Structure of test seat

Abstract

The invention provides a structure of a test seat, which is characterized in that a plurality of through holes are formed from an upper surface to a lower surface of a base, the through holes are adjacent to one another, one end of each of a plurality of individual probes is correspondingly arranged in one of the through holes in a sliding manner, and the other end of each of the individual probes is provided with a contact part; when the probes abut against an object to be detected, the contact parts of the probes are electrically connected with each other, and when the probes abut against the object to be detected, the contact parts of the probes are electrically connected with each other, so that the current difference of the probes supplied to the object to be detected is reduced.

Description

Technical Field

[0001] The present invention relates to a test socket structure, and more particularly to a test socket in which a plurality of probe contact ends are in electrical contact with each other to reduce current errors. Background Art

[0002] With the vigorous development of electronic technology and related technologies such as the Internet, as well as the continuous improvement of consumption levels in the global electronics market, the demand for consumer electronic products has risen rapidly, which has driven the prosperous development of the semiconductor industry.

[0003] Semiconductor manufacturing involves multiple key steps, including IC design, wafer fabrication, wafer probing, wafer packaging, and post-packaging testing. Among these steps, wafer testing and post-packaging testing aim to test the electrical functionality of one or more dies on an uncut wafer, or one or more dies that have been cut from a wafer, in order to detect and eliminate unqualified dies.

[0004] Typically, when testing semiconductor chips, the tester needs to contact the DUT through a test socket. In other words, the test socket is considered the interface for transmitting test and power signals between the tester and the DUT. Simultaneously, the test socket and the tester use control and analysis programs to accurately measure the DUT's electrical characteristics. This test socket plays a critical role in ensuring test accuracy and reliability, thereby guaranteeing the production of high-quality semiconductor components.

[0005] Conventional test sockets generally consist of two parts: one is the socket body, a component made of metal or plastic with a precisely cut cavity; the other is the spring probe that is inserted into the perforation of the test socket, providing a retractable electrical path to connect the chip to the test system. The probes are usually multiple and densely arranged to ensure that they can contact the conductive components on the object under test.

[0006] However, when operating at higher currents, conventional test sockets gradually experience differences in the current flowing through the multiple probes, resulting in different currents flowing through each probe. This current tends to favor probes with lower impedance, causing some probes to experience higher currents and generate higher temperatures. The uneven probe impedance, current distribution, and high temperatures directly affect the DUT's test results and can damage the test socket, leading to inaccurate test results. Therefore, the industry needs a test socket structure that can average current.

[0007] In view of the above problems of the conventional technology, the present invention provides a test socket structure in which contact portions of a plurality of probes of a base are in contact with each other and are electrically connected, thereby providing a test socket capable of reducing current differences between individual probes. Summary of the Invention

[0008] An object of the present invention is to provide a test socket structure in which a plurality of probes are slidably mounted on a base, wherein the contact portions of the plurality of probes are in contact with and electrically connected to each other. The electrically connected contact portions reduce the impedance of the individual probes, thereby reducing the difference in current supplied to the object under test and further reducing the temperature generated by the probes.

[0009] To achieve the aforementioned purposes and effects, the present invention provides a test socket structure comprising a base and a plurality of probes. A plurality of through-holes are provided from an upper surface to a lower surface of the base, and the through-holes are disposed adjacent to one another. One end of each of the plurality of probes is slidably disposed in a corresponding one of the through-holes, and a contact portion is disposed at the other end of each of the plurality of probes. The contact portions of the respective probes are in electrical contact with one another. This structure reduces the difference in current supplied to the object under test by the individual probes.

[0010] In one embodiment of the present invention, a portion of the upper surface of the base is recessed to form a receiving groove, and the respective ends of the probes protrude from the upper surface and extend to the receiving groove.

[0011] In one embodiment of the present invention, a plate is disposed on an upper portion of the accommodating tank, and the respective ends of the probes pass through the plate.

[0012] In one embodiment of the present invention, each of the probes is sleeved with an elastic member, one end of the elastic member abuts against a lower side of the plate, and the other end of the elastic member abuts against the probes, and the elastic member is used to provide a downward thrust to the probes.

[0013] In one embodiment of the present invention, a plurality of gaskets are further included. Each of the gaskets is correspondingly sleeved on the end of each of the probes, and a lower portion of each of the gaskets abuts against an upper portion of the plate.

[0014] In one embodiment of the present invention, a limiting groove is disposed at each end of the probes, and the gaskets are disposed in the limiting groove of each probe.

[0015] In one embodiment of the present invention, the contact portions of the probes are each a hexagonal column, and the contact portions of the probes are in electrical contact with each other.

[0016] In one embodiment of the present invention, a plurality of bump structures are disposed below the contact portion of each of the probes.

[0017] In one embodiment of the present invention, the base and the probes are made of a conductive material.

[0018] In one embodiment of the present invention, a moving distance of each of the probes is smaller than a height of the contact portion of each of the probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 : It is a schematic diagram of an exploded structure of an embodiment of the present invention; Figure 2A : It is a schematic side view of the structure of an embodiment of the present invention; Figure 2B : It is an enlarged side view of the structure of one embodiment of the present invention; Figures 3A to 3B : It is a schematic diagram of the structure and operation of an embodiment of the present invention; Figure 4A : It is a schematic diagram of the contact portion structure of an embodiment of the present invention; Figure 4B : It is a schematic diagram of the contact portion structure of another embodiment of the present invention; Figure 4C : It is a schematic diagram of the contact structure of yet another embodiment of the present invention; Figure 5 : It is another structural schematic diagram of an embodiment of the present invention; Figure 6A : It is a schematic side view of another structure of an embodiment of the present invention; and Figure 6B : It is an enlarged side view of another structure of an embodiment of the present invention.

Figure number comparison

[0020] In order to further understand and appreciate the structural features and effects achieved by the present invention, preferred embodiments and detailed descriptions are provided as follows:

[0021] In view of the above-mentioned problems of the conventional technology, the present invention is a test socket structure, which has a plurality of through-holes formed from an upper surface to a lower surface of a base. The through-holes are arranged adjacent to each other, and one end of each of a plurality of probes is slidably mounted in one of the through-holes. The other end of each of the probes is provided with a contact portion. The contact portions of the respective probes are in electrical contact with each other. When the probes abut against the object to be tested, the contact portions of the respective probes are electrically connected to each other, thereby solving the problem of uneven current conduction and high temperature generated by the probes in the conventional test socket.

[0022] See also Figure 1 , which is a schematic diagram of an exploded structure of an embodiment of the present invention. As shown in the figure, this embodiment is a first embodiment, which is a structure 1 of a test seat, which includes a base 10 and a plurality of probes 20.

[0023] See again Figure 1 See also Figure 2A as well as Figure 2B , Figure 2A FIG1 is a schematic side view of the structure of an embodiment of the present invention. Figure 2B This is an enlarged schematic side view of the structure of an embodiment of the present invention. As shown in the figure, in this embodiment, a plurality of through-holes 14 are provided from an upper surface 11 to a lower surface 12 of the base 10, and the through-holes 14 are arranged adjacent to each other. One end of each of the probes 20 is slidably disposed in one of the through-holes 14, and a contact portion 22 is provided at the other end of each of the probes 20. The contact portions 22 of each of the probes 20 are in contact with each other and are conductive.

[0024] Continuing from the above, Figure 2A and Figure 2B In the figure, the dotted line portion represents the probe at the rear.

[0025] Continuing from the above, in this embodiment, the base 10 and the probes 20 are made of a conductive material, so that the probes 20 are electrically connected to the base 10 .

[0026] See also Figures 3A to 3B , Figures 3A to 3B : It is a schematic diagram of the structure and operation of an embodiment of the present invention. As shown in the figure, in this embodiment, the structure 1 of the test socket is used to test a device under test 30. The device under test 30 is provided with a first conductive member 32 and a second conductive member 34. The first conductive member 32 is a conductive element that protrudes more than the second conductive member 34 and is used to represent conductive elements of different heights on the device under test 30.

[0027] Continuing from the above, when the test seat structure 1 is used for testing, the base 10 moves toward the object under test 30 and drives the probes 20 to move. When the probes 20 move to the object under test 30, a portion of the probes 20 first abut against the more protruding first conductive member 32, and then another portion of the probes 20 abut against the lower second conductive member 34, so that a step is formed between the probes 20. In this embodiment, the contact portions 22 of the individual probes 20 have a height H1. When the object under test 30 is tested and moved, the individual probes 20 move a moving distance H2. The moving distance H2 refers to the step (e.g., the difference between the portion of the probe 20 abutting against the first conductive member 32 and the portion of the probe 20 abutting against the second conductive member 34) Figure 3B As shown), the moving distance H2 is smaller than the height H1 to avoid a large drop so that the contact portions 22 of the probes 20 do not contact each other.

[0028] The probes 20 of this embodiment are in contact with each other to balance and reduce their respective impedances. Balancing the impedance of each of the probes 20 can avoid uneven current flow. Reducing the impedance can also improve the overall current carrying capacity and reduce heat generation.

[0029] See also Figure 4A , which is a schematic diagram of the contact structure of an embodiment of the present invention, Figure 4A As shown in the bottom view, in this embodiment, the contact portion 22 of each of the probes 20 is a hexagonal prism, and the contact portion 22 of the hexagonal prism is densely spread (flat filling) on ​​the lower surface 12, and the contact portions 22 of each of the probes 20 are in surface contact with each other, so that they are electrically conductive to each other.

[0030] See also Figure 4B , which is a schematic diagram of the contact structure of another embodiment of the present invention, Figure 4B As shown in the bottom view, in another embodiment of the contact portion 22, the contact portion 22 of each of the probes 20 is a quadrangular prism, and the contact portion 22 of the quadrangular prism is densely spread (flat filling) on ​​the lower surface 12, and the contact portions 22 of each of the probes 20 are in surface contact with each other, so that they are electrically conductive to each other. The other component relationships of this embodiment are the same as those of the first embodiment described above, so they will not be repeated.

[0031] See also Figure 4C , which is a schematic diagram of the contact structure of another embodiment of the present invention, Figure 4CAs shown in the bottom view, in another embodiment of the contact portion 22, the contact portion 22 of each of the probes 20 is a cylinder, and the cylindrical contact portions 22 are arranged on the lower surface 12, and the contact portions 22 of each of the probes 20 are in line contact with each other, so that they are electrically conductive with each other. The other component relationships of this embodiment are the same as those of the first embodiment mentioned above, so they will not be repeated.

[0032] See also Figure 5 、 Figure 6A as well as Figure 6B , Figure 5 is another structural diagram of an embodiment of the present invention, Figure 6A FIG. 1 is a schematic side view of another structure of an embodiment of the present invention. Figure 6B This is an enlarged side view of another structure of an embodiment of the present invention. As shown in the figure, this embodiment is a second embodiment, which is based on the above-mentioned first embodiment. In this embodiment, the base 10 further includes a accommodating groove 16 and a plate 18, and the probes 20 are respectively covered with an elastic member 24, and a plurality of gaskets 26 are respectively covered with one of the probes 20.

[0033] Continuing from the above, a portion of the upper surface 11 of the base 10 is recessed to form the accommodating groove 16 , and the respective ends of the probes 20 protrude from the upper surface 11 and extend into the accommodating groove 16 . The plate 18 is provided above one side of the accommodating groove 16 , and the respective ends of the probes 20 pass through the plate 18 .

[0034] Continuing from the above, the plate 18 is used to adjust the positions of the probes 20 to prevent the bending displacement of the probes 20 from affecting the test results.

[0035] Continuing from the above, the probes 20 are individually sleeved with the elastic member 24. One end of the elastic member 24 abuts against a lower side of the plate 18, and the other end of the elastic member 24 abuts against the probes 20. The elastic member 24 is disposed in the accommodating groove 16 to provide a downward thrust to the probes 20 to prevent the probes 20 from being displaced during testing, resulting in poor contact.

[0036] Continuing from the above, the other end of the elastic member 24 can be welded to the probes 20 , or the other end of the elastic member 24 can abut against the limiting grooves of the probes 20 .

[0037] Continuing from the above, the gaskets 26 are respectively mounted on the ends of the probes 20 , and the bottom of the gaskets 26 abuts against the top of the plate 18 . The gaskets 26 can further prevent the probes 20 from sliding on the plate 18 and the base 10 .

[0038] Continuing from the above, further, a limiting groove 28 is set at the end of each of the probes 20, and the gaskets 26 are respectively set in the limiting grooves 28 of each of the probes 20 to firmly fix the gaskets 26 and the probes 20. The other component relationships of this embodiment are the same as those of the first embodiment, so they are not repeated here.

[0039] Continuing from the above, Figure 6A and Figure 6B In the figure, the dotted line portion represents the probe at the rear.

[0040] See again Figure 2B as well as Figure 6A As shown in the figure, in one embodiment, a plurality of bump structures 222 are further provided below the contact portion 22 of each of the probes 20. The bump structures 222 are used to ensure that the contact portion 22 of each of the probes 20 is electrically connected to the object to be tested 30. The other component relationships of this embodiment are the same as those of the first embodiment described above, so they will not be repeated. In summary, the present invention provides a test socket structure in which multiple probes are slidably mounted on a base. The contact portions of the multiple probes are in contact and electrically connected to each other. The electrically connected contact portions reduce the impedance of the individual probes, thereby reducing the current differences supplied to the object under test and further reducing the temperature generated by the probes. This solves the problem of conventional test sockets in which, when operating at higher currents, each probe receives a different current, causing some probes to be subjected to higher currents and generate higher temperatures. The uneven distribution of probe impedance and current, as well as the high temperature generated, directly affect the results of the object under test and damage the test socket, resulting in inaccurate test results.

[0041] The size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0042] The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent changes and modifications in the shape, structure, characteristics and spirit described in the scope of the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A test socket structure, characterized in that: It includes: A base having a plurality of through holes extending from an upper surface to a lower surface thereof, wherein the through holes are arranged adjacent to each other; and A plurality of probes have respective one ends slidably disposed on one of the through holes, and the other ends of the probes are provided with a contact portion, and the contact portions of the probes are in contact with each other for electrical conduction.

2. The structure of the test socket according to claim 1, characterized in that: Part of the upper surface of the base is concave to form a receiving groove, and the respective ends of the probes protrude from the upper surface and extend to the receiving groove.

3. The structure of the test socket according to claim 2, characterized in that: A plate is disposed on an upper portion of the accommodating groove, and respective ends of the probes pass through the plate.

4. The structure of the test socket according to claim 3, characterized in that: The probes are respectively sleeved with an elastic member, one end of the elastic member abuts against a lower side of the plate, and the other end of the elastic member abuts against the probes. The elastic member is used for providing downward thrust to the probes.

5. The structure of the test socket according to claim 3, wherein: The utility model further comprises a plurality of gaskets, wherein the gaskets are respectively sleeved on the respective ends of the probes, and a lower portion of the gaskets abuts against an upper portion of the plate.

6. The test socket structure according to claim 5, wherein: The ends of the probes are respectively provided with a limiting groove, and the gaskets are respectively provided in the limiting grooves of the probes.

7. The test socket structure according to claim 1, wherein: The contact portions of the probes are each a hexagonal column, and the contact portions of the probes are in contact with each other and electrically connected.

8. The test socket structure according to claim 1, wherein: A plurality of bump structures are disposed below the contact portion of each of the probes.

9. The test socket structure according to claim 1, wherein: The base and the probes are made of a conductive material.

10. The test socket structure according to claim 1, wherein: A moving distance of each of the probes is smaller than a height of the contact portion of each of the probes.

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