Laminated ceramic electronic component

Abstract

The invention provides a laminated ceramic electronic component capable of improving flexural endurance. The present invention is provided with a laminated body (10) and a pair of external electrodes (40) disposed at both ends of the laminated body (10), the external electrodes (40) including a main surface-side external electrode (411A) having a recessed portion (510A) recessed toward the laminated body (10) side in a cross-sectional view along the lamination direction and the longitudinal direction of the laminated body (10), and peripheral regions (560, 570) adjacent to the recessed portion (510A) in the longitudinal direction (L). The surface roughness of the recess (510A) is rougher than the surface roughness of the peripheral regions (560, 570).

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component. Background Art

[0002] Conventionally, multilayer ceramic capacitors are known as multilayer ceramic electronic components. Generally speaking, a multilayer ceramic capacitor comprises a laminated body composed of a plurality of dielectric layers and internal electrode layers alternately stacked, and external electrodes provided on both end surfaces of the laminated body. For example, Patent Document 1 discloses a multilayer ceramic capacitor having the aforementioned structure, wherein the external electrodes include a base electrode layer formed by sintering.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-243249

[0006] However, in such multilayer ceramic capacitors, when mounted on a substrate, flexural stress generated at the external electrodes is transmitted to the multilayer body, which may cause cracks in the multilayer body. Therefore, multilayer ceramic capacitors with improved flexural resistance are desired. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] An object of the present invention is to provide a multilayer ceramic electronic component capable of improving flexural resistance.

[0009] Technical solutions to solve problems

[0010] A multilayer ceramic electronic component according to the present invention comprises: a laminate including a plurality of ceramic layers and a plurality of internal conductor layers alternately stacked in a stacking direction, the laminate including a first principal surface and a second principal surface opposing each other in the stacking direction, a first end surface and a second end surface opposing each other in a longitudinal direction perpendicular to the stacking direction, and a first side surface and a second side surface opposing each other in a width direction perpendicular to the stacking direction and the longitudinal direction; and a pair of external electrodes spaced apart from each other at opposite ends of the laminate in the longitudinal direction, the internal conductor layers including a first internal conductor layer extending to the first end surface and a second internal conductor layer extending to the second end surface, the external electrodes including a main surface-side external electrode arranged on at least one of the first principal surface and the second principal surface, the main surface-side external electrode having a recessed portion recessed toward the laminate in a cross-section viewed along the stacking direction and the longitudinal direction, and a peripheral region adjacent to the recessed portion in the longitudinal direction, the surface roughness of the recessed portion being coarser than the surface roughness of the peripheral region.

[0011] Effects of the Invention

[0012] According to the present invention, a multilayer ceramic electronic component capable of improving flexural resistance can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of the appearance of a multilayer ceramic capacitor according to an embodiment.

[0014] Figure 2 yes Figure 1 II-II sectional view.

[0015] Figure 3 yes Figure 2 Sectional view III-III.

[0016] Figure 4A yes Figure 2 IVA-IVA cross-sectional view.

[0017] Figure 4B yes Figure 2 IVB-IVB cross-sectional view.

[0018] Figure 5A yes Figure 2 VA is an enlarged view of the portion indicated by VA, and is a view showing a cross section of the first main surface side external electrode.

[0019] Figure 5B is with Figure 5A 1 and 2 are corresponding figures, and are diagrams showing a cross section of the first main surface side external electrode.

[0020] Figure 6A It is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a first step of forming external electrodes on a multilayer body.

[0021] Figure 6B It is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a second step of forming external electrodes on a multilayer body.

[0022] Figure 6C It is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a third step of forming external electrodes on a multilayer body.

[0023] Figure 7A A diagram showing a two-cell multilayer ceramic capacitor.

[0024] Figure 7B A diagram showing a triple-structured multilayer ceramic capacitor.

[0025] Figure 7C A diagram showing a quadruple-structured multilayer ceramic capacitor.

[0026] Description of Reference Numerals

[0027] 1: Multilayer ceramic capacitors (multilayer ceramic electronic components);

[0028] 10: laminate;

[0029] 20: dielectric layer (ceramic layer);

[0030] 30: internal electrode layer (internal conductor layer);

[0031] 31: first internal electrode layer (first internal conductor layer);

[0032] 32: second internal electrode layer (second internal conductor layer);

[0033] 35: floating internal electrode layer (floating internal conductor layer);

[0034] 40: external electrode;

[0035] 400A: 1st end surface side external electrode (end surface side external electrode);

[0036] 400B: Second end surface side external electrode (end surface side external electrode);

[0037] 411A: first main surface side external electrode (main surface side external electrode);

[0038] 411B: first main surface side external electrode (main surface side external electrode);

[0039] 412A: Second main surface side external electrode (main surface side external electrode);

[0040] 412B: second main surface side external electrode (main surface side external electrode);

[0041] 510A: Recessed portion (recessed portion) on the first main surface side;

[0042] 510B: Recessed portion (recessed portion) on the first main surface;

[0043] 520A: Second main surface side concave portion (recessed portion);

[0044] 520B: Second main surface side concave portion (recessed portion);

[0045] 550s: The surface of the concave portion of the first main surface;

[0046] 560: medial peripheral region (peripheral region);

[0047] 560s: surface of the medial peripheral area;

[0048] 570: Outer peripheral area (peripheral area);

[0049] 570s: surface of the outer peripheral area;

[0050] L: length direction;

[0051] T: stacking direction;

[0052] W: width direction;

[0053] LS1: 1st end face;

[0054] LS2: 2nd end face;

[0055] TS1: 1st main surface;

[0056] TS2: 2nd main surface;

[0057] WS1: side 1;

[0058] WS2: Side 2. DETAILED DESCRIPTION

[0059] Hereinafter, a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to an embodiment of the present disclosure will be described with reference to the drawings. Figure 1 It is an external perspective view of a multilayer ceramic capacitor 1 according to the embodiment. Figure 2 yes Figure 1 II-II sectional view. Figure 3 yes Figure 2 Sectional view III-III. Figure 4A yes Figure 2 IVA-IVA cross-sectional view. Figure 4B yes Figure 2 IVB-IVB cross-sectional view.

[0060] like Figure 1 As shown, the multilayer ceramic capacitor 1 according to the embodiment has a substantially rectangular parallelepiped shape. The multilayer ceramic capacitor 1 includes a substantially rectangular parallelepiped laminate 10 and a pair of external electrodes 40 disposed at both ends of the laminate 10 at a distance from each other.

[0061] exist Figure 1 In FIG. 1 , arrow T indicates the stacking direction of the multilayer ceramic capacitor 1 and the multilayer body 10. The stacking direction T is also the thickness direction and height direction of the multilayer ceramic capacitor 1 and the multilayer body 10. Figure 1 In FIG. 1 , arrow L indicates the longitudinal direction of the multilayer ceramic capacitor 1 and the multilayer body 10 perpendicular to the stacking direction T. Figure 1 In FIG, arrow W indicates the width direction of the multilayer ceramic capacitor 1 and the laminate 10 , which is perpendicular to the lamination direction T and the longitudinal direction L. The pair of external electrodes 40 are respectively arranged at one end and the other end of the laminate 10 in the longitudinal direction L.

[0062] exist Figures 1 to 4B The XYZ orthogonal coordinate system is shown in FIG. The length direction L of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the X direction. The width direction W of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the Y direction. The stacking direction T of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the Z direction. Here, Figure 2 The cross section shown is also referred to as the LT cross section. Figure 3 The cross section shown is also referred to as the WT cross section. Figure 4A as well as Figure 4B The cross section shown is also referred to as the LW cross section.

[0063] like Figures 1 to 4B As shown, the stack 10 includes a first main surface TS1 and a second main surface TS2 opposite to each other in the stacking direction T, a first end surface LS1 and a second end surface LS2 opposite to each other in the length direction L perpendicular to the stacking direction T, and a first side surface WS1 and a second side surface WS2 opposite to each other in the width direction W perpendicular to the stacking direction T and the length direction L.

[0064] like Figure 1 As shown, the laminate 10 has a generally rectangular parallelepiped shape. Furthermore, the dimension of the laminate 10 in the longitudinal direction L is not necessarily longer than the dimension in the width direction W. The corners and ridges of the laminate 10 are preferably rounded. A corner is where three surfaces of the laminate intersect, and a ridge is where two surfaces of the laminate intersect. Furthermore, concavities and convexities may be formed on part or all of the surface constituting the laminate 10.

[0065] The dimensions of the laminate 10 are not particularly limited, but if the dimension in the longitudinal direction L of the laminate 10 is defined as the L dimension, the L dimension is preferably 0.2 mm or more and 10 mm or less. Furthermore, if the dimension in the stacking direction T of the laminate 10 is defined as the T dimension, the T dimension is preferably 0.05 mm or more and 10 mm or less. Furthermore, if the dimension in the width direction W of the laminate 10 is defined as the W dimension, the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0066] like Figure 2 as well as Figure 3 As shown, the laminate 10 includes an inner layer portion 11 , and a first main surface side outer layer portion 12 and a second main surface side outer layer portion 13 arranged in the lamination direction T so as to sandwich the inner layer portion 11 .

[0067] The inner layer portion 11 includes a plurality of dielectric layers 20 as ceramic layers and a plurality of internal electrode layers 30 as internal conductor layers, alternately stacked in a stacking direction T. The inner layer portion 11 extends from the internal electrode layer 30 located closest to the first main surface TS1 to the internal electrode layer 30 located closest to the second main surface TS2 in the stacking direction T. In the inner layer portion 11, the plurality of internal electrode layers 30 are arranged to face each other with the dielectric layer 20 interposed therebetween. The inner layer portion 11 is a portion that generates electrostatic capacitance and essentially functions as a capacitor.

[0068] The plurality of dielectric layers 20 are formed from a dielectric material. For example, the dielectric material may be a dielectric ceramic containing BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Furthermore, the dielectric material may be a material containing these main components with the addition of secondary components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds. The dielectric material is particularly preferably a material containing BaTiO3 as a main component.

[0069] The thickness of the dielectric layer 20 is preferably not less than 0.2 μm and not more than 15 μm. The number of dielectric layers 20 stacked is preferably not less than 10 and not more than 1200. The number of dielectric layers 20 is the sum of the number of dielectric layers 20 in the inner layer portion 11 and the number of dielectric layers 20 in each of the first main surface-side outer layer portion 12 and the second main surface-side outer layer portion 13.

[0070] The multiple internal electrode layers 30 include multiple first internal electrode layers 31 serving as multiple first internal conductor layers and multiple second internal electrode layers 32 serving as multiple second internal conductor layers. The first internal electrode layers 31 and the second internal electrode layers 32 are alternately arranged in the stacking direction T, sandwiching the dielectric layers 20 therebetween. The first internal electrode layers 31 extend to the first end surface LS1. The second internal electrode layers 32 extend to the second end surface LS2. In the following description, when it is not necessary to distinguish between the first internal electrode layers 31 and the second internal electrode layers 32, the first internal electrode layers 31 and the second internal electrode layers 32 may be collectively referred to as the internal electrode layers 30.

[0071] like Figure 4A As shown, the first internal electrode layer 31 includes a first opposing portion 31A and a first lead portion 31B. The first opposing portion 31A is a region that faces the second internal electrode layer 32 with the dielectric layer 20 interposed therebetween and is located within the laminate 10. The first lead portion 31B extends from the first opposing portion 31A to the first end surface LS1 and is exposed on the first end surface LS1.

[0072] like Figure 4BAs shown, the second internal electrode layer 32 includes a second opposing portion 32A and a second lead portion 32B. The second opposing portion 32A is a region that faces the first internal electrode layer 31 with the dielectric layer 20 interposed therebetween and is located within the laminate 10. The second lead portion 32B extends from the second opposing portion 32A to the second end surface LS2 and is exposed on the second end surface LS2.

[0073] In the embodiment, the first opposing portion 31A and the second opposing portion 32A face each other via the dielectric layer 20 , thereby forming capacitance and exhibiting capacitor characteristics.

[0074] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or angled. The shapes of the first lead portion 31B and the second lead portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or angled.

[0075] The first opposing portion 31A and the first lead portion 31B may be formed to have the same dimension in the width direction W, or one of them may be smaller. The second opposing portion 32A and the second lead portion 32B may be formed to have the same dimension in the width direction W, or one of them may be smaller.

[0076] The first and second internal electrode layers 31 and 32 are formed of a suitable conductive material, such as a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one of these metals. When an alloy is used, the first and second internal electrode layers 31 and 32 may be formed of, for example, an Ag-Pd alloy.

[0077] The thickness of each of the first internal electrode layer 31 and the second internal electrode layer 32 is preferably 0.2 μm to 2.0 μm, for example. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 10 to 1000.

[0078] like Figure 2 as well as Figure 3As shown, the first principal surface-side outer layer portion 12 is located on the first principal surface TS1 side of the laminate 10. The first principal surface-side outer layer portion 12 is a collection of multiple dielectric layers 20 located between the first principal surface TS1 and the internal electrode layer 30 closest to the first principal surface TS1. On the other hand, the second principal surface-side outer layer portion 13 is located on the second principal surface TS2 side of the laminate 10. The second principal surface-side outer layer portion 13 is a collection of multiple dielectric layers 20 located between the second principal surface TS2 and the internal electrode layer 30 closest to the second principal surface TS2. The dielectric layers 20 used in both the first principal surface-side outer layer portion 12 and the second principal surface-side outer layer portion 13 can be the same as the dielectric layers 20 used in the internal layer portion 11.

[0079] Furthermore, the laminate 10 includes an opposing electrode portion 11E. The opposing electrode portion 11E is a portion where the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 face each other. The opposing electrode portion 11E is configured as a portion of the inner layer portion 11. Figure 4A as well as Figure 4B , the range of the opposing electrode portion 11E in the width direction W and the length direction L is shown. Note that the opposing electrode portion 11E is also referred to as a capacitor effective portion.

[0080] In addition, the stacked body 10 has a side outer layer portion. The side outer layer portion has a first side outer layer portion WG1 and a second side outer layer portion WG2. The first side outer layer portion WG1 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the first side WS1. The second side outer layer portion WG2 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the second side WS2. Figure 3 、 Figure 4A as well as Figure 4B , the range of the first side outer layer portion WG1 and the second side outer layer portion WG2 in the width direction W is shown. In addition, the side outer layer portion is also called a W gap or a side gap.

[0081] In addition, the stacked body 10 has an end face side outer layer portion. The end face side outer layer portion has a first end face side outer layer portion LG1 and a second end face side outer layer portion LG2. The first end face side outer layer portion LG1 is a portion including the dielectric layer 20 and the first lead portion 31B located between the opposing electrode portion 11E and the first end face LS1. That is, the first end face side outer layer portion LG1 is a collection of portions of the plurality of dielectric layers 20 on the first end face LS1 side and the plurality of first lead portions 31B. The second end face side outer layer portion LG2 is a portion including the dielectric layer 20 and the second lead portion 32B located between the opposing electrode portion 11E and the second end face LS2. That is, the second end face side outer layer portion LG2 is a collection of portions of the plurality of dielectric layers 20 on the second end face LS2 side and the plurality of second lead portions 32B. In Figure 2 、 Figure 4A as well as Figure 4B , the ranges of the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2 in the longitudinal direction L are shown. In addition, the end surface side outer layer portion is also called an L gap or an end gap.

[0082] like Figure 1 as well as Figure 2 As shown, the external electrode 40 includes a first external electrode 40A disposed on the first end surface LS1 side of the stacked body 10 and a second external electrode 40B disposed on the second end surface LS2 side of the stacked body 10 .

[0083] The first external electrode 40A and the second external electrode 40B have the same basic structure. Furthermore, the first external electrode 40A and the second external electrode 40B have shapes that are substantially plane-symmetrical with respect to a WT cross-section taken at the center in the longitudinal direction L of the multilayer ceramic capacitor 1. Therefore, in the following description, when there is no need to distinguish between the first external electrode 40A and the second external electrode 40B, the first external electrode 40A and the second external electrode 40B may be collectively referred to as the external electrode 40.

[0084] The first external electrode 40A is arranged on the first end surface LS1. The first external electrode 40A contacts the first lead portion 31B of each of the plurality of first internal electrode layers 31 exposed on the first end surface LS1. Thus, the first external electrode 40A is electrically connected to the plurality of first internal electrode layers 31. The first external electrode 40A may also be arranged on a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. In the embodiment, the first external electrode 40A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0085] The second external electrode 40B is arranged on the second end surface LS2. The second external electrode 40B contacts the second lead portion 32B of each of the plurality of second internal electrode layers 32 exposed on the second end surface LS2. Thus, the second external electrode 40B is electrically connected to the plurality of second internal electrode layers 32. The second external electrode 40B may also be arranged on a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. In the embodiment, the second external electrode 40B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0086] As described above, within the laminate 10, the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 oppose each other via the dielectric layer 20, thereby forming a capacitor. Consequently, capacitor characteristics are exhibited between the first external electrode 40A connected to the first internal electrode layer 31 and the second external electrode 40B connected to the second internal electrode layer 32.

[0087] like Figure 2 、 Figure 4A as well as Figure 4B As shown, the first external electrode 40A includes a first foundation electrode layer 50A and a first plating layer 60A disposed on the first foundation electrode layer 50A. The second external electrode 40B includes a second foundation electrode layer 50B and a second plating layer 60B disposed on the second foundation electrode layer 50B.

[0088] The first foundation electrode layer 50A is disposed on the first end surface LS1. The first foundation electrode layer 50A is connected to the first lead portions 31B of each of the plurality of first internal electrode layers 31 exposed on the first end surface LS1. In the embodiment, the first foundation electrode layer 50A is formed so as to extend from the first end surface LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0089] The second foundation electrode layer 50B is disposed on the second end surface LS2. The second foundation electrode layer 50B contacts the second lead portions 32B of each of the plurality of second internal electrode layers 32 exposed on the second end surface LS2. In the embodiment, the second foundation electrode layer 50B is formed so as to extend from the second end surface LS2 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0090] The first and second base electrode layers 50A and 50B of the embodiment are sintered layers. The sintered layers preferably include a metal component and either a glass component or a ceramic component, or both. The metal component may include, for example, at least one selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, and the like. The glass component may include, for example, at least one selected from B, Si, Ba, Mg, Al, Li, and the like. The ceramic component may be the same or a different type of ceramic material as the dielectric layer 20. The ceramic component may include, for example, at least one selected from BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, CaZrO3, and the like.

[0091] The sintered layer is formed by applying a conductive paste containing, for example, glass and metal to the laminate 10 and sintering it. The sintered layer can be formed by simultaneously sintering the raw materials of the laminate 10 having multiple internal electrode layers and dielectric layers, that is, the laminated pieces before sintering, and the conductive paste applied to the laminated pieces. Alternatively, it can be formed by sintering the laminate 10 to obtain the laminate 10, and then applying a conductive paste to the laminate 10 and sintering it. In addition, in the case of the above-mentioned structure, the sintered layer is preferably formed by sintering a material to which a ceramic material is added instead of a glass component. In this case, it is particularly preferred to use a ceramic material of the same type as the dielectric layer 20 as the added ceramic material. In addition, the sintered layer can also be a plurality of layers.

[0092] The thickness of the first foundation electrode layer 50A located on the first end surface LS1 in the longitudinal direction L is preferably about 2 μm or more and 220 μm or less at the center portion in the stacking direction T and the width direction W of the first foundation electrode layer 50A.

[0093] The thickness of the second foundation electrode layer 50B located on the second end surface LS2 in the longitudinal direction L is preferably about 2 μm or more and 220 μm or less at the center portion in the stacking direction T and the width direction W of the second foundation electrode layer 50B.

[0094] In the case where the first base electrode layer 50A is also provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the thickness of the first base electrode layer 50A provided in the portion corresponding to the stacking direction T is preferably, for example, greater than 3 μm and less than 40 μm at the central portion of the first base electrode layer 50A provided in the portion in the length direction L and the width direction W.

[0095] In the case where the first base electrode layer 50A is also provided on a portion of at least one surface of the first side surface WS1 or the second side surface WS2, the thickness of the first base electrode layer 50A provided in the portion corresponding to the width direction W is preferably, for example, greater than 3 μm and less than 40 μm at the central portion of the first base electrode layer 50A provided in the portion in the longitudinal direction L and the stacking direction T.

[0096] In the case where a second base electrode layer 50B is also provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the thickness of the second base electrode layer 50B provided in the portion corresponding to the stacking direction T is preferably, for example, greater than 3 μm and less than 40 μm at the central portion of the second base electrode layer 50B provided in the portion in the length direction L and the width direction W.

[0097] In the case where the second base electrode layer 50B is also provided on a portion of at least one surface of the first side surface WS1 or the second side surface WS2, the thickness of the second base electrode layer 50B provided in the portion corresponding to the width direction W is preferably, for example, greater than 3 μm and less than 40 μm at the central portion in the longitudinal direction L and the stacking direction T of the second base electrode layer 50B provided in the portion.

[0098] The first plating layer 60A is arranged to cover the first foundation electrode layer 50A.

[0099] The second plating layer 60B is arranged to cover the second foundation electrode layer 50B.

[0100] The first plating layer 60A and the second plating layer 60B may include, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, and the like. The first plating layer 60A and the second plating layer 60B may each be formed from multiple layers. The first plating layer 60A and the second plating layer 60B preferably have a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0101] The first plating layer 60A is arranged to cover the first base electrode layer 50A. In the embodiment, the first plating layer 60A includes a first Ni plating layer 61A and a first Sn plating layer 62A located on the first Ni plating layer 61A.

[0102] The second plating layer 60B is arranged to cover the second base electrode layer 50B. In the embodiment, the second plating layer 60B includes a second Ni plating layer 61B and a second Sn plating layer 62B located on the second Ni plating layer 61B.

[0103] The Ni plating layer prevents the first and second base electrode layers 50A and 50B from being corroded by solder during assembly of the multilayer ceramic capacitor 1. Furthermore, the Sn plating layer improves solder wettability during assembly of the multilayer ceramic capacitor 1. This facilitates assembly of the multilayer ceramic capacitor 1. The thickness of each of the first Ni plating layer 61A, the first Sn plating layer 62A, the second Ni plating layer 61B, and the second Sn plating layer 62B is preferably 1 μm or more and 15 μm or less.

[0104] Alternatively, the external electrode 40 of the embodiment may include, for example, a conductive resin layer containing conductive particles and a thermosetting resin. The conductive resin layer may also be disposed so as to cover the sintered layer. When the conductive resin layer is disposed so as to cover the sintered layer, the conductive resin layer is disposed between the sintered layer and the plating layers (first plating layer 60A, second plating layer 60B). The conductive resin layer may completely cover the sintered layer or partially cover the sintered layer.

[0105] The conductive resin layer composed of a thermosetting resin is more flexible than, for example, a conductive layer composed of a plated film or a fired product of a conductive paste. Therefore, even when subjected to physical shock or shock from thermal cycling, the conductive resin layer functions as a buffer layer. Consequently, the conductive resin layer prevents cracks from forming in the multilayer ceramic capacitor 1.

[0106] The metal constituting the conductive particles may also be Ag, Cu, Ni, Sn, Bi, or alloys thereof. The conductive particles preferably contain Ag. An example of the conductive particles is Ag metal powder. Ag has the lowest specific resistivity among metals, making it suitable as an electrode material. Furthermore, Ag is a noble metal, making it resistant to oxidation and highly weatherable. Therefore, Ag metal powder is suitable as the conductive particles.

[0107] Alternatively, the conductive particles may be metal powder coated with Ag. When using conductive particles coated with Ag, the metal powder is preferably Cu, Ni, Sn, Bi, or an alloy thereof. To maintain the properties of Ag while reducing the cost of the base metal, Ag-coated metal powder is preferred.

[0108] Furthermore, the conductive particles may be Cu or Ni treated with an anti-oxidation agent. Furthermore, the conductive particles may be metal powders coated with Sn, Ni, or Cu. When using conductive particles coated with Sn, Ni, or Cu, the metal powder is preferably Ag, Cu, Ni, Sn, Bi, or an alloy thereof.

[0109] The shape of the conductive particles is not particularly limited. Spherical, flat, or other shapes can be used as the conductive particles, but a mixture of spherical metal powder and flat metal powder is preferably used.

[0110] The conductive particles contained in the conductive resin layer mainly play a role in ensuring the conductivity of the conductive resin layer. Specifically, the plurality of conductive particles are in contact with each other, thereby forming a conductive path inside the conductive resin layer.

[0111] The resin constituting the conductive resin layer may include, for example, at least one selected from various well-known thermosetting resins, such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, and polyimide resin. Among these, epoxy resin is one of the most suitable resins, particularly due to its excellent heat resistance, moisture resistance, and adhesion. Furthermore, the resin of the conductive resin layer preferably includes a curing agent along with the thermosetting resin. When epoxy resin is used as the base resin, the epoxy resin curing agent may also be various well-known compounds, such as phenols, amines, acid anhydrides, imidazoles, active esters, and amide-imides.

[0112] The conductive resin layer may be formed of a plurality of layers. The thickness of the thickest portion of the conductive resin layer is preferably, for example, 10 μm to 150 μm.

[0113] The above is the basic structure of the multilayer ceramic capacitor 1 according to the embodiment. Furthermore, if the lengthwise dimension of the multilayer ceramic capacitor 1, including the multilayer body 10 and the external electrodes 40, is defined as the L dimension, then the L dimension is preferably 0.2 mm or more and 10 mm or less. Furthermore, if the length of the multilayer ceramic capacitor 1 in the stacking direction is defined as the T dimension, then the T dimension is preferably 0.05 mm or more and 10 mm or less. Furthermore, if the widthwise dimension of the multilayer ceramic capacitor 1 is defined as the W dimension, then the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0114] The multilayer ceramic capacitor 1 of the embodiment having the above-described basic structure has the following features in the external electrodes 40 , namely, the first external electrode 40A and the second external electrode 40B.

[0115] The external electrode 40 of the embodiment includes a main surface side external electrode arranged on at least one of the first main surface TS1 and the second main surface TS2. In detail, as described above, the first external electrode 40A of the embodiment is arranged on the first end surface LS1 and is formed to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2 and a portion of the first side surface WS1 and a portion of the second side surface WS2. That is, the first external electrode 40A of the embodiment is as follows. Figure 2 As shown, the first end surface side external electrode 400A as the end surface side external electrode arranged on the first end surface LS1, the first main surface side external electrode 411A as the main surface side external electrode arranged on the first main surface TS1, and the second main surface side external electrode 412A as the main surface side external electrode arranged on the second main surface TS2, and as shown Figure 4A as well as Figure 4B As shown, the first side surface side external electrode 421A is arranged on the first side surface WS1 and the second side surface side external electrode 422A is arranged on the second side surface WS2 .

[0116] As described above, the first external electrode 40A includes a first base electrode layer 50A and a first plating layer 60A disposed on the first base electrode layer 50A. Furthermore, in the embodiment, the first base electrode layer 50A is formed so as to extend from the first end surface LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2, and the first plating layer 60A is disposed so as to cover the first base electrode layer 50A.

[0117] That is, Figure 2As shown, the first end-face-side external electrode 400A of the embodiment includes a first end-face-side base electrode layer 500A disposed on the first end-face LS1 and a first end-face-side plating layer 600A formed above the first end-face-side base electrode layer 500A. The first end-face-side base electrode layer 500A is a portion of the first base electrode layer 50A. The first end-face-side plating layer 600A is a portion of the first plating layer 60A and includes a first Ni plating layer 61A and a first Sn plating layer 62A formed on the first Ni plating layer 61A.

[0118] like Figure 2 As shown, the first main surface-side external electrode 411A of the embodiment includes a first main surface-side base electrode layer 511A as a main surface-side base electrode layer arranged on the first main surface TS1, and a first main surface-side plating layer 611A as a main surface-side plating layer formed above the first main surface-side base electrode layer 511A. The first main surface-side base electrode layer 511A is part of the first base electrode layer 50A. The first main surface-side plating layer 611A is part of the first plating layer 60A and includes a first Ni plating layer 61A and a first Sn plating layer 62A formed on the first Ni plating layer 61A.

[0119] like Figure 2 As shown, the second main surface side external electrode 412A of the embodiment includes a second main surface side base electrode layer 512A as a main surface side base electrode layer arranged on the second main surface TS2, and a second main surface side plating layer 612A as a main surface side plating layer formed above the second main surface side base electrode layer 512A. The second main surface side base electrode layer 512A is part of the first base electrode layer 50A. The second main surface side plating layer 612A is part of the first plating layer 60A and includes a first Ni plating layer 61A and a first Sn plating layer 62A on the first Ni plating layer 61A.

[0120] like Figure 4A as well as Figure 4B As shown, the first-side-side external electrode 421A of the embodiment includes a first-side-side base electrode layer 521A disposed on the first side surface WS1 and a first-side-side plating layer 621A formed above the first-side-side base electrode layer 521A. The first-side-side base electrode layer 521A is a portion of the first base electrode layer 50A. The first-side-side plating layer 621A is a portion of the first plating layer 60A and includes a first Ni plating layer 61A and a first Sn plating layer 62A formed on the first Ni plating layer 61A.

[0121] like Figure 4A as well as Figure 4BAs shown, the second-side external electrode 422A of the embodiment includes a second-side base electrode layer 522A disposed on the second side surface WS2 and a second-side plating layer 622A formed above the second-side base electrode layer 522A. The second-side base electrode layer 522A is a portion of the first base electrode layer 50A. The second-side plating layer 622A is a portion of the first plating layer 60A and includes a first Ni plating layer 61A and a first Sn plating layer 62A on the first Ni plating layer 61A.

[0122] The thickness of each of the first Ni plating layer 61A and the first Sn plating layer 62A of the first main surface plating layer 611A, the second main surface plating layer 612A, the first side surface plating layer 621A, and the second side surface plating layer 622A is preferably 1 μm or more and 4 μm or less.

[0123] As described above, the second external electrode 40B of the embodiment is arranged on the second end surface LS2 and is formed to extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2 and a portion of the first side surface WS1 and a portion of the second side surface WS2. That is, the second external electrode 40B of the embodiment is as follows. Figure 2 As shown, the second end surface side external electrode 400B as the end surface side external electrode arranged on the first end surface LS1, the first main surface side external electrode 411B as the main surface side external electrode arranged on the first main surface TS1, and the second main surface side external electrode 412B as the main surface side external electrode arranged on the second main surface TS2, and as shown Figure 4A as well as Figure 4B As shown, the first side surface side external electrode 421B is arranged on the first side surface WS1 and the second side surface side external electrode 422B is arranged on the second side surface WS2 .

[0124] As described above, the second external electrode 40B includes a second base electrode layer 50B and a second plating layer 60B disposed on the second base electrode layer 50B. Furthermore, in the embodiment, the second base electrode layer 50B is formed so as to extend from the second end surface LS2 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2, and the second plating layer 60B is disposed so as to cover the second base electrode layer 50B.

[0125] That is, Figure 2As shown, the second end-face-side external electrode 400B of the embodiment includes a second end-face-side base electrode layer 500B disposed on the second end-face LS2 and a second end-face-side plating layer 600B formed above the second end-face-side base electrode layer 500B. The second end-face-side base electrode layer 500B is a portion of the second base electrode layer 50B. The second end-face-side plating layer 600B is a portion of the second plating layer 60B and includes a second Ni plating layer 61B and a second Sn plating layer 62B formed on the second Ni plating layer 61B.

[0126] like Figure 2 As shown, the first main surface side external electrode 411B of the embodiment includes a first main surface side base electrode layer 511B as a main surface side base electrode layer arranged on the first main surface TS1, and a first main surface side plating layer 611B as a main surface side plating layer formed above the first main surface side base electrode layer 511B. The first main surface side base electrode layer 511B is part of the second base electrode layer 50B. The first main surface side plating layer 611B is part of the second plating layer 60B and includes a second Ni plating layer 61B and a second Sn plating layer 62B formed on the second Ni plating layer 61B.

[0127] like Figure 2 As shown, the second main surface side external electrode 412B of the embodiment includes a second main surface side base electrode layer 512B as a main surface side base electrode layer arranged on the second main surface TS2, and a second main surface side plating layer 612B as a main surface side plating layer formed above the second main surface side base electrode layer 512B. The second main surface side base electrode layer 512B is part of the second base electrode layer 50B. The second main surface side plating layer 612B is part of the second plating layer 60B and includes a second Ni plating layer 61B and a second Sn plating layer 62B on the second Ni plating layer 61B.

[0128] like Figure 4A as well as Figure 4B As shown, the first-side-side external electrode 421B of the embodiment includes a first-side-side base electrode layer 521B arranged on the first side surface WS1 and a first-side-side plating layer 621B formed above the first-side-side base electrode layer 521B. The first-side-side base electrode layer 521B is part of the second base electrode layer 50B. The first-side-side plating layer 621B is part of the second plating layer 60B and includes a second Ni plating layer 61B and a second Sn plating layer 62B on the second Ni plating layer 61B.

[0129] like Figure 4A as well as Figure 4BAs shown, the second-side external electrode 422B of the embodiment includes a second-side base electrode layer 522B disposed on the second side surface WS2 and a second-side plating layer 622B formed above the second-side base electrode layer 522B. The second-side base electrode layer 522B is a portion of the second base electrode layer 50B. The second-side plating layer 622B is a portion of the second plating layer 60B and includes a second Ni plating layer 61B and a second Sn plating layer 62B on the second Ni plating layer 61B.

[0130] The thickness of each of the second Ni plating layer 61B and the second Sn plating layer 62B of the first main surface plating layer 611B, the second main surface plating layer 612B, the first side surface plating layer 621B, and the second side surface plating layer 622B is preferably 1 μm or more and 4 μm or less, for example.

[0131] Figure 2 The LT cross section of the multilayer ceramic capacitor 1 and the laminate 10 along the stacking direction T and the longitudinal direction L is shown. In this LT cross section, the first main surface side external electrode 411A of the first external electrode 40A has a first main surface side recessed portion 510A as a recessed portion that is recessed toward the laminate 10 side. The first main surface side recessed portion 510A is formed on the surface of the first main surface side external electrode 411A. The first main surface side recessed portion 510A has a width direction W that is perpendicular to the LT cross section. Figure 2 The first principal surface side recess 510A may be formed to extend across the entire length of the first principal surface side external electrode 411A along the width direction W. The first principal surface side recess 510A is disposed approximately near the center of the first principal surface side external electrode 411A in the longitudinal direction L.

[0132] like Figure 2 As shown, in the LT cross-section, the second main surface side external electrode 412A of the first external electrode 40A has a second main surface side recessed portion 520A as a recessed portion that is recessed toward the laminate 10 side. The second main surface side recessed portion 520A is formed on the surface of the second main surface side external electrode 412A. The second main surface side recessed portion 520A has a width direction W that is perpendicular to the LT cross-section. Figure 2 The second main surface side recess 520A may be formed to extend across the entire length of the second main surface side external electrode 412A along the width direction W. The second main surface side recess 520A is disposed approximately near the center of the second main surface side external electrode 412A in the longitudinal direction L.

[0133] like Figure 2As shown, in the LT cross-section, the first main surface side external electrode 411B of the second external electrode 40B has a first main surface side recessed portion 510B as a recessed portion that is recessed toward the laminate 10 side. The first main surface side recessed portion 510B is formed on the surface of the first main surface side external electrode 411B. The first main surface side recessed portion 510B has a width direction W that is perpendicular to the LT cross-section. Figure 2 The first principal surface side recess 510B may be formed to extend across the entire length of the first principal surface side external electrode 411B along the width direction W. The first principal surface side recess 510B is disposed approximately near the center of the first principal surface side external electrode 411B in the longitudinal direction L.

[0134] like Figure 2 As shown, in the LT cross-section, the second main surface side external electrode 412B of the second external electrode 40B has a second main surface side recessed portion 520B as a recessed portion that is recessed toward the laminate 10 side. The second main surface side recessed portion 520B is formed on the surface of the second main surface side external electrode 412B. The second main surface side recessed portion 520B has a width direction W that is perpendicular to the LT cross-section. Figure 2 The second main surface side recess 520B may be formed to extend in the front-to-back direction of the paper. The second main surface side recess 520B may also be formed to extend over the entire length of the second main surface side external electrode 412B along the width direction W. The second main surface side recess 520B is arranged approximately near the center of the second main surface side external electrode 412B in the longitudinal direction L.

[0135] Figure 4A as well as Figure 4B The LW cross section of the multilayer ceramic capacitor 1 and the laminate 10 along the length direction L and the width direction W is shown. In this LW cross section, the first side surface external electrode 421A of the first external electrode 40A has a first side surface recessed portion 530A as a recessed portion that is recessed toward the laminate 10 side. The first side surface recessed portion 530A is formed on the surface of the first side surface external electrode 421A. The first side surface recessed portion 530A has a longitudinal direction T perpendicular to the LW cross section, i.e., the longitudinal direction T. Figure 4A as well as Figure 4B The first side surface recess 530A may be formed to extend in the front-to-back direction of the paper. The first side surface recess 530A may also be formed to span the entire length of the first side surface external electrode 421A along the stacking direction T. The first side surface recess 530A is disposed approximately near the center of the first side surface external electrode 421A in the longitudinal direction L. The first side surface recess 530A may communicate with either or both of the first main surface recess 510A and the second main surface recess 520A described above.

[0136] like Figure 4A as well as Figure 4BAs shown, in the LW cross-sectional view, the second side surface external electrode 422A of the first external electrode 40A has a second side surface concave portion 540A as a concave portion that is recessed toward the stacked body 10. The second side surface concave portion 540A is formed on the surface of the second side surface external electrode 422A. The second side surface concave portion 540A has a stacking direction T perpendicular to the LW cross-sectional view. Figure 4A as well as Figure 4B The second side surface recess 540A may be formed to extend in the front-to-back direction of the paper. The second side surface recess 540A may also be formed to extend across the entire length of the second side surface external electrode 422A along the stacking direction T. The second side surface recess 540A is disposed approximately near the center of the second side surface external electrode 422A in the longitudinal direction L. The second side surface recess 540A may communicate with either or both of the first main surface recess 510A and the second main surface recess 520A described above.

[0137] like Figure 4A as well as Figure 4B As shown, in the LW cross-sectional view, the first side surface external electrode 421B of the second external electrode 40B has a first side surface concave portion 530B as a concave portion that is recessed toward the stacked body 10. The first side surface concave portion 530B is formed on the surface of the first side surface external electrode 421B. The first side surface concave portion 530B has a stacking direction T perpendicular to the LW cross-sectional view. Figure 4A as well as Figure 4B The first side surface recess 530B may be formed to extend in the front-to-back direction of the paper. The first side surface recess 530B may also be formed to extend across the entire length of the first side surface external electrode 421B along the stacking direction T. The first side surface recess 530B is disposed approximately near the center of the first side surface external electrode 421B in the longitudinal direction L. The first side surface recess 530B may communicate with either or both of the first main surface recess 510B and the second main surface recess 520B described above.

[0138] like Figure 4A as well as Figure 4B As shown, in the LW cross-sectional view, the second side surface external electrode 422B of the second external electrode 40B has a second side surface concave portion 540B as a concave portion that is recessed toward the stacked body 10. The second side surface concave portion 540B is formed on the surface of the second side surface external electrode 422B. The second side surface concave portion 540B has a stacking direction T perpendicular to the LW cross-sectional view. Figure 4A as well as Figure 4BThe second side surface recess 540B may be formed to extend in the front-to-back direction of the paper. The second side surface recess 540B may also be formed to extend across the entire length of the second side surface external electrode 422B along the stacking direction T. The second side surface recess 540B is disposed approximately near the center of the second side surface external electrode 422B in the longitudinal direction L. The second side surface recess 540B may communicate with either or both of the first main surface recess 510B and the second main surface recess 520B described above.

[0139] The first principal surface-side external electrode 411A and the second principal surface-side external electrode 412A of the first external electrode 40A, and the first principal surface-side external electrode 411B and the second principal surface-side external electrode 412B of the second external electrode 40B have the same structure. Furthermore, the first side surface-side external electrode 421A and the second side surface-side external electrode 422A of the first external electrode 40A, and the first side surface-side external electrode 421B and the second side surface-side external electrode 422B of the second external electrode 40B also have the same structure as the four principal surface-side external electrodes 411A, 412A, 411B, and 412B described above.

[0140] The first main surface side recessed portions 510A and the second main surface side recessed portions 520A of the first external electrode 40A and the first main surface side recessed portions 510B and the second main surface side recessed portions 520B of the second external electrode 40B have the same structure. Furthermore, the first side surface side recessed portions 530A and the second side surface side recessed portions 540A of the first external electrode 40A and the first side surface side recessed portions 530B and the second side surface side recessed portions 540B of the second external electrode 40B also have the same structure as the four main surface side recessed portions 510A, 520A, 510B, and 520B described above.

[0141] Therefore, as representatives of the main surface side external electrodes and main surface side recesses at these four locations and the side side external electrodes and side side recesses at these four locations, the first main surface side external electrode 411A and the first main surface side recess 510A of the first external electrode 40A are described below, thereby serving as a description of the main surface side external electrodes and main surface side recesses at the four locations and the side side external electrodes and side side recesses at the four locations.

[0142] Furthermore, the first principal surface-side external electrode 411A of the first external electrode 40A corresponds to the second principal surface-side external electrode 412A, the first side surface-side external electrode 421A, and the second side surface-side external electrode 422A of the first external electrode 40A, and the first principal surface-side external electrode 411B, the second principal surface-side external electrode 412B, the first side surface-side external electrode 421B, and the second side surface-side external electrode 422B of the second external electrode 40B. The first principal surface-side recessed portion 510A of the first external electrode 40A corresponds to the second principal surface-side recessed portion 520A, the first side surface-side recessed portion 530A, and the second side surface-side recessed portion 540A of the first external electrode 40A, and the first principal surface-side recessed portion 510B, the second principal surface-side recessed portion 520B, the first side surface-side recessed portion 530B, and the second side surface-side recessed portion 540B of the second external electrode 40B.

[0143] The first base electrode layer 50A and the first plating layer 60A of the first external electrode 40A correspond to the second base electrode layer 50B and the second plating layer 60B of the second external electrode 40B. The first Ni plating layer 61A and the first Sn plating layer 62A of the first plating layer 60A of the first external electrode 40A correspond to the second Ni plating layer 61B and the second Sn plating layer 62B of the second plating layer 60B of the second external electrode 40B.

[0144] Figure 5A yes Figure 2 VA is an enlarged view of the portion indicated by VA and is an LT cross-sectional view showing the first principal surface side external electrode 411A of the first external electrode 40A. Figure 5B is with Figure 5A The corresponding figure shows the outer shape of the LT cross section of the first main surface side external electrode 411A of the first external electrode 40A. Figure 5A as well as Figure 5B In the figure, it is shown that Figures 1 to 4B The same XYZ orthogonal coordinate system.

[0145] like Figure 5A As shown, the first main surface side external electrode 411A of the first external electrode 40A includes a first main surface side base electrode layer 511A arranged on the first main surface TS1 and a first main surface side plating layer 611A including a first Ni plating layer 61A and a first Sn plating layer 62A. The first main surface side recessed portion 510A is formed by stacking the first Sn plating layer 62A of the outermost first main surface side plating layer 611A, the first Ni plating layer 61A below the first Sn plating layer 62A, and the first main surface side base electrode layer 511A below the first Ni plating layer 61A in the stacking direction T (in the stacking direction T). Figure 5A 、 Figure 5B It is formed so as to be recessed toward the stacked body 10 side (corresponding to the Z direction).

[0146] Therefore, the thickness of the first principal surface side foundation electrode layer 511A corresponding to the stacking direction T is smallest at the portion corresponding to the first principal surface side recess 510A. In the embodiment, the maximum thickness of the first principal surface side foundation electrode layer 511A is preferably 15 μm to 30 μm, for example.

[0147] like Figure 5A As shown, in the LT cross-sectional view, the first main surface side external electrode 411A in the first external electrode 40A has the above-mentioned first main surface side recess 510A and a recess in the longitudinal direction L (in the longitudinal direction L). Figure 5A In the X direction, there are an inner peripheral region 560 and an outer peripheral region 570 as peripheral regions adjacent to the first main surface side recess 510A.

[0148] If used Figure 5B As will be described later, the first main surface side recess 510A is a portion of a region 700 in the longitudinal direction L of a portion recessed toward the laminate 10 side. Figure 5A Shown in FIG. 5 is a recessed area 550 .

[0149] The inner peripheral area 560 is an area on the inner side relative to the first main surface side recess 510A in the first main surface side external electrode 411A in the longitudinal direction L, that is, on the center side in the longitudinal direction L of the stack 10 (on the side away from the first end surface LS1 in the longitudinal direction L), and is an area with a range approximately equal to the longitudinal direction L of the recess area 550 from the recess area 550.

[0150] The outer peripheral area 570 is an area on the outside of the first main surface side recess 510A in the first main surface side external electrode 411A in the longitudinal direction L, i.e., on the outside of the stack 10 in the longitudinal direction L (on the side close to the first end surface LS1 in the longitudinal direction L), and is an area with a range approximately equal to that of the recess area 550 in the longitudinal direction L starting from the recess area 550.

[0151] like Figure 5B As shown, the surface of the first principal surface-side external electrode 411A has the aforementioned first principal surface-side recess 510A, a first raised portion 710 on the inner side of the first principal surface-side recess 510A, and a second raised portion 720 on the outer side of the first principal surface-side recess 510A. The first raised portion 710 corresponds to the inner peripheral region 560, and the second raised portion 720 corresponds to the outer peripheral region 570.

[0152] Figure 5BReference numeral 700 indicates an area in the longitudinal direction L of the first principal surface side recessed portion 510A (recessed portion region 550) in the embodiment. The area 700 in the longitudinal direction L of the first principal surface side recessed portion 510A is based on the distance in the longitudinal direction L between a first midpoint 510m1 of a line connecting the deepest portion 510d of the first principal surface side recessed portion 510A and the apex 710p of the first raised portion 710, and a second midpoint 510m2 of a line connecting the deepest portion 510d of the first principal surface side recessed portion 510A and the apex 720p of the second raised portion 720. The deepest portion 510d of the first principal surface side recessed portion 510A is the portion of the first principal surface side recessed portion 510A that is closest to the first principal surface TS1 of the stacked body 10 in the stacking direction T. The vertex 710p of the first raised portion 710 is the point on the surface of the first raised portion 710 that is farthest from the first main surface TS1 of the stacked body 10 in the stacking direction T. The vertex 720p of the second raised portion 720 is the point on the surface of the second raised portion 720 that is farthest from the first main surface TS1 of the stacked body 10 in the stacking direction T.

[0153] The distance in the stacking direction T between the vertex 710p of the first raised portion 710 and the first main surface TS1 of the stacked body 10 is the height 710H of the first raised portion 710. The distance in the stacking direction T between the vertex 720p of the second raised portion 720 and the first main surface TS1 of the stacked body 10 is the height 720H ​​of the second raised portion 720. In the embodiment, the height 710H of the first raised portion 710 and the height 720H ​​of the second raised portion 720 may be the same or different. In different situations, the height 710H of the first raised portion 710 may be higher than the height 720H ​​of the second raised portion 720, or conversely, the height 710H of the first raised portion 710 may be lower than the height 720H ​​of the second raised portion 720.

[0154] like Figure 5B As shown, in the embodiment, the depth D of the first main surface side recess 510A is the shortest distance between a line connecting the apex 710 p of the first protrusion 710 and the apex 720 p of the second protrusion 720 and the deepest portion 510 d.

[0155] In the embodiment, the depth D of the first main surface side recess 510A is preferably 3 μm or more and 10 μm or less.

[0156] In the embodiment, the depth D of the first main surface side recess 510A is preferably larger than the thickness of the Ni plating layer 61A in the stacking direction T.

[0157] like Figure 5BAs shown, in the embodiment, the distance 730L between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 in the longitudinal direction L is preferably 120 μm to 150 μm. Furthermore, the distance 730L is preferably greater than the maximum thickness of the first principal surface side base electrode layer 511A.

[0158] like Figure 5B As shown, in the embodiment, a distance 740L in the longitudinal direction L between the inner end 560a of the first principal surface side base electrode layer 511A and the deepest portion 510d of the first principal surface side recess 510A is preferably 110 μm or more and 130 μm or less.

[0159] like Figure 5B As shown, in the embodiment, the distance 750L in the longitudinal direction L between the inner end 560 a of the first principal-surface-side base electrode layer 511A and the apex 710 p of the first protrusion 710 is preferably 70 μm or more and 90 μm or less.

[0160] In the first main surface side external electrode 411A of the embodiment, the surface roughness Ra of the surface 550s of the first main surface side recess 510A is rougher than the surface roughness Ra of the surface 560s of the inner peripheral area 560 corresponding to the first protrusion 710, and is rougher than the surface roughness Ra of the surface 570s of the outer peripheral area 570 corresponding to the second protrusion 720.

[0161] The surface roughness Ra of the surface 550s of the first main surface side recess 510A is preferably 0.7 μm or more, more preferably 0.7 μm or more and 1.4 μm or less, and further preferably 1.0 μm or more and 1.4 μm or less.

[0162] The surface roughness Ra of the surface 560s of the inner peripheral region 560 and the surface roughness Ra of the surface 570s of the outer peripheral region 570 are preferably 0.5 μm or less, more preferably 0.2 μm or more and 0.5 μm or less, and further preferably 0.4 μm or more and 0.5 μm or less.

[0163] In the multilayer ceramic capacitor 1 of the embodiment, the first main surface-side external electrode 411A of the first external electrode 40A includes a first main surface-side recess 510A. Furthermore, the first main surface-side external electrode 411A includes an inner peripheral region 560 located inwardly of the first main surface-side recess 510A in the longitudinal direction L, and an outer peripheral region 570 located outwardly of the first main surface-side recess 510A in the longitudinal direction L. The surface roughness Ra of a surface 550s of the first main surface-side recess 510A is rougher than the surface roughness Ra of a surface 560s of the inner peripheral region 560 and the surface roughness Ra of a surface 570s of the outer peripheral region 570.

[0164] The multilayer ceramic capacitor 1 of the embodiment is mounted on a substrate. When mounted on the substrate, the external electrode 40 is sometimes joined to the terminal of the substrate by welding. When the first main surface side external electrode 411A is joined to the substrate by welding, the bending stress generated by the first main surface side external electrode 411A is particularly concentrated on the Figure 5B The inner end 411e of the first principal surface-side external electrode 411A or the inner end 560a of the first principal surface-side base electrode layer 511A shown in FIG. This tensile stress is transmitted to the laminate 10, potentially causing cracks, etc., in the laminate 10. In the multilayer ceramic capacitor 1 of the embodiment, the first principal surface-side external electrode 411A includes the first principal surface-side recess 510A, thereby forming a depression corresponding to the first principal surface-side recess 510A in the first principal surface-side base electrode layer 511A. This reduces the total mass of the first principal surface-side base electrode layer 511A compared to a case without the first principal surface-side recess 510A. This reduction in mass is related to a reduction in tensile stress due to the flexural stress concentrated on the inner end 411e and end 560a. This improves the flexural resistance of the multilayer ceramic capacitor 1, and consequently, suppresses the occurrence of cracks, etc., in the laminate 10.

[0165] When soldering the first principal surface-side external electrode 411A to the substrate, solder enters between the first principal surface-side external electrode 411A and the substrate. Although this solder contacts the surface of the first principal surface-side external electrode 411A, the larger the contact area, the greater the aforementioned flexural stress on the first principal surface-side external electrode 411A. As a result, cracks, etc., may form in the laminate 10. In this embodiment, the surface roughness Ra of the surface 550s of the first principal surface-side recessed portion 510A is rougher than the surface roughness Ra of the surface 560s of the inner peripheral region 560 and rougher than the surface roughness Ra of the surface 570s of the outer peripheral region 570. This makes it difficult for the solder to wet the surface 550s of the first principal surface-side recessed portion 510A, making it difficult to contact the entire surface. Consequently, the solder's contact area with the surface 550s of the first principal surface-side recessed portion 510A becomes smaller than the surface 560s of the inner peripheral region 560 and the surface 570s of the outer peripheral region 570. Therefore, the contact area of ​​the solder with the entire surface of the first main surface side external electrode 411A can be reduced, so the tensile stress due to the flexural stress concentrated on the inner end portion 411e and the end 560a can be reduced, resulting in the suppression of cracks in the laminate 10. The solder bonding strength is ensured by the surface 560s of the inner peripheral region 560 and the surface 570s of the outer peripheral region 570, where the solder contact area is relatively large.

[0166] Next, a method for measuring the surface roughness Ra of the first principal surface side external electrode 411A and the depth D of the first principal surface side recessed portion 510A will be described.

[0167] First, the method for measuring the surface roughness Ra (arithmetic mean roughness Ra) of the first principal surface-side external electrode 411A will be described. Using a laser microscope (KEYENCE (registered trademark), VK-X1000, 20x magnification), a laser was used to scan the surfaces of the first principal surface-side recessed portion 510A (recessed region 550), the inner peripheral region 560, and the outer peripheral region 570, acquiring images of each surface. The surface roughness Ra of each surface was then measured using analysis software (KEYENCE (registered trademark), Multi-File Analysis Application).

[0168] Next, the method for measuring the depth D of the first main surface side recess 510A is described. The multilayer ceramic capacitor 1 is ground from the first side surface WS1 or the second side surface WS2 to a position approximately halfway along the width direction W. This exposes the LT cross-section of the multilayer ceramic capacitor 1 at the exact center along the width direction W. Next, a digital microscope is used to measure the depth D of the first main surface side recess 510A in the LT cross-section exposed by grinding. This allows the depth D of the first main surface side recess 510A to be confirmed.

[0169] Next, a method for manufacturing the multilayer ceramic capacitor 1 according to the embodiment will be described. The method for manufacturing the multilayer ceramic capacitor 1 according to the embodiment is not limited as long as the above requirements are met. However, a preferred manufacturing method includes the following steps. Details of each step are described below.

[0170] A dielectric sheet for dielectric layer 20 and a conductive paste for internal electrode layer 30 are prepared. Both the dielectric sheet for dielectric layer 20 and the conductive paste for internal electrode layer 30 contain a binder and a solvent. The binder and solvent can be known binders and solvents. For example, the conductive paste is a paste obtained by adding an organic binder and an organic solvent to metal powder.

[0171] For example, conductive paste for the internal electrode layer 30 is printed in a predetermined pattern on the dielectric sheet by screen printing, gravure printing, etc. Thus, a dielectric sheet having a pattern for the first internal electrode layer 31 and a dielectric sheet having a pattern for the second internal electrode layer 32 are prepared.

[0172] By stacking a predetermined number of dielectric sheets without the internal electrode layer 30 pattern printed on them, a portion on the first main surface TS1 side, which will become the first main surface side outer layer portion 12, is formed. Dielectric sheets with the first internal electrode layer 31 pattern printed on them and dielectric sheets with the second internal electrode layer 32 pattern printed on them are then alternately stacked on top of them. This forms a portion that will become the inner layer portion 11. A predetermined number of dielectric sheets without the internal electrode layer 30 pattern printed on them are then stacked on top of this portion that will become the inner layer portion 11, forming a portion on the second main surface TS2 side, which will become the second main surface side outer layer portion 13. This produces a laminated sheet.

[0173] The laminated sheets are pressed in the lamination direction by isostatic pressing or the like to produce a laminated block.

[0174] The stacked block is cut into pieces of a predetermined size to obtain a plurality of stacked small pieces. The stacked small pieces may then be polished by barrel polishing or the like to round off the corners and ridges.

[0175] The stacked small pieces are fired to produce the stacked body 10. The firing temperature at this time depends on the materials of the dielectric layer 20 and the internal electrode layer 30, but is preferably 900°C or higher and 1400°C or lower, for example.

[0176] The first external electrode 40A and the second external electrode 40B are formed on both end surfaces of the laminate 10 as follows.

[0177] A conductive paste, which will become the first foundation electrode layer 50A, is applied to the first end face LS1 of the laminate 10. A conductive paste, which will become the second foundation electrode layer 50B, is applied to the second end face LS2 of the laminate 10. In the embodiment, the first foundation electrode layer 50A and the second foundation electrode layer 50B are sintered layers. The sintered layers are formed by applying a conductive paste containing a glass component and a metal to the laminate 10, for example, by dipping, and then sintering the paste. The sintering temperature is preferably, for example, 700°C or higher and 950°C or lower.

[0178] The first foundation electrode layer 50A and the second foundation electrode layer 50B are preferably sintered layers. This allows the first foundation electrode layer 50A and the second foundation electrode layer 50B to be formed using a relatively simple method compared to thin film formation methods such as sputtering and vapor deposition.

[0179] In an embodiment, impregnation is performed so that the conductive paste that becomes the first main surface side base electrode layer 511A of the first base electrode layer 50A is configured to extend from the first end surface LS1 of the stack 10 to a portion of the first main surface TS1, and the conductive paste that becomes the second main surface side base electrode layer 512A of the first base electrode layer 50A is configured to extend from the first end surface LS1 of the stack 10 to a portion of the second main surface TS2.

[0180] In addition, in an embodiment, impregnation is performed so that the conductive paste that becomes the first principal surface side base electrode layer 511B of the second base electrode layer 50B is configured to extend from the second end surface LS2 of the stack 10 to a portion of the first principal surface TS1, and the conductive paste that becomes the second principal surface side base electrode layer 512B of the second base electrode layer 50B is configured to extend from the second end surface LS2 of the stack 10 to a portion of the second principal surface TS2.

[0181] In addition, at this time, it is preferred to carry out the impregnation simultaneously so that the conductive paste which becomes the first side surface side base electrode layer 521A of the first base electrode layer 50A is configured as a part extending from the first end surface LS1 of the stack 10 to the first side surface WS1, and the conductive paste which becomes the second side surface side base electrode layer 522A of the first base electrode layer 50A is configured as a part extending from the first end surface LS1 of the stack 10 to the second side surface WS2.

[0182] In addition, at this time, it is preferred to carry out the impregnation simultaneously so that the conductive paste which becomes the first side surface side base electrode layer 521B of the second base electrode layer 50B is configured to extend from the second end surface LS2 of the stack 10 to a part of the first side surface WS1, and the conductive paste which becomes the second side surface side base electrode layer 522B of the second base electrode layer 50B is configured to extend from the second end surface LS2 of the stack 10 to a part of the second side surface WS2.

[0183] Alternatively, the pre-fired laminated pieces and the conductive paste applied to the laminated pieces may be fired simultaneously. In this case, the sintered layer is preferably formed by sintering a material to which a ceramic material has been added in place of the glass component. In this case, the added ceramic material is preferably the same type as the dielectric layer 20. In this case, the conductive paste is applied to the pre-fired laminated pieces, and the laminated pieces and the conductive paste applied to the laminated pieces are sintered simultaneously, thereby forming a laminate 10 having a sintered layer. Forming the sintered layer simultaneously with the firing of the laminate 10 can simplify the manufacturing process.

[0184] Next, plating is performed on the surfaces of the first and second foundation electrode layers 50A, including the sintered layers. In the embodiment, a first plating layer 60A is formed on the surface of the first foundation electrode layer 50A. Furthermore, a second plating layer 60B is formed on the surface of the second foundation electrode layer 50B. In the embodiment, a first Ni plating layer 61A is formed on the surface of the first foundation electrode layer 50A, and a first Sn plating layer 62A is formed on the surface of the first Ni plating layer 61A. In the embodiment, a second Ni plating layer 61B is formed on the surface of the second foundation electrode layer 50B, and a second Sn plating layer 62B is formed on the surface of the second Ni plating layer 61B.

[0185] When performing the plating process, either electrolytic plating or electroless plating can be used. However, electroless plating requires pretreatment with a catalyst to increase the deposition rate of the coating, which has the disadvantage of complicating the process. Therefore, electrolytic plating is generally preferred. The Ni plating layer and the Sn plating layer are preferably formed sequentially by, for example, barrel plating.

[0186] Alternatively, when a conductive resin layer is provided, it can be arranged to cover the sintered layer. When providing a conductive resin layer, a conductive resin paste containing a thermosetting resin and a metal component is applied to the sintered layer and then heat-treated at a temperature of 250°C to 550°C or higher. This heat-cures the thermosetting resin to form the conductive resin layer. The heat treatment is preferably performed in an N2 atmosphere. Furthermore, to prevent scattering of the resin and oxidation of the various metal components, the oxygen concentration is preferably below 100 ppm.

[0187] Here, when obtaining the above-mentioned groove-shaped recessed portions in each main surface side external electrode and each side surface side external electrode of the external electrode 40 as in the embodiment, for example, the following methods can be mentioned.

[0188] Figures 6A to 6C The process of forming the base electrode layer in this method is schematically shown. Figure 6A As shown in FIG. 1 , the first conductive paste P1 that will become the base electrode layer is applied to the end portion of the laminate 10 in the longitudinal direction L by dipping. A conductive paste with a relatively high viscosity can be used for the first conductive paste P1. Figure 6B As shown in FIG. 1 , the first conductive paste P1 is removed from the end face of the laminate 10 and the vicinity of the end face, thereby forming a first protruding portion 710. Figure 6CAs shown, the second conductive paste P2 having a relatively low viscosity is lightly applied by dipping just before the first raised portion 710. This forms the second raised portion 720, and a recess G is formed between the second raised portion 720 and the first raised portion 710. This recess G serves as the first principal surface side recess 510A, the second principal surface side recess 520A, the first side surface side recess 530A, the second side surface side recess 540A, the first principal surface side recess 510B, the second principal surface side recess 520B, the first side surface side recess 530B, and the second side surface side recess 540B described above.

[0189] Here, when controlling the surface roughness of each main surface side external electrode and each side surface side external electrode of the external electrode 40 as in the embodiment, that is, making the surface roughness of the recessed portion rougher than the surface roughness of the peripheral region, for example, the following methods can be mentioned.

[0190] After forming the external electrodes, barrel polishing is performed. By adjusting the size of the recess, the size of the media used for barrel polishing, and the conditions for barrel polishing, the contact between the media and the surfaces of the recess and the surrounding area is adjusted, resulting in the recess surface being rougher than the surrounding area. For example, barrel polishing can be performed while masking the recess surface, leaving the recess surface unpolished while polishing the surrounding area. This can result in the recess surface being rougher than the surrounding area.

[0191] Through the above-described manufacturing steps, the multilayer ceramic capacitor 1 can be manufactured.

[0192] The structure of the multilayer ceramic capacitor 1 is not limited to Figures 1 to 4B For example, the multilayer ceramic capacitor 1 may also be as shown in FIG. Figure 7A 、 Figure 7B as well as Figure 7C The following are multilayer ceramic capacitors with dual, triple, and quadruple structures.

[0193] Figure 7A The multilayer ceramic capacitor 1 shown is a multilayer ceramic capacitor 1 of a two-layer structure, and as an internal electrode layer 30, in addition to the first internal electrode layer 33 and the second internal electrode layer 34, it also has a floating internal electrode layer 35 as a floating internal conductor layer that is not extended to either the first end surface LS1 or the second end surface LS2.

[0194] Figure 7B The illustrated multilayer ceramic capacitor 1 is a multilayer ceramic capacitor 1 having a triple structure including a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as floating internal electrode layers 35 .

[0195] Figure 7CThe illustrated multilayer ceramic capacitor 1 is a quadruple structure multilayer ceramic capacitor 1 including a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C as floating internal electrode layers 35 .

[0196] By providing the floating internal electrode layer 35 as the internal electrode layer 30, the multilayer ceramic capacitor 1 has a structure in which the opposing electrode portion is divided into multiple components. This creates a structure in which multiple capacitor components are connected in series between the opposing internal electrode layers 30. Consequently, the voltage applied to each capacitor component is reduced, enabling the multilayer ceramic capacitor 1 to achieve a higher withstand voltage. Furthermore, the multilayer ceramic capacitor 1 of the embodiment can, of course, also have a multi-cell structure with four or more components.

[0197] exist Figure 7A 、 Figure 7B as well as Figure 7C In the multilayer ceramic capacitor 1 having the structure shown, similarly to the above-described embodiment, the first external electrode 40A has a first main surface side recess 510A and a second main surface side recess 520A, and the second external electrode 40B has a first main surface side recess 510B and a second main surface side recess 520B. Furthermore, the surface roughness of these recesses is preferably coarser than the surface roughness of the surrounding areas of the recesses.

[0198] Alternatively, it can be Figure 7A 、 Figure 7B as well as Figure 7C In the multilayer ceramic capacitor 1 having the structure shown, similarly to the above-described embodiment, the first external electrode 40A has a first side surface recess 530A and a second side surface recess 540A, and the second external electrode 40B has a first side surface recess 530B and a second side surface recess 540B. Furthermore, the surface roughness of these recesses is preferably coarser than the surface roughness of the surrounding areas of the recesses.

[0199] in particular, Figures 7A to 7C The multilayer ceramic capacitor 1 having a double, triple, or quadruple structure with floating internal electrode layers 35 shown is effective when used under high voltage. However, it is preferable to add shrinkage stress to the multilayer body 10 as a countermeasure against electrostriction under high voltage. To achieve this countermeasure, the plating thickness of the external electrodes on the main surface and side surfaces of the multilayer body 10 is increased. However, in this case, Figure 5BThe tensile stress applied to the inner end 411e and end 560a of the external electrode 40 shown in the figure increases, resulting in a problem of reduced flexural resistance. However, as in the embodiment, by providing recessed portions (first main surface side recessed portions and second main surface side recessed portions) in the main surface side external electrode and making the surface roughness of the recessed portions rougher than that of the surrounding areas, flexural resistance can be improved as described above. As a result, the occurrence of cracks in the laminate 10 can be suppressed.

[0200] According to the multilayer ceramic capacitor 1 according to the embodiment described above, the following effects are achieved.

[0201] (1) A multilayer ceramic capacitor 1 according to an embodiment comprises: a multilayer body 10 including a plurality of dielectric layers 20 as ceramic layers and a plurality of internal electrode layers 30 as internal conductor layers alternately stacked in a stacking direction T, and including a first main surface TS1 and a second main surface TS2 opposite to each other in the stacking direction T, a first end surface LS1 and a second end surface LS2 opposite to each other in a longitudinal direction L perpendicular to the stacking direction T, and a first side surface WS1 and a second side surface WS2 opposite to each other in a width direction W perpendicular to the stacking direction T and the longitudinal direction L; and a pair of external electrodes 40 arranged at both ends of the multilayer body 10 in the longitudinal direction L, the internal electrode layers 30 including a first internal electrode layer 31 as a first internal conductor layer extending to the first end surface LS1 and a second internal electrode layer 32 as a second internal conductor layer extending to the second end surface LS2, and the external electrodes 40 including a first internal electrode layer 31 as a first internal conductor layer extending to the first end surface LS1 and a second internal electrode layer 32 as a second internal conductor layer extending to the second end surface LS2, respectively. The first main surface side external electrode 411A, the second main surface side external electrode 412A, the first main surface side external electrode 411B, and the second main surface side external electrode 412B of the electrode respectively have a first main surface side recess 510A, a second main surface side recess 510B, and a second main surface side recess 510C as recesses that are recessed toward the stacked body 10 side in a cross-sectional view along the stacking direction T and the longitudinal direction L. The surface roughness of the first main surface side recess 510A, the second main surface side recess 510B, the second main surface side recess 520B, and the inner peripheral region 560 and the outer peripheral region 570, which are adjacent to the recess in the longitudinal direction L and serve as peripheral regions, is coarser than the surface roughness of the inner peripheral region 560 and the surface roughness of the outer peripheral region 570.

[0202] Thus, the multilayer ceramic capacitor 1 according to the embodiment can improve its flexural resistance when mounted on a substrate, and as a result, it is possible to suppress the occurrence of cracks and the like in the multilayer body 10 .

[0203] (2) In the multilayer ceramic capacitor 1 of (1) according to the embodiment, the surface roughness Ra of the first main surface side recessed portion 510A, the second main surface side recessed portion 520A, the first main surface side recessed portion 510B, and the second main surface side recessed portion 520B is preferably 0.7 μm or more and 1.4 μm or less.

[0204] This can improve the flexural resistance during mounting on a substrate, and as a result, can suppress the occurrence of cracks and the like in the laminate 10 .

[0205] (3) In the multilayer ceramic capacitor 1 of (2) above according to the embodiment, the surface roughness Ra of the inner peripheral region 560 and the surface roughness Ra of the outer peripheral region 570 are preferably 0.2 μm or more and 0.5 μm or less.

[0206] This can improve the flexural resistance during mounting on a substrate, and as a result, can suppress the occurrence of cracks and the like in the laminate 10 .

[0207] (4) In the multilayer ceramic capacitor 1 according to (1) to (3) above, the embodiment includes a mode in which the internal electrode layer 30 includes a floating internal electrode layer 35 as a floating internal conductor layer, which is not extended to either the first end surface LS1 or the second end surface LS2 and is opposed to at least one of the first internal electrode layer 31 and the second internal electrode layer 32 with the dielectric layer 20 interposed therebetween.

[0208] This makes it possible to increase the withstand voltage of the multilayer ceramic capacitor 1 .

[0209] The multilayer ceramic capacitor 1 of the embodiment may also include the following structure, namely, the first external electrode 40A and the second external electrode 40B each include a side external electrode, each of which has a recessed portion similar to that of the main surface external electrode, and the surface roughness of the recessed portion is rougher than the surface roughness of the surrounding area.

[0210] That is, the multilayer ceramic capacitor 1 according to the embodiment includes:

[0211] A laminate 10 comprising a plurality of dielectric layers 20 serving as ceramic layers and a plurality of internal electrode layers 30 serving as internal conductor layers alternately stacked in a stacking direction T, and comprising a first main surface TS1 and a second main surface TS2 opposing each other in the stacking direction T, a first end surface LS1 and a second end surface LS2 opposing each other in a longitudinal direction L perpendicular to the stacking direction T, and a first side surface WS1 and a second side surface WS2 opposing each other in a width direction W perpendicular to the stacking direction T and the longitudinal direction L; and

[0212] A pair of external electrodes 40 are disposed at both ends of the stacked body 10 in the longitudinal direction L, spaced apart from each other.

[0213] The internal electrode layer 30 includes:

[0214] A first internal electrode layer 31 as a first internal conductor layer is led out to the first end surface LS1; and

[0215] The second internal electrode layer 32, which is the second internal conductor layer, is led out to the second end surface LS2.

[0216] The external electrode 40 includes a side surface external electrode disposed on at least one of the first side surface WS1 and the second side surface WS2.

[0217] The side external electrode has:

[0218] a recessed portion that is recessed toward the stacked body in a cross-sectional view along the stacking direction and the longitudinal direction; and

[0219] a peripheral region adjacent to the recess in the longitudinal direction,

[0220] The surface roughness of the recessed portion is coarser than the surface roughness of the peripheral region.

[0221] The present invention is not limited to the configuration of the above embodiment, and can be applied with appropriate modifications within the scope of the present invention. In addition, a combination of two or more configurations of the preferred configurations described in the above embodiment also constitutes the present invention.

[0222] For example, the multilayer ceramic capacitor 1 may be a two-terminal multilayer ceramic capacitor having two external electrodes, or may be a multi-terminal multilayer ceramic capacitor having a large number of external electrodes.

[0223] In the above embodiment, a multilayer ceramic capacitor using dielectric ceramics is exemplified as a multilayer ceramic electronic component. However, the multilayer ceramic electronic component disclosed herein is not limited to this application and can be applied to various multilayer ceramic electronic components, such as piezoelectric components using piezoelectric ceramics, thermistors using semiconductor ceramics, and inductors using magnetic ceramics. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, semiconductor ceramics include spinel ceramics, and magnetic ceramics include ferrites.

Claims

1. A multilayer ceramic electronic component comprising: a laminate comprising a plurality of ceramic layers and a plurality of internal conductor layers alternately stacked in a stacking direction, and comprising a first main surface and a second main surface opposing each other in the stacking direction, a first end surface and a second end surface opposing each other in a longitudinal direction perpendicular to the stacking direction, and a first side surface and a second side surface opposing each other in a width direction perpendicular to the stacking direction and the longitudinal direction; and A pair of external electrodes are disposed at both ends of the stack in the longitudinal direction thereof, spaced apart from each other. The inner conductor layer comprises: a first internal conductor layer extending to the first end surface; and The second internal conductor layer is led out to the second end surface, The external electrodes include: a main surface side external electrode arranged on at least one of the first main surface and the second main surface; The main surface side external electrode has: a recessed portion that is recessed toward the stacked body in a cross-sectional view along the stacking direction and the longitudinal direction; and a peripheral region adjacent to the recess in the longitudinal direction, The surface roughness of the recessed portion is coarser than the surface roughness of the peripheral region.

2. The multilayer ceramic electronic component according to claim 1, wherein The surface roughness Ra of the recessed portion is greater than or equal to 0.7 μm and less than or equal to 1.4 μm.

3. The multilayer ceramic electronic component according to claim 2, wherein The surface roughness Ra of the peripheral region is greater than or equal to 0.2 μm and less than or equal to 0.5 μm.

4. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein The internal conductive layer includes a floating internal conductive layer that is not drawn out to either the first end surface or the second end surface and faces at least one of the first internal conductive layer and the second internal conductive layer with the ceramic layer interposed therebetween.

Images