Device for removing residual metal on back surface of invalid packaging chip

Abstract

The invention provides a device for removing residual metal on the back surface of a failed packaged chip. The device comprises a protective cover, a chip mounting rack, a cleaning assembly, a waste liquid collecting tank and a controller, the protective cover encloses the chip mounting rack, the cleaning assembly and the waste liquid collecting tank, and a liquid dripping opening is formed in the top end of the protective cover and used for dripping a solution through a dropper; the chip mounting rack is used for mounting the failed packaging chip, and the chip mounting rack can turn over the failed packaging chip to enable the back surface of the failed packaging chip to face the liquid dropping opening or deviate from the liquid dropping opening; the cleaning assembly is used for cleaning the back surface of the failure packaging chip; the waste liquid collecting tank is used for collecting cleaning waste liquid; the controller is arranged on the protective cover and electrically connected with the chip mounting frame and the cleaning assembly. The controller is used for controlling the chip mounting frame and the cleaning assembly. The device can solve the problem that the physical health of operators is affected by splashing of an acid solution in the process of removing residual metal on the back of the chip.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a device for removing residual metal from the back side of a failed packaged chip. Background Art

[0002] During semiconductor device failure analysis, removing the heatsink cover and residual metal on the back of the chip (such as residual indium and back-gold) from failed package samples is a crucial prerequisite for subsequent analysis steps. Failure to completely remove this residual metal can severely impact the effectiveness of various failure analysis methods. For example, when using ultrasonic scanning, sound waves are easily scattered by residual metal, affecting imaging quality. In infrared analysis, infrared light cannot penetrate these metal layers to inspect the chip's internal circuitry, similarly limiting analysis accuracy.

[0003] Currently, the common practice for removing residual metal on the back of the chip is to use a mixed solution of hydrochloric acid and hydrogen peroxide. This chemical solution can effectively dissolve a variety of metal residues, including indium and gold, providing a clean surface for subsequent failure analysis. However, the existing operation method is mainly to manually titrate the mixed solution directly onto the sample surface through a dropper to achieve a reaction, and then rinse with clean water to remove the reaction products and obtain a clean chip surface. Although this treatment method is simple and direct, it has obvious shortcomings in the actual operation process: first, since the sample is exposed to an open environment throughout the process, the acidic solution is extremely volatile and causes pollution to the surrounding environment; second, the risk of solution splashing during the operation increases the potential threat to the health of the operator. Summary of the Invention

[0004] The embodiments of the present application at least provide a device for removing residual metal from the back of a failed packaged chip, which can improve the problem of splashing acidic solution affecting the health of operators during the process of removing residual metal from the back of the chip.

[0005] The embodiment of the present application provides a device for removing residual metal from the back side of a failed packaged chip, the device comprising: a protective cover, a chip mounting frame, a cleaning assembly, a waste liquid collection tank, and a controller;

[0006] The protective cover surrounds the chip mounting frame, the cleaning assembly and the waste liquid collecting tank, and a dripping port is provided on the top of the protective cover for dripping the solution with a dropper;

[0007] The chip mounting frame is used to mount a failed packaged chip, and the chip mounting frame is configured to be able to flip the failed packaged chip so that its back side faces the dripping port or faces away from the dripping port;

[0008] The cleaning component is located on a side of the chip mounting frame away from the dripping port, and is used to clean the back side of the failed packaged chip;

[0009] The waste liquid collecting tank is located on a side of the cleaning component away from the dripping port, and is used to collect cleaning waste liquid;

[0010] The controller is arranged on the protective cover and is electrically connected to the chip mounting frame and the cleaning component respectively. The controller controls the chip mounting frame to flip according to the set titration time so that the back side of the failed packaged chip faces or away from the dripping port; and controls the opening and closing of the cleaning component and the flipping of the chip mounting frame according to the set cleaning time.

[0011] In an optional embodiment, the protective cover is a transparent cover.

[0012] In an optional embodiment, the chip mounting frame includes a flip motor and a sample stage;

[0013] The flip motor is arranged in the protective cover;

[0014] The sample stage is arranged on the rotating shaft of the flip motor and is used for mounting the failed packaged chip.

[0015] In an optional embodiment, the mounting platform is provided with a fixed clamping block, a movable clamping block and an elastic member;

[0016] The fixed clamping block is fixedly arranged on the mounting platform;

[0017] The movable clamping block is movably arranged on the mounting platform;

[0018] The elastic member is arranged between the movable clamping block and the sample stage, and is configured to enable the movable clamping block to move toward the fixed clamping block when no external force is applied, so as to clamp the failed packaged chip.

[0019] In an optional embodiment, the flip motor is movably disposed in the protective cover and has a dissolving and cleaning position and a loading and unloading position. In the dissolving and cleaning position, the dropper can drip solution into the failed packaged chip. In the loading and unloading position, the failed packaged chip can be mounted on or unloaded from the sample stage.

[0020] The chip mounting rack further includes a first driving mechanism for driving the flip motor to move between the dissolving and cleaning position and the loading and unloading position.

[0021] In an optional embodiment, the first driving mechanism includes a first screw rod, a first slider and a locking member;

[0022] The first screw rod is rotatably disposed in the protective cover, and one end of the first screw rod is passed through the outside of the protective cover;

[0023] The first slider is movably disposed in the protective cover, and the first slider is threadably engaged with the first screw rod;

[0024] The locking member is provided on the first slider, and the locking member has a first state and a second state. In the first state, the locking member is locked to the sample stage so that the flip motor and the sample stage can move following the first slider. In the second state, the locking member is unlocked from the sample stage.

[0025] In an optional embodiment, the locking member is a telescopic cylinder, and the telescopic rod of the locking member can be inserted into or withdrawn from a slot provided in the sample stage to switch between the first state and the second state.

[0026] In an optional embodiment, in the first state, the locking member can restrict the flip motor from flipping the sample stage.

[0027] In an optional embodiment, the device further comprises: a dropper mounting bracket;

[0028] The dropper mounting frame is arranged in the protective cover and is located between the dripping port and the chip mounting frame. The dropper mounting frame is used to install the dropper. The dropper mounting frame is configured to be able to move the dropper so that it is aligned with different positions of the failed packaged chip.

[0029] In an optional embodiment, the dropper mounting frame includes a frame, a first crossbeam, a second crossbeam, a second drive mechanism, and a third drive mechanism;

[0030] The frame is disposed within the protective cover;

[0031] The first crossbeam is laterally movably arranged on the frame, and the first crossbeam is provided with a first waist-shaped hole;

[0032] The second crossbeam is longitudinally movably arranged on the frame, and the second crossbeam is provided with a second waist-shaped hole;

[0033] The second driving mechanism is provided on the frame and connected to the first beam, and the second driving mechanism is used to drive the first beam to move laterally;

[0034] The third driving mechanism is provided on the frame and connected to the second crossbeam, and the third driving mechanism is used to drive the second crossbeam to move longitudinally;

[0035] The first waist-shaped hole and the second waist-shaped hole are cross-intersected, the dropper is inserted into the first waist-shaped hole and the second waist-shaped hole, and the dropper can slide in the first waist-shaped hole and the second waist-shaped hole.

[0036] The above technical solution of this application has the following beneficial technical effects:

[0037] The device for removing residual metal from the back of a failed packaged chip according to an embodiment of the present application includes a protective cover and a chip mounting rack, a cleaning assembly, and a waste liquid collection tank enclosed in the protective cover. During specific use, the work of removing residual metal from the back of the failed packaged chip is all carried out within the protective cover. In this way, the splashing solution can be blocked by the protective cover, thereby improving the problem of splashing acidic solution affecting the health of the operator during the process of removing residual metal from the back of the chip.

[0038] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without inventive effort.

[0040] Figure 1 A schematic structural diagram of a device for removing residual metal from the back of a failed packaged chip provided in an embodiment of the present application is shown;

[0041] Figure 2 Shown Figure 1 Schematic diagram of the structure of the chip mounting frame;

[0042] Figure 3 Shown Figure 1 Schematic diagram of the structure of the middle dropper mounting frame;

[0043] In the picture:

[0044] 1. Failed packaged chip; 2. Dropper; 100. Protective cover; 101. Drip port; 102. Protective door; 200. Chip mounting rack; 210. Flip motor; 220. Sample stage; 221. Fixed clamp; 222. Movable clamp; 223. Elastic member; 224. Mounting plate; 225. Guide rod; 226. Limit block; 227. Slot; 230. First drive mechanism; 231. First screw rod; 232. First slider; 233. Locking member; 30 0. Cleaning assembly; 400. Waste liquid collection tank; 401. Drain pipe; 500. Controller; 501. Switch; 502. Emergency stop button; 600. Dropper mounting bracket; 610. Frame; 620. First crossbeam; 621. First waist-shaped hole; 630. Second crossbeam; 631. Second waist-shaped hole; 640. Second driving mechanism; 641. Second screw rod; 642. Second slider; 650. Third driving mechanism; 651. Third screw rod; 652. Third slider. DETAILED DESCRIPTION

[0045] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0046] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0047] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0050] refer to Figures 1 to 3 An embodiment of the present application provides a device for removing residual metal from the back side of a failed packaged chip 1 , the device comprising a protective cover 100 , a chip mounting rack 200 , a cleaning assembly 300 , a waste liquid collection tank 400 and a controller 500 .

[0051] The protective cover 100 surrounds the chip mounting frame 200 , the cleaning assembly 300 and the waste liquid collecting tank 400 . A dripping port 101 is provided at the top of the protective cover 100 . The dripping port 101 is used for the dropper 2 to drip the solution.

[0052] The chip mounting rack 200 is used to mount the failed packaged chip 1 . The chip mounting rack 200 is configured to be able to flip the failed packaged chip 1 so that its back side faces the dripping port 101 or faces away from the dripping port 101 .

[0053] The cleaning assembly 300 is located on a side of the chip mounting frame 200 away from the dripping port 101 . The cleaning assembly 300 is used to clean the back side of the failed packaged chip 1 .

[0054] The waste liquid collecting tank 400 is located on a side of the cleaning component 300 away from the dripping port 101 , and is used to collect cleaning waste liquid.

[0055] The controller 500 is arranged on the protective cover 100 and is electrically connected to the chip mounting rack 200 and the cleaning assembly 300 respectively. The controller 500 controls the flipping of the chip mounting rack 200 according to the set titration time so that the back side of the failed packaged chip 1 faces or away from the drip port 101; and controls the opening and closing of the cleaning assembly 300 and the flipping of the chip mounting rack 200 according to the set cleaning time.

[0056] During specific use, the operator can drip a solution onto the back of the failed packaged chip 1 through the dripping port 101 to dissolve the residual metal on the back of the failed packaged chip 1. After the solution dripping is completed, the controller 500 can control the chip mounting rack 200 to flip the failed packaged chip 1 so that its back is away from the dripping port 101 (downward) according to the set titration time. At the same time, the controller 500 can control the cleaning component 300 to spray water to clean the back of the failed packaged chip 1 according to the set cleaning time. The dripping cleaning waste liquid can fall into the waste liquid collection tank 400. When the cleaning time is over, the controller 500 can control the cleaning component 300 to stop spraying water, and at the same time control the chip mounting rack 200 to flip the failed packaged chip 1 again so that its back is facing the dripping port 101 (upward), so that the operator can confirm whether the residual metal is completely removed. After confirming that the residual metal is completely removed, the operator can take out the failed packaged chip 1 for failure analysis.

[0057] Optionally, refer to Figure 1 , the protective cover 100 is a cylindrical structure. Of course, the protective cover 100 can also be a structure of other shapes, such as a spherical structure, a cylindrical structure, etc.

[0058] Optionally, the protective cover 100 is a transparent cover, which makes it easier for operators to observe the internal operation of the device and the removal of residual metal.

[0059] Optionally, a detachable top cover is provided on the top of the protective cover 100, which can cover the dripping port 101. In specific use, the top cover can be removed when dripping, and the dripping port 101 can be re-covered after the dripping is completed, so as to reduce the volatilization of the solution and the pollution of the surrounding environment.

[0060] Optionally, refer to Figure 1 The protective cover 100 is provided with a protective door 102 located on the side of the protective cover 100. The protective door 102 is used to load and unload failed packaged chips 1. In other words, the operator can open the protective door 102 to load the failed packaged chip 1 onto the chip mounting rack 200 inside the protective cover 100, or remove the failed packaged chip 1 from the chip mounting rack 200 after removing the residual metal on the back side. It should be understood that the protective door 102 is closed during the process of removing the residual metal on the back side of the chip, which can improve the side protection capability of the protective cover 100.

[0061] Optionally, refer to Figure 2 The chip mounting frame 200 includes a flip motor 210 and a sample stage 220. The flip motor 210 is disposed in the protective cover 100. The sample stage 220 is disposed on the rotating shaft of the flip motor 210 and is used to mount the failed packaged chip 1. In a specific configuration, the flip motor 210 is disposed on the inner wall of the protective cover 100, and the sample stage 220 is located below the drip port 101 and mounted on the rotating shaft of the flip motor 210. When the flip motor 210 drives its rotating shaft to rotate, it can drive the sample stage 220 to rotate 180°, thereby flipping the failed packaged chip 1.

[0062] Optionally, refer to Figure 2 , the mounting table is provided with a fixed clamp 221, a movable clamp 222 and an elastic member 223. The fixed clamp 221 is fixedly provided on the mounting table. The movable clamp 222 is movably provided on the mounting table. The elastic member 223 is provided between the movable clamp 222 and the sample stage 220, and the elastic member 223 is configured to enable the movable clamp 222 to move in a direction close to the fixed clamp 221 when not acted upon by external force, so as to clamp the failed packaged chip 1. Specifically, an installation space is formed between the fixed clamp 221 and the movable clamp 222, and the failed packaged chip 1 is installed in the installation space. Moreover, since the elastic member 223 can enable the movable clamp 222 to move in a direction close to the fixed clamp 221 when not acted upon by external force, this not only can achieve the fixation of the failed packaged chip 1, but can also be suitable for fixing failed packaged chips 1 of different sizes.

[0063] Optionally, refer to Figure 2 , a mounting plate 224, a guide rod 225 and a limit block 226 are also provided on the mounting platform. The mounting plate 224 is fixedly arranged on the mounting platform. The guide rod 225 is passed through the mounting plate 224 and can move axially relative to the mounting plate 224. The axial direction of the guide rod 225 is consistent with the moving direction of the movable clamp 222. The end of the guide rod 225 close to the fixed clamp 221 is connected to the movable clamp 222, and the end of the guide rod 225 away from the fixed clamp 221 is connected to the limit block 226. This arrangement enables the movable clamp 222 to be movably arranged on the mounting platform. In the specific arrangement, the elastic member 223 can be arranged between the mounting plate 224 and the movable clamp 222. The elastic member 223 can rely on its own elastic force to push the movable clamp 222 to move it in the direction close to the fixed clamp 221 to clamp the failed packaged chip 1.

[0064] Optionally, the flip motor 210 is movably disposed in the protective cover 100. The flip motor 210 has a dissolving and cleaning position and a loading and unloading position. When in the dissolving and cleaning position, the dropper 2 can drip the solution into the failed packaged chip 1. When in the loading and unloading position, the failed packaged chip 1 can be mounted on the sample stage 220 or removed from the sample stage 220. Specifically, since the sample stage 220 is mounted on the rotating shaft of the flip motor 210, the sample stage 220 and the flip motor 210 can move synchronously. In the dissolving and cleaning position, the sample stage 220 can be moved to the bottom of the dripping port 101 so that the solution can be dripped onto the chip surface to dissolve the residual metal. In the loading and unloading position, the sample stage 220 can be moved to the vicinity of the protective door 102 so that the user can load and unload the failed packaged chip 1.

[0065] Optionally, the chip mounting rack 200 further includes a first driving mechanism 230 , which is configured to drive the flip motor 210 to move between the dissolving and cleaning position and the loading and unloading position.

[0066] Alternatively, as Figure 2As shown, the first driving mechanism 230 includes a first screw rod 231, a first slider 232, and a locking member 233. The first screw rod 231 is rotatably disposed in the protective cover 100, and one end of the first screw rod 231 is extended to the outside of the protective cover 100. The first slider 232 is movably disposed in the protective cover 100, and the first slider 232 is threadedly engaged with the first screw rod 231. The locking member 233 is disposed on the first slider 232. The locking member 233 has a first state and a second state. In the first state, the locking member 233 is locked to the sample stage 220, so that the flip motor 210 and the sample stage 220 can move with the first slider 232. In the second state, the locking member 233 is unlocked from the sample stage 220. Specifically, when the locking member 233 is in the first state, the locking member 233 is locked to the sample stage 220. The operator can twist the end of the first screw 231 that extends outside the protective cover 100 to cause the first screw 231 to rotate circumferentially. When the first screw 231 rotates circumferentially, it can drive the first slider 232 to move, and at the same time, the first slider 232 drives the sample stage 220 and the flip motor 210 to move. When the locking member 233 is in the second state, the locking member 233 is unlocked from the sample stage 220. When the first slider 232 moves, it cannot transmit power to the sample stage 220 and the flip motor 210, making it impossible for the sample stage 220 and the flip motor 210 to move with the first slider 232. In this article, the axial direction of the first screw 231, the movement direction of the first slider 232, and the movement direction of the flip motor 210 and the sample stage 220 are in the same direction. It should be understood that when the first screw rod 231 extends from the side of the protective cover 100, a perforated sealing gasket can be provided between the first screw rod 231 and the protective cover 100 to improve the protective capability of the side of the protective cover 100. In addition, a handle can be provided at the end of the first screw rod 231 extending outside the protective cover 100 to facilitate rotation by the operator.

[0067] Optionally, refer to Figure 2 The locking member 233 is a telescopic cylinder, and the telescopic rod of the locking member 233 can be inserted into or withdrawn from the slot 227 provided in the sample stage 220 to switch between the first state and the second state. Specifically, when the telescopic cylinder controls the extension of its telescopic rod, the front end of the telescopic rod can be inserted into the slot 227 of the sample stage 220. The telescopic rod and the slot 227 cooperate with each other, so that when the first slider 232 moves, power can be transmitted to the sample stage 220 and the flip motor 210 through the telescopic cylinder, so that the sample stage 220 and the flip motor 210 can move with the first slider 232. In this article, the extension direction of the telescopic cylinder is inconsistent with the moving direction of the sample stage 220, for example, the extension direction of the telescopic cylinder is perpendicular to the moving direction of the sample stage 220.

[0068] Optionally, in the first state, the locking member 233 can restrict the flipping motor 210 from flipping the sample stage 220, and in the second state, the locking member 233 can allow the flipping motor 210 to flip the sample stage 220. For example, the axial direction of the telescopic rod of the telescopic cylinder and the rotation axis of the sample stage 220 may not coincide with each other, or the telescopic rod of the telescopic cylinder cannot rotate within the slot 227. In this way, the locking member 233 can restrict the flipping motor 210 from flipping the sample stage 220 in the first state, thereby preventing the sample stage 220 from flipping itself during use and affecting the dissolution of residual metal.

[0069] Optionally, the cleaning component 300 is a spray device. Specifically, the cleaning component 300 may include a nozzle, a water supply pipe and a water supply valve. The nozzle is used to spray water to the failed packaged chip 1. The water supply pipe is connected to the nozzle, and one end of the water supply pipe is passed through the outside of the protective cover 100 and connected to the water supply device. The water supply valve is arranged in series with the water supply pipe and is electrically connected to the controller 500. During specific use, the water supply valve is opened under the control of the controller 500 so that the water supply pipe supplies water to the nozzle. When cleaning is completed, the water supply valve is closed under the control of the controller 500 so that the water supply pipe stops supplying water to the nozzle.

[0070] Optionally, refer to Figure 1 The waste liquid collecting tank 400 is provided with a drain pipe 401, one end of which is passed through the outside of the protective cover 100. In specific use, the cleaning waste liquid collected by the waste liquid collecting tank 400 can be discharged into a fixed liquid collecting container through the drain pipe 401.

[0071] Optionally, refer to Figure 1 Controller 500 is provided with a switch 501, which is used to activate controller 500 so that controller 500 controls the chip mounting rack 200 and cleaning assembly 300. Specifically, after completing solution dripping, the operator can activate controller 500 by operating switch 501. After activation, controller 500 can control chip mounting rack 200 to flip over so that the back side of failed packaged chip 1 faces downward according to the set dripping time. At the same time, controller 500 can control cleaning assembly 300 to clean failed packaged chip 1 according to the set cleaning time. When the cleaning time expires, controller 500 can control cleaning assembly 300 to stop cleaning and control chip mounting rack 200 to flip over failed packaged chip 1 again so that the back side faces upward.

[0072] Optionally, refer to Figure 1 The controller 500 is provided with an input terminal for setting the titration time and the cleaning time. In a specific setting, the input terminal can be a liquid crystal touch display panel. In specific use, after the controller 500 is activated by using the switch 501, the operator can set the titration time and the cleaning time through the input terminal.

[0073] Optionally, refer to Figure 1 Controller 500 is provided with an emergency stop button 502, which is used to output a shutdown command to cause controller 500 to control chip mounting rack 200 and cleaning assembly 300 to stop operating. Specifically, if a chip falls off, a functional failure occurs, or an incorrect triggering occurs, the operator can press emergency stop button 502 to stop chip mounting rack 200 and cleaning assembly 300.

[0074] Optionally, refer to Figure 1 The device also includes a dropper mounting frame 600. The dropper mounting frame 600 is arranged in the protective cover 100 and is located between the dripping port 101 and the chip mounting frame 200. The dropper mounting frame 600 is used to install the dropper 2. The dropper mounting frame 600 is configured to be able to move the dropper 2 so that it is aligned with different positions of the failed packaged chip 1. Specifically, the dropper 2 can be installed on the dropper mounting frame 600 through the dripping port 101. When dripping is required, the dropper mounting frame 600 can be used to move the dropper 2 to above the target position, and then the dropper 2 can be manually squeezed to drip the solution into the target position. This arrangement can keep human hands away from the solution as much as possible, reducing the impact of splashing or volatilization of the solution on the health of the operator.

[0075] Optionally, refer to Figure 3The dropper mounting frame 600 includes a frame 610, a first crossbeam 620, a second crossbeam 630, a second drive mechanism 640, and a third drive mechanism 650. The frame 610 is a rectangular frame and is mounted on the inner wall of the protective cover 100. The first crossbeam 620 is mounted on the frame 610 for transverse movement. The second crossbeam 630 is mounted on the frame 610 for longitudinal movement and crosses the first crossbeam 620. The second drive mechanism 640 is mounted on the frame 610 and connected to the first crossbeam 620. The second drive mechanism 640 is used to drive the first crossbeam 620 for transverse movement. The third drive mechanism 650 is mounted on the frame 610 and connected to the second crossbeam 630. The third drive mechanism 650 is used to drive the second crossbeam 630 for longitudinal movement. The first crossbeam 620 is provided with a first waist-shaped hole 621, and the second crossbeam 630 is provided with a second waist-shaped hole 631. The first waist-shaped hole 621 and the second waist-shaped hole 631 cross each other. During specific installation, the dropper 2 is inserted into the first waist-shaped hole 621 and the second waist-shaped hole 631 at the same time, and the dropper 2 can slide in the first waist-shaped hole 621 and the second waist-shaped hole 631. During specific use, when the first crossbeam 620 moves laterally, the first crossbeam 620 can drive the dropper 2 to move in the second waist-shaped hole 631, and when the second crossbeam 630 moves longitudinally, the second crossbeam 630 can drive the dropper 2 to move in the first waist-shaped hole 621. In this way, the dropper 2 can be aligned with different positions on the back of the failed packaged chip 1, thereby achieving the dripping of solution at different positions on the back of the failed packaged chip 1. In this article, the dropper 2 can be a structure that is thick at the top and thin at the bottom, so as to prevent the dropper 2 from falling from the first waist-shaped hole 621 and the second waist-shaped hole 631.

[0076] Optionally, refer to Figure 3 The second driving mechanism 640 includes a second screw rod 641 and a second slider 642. The second screw rod 641 is rotatably arranged in the protective cover 100, and the axial direction of the second screw rod 641 is consistent with the moving direction of the first crossbeam 620. One end of the second screw rod 641 is passed through the outside of the protective cover 100. The second slider 642 is arranged on the first crossbeam 620 and is threadedly engaged with the second screw rod 641. When the operator twists the end of the second screw rod 641 extending outside the protective cover 100, the second screw rod 641 can be rotated circumferentially. When the second screw rod 641 rotates circumferentially, it can drive the second slider 642 to move laterally. At the same time, the second slider 642 can drive the first crossbeam 620 to move laterally. It should be understood that when the second screw rod 641 extends from the side of the protective cover 100, a perforated sealing gasket can be set between the second screw rod 641 and the protective cover 100 to improve the protection capability of the side of the protective cover 100. In addition, a handle may be provided at one end of the second screw rod 641 extending outside the protective cover 100 to facilitate rotation by an operator.

[0077] Optionally, refer to Figure 3The third driving mechanism 650 includes a third screw rod 651 and a third slider 652. The third screw rod 651 is rotatably arranged in the protective cover 100. The axial direction of the third screw rod 651 is consistent with the moving direction of the second crossbeam 630. One end of the third screw rod 651 is passed through the outside of the protective cover 100. The third slider 652 is arranged on the second crossbeam 630 and is threadedly engaged with the third screw rod 651. When the operator twists the end of the third screw rod 651 extending outside the protective cover 100, the third screw rod 651 can be rotated circumferentially. When the third screw rod 651 rotates circumferentially, it can drive the third slider 652 to move longitudinally. At the same time, the third slider 652 can drive the second crossbeam 630 to move longitudinally. It should be understood that when the third screw rod 651 extends from the side of the protective cover 100, a perforated sealing gasket can be set between the third screw rod 651 and the protective cover 100 to improve the protection capability of the side of the protective cover 100. In addition, a handle may be provided at one end of the third screw rod 651 extending outside the protective cover 100 to facilitate rotation by an operator.

[0078] The working process of the device for removing residual metal on the back side of the failed packaged chip 1 in the embodiment of the present application is as follows:

[0079] 1) Open the protective door 102 and move the sample stage 220 to the vicinity of the protective door 102 by rotating the first screw 231;

[0080] 2) Place the failed packaged chip 1 face down on the sample stage 220 and secure it with the fixed clamp 221 and the movable clamp 222. Then, move the sample stage 220 to the dissolution and cleaning position and close the protective door 102.

[0081] 3) Place the dropper 2 filled with a mixture of hydrochloric acid and hydrogen peroxide into the dropper mounting frame 600 , and move the dropper 2 to the position above the metal residue of the failed packaged chip 1 by rotating the second screw 641 and the third screw 651 to drip the solution;

[0082] 4) Turn on the switch 501 of the controller 500 and set the titration time T1 and the cleaning time T2 through the input terminal of the controller 500;

[0083] 5) When the titration time reaches T1, the controller 500 controls the telescopic cylinder to unlock the sample stage 220 and simultaneously controls the flip motor 210 to flip the sample stage 220 so that the back of the failed packaged chip 1 faces downward;

[0084] 6) After the sample stage 220 is flipped over, the controller 500 controls the cleaning device to spray water to clean the failed packaged chip 1;

[0085] 7) When the cleaning time reaches T2, the controller 500 controls the cleaning device to stop spraying water, and at the same time controls the flip motor 210 to flip the sample stage 220 so that the back side of the failed packaged chip 1 faces upward;

[0086] 8) After the sample is flipped, the controller 500 controls the telescopic cylinder to lock the sample stage 220;

[0087] 9) The cleaning waste liquid is collected through the waste liquid collecting tank 400 and discharged into a fixed liquid collecting container;

[0088] 10) The operator observes and confirms whether the residual metal on the back of the failed packaged chip 1 is completely removed. If there is no residue, the operator can rotate the first screw 231 to move the sample stage 220 to the vicinity of the protective door 102 and remove the failed packaged chip 1. If there is still residue, repeat the above steps 1) to 10).

[0089] The device for removing residual metal from the back side of the failed packaged chip 1 according to an embodiment of the present application includes a protective cover 100 and a chip mounting rack 200, a cleaning assembly 300 and a waste liquid collection tank 400 enclosed in the protective cover 100. During specific use, the work of removing the residual metal from the back side of the failed packaged chip 1 is all carried out within the protective cover 100. In this way, the splashing solution can be blocked by the protective cover 100, thereby improving the problem of splashing of acidic solution affecting the health of the operator during the process of removing the residual metal from the back side of the chip.

[0090] The one or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification shall be included within the scope of protection of this application.

[0091] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A device for removing residual metal from the back of a failed packaged chip, characterized in that: The device includes: a protective cover, a chip mounting frame, a cleaning component, a waste liquid collection tank and a controller; The protective cover surrounds the chip mounting frame, the cleaning assembly and the waste liquid collecting tank, and a dripping port is provided on the top of the protective cover for dripping the solution with a dropper; The chip mounting frame is used to mount a failed packaged chip, and the chip mounting frame is configured to be able to flip the failed packaged chip so that its back side faces the dripping port or faces away from the dripping port; The cleaning component is located on a side of the chip mounting frame away from the dripping port, and is used to clean the back side of the failed packaged chip; The waste liquid collecting tank is located on a side of the cleaning component away from the dripping port, and is used to collect cleaning waste liquid; The controller is arranged on the protective cover and is electrically connected to the chip mounting frame and the cleaning component respectively. The controller controls the chip mounting frame to flip according to the set titration time so that the back side of the failed packaged chip faces or away from the dripping port; and controls the opening and closing of the cleaning component and the flipping of the chip mounting frame according to the set cleaning time.

2. The device for removing residual metal from the back of a failed packaged chip according to claim 1, characterized in that: The protective cover is a transparent cover.

3. The device for removing residual metal from the back of a failed packaged chip according to claim 1, characterized in that: The chip mounting frame includes a flip motor and a sample stage; The flip motor is arranged in the protective cover; The sample stage is arranged on the rotating shaft of the flip motor and is used for mounting the failed packaged chip.

4. The device for removing residual metal from the back side of a failed packaged chip according to claim 3, characterized in that: The mounting platform is provided with a fixed clamping block, a movable clamping block and an elastic member; The fixed clamping block is fixedly arranged on the mounting platform; The movable clamping block is movably arranged on the mounting platform; The elastic member is arranged between the movable clamping block and the sample stage, and is configured to enable the movable clamping block to move toward the fixed clamping block when no external force is applied, so as to clamp the failed packaged chip.

5. The device for removing residual metal from the back side of a failed packaged chip according to claim 3, characterized in that: The flip motor is movably disposed in the protective cover and has a dissolving and cleaning position and a loading and unloading position. In the dissolving and cleaning position, the dropper can drip a solution into the failed packaged chip. In the loading and unloading position, the failed packaged chip can be mounted on or unloaded from the sample stage. The chip mounting rack further includes a first driving mechanism for driving the flip motor to move between the dissolving and cleaning position and the loading and unloading position.

6. The device for removing residual metal from the back side of a failed packaged chip according to claim 5, characterized in that: The first driving mechanism includes a first screw rod, a first slider and a locking member; The first screw rod is rotatably disposed in the protective cover, and one end of the first screw rod is passed through the outside of the protective cover; The first slider is movably disposed in the protective cover, and the first slider is threadably engaged with the first screw rod; The locking member is provided on the first slider, and the locking member has a first state and a second state. In the first state, the locking member is locked to the sample stage so that the flip motor and the sample stage can move following the first slider. In the second state, the locking member is unlocked from the sample stage.

7. The device for removing residual metal from the back side of a failed packaged chip according to claim 6, characterized in that: The locking member is a telescopic cylinder, and the telescopic rod of the locking member can be inserted into or withdrawn from a slot provided on the sample stage to switch between the first state and the second state.

8. The device for removing residual metal from the back side of a failed packaged chip according to claim 6, characterized in that: In the first state, the locking member can restrict the flip motor from flipping the sample stage.

9. The device for removing residual metal from the back side of a failed packaged chip according to claim 1, characterized in that: The device also includes: a dropper mounting bracket; The dropper mounting frame is arranged in the protective cover and is located between the dripping port and the chip mounting frame. The dropper mounting frame is used to install the dropper. The dropper mounting frame is configured to be able to move the dropper so that it is aligned with different positions of the failed packaged chip.

10. The device for removing residual metal from the back side of a failed packaged chip according to claim 9, characterized in that: The dropper mounting frame includes a frame, a first crossbeam, a second crossbeam, a second drive mechanism, and a third drive mechanism; The frame is disposed within the protective cover; The first crossbeam is laterally movably arranged on the frame, and the first crossbeam is provided with a first waist-shaped hole; The second crossbeam is longitudinally movably arranged on the frame, and the second crossbeam is provided with a second waist-shaped hole; The second driving mechanism is provided on the frame and connected to the first beam, and the second driving mechanism is used to drive the first beam to move laterally; The third driving mechanism is provided on the frame and connected to the second crossbeam, and the third driving mechanism is used to drive the second crossbeam to move longitudinally; The first waist-shaped hole and the second waist-shaped hole are cross-intersected, the dropper is inserted into the first waist-shaped hole and the second waist-shaped hole, and the dropper can slide in the first waist-shaped hole and the second waist-shaped hole.

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