Wafer transport device with detection function

Abstract

The application discloses a wafer conveying device with a detection function, characterized in that the wafer conveying device comprises a movable bearing part, a connecting part arranged on the bearing part, and oppositely arranged clamping mechanisms movably arranged on the connecting part; the clamping mechanisms are close to each other to clamp the wafer, and the clamping mechanisms are away from each other to release the wafer; a first detection device is provided with a first emitter and a first receiver, and the first emitter and the first receiver are oppositely arranged; the first emitter is used for emitting a first detection light, and the first receiver is used for receiving the first detection light reflected by the wafer to detect the surface pattern of the wafer. The wafer conveying efficiency and the detection efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a wafer conveying device with a detection function. BACKGROUND

[0002] In a semiconductor manufacturing process, a substrate (such as a wafer) usually needs to be processed through multiple processing stations. Due to the limited range of movement of a robot, a mobile carrier is often configured between each robot to realize the transmission of the substrate between different stations. When the back surface of the substrate needs to be processed, the front and back surfaces of the substrate are flipped by an independent substrate flipping unit; and after the processing of the substrate is completed, the substrate needs to be taken down and placed into an automatic optical detection module for detection of the processing effect, and an independent automatic optical detection module is used to detect the surface and edge of the substrate.

[0003] In the prior art, the substrate automatic optical detection module, the flipping unit module and the mobile carrier unit module are separate modules, and each module needs to be transmitted by a robot to be linked with each other. The transmission process of the substrate greatly increases the time consumed by the linkage of each module, which affects the wafer conveying efficiency and the wafer detection efficiency, thereby affecting the production capacity of the entire machine.

[0004] Therefore, it is necessary to provide a new wafer conveying device with a detection function to solve the above problems in the prior art. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a wafer conveying device with a detection function which can improve the wafer conveying efficiency and the wafer detection efficiency.

[0006] To solve the above technical problem, according to an embodiment of the present application, a wafer conveying device with a detection function is provided, characterized in that it comprises a movable carrier;

[0007] a connecting portion provided on the carrier;

[0008] oppositely arranged clamping mechanisms movably provided on the connecting portion; the oppositely arranged clamping mechanisms are close to each other to clamp the wafer; and the oppositely arranged clamping mechanisms are away from each other to release the wafer;

[0009] a first detection device having a first emitting member and a first receiving member, and the first emitting member and the first receiving member are oppositely arranged;

[0010] The first emitting member is used to emit a first detection light, and the first receiving member is used to receive the first detection light reflected by the wafer to detect the surface pattern of the wafer.

[0011] By adopting the above technical solution, a movable carrier is provided so that the carrier can drive the wafer to move. During the movement, the wafer can be flipped or inspected, etc., which combines the flipping, transportation and inspection of the wafer together, thereby improving the inspection efficiency and transportation efficiency of the wafer. At the same time, the clamping mechanisms are close to each other, which can clamp the wafer so that the wafer is fixed on the carrier; the clamping mechanisms are far away from each other, which can loosen the wafer so that the wafer can be separated from the carrier; thereby facilitating the process of the robotic arm taking and placing the wafer. In addition, the first detection light emitted by the first transmitting element is received by the first receiving element after being reflected by the surface of the wafer. The first receiving element transmits the detection result to the host computer, such as a control computer, so as to identify whether there are defects on the surface of the wafer, thereby realizing the synchronous detection of wafer surface defects during the wafer transfer process, thereby improving the production capacity of the entire machine.

[0012] According to an embodiment of the present application, the first detection device further includes a reflector having a first reflective surface and a second reflective surface; the reflector is disposed between the first transmitting element and the first receiving element;

[0013] Among them, the first emitting element emits the first detection light toward the first reflecting surface, the first detection light is reflected by the first reflecting surface and irradiates the wafer, and is reflected by the wafer to the second reflecting surface, and is received by the first receiving element after being reflected by the second reflecting surface to detect the pattern on the surface of the wafer.

[0014] According to an embodiment of the present application, the first transmitting element and the first receiving element are both arranged horizontally;

[0015] There is a first angle between the first reflecting surface and the wafer, and there is a second angle between the second reflecting surface and the wafer; the first angle is greater than 0° and less than 45°, and the second angle is greater than 135° and less than 180°, so that the first reflecting surface can reflect the first detection light to the wafer, and the second reflecting surface reflects the first detection light reflected by the wafer to the first receiving element.

[0016] According to an embodiment of the present application, the clamping mechanism includes:

[0017] a first clamping jaw disposed opposite to the first clamping jaw and movably disposed on the connecting portion, wherein an end portion of the first clamping jaw is provided with a first support plate, and the first support plate is used to contact one end surface of the wafer;

[0018] The second clamping jaw is arranged opposite to each other and is movably arranged on the connecting portion. The end of the second clamping jaw is provided with a second support plate. The second support plate is used to contact the other end surface of the wafer to cooperate with the first support plate to clamp the wafer.

[0019] According to an embodiment of the present application, the clamping mechanism further includes:

[0020] A first driving assembly includes a first driving plate and a first driving member; the first driving plate is used to connect the first clamping jaws arranged opposite to each other; the first driving member is provided at the connecting portion and connected to the first driving plate to drive the first driving plate and the first clamping jaws arranged opposite to each other toward or away from the wafer;

[0021] The second driving assembly includes a second driving plate and a second driving member; the second driving plate is used to connect the second clamping jaws arranged opposite to each other; the second driving member is arranged on the connecting part and connected to the second driving plate to drive the second driving plate and the second clamping jaws arranged opposite to each other to approach or move away from the wafer.

[0022] According to an embodiment of the present application, a flipping device is further included, which is connected to the connecting portion and is used to drive the connecting portion and the clamping mechanism to flip so as to flip the wafer.

[0023] According to an embodiment of the present application, a plurality of second detection components are further included, each of which includes:

[0024] A second emitting element, provided on the supporting element, for emitting a second detection light;

[0025] a second receiving element, disposed on the supporting element, for receiving the second detection light;

[0026] The second detection light emitted by the second emitting element is parallel to the surface of the wafer. When the second receiving element can receive the second detection light, the wafer is horizontal; when the second receiving element cannot receive the second detection light, the wafer is tilted.

[0027] According to an embodiment of the present application, there is a third angle between the optical paths of the second detection light beams of two adjacent second detection components, and the third angle is greater than 0° and less than 180°.

[0028] According to an embodiment of the present application, a first moving member is further included, which is connected to the carrier and is used to drive the carrier to move so that the first detection light is irradiated to different positions on the surface of the wafer.

[0029] According to an embodiment of the present application, a sensor is further included, wherein the sensor includes a third transmitting element and a third receiving element, and the third transmitting element and the third receiving element are arranged opposite to each other to detect whether the wafer is placed on the clamping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1This is a schematic diagram of the main structure of a wafer transport device according to an embodiment of the present invention;

[0031] Figure 2 Schematic diagram of the positional relationship between a first detection device and a wafer according to an embodiment of the present invention;

[0032] Figure 3 A top view of a wafer transport device according to an embodiment of the present invention;

[0033] Figure 4 for Figure 1 Enlarged view of part A.

[0034] Reference numerals:

[0035] 100, carrier; 200, connecting part; 210, bottom plate; 220, side plate; 300, clamping mechanism; 310, first clamping jaw; 311, first support plate; 320, second clamping jaw; 321, second support plate; 330, first driving assembly; 331, first driving plate; 332, first driving member; 340, second driving assembly; 341, second driving plate; 342, second driving member; 410, first emitting member; 411, first detection light; 420, first receiving member; 430, reflector; 431, first reflecting surface; 432, second reflecting surface; 500, flipping device; 610, second emitting member; 611, second detection light; 620, second receiving member; 700, first moving member; 810, third emitting member; 820, third receiving member. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0037] The following is combined with Figures 1-4 , the specific implementation methods of the present invention are further described in detail.

[0038] An embodiment of the present invention provides a wafer transport device, wherein the wafer transport device has a detection function, which can detect whether there are defects on the surface of the wafer during the wafer transportation process, and can also flip the wafer, and both end surfaces of the wafer can be detected. Specifically, the wafer transport device with a detection function includes a movable carrier 100;

[0039] The connecting portion 200 is provided on the carrier 100;

[0040] The clamping mechanisms 300 are arranged opposite to each other, and the clamping mechanisms 300 are movably arranged on the connecting portion 200; the clamping mechanisms 300 are arranged opposite to each other to clamp the wafer; the clamping mechanisms 300 are arranged opposite to each other to release the wafer;

[0041] The first detection device comprises a first transmitting element 410 and a first receiving element 420, wherein the first transmitting element 410 and the first receiving element 420 are arranged opposite to each other;

[0042] The first emitting element 410 is used to emit a first detection light 411 , and the first receiving element 420 is used to receive the first detection light 411 reflected by the wafer to detect the surface pattern of the wafer.

[0043] In some embodiments, a wafer transport device is mounted on the wafer transport equipment. The wafer transport equipment includes a platform, a carrier 100 movably mounted on the platform, and a wafer is placed on the carrier 100. The movement of the carrier 100 can drive the synchronous movement of the wafer. The specific movement method is described below. The carrier 100 is provided with a connecting portion 200. Two connecting portions 200 are provided, and the two connecting portions 200 are arranged opposite each other on the carrier 100. The connecting portions 200 are also provided with a clamping mechanism 300. Since the two connecting portions 200 are arranged opposite each other, the two clamping mechanisms 300 are also arranged opposite each other. The clamping mechanism 300 is movable on the connecting portion 200. The clamping mechanism 300 is used to clamp the wafer. When the opposing clamping mechanisms 300 are moved closer to each other, the wafer can be clamped; when the opposing clamping mechanisms 300 are moved away from each other, the wafer can be released. In some specific embodiments, the carrier 100 has a carrying surface, which is used to mount the clamping mechanism and the flipping device 500.

[0044] In some specific embodiments, a first detection device is provided on the carrier 100; wherein, the first detection device includes a first emitting element 410 and a first receiving element 420, the first emitting element 410 is used to emit a first detection light 411, and the first receiving element 420 is used to receive the first detection light 411 emitted by the first emitting element 410. Specifically, two pillars are provided on the platform, both of which are vertically arranged, and the two pillars are used to connect the first emitting element 410 and the first receiving element 420. More specifically, the two pillars are respectively placed on both sides of the wafer and are arranged radially symmetrically with respect to the wafer, so that the first emitting element 410 and the first receiving element 420 are arranged radially symmetrically with respect to the wafer. The first detection light 411 is irradiated onto the surface of the wafer, and is received by the first receiving element 420 after being reflected by the surface of the wafer, thereby detecting the surface pattern of the wafer.

[0045] In some more specific embodiments, the first emitting element 410 is a light source for illuminating the object to be inspected, and can be an LED light or infrared light, etc., without limitation, as long as it can emit the first inspection light 411 to illuminate the wafer.

[0046] In some more specific embodiments, the first receiving element 420 may be an image sensor or a camera, etc., without limitation herein, and is primarily capable of receiving the first detection light 411 reflected by the wafer and outputting it to a host computer. More specifically, the first receiving element 420 may also be an area array camera, a line array camera, a CMOS or CCD image sensor, etc.

[0047] The first detection device further includes a reflector 430 having a first reflective surface 431 and a second reflective surface 432 ; the reflector 430 is disposed between the first transmitting element 410 and the first receiving element 420 ;

[0048] Among them, the first emitting element 410 emits the first detection light 411 to the first reflecting surface 431. The first detection light 411 is reflected by the first reflecting surface 431 and irradiates the wafer, and is reflected by the wafer to the second reflecting surface 432. After being reflected by the second reflecting surface 432, it is received by the first receiving element 420 to detect the pattern on the wafer surface.

[0049] In some embodiments, the first detection light 411 emitted by the first emitting element 410 can be emitted horizontally or at an angle. When it is emitted at an angle, the first emitting element 410 and the first receiving element 420 are both arranged at an angle so that the first receiving element 420 can receive the first detection light 411 emitted by the first emitting element 410.

[0050] In some specific embodiments, the first emitting element 410 and the first receiving element 420 are both horizontally arranged, so that the first detection light 411 emitted by the first emitting element 410 is horizontal; the first detection light 411 received by the first receiving element 420 is also horizontal. More specifically, in order to ensure that the first detection light 411 is reflected by the wafer surface and received by the first receiving element 420, a reflector 430 is further provided in the first detection device. The reflector 430 is provided between the first emitting element 410 and the first receiving element 420 and can be fixed to the machine platform or to other locations. This is not limited here, and the reflector 430 is primarily concerned with reflecting the first detection light 411.

[0051] In some more specific embodiments, the reflector 430 is arranged in a "V" shape, having a first reflective surface 431 and a second reflective surface 432. The first emitting element 410 emits a first detection light 411 toward the first reflective surface 431. After reaching the first reflective surface 431, the first detection light 411 is reflected therefrom, irradiating the wafer surface. The wafer surface then reflects the first detection light 411 again, causing the first detection light 411 to pass through the wafer surface and then irradiate the second reflective surface 432. The second reflective surface 432 similarly reflects the first detection light 411, causing the first reflected light to be received by the first receiving element 420. That is, after the first emitting element 410 emits the first detection light 411, the first detection light 411 passes through the first reflective surface 431, the wafer surface, and the second reflective surface 432 in sequence before being received by the first receiving element 420. This improves vertical space utilization.

[0052] The first transmitting element 410 and the first receiving element 420 are both arranged horizontally;

[0053] There is a first angle between the first reflecting surface 431 and the wafer, and there is a second angle between the second reflecting surface 432 and the wafer; the first angle is greater than 0° and less than 45°, and the second angle is greater than 135° and less than 180°, so that the first reflecting surface 431 can reflect the first detection light 411 to the wafer, and the second reflecting surface 432 reflects the first detection light 411 reflected by the wafer to the first receiving element 420.

[0054] In some embodiments, in order to enable the first detection light 411 reflected by the first reflection surface 431 to be reflected by the wafer surface to the second reflection surface 432, the first reflection surface 431 and the second reflection surface 432 are set to have an angle with the vertical direction, and the angles are the same.

[0055] In some specific embodiments, a first angle is defined between the first reflective surface 431 and the wafer, and a second angle is defined between the second reflective surface 432 and the wafer. The first angle is greater than 0° and less than 45°, and the second angle is greater than 135° and less than 180°. It is important to note that both the first and second angles are measured from the first quadrant. Since the first detection light 411 emitted by the first emitter 410 is horizontal, when the first angle is 45°, the first detection light 411 will return along its original path after reflecting from the first reflective surface 431 and strike the first reflective surface 431 again. When the first angle is greater than 45°, the first detection light 411 will be deflected toward the first emitter 410 after reflecting from the first reflective surface 431, preventing it from striking the second reflective surface 432. Therefore, the first angle is set to be greater than 0° and less than 45°. Similarly, to ensure that the first detection light 411 reflected from the wafer is horizontal after reflecting from the second reflective surface 432, the second angle is set to be greater than 135° and less than 180°. At the same time, the acute angle between the first angle and the second angle is the same, that is, when the first angle is 10°, the second angle is 170°. At this time, the acute angle of the second angle is 10°, so that the first receiving element 420 can receive the horizontally irradiated first detection light 411.

[0056] The wafer transport device further includes a first moving member 700 , which is connected to the carrier 100 and is configured to drive the carrier 100 to move so that the first detection light 411 is irradiated to different positions on the surface of the wafer.

[0057] In some embodiments, in order to facilitate the movement of the carrier 100, a first movable member 700 is further provided on the machine. Specifically, the first movable member 700 can be an electric cylinder or a pneumatic cylinder, etc., which is not limited here, and the first movable member 700 is mainly capable of driving the carrier 100 to move; the first movable member 700 is fixed to the machine, and its fixing method can be bonding, clamping or bolting, etc., which is not limited here, and the position of the first movable member 700 on the machine will not change. At the same time, the first movable member 700 is connected to the carrier 100. When the first movable member 700 is started, the piston rod of the first movable member 700 pushes the carrier 100 to move, so that the first detection light 411 can be irradiated to different positions on the wafer surface. More specifically, a track is provided on the machine, and the carrier 100 is movably provided on the track and can move on the track along the length direction of the track. The track has a limiting effect on the carrier 100, thereby limiting the movement direction of the carrier 100. In some specific embodiments, when the first movable member 700 is controlled pneumatically, the movement speed is controlled by adjusting the inlet and outlet air volumes.

[0058] In some embodiments, the first movable member 700 can also be a motor. When the first movable member 700 is a motor, the first movable member 700 is connected to the carrier 100 by means of a pulley transmission, that is, the first movable member 700 is arranged on the machine, and a driving pulley is provided on the rotating shaft of the first movable member 700. A driven pulley is also provided on the machine for rotation. The driving pulley and the driven pulley are connected by a transmission belt. At the same time, the carrier 100 is connected to the transmission belt, so that when the first movable member 700 is started, it can drive the transmission belt to move, thereby driving the carrier 100 to move.

[0059] The clamping mechanism 300 includes:

[0060] The first clamping jaws 310 are arranged opposite to each other and are movably arranged on the connecting portion 200. The ends of the first clamping jaws 310 are provided with first support plates 311. The first support plates 311 are used to contact one end surface of the wafer.

[0061] The second clamping jaw 320 is arranged opposite to each other and is movably arranged on the connecting portion 200. A second support plate 321 is provided at the end of the second clamping jaw 320. The second support plate 321 is used to contact the other end surface of the wafer to cooperate with the first support plate 311 to clamp the wafer.

[0062] In some embodiments, to facilitate wafer clamping, a clamping mechanism 300 is provided that includes a first clamping jaw 310 and a second clamping jaw 320 disposed opposite each other. The first clamping jaws 310 are symmetrically disposed about the radial direction of the wafer and are movably disposed on the connecting portion 200 and can move toward or away from the wafer.

[0063] In some specific embodiments, a first support plate 311 is provided at the end of the first clamping jaw 310 facing the wafer. This support plate 311 may be bonded, bolted, or integrally formed, without limitation herein, with the primary focus being on ensuring that the position of the first support plate 311 at the end of the first clamping jaw 310 remains unchanged. Furthermore, the thickness of the first support plate 311 is smaller than the thickness of the end of the first clamping jaw 310, enabling the end of the first clamping jaw 310 to restrain the wafer.

[0064] In some specific embodiments, the second clamping jaws 320 are symmetrically arranged with respect to the radial direction of the wafer, and are movably arranged on the connecting portion 200 and can move on the connecting portion 200 toward or away from the wafer.

[0065] In some more specific embodiments, the second clamping jaw 320 is provided with a second supporting plate 321 at the end of the wafer, which can be provided by bonding, bolting or one-piece forming, etc., and is not limited here, as long as the position of the second supporting plate 321 at the end of the second clamping jaw 320 does not change. At the same time, the thickness of the second supporting plate 321 is less than the thickness of the end of the second clamping jaw 320, so that the end of the second clamping jaw 320 can limit the position of the wafer.

[0066] More specifically, the first supporting plate 311 is in contact with one of the end faces of the wafer, and the second supporting plate 321 is in contact with the other end face of the wafer, thereby clamping the wafer.

[0067] In some embodiments, the first supporting plate 311 is provided at the top of the first clamping jaw 310, and the second supporting plate 321 is provided at the bottom of the second clamping jaw 320, so that a clamping space is formed between the first supporting plate 311 and the second supporting plate 321, facilitating clamping of the wafer, and at the same time, the end of the first clamping jaw 310 and the end of the second clamping jaw 320 can also limit the position of the wafer.

[0068] In some embodiments, the first supporting plate 311 is provided at the bottom of the first clamping jaw 310, and the second supporting plate 321 is provided at the top of the second clamping jaw 320, so that a clamping space is formed between the first supporting plate 311 and the second supporting plate 321, facilitating clamping of the wafer, and at the same time, the end of the first clamping jaw 310 and the end of the second clamping jaw 320 can also limit the position of the wafer.

[0069] In some specific embodiments, the first clamping jaw 310 and the second clamping jaw 320 can approach or move away from the wafer, and therefore, in order to facilitate clamping of the wafer, the height of the clamping space is greater than the thickness of the wafer, or equal to the thickness of the wafer. More specifically, the height of the clamping space is between 1-1.5 times the thickness of the wafer.

[0070] The clamping mechanism 300 further comprises:

[0071] The first driving assembly 330 comprises a first driving plate 331 and a first driving member 332; the first driving plate 331 is used to connect the oppositely arranged first clamping jaw 310; the first driving member 332 is arranged on the connecting portion 200 and connected with the first driving plate 331, so as to drive the first driving plate 331 and the oppositely arranged first clamping jaw 310 to approach or move away from the wafer;

[0072] The second driving assembly 340 comprises a second driving plate 341 and a second driving member 342; the second driving plate 341 is used to connect the oppositely arranged second clamping jaw 320; the second driving member 342 is arranged on the connecting portion 200 and connected with the second driving plate 341, so as to drive the second driving plate 341 and the oppositely arranged second clamping jaw 320 to approach or move away from the wafer.

[0073] In some embodiments, in order to be able to control the independent movement of the relatively set first clamp 310 and the relatively set second clamp 320 respectively, the clamping mechanism 300 is provided to also include a first drive component 330 and a second drive component 340; wherein the first drive component 330 is used to drive the relatively set first clamp 310 to move; the second drive component 340 is used to drive the relatively set second clamp 320 to move, thereby clamping the wafer.

[0074] In some specific embodiments, the first driving assembly 330 includes a first driving plate 331 and a first driving member 332, wherein the first driving plate 331 is movably provided on the connecting portion 200. More specifically, the connecting portion 200 has a bottom plate 210 and a side plate 220, and the first driving plate 331 is movably provided on the bottom plate 210 and can move closer to or further away from the wafer on the connecting portion 200; or the connecting portion 200 has only the bottom plate 210 or the side plate 220, when the connecting portion 200 has only the bottom plate 210, the first driving plate 331 is movably provided on the bottom plate 210 and can move closer to or further away from the wafer on the bottom plate 210; when the connecting portion 200 has only the side plate 220, the first driving plate 331 is provided on the side plate 220 and can move closer to or further away from the wafer on the side plate 220; the specific arrangement is not limited here, and the first driving plate 331 is mainly provided to be able to move closer to or further away from the wafer. The first clamping jaw 310, which is relatively arranged, is fixed to the end face of the first driving plate 331. The arrangement method thereof can be adhesive, clamping or bolting, etc., which is not limited here, and the main principle is that the position between the first clamping jaw 310 and the first driving plate 331 does not move relative to each other. The first driving member 332 is arranged on the connecting portion 200. The arrangement method thereof can be adhesive, clamping or bolting, etc., which is not limited here, and the main principle is that the position between the first clamping jaw 310 and the first driving plate 331 does not move relative to each other. The first driving member 332 can be an electric cylinder or a pneumatic cylinder, etc., which is not limited here, and the main principle is that it can drive the first driving plate 331 to move. The first driving member 332 is connected to the first driving plate 331. When the first driving member 332 is started, the piston rod of the first driving member 332 drives the first driving plate 331 to move closer to or away from the wafer, thereby driving the first clamping jaw 310 to move closer to or away from the wafer.

[0075] In some specific embodiments, the second drive assembly 340 includes a second driving plate 341 and a second driving member 342, wherein the second driving plate 341 is movably mounted on the bottom plate 210 of the connecting portion 200. The second clamping jaw 320, which is positioned opposite to the second driving plate 341, is fixed to the end surface of the second driving plate 341. The mounting method may be adhesive, clamping, or bolting, without limitation, as long as the second clamping jaw 320 and the second driving plate 341 do not move relative to each other. The second driving member 342 is mounted on the connecting portion 200. The mounting method may be adhesive, clamping, or bolting, without limitation, as long as the second clamping jaw 320 and the second driving plate 341 do not move relative to each other. The second driving member 342 may be an electric cylinder or a pneumatic cylinder, without limitation, as long as it can drive the second driving plate 341 to move. The second driving member 342 is connected to the second driving plate 341. When the second driving member 342 is activated, the piston rod of the second driving member 342 drives the second driving plate 341 toward or away from the wafer, thereby driving the second clamping jaw 320 toward or away from the wafer.

[0076] In some more specific embodiments, the length of the second driving plate 341 is less than that of the first driving plate 331, and the second driving plate 341 is positioned between the first driving plate 331 and the wafer. During the clamping process, the first clamping jaws 310, which are positioned opposite each other, are controlled to move to an appropriate position. The robotic arm first clamps the wafer and places it on the first support plate 311, which then supports the wafer. Once the wafer is placed, the second driving member 342 is activated, pushing the second clamping jaw 320, causing the second support plate 321 to move toward the wafer and contact the other end face of the wafer, thereby allowing the first support plate 311 and the second support plate 321 to cooperate and clamp the wafer.

[0077] The wafer transport device further includes a flipping device 500 , which is connected to the clamping mechanism 300 and is used to drive the clamping mechanism 300 to flip so as to flip the wafer.

[0078] In some embodiments, in order for the first detection device to be able to detect both sides of the wafer, a flipping device 500 is also provided on the carrier 100, wherein the flipping device 500 is connected to the connecting part 200 and can drive the connecting part 200 to flip, thereby driving the clamping mechanism 300 to flip, so as to realize driving the wafer to flip.

[0079] In some specific embodiments, a support is provided on the carrier 100 and the flipping device 500 is disposed on top of the support, wherein the height of the support is greater than the radius of the wafer so that the carrier 100 does not interfere with the flipping of the wafer.

[0080] In some more specific embodiments, the overturning device 500 is an electric motor, and the overturning device 500 is connected to the side plate 220 of the connecting part 200 through a belt drive, i.e. a driving wheel is connected to the rotating shaft of the overturning device 500 through a key, and a driven wheel is rotatably arranged on the side plate 220, and the driving wheel and the driven wheel are connected through a transmission belt, so that when the overturning device 500 is started, the clamping mechanism 300 and the wafer can be synchronously overturned through the transmission belt.

[0081] In some more specific embodiments, the overturning device 500 is an electric motor, and the rotating shaft of the overturning device 500 is connected to the side plate 220 of the connecting part 200 through a key. When the overturning device 500 is started, the connecting part 200 is overturned, thereby synchronously overturning the clamping mechanism 300 and the wafer.

[0082] Specifically, after the wafer is overturned, the supporting relationship between the first supporting plate 311 and the second supporting plate 321 changes. More specifically, taking that the first supporting plate 311 supports the wafer before the wafer is overturned as an example. Before the wafer is overturned, since the first supporting plate 311 is arranged at the bottom of the wafer, the first supporting plate 311 supports the wafer, and the second supporting plate 321 cooperates with the first supporting plate 311 to clamp the wafer. After the wafer is overturned, at this time, the second supporting plate 321 is arranged at the bottom of the wafer, so the second supporting plate 321 supports the wafer, and the first supporting plate 311 cooperates with the second supporting plate 321 to clamp the wafer. When it is needed to take down the wafer, at this time, the first driving member 332 drives the first supporting plate 311 to move away from the wafer, and only the second supporting plate 321 supports the wafer, at this time, the mechanical arm transfers the wafer to other positions.

[0083] The wafer conveying device further comprises a plurality of second detection assemblies, each of which comprises:

[0084] a second emitting member 610 arranged on the bearing member 100 and used for emitting a second detection light 611;

[0085] a second receiving member 620 arranged on the bearing member 100 and used for receiving the second detection light 611;

[0086] The second detection light 611 emitted by the second emitting member 610 is parallel to the surface of the wafer, and when the second receiving member 620 can receive the second detection light 611, the wafer is horizontal, and when the second receiving member 620 cannot receive the second detection light 611, the wafer is inclined.

[0087] In some embodiments, after the wafer is clamped, it is also needed to detect whether the wafer is horizontal, and therefore the second detection assembly is arranged on the bearing member 100, which can be arranged in a manner of bonding, clamping or bolt fixing, etc., and is not limited herein, as long as the wafer can be detected.

[0088] In some specific embodiments, the second detection component includes a second emitting element 610 and a second receiving element 620; wherein the second emitting element 610 is used to emit a second detection light 611, and the second receiving element 620 is used to receive the second detection light 611 emitted by the second emitting element 610. More specifically, the second emitting element 610 and the second receiving element 620 are both arranged horizontally so that the second detection light 611 is in a horizontal state. At the same time, the interval between the second detection light 611 and the surface of the wafer is smaller than the radius of the wafer. In order to be able to more accurately detect the state of the wafer, the second detection light 611 is set to fit the wafer surface as much as possible. In some embodiments, the second detection light 611 fits the surface of the wafer.

[0089] In some specific embodiments, when the wafer is horizontal, the second detection light 611 is not interfered with by the wafer, and the second receiving element 620 can receive the second detection light 611 emitted by the second emitting element 610. When the wafer is tilted, the tilted wafer blocks the second detection light 611, and the second receiving element 620 cannot receive the second detection light 611 emitted by the second emitting element 610. Therefore, when the second receiving element 620 cannot receive the second detection light 611 emitted by the second emitting element 610, it can be determined that the wafer is tilted.

[0090] In some more specific embodiments, the optical paths of the second detection light beams 611 of the plurality of second detection components may be parallel or intersecting.

[0091] In some more specific embodiments, there is a third angle between the optical paths of the second detection light beams 611 of two adjacent second detection components, and the third angle is greater than 0° and less than 180°. That is, the optical paths of the second detection light beams 611 of two adjacent second detection components intersect; the problem of not blocking the second detection light beam 611 when the wafer is tilted at too large an angle due to the parallel optical paths is improved. More specifically, two second detection components are set in the present application, and the third angle is 90°. The optical paths of the second detection light beams 611 of the two second detection components are made perpendicular. At this time, no matter in which direction the wafer is tilted, it can be detected by the second detection component, thereby improving the accuracy of the detection.

[0092] The wafer transport device further includes a sensor disposed on the carrier 100 to detect whether a wafer is placed on the clamping mechanism 300 .

[0093] In some embodiments, the carrier 100 is further provided with a sensor. Specifically, the sensor is a pair of sensors, which have a third emitting member 810 and a third receiving member 820. The third emitting member 810 is fixedly arranged on the end face of one of the second driving plates 341, and can be arranged by adhesion, clamping or screwing, etc., without limitation, as long as the relative displacement between the two does not occur. The third receiving member 820 is fixedly arranged on the end face of the other second driving plate, so that the third emitting member 810 and the third receiving member 820 are arranged oppositely. The third receiving member 820 can be arranged by adhesion, clamping or screwing, etc., without limitation, as long as the relative displacement between the two does not occur. The third emitting member 810 is used for emitting laser, and the third receiving member 820 is used for receiving the laser emitted by the third emitting member 810. Since the third emitting member 810 and the third receiving member 820 are arranged on the two sides of the wafer respectively, when the wafer is placed on the first clamping jaw 310, the laser is blocked by the wafer, and the third receiving member 820 cannot receive the laser emitted by the third emitting member 810. When the wafer is not placed on the first clamping jaw 310, the third receiving member 820 can receive the laser emitted by the third emitting member 810. At this time, the wafer is placed on the first clamping jaw 310 of the clamping mechanism 300, and the wafer blocks the signal emitted by the third emitting member 810, so that the third receiving member 820 cannot receive the signal emitted by the third emitting member 810, which represents that the wafer is placed on the first clamping jaw 310 at this time. At this time, the second clamping jaw 320 is controlled to move towards the wafer to clamp the wafer. In addition, the connecting part 200 is further provided with a sensor (not shown in the figure), which is used to detect the position of the first clamping jaw 310 and the second clamping jaw 320 (which is a prior art and will not be described here), so as to determine whether the clamping of the first clamping jaw 310 and the second clamping jaw 320 is in place. When the clamping is in place, the turnover device 500 is started to drive the wafer to turn over.

[0094] The implementation principle of the wafer conveying device with a detection function in the embodiment of the application is that the wafer is clamped by the mechanical arm, placed on the first supporting plate 311 of the first clamping jaw 310, the second driving member 342 is controlled to move, the second supporting plate 321 is driven by the second driving member 342 to approach the wafer, and the wafer is clamped by the cooperation of the second supporting plate 321 and the first supporting plate 311. After the wafer is clamped, the second detection device can detect whether the wafer on the clamping mechanism 300 is arranged horizontally. After determining that the wafer is horizontal, the carrier 100 is driven by the first moving member 700 to move, so that the wafer moves synchronously. In the movement process, the first detection device can detect the surface of the wafer to determine whether there is a defect on the surface of the wafer. In addition, under the action of the turnover device 500, the wafer can be turned over. After the wafer is turned over, the second supporting plate 321 supports the wafer, the first driving member 332 is controlled to drive the first supporting plate 311 to move away from the wafer, and at this time the mechanical wall takes down the wafer on the second supporting plate 321 and transfers it.

[0095] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A wafer transport device with a detection function, characterized in that: It includes a movable carrier (100); A connecting portion (200) is provided on the supporting member (100); Clamping mechanisms (300) are arranged opposite to each other, and the clamping mechanisms (300) are movably arranged on the connecting portion (200); the clamping mechanisms (300) are arranged opposite to each other and move closer to clamp the wafer; and the clamping mechanisms (300) are arranged opposite to each other and move away from each other to release the wafer; The first detection device comprises a first transmitting element (410) and a first receiving element (420), wherein the first transmitting element (410) and the first receiving element (420) are arranged opposite to each other; The clamping mechanism (300) comprises: A first clamping jaw (310) is arranged opposite to each other and is movably provided on the connecting portion (200); a first support plate (311) is provided at the end of the first clamping jaw (310); the first support plate (311) is used to contact one end surface of the wafer; A second clamping jaw (320) is arranged opposite to the first clamping jaw (320) and is movably arranged on the connecting portion (200). A second support plate (321) is provided at the end of the second clamping jaw (320). The second support plate (321) is used to contact the other end surface of the wafer to cooperate with the first support plate (311) to clamp the wafer. A first driving assembly (330) includes a first driving plate (331) and a first driving member (332); the first driving plate (331) is used to connect the first clamping jaw (310) arranged opposite to the first driving plate (331); the first driving member (332) is provided on the connecting portion (200) and connected to the first driving plate (331) to drive the first driving plate (331) and the first clamping jaw (310) arranged opposite to the first driving plate (331) to move closer to or away from the wafer; A second driving assembly (340) includes a second driving plate (341) and a second driving member (342); the second driving plate (341) is used to connect the second clamping jaw (320) arranged opposite to the wafer; the second driving member (342) is provided on the connecting portion (200) and connected to the second driving plate (341) to drive the second driving plate (341) and the second clamping jaw (320) arranged opposite to the wafer to move closer to or away from the wafer; The first emitting element (410) is used to emit a first detection light (411), and the first receiving element (420) is used to receive the first detection light (411) reflected by the wafer, so as to detect a surface pattern of the wafer.

2. The wafer transport device according to claim 1, wherein: The first detection device further comprises a reflector (430), the reflector (430) having a first reflective surface (431) and a second reflective surface (432); the reflector (430) is arranged between the first transmitting element (410) and the first receiving element (420); The first emitting element (410) emits the first detection light (411) toward the first reflecting surface (431), and the first detection light (411) is reflected by the first reflecting surface (431) and irradiated onto the wafer, and is reflected by the wafer to the second reflecting surface (432), and is received by the first receiving element (420) after being reflected by the second reflecting surface (432) to detect the pattern on the surface of the wafer.

3. The wafer transport device according to claim 2, wherein: The first transmitting element (410) and the first receiving element (420) are both arranged horizontally; A first angle is formed between the first reflecting surface (431) and the wafer, and a second angle is formed between the second reflecting surface (432) and the wafer; the first angle is greater than 0° and less than 45°, and the second angle is greater than 135° and less than 180°, so that the first reflecting surface (431) can reflect the first detection light (411) to the wafer, and the second reflecting surface (432) reflects the first detection light (411) reflected by the wafer to the first receiving element (420).

4. The wafer transport device according to claim 1, wherein: It also includes a flipping device (500), which is connected to the connecting portion (200) and is used to drive the connecting portion (200) and the clamping mechanism (300) to flip, so as to flip the wafer.

5. The wafer transport device according to claim 1, wherein: Also included are a plurality of second detection components, each of which includes: A second emitting element (610), provided on the supporting element (100), for emitting a second detection light (611); A second receiving element (620), provided on the supporting element (100), for receiving the second detection light (611); The second detection light (611) emitted by the second emitting element (610) is parallel to the surface of the wafer. When the second receiving element (620) can receive the second detection light (611), the wafer is horizontal; when the second receiving element (620) cannot receive the second detection light (611), the wafer is tilted.

6. The wafer transport device according to claim 5, characterized in that: There is a third angle between the optical paths of the second detection light beams (611) of two adjacent second detection components, and the third angle is greater than 0° and less than 180°.

7. The wafer transport device according to claim 1, wherein: The invention also includes a first moving member (700), which is connected to the carrier (100) and is used to drive the carrier (100) to move so that the first detection light (411) is irradiated to different positions on the surface of the wafer.

8. The wafer transport device according to claim 1 or 5, characterized in that: The device further comprises a sensor, wherein the sensor comprises a third transmitting element (810) and a third receiving element (820), wherein the third transmitting element (810) and the third receiving element (820) are arranged relative to each other to detect whether the wafer is placed on the clamping mechanism (300).

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