Wafer flipping device and wafer flipping apparatus

Abstract

The application discloses a wafer overturning device and a wafer overturning equipment. The wafer overturning device comprises a movable bearing part, a supporting part arranged on the bearing part, and oppositely arranged clamping mechanisms each movably arranged on the supporting part. Each clamping mechanism comprises a plurality of clamping components for clamping wafers, and the clamping components are arranged in a vertical direction. The clamping mechanisms are arranged oppositely and are close to each other, so that each clamping component clamps a corresponding wafer. The clamping mechanisms are arranged oppositely and are far away from each other, so that each clamping component releases the corresponding wafer. An overturning part is arranged on the bearing part and is connected with the supporting part, and is used for driving the overturning of the supporting part and the clamping mechanisms. The wafer overturning equipment comprises at least two wafer overturning devices, and the interval between adjacent wafer overturning devices is greater than the radius of the wafer. The wafer overturning efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer flipping device and wafer flipping equipment. Background Art

[0002] During semiconductor manufacturing, substrates (such as wafers) typically pass through multiple processing stations. Due to the limited range of robots, mobile carriers are often deployed between robots to facilitate the transfer of substrates between stations. When the backside of a substrate needs to be processed, a separate substrate flipping unit is used to flip the substrate from front to back.

[0003] In the existing technology, the flip unit module and the mobile carrying unit module are separate modules, and the modules need to be transferred and linked to each other through a robot. The time consumed by the linkage of each module during the transfer of the substrate is greatly increased. At the same time, only a single wafer can be flipped at a time, which reduces the wafer flipping efficiency and thus affects the production capacity of the entire machine.

[0004] Therefore, it is necessary to provide a new wafer flipping device and wafer flipping equipment to solve the above problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by the present application is to provide a wafer flipping device and a wafer flipping equipment that can improve the wafer flipping efficiency.

[0006] To solve the above technical problems, according to an embodiment of the present application, a wafer flipping device is provided, comprising a movable carrier:

[0007] A supporting portion, provided on the bearing member;

[0008] The oppositely arranged clamping mechanisms are movably arranged on the support portion, each of the clamping mechanisms includes a plurality of clamping assemblies, the clamping assemblies are used to clamp the wafer, and the plurality of clamping assemblies are spaced apart in the vertical direction; the oppositely arranged clamping mechanisms are close to each other so that each clamping assembly clamps the corresponding wafer; the oppositely arranged clamping mechanisms are moved away from each other so that each clamping assembly releases the corresponding wafer;

[0009] The clamping assembly includes a first clamping device and a second clamping device, the first clamping device includes a first clamping jaw disposed opposite to each other; the second clamping device includes a second clamping jaw disposed opposite to each other; the first clamping jaw is used to support the wafer, and the second clamping jaw is used to move radially along the wafer after the first clamping jaw supports the wafer to cooperate with the first clamping jaw to clamp the wafer;

[0010] The flipping member is provided on the bearing member and connected to the supporting portion, and is used for driving the supporting portion and the clamping mechanism to flip.

[0011] A wafer flipping device comprises a wafer flipping device, wherein at least two wafer flipping devices are provided, and the interval between adjacent wafer flipping devices is greater than the radius of the wafer.

[0012] By adopting the above technical solution, multiple clamping assemblies are arranged on the carrier, each clamping assembly can clamp a wafer, allowing the clamping mechanism to clamp multiple wafers synchronously. The flipping member can drive the clamping mechanism to flip. Therefore, after the clamping mechanism clamps the wafer, the flipping member is activated, which can drive the multiple wafers to flip synchronously. In other words, the wafer flipping device combines a movable carrier and a flipping member, so that the carrier can drive multiple wafers to flip synchronously during movement, improving wafer flipping efficiency and thus increasing the production capacity of the entire machine.

[0013] According to an embodiment of the present application, a first support plate is provided at the end of the first clamping jaw, and the first support plate is used to contact one of the end faces of the wafer; a second support plate is provided at the end of the second clamping jaw, and the second support plate moves radially along the wafer after the first support plate supports the wafer to cooperate with the first support plate to clamp the wafer.

[0014] According to an embodiment of the present application, the first support plate is arranged at the bottom of the first clamping jaw, and the second support plate is arranged at the top of the second clamping jaw, so that a clamping space is formed between the first support plate and the corresponding second support plate to clamp the wafer.

[0015] According to an embodiment of the present application, the first support plate is arranged at the top of the first clamping jaw, and the second support plate is arranged at the bottom of the second clamping jaw, so that a clamping space is formed between the first support plate and the corresponding second support plate to clamp the wafer.

[0016] According to an embodiment of the present application, the clamping mechanism further includes:

[0017] a first driving assembly comprising a first driving plate and a first driving member; the first driving plate being used to connect the plurality of first clamping devices; the first driving member being disposed on the supporting portion and connected to the first driving plate to drive the first driving plate and the plurality of first clamping devices toward or away from the wafer;

[0018] The second driving assembly includes a second driving plate and a second driving member; the second driving plate is used to connect multiple second clamping devices; the second driving member is arranged on the supporting part and connected to the second driving plate to drive the second driving plate and multiple second clamping devices to approach or move away from the wafer.

[0019] According to the embodiment of the present application, the detection mechanism comprises a first emitter and a first receiver. A plurality of the first emitters are arranged at intervals on one of the second driving plates, and each of the first emitters corresponds to a second clamping jaw position. A plurality of the first receivers are arranged at intervals on the other second driving plate, and each of the first receivers corresponds to a second clamping jaw position. The first receiver is used to receive the signal emitted by the first emitter to detect whether the wafer is placed on the corresponding clamping assembly.

[0020] According to the embodiment of the present application, the first moving member is connected with the carrier and used to drive the carrier to move.

[0021] According to the embodiment of the present application, a plurality of second detection assemblies are arranged at intervals along the vertical direction and correspond to the plurality of clamping assemblies. Each of the second detection assemblies comprises:

[0022] A second emitter arranged on the carrier and used to emit a second detection light;

[0023] A second receiver arranged on the carrier and used to receive the second detection light;

[0024] When the second receiver can receive the second detection light, the wafer is horizontal; when the second receiver cannot receive the second detection light, the wafer is inclined.

[0025] According to the embodiment of the present application, each of the clamping assemblies corresponds to two second detection assemblies. The optical paths of the second detection lights of the two adjacent second detection assemblies have a third included angle, and the third included angle is greater than 0° and less than 180°.

[0026] According to the embodiment of the present application, the materials of the first clamping jaw and the second clamping jaw are both conductive polyether ether ketone. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 FIG. 1 is a schematic view of the main body structure of a wafer overturning device according to an embodiment of the present application;

[0028] Figure 2 FIG. 2 is a top view of the main body of a wafer overturning device according to an embodiment of the present application;

[0029] Figure 3 FIG. 3 is a schematic view of the main body of a wafer overturning device according to another embodiment of the present application; Figure 1 FIG. 4 is an enlarged view of part A in FIG. 3.

[0030] REFERENCE NUMERALS:

[0031] 100, carrier; 200, supporting portion; 210, bottom plate; 220, side plate; 300, clamping assembly; 310, first clamping device; 311, first clamping jaw; 312, first support plate; 320, second clamping device; 321, second clamping jaw; 322, second support plate; 330, first driving assembly; 331, first driving plate; 332, first driving member; 340, second driving assembly; 341, second driving plate; 342, second driving member; 400, flipping member; 510, first emitting member; 520, first receiving member; 610, second emitting member; 611, second detection light; 620, second receiving member; 700, first moving member. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0033] The following is combined with Figure 1-3 , the specific implementation methods of the present invention are further described in detail.

[0034] An embodiment of the present invention provides a wafer flipping device capable of simultaneously flipping multiple wafers to improve wafer flipping efficiency. The wafer flipping device includes a movable carrier 100:

[0035] The supporting portion 200 is provided on the carrier 100;

[0036] The oppositely arranged clamping mechanisms are movably arranged on the support portion 200. Each clamping mechanism includes a plurality of clamping assemblies 300, which are used to clamp wafers. The plurality of clamping assemblies 300 are spaced apart in the vertical direction. The oppositely arranged clamping mechanisms are close to each other so that each clamping assembly 300 clamps the corresponding wafer. The oppositely arranged clamping mechanisms are separated from each other so that each clamping assembly 300 releases the corresponding wafer.

[0037] The clamping assembly includes a first clamping device 310 and a second clamping device 320. The first clamping device 310 includes a first clamping jaw 311 disposed opposite to each other; the second clamping device 320 includes a second clamping jaw 321 disposed opposite to each other. The first clamping jaw 311 is used to support the wafer, and the second clamping jaw 321 is used to move radially along the wafer after the first clamping jaw 311 supports the wafer to cooperate with the first clamping jaw 311 to clamp the wafer.

[0038] The flipping member 400 is provided on the carrier 100 and connected to the supporting portion 200 , and is used to drive the supporting portion 200 and the clamping mechanism to flip.

[0039] In some embodiments, a wafer flipping device is provided on a wafer flipping apparatus. The wafer flipping apparatus includes a platform, a carrier 100 movably mounted on the platform, and a wafer placed on the carrier 100. Movement of the carrier 100 drives synchronous movement of the wafer, the specific movement of which is described below. The carrier 100 is provided with two support portions 200, which are arranged opposite each other on the carrier 100. The support portions 200 are also provided with a clamping mechanism that can move on the support portions 200. Since the two support portions 200 are arranged opposite each other, the two clamping mechanisms are also arranged opposite each other. Furthermore, the clamping mechanism can move on the support portions 200. The clamping mechanism is used to clamp the wafer. When the opposing clamping mechanisms approach each other, the wafer is clamped; when the opposing clamping mechanisms move away from each other, the wafer is released. In some specific embodiments, the carrier 100 has a supporting surface for mounting the clamping mechanism and the flipping element 400.

[0040] In some specific embodiments, in order to be able to clamp multiple wafers at the same time, a clamping mechanism is provided including multiple clamping assemblies 300, each clamping assembly 300 is capable of clamping a corresponding wafer, and the multiple clamping assemblies 300 are arranged at intervals along the vertical direction; more specifically, the multiple clamping assemblies 300 are arranged at even intervals along the vertical direction. When the clamping mechanism moves, the multiple clamping assemblies 300 move synchronously, thereby clamping or releasing the wafer. Specifically, when the relatively arranged clamping mechanisms approach each other, the relatively arranged multiple clamping assemblies 300 approach each other, and each two relatively arranged clamping assemblies 300 can clamp one wafer, so the multiple clamping assemblies 300 can clamp multiple wafers.

[0041] In some specific embodiments, the support portion 200 includes a side plate 220 and a bottom plate 210 , and the clamping mechanism is movably disposed on the bottom plate 210 of the support portion 200 , so that the relatively disposed clamping mechanisms can move closer to or farther away from each other.

[0042] In some more specific embodiments, in order to be able to drive multiple wafers to flip, a flip member 400 is further provided on the carrier 100. The setting method can be bonding, clamping or bolting, etc., which is not limited here, and the position of the flip member 400 on the carrier 100 does not change. In some more specific embodiments, the flip member 400 is a motor, and the rotating shaft of the flip member 400 is connected to the side plate 220 of the support part 200 by a key connection, so that when the flip member 400 is started, it can drive the support part 200 to flip, thereby driving multiple wafers to flip synchronously. More specifically, the distance between the clamping assembly 300 at the bottom in the vertical direction and the carrier 100 is greater than the radius of the wafer to reduce the possibility of collision between the wafer and the end face of the carrier 100 during the flipping process.

[0043] In some embodiments, in order to facilitate the movement of the carrier 100, a first movable member 700 is further provided on the machine. Specifically, the first movable member 700 can be an electric cylinder, a pneumatic cylinder, or a motor, etc., which is not limited here, and the first movable member 700 is mainly capable of driving the carrier 100 to move; it is worth noting that when the first movable member 700 is a motor, the first movable member 700 and the carrier 100 are connected by a pulley transmission, that is, the first movable member 700 is provided on the machine, and a driving pulley is provided on the rotating shaft of the first movable member 700, and a driven pulley is also rotatably provided on the machine, and the driving pulley and the driven pulley are connected by a transmission belt, and the carrier 100 is connected to the transmission belt at the same time, so that when the first movable member 700 is started, it can drive the transmission belt to move, thereby driving the carrier 100 to move. The first movable member 700 is fixedly arranged on the machine, and its fixing method can be bonding, clamping or bolting, etc., which is not limited here. The main thing is that the position of the first movable member 700 on the machine will not change. At the same time, the first movable member 700 is connected to the carrier 100. When the first movable member 700 is started, the piston rod of the first movable member 700 pushes the carrier 100 to move, so that the first detection light can be irradiated to different positions on the wafer surface. More specifically, a track is provided on the machine, and the carrier 100 is movably arranged on the track and can move along the length direction of the track on the track. The track has a limiting effect on the carrier 100, thereby limiting the movement direction of the carrier 100. In some specific embodiments, when the first movable member 700 is controlled by pneumatic means, the control of the movement speed is achieved by adjusting the inlet and outlet air volumes.

[0044] A first support plate 312 is provided at the end of the first clamping jaw 311, and the first support plate 312 is used to contact one end surface of the wafer; a second support plate 322 is provided at the end of the second clamping jaw 321, and the second support plate 322 moves radially along the wafer after the first support plate 312 supports the wafer to cooperate with the first support plate 312 to clamp the wafer.

[0045] In some embodiments, in order to be able to clamp the wafer and prevent the wafer from detaching from the clamping assembly 300 on its own after the wafer is flipped, the clamping assembly 300 is provided to include a first clamping device 310 and a second clamping device 320, wherein the first clamping device 310 and the second clamping device 320 cooperate to clamp the two end faces of the wafer, so that the wafer will not detach on its own after flipping; at the same time, relying on the clamping assembly 300 arranged on the relatively arranged support part 200, the stability of the wafer clamping can be guaranteed.

[0046] In some specific embodiments, the first clamping device 310 includes first clamping jaws 311 disposed opposite each other and symmetrically arranged about the radial direction of the wafer. A first support plate 312 is provided at the end of the first clamping jaw 311, and the first support plate 312 is configured to contact one end surface of the wafer.

[0047] In some specific embodiments, the second clamping device 320 includes opposing second jaws 321, which are arranged symmetrically about the wafer's radial direction. A second support plate 322 is provided at the end of the second jaw 321, and the first support plate 312 is configured to contact the other end surface of the wafer. Specifically, the first support plate 312 and the second support plate 322 respectively contact the two end surfaces of the wafer to clamp the wafer. This prevents the wafer from detaching after flipping. For ease of understanding, the wafer flipping device is in an initial state, with the first support plate 312 contacting the bottom surface of the wafer and the second support plate 322 contacting the top surface of the wafer. During wafer placement, the wafer is first placed on the first support plate 312. The four opposing first support plates 312 of the clamping assembly 300 jointly support the wafer. After the wafer is placed, the second clamping device 320 approaches the wafer, causing the second jaw 321 to contact the top surface of the wafer and cooperate with the first jaw 311 to clamp the wafer. After the wafer is flipped, the second clamping jaw 321 is placed under the wafer to support the wafer. When the wafer needs to be removed, the first clamping device 310 is away from the wafer. At this time, the top of the wafer is not restricted by the first clamping jaw 311, and the robot can remove the wafer.

[0048] The first supporting plate 312 is disposed at the bottom of the first clamping jaw 311 , and the second supporting plate 322 is disposed at the top of the second clamping jaw 321 , so that a clamping space is formed between the first supporting plate 312 and the corresponding second supporting plate 322 to clamp the wafer.

[0049] In some embodiments, the first support plate 312 is disposed at the bottom of the first clamping jaw 311 and can be mounted by bonding, clamping, or bolting, without limitation. The primary requirement is that the first support plate 312 and the second support plate 322 are prevented from relative movement. The second support plate 322 is disposed at the top of the second clamping jaw 321 and can be mounted by bonding, clamping, or bolting, without limitation. The primary requirement is that the first support plate 312 and the second support plate 322 are spaced apart to form a clamping space between the first support plate 312 and the second support plate 322. The clamping space is used to accommodate a wafer, allowing the wafer to be clamped between the first support plate 312 and the second support plate 322. When the wafer is placed, the first support plate 312 supports the wafer, and the second support plate 322 cooperates with the first support plate 312 to clamp the wafer. When the wafer is flipped, the second support plate 322 supports the wafer, and the first support plate 312 and the second support plate 322 cooperate to clamp the wafer.

[0050] The first supporting plate 312 is disposed on the top of the first clamping jaw 311 , and the second supporting plate 322 is disposed on the bottom of the second clamping jaw 321 , so that a clamping space is formed between the first supporting plate 312 and the corresponding second supporting plate 322 to clamp the wafer.

[0051] In some embodiments, the first support plate 312 is disposed on top of the first clamping jaw 311 and can be attached by bonding, clamping, or bolting, without limitation. The primary requirement is that the first support plate 312 and the second support plate 322 are prevented from relative movement. The second support plate 322 is disposed on the bottom of the second clamping jaw 321 and can be attached by bonding, clamping, or bolting, without limitation. The primary requirement is that the first support plate 312 and the second support plate 322 are prevented from relative movement. A gap is formed between the first support plate 312 and the second support plate 322, creating a clamping space for accommodating a wafer so that the wafer can be clamped between the first support plate 312 and the second support plate 322. When the wafer is placed, the second support plate 322 supports the wafer, and the first support plate 312 and the second support plate 322 cooperate to clamp the wafer. When the wafer is flipped, the first support plate 312 supports the wafer, and the second support plate 322 cooperates with the first support plate 312 to clamp the wafer.

[0052] The clamping mechanism also includes:

[0053] The first driving assembly 330 includes a first driving plate 331 and a first driving member 332. The first driving plate 331 is used to connect the plurality of first clamping devices 310. The first driving member 332 is disposed on the support portion 200 and connected to the first driving plate 331 to drive the first driving plate 331 and the plurality of first clamping devices 310 toward or away from the wafer.

[0054] The second driving assembly 340 includes a second driving plate 341 and a second driving member 342; the second driving plate 341 is used to connect multiple second clamping devices 320; the second driving member 342 is arranged on the supporting part 200 and connected to the second driving plate 341 to drive the second driving plate 341 and multiple second clamping devices 320 to move closer to or away from the wafer.

[0055] In some embodiments, multiple first clamping devices 310 on each support part 200 need to move synchronously; multiple second clamping devices 320 on each support part 200 need to move synchronously; therefore, the clamping mechanism also includes a first drive component 330 and a second drive component 340, wherein the first drive component 330 is used to drive the multiple first clamping devices 310 to move synchronously, so that the multiple first clamping devices 310 can approach or move away from the wafer at the same time; the second drive component 340 is used to drive the multiple second clamping devices 320 to move synchronously, so that the multiple second clamping devices 320 can approach or move away from the wafer at the same time.

[0056] In some specific embodiments, the first drive assembly 330 includes a first driving plate 331 and a first driving member 332. The plurality of first clamping devices 310 are disposed on the first driving plate 331. The plurality of first clamping devices 310 are evenly spaced vertically on the first driving plate 331. When the first driving plate 331 moves, the plurality of first clamping devices 310 are synchronously moved, thereby driving the corresponding first clamping jaws 311 to move. The first driving member 332 is disposed on the base plate 210 of the support portion 200. The first driving member 332 may be attached by bonding, clamping, or bolting, without limitation, provided that the position of the first driving member 332 on the base plate 210 of the support portion 200 remains unchanged. The first driving member 332 is connected to the first driving plate 331, such that when the first driving member 332 is activated, it can drive the first driving plate 331 toward or away from the wafer, thereby moving the plurality of first clamping jaws 311 toward or away from the wafer to facilitate clamping the corresponding wafer.

[0057] In some more specific embodiments, the first driving member 332 may be a pneumatic cylinder or an electric cylinder, which is not limited herein, and the first driving member 332 is mainly capable of driving the first driving plate 331 to move on the bottom plate 210 of the support portion 200 .

[0058] In some specific embodiments, the second drive assembly 340 includes a second driving plate 341 and a second driving member 342; wherein the plurality of second clamping devices 320 are disposed on the second driving plate 341, and the plurality of second clamping devices 320 are evenly spaced along the vertical direction on the second driving plate 341. When the second driving plate 341 moves, the plurality of second clamping devices 320 are driven to move synchronously, thereby driving the corresponding second clamping jaws 321 to move. The second driving member 342 is disposed on the bottom plate 210 of the support portion 200, and can be mounted by bonding, clamping, or bolting, without limitation, provided that the position of the second driving member 342 on the bottom plate 210 of the support portion 200 does not change. The second driving member 342 is connected to the second driving plate 341, so that when the second driving member 342 is activated, it can drive the second driving plate 341 toward or away from the wafer, thereby moving the plurality of second clamping jaws 321 toward or away from the wafer to facilitate clamping the corresponding wafer.

[0059] In some more specific embodiments, the second driving member 342 may be a pneumatic cylinder or an electric cylinder, which is not limited herein, and the second driving member 342 is mainly capable of driving the first driving plate 331 to move on the bottom plate 210 of the support portion 200 .

[0060] In some more specific embodiments, the second driving plate 341 is shorter than the first driving plate 331, and the second driving plate 341 is positioned between the first driving plate 331 and the wafer. To allow the second driving member 342 on the bottom plate 210 of the support portion 200 to connect with the second driving plate 341, a groove is defined in the first driving plate 331, extending through the thickness of the first driving plate 331 to facilitate connection between the second driving member 342 and the second driving plate 341.

[0061] The wafer flipping device also includes multiple detection mechanisms; the detection mechanisms include a first transmitter 510 and a first receiver 520; multiple first transmitters 510 are spaced apart on one of the second driving plates 341, and each first transmitter 510 corresponds to the position of the second clamping jaw 321; multiple first receivers 520 are spaced apart on another second driving plate 341, and each first receiver 520 corresponds to the position of the second clamping jaw 321; the first receiver 520 is used to receive the signal emitted by the first transmitter 510 to detect whether a wafer is placed on the corresponding clamping assembly 300.

[0062] In some embodiments, after the wafer is placed, it is necessary to detect whether the wafer is clamped on the clamping assembly 300. Therefore, the wafer flipping device also includes multiple detection mechanisms, wherein the detection mechanism includes a first transmitter 510 and a first receiver 520. The first transmitter 510 is used to transmit signals, and the first receiver 520 is used to receive the signal transmitted by the first transmitter 510. At the same time, the first transmitter 510 and the first receiver 520 are respectively placed on both sides of the wafer. When a wafer is placed on the first clamping jaw 311, the signal emitted by the first transmitter 510 will be blocked by the wafer. When no wafer is placed on the first clamping jaw 311, the signal emitted by the first transmitter 510 will not be blocked by the wafer. That is, when the first receiving element 520 is able to receive the signal emitted by the first transmitting element 510, it indicates that there is no wafer placed on the corresponding first clamping jaw 311 at this time. At this time, when a wafer is placed on the first clamping jaw 311 of the clamping assembly 300, the wafer blocks the signal emitted by the first transmitting element 510, and the first receiving element 520 cannot receive the signal emitted by the first transmitting element 510, indicating that a wafer is placed on the first clamping jaw 311. At this time, the second clamping jaw 321 is controlled to move toward the wafer to clamp the wafer. In addition, the support portion 200 is also provided with a sensor (not shown in the figure) for detecting the position of the first clamping jaw 311 and the second clamping jaw 321 (this is prior art and will not be described in detail here) to determine whether the first clamping jaw 311 and the second clamping jaw 321 are clamped in place. When they are clamped in place, the flipping element 400 is activated to cause the multiple wafers to flip.

[0063] In some specific embodiments, the first transmitter 510 and the first receiver 520 are disposed opposite each other. Specifically, the first transmitter 510 is disposed on one of the second driving plates 341, and the first receiver 520 is disposed on the other second driving plate 341, thereby positioning the first transmitter 510 and the first receiver 520 opposite each other. More specifically, multiple first transmitters 510 are vertically spaced apart on corresponding second driving plates 341, and the multiple first transmitters 510 correspond one-to-one with the multiple clamping assemblies 300. Multiple first receivers 520 are vertically spaced apart on corresponding second driving plates 341, and the multiple first receivers 520 correspond one-to-one with the multiple clamping assemblies 300. This ensures that the multiple detection mechanisms correspond one-to-one with the multiple clamping assemblies 300, and each detection mechanism can detect whether a wafer is placed on the corresponding first clamping jaw 311.

[0064] In some more specific embodiments, the first emitting element 510 and the first receiving element 520 together form a through-beam sensor, the first emitting element 510 is used to emit laser light, and the first receiving element 520 is used to receive the laser light emitted by the first emitting element 510 .

[0065] The wafer flipping device further includes a plurality of second detection components, which are arranged at intervals along the vertical direction and correspond to the plurality of clamping components 300; each second detection component includes:

[0066] The second emitting element 610 is disposed on the carrier 100 and is used to emit a second detection light 611;

[0067] The second receiving element 620 is disposed on the carrier 100 and is used to receive the second detection light 611;

[0068] The second detection light 611 emitted by the second emitting element 610 is parallel to the surface of the wafer. When the second receiving element 620 can receive the second detection light 611, the wafer is horizontal; when the second receiving element 620 cannot receive the second detection light 611, the wafer is tilted.

[0069] In some embodiments, after the clamping assembly 300 clamps the wafer, it is necessary to detect whether the wafer on each clamping assembly 300 is horizontally arranged, so a second detection assembly is set;

[0070] In some specific embodiments, the second detection component includes a second emitting element 610 and a second receiving element 620; wherein the second emitting element 610 is used to emit a second detection light 611, and the second receiving element 620 is used to receive the second detection light 611 emitted by the second emitting element 610. More specifically, the second emitting element 610 and the second receiving element 620 are both arranged horizontally so that the second detection light 611 is in a horizontal state. At the same time, the interval between the second detection light 611 and the surface of the wafer is smaller than the radius of the wafer. In order to be able to more accurately detect the state of the wafer, the second detection light 611 is set to fit the wafer surface as much as possible. In some embodiments, the second detection light 611 fits the surface of the wafer.

[0071] In some more specific embodiments, the optical paths of the second detection light beams 611 of the plurality of second detection components may be parallel or intersecting.

[0072] In some more specific embodiments, the second emitting element 610 and the second receiving element 620 together form a through-beam sensor, the second emitting element 610 is used to emit laser light, and the second receiving element 620 is used to receive the laser light emitted by the second emitting element 610 .

[0073] In some more specific embodiments, since there are multiple wafers, the wafer at each position needs to be inspected, so the multiple second inspection components are evenly distributed along the vertical direction, and the multiple second inspection components correspond one-to-one to the multiple clamping components 300, so that each wafer can be inspected by the corresponding second inspection component.

[0074] In some more specific embodiments, when the wafer is horizontal, the second detection light 611 is not interfered with by the wafer, and the second receiving element 620 can receive the second detection light 611 emitted by the second emitting element 610. When the wafer is tilted, the tilted wafer blocks the second detection light 611, and the second receiving element 620 cannot receive the second detection light 611 emitted by the second emitting element 610. Therefore, when the second receiving element 620 cannot receive the second detection light 611 emitted by the second emitting element 610, it can be determined that the wafer is tilted.

[0075] In some more specific embodiments, accurate inspection of each wafer cannot be achieved with a single second detection assembly alone. Therefore, two second detection assemblies are configured for each clamping assembly 300, that is, two second clamping assemblies are configured for each wafer. In this case, the optical paths of the second detection beams 611 in the two second detection assemblies can be parallel or intersecting. When parallel, the second detection beams 611 are not blocked when the wafer is tilted at a large angle. Therefore, the optical paths of the second detection beams 611 in two adjacent second detection assemblies are configured to intersect, that is, a third angle exists between the optical paths of the second detection beams 611 in two adjacent second detection assemblies, and the third angle is greater than 0° and less than 180°. This improves the problem of parallel optical paths preventing the second detection beams 611 from being blocked when the wafer is tilted at a large angle. More specifically, in this application, two second detection assemblies are configured with a third angle of 90°. This makes the optical paths of the second detection beams 611 in the two second detection assemblies perpendicular. In this case, regardless of the wafer's tilt, the second detection assemblies can detect it, improving inspection accuracy.

[0076] The first clamping jaw 311 and the second clamping jaw 321 are both made of conductive polyetheretherketone.

[0077] In some embodiments, the first clamping jaw 311 and the second clamping jaw 321 are both made of conductive polyetheretherketone (PEEK). Specifically, conductive PEEK refers to a composite material made by adding conductive fillers to a PEEK matrix to impart conductive properties. This is known technology and will not be described in detail here.

[0078] An embodiment of the present application further discloses a wafer flipping device, comprising the above-mentioned wafer flipping device, wherein at least two wafer flipping devices are provided, and the interval between adjacent wafer flipping devices is greater than the radius of the wafer.

[0079] In some embodiments, the wafer flipping equipment includes a machine platform, and the wafer flipping device is set on the machine platform. It can be set in two, three or more quantities, which is not limited here. In actual use, the number of wafer flipping devices is determined according to actual use requirements.

[0080] In some embodiments, a plurality of wafer flipping devices are evenly distributed along the horizontal direction on the platform.

[0081] In some embodiments, a plurality of wafer flipping devices are evenly spaced apart in the vertical direction on the platform.

[0082] In some specific embodiments, the interval between two adjacent wafer flipping devices is greater than the radius of the wafer, so as to reduce the possibility of wafers on adjacent wafer flipping devices colliding with each other during the wafer flipping process.

[0083] The implementation principle of a wafer flipping device and a wafer flipping equipment in an embodiment of the present application is to place multiple wafers on a clamping assembly 300 for clamping by a robot. For ease of understanding, the first support plate 312 is used as an example to support the wafer. The multiple wafers are placed on the corresponding first support plate 312 by the robot. The robot places the wafers in a direction perpendicular to the relatively arranged connection part so that multiple wafers can be placed at the same time. After the wafers are placed, the second clamping jaw 321 is controlled to move so that the second support plate 322 cooperates with the first support plate 312 to clamp the wafers. The flipping member 400 is started to flip the multiple wafers synchronously. After the flipping is completed, the second support plate 322 supports the wafer, and the first support plate 312 cooperates with the second support plate 322 to clamp the wafer. When the wafer needs to be removed, the first clamping jaw 311 is controlled to move away from the wafer, and the robot drives the multiple wafers to leave the second clamping jaw 321 synchronously.

[0084] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations of these embodiments are possible. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the invention described herein is susceptible to other embodiments and may be practiced or implemented in a variety of ways.

Claims

1. A wafer flipping device, characterized in that: It comprises a movable carrier (100): A supporting portion (200) is provided on the supporting member (100); The clamping mechanisms are arranged opposite to each other and are movably arranged on the support portion (200). Each of the clamping mechanisms comprises a plurality of clamping assemblies (300), the clamping assemblies (300) are used to clamp wafers, and the plurality of clamping assemblies (300) are arranged at intervals along the vertical direction. The clamping mechanisms are arranged opposite to each other so that each clamping assembly (300) clamps the corresponding wafer. The clamping mechanisms are arranged opposite to each other so that each clamping assembly (300) releases the corresponding wafer. The clamping assembly (300) includes a first clamping device (310) and a second clamping device (320), wherein the first clamping device (310) includes first clamping jaws (311) arranged opposite to each other; the second clamping device (320) includes second clamping jaws (321) arranged opposite to each other; the first clamping jaw (311) is used to carry the wafer, and the second clamping jaw (321) is used to move along the radial direction of the wafer after the first clamping jaw (311) carries the wafer to cooperate with the first clamping jaw (311) to clamp the wafer; A turning member (400) is provided on the bearing member (100), connected to the supporting portion (200), and used for driving the supporting portion (200) and the clamping mechanism to turn over; A first support plate (312) is provided at the end of the first clamping jaw (311), and the first support plate (312) is used to contact one end surface of the wafer; a second support plate (322) is provided at the end of the second clamping jaw (321), and the second support plate (322) moves along the radial direction of the wafer after the first support plate (312) carries the wafer to cooperate with the first support plate (312) to clamp the wafer; The clamping mechanism further comprises: a first driving assembly (330) comprising a first driving plate (331) and a first driving member (332); the first driving plate (331) being used to connect the plurality of first clamping devices (310); the first driving member (332) being provided on the supporting portion (200) and connected to the first driving plate (331) to drive the first driving plate (331) and the plurality of first clamping devices (310) to move closer to or away from the wafer; The second driving assembly (340) includes a second driving plate (341) and a second driving member (342); the second driving plate (341) is used to connect multiple second clamping devices (320); the second driving member (342) is arranged on the supporting part (200) and connected to the second driving plate (341) to drive the second driving plate (341) and multiple second clamping devices (320) to approach or move away from the wafer.

2. The wafer flipping device according to claim 1, wherein: The first support plate (312) is arranged at the bottom of the first clamping jaw (311), and the second support plate (322) is arranged at the top of the second clamping jaw (321), so that a clamping space is formed between the first support plate (312) and the corresponding second support plate (322) to clamp the wafer.

3. The wafer flipping device according to claim 1, wherein: The first support plate (312) is arranged at the top of the first clamping jaw (311), and the second support plate (322) is arranged at the bottom of the second clamping jaw (321), so that a clamping space is formed between the first support plate (312) and the corresponding second support plate (322) to clamp the wafer.

4. The wafer flipping device according to claim 1, wherein: It also includes multiple detection mechanisms; the detection mechanisms include a first transmitting member (510) and a first receiving member (520); multiple first transmitting members (510) are spaced apart on one of the second driving plates (341), and each first transmitting member (510) corresponds to the position of the second clamping claw (321); multiple first receiving members (520) are spaced apart on another of the second driving plates (341), and each first receiving member (520) corresponds to the position of the second clamping claw (321); the first receiving member (520) is used to receive the signal emitted by the first transmitting member (510) to detect whether the wafer is placed on the corresponding clamping assembly (300).

5. The wafer flipping device according to claim 1, wherein: It also includes a first moving member (700), which is connected to the supporting member (100) and is used to drive the supporting member (100) to move.

6. The wafer flipping device according to any one of claims 1 to 5, characterized in that: It also includes a plurality of second detection components, which are spaced apart in the vertical direction and correspond to the plurality of clamping components (300); each of the second detection components includes: A second emitting element (610), provided on the carrier (100), for emitting a second detection light (611); A second receiving element (620), provided on the supporting element (100), for receiving the second detection light (611); The second detection light (611) emitted by the second emitting element (610) is parallel to the surface of the wafer. When the second receiving element (620) can receive the second detection light (611), the wafer is horizontal; when the second receiving element (620) cannot receive the second detection light (611), the wafer is tilted.

7. The wafer flipping device according to claim 6, wherein: Each of the clamping components (300) corresponds to two of the second detection components; there is a third angle between the optical paths of the second detection light beams (611) of two adjacent second detection components, and the third angle is greater than 0° and less than 180°.

8. The wafer flipping device according to claim 1, wherein: The first clamping jaw (311) and the second clamping jaw (321) are both made of conductive polyetheretherketone.

9. A wafer flipping device, characterized in that: It comprises the wafer flipping device according to any one of claims 1 to 8, wherein at least two wafer flipping devices are provided, and the interval between adjacent wafer flipping devices is greater than the radius of the wafer.

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