Bearing device and semiconductor process equipment

Abstract

The embodiment of the invention provides a bearing device and semiconductor process equipment, and relates to the technical field of semiconductor process.The bearing device comprises a base, a supporting mechanism and a clamping mechanism; the supporting mechanism penetrates through the base in the vertical direction, the clamping mechanism is arranged on the periphery of the base, and the base can ascend and descend relative to the supporting mechanism. Under the condition that the base is lifted from the first position to the second position, the top of the supporting mechanism is lower than the top of the base, the base is used for supporting a wafer, and the clamping mechanism is used for clamping the wafer through the peripheral surface of the wafer; and under the condition that the base descends from the second position to the first position, the clamping mechanism releases the wafer, the top of the supporting mechanism protrudes out of the base, and the supporting mechanism is used for supporting the wafer. The bearing device has the function of clamping and limiting the wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor process technology, and in particular to a carrier device and semiconductor process equipment. Background Art

[0002] During semiconductor processes such as etching, a wafer is supported on a pedestal, which then lifts the wafer to the processing position, where it is then processed by semiconductor processing equipment. Because the wafer is merely supported on the pedestal and not fixed in place, slight gas fluctuations or motor oscillations can cause the wafer to slip relative to the pedestal during processing, adversely affecting the processing results. Summary of the Invention

[0003] The embodiments of the present application provide a carrier device and semiconductor process equipment to solve the problems existing in the background technology.

[0004] In a first aspect, an embodiment of the present application provides a carrying device.

[0005] The carrying device provided in the embodiment of the present application includes: a base, a supporting mechanism and a clamping mechanism; the supporting mechanism is vertically penetrated through the base, the clamping mechanism is arranged on the outer periphery of the base, and the base can be raised and lowered relative to the supporting mechanism; when the base is raised from a first position to a second position, the top of the supporting mechanism is lower than the top of the base, the base is used to support the wafer, and the clamping mechanism is used to clamp the wafer through the outer peripheral surface of the wafer; when the base is lowered from the second position to the first position, the clamping mechanism releases the wafer, the top of the supporting mechanism protrudes from the base, and the supporting mechanism is used to support the wafer.

[0006] Optionally, the carrying device also includes a first volume adjuster; the clamping mechanism includes a plurality of second volume adjusters, and the plurality of second volume adjusters are arranged on the periphery of the base; each second volume adjuster is connected to the first volume adjuster, and the base can drive the first volume adjuster to move, so as to drive each second volume adjuster to move, so as to clamp or release the wafer.

[0007] Optionally, the first volume adjuster includes a first cylinder and a first piston, the first piston is slidably connected to the cavity wall of the first cylinder, and the first piston and the first cylinder form a first sealed cavity; the second volume adjuster includes a second cylinder and a second piston, the second piston is slidably connected to the second cylinder, the second piston and the cavity wall of the second cylinder form a second sealed cavity, the second sealed cavity is communicated with the first sealed cavity, and fluid is contained in the first sealed cavity and the second sealed cavity; the first cylinder is connected to the support mechanism, and the base can drive the first piston to move to adjust the volume of the first sealed cavity and adjust the volume of the second sealed cavity.

[0008] Optionally, the first piston is provided with an abutment surface, which is arranged upward, and when the base is located between the first position and the second position, the base abuts against the abutment surface.

[0009] Optionally, the base is connected to a pressing member, and when the base is located between the first position and the second position, the pressing member abuts against the abutting surface.

[0010] Optionally, the first volume adjuster further includes a first reset member, which is respectively connected to the first cylinder and the first piston; when the base is raised from the first position to the second position, the first reset member is used to drive the first piston to rise.

[0011] Optionally, the first piston is arranged vertically, and the lower surface of the first piston and the first cylinder body form the first sealed cavity; the second piston is arranged horizontally, and the surface of the first piston facing the base and the second cylinder body form the second sealed cavity.

[0012] Optionally, the second volume adjuster further includes a second reset member, which is respectively connected to the second cylinder and the second piston; in the process of the base being raised from the first position to the second position, the second reset member is used to apply a force to the second piston extending toward the base.

[0013] Optionally, the second cylinder is connected to the base so that the clamping mechanism can rise and fall synchronously with the base.

[0014] Optionally, the fluid is air.

[0015] Optionally, the clamping mechanism further includes a plurality of clamping members, and the second volume adjuster is drive-connected to the clamping members one by one, and the bottom surface of the clamping member is higher than the top surface of the base; in the process of the base rising from the first position to the second position, the second volume adjuster drives the clamping member to extend toward the wafer supported on the base.

[0016] In a second aspect, an embodiment of the present application provides a semiconductor process equipment.

[0017] The semiconductor process equipment provided in the embodiments of the present application includes any one of the carrier devices provided in the embodiments of the present application.

[0018] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0019] In an embodiment of the present application, the base can be first positioned in a first position so that the top of the support mechanism protrudes from the base, and the wafer can be placed on the support mechanism. Furthermore, the base can be raised from the first position to the second position so that the support mechanism retracts below the top surface of the base, and the wafer is supported on the top surface of the base; at the same time, the clamping mechanism can clamp the wafer via the outer circumference of the wafer. Thus, the wafer can be limited by the clamping mechanism clamping the wafer via the outer circumference of the wafer to prevent the wafer from slipping during the process of processing the wafer.

[0020] In addition, after the process is completed, the base can be lowered from the second position to the first position, the clamping mechanism releases the wafer, the top of the support mechanism protrudes from the base, and the support mechanism supports the wafer. In this way, it is convenient to use a robot or other equipment to remove the wafer after the process is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic diagram of a carrying device provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 A top view of the carrying device shown in FIG;

[0024] Figure 3A schematic diagram of a carrying device provided in an embodiment of the present application, showing a situation where a support mechanism carries a wafer;

[0025] Figure 4 for Figure 3 A partial schematic diagram of the carrying device shown in FIG;

[0026] Figure 5 for Figure 3 A top view of the carrying device shown in FIG;

[0027] Figure 6 A schematic diagram of a carrier device provided in an embodiment of the present application, showing a wafer being carried on a base;

[0028] Figure 7 for Figure 6 A partial schematic diagram of the carrying device shown in FIG;

[0029] Figure 8 for Figure 6 A top view of the carrying device shown in FIG;

[0030] Figure 9 A schematic diagram of a carrying device provided in an embodiment of the present application, showing Figure 6 On the basis of the carrier device shown, the wafer is further raised along with the susceptor by a preset distance;

[0031] Figure 10 A schematic diagram of a carrying device provided in an embodiment of the present application, showing Figure 9 The wafer is lowered a preset distance along with the susceptor on the basis of the carrier device shown;

[0032] Figure 11 for Figure 10 A partial schematic diagram of the carrying device shown in FIG;

[0033] Figure 12 A schematic diagram of a carrying device provided in an embodiment of the present application, showing Figure 10 Based on the carrying device shown, the wafer further descends along with the base and is finally carried on the supporting mechanism.

[0034] Description of reference numerals:

[0035] 100-carrying device; 110-base; 111-pressing member; 120-supporting mechanism; 130-clamping mechanism; 131-second volume adjuster; 1311-second cylinder; 1312-second piston; 1313-second sealed chamber; 1314-second reset member; 132-clamping member; 140-first volume adjuster; 141-first cylinder; 142-first piston; 1421-abutting surface; 143-first sealed chamber; 144-first reset member; 150-bracket; 200-wafer. DETAILED DESCRIPTION

[0036] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0038] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0039] Furthermore, it is required that the application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0040] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0041] The embodiment of the present application provides a carrying device. Figures 1 to 12 The carrying device 100 provided in the embodiment of the present application includes: a base 110 , a supporting mechanism 120 and a clamping mechanism 130 .

[0042] The support mechanism 120 is vertically disposed on the base 110, and the clamping mechanism 130 is disposed on the periphery of the base 110. The base 110 can be raised and lowered relative to the support mechanism 120. For example, the support mechanism 120 is a thimble. For example, the support mechanism 120 is a three-needle thimble.

[0043] Combine Figure 1 、 Figure 3 and Figure 6 When the top of the support mechanism 120 is higher than the top of the susceptor 110, the wafer 200 can be placed on the support mechanism 120. When the top of the support mechanism 120 is lower than the top of the susceptor 110, the wafer 200 can be placed on the susceptor 110. In other words, when the top of the support mechanism 120 protrudes from the susceptor 110, the support mechanism 120 supports the wafer 200. When the susceptor 110 is raised relative to the support mechanism 120 and the support mechanism 120 is retracted relative to the susceptor 110 to a retracted position, the wafer 200 can be placed on the susceptor 110.

[0044] It should be noted that, illustratively, during the process of placing and removing the wafer 200, the top of the support mechanism 120 can be made to protrude from the base 110, that is, the wafer 200 can be supported on the support mechanism 120, thereby facilitating the movement of the wafer 200 using a robot or other equipment. When the wafer 200 needs to be processed, the wafer 200 can be supported on the base 110.

[0045] Further, refer to Figures 3 to 9 Using the solution provided in the embodiment of the present application, when the base 110 is raised from the first position to the second position, the top of the support mechanism 120 is lower than the top of the base 110. The base 110 is used to support the wafer 200, and the clamping mechanism 130 is used to clamp the wafer 200 via the outer circumference of the wafer 200. Therefore, the clamping mechanism 130 can clamp the wafer 200 via the outer circumference of the wafer 200 to limit the position of the wafer 200, thereby preventing the wafer 200 from slipping during the processing of the wafer 200.

[0046] refer to Figures 9 to 12 When the base 110 descends from the second position to the first position, the clamping mechanism 130 releases the wafer 200, and the top of the support mechanism 120 protrudes from the base 110, and the support mechanism 120 is used to support the wafer 200. In this way, when the clamping mechanism 130 releases the wafer 200 and the wafer 200 is supported by the support mechanism 120, it is convenient to use a robot or other equipment to remove the wafer 200 after the process is completed.

[0047] In this way, using the carrier device 100 provided in the embodiment of the present application, the base 110 can be first positioned in the first position so that the top of the support mechanism 120 protrudes from the base 110, and the wafer 200 can be placed on the support mechanism 120. Furthermore, the base 110 can be raised from the first position to the second position so that the support mechanism 120 is retracted below the top surface of the base 110, and the wafer 200 is carried on the top surface of the base 110; at the same time, the clamping mechanism 130 can clamp the wafer 200 via the outer circumference of the wafer 200. Thus, the wafer 200 can be limited by the clamping mechanism 130 clamping the wafer 200 via the outer circumference of the wafer 200 to prevent the wafer 200 from slipping during the process of processing the wafer 200.

[0048] In addition, after the process is completed, the base 110 can be lowered from the second position to the first position, the clamping mechanism 130 releases the wafer 200, and the top of the support mechanism 120 protrudes from the base 110. The support mechanism 120 supports the wafer 200, which makes it easy to use a robot or other equipment to remove the wafer 200 after the process is completed. Optionally, the support mechanism 120 can be fixed relative to the base position, which is equivalent to fixing the pick-up and placement station of the wafer 200. In this way, the lifting system can be omitted and it is convenient to combine with a robot or other equipment to pick up and place the wafer 200. However, this application is not limited to this. The support mechanism can also be connected to the lifting mechanism to achieve independent lifting.

[0049] In some embodiments, the base 110 is provided with a plurality of vertically extending through holes. The support mechanism 120 includes a plurality of ejector pins, which are disposed in a one-to-one correspondence with the through holes. Thus, during the raising and lowering of the base 110, the ejector pins can be extended or retracted relative to the base 110.

[0050] refer to Figure 6 、 Figure 7 、 Figure 10 and Figure 11 In some embodiments, the carrier 100 further includes a first volume adjuster 140 . The clamping mechanism 130 includes a plurality of second volume adjusters 131 , which are disposed on the periphery of the base 110 . Each second volume adjuster 131 is in communication with the first volume adjuster 140 . The base 110 can drive the first volume adjuster 140 to move, thereby driving each second volume adjuster 131 to move, thereby clamping or releasing the wafer 200 .

[0051] For example, the first volume adjuster 140 is a first telescopic cylinder, and the second volume adjuster 131 is a second telescopic cylinder. The chamber of the first telescopic cylinder is connected to the chamber of the second telescopic cylinder. Figure 10When the volume of the first telescopic cylinder is compressed, the fluid in the first telescopic cylinder will be discharged into the second telescopic cylinder, thereby expanding the volume of the second telescopic cylinder. In this way, the second telescopic cylinder can be retracted, so that the clamping mechanism 130 can release the wafer 200. Figure 7 When the volume of the chamber of the first telescopic cylinder increases, the chamber of the first telescopic cylinder will draw the fluid in the chamber of the second telescopic cylinder into the chamber of the first telescopic cylinder, and the chamber of the second telescopic cylinder will shrink, so that the second telescopic cylinder can be extended, and then the clamping mechanism 130 can clamp the wafer 200.

[0052] It should be noted that, in the above, the working principle of the carrying device 100 is mainly explained by taking the first volume adjuster 140 as the first telescopic cylinder and the second volume adjuster 131 as the second telescopic cylinder as an example. It can be understood that the first volume adjuster 140 and the second volume adjuster 131 may not be telescopic cylinders. For example, the working principle of the telescopic cylinder can be imitated to independently develop the first volume adjuster 140 and the second volume adjuster 131 that can adjust the volume.

[0053] Of course, in order to facilitate those skilled in the art to better implement the solutions provided in the embodiments of the present application, more detailed examples are provided below for reference by those skilled in the art.

[0054] refer to Figure 3 and Figure 4 In some embodiments, the first volume adjuster 140 includes a first cylinder 141 and a first piston 142 . The first piston 142 is slidably connected to the cavity wall of the first cylinder 141 , and the first piston 142 and the first cylinder 141 enclose a first sealed cavity 143 .

[0055] The second volume adjuster 131 includes a second cylinder 1311 and a second piston 1312. The second piston 1312 is slidably connected to the second cylinder 1311. The second piston 1312 and the cavity wall of the second cylinder 1311 form a second sealed cavity 1313. The second sealed cavity 1313 is connected to the first sealed cavity 143. The first sealed cavity 143 and the second sealed cavity 1313 contain a fluid. Exemplarily, the fluid is air. Of course, in other embodiments, the fluid may also be a liquid. For example, the fluid may be hydraulic oil.

[0056] The first cylinder 141 is connected to the support mechanism 120. The base 110 can drive the first piston 142 to move, thereby adjusting the volume of the first sealed cavity 143 and the volume of the second sealed cavity 1313. It should be noted that to improve the smoothness of the extension and contraction of the second piston 1312 of each second volume adjuster 131, in some embodiments, the dimensions of each second volume adjuster 131 are the same.

[0057] refer to Figure 1 Exemplarily, the carrier device 100 includes a bracket 150. The support mechanism 120 is detachably connected to the bracket 150. Furthermore, exemplary, the bracket 150 can be fixedly installed in the semiconductor process chamber. Exemplarily, the first cylinder 141 is indirectly connected to the support mechanism 120 by being connected to the bracket 150.

[0058] It should be noted that since the first cylinder 141 is connected to the support mechanism 120, the first cylinder 141 is fixed relative to the support mechanism 120. Furthermore, during the process of the base 110 moving up and down relative to the support mechanism 120, the base 110 can be used to drive the first piston 142 to move relative to the first cylinder 141 to adjust the volume of the first sealed chamber 143. Furthermore, since the second sealed chamber 1313 is connected to the first sealed chamber 143, for example, when the volume of the first sealed chamber 143 decreases, the volume of the second sealed chamber 1313 will correspondingly increase. When the volume of the first sealed chamber 143 increases, the volume of the second sealed chamber 1313 will correspondingly decrease. Thus, by using the base 110 to drive the first piston 142 to move relative to the first cylinder 141, the second piston 1312 can be driven to move, allowing the clamping mechanism 130 to clamp or release the wafer 200.

[0059] refer to Figure 3 and Figure 4 In some embodiments, the first piston 142 is provided with an abutting surface 1421 , which is disposed upward. When the base 110 is located between the first position and the second position, the base 110 abuts against the abutting surface 1421 .

[0060] Further, refer to Figure 6 In some embodiments, the base 110 is connected to a pressing member 111. When the base 110 is between the first position and the second position, the pressing member 111 abuts against the abutment surface 1421. In this way, when the base 110 is raised or lowered between the first position and the second position, the base 110 can drive the abutment surface 1421 to rise or fall synchronously.

[0061] In addition, reference Figure 9 In some embodiments, the susceptor 110 carrying the wafer 200 can be further raised. During the further rise of the susceptor 110, the pressing member 111 can separate from the abutting surface 1421, and the volume of the first volume adjuster 140 is at its maximum capacity. The volume of the first volume adjuster 140 does not increase as the susceptor 110 further rises. At this time, the clamping mechanism 130 remains in the clamping state. The susceptor 110 can further lift the wafer 200 to a predetermined position, so that the wafer 200 can be processed at the predetermined position.

[0062] refer to Figure 3 、 Figure 4 、 Figure 6 and Figure 7 In some embodiments, the first volume adjuster 140 further includes a first return member 144. The first return member 144 is connected to the first cylinder 141 and the first piston 142, respectively. As the base 110 is raised from the first position to the second position, the first return member 144 is used to drive the first piston 142 upward. Exemplarily, the first return member 144 is a first compression spring. Thus, after the downward pressure applied to the first piston 142 by the base 110 is removed, the first piston 142 can rise under the action of the first return member 144.

[0063] refer to Figure 3 、 Figure 4 、 Figure 6 and Figure 7 In some embodiments, the first piston 142 is disposed vertically, with the lower surface of the first piston 142 and the first cylinder 141 enclosing a first sealed chamber 143. The second piston 1312 is disposed horizontally, with the surface of the first piston 142 facing the base 110 and the second cylinder 1311 enclosing a second sealed chamber 1313. In this way, by disposing the first piston 142 vertically, the base 110 can be used to drive the first piston 142 to move, and by disposing the second piston 1312 horizontally, the second piston 1312 can be used to clamp the wafer 200.

[0064] refer to Figure 3 、 Figure 4 、 Figure 6 and Figure 7 In some embodiments, the second volume adjuster 131 further includes a second return member 1314. The second return member 1314 is connected to the second cylinder 1311 and the second piston 1312, respectively. When the base 110 is raised from the first position to the second position, the second return member 1314 is used to apply a force to the second piston 1312 to extend toward the base 110. In this way, when the volume of the second sealed chamber 1313 decreases, the second return member 1314 can be used to drive the second piston 1312 to move toward the base 110, thereby clamping and limiting the wafer 200.

[0065] refer to Figure 7 In some embodiments, the second cylinder 1311 is connected to the base 110 so that the clamping mechanism 130 can rise and fall synchronously with the base 110 .

[0066] In some embodiments, the clamping mechanism 130 further includes a plurality of clamping members 132. The second volume adjuster 131 is drive-connected to the clamping member 132 in a one-to-one correspondence, and the bottom surface of the clamping member 132 is positioned higher than the top surface of the base 110. During the process of the base 110 being raised from the first position to the second position, the second volume adjuster 131 drives the clamping member 132 to extend toward the wafer 200 supported on the base 110. For example, the distance between the bottom surface of the clamping member 132 and the top surface of the base 110 may be greater than 1 mm. In this way, the clamping member 132 can be prevented from interfering with the base 110 by making the bottom surface of the clamping member 132 higher than the top surface of the base 110.

[0067] In order to enable those skilled in the art to better understand the solution provided by the embodiment of the present application, the following briefly introduces the working process of the carrying device 100 with reference to the accompanying drawings.

[0068] refer to Figure 1 In some embodiments, the support mechanism 120 includes three ejector pins. The three ejector pins are detachably mounted on the bracket 150. Exemplarily, the ejector pin is made of ceramic and can be replaced when it is damaged. Exemplarily, the three ejector pins can be evenly distributed along the circumference of the base 110. Before preparing to carry the wafer, the base 110 can be driven down so that the support mechanism 120 protrudes above the base 110. It should be noted that the base 110 can be driven by a dedicated motor to be raised, lowered or rotated. The motor drives the base 110 to rise to a preset position, mainly to perform semiconductor process on the wafer at the preset position. In addition, in the process of the motor driving the base 110 to rotate, the wafer can be driven to rotate to improve the uniformity of the semiconductor process. For example, the etching uniformity of the wafer can be improved by driving the wafer to rotate.

[0069] Further, combined with Figure 1 and Figure 3 When the support mechanism 120 protrudes above the base 110 , the wafer 200 can be placed on the support mechanism 120 using a wafer transfer robot.

[0070] Further, combined with Figure 6 and Figure 7 , which can drive the base 110 upward. During the ascending process of the base 110, the first piston 142 can rise under the action of the first return member 144. This increases the volume of the first sealed cavity 143, and the fluid in the second sealed cavity 1313 flows into the first sealed cavity 143. Furthermore, the second return member 1314 drives the second piston 1312 to move toward the base 110, thereby clamping and limiting the wafer 200.

[0071] It should be noted that in some embodiments, the first volume adjuster 140 may be formed by a lifting cylinder, and the second volume adjuster 131 may be formed by a clamping cylinder. Thus, when the base 110 rises, the volume of the lifting cylinder increases, while the volume of the clamping cylinder decreases, causing the pistons of the clamping cylinders to move toward the wafer 200, thereby clamping the wafer 200.

[0072] Further, combined with Figure 9 After the wafer 200 is clamped and limited, the base 110 can be further driven to rise, so that the wafer 200 is lifted to a preset position, and the semiconductor process is performed on the wafer 200 at the preset position.

[0073] refer to Figure 10 After the semiconductor process is completed on the wafer 200, the base 110 can be driven to descend. When the base 110 descends to a preset height, the pressing member 111 and the abutting surface 1421 just abut against each other. Figure 11 After the pressing member 111 contacts the contact surface 1421, the base 110 is further driven to descend. The pressing member 111 can drive the first piston 142 to descend, so that the fluid in the first sealed chamber 143 flows into the second sealed chamber 1313. This drives the second piston 1312 to move away from the wafer 200 to release the restriction on the wafer 200. In addition, as the base 110 descends, the support mechanism 120 will protrude relative to the base 110. Figure 12 The wafer 200 can be carried on the protruding support mechanism 120. Furthermore, the wafer 200 carried on the support mechanism 120 can be taken away by a robot.

[0074] In some embodiments, the first return member 144 is a spring, wherein the spring coefficient of the first return member 144 is K1, the length of the first return member 144 is L1, the initial design of the first return member 144 is F1, and the spring coil wire diameter of the first return member 144 is d1. The second return member 1314 is a spring, wherein the spring coefficient of the second return member 1314 is K2, the length of the second return member 1314 is L2, the initial design of the second return member 1314 is F2, and the spring coil wire diameter of the second return member 1314 is d2. Note that the volume of the first sealed chamber 143 of the first volume adjuster 140 is V1, and the force-bearing area of ​​the first piston 142 is S1; the volume of the second sealed chamber 1313 of the second volume adjuster 131 is V2, and the force-bearing area of ​​the second piston 1312 is S2. According to the law of gas compression, the gas and internal spring force in the first sealed chamber 143 of the first volume adjuster 140 maintain a dynamic balance with the gas volume and internal spring force in the second sealed chamber 1313 of the three second volume adjusters 131. When the influence of external factors such as friction is ignored, V1=3V2; (K1·L1-F1·d1) / S1=3(K2·L2-F2·d2) / S2.

[0075] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0076] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A carrying device (100), characterized in that: include: A base (110), a supporting mechanism (120) and a clamping mechanism (130); The support mechanism (120) is vertically disposed on the base (110), the clamping mechanism (130) is disposed on the outer periphery of the base (110), and the base (110) can be raised and lowered relative to the support mechanism (120); When the base (110) is raised from the first position to the second position, the top of the support mechanism (120) is lower than the top of the base (110), the base (110) is used to support the wafer (200), and the clamping mechanism (130) is used to clamp the wafer (200) via the outer peripheral surface of the wafer (200); When the base (110) descends from the second position to the first position, the clamping mechanism (130) releases the wafer (200), and the top of the supporting mechanism (120) protrudes from the base (110), and the supporting mechanism (120) is used to support the wafer (200).

2. The carrying device (100) according to claim 1, characterized in that The carrying device (100) further includes a first volume adjuster (140); the clamping mechanism (130) includes a plurality of second volume adjusters (131), and the plurality of second volume adjusters (131) are arranged on the periphery of the base (110); Each of the second volume adjusters (131) is connected to the first volume adjuster (140), and the base (110) can drive the first volume adjuster (140) to move, thereby driving each of the second volume adjusters (131) to move, so as to clamp or release the wafer (200).

3. The carrying device (100) according to claim 2, characterized in that: The first volume adjuster (140) includes a first cylinder (141) and a first piston (142), wherein the first piston (142) is slidably connected to the cavity wall of the first cylinder (141), and the first piston (142) and the first cylinder (141) enclose a first sealed cavity (143); The second volume adjuster (131) comprises a second cylinder (1311) and a second piston (1312), the second piston (1312) being slidably connected to the second cylinder (1311), the second piston (1312) and the cavity wall of the second cylinder (1311) forming a second sealed cavity (1313), the second sealed cavity (1313) being in communication with the first sealed cavity (143), and the first sealed cavity (143) and the second sealed cavity (1313) containing fluid; The first cylinder (141) is connected to the support mechanism (120), and the base (110) can drive the first piston (142) to move to adjust the volume of the first sealed chamber (143) and the volume of the second sealed chamber (1313).

4. The carrying device (100) according to claim 3, characterized in that: The first piston (142) is provided with an abutting surface (1421), and the abutting surface (1421) is arranged upward. When the base (110) is located between the first position and the second position, the base (110) abuts against the abutting surface (1421).

5. The carrying device (100) according to claim 4, characterized in that: The base (110) is connected to a pressing member (111), and when the base (110) is located between the first position and the second position, the pressing member (111) abuts against the abutting surface (1421).

6. The carrying device (100) according to claim 3, characterized in that: The first volume adjuster (140) further includes a first reset member (144), and the first reset member (144) is respectively connected to the first cylinder (141) and the first piston (142); During the process of the base (110) rising from the first position to the second position, the first restoring member (144) is used to drive the first piston (142) to rise.

7. The carrying device (100) according to claim 3, characterized in that The first piston (142) is vertically arranged, and the lower surface of the first piston (142) and the first cylinder body (141) enclose the first sealed cavity (143); The second piston (1312) is arranged horizontally, and the surface of the first piston (142) facing the base (110) and the second cylinder body (1311) form the second sealed chamber (1313).

8. The carrying device (100) according to claim 7, characterized in that: The second volume adjuster (131) further includes a second return member (1314), and the second return member (1314) is respectively connected to the second cylinder (1311) and the second piston (1312); During the process of the base (110) rising from the first position to the second position, the second restoring member (1314) is used to apply a force to the second piston (1312) extending toward the base (110).

9. The carrying device (100) according to claim 3, characterized in that: The second cylinder (1311) is connected to the base (110) so that the clamping mechanism (130) can be raised and lowered synchronously with the base (110).

10. The carrying device (100) according to claim 3, characterized in that: The fluid is air.

11. The carrying device (100) according to claim 2, characterized in that: The clamping mechanism (130) further comprises a plurality of clamping members (132), the second volume adjusters (131) being drivingly connected to the clamping members (132) in a one-to-one correspondence, and the bottom surfaces of the clamping members (132) are located higher than the top surface of the base (110); During the process of the base (110) being raised from the first position to the second position, the second volume adjuster (131) drives the clamping member (132) to extend toward the wafer (200) supported on the base (110).

12. A semiconductor process equipment, characterized in that: A carrying device (100) comprising any one of claims 1 to 11.

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