A dual crystal bonding table vibration plate loading crystal bonding machine

Abstract

The present application relates to a dual-soldering table vibration plate feeding and solidifying machine, and relates to the technical field of solidifying machines, which includes a discharge device and a loading device arranged on a workbench, wherein the discharge device includes a vibration plate, a straight vibration plate and a discharge table, and the loading device includes a fixed frame, two solidifying tables, multiple swing arms and a picking assembly, and also includes a discharge table equipped with a negative pressure pipe, a blowing pipe and various sensors, an anti-shake structure, a material separation component and a visual detector, and a picking assembly composed of a suction head and a first rotating motor. The present application achieves the goal of achieving efficient loading and solidifying of semiconductor wafers, ensures accurate transportation, positioning and installation of semiconductor wafers through reasonable structural design and component coordination, uses sensors and visual detectors to improve operational accuracy and reduce errors, and has functions such as vibration reduction and material separation to improve overall working stability and efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of crystal bonding machines, and in particular to a crystal bonding machine with dual crystal bonding tables and vibration plates for loading. Background Art

[0002] In the field of die bonders, with the rapid development of industries like electronics manufacturing, the requirements for loading and bonding efficiency, as well as precision, are becoming increasingly stringent. Efficient and stable die bonders can improve production speed and product quality, reduce production costs, and play a vital role in improving overall production efficiency. Furthermore, the continuous miniaturization and high performance of electronic devices poses greater challenges to the adaptability and precision of die bonders. Therefore, the development of more advanced die bonders has become a key requirement for industry development. These not only meet current production needs but also have a positive impact on promoting the advancement of the entire electronics manufacturing industry.

[0003] In the related art, the loading method of the crystal bonder adopts a single loading channel. This method can only supply semiconductor wafers to one crystal bonder at a time, which means that only one crystal bonder can complete the loading operation within a period of time, affecting production efficiency. Summary of the Invention

[0004] In order to improve production efficiency, the present application provides a dual crystal bonding table vibration plate loading crystal bonding machine.

[0005] A dual-soldering table vibration plate loading crystal bonding machine, comprising a workbench, on which a discharging device and a loading device are arranged;

[0006] The discharging device includes:

[0007] A vibration plate connected to the workbench, on which semiconductor wafers for loading are placed;

[0008] The straight vibration plate is detachably connected to the vibration plate. The straight vibration plate is connected to two limiting plates. The two limiting plates cooperate with the straight vibration plate to form a limiting groove. An angle of 5°-10° is set between the straight vibration plate and the workbench.

[0009] The unloading table is connected to the straight vibration plate. A unloading trough is provided on the unloading table. The semiconductor wafer slides along the straight vibration plate into the unloading trough.

[0010] The loading device includes:

[0011] a fixed frame connected to the workbench;

[0012] Two crystal bonding tables are connected to the workbench. The crystal bonding tables are located on both sides of the straight vibration plate, and a crystal bonding box is provided on the crystal bonding table.

[0013] Multiple swing arms are connected to the fixed frame, and the swing arms are located between the corresponding crystal bonding table and the straight vibration plate;

[0014] The material picking assembly is connected to the swing arm, and the swing arm transfers the semiconductor wafers in the material trough to the loading plate through the material picking assembly.

[0015] By adopting the above technical solution, the workbench is provided with a discharging device and a loading device, and the semiconductor wafers are transported by using a vibration plate and a straight vibration plate. A limiting groove is provided on the straight vibration plate to ensure orderly transportation of the semiconductor wafers. By setting a specific angle, the sliding of the semiconductor wafers is facilitated. The discharge table is provided with a discharge groove for the convenience of the semiconductor wafers to stay. It is equipped with two crystal bonding tables and swing arms, which can enable multiple swing arms to work independently and alternately, realize dual-station parallel operation, reduce equipment idle time, and improve the loading efficiency of the crystal bonding box.

[0016] Optionally, the discharge table is integrally connected to the straight vibration plate, and the discharge table is connected to two negative pressure tubes, and the axes of the two negative pressure tubes are perpendicular to each other, the opening of each negative pressure tube is flush with the inner wall of the discharge trough, and the negative pressure tube is connected to a negative pressure fan through a pipeline.

[0017] By adopting the above technical solution, the unloading table and the straight vibration plate are connected as one piece, making the structure more stable, facilitating the smooth sliding of the semiconductor wafers from the straight vibration plate to the unloading trough; the two negative pressure tubes, which are perpendicular to each other and whose openings are flush with the inner wall of the unloading trough, can effectively adsorb the semiconductor wafers in the unloading trough under the action of the negative pressure fan, so that the semiconductor wafers slide toward the inner wall corner of the unloading trough, thereby improving the accuracy of semiconductor wafer positioning.

[0018] Optionally, the discharge table is connected to a blowing pipe, which is connected to a hair dryer through a pipeline; the inner wall of the discharge trough is connected to a first fiber optic sensor, which is electrically connected to the negative pressure fan and the hair dryer, and the first fiber optic sensor is used to detect whether there are semiconductor wafers in the discharge trough.

[0019] By adopting the above technical solution, a discharging device and a loading device are set on the workbench, and the semiconductor wafer is placed on the vibration plate. The semiconductor wafer slides to the discharge trough of the discharge table through the straight vibration plate limiting trough. The discharge table is integrally connected to the straight vibration plate and has two vertical negative pressure tubes to adsorb the semiconductor wafer. The discharge table is connected to the blowing pipe and the hair dryer through the pipe. When the first optical fiber sensor on the inner wall of the discharge trough detects the semiconductor wafer, it is electrically connected to the negative pressure fan and the hair dryer, triggering the simultaneous start of the two. The blowing pipe assists in pushing the semiconductor wafer to fit the negative pressure port, thereby improving the adsorption efficiency of the semiconductor wafer, so that the semiconductor wafer can accurately reach the specified position, preparing for the subsequent swing arm to transfer the semiconductor wafer to the loading plate through the material picking component, thereby improving the overall loading accuracy and efficiency.

[0020] Optionally, a second fiber optic sensor is connected to the discharge table on the same side wall of the negative pressure tube, and the second fiber optic sensor is electrically connected to the swing arm and the blower, wherein the second fiber optic sensor is used to detect whether the semiconductor wafer in the discharge trough slides to a predetermined position.

[0021] By adopting the above technical solution, the first fiber optic sensor connected to the inner wall of the discharge trough can detect whether there are semiconductor wafers in the discharge trough. The second fiber optic sensor connected to the same side wall of the negative pressure tube of the discharge table is electrically connected to the swing arm and the hair dryer, and can detect whether the semiconductor wafer in the discharge trough slides to the predetermined position. In this way, it can be ensured that the hair dryer is controlled to stop working in time after the semiconductor wafer in the discharge trough is accurately in place, and the semiconductor wafer is fixed only by negative pressure, avoiding the semiconductor wafer from shifting due to wind interference, thereby improving the loading accuracy and reliability, and ensuring the stable and efficient operation of the crystal bonding machine.

[0022] Optionally, the unloading table is connected to a fixed column, which is connected to the workbench, and a first connecting groove is provided on the unloading table, in which a first anti-shake plate is provided, and the first anti-shake plate is connected to the inner wall of the first connecting groove through a first vibration-damping spring; the first anti-shake plate is connected to a limiting plate on the side close to the workbench, and the first anti-shake plate is rotatably connected to a connecting plate, and the connecting plate abuts against the limiting plate; a second connecting groove is provided on the straight vibration plate, in which a second anti-shake plate is provided, and the second anti-shake plate is connected to the inner wall of the second connecting groove through a second vibration-damping spring, and the second anti-shake plate is rotatably connected to the connecting plate on the side close to the workbench.

[0023] By adopting the above technical solution, the vibration reduction system composed of the first vibration reduction spring, the second vibration reduction spring and the connecting plate can absorb and consume the vibration energy transmitted by the straight vibration plate, reduce the amplitude of the semiconductor wafers in the discharge trough, and ensure the stability of negative pressure adsorption. At the same time, the components are connected by screws for easy maintenance and replacement.

[0024] Optionally, a silicone damping block is connected to one side of the straight vibration plate close to the unloading platform, and the silicone damping block abuts against the unloading platform.

[0025] By adopting the above technical solution, the silicone damping block can block the vibration transmission between the straight vibration plate and the discharge table, reduce resonance, reduce the amplitude of the semiconductor wafers in the discharge trough, ensure the stability of negative pressure adsorption, and reduce the friction loss between the straight vibration plate and the discharge table.

[0026] Optionally, a strip groove is provided on the straight vibration plate between the two limiting plates, a plurality of dividing springs are connected to the bottom of the strip groove, a dividing plate is connected to the dividing spring, and a plurality of arc-shaped dividing blocks are provided on the dividing plate; a cover plate is provided in the strip groove of the straight vibration plate, a plurality of openings corresponding to the dividing blocks are provided on the cover plate, the cover plate is provided on the dividing plate, and the dividing blocks pass through the openings.

[0027] By adopting the above technical solution, a strip groove is opened on the straight vibration plate, the bottom of the groove is connected to the dividing spring and the dividing plate, and the dividing plate is provided with an arc-shaped dividing block. When the semiconductor wafer slides over the straight vibration plate, the stacked semiconductor wafers press the arc-shaped dividing block to sink and compress the dividing spring. After the single-layer semiconductor wafer passes, the dividing spring lifts the dividing block to reset and the dividing block protrudes from the cover plate, which can prevent the semiconductor wafer from being flipped over by the dividing block. At the same time, the arc structure guides the semiconductor wafer to slide along the edge of the dividing block, forcibly separating the stacked body; a cover plate is arranged in the strip groove of the straight vibration plate, and the cover plate has an opening corresponding to the dividing block and the dividing block passes through the opening, which can play a certain protective and limiting role, ensuring that the dividing block works normally to separate the stacked semiconductor wafers.

[0028] Optionally, a first visual detector is provided on the fixed frame above the discharge table, and the first visual detector is used to detect the shape of the semiconductor wafers in the discharge trough; a second visual detector is provided on the fixed frame above the crystal bonding table, and the second visual detector is electrically connected to the swing arm, and the second visual detector is used to detect the position on the crystal bonding box where the semiconductor wafer can be installed, and to control the position of the swing arm on the crystal bonding box.

[0029] By adopting the above technical solution, the first visual detector can detect the shape of the semiconductor wafer in the discharge trough, which is convenient for the subsequent accurate adsorption and adjustment of the semiconductor wafer posture; the second visual detector can determine the position on the crystal bonding box where the semiconductor wafer can be installed, and control the position of the swing arm on the crystal bonding box to achieve precise placement of the semiconductor wafer. The parallel operation of the two stations can reduce the idle time of the equipment and improve work efficiency. The visual sensing forms a closed-loop control to avoid manual intervention.

[0030] Optionally, the material picking assembly includes a suction head and a first rotating motor; the suction head is rotatably connected to the swing arm, the suction head is connected to a suction cylinder through a pipe, and the suction cylinder is electrically connected to the first and second visual detectors; the first rotating motor is connected to the swing arm, the suction head is axially sleeved with an anti-slip wheel, the output shaft of the first rotating motor is connected to the anti-slip wheel through a belt, and the first rotating motor is electrically connected to the first and second visual detectors.

[0031] By adopting the above technical solution, the suction head can absorb the semiconductor wafers in the discharge trough under the action of the suction cylinder, and the first rotating motor can drive the suction head to rotate through the belt and anti-slip pulley to correct the placement posture of the semiconductor wafer, and the suction cylinder and the first rotating motor are electrically connected to the first and second visual detectors. The suction and semiconductor wafer posture adjustment can be accurately controlled according to the semiconductor wafer shape detected by the visual detector and the position where the semiconductor wafer can be installed on the crystal bonding box, thereby improving the accuracy and efficiency of the crystal bonding machine loading.

[0032] In summary, this application includes at least one of the following beneficial technical effects:

[0033] 1. The dual crystal bonding stations and dual swing arms design enables multiple swing arms to work independently and alternately, reducing equipment idle time and improving the efficiency of loading the crystal bonding cassettes on the crystal bonding stations. This solves the problem that the existing single-channel loading can only feed one crystal bonding station, affecting production efficiency.

[0034] 2. The negative pressure tube and the blowing tube are coordinated. The negative pressure tube is arranged vertically to absorb the semiconductor wafer to the inner corner of the discharge trough. The blowing tube assists in pushing the semiconductor wafer to fit the negative pressure port. The optical fiber sensor detects and controls, combined with visual polarity correction, to improve the loading accuracy.

[0035] 3. The straight vibration plate and the discharge table are equipped with vibration reduction, anti-shake structures and silicone damping blocks to reduce the amplitude of the semiconductor wafers in the discharge trough and ensure the stability of negative pressure adsorption. The separation spring and arc-shaped separation block of the straight vibration plate can forcibly separate the stacked semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application;

[0037] Figure 2 This is a schematic diagram of the structure of the vibration disk and the straight vibration plate of Example 1 of the present application;

[0038] Figure 3 yes Figure 2 A partial enlarged schematic diagram of part A;

[0039] Figure 4 yes Figure 1 A partial enlarged schematic diagram of part B;

[0040] Figure 5 Schematic diagram of the structure of the drive motor group of Example 1 of the present application;

[0041] Figure 6 Schematic diagram of the structure of the drive motor group of Example 1 of the present application;

[0042] Figure 7 This is a schematic diagram of the overall structure of Example 2 of the present application;

[0043] Figure 8 yes Figure 7 A partial enlarged schematic diagram of part C in the middle;

[0044] Figure 9 This is a schematic diagram of the structure of the vibration disk and the straight vibration plate of Example 2 of the present application;

[0045] Figure 10 yes Figure 9 A partial enlarged schematic diagram of part D in the middle;

[0046] Figure 11 yes Figure 9 The schematic diagram of the cross-sectional structure along the AA surface mainly shows the strip grooves.

[0047] Description of the drawings: 1. Workbench; 2. Crystal bonding table; 3. Crystal bonding box; 4. Vibration plate; 5. Straight vibration plate; 6. Material limit plate; 7. Material discharge table; 8. Material discharge trough; 9. Negative pressure pipe; 10. Negative pressure fan; 11. Blowing pipe; 12. Blower; 13. First fiber optic sensor; 14. Second fiber optic sensor; 15. Fixing frame; 1501. Mounting plate; 1502. Fixing plate; 16. Lifting motor; 17. Second rotating motor; 18. Rotating table; 19. Lifting frame; 1901. First lifting platform; 1902. First lifting block; 1903. Second lifting platform; 1904. Second lifting block; 20. Swing arm; 2001 , fixed frame; 2002, swing frame; 21, suction head; 22, suction joint; 23, suction cylinder; 24, anti-skid wheel; 25, first rotating motor; 26, first visual detector; 27, second visual detector; 28, fixed column; 29, first connecting groove; 30, first damping spring; 31, first connecting block; 32, first anti-shake plate; 33, limit plate; 34, connecting plate; 35, second connecting groove; 36, second damping spring; 37, second connecting block; 38, second anti-shake plate; 39, silicone damping block; 40, strip groove; 41, dividing spring; 42, dividing plate; 43, dividing block; 44, cover plate. DETAILED DESCRIPTION

[0048] The following is combined with Figure 1 -Attached Figure 11 , further details of this application are given. Embodiment 1:

[0049] A dual crystal bonding table vibration plate loading crystal bonding machine, refer to Figure 1 The device comprises a workbench 1 and two bonding stations 2 fixedly connected to its upper end surface. The workbench 1 is provided with a discharge device and a loading device, with the two bonding stations 2 located on either side of the discharge device. A bonding cassette 3, a tray for holding semiconductor wafers, is placed on the upper end surface of the bonding station 2. The discharge device is used to sequentially discharge the stacked semiconductor wafers, while the loading device is used to grab the semiconductor wafers discharged by the discharge device and install them in the bonding cassette 3 on the bonding station 2.

[0050] Reference Figure 1 、 Figure 2The discharge device includes a vibrating plate 4 fixedly connected to the workbench 1. A number of semiconductor wafers are placed in the vibrating plate 4, and the semiconductor wafers slide along the discharge trough of the vibrating plate 4 toward the discharge port of the vibrating plate 4. A straight vibration plate 5 is fixedly connected to the discharge port of the vibrating plate 4, wherein an angle of 5°-10° (preferably 7°) is set between the straight vibration plate 5 and the workbench 1, so that the straight vibration plate 5 is tilted from the discharge port of the vibrating plate 4 toward the workbench 1. At the same time, the surface of the straight vibration plate 5 is coated with a wear-resistant layer to prevent friction damage.

[0051] Two limiting plates 6 are fixedly connected to the upper end of the straight vibration plate 5. These two limiting plates 6 and the upper end of the straight vibration plate 5 cooperate to form a limiting trough, along which the semiconductor wafers on the vibrating disk 4 can slide under the continuous vibration of the vibrating disk 4. A discharge platform 7 is fixedly connected to the end of the straight vibration plate 5 away from the vibrating disk 4. The upper end of the discharge platform 7 is flush with the straight vibration plate 5, and a discharge trough 8 is defined on the discharge platform 7. The size of the discharge trough 8 is larger than that of the semiconductor wafer, allowing the semiconductor wafer to slide along the surfaces of the straight vibration plate 5 and the discharge platform 7 and fall smoothly into the discharge trough 8.

[0052] Reference Figure 1 、 Figure 2 、 Figure 3 , two negative pressure tubes 9 are embedded on the discharge table 7. One of the negative pressure tubes 9 is located on the side of the discharge table 7 away from the straight vibration plate 5, and the opening of the negative pressure tube 9 is flush with the inner wall of the discharge trough 8. The other negative pressure tube 9 is located on the side wall of the discharge table 7, and the opening of the negative pressure tube 9 is flush with the inner wall of the discharge trough 8, and the axes of the two negative pressure tubes 9 are located in the same plane and perpendicular to each other. A negative pressure fan 10 is connected to the workbench 1, and the two negative pressure tubes 9 are both connected to the negative pressure fan 10. When the negative pressure fan 10 is started, the two negative pressure tubes 9 can simultaneously adsorb the semiconductor wafers in the discharge trough 8, so that the semiconductor wafers in the discharge trough 8 slide toward the inner wall corner of the discharge trough 8, and the adsorption force of the two negative pressure tubes 9 is consistent.

[0053] A blowing pipe 11 is embedded on the side of the discharge table 7 opposite to one of the negative pressure tubes 9, and the opening of the blowing pipe 11 is flush with the inner wall of the discharge trough 8. At the same time, the blowing pipe 11 is connected to a blower 12, and the blower 12 is fixedly connected to the workbench 1. The blower 12 blows air toward the discharge trough 8 through the blowing pipe, thereby pushing the semiconductor wafers entering the discharge trough 8 toward the negative pressure tube 9, thereby improving the adsorption efficiency of the semiconductor wafers. In addition, a first fiber optic sensor 13 is embedded on the inner wall of the discharge trough 8 opposite to the negative pressure tube 9, and the first fiber optic sensor 13 is electrically connected to the negative pressure blower 10 and the blower 12. In addition, a second fiber optic sensor 14 is embedded on the same inner wall of the discharge trough 8 and the negative pressure tube 9, and the second fiber optic sensor 14 is electrically connected to the blower 12. Among them, when the semiconductor wafer falls into the discharge trough 8, the first fiber optic sensor 13 is triggered and sends an electrical signal to the negative pressure fan 10 and the hair dryer 12, so that the negative pressure fan 10 and the hair dryer 12 are turned on synchronously. When the semiconductor wafer is adsorbed by the negative pressure tube 9 and the two second fiber optic sensors 14 are blocked and triggered, the second fiber optic sensor 14 sends an electrical signal to the hair dryer 12, thereby stopping the hair dryer 12 from working.

[0054] Reference Figure 1 The loading device includes a fixed frame 15 fixedly connected to the workbench 1, wherein the fixed frame 15 includes a mounting plate 1501 and two fixing plates 1502, the two fixing plates 1502 are fixedly connected to the workbench 1, and the mounting plate 1501 is fixedly connected to one end of the fixing plate 1502 away from the workbench 1, and the mounting plate 1501 is located above the crystal bonding table 2 and the unloading table 7.

[0055] Reference Figure 1 、 Figure 4 、 Figure 5 Two sets of drive motor groups are fixedly connected to the upper end surface of the mounting plate 1501, and the drive motor groups are located between the crystal bonding table 2 and the unloading table 7 on the corresponding side. At the same time, each set of drive motor groups includes a second rotating motor 17.

[0056] Reference Figure 5 、 Figure 6The rotating shaft of the second rotating motor 17 is fixedly connected to the rotating platform 18 of the lifting frame 19. Two symmetrically arranged first lifting platforms 1901 and two second lifting platforms 1903 are fixedly connected to either side of the rotating platform 18. Each first lifting platform 1901 is slidably connected to a first lifting block 1902. Each first lifting block 1902 is fixedly connected to a second lifting block 1904, and each second lifting block 1904 is slidably connected to the corresponding second lifting platform 1903. Furthermore, two lifting motors 16 are fixedly connected to the side of the rotating platform 18. The output rod of each lifting motor 16 is fixedly connected to the corresponding first lifting platform 1901, allowing each lifting motor 16 to drive a first lifting block 1902 and a second lifting block 1904 to slide.

[0057] The second lifting block 1904 is fixedly connected to the swing arm 20. The swing arm 20 includes a fixed frame 2001 that is slidably connected to the second lifting platform 1903. The fixed frame 2001 is fixedly connected to a swing frame 2002 on the side close to the crystal bonding platform 2. The end of the swing frame 2002 is rotatably connected to a suction head 21. The end of the suction head 21 away from the workbench 1 is rotatably connected to a suction joint 22. The suction joint 22 is connected to a suction cylinder 23 through a pipe, and the suction cylinder 23 is fixedly connected to the mounting plate 1501. The suction cylinder 23 has two working modes: suction and air jet. The suction head 21 is axially sleeved with an anti-slip wheel 24, and a first rotating motor 25 is fixedly connected inside the fixed frame 2001. The output shaft of the first rotating motor 25 is connected to the outer surface of the anti-slip wheel 24 through a belt.

[0058] Reference Figure 2 、 Figure 3 、 Figure 5 The fixed frame 15 is fixedly connected to a first visual detector 26 above the discharge table 7, and the first visual detector 26 is electrically connected to the first rotating motor 25, the second rotating motor 17, the lifting motor 16, and the suction cylinder 23. The first visual detector 26 is used to detect the shape of the semiconductor wafers in the discharge trough 8. In addition, the fixed frame 15 is fixedly connected to a second visual detector 27 above the corresponding crystal bonding table 2. The second visual detector 27 is electrically connected to the first rotating motor 25, the second rotating motor 17, the lifting motor 16, and the suction cylinder 23. The second visual detector 27 is used to determine the position on the crystal bonding box 3 where the semiconductor wafer can be installed, and to control and monitor the position of the suction head 21 on the crystal bonding box 3.

[0059] During operation, when the first visual detector 26 detects the presence of a semiconductor wafer in the discharge chute 8, it drives one of the second rotary motors 17 to rotate the corresponding swing arm 20 toward the discharge table 7, while the other second rotary motor 17 rotates the corresponding swing arm 20 away from the discharge table 7. These two second rotary motors 17 rotate synchronously, in the same direction and at the same angle. Furthermore, after one swing arm 20 completes its operation, the second rotary motor 17 can rotate the other, unused swing arm 20 back to the discharge chute 8. This reduces the need for repeated use of a single swing arm 20 and increases its service life.

[0060] The first visual detector 26 monitors the position of the swing arm 20 and brings the suction head 21 on the swing arm 20 close to the semiconductor wafer in the discharge trough 8. The first visual detector 26 then drives the suction motor to absorb the semiconductor wafer in the discharge trough 8. After absorption, the first visual detector 26 checks the positive and negative poles of the semiconductor wafer. If the positive and negative poles of the semiconductor wafer are facing opposite directions, the first rotary motor 25 is driven to cause the suction head 21 to rotate the semiconductor wafer, thereby correcting the semiconductor wafer's placement. Simultaneously, when the swing arm 20 moves to the appropriate position, the suction cylinder 23 changes its operating mode and blows the semiconductor wafer into the die bonder 3.

[0061] When the swing arm 20, which holds the semiconductor wafer, rotates onto the die bonding table 2, the second visual detector 27 controls the swing arm 20 to a position suitable for mounting on the die bonding cassette 3. During this transfer, the second visual detector 27 continuously drives the first rotation motor 25 to adjust the semiconductor wafer's position. Simultaneously, the other swing arm 20, which holds the semiconductor wafer, rotates onto the transfer table and, under the guidance and detection of the first visual detector 26, picks up a newly dropped semiconductor wafer from the discharge chute 8, then repeats the aforementioned operation. The four swing arms 20 operate independently and alternately, thereby improving the efficiency of loading the die bonding cassette 3 onto the die bonding table 2.

[0062] The operating principle of Example 1 of the present application is as follows: efficient and accurate loading is achieved through the alternating operation of dual swing arms 20 and visual closed-loop control. When a semiconductor wafer slides into the discharge trough 8 through the limiting slots of the vibrating plate 4 and the straight vibration plate 5, the first fiber optic sensor 13 triggers the simultaneous activation of the negative pressure blower 10 and the blower 12. The dual negative pressure tubes 9 (in a vertical arrangement) attract the semiconductor wafer to the inner corner of the discharge trough 8, and the blower tube 11 assists in pushing the semiconductor wafer into contact with the negative pressure port. The second fiber optic sensor 14 detects that the semiconductor wafer is in place and shuts off the blower 12, leaving only the negative pressure stationary.

[0063] Furthermore, a first visual detector 26 can be used to identify the position and polarity of semiconductor wafers. By controlling one of the swing arms 20 to rotate toward the discharge chute 8, the suction head 21 absorbs the semiconductor wafer. If the polarity of the semiconductor wafer reverses, the first rotary motor 25 is driven to rotate the suction head 21 to correct the position. A second visual detector 27 scans the empty spaces in the die bonder cassette 3, guiding the swing arm 20 to precisely place the semiconductor wafer in the target position. Simultaneously, the other swing arm 20 performs the same operation on the other die bonder 2. The two swing arms 20 operate independently and seamlessly.

[0064] Dual-station parallel operation reduces equipment idle time, thereby improving work efficiency. Furthermore, negative pressure / air blowing collaborative positioning, combined with visual polarity correction, enhances loading accuracy. Finally, fiber optics and visual sensing form a closed-loop control loop, eliminating manual intervention. Example 2:

[0065] A dual crystal bonding table vibration plate loading crystal bonding machine, refer to Figure 7 、 Figure 8 The difference between it and Example 1 is that a fixing column 28 is fixedly connected to the side of the unloading table 7 close to the workbench 1, and the fixing column 28 is fixedly connected to the workbench 1 by screws, and a first connecting groove 29 is opened on the side of the unloading table 7 close to the crystal bonding table 2, and a first shock-absorbing spring 30 is fixedly connected to the inner wall of the first connecting groove 29 opposite to the workbench 1.

[0066] Reference Figure 7 、 Figure 9 、 Figure 10 The end of the first damping spring 30 is fixedly connected to a first connecting block 31, which is screwed to a first anti-shake plate 32. The first anti-shake plate 32 is fixedly connected to a limit plate 33 on the side closest to the workbench 1. The first anti-shake plate 32 is rotatably connected to a connecting plate 34 above the limit plate 33, and the connecting plate 34 abuts the limit plate 33.

[0067] A second connecting groove 35 is defined on the side of the straight vibration plate 5 near the crystal bonding table 2. A second damping spring 36 is fixedly connected to the inner wall of the second connecting groove 35 opposite the workbench 1. The end of the second damping spring 36 is fixedly connected to a second connecting block 37. This second connecting block 37 is screwed to a second anti-shake plate 38. The end of the second anti-shake plate 38 near the workbench 1 is rotatably connected to the other end of the connecting plate 34. Furthermore, a silicone damping block 39 is fixedly connected to the side of the straight vibration plate 5 near the unloading table 7. This abuts against the unloading table 7, reducing frictional losses between the straight vibration plate 5 and the unloading table 7 while further minimizing the impact of the vibration of the straight vibration plate 5 on the unloading table 7.

[0068] Reference Figure 8 、 Figure 11, the straight vibration plate 5 is provided with a strip groove 40 between the two limiting plates 6, and the width of the strip groove 40 is smaller than the width of the semiconductor wafer. A number of dividing springs 41 are fixedly connected to the bottom of the strip groove 40, and the end of the dividing spring 41 is fixedly connected to the dividing plate 42. The size of the dividing plate 42 matches the size of the strip groove 40, and a gap of 5-10mm is provided between the dividing plate 42 and the inner wall of the strip groove 40. The dividing plate 42 is fixedly connected to a number of arc-shaped dividing blocks 43 made of rubber material on the side away from the workbench 1. In addition, the dividing plate 42 is covered with a cover plate 44, and the cover plate 44 is provided with a number of openings corresponding to the dividing blocks 43. At the same time, the cover plate 44 is fixed to the inner wall of the strip groove 40 with a snap, and the surface of the cover plate 44 is flush with the upper end face of the straight vibration plate 5. The dividing block 43 passes through the opening, and the length of the part protruding from the upper end face of the straight vibration plate 5 is 5mm.

[0069] The operating principle of Example 2 of the present application is as follows: the vibration energy of the straight vibration plate 5 is first transmitted to the material distribution spring 41 to buffer the impact of the semiconductor wafers, then transmitted to the second vibration damping spring 36 to absorb the vibration of the straight vibration plate 5, and then transmitted through the connecting plate 34 lever to the first anti-shake plate 32. Finally, the first vibration damping spring 30 dissipates the remaining energy. The silicone damping block 39 blocks the vibration transmission between the straight vibration plate 5 and the unloading platform 7, reducing resonance. This reduces the amplitude of the semiconductor wafers in the unloading chute 8 and ensures the stability of negative pressure adsorption. At the same time, these components are connected by screws to facilitate maintenance and replacement.

[0070] In addition, when the semiconductor wafer slides over the straight vibration plate 5, the stacked semiconductor wafers press the arc-shaped dividing block 43 to sink, thereby compressing the dividing spring 41. Then, after the single-layer semiconductor wafer passes, the dividing spring 41 lifts the dividing block 43 to reset it and the dividing block 43 protrudes 445mm from the cover plate, thereby preventing the semiconductor wafer from being flipped over by the dividing block 43. At the same time, the arc-shaped structure guides the semiconductor wafer to slide along the edge of the dividing block 43, forcing the stack to separate.

[0071] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A dual crystal bonding table vibration plate loading crystal bonding machine, comprising a workbench (1), characterized in that: The workbench (1) is provided with a discharging device and a loading device; The discharging device comprises: A vibration plate (4) is connected to the workbench (1), and a semiconductor wafer for loading is placed on the vibration plate (4); A straight vibration plate (5) is detachably connected to the vibration disk (4); the straight vibration plate (5) is connected to two material limiting plates (6); the two material limiting plates (6) cooperate with the straight vibration plate (5) to form a material limiting groove; an angle of 5°-10° is set between the straight vibration plate (5) and the workbench (1); A discharge platform (7) is connected to the straight vibration plate (5), and a discharge trough (8) is provided on the discharge platform (7), and the semiconductor wafer slides along the straight vibration plate (5) into the discharge trough (8); The feeding device comprises: A fixed frame (15) connected to the workbench (1); Two crystal-bonding tables (2) are connected to the workbench (1), the crystal-bonding tables (2) are respectively located on both sides of the straight vibration plate (5), and a crystal-bonding box (3) is provided on the crystal-bonding tables (2); A plurality of swing arms (20) are connected to the fixing frame (15), and the swing arms (20) are located between the corresponding crystal fixing tables (2) and the straight vibration plates (5); The material taking component is connected to the swing arm (20), and the swing arm (20) transfers the semiconductor wafers in the discharge trough (8) to the loading plate through the material taking component.

2. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 1, characterized in that: The discharge platform (7) is integrally connected to the straight vibration plate (5), and the discharge platform (7) is connected to two negative pressure pipes (9), and the axes of the two negative pressure pipes (9) are perpendicular to each other. The opening of each negative pressure pipe (9) is flush with the inner wall of the discharge trough (8), and the negative pressure pipe (9) is connected to a negative pressure fan (10) through a pipeline.

3. The dual crystal bonding table vibration plate feeding crystal bonding machine according to claim 2, characterized in that: The material discharging platform (7) is connected to a blowing pipe (11), and the blowing pipe (11) is connected to a blower (12) through a pipeline; The inner wall of the discharge trough (8) is connected to a first optical fiber sensor (13), the first optical fiber sensor (13) is electrically connected to the negative pressure blower (10) and the blower (12), and the first optical fiber sensor (13) is used to detect whether a semiconductor wafer exists in the discharge trough (8).

4. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 3, characterized in that: The discharge platform (7) is connected to a second optical fiber sensor (14) on the same side wall as the negative pressure tube (9), and the second optical fiber sensor (14) is electrically connected to the swing arm (20) and the blower (12), wherein the second optical fiber sensor (14) is used to detect whether the semiconductor wafer in the discharge trough (8) slides to a predetermined position.

5. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 1, characterized in that: The unloading platform (7) is connected to a fixed column (28), the fixed column (28) is connected to the workbench (1), a first connecting groove (29) is provided on the unloading platform (7), a first anti-shake plate (32) is provided in the first connecting groove (29), and the first anti-shake plate (32) is connected to the inner wall of the first connecting groove (29) through a first damping spring (30); The first anti-shake plate (32) is connected to a limiting plate (33) on one side close to the workbench (1), and the first anti-shake plate (32) is rotatably connected to a connecting plate (34), and the connecting plate (34) abuts against the limiting plate (33); The straight vibration plate (5) is provided with a second connecting groove (35), a second anti-shake plate (38) is provided in the second connecting groove (35), the second anti-shake plate (38) is connected to the inner wall of the second connecting groove (35) via a second vibration-damping spring (36), and the second anti-shake plate (38) is rotatably connected to the connecting plate (34) on a side close to the workbench (1).

6. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 5, characterized in that: A silicone damping block (39) is connected to one side of the straight vibration plate (5) close to the material discharging platform (7), and the silicone damping block (39) abuts against the material discharging platform (7).

7. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 1, characterized in that: The straight vibration plate (5) is provided with a strip groove (40) between the two limiting plates (6); a plurality of material dividing springs (41) are connected to the bottom of the strip groove (40); a material dividing plate (42) is connected to the material dividing spring (41); and a plurality of arc-shaped material dividing blocks (43) are provided on the material dividing plate (42); The straight vibration plate (5) is provided with a cover plate (44) in the strip groove (40), and a number of openings corresponding to the material dividing blocks (43) are opened on the cover plate (44). The cover plate (44) is covered on the material dividing plate (42), and the material dividing blocks (43) pass through the openings.

8. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 1, characterized in that: The fixing frame (15) is provided with a first visual detector (26) above the discharge platform (7), and the first visual detector (26) is used to detect the shape of the semiconductor wafer in the discharge trough (8); The fixing frame (15) is provided with a second visual detector (27) above the crystal bonding table (2). The second visual detector (27) is electrically connected to the swing arm (20). The second visual detector (27) is used to detect the position of the semiconductor wafer on the crystal bonding box (3) and to control the position of the swing arm (20) on the crystal bonding box (3).

9. The dual crystal bonding table vibration plate loading crystal bonding machine according to claim 8, characterized in that: The material taking component comprises a material suction head (21) and a first rotating motor (25); The suction head (21) is rotatably connected to the swing arm (20), and the suction head (21) is connected to a suction cylinder (23) through a pipeline, and the suction cylinder (23) is electrically connected to the first and second visual detectors; The first rotating motor (25) is connected to the swing arm (20), the suction head (21) is axially sleeved with an anti-slip wheel (24), the output shaft of the first rotating motor (25) is connected to the anti-slip wheel (24) through a belt, and the first rotating motor (25) is electrically connected to the first and second visual detectors.

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