A mounting device for MEMS inertial navigation sensing

Abstract

This invention relates to the field of MEMS inertial navigation technology, and more particularly to a fixing device for MEMS inertial navigation sensors. The device includes a fixed base, a shock-absorbing component on the top surface of the fixed base, a support frame above the shock-absorbing component, a first leveling component inside the support frame, and a second leveling component above the first leveling component. Compared to existing technologies that rely on manual knobs or single-degree-of-freedom adjustment mechanisms, which suffer from low leveling efficiency and poor accuracy, this invention employs a dual-adjustment component design. The first leveling component uses an arc-shaped guide rail and a lead screw drive, while the second leveling component uses a bidirectional lead screw and a wedge block. Combined with real-time feedback from an electronic level and a PLC controller, this achieves automatic leveling with two degrees of freedom, achieving a leveling accuracy of ±0.005°. The entire process is automated, meeting the micro-arc-level installation requirements of MEMS sensors.

Description

Technical Field

[0001] This invention relates to the field of MEMS inertial navigation technology, and more particularly to a fixed device for MEMS inertial navigation sensing. Background Technology

[0002] With the rapid iteration of high-end equipment such as micro-drones, autonomous vehicles, and industrial robots, the accuracy requirements of MEMS inertial navigation sensors have approached the micro-radian level, and the installation stability of the sensors has become the core bottleneck restricting their performance release.

[0003] Currently, most mainstream fixing devices use single-layer silicone pads or metal springs as the main damping body. Although they can cope with low-frequency vibrations, their vibration attenuation efficiency drops sharply to less than 80% in the high-frequency band above 200Hz, and the material hardens in low-temperature environments, leading to further performance degradation.

[0004] Meanwhile, leveling mechanisms generally rely on manually operated mechanical knobs or single-degree-of-freedom electric adjustments, with leveling errors often exceeding 0.1 degrees and taking more than half an hour, making it difficult to meet the rapid response requirements of highly dynamic scenarios.

[0005] In terms of thermal management, traditional passive heat dissipation on metal substrates is prone to deformation of more than 0.1 mm under high-temperature conditions due to the mismatch of thermal expansion coefficients, causing zero-point drift of the sensor. Active cooling systems are difficult to integrate with shock-absorbing structures due to size limitations, and often require sacrificing shock absorption performance in exchange for heat dissipation capacity.

[0006] Furthermore, the clamping methods mostly employ rigid bonding or purely mechanical clamping. The former is prone to clamping force attenuation of over 30% due to adhesive fatigue, while the latter carries the risk of overpressure damage to the sensor. Although existing technologies attempt to introduce magnetorheological materials or shape memory alloys to improve vibration damping performance, they have not yet systematically solved the technical bottlenecks of broadband suppression, thermal vibration coordinated control, and rapid and accurate leveling.

[0007] To address these issues, we designed a mounting device for MEMS inertial navigation sensing. Summary of the Invention

[0008] To overcome the problems mentioned in the background art, the present invention proposes a fixed device for MEMS inertial navigation sensing.

[0009] The technical solution of the present invention is as follows: a fixing device for MEMS inertial navigation sensing, comprising a fixing base, a shock-absorbing component disposed on the top surface of the fixing base, a support frame disposed above the shock-absorbing component, a first leveling component disposed inside the support frame, the first leveling component comprising a mounting base, the top surface of the mounting base being configured as an arc-shaped concave structure, an adjusting seat disposed above the mounting base, the bottom surface of the adjusting seat being configured as an arc-shaped convex structure, an adjusting motor disposed on one side of the mounting base, an adjusting groove being formed on the top surface of the mounting base, an adjusting screw disposed inside the adjusting groove, one end of the adjusting screw being fixedly connected to the output end of the adjusting motor, a sliding block being threaded onto the adjusting screw, a limit block being disposed on the top surface of the sliding block, a steel column being disposed inside the limit block, a bracket being disposed on the bottom surface of the adjusting seat, and the steel column being rotatably connected to the bracket.

[0010] Preferably, a guide block is provided on the bottom surface of the adjustment seat, the guide block is configured as a spherical structure, a guide groove is provided on the top surface of the mounting base, multiple sets of guide blocks are provided, multiple sets of guide grooves are provided, and the guide block is disposed inside the guide groove.

[0011] Preferably, a second leveling component is provided above the first leveling component. The second leveling component includes a mounting frame, and a support frame is provided inside the mounting frame. The support frame is rotatably connected to the mounting frame via a rotating shaft. Two sets of wedge blocks are provided on the bottom surface of the support frame. A servo motor is provided on the side wall of the mounting frame. A drive screw is provided inside the mounting frame. Two sets of threads in opposite directions are provided on the drive screw. Two sets of adjusting blocks are threadedly connected to the drive screw. Both sets of adjusting blocks are trapezoidal structures. One set of adjusting blocks is located below one set of wedge blocks, and the other set of adjusting blocks is located below the other set of wedge blocks.

[0012] Preferably, the support frame has a metal layer inside, and electromagnetic blocks are provided on the side wall of the mounting base and the bottom surface of the wedge block. The electromagnetic blocks on the side wall of the mounting base are in contact with the metal layer. The adjusting block is made of metal, and an electronic level is provided on the bottom surface of the support frame.

[0013] Preferably, the support frame is provided with a pneumatic telescopic rod inside, and multiple sets of the pneumatic telescopic rod are provided. One end of the pneumatic telescopic rod is fixedly connected to the inner side wall of the support frame, and the other end of the pneumatic telescopic rod is connected to a clamping plate. An adhesive layer is provided on one side of the clamping plate, and the adhesive layer occupies 60% of the area of ​​the side wall of the clamping plate.

[0014] Preferably, the shock absorption assembly includes a mounting base, and multiple sets of mounting bases are provided. The mounting bases are configured with a Z-shaped structure, and the mounting bases are fixedly connected to the fixed base by bolts. The top end of the mounting bases is fixedly connected to the support frame.

[0015] Preferably, each of the multiple sets of mounting bases is provided with a magnetorheological damper, and each of the multiple sets of mounting bases is provided with a support column, the support column being made of either a Ni-Ti-Nb-Mo quaternary alloy or a Cu-Al-Ni ternary alloy.

[0016] Preferably, the fixed base has an internal mounting groove, and multiple sets of mounting grooves are provided. The mounting grooves are rectangular in structure, and an isolation pad is provided inside the mounting groove. The isolation pad is corrugated and made of aluminum material.

[0017] Preferably, the fixed base has a cavity inside, a magnetic coil is provided on the inner side wall of the cavity, and a magnetofluid is provided inside the cavity.

[0018] Preferably, the fixed base has a cooling channel inside, the cooling channel is configured with a serpentine structure, and the cooling channel is connected to a circulating cooling system. The circulating cooling system includes a heat exchange module, a circulating pump, a liquid storage tank, and connecting pipes. One end of the heat exchange module is connected to one end of the circulating pump through the connecting pipe, and the other end of the heat exchange module is connected to one end of the liquid storage tank through the connecting pipe. One end of the cooling channel is connected to the other end of the circulating pump through the connecting pipe, and the other end of the cooling channel is connected to the other end of the liquid storage tank through the connecting pipe.

[0019] The beneficial effects of this invention are:

[0020] 1. Compared with existing technologies that rely on manual knobs or single-degree-of-freedom adjustment mechanisms, which have the disadvantages of low leveling efficiency and poor accuracy, this solution adopts a dual-adjustment component collaborative design. The first leveling component uses an arc-shaped guide rail + lead screw drive, and the second leveling component uses a bidirectional lead screw + wedge block scheme. Combined with real-time feedback from an electronic level and a PLC controller, it realizes dual-degree-of-freedom automatic leveling with a leveling accuracy of ±0.005°. Moreover, the entire process is automated, meeting the micro-arc level installation requirements of MEMS sensors.

[0021] 2. Compared with existing technologies that use passive heat dissipation and rigid fixed structures, which have the disadvantage of a sharp drop in accuracy at high temperatures due to thermal expansion stress concentration, this solution integrates a closed-loop system of spiral cooling channels and corrugated aluminum isolation pads, combined with shape memory alloy support columns. The base flatness error is ≤0.01mm at a high temperature of 125℃, completely eliminating sensor zero-position drift caused by thermal stress.

[0022] 3. Compared with existing technologies that use rigid bolts or pure adhesive bonding, which have the disadvantages of easy attenuation of clamping force and damage to the sensor during disassembly, this solution is designed with a pneumatic telescopic rod drive + gradient adhesive layer (100% rigid bonding at the center + 60% flexible contact at the edges). Through dynamic clamping force compensation and modulus gradient design, it not only ensures impact resistance and stability, but also achieves non-destructive peeling of the adhesive layer, which is convenient for maintenance and replacement.

[0023] 4. Compared with existing technologies that use a single silicone pad or metal spring for vibration damping, which have the disadvantages of insufficient high-frequency vibration attenuation and material hardening failure under low-temperature conditions, this solution uses a composite structure of magnetorheological damper and shape memory alloy. Through the synergistic effect of magnetic field-controlled shear stress and phase change energy absorption, it achieves a 98% vibration attenuation rate in a wide frequency range of 200-3000Hz within a temperature range of -60-200℃, without the risk of low-temperature brittle failure, significantly improving the vibration damping stability under extreme environments. Attached Figure Description

[0024] Figure 1 The diagram shown is a three-dimensional structural schematic of the fixing device for MEMS inertial navigation sensing according to the present invention.

[0025] Figure 2 The diagram shown is a three-dimensional side cross-sectional view of the adjustment seat in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0026] Figure 3 The diagram shown is a three-dimensional side cross-sectional view of the guide groove in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0027] Figure 4 The diagram shown is a three-dimensional side cross-sectional view of the fixing device for MEMS inertial navigation sensing according to the present invention.

[0028] Figure 5 The diagram shown is a three-dimensional side cross-sectional view of the mounting frame in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0029] Figure 6 The diagram shown is a cross-sectional perspective view of the fixing base in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0030] Figure 7 The diagram shown is a schematic representation of the structure of the circulating cooling system in the fixed device for MEMS inertial navigation sensing according to the present invention.

[0031] Figure 8 The diagram shown is a three-dimensional schematic representation of the internal structure of the first leveling component in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0032] Figure 9 The diagram shown is a three-dimensional structural schematic of the second leveling component in the fixing device for MEMS inertial navigation sensing according to the present invention.

[0033] Figure 10 The diagram shown is a three-dimensional structural illustration of the mounting base in the mounting device for MEMS inertial navigation sensing according to the present invention.

[0034] Explanation of reference numerals in the attached drawings: 1. Fixed base; 2. Vibration damping assembly; 201. Mounting seat; 202. Bolt; 203. Magnetorheological damper; 204. Support column; 3. Support frame; 4. First leveling assembly; 401. Mounting base; 402. Adjusting seat; 403. Adjusting motor; 404. Adjusting groove; 405. Adjusting screw; 406. Sliding block; 407. Limiting block; 408. Steel column; 410. Bracket; 411. Guide block; 412. Guide groove; 5. Second leveling assembly; 501. 502. Mounting frame; 503. Support frame; 504. Rotating shaft; 505. Wedge block; 506. Servo motor; 507. Drive screw; 508. Adjusting block; 6. Metal layer; 7. Electromagnetic block; 8. Electronic level; 9. Pneumatic telescopic rod; 10. Clamping plate; 11. Adhesive layer; 12. Mounting groove; 13. Isolation pad; 14. Receiving cavity; 15. Cooling channel; 16. Circulating cooling system; 1601. Heat exchange module; 1602. Circulating pump; 1603. Liquid storage tank; 1604. Connecting pipe. Detailed Implementation

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] Please see Figures 1-10This invention provides an embodiment of a fixing device for MEMS inertial navigation sensing, comprising a fixing base 1, a shock-absorbing component 2 disposed on the top surface of the fixing base 1, a support frame 3 disposed above the shock-absorbing component 2, a first leveling component 4 disposed inside the support frame 3, the first leveling component 4 comprising a mounting base 401, the top surface of the mounting base 401 being configured as an arc-shaped concave structure, an adjusting seat 402 disposed above the mounting base 401, the bottom surface of the adjusting seat 402 being configured as an arc-shaped convex structure, an adjusting motor 403 disposed on one side of the mounting base 401, an adjusting groove 404 formed on the top surface of the mounting base 401, and an adjusting screw 403 disposed inside the adjusting groove 404. 5. One end of the adjusting screw 405 is fixedly connected to the output end of the adjusting motor 403. A sliding block 406 is threaded onto the adjusting screw 405. A limit block 407 is provided on the top surface of the sliding block 406. A steel column 408 is provided inside the limit block 407. A bracket 410 is provided on the bottom surface of the adjusting seat 402. The steel column 408 is rotatably connected to the bracket 410. A guide block 411 is provided on the bottom surface of the adjusting seat 402. The guide block 411 is configured as a spherical structure. A guide groove 412 is provided on the top surface of the mounting base 401. Multiple sets of guide blocks 411 and multiple sets of guide grooves 412 are provided. The guide blocks 411 are located inside the guide grooves 412.

[0037] In use, the device is fixed and supported by the fixed base 1. The shock-absorbing component 2 connects the support frame 3 and the fixed base 1, and simultaneously dampens the support frame 3, thereby reducing the vibration of the MEMS inertial navigation sensor mounted on the support frame 3. The mounting base 401 in the first leveling component 4 mounts the adjusting seat 402, and the arc structure provides guidance and limit for the sliding between the mounting base 401 and the adjusting seat 402. Specifically, the adjusting motor 403 drives the adjusting screw 405 inside the adjusting groove 404 to rotate. Under the limiting action of the adjusting groove 404 on the sliding block 406, the rotation of the adjusting screw 405 drives the sliding block 406 to move. Meanwhile, the limiting block 407 ensures that the steel column 408 is always inside the limiting block 407, that is, the horizontal relative position of the steel column 408 and the mounting base 401 remains unchanged. At the same time, the bracket 410 ensures the installation of the steel column 408 and the adjusting seat 402. When the adjusting motor 403 drives the adjusting screw 405 to rotate, the sliding block 406 drives the adjusting seat 402 to move along the arc-shaped top surface of the mounting base 401, thereby realizing the angle adjustment of the adjusting seat 402 in one direction. At the same time, the guide block 411, which can move in the guide groove 412, can also limit the adjusting seat 402, thereby realizing the stable movement between the mounting base 401 and the adjusting seat 402.

[0038] A second leveling component 5 is disposed above the first leveling component 4. The second leveling component 5 includes a mounting frame 501, and a support frame 502 is disposed inside the mounting frame 501. The support frame 502 is rotatably connected to the mounting frame 501 via a rotating shaft 503. Two sets of wedge blocks 504 are disposed on the bottom surface of the support frame 502. A servo motor 505 is disposed on the side wall of the mounting frame 501. A drive screw 506 is disposed inside the mounting frame 501. The drive screw 506 has two sets of threads in opposite directions. Two sets of adjusting blocks 507 are threaded onto the lever 506. Both sets of adjusting blocks 507 are trapezoidal in shape. One set of adjusting blocks 507 is located below one set of wedge blocks 504, and the other set of adjusting blocks 507 is located below the other set of wedge blocks 504. A metal layer 6 is provided inside the support frame 3. Electromagnetic blocks 7 are provided on the side wall of the mounting base 401 and on the bottom surface of the wedge blocks 504. The electromagnetic blocks 7 on the side wall of the mounting base 401 are in contact with the metal layer 6. The adjusting blocks 507 are made of metal. An electronic level 8 is provided on the bottom surface of the support frame 502.

[0039] In use, one end of the support frame 502 can be installed via the mounting frame 501 and the rotating shaft 503. The servo motor 505 drives the drive screw 506 to rotate. The drive screw 506 drives two sets of adjusting blocks 507 through two sets of oppositely oriented threads, causing the two sets of adjusting blocks 507 to move in opposite directions. Under the influence of gravity, the adjusting blocks 507 move, driving the wedge block 504 to rise and fall through the triangular structure, thereby causing the support frame 502 to rotate. In conjunction with the first leveling component 4, the adjustment motor 403 and the servo motor 505 achieve the adjustment of the support frame 502. The system allows for all-around angle adjustment. Simultaneously, in conjunction with the electronic level 8, and under the control of the PLC controller or other controllers, it automatically levels the support frame 502, thereby automatically leveling the MEMS inertial navigation sensor installed inside the support frame 502. Furthermore, the metal layer 6, in conjunction with the electromagnetic block 7, secures the support frame 3 to the mounting base 401. The electromagnetic block 7, in conjunction with the adjusting block 507, secures the wedge block 504 to the adjusting block 507. This ensures the effectiveness of the leveling structure while stably installing the MEMS inertial navigation sensor.

[0040] The support frame 502 is equipped with a pneumatic telescopic rod 9 inside. Multiple sets of the pneumatic telescopic rod 9 are provided. One end of the pneumatic telescopic rod 9 is fixedly connected to the inner side wall of the support frame 502. The other end of the pneumatic telescopic rod 9 is connected to a clamping plate 10. An adhesive layer 11 is provided on one side of the clamping plate 10, and the adhesive layer 11 occupies 60% of the side wall area of ​​the clamping plate 10.

[0041] In use, the clamping plate 10 can be moved by the extension and retraction of multiple sets of pneumatic telescopic rods 9, thereby clamping the MEMS inertial navigation sensor using the clamping plate 10 and the support frame 502. At the same time, the adhesive layer 11 can be set to increase the fixing effect between the MEMS inertial navigation sensor and the clamping plate 10.

[0042] The shock absorption component 2 includes a mounting base 201, and multiple sets of mounting bases 201 are provided. The mounting bases 201 are configured with a Z-shaped structure. The mounting bases 201 are fixedly connected to the fixed base 1 by bolts 202. The top of the mounting bases 201 is fixedly connected to the support frame 3. Each set of mounting bases 201 is provided with a magnetorheological damper 203. Each set of mounting bases 201 is provided with a support column 204. The support column 204 is made of one of Ni-Ti-Nb-Mo quaternary alloy and Cu-Al-Ni ternary alloy.

[0043] In use, the support frame 3 can be installed and fixed using the mounting base 201. At the same time, by setting up the magnetorheological damper 203 and the support column 204 of special material, the combination of the fast response characteristics of the magnetorheological damper 203 and the high damping characteristics of the shape memory alloy can achieve a vibration attenuation rate of 98% in the range of 200-3000Hz. The shape memory alloy material of the support column 204 absorbs high-frequency vibration energy through stress-induced martensitic phase transformation, while the magnetorheological fluid suppresses low-frequency vibration by regulating shear stress through magnetic field. The two work together to cover the full spectrum requirements.

[0044] The fixed base 1 has an internal mounting groove 12, and multiple sets of mounting grooves 12 are provided. The mounting groove 12 is rectangular in structure, and an isolation pad 13 is provided inside the mounting groove 12. The isolation pad 13 is corrugated and made of aluminum material. The fixed base 1 also has an internal receiving cavity 14. A magnetic coil is provided on the internal side wall of the receiving cavity 14, and a magnetorheological fluid is provided inside the receiving cavity 14.

[0045] In use, the installation groove 12 can reduce the overall weight of the device and, together with the corrugated isolation pad 13, absorb thermal deformation, achieving effective deformation absorption within a limited space. Furthermore, the accommodating cavity 14 and the magnetic fluid inside the accommodating cavity 14 can absorb vibration, and, in conjunction with the magnetic coil, the damping effect can be increased as the intensity of the vibration increases.

[0046] The fixed base 1 has a cooling channel 15 inside, which is configured as a serpentine structure. The cooling channel 15 is connected to a circulating cooling system 16. The circulating cooling system 16 includes a heat exchange module 1601, a circulating pump 1602, a liquid storage tank 1603, and a connecting pipe 1604. One end of the heat exchange module 1601 is connected to one end of the circulating pump 1602 through the connecting pipe 1604, and the other end of the heat exchange module 1601 is connected to one end of the liquid storage tank 1603 through the connecting pipe 1604. One end of the cooling channel 15 is connected to the other end of the circulating pump 1602 through the connecting pipe 1604, and the other end of the cooling channel 15 is connected to the other end of the liquid storage tank 1603 through the connecting pipe 1604.

[0047] In use, the serpentine cooling channel 15, under the action of the circulating cooling system 16, cools the interior of the fixed base 1. On one hand, heat exchange occurs between the support frame 502 and the shock-absorbing component 2, the first leveling component 4, and the second leveling component 5 through heat conduction. On the other hand, airflow carries the heat from inside the support frame 502 to the fixed base 1, thereby cooling the MEMS inertial navigation sensor inside the support frame 502. The circulating pump 1602 drives the cooling medium from the storage tank 160... 3. The medium flows out and is transported to the heat exchange module 1601 via the connecting pipe 1604 to absorb the heat generated by the cooled component. The heated medium continues to flow through another heat exchange module 1601 for heat dissipation and cooling, and finally returns to the storage tank 1603 to form a closed loop, realizing continuous heat transfer and temperature control. The circulating cooling system 16 ensures that the medium is forcibly circulated in the cooling channel 15 through the connection of the pipe. The heat exchange module 1601 is responsible for heat absorption and release, the circulating pump 1602 maintains the flow power, and the storage tank 1603 provides medium storage and pressure balance.

[0048] Working principle: Before use, the base 1 is installed in the set position by welding or fixing with hexagonal bolts, etc. Then, the MEMS inertial navigation sensor is placed inside the support frame 502. Then, the pneumatic telescopic rod 9 is activated. The pneumatic telescopic rod 9 drives the clamping plate 10 to move, thereby clamping the MEMS inertial navigation sensor with the clamping plate 10 and the support frame 502.

[0049] After installation, leveling is performed. During leveling, the levelness of the support frame 502 is measured using an electronic level 8, thereby measuring the levelness of the MEMS inertial navigation sensor. If the MEMS inertial navigation sensor is not level, the PLC controller or other controllers are triggered, starting the adjusting motor 403 and the servo motor 505. The adjusting motor 403 drives the adjusting screw 405 inside the adjusting groove 404 to rotate. Under the limiting action of the adjusting groove 404 on the sliding block 406, the adjusting screw 405 rotates, causing the sliding block 406 to move. At the same time, the limiting block 407 ensures that the steel column 408 is always inside the limiting block 407, that is, the horizontal relative position of the steel column 408 and the mounting base 401 remains unchanged. The bracket 410 ensures the installation of the steel column 408 and the adjusting seat 402. At the same time, the adjusting motor 403 drives the adjusting screw 405 to rotate, and the sliding block 406 drives the adjusting seat 402 to move along the arc-shaped top surface of the mounting base 401, thereby realizing the angle adjustment of the adjusting seat 402 in one direction. Meanwhile, the servo motor 505 drives the drive screw 506 to rotate. The drive screw 506 drives two sets of adjusting blocks 507 through two sets of threads in opposite directions, causing the two sets of adjusting blocks 507 to move in opposite directions. Under the action of gravity, the adjusting blocks 507 move, and through the triangular structure, the wedge block 504 is raised and lowered, thereby driving the support frame 502 to rotate, thus enabling the all-round angle adjustment of the support frame 502.

[0050] In use, the circulating pump 1602 drives the cooling medium to flow out of the storage tank 1603, and delivers it to the heat exchange module 1601 through the connecting pipe 1604 to absorb the heat generated by the cooled component. The heated medium continues to flow through another heat exchange module 1601 to dissipate heat and cool down, and finally returns to the storage tank 1603 to form a closed loop, realizing continuous heat transfer and temperature control. The circulating cooling system 16 ensures that the medium is forced to circulate in the cooling channel 15 through the pipe connection, cooling the inside of the fixed base 1, thereby cooling the MEMS inertial navigation sensor.

[0051] Meanwhile, when the temperature changes, the corrugated insulating pad 13 and the mounting groove work together to absorb thermal deformation.

[0052] Meanwhile, when vibrations occur, the vibrations can be absorbed by the receiving cavity 14 and the magnetofluid inside the receiving cavity 14, and the damping effect can be increased as the intensity of the vibration increases in conjunction with the magnetic coil; and by combining the fast response characteristics of the magnetorheological damper 203 with the high damping characteristics of the shape memory alloy, a vibration attenuation rate of 98% can be achieved in the 200-3000Hz range, achieving effective vibration reduction and ensuring the stable operation of the MEMS inertial navigation sensor. Example

[0053] Taking micro drone application scenarios as an example

[0054] Mechanical structure implementation

[0055] The mounting base 1 uses a gallium nitride-graphene composite substrate, measuring 150 mm × 150 mm × 20 mm. Its surface is anodized to form an electromagnetic shielding layer, with a surface resistance of less than 0.1 ohms. The mounting base 1 integrates a spiral cooling channel 15, 3 mm in diameter and 2.5 m in length, integrally formed using laser cutting and 3D printing. Corrugated aluminum insulating pads 13, 0.15 mm thick and 0.1 mm deep, are embedded at the edges of the mounting base 1 and fixed using vacuum brazing, absorbing thermal deformation of ±0.05 mm. Magnetorheological dampers 203, each 15 mm in diameter with a response time of 5 milliseconds, are arranged at the four corners, paired with Ni-Ti-Nb-Mo shape memory alloy support pillars 204, 8 mm in diameter, 25 mm high, and with a pre-compression of 0.2 mm, fixed to the four corners of the base using laser welding.

[0056] In the first leveling component 4 of the support frame 3, the mounting base 401 is made of CNC machined stainless steel, with an arc-shaped groove curvature radius of 50 mm and machining tolerance controlled within ±0.005 mm. The adjusting screw 405 has a lead of 2 mm, driven by a stepper motor 403 with a step angle of 1.8 degrees, and the sliding block 406 has a stroke range of ±10 mm, achieving a leveling angle of ±5 degrees. The guide groove 412 and the spherical guide block 411 are coated with a ceramic coating, with a friction coefficient of less than 0.02, ensuring smooth sliding. The driving screw 506 of the second leveling component 5 has a lead of 1 mm, adopts a bidirectional thread design, is driven by a servo motor 505, and has an encoder resolution of 0.001 degrees. The adjusting block 507 adopts a titanium alloy wedge structure with an inclination angle of 15 degrees, and the support frame 502 has a rotation angle range of ±3 degrees. The electromagnetic block 7 has a magnetic attraction force of not less than 50 N, and its contact area with the 1 mm thick metal layer 6 exceeds 80%, ensuring rigid fixation.

[0057] The clamping system uses a 4 mm diameter pneumatic telescopic rod 9 with a stroke of 15 mm to drive a carbon fiber clamping plate 10 (2 mm thick) to apply pressure to the sensor. The adhesive layer 11 adopts a cyanoacrylate gradient bonding design, with a 0.1 mm thick adhesive layer in the central area and a 0.05 mm flexible adhesive layer at the edge area. The clamping force is monitored in real time by a pressure sensor, with a control accuracy of ±0.2 N, ensuring that the clamping force is stable at 5 N.

[0058] Thermal management system implementation

[0059] The cooling channel 15 is integrated with the fixed base 1. The cross-sectional area of ​​the cooling channel 15 is 1 square millimeter. The coolant is a 50% ethylene glycol aqueous solution, and it is circulated by a magnetically driven circulation pump 1602 at a flow rate of 0.5 liters / minute, consuming only 3 watts. The liquid storage tank 1603 has a volume of 200 ml, a pressure resistance of 0.5 MPa, and high-precision temperature sensors (error ±0.1 degrees Celsius) are installed at the inlet and outlet. The pump speed is dynamically adjusted through a PID algorithm to maintain the temperature of the fixed base 1 at 25 ± 1 degrees Celsius. When the ambient temperature exceeds 80 degrees Celsius, the backup semiconductor cooling module starts, providing 20 watts of cooling capacity to ensure heat dissipation performance under extreme high temperatures.

[0060] Dynamic adjustment and intelligent control

[0061] The fixed base 1 integrates a fiber optic grating (FBG) sensor array with a wavelength resolution of 1 picometer, enabling real-time monitoring of strain (accuracy 0.5 micro-strain) and temperature distribution. A triaxial MEMS accelerometer with a range of ±20g collects vibration spectrum data and transmits it to the control system. An electronic level 8 with an accuracy of ±0.005 degrees provides real-time feedback on the tilt angle of the support frame 502. In the control algorithm, a Kalman filter dynamically adjusts the current (0-2 amps) of the magnetorheological damper 203 based on the vibration spectrum (0-3000 Hz), achieving a vibration attenuation rate exceeding 98%. Automatic leveling is divided into two stages: coarse and fine adjustment. In the coarse adjustment stage, the first leveling component 4 and the second leveling component 5 move at a speed of 5 mm / s to eliminate a tilt angle of ±3 degrees. In the fine adjustment stage, the first leveling component 4 and the second leveling component 5 move at a speed of 0.1 mm / s, combined with iterative correction based on the electronic level data, ultimately achieving a leveling accuracy of ±0.003 degrees.

[0062] Assembly and testing process

[0063] In the processing stage of the fixed base 1, a gallium nitride-graphene substrate is laser-cut, and a spiral cooling channel 15 is 3D-printed and integrated. The surface is anodized to form a 10-micron-thick shielding layer. The corrugated aluminum isolation pad 13 is fixed by vacuum brazing, with a contact surface flatness error ≤0.01 mm. During the installation of the shock absorption component 2, the shape memory alloy support column 204 is pre-compressed by 0.2 mm and then laser-welded. The magnetorheological damper 203 is injected with MRF-132DG magnetorheological fluid (zero magnetic field viscosity 0.1 Pa·s), sealed, and then connected to the control circuit. In the leveling system debugging stage, the gap between the guide groove 412 and the spherical guide block 411 is calibrated to 0.02-0.03 mm, and molybdenum disulfide grease is applied. The electromagnetic locking module test shows an engagement time <10 milliseconds and a release time <5 milliseconds. In performance testing, the electromagnetic vibration table simulated the vibration spectrum of a drone flight (5-2000 Hz, 20g root mean square value), and the sensor output noise decreased from 0.05 degrees in the traditional solution to 0.01 degrees; after running continuously for 8 hours in a high temperature environment of 125 degrees Celsius, the deformation of the fixed base 1 was <0.005 mm, and the coolant temperature rise was <3 degrees Celsius; in the 30g half-sine impact test, the clamping force decayed by <2%, and the adhesive layer did not peel off.

[0064] Typical application scenario verification

[0065] In micro-drones, this device integrates a three-axis MEMS and GPS module within a 15mm x 15mm space. Flight tests show that vibration noise decreased from 2.5 degrees to 0.3 degrees, and positioning accuracy improved to the centimeter level. In vehicle navigation scenarios, the device, installed near the engine compartment, improved gyroscope zero-bias stability from 10 degrees / hour to 1 degree / hour under road vibrations of 5-2000 Hz. In the 125-degree Celsius environment of oil exploration wells, the device operated continuously for 500 hours, with attitude angle measurement error stabilizing at 0.005 degrees, showing no signs of adhesive aging or bolt loosening.

[0066] Conclusion: This embodiment achieves high-precision and stable installation of MEMS sensors in extreme environments through the synergistic design of composite damping materials, intelligent leveling algorithms, and active thermal management. The vibration attenuation rate is increased to 98.5%, the leveling accuracy reaches ±0.003 degrees, the high-temperature deformation is reduced by 97%, the clamping force stability is optimized by 93%, and the fully automatic leveling efficiency is improved by 15 times. It provides a reliable inertial navigation solution for drones, vehicles, and industrial equipment.

[0067] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A fixing device for MEMS inertial navigation sensing, characterized in that: The system includes a fixed base (1), a shock-absorbing component (2) on the top surface of the fixed base (1), a support frame (3) above the shock-absorbing component (2), a first leveling component (4) inside the support frame (3), the first leveling component (4) including a mounting base (401), the top surface of the mounting base (401) being an arc-shaped concave structure, an adjusting seat (402) above the mounting base (401), the bottom surface of the adjusting seat (402) being an arc-shaped convex structure, an adjusting motor (403) on one side of the mounting base (401), and an opening on the top surface of the mounting base (401). An adjusting groove (404) is provided, and an adjusting screw (405) is provided inside the adjusting groove (404). One end of the adjusting screw (405) is fixedly connected to the output end of the adjusting motor (403). A sliding block (406) is threaded onto the adjusting screw (405). A limit block (407) is provided on the top surface of the sliding block (406). A steel column (408) is provided inside the limit block (407). A bracket (410) is provided on the bottom surface of the adjusting seat (402). The steel column (408) is rotatably connected to the bracket (410). A guide block (411) is provided on the bottom surface of the adjusting seat (402). The guide block (411) is configured as a spherical structure. A guide groove (412) is provided on the top surface of the mounting base (401). Multiple sets of guide blocks (411) and multiple sets of guide grooves (412) are provided. The guide block (411) is located inside the guide groove (412). A second leveling component (5) is provided above the first leveling component (4). The second leveling component (5) includes a mounting frame (501). A support frame (502) is provided inside the mounting frame (501). The support frame (502) is rotatably connected to the mounting frame (501) through a rotating shaft (503). A wedge block (504) is provided on the bottom surface of the mounting frame (502). The wedge block (504) is provided in two sets. A servo motor (505) is provided on the side wall of the mounting frame (501). A drive screw (506) is provided inside the mounting frame (501). Two sets of threads with opposite directions are provided on the drive screw (506). Two sets of adjusting blocks (507) are threaded on the drive screw (506). Both sets of adjusting blocks (507) are set in a trapezoidal structure. One set of adjusting blocks (507) is located below one set of wedge blocks (504), and the other set of adjusting blocks (507) is located below the other set of wedge blocks (504). The shock absorption component (2) includes a mounting base (201), which is provided in multiple sets. The mounting base (201) is configured as a Z-shaped structure. The mounting base (201) is fixedly connected to the fixed base (1) by bolts (202). The top end of the mounting base (201) is fixedly connected to the support frame (3). Each of the multiple sets of mounting bases (201) is provided with a magnetorheological damper (203), and each of the multiple sets of mounting bases (201) is provided with a support column (204). The support column (204) is made of either a Ni-Ti-Nb-Mo quaternary alloy or a Cu-Al-Ni ternary alloy. The fixed base (1) has an installation groove (12) inside. There are multiple sets of installation grooves (12). The installation groove (12) is rectangular in structure. An isolation pad (13) is provided inside the installation groove (12). The isolation pad (13) is corrugated and made of aluminum material. The fixed base (1) has a cavity (14) inside, a magnetic coil is provided on the inner side wall of the cavity (14), and a magnetic fluid is provided inside the cavity (14).

2. The fixing device for MEMS inertial navigation sensing according to claim 1, characterized in that: The support frame (3) has a metal layer (6) inside. Electromagnetic blocks (7) are provided on the side wall of the mounting base (401) and the bottom surface of the wedge block (504). The electromagnetic block (7) on the side wall of the mounting base (401) is in contact with the metal layer (6). The adjustment block (507) is made of metal. An electronic level (8) is provided on the bottom surface of the support frame (502).

3. A fixing device for MEMS inertial navigation sensing according to claim 1, characterized in that: The support frame (502) is provided with a pneumatic telescopic rod (9) inside. There are multiple sets of the pneumatic telescopic rod (9). One end of the pneumatic telescopic rod (9) is fixedly connected to the inner side wall of the support frame (502). The other end of the pneumatic telescopic rod (9) is connected to a clamping plate (10). An adhesive layer (11) is provided on one side of the clamping plate (10). The adhesive layer (11) occupies 60% of the side wall area of ​​the clamping plate (10).

4. A fixing device for MEMS inertial navigation sensing according to claim 1, characterized in that: The fixed base (1) is provided with a cooling channel (15), which is configured as a serpentine structure. The cooling channel (15) is connected to a circulating cooling system (16). The circulating cooling system (16) includes a heat exchange module (1601), a circulating pump (1602), a liquid storage tank (1603), and a connecting pipe (1604). One end of the heat exchange module (1601) is connected to one end of the circulating pump (1602) through the connecting pipe (1604), and the other end of the heat exchange module (1601) is connected to one end of the liquid storage tank (1603) through the connecting pipe (1604). One end of the cooling channel (15) is connected to the other end of the circulating pump (1602) through the connecting pipe (1604), and the other end of the cooling channel (15) is connected to the other end of the liquid storage tank (1603) through the connecting pipe (1604).

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