Dark field scattering wafer surface defect detection device

Abstract

According to the dark field scattering wafer surface defect detection device, in the actual use process, a wafer is placed on a movable platform, a plurality of illumination light sources on a mounting frame are turned on, and the movable platform on a base is adjusted, so that the intersection point of detection light and the upper surface of the wafer is basically located in the middle of a dark field microscopic device; the intersection lines of the surfaces of the plurality of dark-field microscopes and the surfaces of the plurality of illumination light sources basically coincide with the upper surface of the wafer, and the plurality of illumination light sources are in one-to-one correspondence with the plurality of dark-field microscopes, so that a plurality of dotted parts on the upper surface of the wafer can be simultaneously detected at one time, and the detection time is greatly shortened; due to the fact that the illumination light sources are detachably connected with the fixing base on the installation frame, after a certain illumination light source is damaged, the illumination light source can be conveniently replaced; in general, by using the dark field scattering wafer surface defect detection device, a plurality of parts of the wafer can be detected at one time, and the time required by wafer detection is greatly shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a dark field scattering wafer surface defect detection device. Background Art

[0002] Darkfield microscopy, also known as dark field microscopy, describes a special microscopic technique in optical microscopy and electron microscopy. It removes light or electrons other than those entering the objective lens, so that the background of the field observed in the eyepiece is black and only the edges of the object are bright. Using this method, microparticles as small as 4-200nm can be seen, and the resolution can be 50 times higher than that of ordinary microscopy.

[0003] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced ​​to form silicon wafers, also known as wafers. Domestic wafer production lines primarily focus on 8-inch and 12-inch wafers.

[0004] Darkfield inspection is often used to detect surface defects on wafers. This method collects scattered light from the surface to be inspected, thereby obtaining surface defect information. When the surface to be inspected is smooth and defect-free, the light is simply reflected and does not enter the lens. When there are defects on the surface to be inspected, the light generates scattered light at the defect and is captured by the lens. Therefore, the image captured under darkfield inspection is a series of bright spots against a dark background, which has a higher contrast than brightfield inspection.

[0005] Existing devices for dark field inspection of wafers have the following problems during use, namely, the illumination light source emits only one light ray, which appears as a point on the wafer surface. If the entire wafer surface is to be inspected, the wafer surface and the inspection light ray need to be moved relative to each other, and the point where the two intersect needs to be moved, so that the movement path is from point to line, and then from line to surface, thereby covering the entire surface of the wafer. This takes a long time and is not conducive to rapid inspection. Summary of the Invention

[0006] (1) Technical problems solved

[0007] To solve the above problems, the present invention provides a dark field scattering wafer surface defect detection device, which can detect multiple parts of the wafer at one time, greatly reducing the time required for wafer detection.

[0008] (2) Technical solution

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A dark field scattering wafer surface defect detection device is used to detect surface defects of a non-patterned wafer, comprising a base and:

[0011] A mounting frame, the mounting frame is arranged on the base, and the mounting frame is provided with a plurality of fixing seats, the plurality of fixing seats are parallel to each other and located in the same plane;

[0012] a plurality of illumination light sources, each of which can emit light for illuminating the wafer to be inspected, wherein the plurality of illumination light sources correspond to the plurality of fixing bases in a one-to-one manner, and the illumination light sources are detachably connected to the fixing bases so that the light rays emitted by the plurality of illumination light sources are parallel to each other and located in the same plane;

[0013] A dark-field microscope device, the dark-field microscope device being disposed on the base and used for imaging, the dark-field microscope device comprising a plurality of mutually independent dark-field microscopes, the plurality of dark-field microscopes being linearly arranged and corresponding one-to-one with the plurality of illumination light sources, the surface passing through the plurality of dark-field microscopes and the surface passing through the plurality of illumination light sources having an intersection line, the intersection line being a horizontal line;

[0014] a movable platform, the movable platform being arranged on the base and being used for carrying the wafer to be inspected and adjusting the spatial position of the wafer so that the upper surface of the wafer can coincide with the intersection line;

[0015] A computer is arranged on the base, and the illumination light source, the dark field microscope device, and the mobile platform are all electrically connected to the computer, and is used to control the switch of the illumination light source, the movement of the mobile platform, and enhance the image information collected by the dark field microscope device and extract defects.

[0016] Preferably, a V-shaped groove is provided on the upper surface of the fixing seat, and the lighting source is substantially cylindrical and is magnetically connected in the V-shaped groove.

[0017] Preferably, a first anti-slip pad is provided on the top of the fixing seat, a second anti-slip pad is provided on the upper surface of the V-shaped groove, and an annular limit block is provided on the top of the lighting source to prevent the lighting source from sliding downward relative to the fixing seat.

[0018] Preferably, the lighting source is basically cylindrical and the emitted light coincides with its own axis. The distance between the corresponding positions of two adjacent lighting sources can be decomposed into a horizontal spacing and an inclined spacing parallel to the extension line of the lighting source. The length of the horizontal spacing is greater than the radius of the lighting source, and the length of the inclined spacing is greater than the length of the lighting source.

[0019] Preferably, the mobile platform comprises:

[0020] A workbench, the workbench being used to carry a wafer to be inspected;

[0021] A longitudinal moving component, the longitudinal moving component is driven and connected to the workbench, and is used to drive the workbench and the wafer to move forward and backward;

[0022] a transverse moving assembly, the transverse moving assembly drivingly connected to the longitudinal moving assembly, and configured to drive the longitudinal moving assembly to move left and right, so as to cooperate with the longitudinal moving assembly to change the position of the wafer on the horizontal plane;

[0023] A vertical moving component is arranged on the base and is top-driven and connected to the lateral moving component, and is used to drive the lateral moving component to move up and down, so as to cooperate with the lateral moving component and the vertical moving component to change the position of the wafer in the three-dimensional space.

[0024] Preferably, a first guide hole and a first threaded hole are provided on the workbench, the axis of the first guide hole and the axis of the first threaded hole are parallel to each other and arranged longitudinally, and the longitudinal moving component includes:

[0025] a first moving member, the first moving member drivingly connected to the transverse moving assembly;

[0026] Two first fixing members, both of which are fixedly connected to the top of the first movable member, and the line connecting the corresponding positions of the two first fixing members is arranged longitudinally;

[0027] a first guide rod, the first guide rod being longitudinally arranged between the two first fixing members, and the side surface of the first guide rod being slidably connected to the first guide hole;

[0028] a first screw, the first screw being rotatably connected between the two first fixing members and being longitudinally arranged, the first screw being engaged in the first threaded hole;

[0029] A first motor is fixedly connected to one of the first fixing members and drives the first screw rod.

[0030] Preferably, a second guide hole and a second threaded hole are provided on the first moving member, the axis of the second guide hole and the axis of the second threaded hole are parallel to each other and are arranged transversely, and the transverse moving component includes:

[0031] a second moving member drivingly connected to the vertical moving assembly;

[0032] Two second fixing members, both of which are fixedly connected to the top of the second movable member, and a line connecting corresponding positions of the two second fixing members is arranged horizontally;

[0033] a second guide rod, the second guide rod being laterally arranged between the two second fixing members, and the side surface of the second guide rod being slidably connected to the second guide hole;

[0034] a second screw, the second screw being rotatably connected between the two second fixing members and being laterally arranged, the second screw being engaged in the second threaded hole;

[0035] A second motor is fixedly connected to one of the second fixing members and drives the second screw rod.

[0036] Preferably, the vertical movement assembly includes:

[0037] A hydraulic cylinder, the hydraulic cylinder being fixedly connected to the bottom of the base;

[0038] A hydraulic rod, wherein the bottom of the hydraulic rod is drivingly connected to the hydraulic cylinder, and the top of the hydraulic rod passes through the base and is fixedly connected to the second moving member.

[0039] Preferably, it also includes a carrier assembly for carrying wafers, and the carrier assembly is composed of multiple bosses, the bosses are cylindrical and different bosses have different diameters, multiple bosses are stacked and the diameters decrease from bottom to top, the diameter of the boss at the top is smaller than the diameter of the wafer, so that the edge of the wafer is suspended in the air, and the diameter of the boss at the top is smaller than the radius of the wafer, so that the wafer is firmly placed.

[0040] Preferably, the top of the movable platform and the top of the boss are both provided with positioning grooves, and the bottom of the boss is provided with positioning protrusions corresponding to the positioning grooves, which are used to fix the relative positions of the top of the movable platform and the multiple protrusions, and the top of the boss is provided with a third anti-slip pad to prevent the boss and the wafer from moving relative to each other.

[0041] (3) Beneficial effects

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] During actual use, the wafer is placed on a movable platform, multiple lighting sources on the mounting frame are turned on, and the movable platform on the base is adjusted so that the intersection of the detection light and the upper surface of the wafer is basically located in the middle of the dark field microscope device. At this time, the intersection line of the surfaces passing through multiple dark field microscopes and the surfaces passing through multiple lighting sources basically coincides with the upper surface of the wafer. Since there are multiple lighting sources and they correspond one-to-one to multiple dark field microscopes, multiple point-like parts of the upper surface of the wafer can be detected at one time, thereby greatly reducing the detection time; and since the lighting light source is detachably connected to the fixed seat on the mounting frame, it can be easily replaced after a certain lighting light source is damaged; in general, by using the dark field scattering wafer surface defect detection device, multiple parts of the wafer can be detected at one time, greatly reducing the time required for wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0045] Figure 1 A perspective view of a dark field scattering wafer surface defect detection device according to the present invention is shown;

[0046] Figure 2 Shown Figure 1 A magnified view of part A in FIG;

[0047] Figure 3 Shown Figure 1 A three-dimensional image of the medium dark field scattering wafer surface defect detection device from another angle;

[0048] Figure 4 Shown Figure 1 Front view of the medium dark field scattering wafer surface defect detection device;

[0049] Figure 5 Shown Figure 1 A top view of the medium dark field scattering wafer surface defect detection device;

[0050] Figure 6 Shown Figure 1 A partial perspective view of a medium dark field scattering wafer surface defect detection device;

[0051] Figure 7 Shown Figure 1 A perspective view of the middle mounting frame and the fixing base;

[0052] Figure 8 Shown Figure 7 A magnified view of part B in FIG;

[0053] Figure 9 Shown Figure 1A three-dimensional view of the mounting frame and the fixing base from another angle;

[0054] Figure 10 Shown Figure 1 A stereogram of the medium lighting source;

[0055] Figure 11 Shown Figure 1 Bottom view of the horizontal cross-section of the medium dark field microscope apparatus;

[0056] Figure 12 Shown Figure 1 Schematic diagram of the exploded structure of the loaded components and wafers;

[0057] Figure 13 Shown Figure 1 Schematic diagram of the explosion structure of the carrier component and wafer from another angle.

[0058] In the figure: 1, base; 2, mounting frame; 3, lighting source; 31, limit block; 4, dark field microscope; 41, dark field microscope; 5, moving platform; 51, workbench; 511, first guide hole; 512, first threaded hole; 52, longitudinal moving component; 521, first moving member; 522, first fixing member; 523, first guide rod; 524, first screw rod; 525, first motor; 526, second guide hole; 527, second threaded hole; 53, transverse Moving assembly; 531, second moving member; 532, second fixed member; 533, second guide rod; 534, second screw rod; 535, second motor; 54, vertical moving assembly; 541, hydraulic cylinder; 542, hydraulic rod; 6, computer; 7, fixing seat; 71, V-groove; 72, first anti-slip pad; 73, second anti-slip pad; 8, loading assembly; 81, boss; 82, positioning groove; 83, positioning protrusion; 84, third anti-slip pad; 9, wafer; 10, baffle. DETAILED DESCRIPTION

[0059] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0060] See attached Figure 1 , Attachment Figure 2 and attached Figure 11The embodiment of the present invention discloses a dark field scattering wafer surface defect detection device for detecting surface defects of a non-patterned wafer 9, comprising a base 1, a mounting frame 2, a plurality of illumination light sources 3, a dark field microscope 4, a mobile platform 5, and a computer 6. The mounting frame 2 is arranged on the base 1, and a plurality of fixing seats 7 are provided on the mounting frame 2. The plurality of fixing seats 7 are parallel to each other and located in the same plane; the illumination light source 3 can emit light for irradiating the wafer 9 to be inspected, the plurality of illumination light sources 3 and the plurality of fixing seats 7 correspond one to one, and the illumination light source 3 and the fixing seats 7 are detachably connected so that the light emitted by the plurality of illumination light sources 3 is parallel to each other and located in the same plane; the dark field microscope 4 is arranged on the base 1 for imaging. The dark field microscope device 4 includes multiple independent dark field microscopes 41, which are arranged linearly and correspond one-to-one to multiple illumination light sources 3. The surfaces of the multiple dark field microscopes 41 and the surfaces of the multiple illumination light sources 3 have an intersection line, which is a horizontal line; the movable platform 5 is arranged on the base 1, and is used to carry the wafer 9 to be inspected and adjust the spatial position of the wafer 9 so that the upper surface of the wafer 9 can coincide with the intersection line; the computer 6 is arranged on the base 1, and the illumination light source 3, the dark field microscope device 4, and the movable platform 5 are all electrically connected to the computer 6, and are used to control the switch of the illumination light source 3, the movement of the movable platform 5, and the enhancement and defect extraction of the image information collected by the dark field microscope device 4.

[0061] During actual use, the wafer 9 is placed on the movable platform 5, the multiple lighting light sources 3 on the mounting frame 2 are turned on, and the movable platform 5 on the base 1 is adjusted so that the intersection of the detection light and the upper surface of the wafer 9 is basically located in the middle of the dark field microscope device 4. At this time, the intersection line of the surfaces of the multiple dark field microscopes 41 and the surfaces of the multiple lighting light sources 3 basically coincides with the upper surface of the wafer 9. Since there are multiple lighting light sources 3 and they correspond one-to-one to the multiple dark field microscopes 41, multiple point-like parts on the upper surface of the wafer 9 can be detected at one time, thereby greatly reducing the detection time; and since the lighting light source 3 is detachably connected to the fixed seat 7 on the mounting frame 2, it can be easily replaced after a certain lighting light source 3 is damaged; in general, by using the dark field scattering wafer surface defect detection device, multiple parts of the wafer can be detected at one time, greatly reducing the time required for wafer detection.

[0062] It should be noted that the above-mentioned unpatterned wafer 9 refers to a bare silicon wafer or a silicon wafer with some blank films. Typical defects on its surface include particles, residues, scratches, native crystal pits, cracks, etc. These defects will affect the processing quality of subsequent processes and ultimately affect the yield of the product. When there is no pattern on the wafer surface, there is no need for image comparison, and dark field detection has the characteristics of high speed and high sensitivity, and therefore has higher production capacity.

[0063] It should be noted that the surface of the above-mentioned multiple dark-field microscopes 41 refers to the surface of the central axis of the above-mentioned multiple dark-field microscopes 41; the surface of the above-mentioned multiple illumination light sources 3 refers to the surface of multiple detection lights; since the detection is on the upper surface of the wafer 9, the position of the illumination light source 3 is obviously higher than the wafer 9, and the light emitted by the illumination light source 9 also obviously extends obliquely downward.

[0064] See attached Figure 1 -Attached Figure 6 Furthermore, in order to facilitate observation in the prior art, the detection device is usually set at a height that is adapted to the height of the human body. Since the brightness of the light emitted by the illumination light source 3 is relatively high and there is usually no obstruction in the path after reflection, if a person passes by, the eyes may be irradiated and damaged. Therefore, a baffle 10 can also be set on the reflection path of the detection light to prevent the light from directly irradiating the eyes. The baffle 10 can be made of a light-absorbing material to prevent the light from continuing to reflect after it hits the baffle 10. It can also be made of a smooth material so that the light can be reflected to a higher position after it hits the baffle 10, thereby missing the height of the human body. It should be noted that when the baffle 10 can reflect light, there are certain requirements for the reflection angle, that is, when the light continues to reflect after passing through the baffle 10, the light must be as close to the vertical direction as possible to ensure that it does not irradiate the human body.

[0065] See attached Figure 7 -Attached Figure 9 There are many detachable connection methods. In order to more clearly and vividly understand how the lighting source 3 is connected to the fixing base 7, this embodiment introduces one of the connection methods. Specifically, a V-shaped groove 71 is provided on the upper surface of the fixing base 7, and the lighting source 3 is basically cylindrical and is magnetically connected in the V-shaped groove 71.

[0066] Through the design of the above structure, the basically cylindrical lighting source 3 can be clamped in the V-shaped groove 71, and the magnetic attraction between the fixing seat 7 and the lighting source 3 can prevent the lighting source 3 from sliding out of the V-shaped groove 71 by itself. It has the advantages of simple structure, reliable connection, and convenient and quick disassembly and assembly.

[0067] See attached Figure 2 And attached Figure 8 -Attached Figure 10 In order to further prevent the lighting source 3 from sliding out of the V-shaped groove 71, the following design is carried out in this embodiment. Specifically, a first anti-slip pad 72 is provided on the top of the fixing seat 7, a second anti-slip pad 73 is provided on the upper surface of the V-shaped groove 71, and an annular limit block 31 is provided on the top of the lighting source 3 to prevent the lighting source 3 from sliding downward relative to the fixing seat 7.

[0068] Through the design of the above structure, the first anti-slip pad 72 and the limit block 31 cooperate with each other, so that even if the lighting light source 3 is subjected to downward force, it is not easy to slide out of the V-shaped groove 71 by itself, and it can be prevented from staying in the same position every time; the second anti-slip pad 73 can prevent the lighting light source 3 and the fixing seat 7 from sliding and dislocating relative to each other.

[0069] Furthermore, the material of the first anti-slip pad 72 and the second anti-slip pad 73 can be silicone, which is safe, non-toxic and durable. The surfaces of the first anti-slip pad 72 and the second anti-slip pad 73 can be provided with textures to further enhance friction and anti-slip performance.

[0070] To facilitate understanding of the lighting source 3, the following design is implemented in this embodiment. Specifically, the lighting source 3 is substantially cylindrical and the emitted light coincides with its own axis. The distance between the corresponding positions of two adjacent lighting sources 3 can be decomposed into a horizontal spacing and an inclined spacing parallel to the extension line of the lighting source 3. The length of the horizontal spacing is greater than the radius of the lighting source 3, and the length of the inclined spacing is greater than the length of the lighting source 3.

[0071] See attached Figure 3 -Attached Figure 6 There are many structures that can change the spatial position of the carrier. In the prior art, there is a method of making the detection path cover the entire upper surface of the wafer 9 by rotating and moving. Specifically, its path is from point to circle line, from circle to surface, but this method is difficult to ensure that the center of the circular path coincides with the center of the wafer 9. Therefore, another movement method is adopted in this embodiment. Specifically, the moving platform 5 includes a workbench 51, a longitudinal movement component 52, a lateral movement component 53, and a vertical movement component 54. The workbench 51 is used to carry the wafer 9 to be inspected; the longitudinal movement component 52 is driven and connected to the workbench 51, used to drive the workbench 51 and the wafer 9 to move back and forth; the lateral movement component 53 is driven and connected to the longitudinal movement component 52, used to drive the longitudinal movement component 52 to move left and right, so as to cooperate with the longitudinal movement component 52 to change the position of the wafer 9 on the horizontal plane; the vertical movement component 54 is arranged on the base 1 and the top is driven and connected to the lateral movement component 53, used to drive the lateral movement component 53 to move up and down, so as to cooperate with the lateral movement component 53 and the longitudinal movement component 52 to change the position of the wafer 9 in the three-dimensional space.

[0072] Through the design of the above structure, the position of the wafer 9 in the horizontal, longitudinal and vertical directions can be changed by pure movement, so that the intersection of the upper surface of the wafer 9 and the detection light is changed. The detection path is from point to straight line, and then from straight line to plane.

[0073] See attached Figure 3 -Attached Figure 6There are many structures that can move longitudinally. One of them is introduced in this embodiment. Specifically, a first guide hole 511 and a first threaded hole 512 are provided on the workbench 51. The axis of the first guide hole 511 and the axis of the first threaded hole 512 are parallel to each other and arranged longitudinally. The longitudinal moving component 52 includes a first moving member 521, two first fixing members 522, a first guide rod 523, a first screw 524, and a first motor 525. The first moving member 521 drives the connection to the transverse moving component 53; the two first fixing members 522 are It is fixedly connected to the top of the first movable member 521, and the line connecting the corresponding positions of the two first fixing members 522 is arranged longitudinally; the first guide rod 523 is longitudinally arranged between the two first fixing members 522, and the side of the first guide rod 523 is slidingly connected to the first guide hole 511; the first screw rod 524 is rotatably connected between the two first fixing members 522 and is arranged longitudinally, and the first screw rod 524 is engaged in the first threaded hole 512; the first motor 525 is fixedly connected to one of the first fixing members 522 and drives the first screw rod 524.

[0074] With the above structural design, when the first motor 525 on the first fixing member 522 is started, the first screw 524 will rotate accordingly and drive the workbench 51 to move along the direction of the first guide rod 523, thereby changing the longitudinal position of the wafer 9 in the horizontal plane.

[0075] See attached Figure 3 -Attached Figure 6 There are many structures that can move horizontally. This embodiment introduces one of them. Specifically, the first moving member 521 is provided with a second guide hole 526 and a second threaded hole 527. The axis of the second guide hole 526 and the axis of the second threaded hole 527 are parallel to each other and are arranged horizontally. The horizontal moving assembly 53 includes a second moving member 531, two second fixing members 532, a second guide rod 533, a second screw rod 534, and a second motor 535. The second moving member 531 drives the vertical moving assembly 54; the two second fixing members 532 They are all fixedly connected to the top of the second movable member 531, and the line connecting the corresponding positions of the two second fixing members 532 is arranged horizontally; the second guide rod 533 is arranged horizontally between the two second fixing members 532, and the side of the second guide rod 533 is slidably connected to the second guide hole 526; the second screw 534 is rotatably connected between the two second fixing members 532 and is arranged horizontally, and the second screw 534 is engaged in the second threaded hole 527; the second motor 535 is fixedly connected to one of the second fixing members 532 and drives the second screw 534.

[0076] Through the design of the above structure, the second motor 535 on the second fixing member 532 is started, and the second screw 534 will rotate accordingly, and drive the first movable member 521 to move along the direction of the second guide rod 533, thereby changing the horizontal position of the wafer 9 in the horizontal plane. In conjunction with the longitudinal moving component 52, the position of the wafer 9 in the horizontal plane can be changed.

[0077] See attached Figure 3 -Attached Figure 6 There are many structures that can move vertically, and one of them is introduced in this embodiment. Specifically, the vertical moving component 54 includes a hydraulic cylinder 541 and a hydraulic rod 542. The hydraulic cylinder 541 is fixedly connected to the bottom of the base 1; the bottom of the hydraulic rod 542 drives the hydraulic cylinder 541, and the top passes through the base 1 and is fixedly connected to the second moving member 531.

[0078] Through the above structural design, when the hydraulic cylinder 541 is started, the hydraulic rod 542 will drive the lateral moving assembly 53 to move up and down, thereby changing the height of the wafer 9 in the vertical direction.

[0079] See attached Figure 1 , Attachment Figure 12 and attached Figure 13 In the prior art, the wafer 9 is usually placed directly on a plane, but the wafer 9 itself is also a plane, so it is not easy to take and place. In order to solve the above problem, the following design is carried out in this embodiment. Specifically, it also includes a carrier assembly 8 for carrying the wafer 9. The carrier assembly 8 is composed of multiple bosses 81. The bosses 81 are cylindrical and different bosses 81 have different diameters. Multiple bosses 81 are stacked and the diameters decrease from bottom to top. The diameter of the boss 81 at the top is smaller than the diameter of the wafer 9, and the diameter of the boss 81 at the top is smaller than the radius of the wafer 9.

[0080] Through the design of the above structure, since the diameter of the boss 81 at the top is smaller than the diameter of the wafer 9, the edge of the wafer 9 is suspended after being placed, which is convenient for taking and placing; and since the diameter of the boss 81 at the top is smaller than the radius of the wafer 9, the wafer 9 is easy to place and is relatively firm after being placed and is not easy to fall over.

[0081] See attached Figure 12 and attached Figure 13Furthermore, in order to prevent the relative positions of the top of the mobile platform 5, the multiple bosses 81, and the wafer 9 from changing during the movement of the mobile platform 5, resulting in the detection part of the wafer 9 not moving along the expected path, thereby affecting the detection result, the following design is carried out in this embodiment. Specifically, the top of the mobile platform 5 and the top of the boss 81 are both provided with a positioning groove 82, and the bottom of the boss 81 is provided with a positioning protrusion 83 corresponding to the positioning groove 82, which is used to fix the relative position of the top of the mobile platform 5 and the multiple bosses 81, and the top of the boss 81 is provided with a third anti-slip pad 84.

[0082] Through the design of the positioning groove 82 and the positioning protrusion 83 in the above structure, relative movement between the top of the movable platform 5 and the boss 81 and between multiple bosses 81 can be effectively prevented; through the design of the third anti-slip pad 84 in the above structure, relative movement between the boss 81 and the wafer 9 can be effectively prevented.

[0083] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0084] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0085] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A dark field scattering wafer surface defect detection device for detecting surface defects of a blank wafer, comprising a base, characterized in that: Also includes: A mounting frame, the mounting frame is arranged on the base, and the mounting frame is provided with a plurality of fixing seats, the plurality of fixing seats are parallel to each other and located in the same plane; a plurality of illumination light sources, each of which can emit light for illuminating the wafer to be inspected, wherein the plurality of illumination light sources correspond to the plurality of fixing bases in a one-to-one manner, and the illumination light sources are detachably connected to the fixing bases so that the light rays emitted by the plurality of illumination light sources are parallel to each other and located in the same plane; A dark-field microscope device, the dark-field microscope device being disposed on the base and used for imaging, the dark-field microscope device comprising a plurality of mutually independent dark-field microscopes, the plurality of dark-field microscopes being linearly arranged and corresponding one-to-one with the plurality of illumination light sources, the surface passing through the plurality of dark-field microscopes and the surface passing through the plurality of illumination light sources having an intersection line, the intersection line being a horizontal line; a movable platform, the movable platform being arranged on the base and being used for carrying the wafer to be inspected and adjusting the spatial position of the wafer so that the upper surface of the wafer can coincide with the intersection line; A computer is arranged on the base, and the illumination light source, the dark field microscope device, and the mobile platform are all electrically connected to the computer, and is used to control the switch of the illumination light source, the movement of the mobile platform, and enhance the image information collected by the dark field microscope device and extract defects.

2. The dark field scattering wafer surface defect detection device according to claim 1, characterized in that: A V-shaped groove is provided on the upper surface of the fixing seat, and the lighting source is substantially cylindrical and is magnetically connected in the V-shaped groove.

3. The dark field scattering wafer surface defect detection device according to claim 2, characterized in that: A first anti-slip pad is provided on the top of the fixing seat, a second anti-slip pad is provided on the upper surface of the V-shaped groove, and an annular limiting block is provided on the top of the lighting source to prevent the lighting source from sliding downward relative to the fixing seat.

4. The dark field scattering wafer surface defect detection device according to claim 1, characterized in that: The lighting light source is basically cylindrical and the emitted light coincides with its own axis. The distance between the corresponding positions of two adjacent lighting light sources can be decomposed into a horizontal spacing and an inclined spacing parallel to the extension line of the lighting light source. The length of the horizontal spacing is greater than the radius of the lighting light source, and the length of the inclined spacing is greater than the length of the lighting light source.

5. The dark field scattering wafer surface defect detection device according to claim 1, characterized in that: The mobile platform includes: A workbench, the workbench being used to carry a wafer to be inspected; A longitudinal moving component, the longitudinal moving component is driven and connected to the workbench, and is used to drive the workbench and the wafer to move forward and backward; a transverse moving assembly, the transverse moving assembly drivingly connected to the longitudinal moving assembly, and configured to drive the longitudinal moving assembly to move left and right, so as to cooperate with the longitudinal moving assembly to change the position of the wafer on the horizontal plane; A vertical moving component is arranged on the base and is top-driven and connected to the lateral moving component, and is used to drive the lateral moving component to move up and down, so as to cooperate with the lateral moving component and the vertical moving component to change the position of the wafer in the three-dimensional space.

6. The dark field scattering wafer surface defect detection device according to claim 5, characterized in that: The workbench is provided with a first guide hole and a first threaded hole, the axis of the first guide hole and the axis of the first threaded hole are parallel to each other and arranged longitudinally, and the longitudinal moving component includes: a first moving member, the first moving member drivingly connected to the transverse moving assembly; Two first fixing members, both of which are fixedly connected to the top of the first movable member, and the line connecting the corresponding positions of the two first fixing members is arranged longitudinally; a first guide rod, the first guide rod being longitudinally arranged between the two first fixing members, and the side surface of the first guide rod being slidably connected to the first guide hole; a first screw, the first screw being rotatably connected between the two first fixing members and being longitudinally arranged, the first screw being engaged in the first threaded hole; A first motor is fixedly connected to one of the first fixing members and drives the first screw rod.

7. The dark field scattering wafer surface defect detection device according to claim 6, characterized in that: The first moving member is provided with a second guide hole and a second threaded hole, the axis of the second guide hole and the axis of the second threaded hole are parallel to each other and are arranged transversely, and the transverse moving component includes: a second moving member drivingly connected to the vertical moving assembly; Two second fixing members, both of which are fixedly connected to the top of the second movable member, and a line connecting corresponding positions of the two second fixing members is arranged horizontally; a second guide rod, the second guide rod being laterally arranged between the two second fixing members, and the side surface of the second guide rod being slidably connected to the second guide hole; a second screw, the second screw being rotatably connected between the two second fixing members and being laterally arranged, the second screw being engaged in the second threaded hole; A second motor is fixedly connected to one of the second fixing members and drives the second screw rod.

8. The dark field scattering wafer surface defect detection device according to claim 7, characterized in that: The vertical movement component includes: A hydraulic cylinder, the hydraulic cylinder being fixedly connected to the bottom of the base; A hydraulic rod, wherein the bottom of the hydraulic rod is drivingly connected to the hydraulic cylinder, and the top of the hydraulic rod passes through the base and is fixedly connected to the second moving member.

9. A dark field scattering wafer surface defect detection device according to any one of claims 1 to 8, characterized in that: It also includes a carrier assembly for carrying wafers, which is composed of multiple bosses. The bosses are cylindrical and different bosses have different diameters. Multiple bosses are stacked and their diameters decrease from bottom to top. The diameter of the boss at the top is smaller than the diameter of the wafer so that the edge of the wafer is suspended in the air. The diameter of the boss at the top is smaller than the radius of the wafer so that the wafer is firmly placed.

10. The dark field scattering wafer surface defect detection device according to claim 9, characterized in that: The top of the movable platform and the top of the boss are both provided with positioning grooves, and the bottom of the boss is provided with positioning protrusions corresponding to the positioning grooves, which are used to fix the relative positions of the top of the movable platform and multiple protrusions. The top of the boss is provided with a third anti-slip pad to prevent the boss and the wafer from moving relative to each other.

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