Capacitor and manufacturing method thereof

Abstract

The invention discloses a capacitor and a manufacturing method thereof, the capacitor comprises a shell and a core placed in the shell, the core is formed by winding a base film plated with a metal film, and a layer of anti-oxidation oil film is additionally arranged on one side, far away from the base film, of the metal film. By applying the anti-oxidation oil film on the surface of the metal film, an effective barrier is formed to prevent moisture and oxygen from invading, so that the high-temperature and high-humidity resistance of the capacitor is remarkably improved, and long-term stable work of the capacitor is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to a capacitor and a manufacturing method thereof. Background Art

[0002] The new energy sector will inevitably employ drive controllers, inverters, or converters, driving a return to the growth of metallized film capacitors. Metallized film capacitors provide busbar support and filtering in control drive boards, and their performance is crucial to the stable operation of the equipment. However, the application environment for control drive equipment in the new energy sector is relatively harsh. For example, photovoltaic and wind power equipment is built in coastal areas or even offshore. Under these conditions, high temperatures can easily cause moisture to enter the capacitor core through the epoxy surface of the metallized film capacitor. This moisture then oxidizes the metallized film, causing the capacitor to fail. Therefore, a capacitor is urgently needed to address the current issue of capacitors being unable to withstand high temperatures and humidity. Summary of the Invention

[0003] The embodiments of the present invention provide a capacitor and a method for manufacturing the same, aiming to solve the problem that capacitors in the prior art are not resistant to high temperature and high humidity.

[0004] In a first aspect, the present invention provides a capacitor comprising a shell and a core, wherein the core is arranged in the shell, and the core is wound by a base film plated with a metal film, wherein an anti-oxidation oil film is also attached to the side of the metal film away from the base film.

[0005] In a second aspect, the present invention provides a flipping device, which is applied to the capacitor as described above, and the method includes: vacuum evaporating the metal film on the surface of the base film, and controlling the oil temperature to evaporate the anti-oxidation oil and adhere to the surface of the metal film to form the anti-oxidation oil film; winding the coated base film into the core; performing a film sintering treatment on the core; installing the core into the shell; and pouring packaging material into the shell and curing it.

[0006] Compared with the prior art, the present invention has the following beneficial effects:

[0007] The technical solution of this invention comprises a capacitor housing and a core placed within it. The core is made of a wound base film coated with a metal film. A layer of anti-oxidation oil film is applied to the side of the metal film facing away from the base film. This anti-oxidation oil film forms an effective barrier against the intrusion of moisture and oxygen, significantly improving the capacitor's resistance to high temperatures and humidity, ensuring long-term stable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0009] Figure 1 Schematic diagram of the structure of a capacitor according to an embodiment of the present invention;

[0010] Figure 2 is a top view of a capacitor according to an embodiment of the present invention;

[0011] Figure 3 is a schematic cross-sectional view of a capacitor according to an embodiment of the present invention;

[0012] Figure 4 is a partially enlarged view of a cross-sectional schematic diagram of a capacitor according to an embodiment of the present invention;

[0013] Figure 5 This is a three-dimensional structural diagram of a capacitor according to an embodiment of the present invention when no packaging material is filled;

[0014] Figure 6 Schematic diagram of the structure of the capacitor housing according to an embodiment of the present invention;

[0015] Figure 7 A top view of a housing of a capacitor according to an embodiment of the present invention;

[0016] Figure 8 This is a table of high temperature and high humidity test data of capacitors produced by conventional technology according to an embodiment of the present invention;

[0017] Figure 9 This is a table of high temperature and high humidity test data of capacitors produced by the process of the embodiment of the present invention;

[0018] Figure 10 A diagram showing the steps of a method for manufacturing a capacitor according to an embodiment of the present invention;

[0019] Figure 11 A diagram of sub-steps of a method for manufacturing a capacitor according to an embodiment of the present invention;

[0020] Figure 12 FIG2 is another sub-step diagram of the capacitor manufacturing method according to an embodiment of the present invention.

[0021] Description of the figure mark:

[0022] 10. Core; 11. Base film; 12. Metal film; 121. Outer film; 13. Anti-oxidation oil film; 14. Aluminum foil layer;

[0023] 20. Housing; 21. Opening; 22. Bottom surface; 23. Inner wall; 241. First protrusion; 242. Second protrusion; 243. Third protrusion; 244. Guide groove;

[0024] 30. Pins;

[0025] 40. Packaging materials. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0027] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In order to solve the problem that the capacitors in the prior art are not resistant to high temperature and high humidity, the present invention proposes a capacitor. Figures 1 to 7The capacitor includes a housing 20 and a core 10. The core 10 is housed within the housing 20 and is formed by winding a base film 11 coated with a metal film 12. The metal film 12 is also coated with an anti-oxidation oil film 13 on the side facing away from the base film 11. The capacitor core 10 is made from high-quality base film 11 through a precise slitting and winding process. The base film 11 is typically made of a surface-treated thin film material to ensure film quality during the subsequent metal evaporation process. During the metallization process, a uniform layer of metal film 12 is deposited on the surface of the base film 11 under vacuum using a specific evaporation process. This process uses controlled evaporation temperature and time to ensure dense adhesion and excellent conductivity of the metal layer. To enhance the metal film 12's antioxidant capacity and improve its performance in high-temperature and high-humidity environments, a layer of anti-oxidation oil film 13 is introduced during the metallization film deposition process. In practice, the oil temperature during the evaporation stage is adjusted to allow the anti-oxidation oil to evaporate and adhere to the surface of the metal film 12. The anti-oxidation oil naturally evaporates and deposits on the surface of the metal film 12, forming a uniform protective layer. This oil film can effectively slow down the oxidation reaction of the metal film 12, ensuring the stability of the metal layer of the core 10 in high temperature and high humidity environments. In actual operation, polypropylene (PP) or polyphenylene sulfide (PPS) film is used as the base film 11 material. During the metal plating process, after the metal film 12 is deposited in a vacuum environment, the anti-oxidation oil is immediately evaporated by controlling the oil temperature to 80-120°C and evenly adhere to the surface of the metal film 12, forming a continuous anti-oxidation oil film 13 protective layer.

[0029] In one embodiment, one end of the core 10 is provided with an ablative insulating layer (not shown) formed by a sintering process. The ablative insulating layer is formed by sintering on one end of the core 10 to enhance the insulation performance of the end of the core 10 and prevent short circuits or leakage during subsequent soldering and lead-out processes. This ablative insulating layer is formed using a sintering process. First, the surface of the end of the core 10 is cleaned to ensure it is dust- and oil-free. Then, under specific temperature and atmospheric conditions, the end of the core 10 is exposed to a high-temperature environment to form a thin oxide film or insulating film on the surface. This process can be achieved through high-temperature ablation or oxidation reaction. Specifically, a laser ablation process is used to locally ablate and remove the metallized film layer on one end of the core 10, forming an ablative insulating layer with a width of 0.5 to 1.0 mm. This step selectively removes the metal conductive layer on this end, creating an insulating region. This embodiment intentionally utilizes a single-sided sintering process, which is significantly different from the double-sided sintering process used in traditional capacitor manufacturing. During the film burning process, the laser energy and ablation time need to be precisely controlled to ensure that the metal layer in the target area is completely removed to achieve sufficient insulation, while avoiding excessive ablation to damage the base film 11 material. This special design of single-sided ablation has multiple technical advantages. Compared with traditional double-sided burning, more effective electrode area is retained, which improves the capacity density per unit volume of the capacitor. While ensuring reliable electrical connections inside the core 10, the risk of water vapor infiltration along the end is significantly reduced. After the ablation is completed, the metallized film layer remains intact at the other end of the core 10 for subsequent gold spraying and electrode extraction.

[0030] Furthermore, a conductive gold spraying layer is provided on the end of one side of the core 10 away from the ablated insulating layer, and the conductive gold spraying layer is connected to the metal film 12. After the capacitor completes the single-sided film burning process, a conductive gold spraying layer needs to be made on the other end face of the core 10 that has not been ablated. The specific method includes using a high-pressure spray gun to spray molten zinc-tin alloy or copper alloy particles onto the intact end face of the core 10. These high-temperature metal particles will firmly adhere to the metal film 12 exposed at the end to form a dense conductive gold spraying layer. The thickness of the gold spraying needs to be controlled within the range of 20-50μm. Too thin will lead to poor contact, and too thick may affect subsequent assembly. It is also necessary to note that the gold spraying position must be precisely aligned with the un-ablated end area to avoid metal particles splashing onto the ablated insulating layer and causing a short circuit. The gold spraying layer constructs a low-resistance conductive path on the un-ablated side, which not only ensures good lead-out of the capacitor electrode and ensures excellent electrical connection, but also does not destroy the moisture-proof function of the ablated insulating layer.

[0031] In one embodiment, referring to Figure 3The portion of the metal film 12 extending from the winding end of the base film 11 along the winding direction is the outer film 121, and the outer film 121 is wound multiple times along the winding direction. The portion of the metal film 12 extending from the winding end of the base film 11 along the winding direction is designed as the outer film 121, and its main purpose is to enhance the packaging effect of the end of the core 10 and improve its moisture resistance. This outer film 121 is formed by continuously winding multiple times along the winding direction after the metal film 12 is wound on the core 10, ensuring that the entire end area of ​​the core 10 is fully protected. After the base film 11 undergoes the metallization, slitting and winding processes, when the core 10 is wound to a preset number of turns, the end of the metal film 12 is continued to be wound multiple times along the winding direction to ensure that it is not exposed or affected by external moisture or mechanical stress during the subsequent packaging process. In the solution of the present invention, based on actual experimental results, the above number of turns is generally selected to be between 20 and 30 turns. To achieve continuous winding for multiple turns, mechanical equipment such as automatic winders precisely control the winding angle and tension to ensure that the outer film 121 is uniform and close-fitting. After the winding is completed, the outer film 121 is tightly combined with the remaining metal film 12 of the core 10 to form a whole. The outer film 121 continues to be wound multiple times along the winding direction, thereby establishing a solid sealing layer in the end area of ​​the core 10. This continuous winding design can effectively prevent moisture from penetrating into the interior of the core 10 along the winding line, while improving the mechanical strength and stress resistance of the end. The material of the outer film 121 is generally the metal film 12 or a specially treated metallized layer to ensure that it has excellent antioxidant and high temperature resistance.

[0032] Furthermore, the continuous multi-turn outer film 121 facilitates subsequent welding or lead extraction operations, as it provides a stable conductive surface and mechanical support, contributing to the stability and reliability of the solder joints. The entire winding process design not only ensures the sealing of the ends of the core 10 but also enhances the overall structural integrity of the core 10, helping the capacitor achieve long-term performance stability in high-temperature and high-humidity environments. This technical solution fully utilizes the sealing advantages of multi-turn winding, significantly improving the moisture resistance of the capacitor and its reliability in extreme environments.

[0033] In one embodiment, referring to Figure 3The outer periphery of the core 10 is also wrapped with an aluminum foil layer 14. After the gold spraying process, the capacitor core 10 is completely wrapped with an aluminum foil protective layer. A special double-sided composite aluminum foil tape is used to tightly wrap the aluminum foil layer 14 around the outer surface of the core 10 using a spiral wrapping method. The thickness of the aluminum foil layer 14 is preferably 30-50 μm, and the tape width is selected based on the size of the core 10, typically 10-15 mm. During the wrapping process, ensure that the overlapping portions of the aluminum foil tape have a 2-3 mm overlap to form a continuous sealing protective layer. Maintain appropriate tension during wrapping to avoid deformation of the core 10 caused by excessive tightening or wrinkling caused by excessive loosening. Finally, after wrapping, heat pressing is performed to ensure that the aluminum foil tape is fully adhered to the surface of the core 10. The aluminum foil protective layer acts as a physical barrier, effectively blocking the intrusion of external moisture and contaminants. It also forms a gradient protection system with the internal anti-oxidation oil film 13 and the single-sided burnt film structure, significantly improving the product's reliability in harsh environments.

[0034] In one embodiment, referring to Figures 1 to 3 、 Figure 6 and Figure 7 A packaging material 40 is also provided between the shell 20 and the core 10. The shell 20 has an opening 21, and a first protrusion 241 is provided on the inner wall surface of the shell 20 facing the opening 21. The first protrusion 241 abuts the core 10 on the side closest to the opening 21. The inner wall surface of the shell 20 facing the opening 21 refers to the bottom surface 22. A special packaging material 40 is provided between the shell 20 and the core 10 of the capacitor to provide additional mechanical support and moisture isolation, thereby enhancing the environmental resistance of the overall product. The shell 20 has an opening 21 to facilitate the entry and packaging of the core 10, and a first protrusion 241 structure is provided on the side of the shell 20 facing the opening 21. The first protrusion 241 abuts the core 10, and fixes the position of the core 10 when the packaging material 40 is not poured between the shell 20 and the core 10, so that there is enough gap between the core 10 and the inner wall surface of the shell 20 to allow the packaging material 40 to flow in, and prevents the core 10 from shifting or vibrating during assembly, packaging or transportation. The gap between the shell 20 and the core 10 is filled with epoxy resin or other suitable packaging materials 40. This packaging material 40 has good adhesion, insulation and moisture resistance, can effectively block the infiltration of external water vapor and oxygen, while buffering mechanical stress and protecting the integrity of the core 10 and the metal film 12. The addition of packaging material 40 also helps to improve the sealing and thermal conductivity of the overall package.

[0035] The first protrusion 241 is more than just a simple support structure; it actually forms a sophisticated resin flow guide system. By controlling the contact position and gap size between the protrusion and the core 10, the resin flow path and filling sequence can be precisely guided, ensuring that the bottom of the core 10, traditionally the most difficult area to fill, is completely coated.

[0036] Further, refer to Figure 6 and Figure 7 , a plurality of second protrusions 242 are protruded along the edge of the opening 21 in a direction away from the housing 20, and the second protrusions 242 are used to abut the circuit board on which the capacitor is installed. The housing 20 is designed with a plurality of second protrusions 242 along the edge of the opening 21. These second protrusions 242 protrude along the edge of the opening 21 in a direction away from the housing 20, and are mainly used to abut the circuit board on which the capacitor is installed. After the second protrusions 242 abut the circuit board, a reserved gap can be formed between the two. This gap not only provides a dissipation channel for the heat inside the capacitor, avoiding the temperature increase caused by excessive closure of the sealed space, but also helps air circulation and improves the heat dissipation effect, thereby reducing the temperature rise in the working environment and improving the working stability and reliability of the capacitor. Each second protrusion 242 is formed by the molding process of the edge of the housing 20, and has a certain height and width, so that it can reliably match the corresponding structure of the circuit board during installation.

[0037] In addition, the capacitor is also equipped with a pin 30. A guide groove 244 extending toward the opening 21 is provided on the inner side wall 23 of the housing 20 near the opening 21. The guide groove 244 is designed to guide the pin 30 to be accurately positioned during installation, ensuring that the connection between the pin 30 and the core 10 is reliable and stable. In order to achieve accurate guidance and positioning of the pin 30, the guide groove 244 is formed by clamping two spaced third protrusions 243 extending in the direction of the opening 21 on the inner side wall 23 near the opening 21. The two second protrusions 242 are spaced apart from each other to form a groove-shaped space, namely the guide groove 244. The two third protrusions 243 stabilize the formation of the guide groove 244 through the clamping action, reducing assembly errors. At the same time, they play a role in protecting the connection end of the pin 30 and the core 10 during the guiding process, preventing mechanical damage or deviation caused by improper installation. The size and depth of the guide groove 244 are optimized to take into account both the size matching of the pin 30 and the convenience and guidance of assembly, ensuring that the pin 30 can be smoothly and correctly inserted into the conductive end formed by the core 10.

[0038] The present invention also discloses a method for manufacturing a capacitor, which is applied to the above capacitor, referring to Figure 10 , the method comprising:

[0039] S110, vacuum evaporating the metal film on the surface of the base film, and controlling the oil temperature to allow the anti-oxidation oil to evaporate and adhere to the surface of the metal film to form the anti-oxidation oil film;

[0040] S120, winding the coated base film into the core;

[0041] S130, performing a film sintering process on the core;

[0042] S140, installing the core into the housing;

[0043] S150: pouring packaging material into the shell and curing it.

[0044] In this manufacturing method, a vacuum evaporation process is first used to deposit a metal film 12 on the surface of a base film 11. This process is performed using high-precision evaporation equipment to ensure a uniform and dense metal layer. To enhance the oxidation resistance of the metal film 12, a special process is used to control the oil temperature during the evaporation process, allowing the anti-oxidation oil to naturally evaporate and adhere to the surface of the metal film 12, forming a uniform anti-oxidation oil film 13, thereby significantly reducing the oxidation reaction of the metal film 12 in a high temperature and high humidity environment. Next, the base film 11 coated with the metal film 12 is cut and wound into the shape of a core 10, forming a metalized film core 10 with a certain number of turns. To meet the requirements of capacitance and moisture resistance, the number of turns is usually controlled to be around 20 to 30 turns. After winding is completed, the core 10 is subjected to a film sintering process. Through high-temperature sintering or oxidation reaction, the insulation layer and structural integrity of the metal film 12 are further insulated and strengthened, providing a good foundation for subsequent packaging. After film firing, the core 10 is securely installed in the pre-set housing 20, ensuring a tight fit between the core 10 and the housing 20, thereby ensuring effective packaging and heat dissipation. During the packaging step, the interior of the housing 20 is filled with a pre-treated encapsulating material 40, such as epoxy resin, to seal the gap between the core 10 and the external environment. After pouring, the encapsulating material 40 cures to form a strong and stable seal, effectively improving the capacitor's resistance to high-temperature and high-humidity environments and its mechanical reliability.

[0045] Through the above process, the capacitor of the present invention exhibits excellent reliability and durability in harsh environments such as new energy, and fully meets the demand of modern electronic equipment for high-performance capacitors.

[0046] In one embodiment, referring to Figure 11 The steps of S120 include:

[0047] S121, winding the base film coated with the metal film to obtain a first wound body;

[0048] S122 , continuing to wind the metal film at the winding end of the first winding body that is not connected to the base film for a preset number of turns along the winding direction based on the first winding body.

[0049] First, the first stage of winding is carried out to form an effective capacitance area. The base film 11 that has been vacuum-coated and has an anti-oxidation oil film 13 is precisely wound according to preset parameters. Using a computer-controlled automatic winder, under constant tension conditions, the base film 11 is wound to the designed number of turns to form a first wound body with a rated capacitance value. This stage requires strict control of the interlayer spacing and winding tightness, usually controlling the winding speed at 30-40 rpm to ensure that the metal film 12 layers are in close contact without excessive extrusion that causes the anti-oxidation oil film 13 to rupture.

[0050] Then, the second stage of winding is carried out to form an outer protective layer. After completing the winding of the effective capacitance area, the base film 11 is not cut immediately. Instead, the winding machine is controlled to continue to wind the metal film 12 at the end of the first winding body in the same direction for 20-30 turns, forming a special protective outer film 121 layer. Specifically, during the second stage of winding, the same winding tension as the previous stage should be maintained to avoid interlayer deformation due to tension changes. It is also necessary to use an optical sensor to count and ensure that the number of turns of the outer film 121 is accurately controlled within the range of 20-30 turns. At the same time, the flatness of the outer film 121 needs to be continuously monitored during the winding process to prevent wrinkles or misalignment. This range of 20 to 30 turns has been optimized through process optimization to ensure a high capacitance and enhance the core 10's barrier ability to moisture through the sealing effect of multiple turns. The secondary winding usually adopts automated operation to ensure a consistent number of turns and tight winding, thereby improving electrical stability. Through the continuous winding of the above two steps, the structural stability formed by the basic winding and the sealing effect of the secondary winding are fully utilized to ensure the electrical performance and mechanical reliability of the core 10 in a high temperature and high humidity environment.

[0051] In one embodiment, referring to Figure 12 The S130 also includes:

[0052] S131, performing a film burning process on one end of the core;

[0053] S131, performing gold spraying treatment on the other end of the core.

[0054] First, one end of the core 10 is selected and subjected to a high-temperature film burn-in treatment. Specifically, a pulsed laser is used to precisely ablate one end of the core 10, with the ablation depth controlled to completely remove the metal film 12 without damaging the base film 11. After the burn-in treatment is complete, the other end of the core 10 is subjected to a gold spraying treatment. Using a high-pressure spray gun or spraying equipment, a high-purity metal, such as gold or gold-plated material, is sprayed onto the end face of the core 10, forming a uniform, highly conductive metal layer. This differentiated endpoint treatment process, combined with the aforementioned anti-oxidation oil film 13 and outer coating 121 technologies, constitutes a complete protective system.

[0055] Reference Figure 8 and Figure 9 To better demonstrate the superior performance of the capacitors of the present invention compared to conventional capacitors, dual 85°C (85°C) high-temperature and high-humidity tests were conducted, and a table of experimental results for the conventional capacitors and the capacitors of the present invention was obtained. During the 1000-hour damp heat test, the capacitance change of the capacitors was significantly reduced, with the change value approaching or falling below ±0.0003, indicating significant improvements in their welding loss and leakage characteristics. In contrast, the experimental results of the capacitor samples manufactured using conventional processes showed generally larger changes in these parameters and significant fluctuations, indicating that they are susceptible to moisture, leading to performance degradation.

[0056] Looking at the capacity change ratio, or the change ratio, in the experimental data for the capacitors of the present invention, most of the change ratios are far lower than the corresponding values ​​for capacitor samples manufactured using conventional processes. For example, the capacitance change of sample No. 1 changed from 0.0063 to 0.00005, and the change ratio decreased from 0.0063 to 0.00005, indicating that this capacitor has achieved a higher stability in capacity retention. The variation rate of sample No. 6 decreased from 0.0054 to 0.00007, a significant reduction.

[0057] Therefore, combining the two test data shows that the process optimization of the present invention significantly improves the capacitor's sealing and moisture resistance, resulting in extremely low capacitance decay in extreme environments and significantly superior performance stability to traditional capacitors. Based on this performance improvement, the capacitor of the present invention has greatly expanded its application range in high-end markets such as new energy, industrial control, transportation, and aerospace, and is expected to lead the capacitor industry towards higher performance, longer lifespan, and wider adaptability, with a promising future.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A capacitor, characterized in that: The invention comprises a shell and a core, wherein the core is arranged in the shell and is wound by a base film coated with a metal film, wherein an anti-oxidation oil film is attached to a side of the metal film away from the base film.

2. A capacitor according to claim 1, characterized in that: An ablation insulation layer formed by a film burning process is provided at one end portion of the core.

3. A capacitor according to claim 2, characterized in that: A conductive gold spraying layer is provided on an end portion of the core away from the ablation insulating layer, and the conductive gold spraying layer is connected to the metal film.

4. The capacitor according to claim 1, wherein: The portion of the metal film extending from the winding end of the base film along the winding direction is the outer film, and the outer film is wound in multiple turns along the winding direction.

5. The capacitor according to claim 1, wherein: The outer peripheral side of the core is further wrapped with an aluminum foil layer.

6. The capacitor according to claim 1, wherein: A packaging material is provided between the shell and the core. The shell is provided with an opening. A first protrusion is provided on the inner wall surface of the shell facing the opening. The first protrusion abuts against the core on a side close to the opening.

7. The capacitor according to claim 6, characterized in that: A plurality of second protrusions are protruded along the edge of the opening in a direction away from the housing, and the second protrusions are used to abut against a circuit board on which the capacitor is mounted.

8. A method for manufacturing a capacitor, characterized in that: Applied to the capacitor according to any one of claims 1 to 7, the method comprises: Vacuum evaporating the metal film on the surface of the base film, and controlling the oil temperature to allow the anti-oxidation oil to evaporate and adhere to the surface of the metal film to form the anti-oxidation oil film; Winding the coated base film into the core; performing a film burning process on the core; Install the core into the shell; The packaging material is poured into the shell and cured.

9. The capacitor manufacturing method according to claim 8, wherein: The step of winding the coated base film into a core comprises: Winding the base film coated with the metal film to obtain a first wound body; The metal film at the winding end of the first winding body that is not connected to the base film is further wound a preset number of times along the winding direction based on the first winding body.

10. The method for manufacturing a capacitor according to claim 8, wherein: The step of performing a film sintering treatment on the core comprises: Performing a film burning process on one end of the core; The other end of the core is subjected to gold spraying treatment.

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