Bonding device based on power component

Abstract

The invention relates to a bonding device based on a power component. The bonding device comprises a bearing table; the sliding part is in sliding connection with the bearing table in the first direction; the mounting part is in sliding connection with the sliding part in the second direction; the photographing piece is arranged on the mounting piece; the bonding mechanism comprises a bonding head, and the bonding head is connected with the mounting piece; and the optical element is connected with the bonding mechanism, incident light of the photographing piece passes through the optical element to form emergent light, the incident light and the emergent light extend in the third direction, and in the first direction, the emergent light is closer to the bonding head relative to the incident light. The distance between the bonding head and the emergent light is smaller than the distance between the bonding head and the incident light, so that the movement distance and the movement time of the bonding head are relatively short, the working efficiency of bonding the lead by the bonding head is improved, and finally, the working efficiency of the bonding device based on the power component is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a bonding device based on power components. Background Art

[0002] During the bonding process between the wire and the chip, the power component-based bonding device's camera needs to take a picture of the bonding area on the chip to determine the specific location of the bonding area. The bonding head of the power component-based bonding device is then accurately moved to the bonding area so that the wire can be effectively bonded to the chip at the bonding area. However, with traditional power component-based bonding devices, after the camera takes the picture, the bonding head needs to move a long distance to reach the bonding area to bond the wire, which increases the movement time of the bonding head and ultimately reduces the working efficiency of the power component-based bonding device. Summary of the Invention

[0003] A technical problem solved by the present application is how to improve the working efficiency of a bonding device based on power components.

[0004] A bonding device based on a power component, with a first direction, a second direction, and a third direction perpendicular to each other as references, comprising:

[0005] Loading platform;

[0006] A sliding member, slidably connected to the supporting platform along a first direction;

[0007] a mounting member, slidably connected to the sliding member along a second direction;

[0008] A photographing member, arranged on the mounting member;

[0009] a bonding mechanism, comprising a bonding head, wherein the bonding head is connected to the mounting member; and

[0010] An optical element is connected to the bonding mechanism. The incident light of the camera component forms an outgoing light after passing through the optical element. Both the incident light and the outgoing light extend along the third direction. Along the first direction, the outgoing light is closer to the bonding head than the incident light.

[0011] In one embodiment, the optical element includes a fixing member, a first reflector and a second reflector, the second reflector is closer to the bonding mechanism than the first reflector along the first direction, the fixing member is fixedly connected to the bonding mechanism and is provided with a transmission hole, the first reflector and the second reflector are arranged on the fixing member, the incident light passes through the transmission hole and is reflected by the first reflector to form an intermediate light, and the intermediate light is reflected by the second reflector to form the outgoing light.

[0012] In one embodiment, the first reflector and the second reflector are arranged parallel to each other, and the intermediate light extends along the first direction.

[0013] In one embodiment, the bond head is slidably connected to the mounting member along the third direction, and the bond head is rotationally connected to the mounting member by rotating around an axis extending along the third direction.

[0014] In one embodiment, the bonding mechanism further includes a linear motor, a stator of the linear motor is connected to the mounting member, and a rotor of the linear motor is connected to the bonding head to drive the bonding head to slide relative to the mounting member along the third direction.

[0015] In one embodiment, the bonding mechanism further includes a driver, which is connected to the mounting member and drives the bonding head to rotate relative to the mounting member.

[0016] In one embodiment, an anti-falling mechanism is further included, wherein the anti-falling mechanism is arranged on the mounting member and connected to the bonding head.

[0017] In one embodiment, along the third direction, the camera and the optical element are located on opposite sides of the supporting platform.

[0018] In one embodiment, the distance between the emergent light and the bonding head is 18 mm to 21 mm.

[0019] In one embodiment, along the first direction, the distance from the outgoing light to the bond head is less than or equal to half the distance from the incident light to the bond head.

[0020] A technical effect of an embodiment of the present application is that, due to the arrangement of the optical element, the outgoing light is closer to the bond head along the first direction than the incident light. Therefore, after the camera takes a picture to determine the bonding area of ​​the chip, during the process of the bond head moving to the bonding area, the movement distance of the bond head is approximately equal to the distance between the bond head and the outgoing light along the first direction, and the movement distance is not the distance between the bond head and the incident light along the first direction. Given that the distance between the bond head and the outgoing light is smaller than the distance between the bond head and the incident light, the movement distance and movement time of the bond head are shortened, allowing the bond head to quickly reach the bonding area, thereby improving the working efficiency of the bond head in bonding leads such as thick aluminum wires, and ultimately improving the working efficiency of the bonding device based on power components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a bonding device based on power components provided in one embodiment.

[0022] Figure 2 for Figure 1 Enlarged structural diagram at point A in the middle.

[0023] Figure 3 for Figure 1 The figure shows a simplified diagram of the optical path of the camera in the bonding device based on power components.

[0024] Figure 4 for Figure 1 The diagram shows the planar structure of the bonding device based on power components.

[0025] Figure 5 for Figure 4 Enlarged structural diagram at point B in the middle.

[0026] Figure 6 for Figure 1 The figure shows a schematic three-dimensional cross-sectional structure of a bonding device based on power components.

[0027] Figure numerals: bonding device based on power components 10, chip 20, bonding area 21, carrier platform 110, sliding part 120, mounting part 130, photographing part 200, incident light 210, intermediate light 220, outgoing light 230, bonding mechanism 300, bonding head 310, linear motor 320, driver 330, optical element 400, fixing part 430, transmission hole 431, first reflector 410, second reflector 420, anti-fall mechanism 500. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0034] See Figure 1 、 Figure 2 and Figure 3 In one embodiment of the present application, a bonding device 10 based on power components is provided for bonding wires to the bonding area 21 of the chip 20, thereby achieving a fixed connection between the wires and the chip 20. The wires can be thick aluminum wires or aluminum ribbons, etc. Obviously, a variety of different power components are provided on the chip 20. The first direction, the second direction, and the third direction, which are perpendicular to each other, are used as references. The first direction, the second direction, and the third direction can be understood as the extension directions of the three coordinate axes in the spatial rectangular coordinate system. The first direction and the second direction can be understood as horizontal directions. For example, the first direction can be understood as the horizontal horizontal direction, the second direction can be understood as the horizontal longitudinal direction, and the third direction can be understood as the vertical direction. The bonding device 10 based on power components includes a carrier 110, a sliding member 120, a mounting member 130, a photographing member 200, a bonding mechanism 300, and an optical element 400. The sliding member 120 is slidably connected to the carrier 110 along a first direction, so that the sliding member 120 and the carrier 110 can slide relative to each other along the first direction. For example, a slide rail can be provided on the carrier 110, and a slide groove can be provided on the sliding member 120. The slide rail and the slide groove cooperate with each other to achieve the sliding connection relationship between the sliding member 120 and the carrier 110. Of course, the sliding member 120 can be provided with a slide rail, and the carrier 110 can be provided with a slide groove. The slide rail and the slide groove cooperate with each other to achieve the sliding connection relationship between the sliding member 120 and the carrier 110.

[0035] See Figure 1 、 Figure 2 and Figure 3 The mounting member 130 is slidably connected to the sliding member 120 along the second direction. For example, the sliding member 120 can be provided with a slide rail, and the mounting member 130 can be provided with a slide groove. The slide rail and the slide groove cooperate with each other to achieve a sliding connection between the mounting member 130 and the sliding member 120. Of course, the mounting member 130 can be provided with a slide rail, and the sliding member 120 can be provided with a slide groove. The slide rail and the slide groove cooperate with each other to achieve a sliding connection between the mounting member 130 and the sliding member 120.

[0036] See Figure 1 、 Figure 2 and Figure 3 The camera element 200 is disposed on the mounting member 130. The camera element 200 may be an industrial camera, for example. For example, the camera element 200 may be fixedly connected to the mounting member 130, such that the camera element 200 cannot move relative to the mounting member 130 in the first, second, and third directions. The bonding mechanism 300 includes a bonding head 310. The bonding head 310 is connected to the mounting member 130. For example, the bonding head 310 may be fixedly connected to the mounting member 130; the bonding head 310 may also be movably connected to the mounting member 130. In this case, the bonding head 310 may be slidably connected to the mounting member 130 in the third direction, and the bonding head 310 may be rotatably connected to the mounting member 130 by rotating about an axis extending in the third direction. Therefore, the bonding head 310 may slide relative to the mounting member 130 in the third direction, and may also rotate relative to the mounting member 130 about the axis in the third direction. As can be understood, the bond head 310 cannot slide relative to the mounting member 130 in the first and second directions. Therefore, the camera member 200 and the bond mechanism 300 cannot slide relative to each other in the first and second directions. This ensures that the camera member 200 and the bond head 310 always move synchronously in the first and second directions, thus maintaining a constant spacing between the camera member 200 and the bond head 310. Of course, the camera member 200 and the entire bond mechanism 300 always move synchronously in the first and second directions, ensuring that the spacing between the camera member 200 and the entire bond mechanism 300 always remains constant. As can be understood, when the bond head 310 is fixedly connected to the mounting member 130, the camera member 200 and the entire bond mechanism 300 always move synchronously in the first and second directions, ensuring that the spacing between the camera member 200 and the entire bond mechanism 300 always remains constant.

[0037] See Figure 1 、 Figure 2 and Figure 3Since the sliding member 120 slides relative to the platform 110 in a first direction and the mounting member 130 slides relative to the sliding member 120 in a second direction, the mounting member 130 can slide relative to the platform 110 in both the first and second directions, thus providing the mounting member 130 with two degrees of sliding freedom relative to the platform 110. Furthermore, the camera unit 200 and the bonding mechanism 300 are disposed on the mounting member 130, thus providing the camera unit 200 and the bonding mechanism 300 with two degrees of sliding freedom relative to the platform 110 in both the first and second directions.

[0038] See Figure 1 、 Figure 2 and Figure 3 The optical element 400 is connected to the bonding mechanism 300. The incident light 210 emitted by the camera element 200 passes through the optical element 400 and forms an outgoing light 230. The incident light 210 extends along the third direction, and the outgoing light 230 also extends along the third direction, making the incident light 210 and the outgoing light 230 parallel to each other. Along the first direction, the outgoing light 230 is closer to the bonding head 310 than the incident light 210. Therefore, the optical element 400 causes the outgoing light 230 to be closer to the bonding head 310 than the incident light 210. This can be understood as the incident light 210 being deflected as it approaches the bonding head 310. During operation, the sliding member 120 slides relative to the carrier 110 in a first direction, and the mounting member 130 slides relative to the sliding member 120 in a second direction. The emitted light 230 of the camera 200 is first moved to the bonding area 21 of the chip 20. That is, the emitted light 230 covers the bonding area 21 of the chip 20. This allows the camera 200 to photograph the bonding area 21 on the chip 20, thereby determining the specific location of the bonding area 21 on the chip 20. The bond head 310 is then accurately moved to the bonding area 21 so that the bond head 310 can effectively bond the wire to the chip 20 at the bonding area 21.

[0039] Due to the volume of the bonding mechanism 300, the installation space for the camera element 200 on the mounting member 130 is limited. Therefore, a relatively large distance is maintained between the camera element 200 and the bonding head 310 along the first direction. If a mode without the optical element 400 is adopted, the light emitted by the camera element 200 will always extend in a straight line. The light emitted by the camera element 200 can be understood as the incident light 210 of the camera element 200. Therefore, it can be figuratively understood that the incident light 210 and the outgoing light 230 of the camera element 200 are collinear. Because the camera element 200 maintains a large distance from the bond head 310 along the first direction, the light emitted by the camera element 200 maintains a large distance from the bond head 310 along the first direction. During operation, the slide 120 slides relative to the carrier 110 in the first direction, and the mounting member 130 slides relative to the slide 120 in the second direction. This first causes the light emitted by the camera element 200 to move to the bonding area 21 of the chip 20, thereby allowing the camera element 200 to photograph the bonding area 21 on the chip 20 to determine the specific location of the bonding area 21 on the chip 20. The bond head 310 is then accurately moved to the bonding area 21, allowing the bond head 310 to effectively bond the wire to the chip 20 at the bonding area 21. Since the light emitted by the camera 200 maintains a large distance from the bonding head 310 along the first direction, when the bonding head 310 moves to the bonding area 21, the movement distance of the bonding head 310 will be roughly equal to the distance between the light emitted by the camera 200 and the bonding head 310 along the first direction. Therefore, the movement distance and movement time of the bonding head 310 are relatively long, thereby affecting the working efficiency of the bonding head 310 in bonding the leads.

[0040] See Figure 1 、 Figure 2 and Figure 3Regarding the power component bonding apparatus 10 in the aforementioned embodiment, the placement of the optical element 400 causes the outgoing light 230 to be closer to the bond head 310 than the incident light 210. This can be understood as the incident light 210 being deflected as it approaches the bond head 310, meaning that the light emitted by the camera 200 extends along a curve. Therefore, after the camera 200 takes a picture to determine the bonding area 21 of the chip 20, the distance the bond head 310 moves to the bonding area 21 is approximately equal to the distance e between the bond head 310 and the outgoing light 230 along the first direction. This distance is not the distance E between the bond head 310 and the incident light 210 along the first direction. Since the distance e between the bonding head 310 and the outgoing light 230 is smaller than the distance E between the bonding head 310 and the incident light 210, the movement distance and movement time of the bonding head 310 are shorter, so that the bonding head 310 can quickly reach the bonding area 21, thereby improving the working efficiency of the bonding head 310 in bonding leads such as thick aluminum wires, and ultimately improving the working efficiency of the bonding device 10 based on power components.

[0041] See Figure 3 、 Figure 4 and Figure 5In some embodiments, the optical element 400 includes a fixing member 430, a first reflector 410, and a second reflector 420. The second reflector 420 is closer to the bonding mechanism 300 than the first reflector 410 along the first direction. The fixing member 430 is fixedly connected to the bonding mechanism 300. For example, the fixing member 430 can be bolted to the bonding mechanism 300. The fixing member 430 has a transmission hole 431. The first reflector 410 and the second reflector 420 are disposed on the fixing member 430. For example, the first reflector 410 and the second reflector 420 can also be bolted to the fixing member 430. Light emitted by the camera first enters the transmission hole 431 from one side, then reaches the first reflector 410, then reaches the second reflector 420, and finally exits the transmission hole 431 from the other side. Specifically, the incident light 210 emitted by the fixing member 430 first reaches the first reflector 410. After being reflected by the first reflector 410, the incident light 210 forms a centerline light that leaves the first reflector 410. When the centerline light 220 reaches the second reflector 420, it is reflected by the second reflector 420 to form an outgoing light 230 that leaves the second reflector 420 and the transmission hole 431. Therefore, through the combined action of the first reflector 410 and the second reflector 420, the light emitted by the camera 200 is deflected as it approaches the bond head 310, i.e., the outgoing light 230 is closer to the bond head 310 than the incident light 210. This shortens the time it takes for the bond head 310 to move to the bonding area 21, ultimately improving the operating efficiency of the power component bonding device 10. In other implementations, the optical element 400 can adopt a prism structure, that is, the incident light 210 is refracted by the prism structure, and the outgoing light 230 formed after the refraction by the prism structure is closer to the bonding head 310 along the first direction relative to the incident light 210. It can also shorten the time for the bonding head 310 to move to the bonding area 21, and ultimately improve the working efficiency of the bonding device 10 based on power components for bonding leads such as thick aluminum wires.

[0042] See Figure 3 、 Figure 4 and Figure 5 In some embodiments, the first reflector 410 and the second reflector 420 are arranged parallel to each other, and the intermediate light 220 extends along the first direction. In this case, the first reflector 410 and the second reflector 420 can form a 45° angle with the third direction, and the intermediate light 220 is perpendicular to both the incident light 210 and the outgoing light 230. In other embodiments, the first reflector 410 and the second reflector 420 can form an angle greater than or less than 45° with the third direction. In this case, the intermediate light 220 is not perpendicular to both the incident light 210 and the outgoing light 230, as long as the outgoing light 230 is closer to the bond head 310 along the first direction than the incident light 210.

[0043] See Figure 1 and Figure 2 In some embodiments, along the third direction, the camera element 200 and the optical element 400 are located on opposite sides of the carrier 110. For example, the camera element 200 can be located on the upper side of the carrier 110, while the optical element 400 is located on the lower side of the carrier 110. This allows for a rational layout of the camera element 200 and the optical element 400, achieving a compact design for the power component bonding apparatus 10. In other embodiments, the camera element 200 and the optical element 400 can both be located on the same side of the carrier 110, for example, on either the upper side or the lower side of the carrier 110.

[0044] In some embodiments, the distance between the outgoing light 230 and the bond head 310 along the first direction is less than or equal to half the distance between the incident light 210 and the bond head 310. This significantly reduces the distance between the outgoing light 230 and the bond head 310 along the first direction, thereby significantly reducing the distance and time required for the bond head 310 to move to the bonding area 21 after the camera 200 takes an image, thereby improving the efficiency of bonding wires such as thick aluminum wires using the power component bonding apparatus 10. The distance between the outgoing light 230 and the bond head 310 is 18 mm to 21 mm. For example, the distance between the outgoing light 230 and the bond head 310 can be 18 mm, 20 mm, or 21 mm.

[0045] See Figure 4 and Figure 6In some embodiments, the bonding mechanism 300 further includes a linear motor 320, the stator of which is fixedly connected to the mounting member 130. The rotor of the linear motor 320 is connected to the bond head 310, and the rotor of the linear motor 320 can drive the bond head 310 to slide relative to the mounting member 130 in the third direction, thereby achieving a sliding connection relationship between the bond head 310 and the mounting member 130 in the third direction. The bonding mechanism 300 further includes a linear driver 330, which is connected to the mounting member 130. The driver 330 drives the bond head 310 to rotate relative to the mounting member 130, causing the bond head 310 to rotate about an axis extending in the third direction, thereby achieving a rotational connection relationship between the bond head 310 and the mounting member 130. By sliding and rotating the bond head 310 relative to the mounting member 130, the bond head 310 can be moved toward or away from the bonding area 21 along the third direction. Obviously, when it is necessary to bond a lead, the bond head 310 can be moved downward along the third direction toward the bonding area 21. After bonding is completed, the bond head 310 can be moved upward along the third direction away from the bonding area 21. It is understood that after bonding is completed, the bond head 310 can be rotated relative to the mounting member 130 to break the lead so that the bond head 310 can bond to the next bonding area 21.

[0046] See Figure 4 and Figure 6 In some embodiments, an anti-fall mechanism 500 is further included. The anti-fall mechanism 500 is disposed on the mounting member 130 and is connected to the bond head 310. By providing the anti-fall mechanism 500, when the linear motor 320 is powered off, the bond head 310 can be effectively prevented from sliding downward relative to the mounting member 130 for a long distance, thereby avoiding damage to the bond head 310 and improving the safety of the power component-based bonding device 10.

[0047] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A bonding device based on power components, with a first direction, a second direction and a third direction perpendicular to each other as references, characterized in that: The power component-based bonding device includes: Loading platform; A sliding member, slidably connected to the supporting platform along a first direction; a mounting member, slidably connected to the sliding member along a second direction; A photographing member, arranged on the mounting member; a bonding mechanism, comprising a bonding head, wherein the bonding head is connected to the mounting member; and An optical element is connected to the bonding mechanism. The incident light of the camera component forms an outgoing light after passing through the optical element. Both the incident light and the outgoing light extend along the third direction. Along the first direction, the outgoing light is closer to the bonding head than the incident light.

2. The bonding device based on power components according to claim 1, characterized in that: The optical element includes a fixing part, a first reflector and a second reflector, the second reflector being closer to the bonding mechanism than the first reflector along the first direction, the fixing part being fixedly connected to the bonding mechanism and having a transmission hole, the first reflector and the second reflector being arranged on the fixing part, the incident light passing through the transmission hole is reflected by the first reflector to form an intermediate light, and the intermediate light is reflected by the second reflector to form the outgoing light.

3. The power component-based bonding device according to claim 2, characterized in that: The first reflector and the second reflector are arranged parallel to each other, and the intermediate light extends along the first direction.

4. The bonding device based on power components according to claim 1, characterized in that: The bond head is slidably connected to the mounting member along the third direction, and the bond head is rotationally connected to the mounting member by rotating around an axis extending along the third direction.

5. The bonding device based on power components according to claim 4, characterized in that: The bonding mechanism further includes a linear motor, a stator of the linear motor is connected to the mounting member, and a rotor of the linear motor is connected to the bonding head to drive the bonding head to slide relative to the mounting member along the third direction.

6. The power component-based bonding device according to claim 4, characterized in that: The bonding mechanism further includes a driver, which is connected to the mounting member and drives the bonding head to rotate relative to the mounting member.

7. The power component-based bonding device according to claim 4, characterized in that: It also includes an anti-falling mechanism, which is arranged on the mounting member and connected to the bonding head.

8. The bonding device based on power components according to claim 1, characterized in that: Along the third direction, the camera and the optical element are respectively located on two opposite sides of the supporting platform.

9. The bonding device based on power components according to claim 1, characterized in that: The distance between the emergent light and the bonding head is 18 mm to 21 mm.

10. The power component-based bonding device according to claim 1, characterized in that: Along the first direction, the distance from the outgoing light to the bond head is less than or equal to half the distance from the incident light to the bond head.

Images