Laser and photoetching machine

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a laser and a photoetching machine, comprising a discharge chamber, and an electrode assembly and a shock wave absorption assembly arranged in the discharge chamber; the electrode assembly comprises an anode structure and a cathode structure which extend along a straight line and are spaced in parallel, and the discharge chamber is filled with mixed gas; the electrode assembly discharges to excite the mixed gas and generates a laser beam between the anode structure and the cathode structure; the optical axis of the laser beam is consistent with the extension direction of the electrode assembly; the shock wave absorption assembly is at least arranged on one side of the optical axis and used for absorbing shock waves generated in an accompanying mode. According to the invention, the shock wave can be effectively eliminated, the adverse effect of the shock wave on the laser is reduced, the stability and consistency of laser output are ensured, and the improvement of a photoetching process is facilitated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a laser and a photolithography machine. Background Art

[0002] Deep ultraviolet (DUV) light sources play a crucial role in semiconductor manufacturing. In particular, the technique of exciting a mixture of argon and fluorine gases through high-voltage discharge to generate 193nm laser light has become a core technology in photolithography. At the moment of discharge, electrons are accelerated and collide with gas molecules, causing ionization and the release of more electrons and ions, forming a high-density plasma. Due to the high temperature and high pressure, the plasma region rapidly expands outward at a rate far exceeding the speed of sound, forming shock waves that cause uneven gas distribution. When the shock waves encounter cavity walls, electrodes, or other structures, they reflect and superimpose with other shock waves, forming a complex wave field that further exacerbates the uneven gas distribution.

[0003] Therefore, the shock wave will cause the plasma to deviate from the optical axis, resulting in uneven laser energy distribution. This uneven energy distribution not only reduces the quality of the laser output, but may also affect the precision requirements in subsequent processing steps. Secondly, the local gas density changes (i.e., compression or rarefaction) caused by the shock wave will cause the laser wavelength to drift, which is a significant problem for applications that rely on precise wavelength control. In addition, the shock wave will also carry metal particles sputtered from the electrode. These metal particles are easily deposited on the optical lens, resulting in transmittance attenuation and further affecting the quality of the laser beam and the overall performance of the system. This not only shortens the service life of the optical components, but also increases the cost and complexity of system maintenance. Summary of the Invention

[0004] The purpose of this application is to provide a laser and a photolithography machine, which can effectively eliminate shock waves, reduce the adverse effects of shock waves on the laser, ensure the stability and consistency of laser output, and facilitate the improvement of the photolithography process.

[0005] The present application provides a laser, comprising a discharge chamber and an electrode assembly and a shock wave absorbing assembly arranged in the discharge chamber; the electrode assembly comprises an anode structure and a cathode structure extending in a straight line and spaced in parallel, and the discharge chamber is filled with a mixed gas; the electrode assembly discharges to excite the mixed gas and generate a laser beam between the anode structure and the cathode structure; the optical axis of the laser beam is consistent with the extension direction of the electrode assembly; the shock wave absorbing assembly is arranged on at least one side of the optical axis for absorbing the accompanying shock wave.

[0006] As an optional implementation, the shock wave absorption component includes a narrowband absorption module and a broadband absorption module; the narrowband absorption module and the broadband absorption module are arranged in sequence along the shock wave movement direction. As an optional embodiment, in the direction perpendicular to the optical axis, the projection of the narrowband absorption module on the inner wall of the discharge chamber covers the projection of the electrode assembly on the inner wall of the discharge chamber; and / or, the projection of the broadband absorption module on the inner wall of the discharge chamber covers the projection of the electrode assembly on the inner wall of the discharge chamber.

[0007] As an optional embodiment, the anode structure and the cathode structure are respectively arranged on two opposite inner wall surfaces of the discharge chamber, and the two broadband absorption modules are respectively arranged on the other two opposite inner wall surfaces of the discharge chamber; the narrowband absorption module is located between the broadband absorption module and the electrode assembly.

[0008] As an optional embodiment, the narrowband absorption module includes a Helmholtz resonator; the Helmholtz resonator includes a plurality of vibration guide plates arranged at intervals along the optical axis, and the plane where the vibration guide plates are located intersects the optical axis perpendicularly.

[0009] As an optional implementation manner, there are at least two Helmholtz resonators, and the at least two Helmholtz resonators are arranged at intervals around the optical axis.

[0010] As an optional implementation, the broadband absorption module includes a foam metal plate; the foam metal plate is in contact with the inner wall of the discharge chamber.

[0011] As an optional embodiment, the foam metal plate is provided with a ceramic coating at least on a surface close to the electrode assembly.

[0012] As an optional embodiment, it also includes an air supply system; the air supply system is connected to the discharge chamber, and the discharge chamber is provided with an airflow driving module located on one side of the electrode assembly, and the airflow driving module includes a plurality of impellers arranged in sequence along the optical axis.

[0013] The present application also provides a photolithography machine, comprising an illumination system, a mask, and the above-mentioned laser, wherein the laser beam generated by the laser is processed by the illumination system and then irradiates the mask.

[0014] The beneficial effects of this application include: By setting a shock wave absorption component on the side of the optical axis, the present application can effectively absorb or disperse the energy of the shock wave, reduce the irregular movement of the plasma caused by the shock wave, thereby keeping the plasma concentrated near the optical axis, ensuring a more uniform distribution of laser energy, and improving the laser output quality.

[0015] This application can stabilize the gas density between the anode and cathode structures, preventing laser wavelength drift. Absorbing shock waves helps maintain gas uniformity within the discharge chamber, avoiding local gas compression or rarefaction caused by shock waves. This stabilizes the laser's working medium environment and ensures consistent laser wavelength, which is particularly important for applications requiring precise wavelength control.

[0016] This application can reduce the risk of optical component contamination, reduce the impact of shock waves on electrodes, and reduce the possibility of electrode sputtering, thereby reducing the generation of metal particles. At the same time, the shock wave absorption component can also prevent some particles that may be carried by the shock wave from approaching the optical lens, further protecting the optical system from contamination, extending its service life, and reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is one of the structural diagrams of the laser according to the embodiment of the present application; Figure 2 This is the second structural diagram of the laser according to the embodiment of the present application; Figure 3 This is the third structural diagram of the laser according to the embodiment of the present application; Figure 4 This is one of the structural diagrams of the narrowband absorption module according to an embodiment of the present application; Figure 5 This is the second structural diagram of the narrowband absorption module according to the embodiment of the present application; Figure 6 This is a schematic diagram of the microstructure of the foam metal plate according to an embodiment of the present application.

[0019] Icons: 100-discharge chamber; 101-electrode assembly; 102-shock wave absorption assembly; 103-anode structure; 104-cathode structure; 105-narrowband absorption module; 106-broadband absorption module; 107-vibrating guide plate; 108-impeller; A-optical axis. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," "third," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0023] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0024] Shock waves can cause the plasma to deviate from the optical axis, resulting in uneven laser energy distribution. This uneven energy distribution not only reduces the quality of the laser output, but may also affect the precision requirements of subsequent processing steps. Secondly, the local gas density changes (i.e., compression or rarefaction) caused by shock waves can cause the laser wavelength to drift, which is a significant problem for applications that rely on precise wavelength control. In addition, shock waves can also carry metal particles sputtered from the electrodes. These metal particles are easily deposited on optical lenses, causing transmittance attenuation and further affecting the quality of the laser beam and the overall performance of the system. This not only shortens the service life of optical components, but also increases the cost and complexity of system maintenance.

[0025] In order to solve the above technical problems, the embodiments of the present application provide a laser and a photolithography machine.

[0026] Reference Figure 1 、 Figure 2 as well as Figure 3As shown, the laser provided in the embodiment of the present application includes a discharge chamber 100 and an electrode assembly 101 and a shock wave absorbing assembly 102 arranged in the discharge chamber 100; the electrode assembly 101 includes an anode structure 103 and a cathode structure 104 extending in a straight line and spaced in parallel, and the discharge chamber 100 is filled with a mixed gas; the electrode assembly 101 discharges to excite the mixed gas and generates a laser beam between the anode structure 103 and the cathode structure 104; the optical axis A of the laser beam is consistent with the extension direction of the electrode assembly 101; the shock wave absorbing assembly 102 is arranged on at least one side of the optical axis A for absorbing the accompanying shock wave.

[0027] It should be noted that the anode structure 103 and cathode structure 104 extend in a straight line and are arranged in parallel and spaced apart. Stable high-voltage discharge can be generated between the anode structure 103 and the cathode structure 104, exciting the mixed gas to form a plasma and ultimately generating a laser beam. The optical axis A of the laser beam is aligned with the extension direction of the electrode assembly 101. In other words, the discharge path directly determines the propagation direction of the laser beam, helping to improve the directionality and stability of the laser output.

[0028] It should be noted that the primary function of the shock wave absorbing assembly 102 is to absorb and weaken the shock wave generated by the discharge process, effectively dissipating the shock wave energy. Exemplarily, the shock wave absorbing assembly 102 is disposed on both sides of the optical axis A. Exemplarily, a shock wave absorbing assembly 102 is disposed on each of the four circumferential sides of the optical axis A, with the four shock wave absorbing assemblies 102 surrounding the central electrode assembly 101.

[0029] The technical effects that can be produced by the embodiments of this application are as follows: First, the embodiment of the present application can effectively absorb or disperse the energy of the shock wave by setting a shock wave absorption component 102 on the side of the optical axis A, reduce the irregular movement of the plasma caused by the shock wave, thereby keeping the plasma concentrated near the optical axis A, ensuring a more uniform distribution of laser energy, and improving the laser output quality.

[0030] Secondly, the embodiments of the present application can stabilize the gas density between the anode structure 103 and the cathode structure 104, preventing laser wavelength drift. Absorbing shock waves helps maintain gas uniformity within the discharge chamber 100, avoiding local gas compression or rarefaction caused by shock waves. This stabilizes the laser's working medium environment and ensures laser wavelength consistency, which is particularly important for applications requiring precise wavelength control.

[0031] Third, the embodiments of the present application can reduce the risk of optical component contamination, reduce the impact of shock waves on electrodes, and reduce the possibility of electrode sputtering, thereby reducing the generation of metal particles. Furthermore, the shock wave absorption assembly 102 can also block some particles that may be carried by the shock wave from approaching the optical lens, further protecting the optical system from contamination, extending its service life, and reducing maintenance costs.

[0032] Based on the above points, the embodiments of the present application can not only improve the performance indicators of the laser itself, such as power stability, wavelength accuracy, etc., by solving the negative impact of shock waves, but also improve the overall working efficiency and yield of the lithography machine that relies on the laser.

[0033] Reference Figure 2 、 Figure 3 As shown, as an optional embodiment, the shock wave absorbing assembly 102 includes a narrowband absorbing module 105 and a broadband absorbing module 106 ; the narrowband absorbing module 105 and the broadband absorbing module 106 are arranged in sequence along the shock wave movement direction.

[0034] It should be noted that the embodiment of the present application provides a composite structural design of a shock wave absorption component 102, including a narrowband absorption module 105 and a broadband absorption module 106, which are arranged in sequence along the direction of shock wave propagation to form a multi-stage absorption mechanism. The narrowband absorption module 105 can be used to absorb the main frequency of the shock wave. For example, the narrowband absorption module 105 absorbs shock waves of 8-20kHz. The broadband absorption module 106 can be used to absorb shock waves within 1-100kHz to compensate for the frequency range not covered by the narrowband absorption module 105. The combination of the two achieves effective shock wave absorption, which is suitable for high-frequency pressure oscillation scenarios in lithography machines.

[0035] It should be noted that during the discharge process, the shock waves generated by the rapid expansion of the plasma often have distinct dominant frequencies. Narrowband absorption module 105 can precisely suppress energy disturbances at these dominant frequencies. Narrowband absorption module 105 utilizes a Helmholtz resonator or resonant cavity structure with adjustable geometric parameters to align its resonant frequency with the target shock wave's dominant frequency, thereby achieving highly efficient energy absorption.

[0036] It should be noted that the broadband absorption module 106 can be made of porous materials, honeycomb structures, metal foams, microchannel arrays, or multi-layer composite sound-absorbing structures. It utilizes the inherent damping effect, viscous dissipation, and thermal conduction of the material to convert fluctuating energy of different frequencies into heat or other forms of loss. This module can effectively absorb residual shock wave energy, particularly in complex environments with uneven discharge, high repetition rates, or reflection interference, by bridging the frequency range beyond the reach of narrowband modules.

[0037] The narrowband absorption module 105 is located at the front end of the shock wave propagation path, absorbing the mainband energy first. The broadband absorption module 106 then absorbs the remaining broadband energy, forming a "step-by-step attenuation" mechanism. The narrowband absorption module 105 is positioned at a linear distance of at least 50 mm from the laser beam and avoids the electrode sputtering path to prevent metal particle deposition that could affect absorption performance.

[0038] Effectively, the embodiments of the present application enhance shock wave absorption efficiency and achieve full frequency coverage. The narrowband absorption module 105 specifically absorbs the primary frequency shock wave, reducing the primary energy source; the broadband absorption module 106 supplements and absorbs the remaining frequency components, ensuring an overall absorption range of 1–100 kHz. The two modules work synergistically to significantly reduce the amplitude of pressure fluctuations within the chamber and improve laser output stability.

[0039] After the shock wave is effectively absorbed, the plasma expansion process becomes smoother and less likely to deviate from the optical axis A; local gas density changes caused by shock wave disturbances are reduced, keeping the laser gain medium uniform; and this helps to obtain higher-quality laser beam shape and power stability.

[0040] Reference Figure 3 As shown, as an optional embodiment, in a direction perpendicular to the optical axis A, the projection of the narrowband absorption module 105 on the inner wall of the discharge chamber 100 overlaps the projection of the electrode assembly 101 on the inner wall of the discharge chamber 100; and the projection of the broadband absorption module 106 on the inner wall of the discharge chamber 100 overlaps the projection of the electrode assembly 101 on the inner wall of the discharge chamber 100. The narrowband absorption module 105 may extend along the optical axis A and have a length greater than the length of the electrode assembly 101. Similarly, the broadband absorption module 106 may extend along the optical axis A and have a length greater than the length of the electrode assembly 101.

[0041] It should be noted that, viewed from the front view in the direction of laser beam propagation, the spatial extent occupied by the shock wave absorption module on the inner wall of the discharge chamber 100 completely or at least partially covers the region where the electrode assembly 101 is located. In other words, the shock wave absorption module is arranged near or within the primary path of shock wave generation and propagation by the electrode assembly 101, ensuring that it can immediately capture and absorb the shock wave energy generated by the discharge.

[0042] It should be noted that the narrowband absorption module 105 and the broadband absorption module 106 are not arranged in a localized point-like manner, but are arranged continuously along the propagation direction of the laser beam, and their total length exceeds the length of the electrode assembly 101 itself. The purpose of this embodiment of the application is to extend the contact time between the shock wave and the absorption module; increase the absorption area, improve the overall absorption efficiency, and achieve uniform and effective suppression of shock waves generated at different locations throughout the electrode discharge area.

[0043] It should be noted that the above-mentioned setting enables the shock wave absorption module to achieve maximum shock wave absorption without interfering with the laser optical path; in addition, a modular design can be adopted to facilitate subsequent maintenance and replacement.

[0044] The embodiment of the present application fully covers the shock wave source area, improving absorption efficiency. Because the absorption module covers the projection range of the area where the electrode assembly 101 is located, it can more effectively capture the shock waves generated by discharges from electrodes at different locations. Compared with localized absorption structures, this full coverage design can significantly improve the absorption rate of shock wave energy and reduce residual disturbances.

[0045] This solution uses an extended absorption structure along the direction of optical axis A to cover the electrode assembly 101 area in the direction perpendicular to the optical axis A, and extends along the direction of optical axis A and has a length greater than the electrode assembly 101. It can quickly respond to and absorb shock waves in each discharge cycle, avoid shock wave accumulation, and achieve efficient, comprehensive and continuous absorption of shock waves, which is conducive to ensuring the long-term stable operation of the system.

[0046] Reference Figure 1 、 Figure 2 as well as Figure 3 As shown, as an optional embodiment, the anode structure 103 and the cathode structure 104 are respectively arranged on two opposite inner wall surfaces of the discharge chamber 100, and the two broadband absorption modules 106 are respectively arranged on the other two opposite inner wall surfaces of the discharge chamber 100; the narrowband absorption module 105 is located between the broadband absorption module 106 and the electrode assembly 101.

[0047] It should be noted that the anode structure 103 and cathode structure 104 are mounted on two opposing inner wall surfaces of the discharge chamber 100, forming a face-to-face arrangement. The broadband absorption module 106 is arranged on the other two opposing inner wall surfaces of the discharge chamber 100, perpendicular to the surfaces of the anode structure 103 and cathode structure 104. This arrangement in the embodiment of the present application ensures excellent absorption of shock waves propagating at different angles.

[0048] The narrowband absorption module 105 is located between the broadband absorption module 106 and the electrode assembly 101 , which means that the narrowband absorption module 105 is closer to the electrode area and can immediately process the shock waves within the main frequency range generated by the discharge.

[0049] Reference Figure 1 、 Figure 4 as well as Figure 5 As shown, as an optional embodiment, the narrowband absorption module 105 includes a Helmholtz resonator; the Helmholtz resonator includes a plurality of vibration guide plates 107 arranged at intervals along the optical axis A, and the plane where the vibration guide plates 107 are located intersects the optical axis A perpendicularly.

[0050] It should be noted that the Helmholtz resonator provided in the embodiment of the present application includes a substrate portion and a plurality of vibration guide plates 107 disposed on the substrate portion. The plurality of vibration guide plates 107 are arranged at intervals along the optical axis A, and the planes on which they are located intersect perpendicularly with the optical axis A. These vibration guide plates 107 can not only resonate at a specific frequency, thereby absorbing shock waves of the corresponding frequency, but also play a role in guiding the airflow, helping the mixed gas to flow more smoothly between the anode structure 103 and the cathode structure 104.

[0051] The vibrating deflector 107 of the present embodiment resonates at a specific frequency, converting shock wave energy into kinetic energy or dissipating it as heat, thereby effectively reducing the impact of shock waves on laser beam quality and system stability. Adjusting the shape, thickness, and material of the vibrating deflector 107 can adjust the resonant frequency of the Helmholtz resonator, making it suitable for absorbing shock waves in the 8-20 kHz range, thereby addressing the primary source of disturbance.

[0052] In addition, the presence of the vibrating guide plate 107 is not limited to absorbing shock waves, but can also guide the mixed gas to be more evenly distributed to the discharge area between the anode structure 103 and the cathode structure 104, ensuring sufficient and uniform gas supply during the discharge process and improving discharge efficiency and stability.

[0053] As an optional implementation manner, there are at least two Helmholtz resonators, and the at least two Helmholtz resonators are arranged around the optical axis A at intervals.

[0054] As an optional implementation, the broadband absorption module 106 includes a foam metal plate; the foam metal plate is in contact with the inner wall of the discharge chamber 100 .

[0055] It should be noted that, referring to Figure 6 As shown in Figure 1, metal foam is a porous material with a three-dimensional network structure, which can be made from metals such as titanium, copper, and aluminum. It contains a large number of tiny pores, which endow the material with excellent shock wave dissipation properties. Metal foam sheets can absorb shock wave energy through various mechanisms, including viscous effects, thermal conduction, and structural vibration dissipation.

[0056] Preferably, the foam metal plate is a molybdenum foam plate, with a pore size of approximately 250 microns and a porosity of 85-95%. The molybdenum foam plate and Helmholtz resonance synergistically eliminate more than 95% of the total shock wave energy.

[0057] Due to its complex microstructure, foam metal plates can provide effective absorption over a wide frequency range and are suitable for absorbing various shock waves from low to high frequencies.

[0058] It should be noted that the foam metal plate is installed in such a way as to fit the inner wall of the discharge chamber 100 . The foam metal plate is directly attached to the inner wall of the discharge chamber 100 to ensure that the entire chamber surface is covered, thereby maximizing its ability to absorb shock waves.

[0059] As an optional embodiment, the foam metal plate is provided with a ceramic coating at least on the surface close to the electrode assembly 101. The specific thickness of the ceramic coating can be set by those skilled in the art as needed and is not particularly limited.

[0060] For example, the outer surface of the molybdenum foam plate is coated with a ceramic coating. It should be noted that metal foam has high thermal conductivity and is resistant to plasma thermal radiation, which means it has strong thermal shock resistance. A 5-8 nm layer of aluminum nitride or silicon nitride can be deposited on the outer surface of the molybdenum foam plate using an ALD process.

[0061] It should be noted that the ceramic coating covers the surface of the three-dimensional mesh structure, reducing or preventing any potential tiny metal particles from falling off, thereby protecting the interior of the laser, especially the optical elements, from contamination and extending the service life of optical lenses and other key components.

[0062] The aluminum nitride layer itself has excellent thermal conductivity. More importantly, it optimizes heat distribution and prevents localized overheating without compromising the inherent high thermal conductivity of the molybdenum foam. Furthermore, the well-matched thermal expansion coefficients of the aluminum nitride layer and the molybdenum substrate make the coating more stable during temperature fluctuations, making it less susceptible to flaking or cracking.

[0063] Reference Figure 1 、 Figure 2 As shown, as an optional embodiment, it also includes an air supply system; the air supply system is connected to the discharge chamber 100, and an air flow driving module is provided in the discharge chamber 100 on one side of the electrode assembly 101, and the air flow driving module includes a plurality of impellers 108 arranged in sequence along the optical axis A.

[0064] It should be noted that the gas supply system is responsible for providing the required mixed gas, such as argon and fluorine, into the discharge chamber 100 to ensure that the laser can operate continuously and stably. The airflow drive module is located on one side of the electrode assembly 101, close to the discharge area. The module contains a plurality of impellers 108 arranged in sequence along the optical axis A. Each impeller 108 is designed to generate a directional airflow at a specific rotation speed to push the mixed gas to circulate in the discharge chamber 100. The number and spacing of the impellers 108 can be adjusted according to actual needs to achieve the best gas flow effect. Through the coordinated work of multiple impellers 108, an orderly airflow channel can be formed to guide the mixed gas from the gas supply system into the discharge chamber 100, and then flow along a predetermined path between the anode and the cathode, and then be discharged or recycled through the other end.

[0065] An embodiment of the present application provides a lithography machine, comprising an illumination system, a mask, and the aforementioned laser. The laser beam generated by the laser is processed by the illumination system and then illuminates the mask.

[0066] The lithography machine provided in the embodiment of the present application achieves effective absorption of shock waves, optimization of gas flow, and improvement of laser output quality by integrating an optimized designed laser, thereby significantly enhancing the accuracy, stability and efficiency of the entire lithography process.

[0067] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A laser, characterized in that: The invention comprises a discharge chamber (100) and an electrode assembly (101) and a shock wave absorbing assembly (102) arranged in the discharge chamber (100); the electrode assembly (101) comprises an anode structure (103) and a cathode structure (104) extending in a straight line and spaced in parallel, and the discharge chamber (100) is filled with a mixed gas; the electrode assembly (101) discharges to excite the mixed gas and generates a laser beam between the anode structure (103) and the cathode structure (104); the optical axis (A) of the laser beam is consistent with the extension direction of the electrode assembly (101); the shock wave absorbing assembly (102) is arranged at least on one side of the optical axis (A) and is used to absorb the shock wave generated along with it.

2. The laser according to claim 1, characterized in that The shock wave absorption component (102) comprises a narrowband absorption module (105) and a broadband absorption module (106); the narrowband absorption module (105) and the broadband absorption module (106) are arranged in sequence along the shock wave movement direction.

3. The laser according to claim 2, characterized in that In a direction perpendicular to the optical axis (A), the projection of the narrowband absorption module (105) on the inner wall of the discharge chamber (100) covers the projection of the electrode assembly (101) on the inner wall of the discharge chamber (100); and / or the projection of the broadband absorption module (106) on the inner wall of the discharge chamber (100) covers the projection of the electrode assembly (101) on the inner wall of the discharge chamber (100).

4. The laser according to claim 2, characterized in that The anode structure (103) and the cathode structure (104) are respectively arranged on two opposite inner wall surfaces of the discharge chamber (100); the two broadband absorption modules (106) are respectively arranged on the other two opposite inner wall surfaces of the discharge chamber (100); and the narrowband absorption module (105) is located between the broadband absorption module (106) and the electrode assembly (101).

5. The laser according to any one of claims 2 to 4, characterized in that: The narrowband absorption module (105) includes a Helmholtz resonator; the Helmholtz resonator includes a plurality of vibration guide plates (107) arranged at intervals along the direction of the optical axis (A), and the plane where the vibration guide plates (107) are located intersects perpendicularly with the direction of the optical axis (A).

6. The laser according to claim 5, characterized in that There are at least two Helmholtz resonators, and the at least two Helmholtz resonators are spaced apart and arranged around the optical axis (A).

7. The laser according to any one of claims 2 to 4 and claim 6, characterized in that: The broadband absorption module (106) comprises a foam metal plate; the foam metal plate is adhered to the inner wall of the discharge chamber (100).

8. The laser according to claim 7, characterized in that The foam metal plate is provided with a ceramic coating at least on a surface close to the electrode assembly (101).

9. The laser according to any one of claims 1 to 4, claim 6 and claim 8, characterized in that: It also includes an air supply system; the air supply system is in communication with the discharge chamber (100); an air flow drive module is provided in the discharge chamber (100) and is located on one side of the electrode assembly (101); the air flow drive module includes a plurality of impellers (108) arranged in sequence along the optical axis (A).

10. A photolithography machine, characterized in that: The invention comprises an illumination system, a mask and the laser according to any one of claims 1 to 9, wherein the laser beam generated by the laser is processed by the illumination system and then irradiates the mask.

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