Composite cooling structure
Through the VC temperature spreader and liquid cooling plate parts in the composite cooling structure, the capillary structure and shovel mechanism are used to solve the problem of insufficient heat dissipation of the two-dimensional temperature spreader in three-dimensional space, and achieve efficient heat conduction and heat dissipation effects, which is suitable for high-power and miniaturized electronic devices.
Patent Information
- Application Number
- CN202510805095.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-17
- Publication Date
- 2025-09-05
AI Technical Summary
Existing two-dimensional temperature dispersion plates have limited heat dissipation capabilities in three-dimensional space and cannot meet the heat dissipation needs of electronic devices with complex structures and limited space. Especially in high-power and miniaturized designs, the limitations of traditional heat sinks are significant.
It adopts a composite cooling structure, including a VC temperature plate and a liquid cooling plate. Through the design of a capillary structure and a shovel mechanism, combined with the evaporation and condensation process of the working medium, it achieves efficient heat conduction and heat dissipation in a small space.
It achieves efficient conduction of heat energy from a small space to a large area of heat dissipation, improves heat dissipation efficiency, and adapts to the high power consumption and miniaturization design requirements of electronic equipment.
Smart Images
Figure CN120603192A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cooling structures for electronic equipment, in particular to a composite cooling structure. Background Art
[0002] With the continuous updating and replacement of electronic devices, traditional radiators used for heat dissipation have gradually shown their limitations. In order to solve the shortcomings of traditional heat dissipation technology, two-dimensional heat spreader technology has come into being. The heat spreader has a capillary structure and working fluid inside. Through the evaporation and condensation process of the working fluid, it can achieve rapid heat transfer and uniform distribution, greatly improving the heat dissipation efficiency; however, the two-dimensional heat spreader still has some problems, such as its limited heat dissipation capacity in three-dimensional space. For some electronic devices with complex structures and space limitations, its heat dissipation performance cannot be fully utilized.
[0003] With the rapid development of 5G technology, artificial intelligence, and high-performance computing, the chip performance of electronic devices continues to improve, and power consumption is also increasing, which places higher demands on heat dissipation technology. Furthermore, electronic devices are increasingly miniaturized and integrated, which makes the internal space of devices more compact and limits the space for heat dissipation. Therefore, there is an urgent need to develop a composite cooling structure that can reliably conduct heat energy from devices in limited spaces, thereby achieving efficient heat dissipation. Summary of the Invention
[0004] In response to the above problems, the present invention provides a composite cooling structure, which efficiently conducts heat energy in a small space to a large-area heat dissipation area, thereby achieving efficient heat dissipation of devices in a wired space.
[0005] A composite cooling structure, characterized in that it comprises:
[0006] The VC heat spreader includes a lower cover and a capillary mechanism. The lower cover is convex downwardly corresponding to the heat source area to form a convex fitting area. The surrounding edges of the upper surface of the lower cover are convex upwardly to form a heat dissipation cavity. The heat dissipation cavity is provided with a capillary mechanism. The heat dissipation cavity formed by the lower cover also contains a working medium.
[0007] and a liquid cooling plate portion, which includes an upper cover, a base, a liquid inlet nozzle, and a liquid outlet nozzle; a shovel mechanism is provided on the central area of the upper surface of the upper cover, the four edges of the base are convex downward to form a surrounding edge, and the central area of the lower surface of the base forms a shovel mechanism arrangement cavity, the surrounding edge cover of the base is installed on the four edges of the upper surface of the upper cover, and the water inlet nozzle and the liquid outlet nozzle are respectively connected to the upper surface of the base;
[0008] The lower surface of the upper cover is welded to the convex edges around the lower cover, the convex depth of the lower convex fitting area just fits the entire surface of the heat source, and the area of the heat dissipation cavity is at least twice the area of the lower convex fitting area.
[0009] It is further characterized by:
[0010] The capillary mechanism includes a bottom plate capillary structure and a plurality of upward convex supporting powder columns, wherein the bottom plate capillary structure is provided with a plurality of upward convex supporting powder columns;
[0011] It also includes at least one layer of copper mesh, which is welded tightly against the lower surface of the upper cover. The copper mesh is provided with a plurality of positioning holes corresponding to the upper convex supporting powder pillars. The tops of the upper convex supporting powder pillars are inserted into the positioning holes. The copper mesh is used to reliably liquefy the vaporized working medium through the upper convex supporting powder pillars and connect it to the bottom of the heat dissipation cavity, thereby ensuring fast and reliable heat exchange of the VC temperature vapor chamber.
[0012] The base is provided with an upper convex block, one end of the upper convex block in the length direction is provided with a liquid inlet, and the other end in the length direction is provided with a liquid outlet, the lower surface of the upper convex block is provided with an inner groove, and the lower surface of the upper convex block is also provided with a lower convex dividing plate, the lower convex dividing plate divides the shovel tooth mechanism into an inlet liquid diffusion area and an outlet liquid confluence area, and the lower convex dividing plate simultaneously divides the inner groove into an inlet liquid mixing tank and an outlet liquid confluence tank, the lower convex range of the four periphery of the base is larger than the outer boundary of the shovel tooth mechanism, the four periphery of the base and the cavity of the shovel tooth mechanism boundary are liquid flow channels, which ensure that the coolant flows into the liquid inlet and remains in the liquid flow channel along the liquid inlet diffusion area, and the liquid flows into the space of each adjacent shovel tooth in the outlet liquid confluence area along the liquid flow channel, and then the coolant converges to the outlet liquid confluence tank and flows out along the liquid outlet;
[0013] The downward convex partition plate is arranged at the periphery of the downward convex fitting area, and the shovel gear mechanism corresponding to the liquid inlet diffusion area is smaller than the shovel gear mechanism corresponding to the liquid outlet confluence area, which ensures that the coolant can reliably complete the heat exchange with the shovel gear mechanism in the higher temperature area after being diffused;
[0014] Each row of shovel teeth of the shovel mechanism is arranged parallel to the lower convex partition plate, and the shovel mechanism is provided with an avoidance notch groove at a position corresponding to the lower convex partition plate;
[0015] The upper surface of each row of shovel teeth of the shovel mechanism is in close contact with the lower surface of the center plate of the base, ensuring that the flow path of the coolant is stable and smooth without turbulence;
[0016] The four surrounding edges of the lower cover are convex and then provided with horizontal expansion edges. The corresponding lower surface of the upper cover is adhered to and welded to the corresponding expansion edges. A working medium inlet is provided at one corner. After the working medium is fed into the cooling chamber through the working medium inlet, the working medium inlet is sealed by welding.
[0017] After adopting the technology of the present invention, heat is transferred from the heat source to the lower convex fitting area of the lower cover, the working medium evaporates due to the heat to form a vapor state, the vaporous working fluid rises, contacts the upper cover, and then condenses and flows back along the capillary structure formed by the copper mesh, several upper convex supporting powder columns, and the capillary structure of the bottom plate, and the cycle repeats. The heat absorbed by the upper cover is carried away by the coolant through the shovel tooth mechanism and the heat exchange with the coolant. Since the area of the heat dissipation cavity is at least twice the area of the lower convex fitting area, the heat energy generated by the electronic device is quickly exchanged through the VC temperature equalizing plate part to the liquid cooling plate part, and then the heat is dissipated by cooling the heat. It efficiently conducts the heat energy in the narrow space to the large-area heat dissipation part (VC temperature equalizing plate, liquid cooling plate part) by forming a lower convex fitting area and the working medium inside it, thereby realizing efficient heat dissipation of devices in wired space positions. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;
[0019] Figure 2 This is a schematic diagram of the cross-sectional structure of the main view of the present invention;
[0020] Figure 3 It is a schematic diagram of the exploded view structure of the present invention;
[0021] Figure 4 is a three-dimensional schematic diagram of the base of the present invention;
[0022] The names corresponding to the serial numbers in the figure are as follows:
[0023] VC temperature averaging plate portion 100 and liquid cooling plate portion 200;
[0024] Lower cover 10, lower convex fitting area 11, horizontal expansion edge 12, working medium inlet 13 capillary mechanism 20, bottom plate capillary structure 21, upper convex supporting powder column 22, heat dissipation cavity 30, upper cover 40, base 50, surrounding edge 51, upper protrusion 52, liquid inlet 53, liquid outlet 54, inner groove 55, liquid inlet mixing groove 551, liquid outlet confluence groove 552, lower convex partition plate 56, liquid flow channel 57, liquid inlet nozzle 60, shovel tooth mechanism 70, shovel teeth 701, liquid inlet diffusion area 71, liquid outlet confluence area 72, avoidance notch groove 73, shovel tooth mechanism arrangement cavity 80, copper mesh 90, positioning hole 91, liquid outlet nozzle 110. DETAILED DESCRIPTION
[0025] A composite cooling structure, see Figure 1-Figure 4, which includes a VC temperature plate portion 100 and a liquid cooling plate portion 200;
[0026] The VC vapor chamber 100 includes a lower cover 10 and a capillary mechanism 20. The lower cover 10 is convex downwardly corresponding to the heat source area, forming a convex fitting area 11. The surrounding edges of the upper surface of the lower cover 10 are convex upwardly, forming a heat dissipation cavity 30. The heat dissipation cavity 30 is arranged with the capillary mechanism 20. A working medium is also provided in the heat dissipation cavity 20 formed by the lower cover 10 (not shown in the figure, which is a mature existing technology).
[0027] The liquid cooling plate portion 2000 includes an upper cover 40, a base 50, a liquid inlet nozzle 60, and a liquid outlet nozzle 110. A shovel mechanism 70 is provided in the central area of the upper surface of the upper cover 40. The four edges of the base 50 are convex downward to form a peripheral edge 51. The central area of the lower surface of the base 50 forms a shovel mechanism arrangement cavity 80. The peripheral edge 51 of the base 50 is mounted on all four sides of the upper surface of the upper cover 40. The liquid inlet nozzle 60 and the liquid outlet nozzle 110 are respectively connected to the upper surface of the base 50.
[0028] The lower surface of the upper cover 40 is welded to the convex edges of the lower cover 10. The convex depth of the convex fitting area 11 just fits the entire surface of the heat source. The area of the heat dissipation cavity 30 is at least twice the area of the convex fitting area 11.
[0029] In specific implementation, according to the arrangement of peripheral devices of the electronic device, the area of the heat dissipation cavity 30 is three times the area of the convex fitting area 11 to ensure efficient and sufficient heat dissipation.
[0030] In a specific implementation, the capillary mechanism 20 includes a bottom plate capillary structure 21 and a plurality of upward convex supporting powder columns 22 , and a plurality of upward convex supporting powder columns 22 are provided on the bottom plate capillary structure 21 ;
[0031] It also includes two layers of copper mesh 90 welded together. The copper mesh 90 is welded tightly against the lower surface of the upper cover 40. The copper mesh 90 is provided with a number of positioning holes 91 corresponding to the upper convex supporting powder column 22. The top of the upper convex supporting powder column 22 is inserted into the positioning hole 91. The copper mesh 90 is used to reliably liquefy the vaporized working medium and connect it to the bottom of the heat dissipation cavity 30 through the upper convex supporting powder column 22, which ensures that the heat exchange of the VC temperature equalizing plate part 100 is fast and reliable.
[0032] In a specific implementation, in order to ensure the reliable and smooth flow of the coolant, the base 50 is provided with an upper protrusion 52, a liquid inlet 53 is provided at one end of the length direction of the upper protrusion 52, and a liquid outlet 54 is provided at the other end of the length direction. The lower surface of the upper protrusion 52 is provided with an inner groove 55, and the lower surface of the upper protrusion 52 is also provided with a lower convex partition plate 56. The lower convex partition plate 56 divides the shovel tooth mechanism 70 into an inlet liquid diffusion area 71 and an outlet liquid confluence area 72. The lower convex partition plate 56 also divides the inner groove 55 into an inlet liquid mixing tank. 551, liquid outlet confluence groove 552. The downward convex range of the four peripheries of the base 50 is larger than the outer boundary of the scraping tooth mechanism 70. The cavity between the four peripheries of the base 50 and the boundary of the scraping tooth mechanism is the liquid flow channel 57, which ensures that the coolant flows into the liquid inlet 53 and flows along the liquid inlet diffusion area 71 to the liquid flow channel 57. The liquid then flows along the liquid flow channel 57 into the spaces of each adjacent scraping tooth in the liquid outlet confluence area 72. The coolant then converges to the liquid outlet confluence groove 552 and flows out along the liquid outlet 54.
[0033] The downward convex partition plate 56 is arranged at the periphery of the downward convex fitting area 11. The shovel mechanism corresponding to the liquid inlet diffusion area 71 is smaller than the shovel mechanism corresponding to the liquid outlet confluence area 72. This ensures that the coolant can reliably complete the heat exchange with the shovel mechanism in the higher temperature area after being diffused.
[0034] Each row of shovel teeth 701 of the shovel mechanism 70 is arranged parallel to the lower convex partition plate 56, and the shovel mechanism 70 is provided with an avoidance notch groove 73 at a position corresponding to the lower convex partition plate 56;
[0035] The upper surface of each row of scraping teeth 701 of the scraping mechanism 70 is in close contact with the lower surface of the center plate of the base 50, ensuring that the flow path of the coolant is stable and smooth without turbulence.
[0036] The four surrounding edges of the lower cover 10 are convex and then provided with horizontal extension edges 12. The corresponding lower surface of the upper cover 40 is adhered to and welded to the corresponding extension edges 12. A working medium inlet 13 is provided at one corner. After the working medium is fed into the cooling chamber 30 through the working medium inlet 13, the working medium inlet 13 is sealed by welding.
[0037] Its working principle is as follows: heat is transferred from the heat source to the lower convex fitting area of the lower cover, the working medium evaporates due to the heat to form a vapor state, the vaporous working fluid rises, contacts the upper cover, and then condenses along the capillary reflux formed by the copper mesh, several upper convex supporting powder columns, and the capillary structure of the bottom plate, and the cycle repeats. The heat absorbed by the upper cover is carried away by the coolant through the shovel mechanism and heat exchange with the coolant. Since the area of the heat dissipation cavity is at least twice the area of the lower convex fitting area, the heat energy generated by the electronic device is quickly exchanged through the VC temperature equalizing plate part to the liquid cooling plate part, and then the heat is dissipated by cooling the heat. It efficiently conducts the heat energy in the narrow space to the large-area heat dissipation part (VC temperature equalizing plate, liquid cooling plate part) by forming a lower convex fitting area and the working medium inside it, thereby realizing efficient heat dissipation of devices in wired space positions.
[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
[0039] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
Claims
1. A composite cooling structure, characterized in that: It includes: VC temperature plate part, which includes the lower cover and capillary mechanism; The lower cover is convex downward corresponding to the heat source area to form a convex fitting area, and the surrounding edges of the upper surface of the lower cover are convex upward to form a heat dissipation cavity. The heat dissipation cavity is arranged with a capillary mechanism, and a working medium is also provided in the heat dissipation cavity formed by the lower cover; and a liquid cooling plate portion, which includes an upper cover, a base, a liquid inlet nozzle, and a liquid outlet nozzle; a shovel mechanism is provided on the central area of the upper surface of the upper cover, the four edges of the base are convex downward to form a surrounding edge, and the central area of the lower surface of the base forms a shovel mechanism arrangement cavity, the surrounding edge cover of the base is installed on the four edges of the upper surface of the upper cover, and the water inlet nozzle and the liquid outlet nozzle are respectively connected to the upper surface of the base; The lower surface of the upper cover is welded to the convex edges around the lower cover, the convex depth of the lower convex fitting area just fits the entire surface of the heat source, and the area of the heat dissipation cavity is at least twice the area of the lower convex fitting area.
2. A composite cooling structure according to claim 1, characterized in that: The capillary mechanism comprises a bottom plate capillary structure and a plurality of upward convex supporting powder columns, and the bottom plate capillary structure is provided with a plurality of upward convex supporting powder columns.
3. A composite cooling structure according to claim 2, characterized in that: It also includes at least one layer of copper mesh, which is welded tightly against the lower surface of the upper cover. The copper mesh is provided with a number of positioning holes corresponding to the upper convex supporting powder columns. The tops of the upper convex supporting powder columns are inserted into the positioning holes. The copper mesh is used to reliably liquefy the vaporized working medium and connect it to the bottom of the heat dissipation cavity through the upper convex supporting powder columns.
4. The composite cooling structure according to claim 1, characterized in that: The base is provided with an upper protrusion, and one end of the upper protrusion in the longitudinal direction is provided with a liquid inlet, and the other end in the longitudinal direction is provided with a liquid outlet. The lower surface of the upper protrusion is provided with an inner groove, and the lower surface of the upper protrusion is also provided with a lower convex partition plate. The lower convex partition plate divides the shovel tooth mechanism into a liquid inlet diffusion area and a liquid outlet confluence area. The lower convex partition plate also divides the inner groove into a liquid inlet mixing tank and a liquid outlet confluence tank. The lower convex range of the four sides of the base is larger than the outer boundary of the shovel tooth mechanism. The cavities on the four sides of the base and the boundary of the shovel tooth mechanism are liquid flow channels, which ensure that the coolant flows into the liquid inlet and remains in the liquid flow channel along the liquid inlet diffusion area. The liquid flows into the space of each adjacent shovel tooth in the liquid outlet confluence area along the liquid flow channel, and then the coolant converges to the liquid outlet confluence tank and flows out along the liquid outlet.
5. A composite cooling structure according to claim 4, characterized in that: The downward convex partition plate is arranged at the periphery of the downward convex fitting area, and the shovel tooth mechanism corresponding to the liquid inlet diffusion area is smaller than the shovel tooth mechanism corresponding to the liquid outlet confluence area.
6. A composite cooling structure according to claim 5, characterized in that: Each row of shovel teeth of the shovel tooth mechanism is arranged parallel to the lower convex partition plate, and the shovel tooth mechanism is provided with an avoidance notch groove at a position corresponding to the lower convex partition plate.
7. A composite cooling structure according to claim 6, characterized in that: The upper surface of each row of shovel teeth of the shovel tooth mechanism is in close contact with the lower surface of the central plate of the base.
8. The composite cooling structure according to claim 1, characterized in that: The four surrounding edges of the lower cover are convex and then provided with horizontal expansion edges. The corresponding lower surface of the upper cover is adhered to and welded to the corresponding expansion edges. A working medium inlet is provided at one corner. After the working medium is fed into the cooling chamber through the working medium inlet, the working medium inlet is sealed by welding.