Full-automatic glue filling mechanism
Through the multi-structure collaborative work of the fully automatic glue filling mechanism, the problems of uneven thermal conductive materials and uneven molding thickness in the thermal conductive structure of large electronic products are solved, and efficient and stable aluminum-plastic film glue filling and molding are achieved, improving processing efficiency and quality.
Patent Information
- Application Number
- CN202511122150.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-12
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2045-08-12
AI Technical Summary
The thermal conductive structure in large electronic products is difficult to ensure the uniformity of thermal conductive materials and molding thickness. In particular, bubbles and unevenness are prone to occur during the glue pouring process in the aluminum-plastic film, resulting in low processing efficiency.
It adopts a fully automatic glue pouring mechanism, including a workbench, glue pouring components and molding components. Through the coordination of the lifting component, film opening structure, film sealing structure, reference structure and extrusion structure, a high degree of integration of multiple glue pouring mechanisms is achieved to ensure stable solution ratio, gas extraction and uniform molding of aluminum-plastic film.
It improves the processing efficiency and quality stability of the thermal conductive structure of large electronic products, ensures the uniformity of thermal conductive materials and the consistency of molding thickness, and solves the problem of uniform glue filling of large-volume thermal conductive structures.
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Figure CN120607009A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of glue pouring, and in particular to a full-automatic glue pouring mechanism. Background Art
[0002] With the development of society, electronic products have become closely intertwined with human life, and people's demands for product quality are becoming increasingly higher. To improve product quality and ensure stable operation, every electronic product is equipped with at least one heat dissipation component. The core thermal conductive structure of the heat dissipation component is generally a thermal conductive material that is molded by glue potting inside an aluminum-plastic film and uniformly shaped by the aluminum-plastic film. The core of the thermal conductive structure's quality lies in the uniformity of the internal thermal conductive material and the uniform thickness of the entire thermal conductive structure.
[0003] However, unlike the small thermal conductive structures in small electronic products, the thermal conductive structures in large electronic products are relatively large. It is difficult to ensure uniformity of the thermal conductive material in such a large thermal conductive structure, and it is also difficult to ensure that the thickness of the entire thermal conductive structure is uniform after the colloid is poured into the aluminum-plastic film and stabilizes. Summary of the Invention
[0004] The main purpose of the present invention is to provide a fully automatic glue pouring mechanism, which aims to ensure uniform and stable glue pouring and make the overall thickness of the processed product uniform.
[0005] To achieve the above-mentioned purpose, the present invention proposes a fully automatic glue pouring mechanism, which includes a workbench, a glue pouring component and a molding component; The workbench is provided with a mounting frame and a guide rail passing through the mounting frame; The glue pouring assembly is connected to the mounting frame and is arranged toward the guide rail. The mounting frame is provided with a lifting assembly relative to the glue pouring assembly. Two film opening structures and two film sealing structures are provided at both ends of the glue pouring assembly. The film sealing structure is located below the film opening structure. A glue pouring cavity is formed between the two oppositely arranged film opening structures and film sealing structures. The glue pouring assembly is provided with a glue pouring mechanism toward the glue pouring cavity. The molding assembly is connected to the guide rail and is arranged toward the glue pouring assembly. A sealing structure is provided between the molding assembly and the glue pouring assembly. A reference structure is penetrated on one side of the molding assembly, and an extrusion structure is penetrated on the other side. The extrusion structure and the reference structure are parallel to each other and are clamped together to form a molding cavity. The molding cavity is connected to the glue pouring cavity, and a clamping structure penetrated through the molding cavity is provided on the reference structure.
[0006] In one embodiment of the present application, the extrusion structure includes an extrusion surface parallel to the reference structure and a pushing structure connected to the periphery of the molding component and connected to the extrusion surface. There are multiple pushing structures, and an array of multiple pushing structures is connected to the extrusion surface.
[0007] In one embodiment of the present application, a plurality of first guide rods vertically connected to the reference structure are arrayed inside the molding component, the extrusion surface is slidably connected to the plurality of first guide rods, and the plurality of first guide rods are connected to both sides of the molding cavity and are symmetrically arranged along the molding cavity.
[0008] In one embodiment of the present application, the pushing structure includes a stabilizing frame connected to the outer periphery of the molding assembly, and a pushing surface connected to the side of the extrusion surface facing away from the molding cavity. The stabilizing frame is provided with a first driving member, and the first driving member is connected to the driving surface. A second guide rod parallel to the first guide rod is provided between the pushing surface and the driving surface.
[0009] In one embodiment of the present application, a plurality of third guide rods parallel to the second guide rods and connected to the driving surface are passed through the stabilizing frame, and the plurality of third guide rods are wrapped around the first driving member.
[0010] In one embodiment of the present application, the film sealing structure includes a second driving member connected to the outer periphery of the glue pouring assembly and arranged toward the glue pouring cavity, and a heat sealing structure connected to the second driving member, wherein the bottom edge of the heat sealing structure is provided with a heat sealing member toward the glue pouring cavity, and the top edge of the heat sealing structure is provided with a stabilizing frame parallel to the heat sealing member toward the glue pouring cavity.
[0011] In one embodiment of the present application, the film opening structure includes a guide structure provided adjacent to the glue filling mechanism, and a film opening member connected to the guide structure. At least two film opening members are symmetrically provided along the guide structure, and suction heads are provided opposite to each other at the two film opening members. The film opening members are provided through the heat sealing structure and between the heat sealing member and the stabilizing frame. The two film-opening parts are connected with a driving mechanism.
[0012] In one embodiment of the present application, the driving mechanism includes a third driving member provided on the top of the glue-filling assembly, and a driving structure connected to the third driving member and connected to the two film-opening members, wherein guide portions are provided at both ends of the driving structure, and the width of the guide portions gradually decreases in the vertical downward direction; A guide groove is provided in the guide portion relative to the film opening member, and the guide groove is arranged parallel to the side wall of the guide portion.
[0013] In one embodiment of the present application, the workbench is provided with a loading portion and a loading portion at both ends relative to the guide rail, the mounting frame is located between the loading portion and the loading portion, and the loading portion is provided with a guide assembly wrapped around the forming assembly; The guide assembly is symmetrically provided with two guide frames located above the forming assembly, and both guide frames are provided with guide pieces connected to the forming cavity along the central axis.
[0014] In one embodiment of the present application, the workbench is provided with at least two parallel guide rails, the glue-pouring components are provided with at least two groups opposite to each other, and the molding components are provided with at least two groups; Each of the glue pouring components is provided with at least two groups of glue pouring mechanisms, and the molding component is provided with at least two groups of clamping structures relative to the glue pouring component, and each of the glue pouring mechanisms corresponds to one clamping structure.
[0015] By adopting the above technical solution, the present invention has the following advantages: The purpose of the present application is to solve the problems of unstable glue-filled thermal conductive materials and uneven thickness of processed products that may occur when processing integrated large-volume thermal conductive structures. The problems in the manufacturing process of the thermal conductive structure are mainly because the raw materials of the thermal conductive material are generally at least two solution materials, which need to be glued into the aluminum-plastic film to allow the different solutions to react. When the final reaction is stable, a flexible gel-like thermal conductive material can be obtained. At the same time, the aluminum-plastic film is sealed to obtain the finished thermal conductive structure. When different solutions react, a large number of bubbles may appear, which makes the finished thermal conductive material prone to unevenness. In addition, in large-volume thermal conductive structures, the aluminum-plastic film has a large area of use, and the large amount of solution filled makes homogeneity and molding difficult.
[0016] In order to solve the above problems, the glue filling mechanism is provided with a workbench for installing different structures, and the workbench is provided with a mounting frame and a guide rail. Because the solution reaction takes time, in order to ensure processing efficiency, multiple guide rails are generally required to be arranged side by side on the workbench for full-power processing. A loading structure can be installed on one side of the guide rail so that multiple glue filling mechanisms can correspond to the power of the aluminum-plastic film cutting preparation mechanism. When one side of multiple glue filling mechanisms is a loading structure, it will be difficult to unload the heat-conducting structure. Therefore, the glue filling mechanism can be guided to the other side through the guide rail, and a unloading structure can be installed on the other side. The above structures cooperate with each other to make the fully automatic glue filling mechanism highly integrated. This structure can effectively solve the efficiency mismatch problem caused by the high efficiency of aluminum-plastic film preparation and the slow glue filling rate, and improve the production and processing rate of the whole machine.
[0017] The glue pouring structure is arranged on the mounting frame. Through the lifting assembly on the mounting frame, the glue pouring structure can be moved relative to the molding assembly to close the mold for processing or open the film for taking materials. The main functions of the glue pouring structure are to pour different solutions, vacuum, remove the gas generated during the reaction, open the aluminum-plastic film to make the equipment convenient for glue pouring, and close the aluminum-plastic film after the processing is completed to make it a complete thermal conductive structure. In order to achieve the above functions, the two sides of the glue pouring assembly are relatively provided with a film opening structure and a film sealing structure. The film opening structure and the film sealing structure can move independently of each other, and the film opening structure and the film sealing structure on both sides are sandwiched to form a glue pouring cavity corresponding to the aluminum-plastic film. The top of the glue pouring assembly is provided with a glue pouring mechanism towards the glue pouring cavity. The glue pouring mechanism generally includes at least two glue pouring heads and an emptying head, or other layout structures that can achieve the above functions. The glue pouring mechanism can ensure the liquid injection efficiency and the stability of the solution ratio, and the emptying head can ensure that there is no other gas in the glue pouring mechanism to avoid reaction errors. It can also extract the gas generated by the reaction to ensure the homogeneity of the thermal conductive material.
[0018] The molding component is connected to the guide rail, which is mainly used to connect and place the aluminum-plastic film. A sealing structure is provided between the molding component and the glue pouring component to prevent air leakage in the inner cavity after the mold is closed. In order to ensure the uniform thickness of the overall thermal conductive structure, a reference structure is provided on one side of the molding component and an extrusion structure is provided on the other side. A molding cavity for accommodating the thermal conductive structure to be processed is provided between the two structures. The reference structure is used to ensure the stability of the shaping of the thermal conductive structure and is used as a reference surface to support the thermal conductive structure. At the same time, a clamping structure connected to the molding cavity is provided on the reference structure. The clamping structure can clamp the top of the aluminum-plastic film so that the entire aluminum-plastic film can be unfolded, which is convenient for glue pouring and shaping. The extrusion structure is parallel to the reference structure to ensure that the entire thermal conductive structure is more uniform after the extrusion structure moves toward the reference structure. Through the cooperation of the above structures, the entire glue pouring mechanism can be highly integrated, and the different structures can be highly coordinated, ensuring the stability of processing efficiency and processing quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0020] Figure 1 This is a structural diagram of the fully automatic glue pouring mechanism of the present invention; Figure 2 It is a structural schematic diagram of the molding component of the fully automatic glue pouring mechanism of the present invention; Figure 3It is a structural schematic diagram of the extrusion structure of the full-automatic glue filling mechanism of the present invention; Figure 4 This is a structural diagram of a workbench of the fully automatic glue pouring mechanism of the present invention; Figure 5 It is a structural schematic diagram of the glue filling component of the fully automatic glue filling mechanism of the present invention; Figure 6 It is a structural schematic diagram of the film sealing structure of the fully automatic glue filling mechanism of the present invention; Figure 7 A schematic structural diagram of the film opening structure of the fully automatic glue filling mechanism of the present invention.
[0021] Description of Figure Numbers: 1. Workbench; 11. Loading unit; 12. Guide assembly; 13. Guide frame; 14. Mounting frame; 15. Guide rail; 2. Glue pouring assembly; 21. Glue pouring mechanism; 3. Film opening structure; 31. Guide structure; 32. Film opening member; 33. Drive mechanism; 34. Drive structure; 35. Guide unit; 4. Film sealing structure; 41. Second drive member; 42. Heat sealing structure; 5. Molding assembly; 51. First guide rod; 6. Reference structure; 61. Clamping structure; 7. Extrusion structure; 71. Extrusion surface; 8. Pushing structure; 81. Stabilizing frame; 82. First drive member; 83. Third guide rod; 84. Pushing surface; 9. Molding cavity; The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0023] Reference Figures 1 to 7 To achieve the above-mentioned purpose, the present invention proposes a fully automatic glue pouring mechanism 21, comprising a workbench 1, a glue pouring component 2 and a molding component 5; The workbench 1 is provided with a mounting frame 14 and a guide rail 15 passing through the mounting frame 14; The glue pouring assembly 2 is connected to the mounting frame 14 and is arranged toward the guide rail 15. The mounting frame 14 is provided with a lifting assembly relative to the glue pouring assembly 2. Two film opening structures 3 and two film sealing structures 4 are provided at opposite ends of the glue pouring assembly 2. The film sealing structure 4 is located below the film opening structure 3. A glue pouring cavity is formed between the two oppositely arranged film opening structures 3 and film sealing structures 4. The glue pouring assembly 2 is provided with a glue pouring mechanism 21 facing the glue pouring cavity. The molding component 5 is connected to the guide rail 15 and is arranged toward the glue pouring component 2. A sealing structure is provided between the molding component 5 and the glue pouring component 2. A reference structure 6 is passed through one side of the molding component 5, and an extrusion structure 7 is passed through the other side. The extrusion structure 7 and the reference structure 6 are parallel to each other and are clamped to form a molding cavity 9. The molding cavity 9 is connected to the glue pouring cavity. A clamping structure 61 is provided on the reference structure 6 and passes through the molding cavity 9.
[0024] The purpose of the present application is to solve the problems of unstable glue-filled thermal conductive materials and uneven thickness of processed products that may occur when processing integrated large-volume thermal conductive structures. The problems in the manufacturing process of the thermal conductive structure are mainly because the raw materials of the thermal conductive material are generally at least two solution materials, which need to be glued into the aluminum-plastic film to allow the different solutions to react. When the final reaction is stable, a flexible gel-like thermal conductive material can be obtained. At the same time, the aluminum-plastic film is sealed to obtain the finished thermal conductive structure. When different solutions react, a large number of bubbles may appear, which makes the finished thermal conductive material prone to unevenness. In addition, in large-volume thermal conductive structures, the aluminum-plastic film has a large area of use, and the large amount of solution filled makes homogeneity and molding difficult.
[0025] In order to solve the above problems, the glue filling mechanism 21 is provided with a workbench 1 for installing different structures, and the workbench 1 is provided with a mounting frame 14 and a guide rail 15. Because the solution reaction takes time, in order to ensure processing efficiency, multiple guide rails 15 are generally required to be arranged side by side on the workbench 1 for full-power processing. A loading structure can be installed on one side of the guide rail 15 so that multiple glue filling mechanisms 21 can correspond to the power of the aluminum-plastic film cutting preparation mechanism. When one side of multiple glue filling mechanisms 21 is a loading structure, it will be difficult to unload the heat-conducting structure. Therefore, the glue filling mechanism 21 can be guided to the other side through the guide rail 15, and a unloading structure can be installed on the other side. The above structures cooperate with each other to make the fully automatic glue filling mechanism 21 highly integrated. This structure can effectively solve the efficiency mismatch problem caused by the high efficiency of aluminum-plastic film preparation and the slow glue filling rate, and improve the production and processing rate of the whole machine.
[0026] The glue pouring structure is arranged on the mounting frame 14. Through the lifting component on the mounting frame 14, the glue pouring structure can be moved relative to the molding component 5 to close the mold for processing or open the film to take out the material. The main functions of the glue pouring structure are to pour glue with different solutions, vacuumize, remove the gas generated during the reaction, open the aluminum-plastic film to make the equipment easier to pour glue, and close the aluminum-plastic film after the processing is completed to make it a complete heat-conducting structure. In order to achieve the above functions, the two sides of the glue pouring component 2 are relatively provided with a film opening structure 3 and a film sealing structure 4, and the film opening structure 3 and the film sealing structure 4 can move independently of each other. The glue filling cavity corresponding to the aluminum-plastic film is formed between the film opening structure 3 and the film sealing structure 4 on both sides. The top of the glue filling component 2 is provided with a glue filling mechanism 21 towards the glue filling cavity. The glue filling mechanism 21 generally includes at least two glue filling heads and one vacuum head, or other layout structures that can achieve the above functions. The glue filling mechanism 21 can ensure the injection efficiency and the stability of the solution ratio, and the vacuum head can ensure that there is no other gas in the glue filling mechanism 21 to avoid reaction errors, and can also extract the gas generated by the reaction to ensure the homogeneity of the thermal conductive material.
[0027] The molding assembly 5 is connected to the guide rail 15, which is mainly used to connect and place the aluminum-plastic film. A sealing structure is provided between the molding assembly 5 and the glue filling assembly 2 to prevent air leakage in the inner cavity after the mold is closed. In order to ensure the uniform thickness of the overall heat-conducting structure, a reference structure 6 is provided on one side of the molding assembly 5 and an extrusion structure 7 is provided on the other side. A molding cavity 9 for accommodating the heat-conducting structure to be processed is provided between the two structures. The reference structure 6 is used to ensure the stability of the shaping of the heat-conducting structure and is used as a reference surface for supporting the heat-conducting structure. At the same time, a clamping structure 61 connected to the molding cavity 9 is provided on the reference structure 6. The top of the aluminum-plastic film can be clamped by the clamping structure 61 so that the entire aluminum-plastic film can be unfolded, which is convenient for glue filling and shaping. The extrusion structure 7 is parallel to the reference structure 6 to ensure that the entire heat-conducting structure is more uniform after the extrusion structure 7 moves toward the reference structure 6. Through the cooperation of the above structures, the entire glue filling mechanism 21 can be highly integrated, and the different structures can be highly coordinated, ensuring the stability of processing efficiency and processing quality.
[0028] See also Figures 2 to 3 The extrusion structure 7 includes an extrusion surface 71 parallel to the reference structure 6 and a pushing structure 8 connected to the periphery of the molding component 5 and connected to the extrusion surface 71. The pushing structure 8 is provided with multiple, and the multiple pushing structures 8 are connected to the extrusion surface 71 in an array.
[0029] The extrusion surface 71 is parallel to the reference structure 6, and the thickness of the entire heat-conducting structure can be made uniform when the extrusion surface 71 is working. Multiple pushing structures 8 jointly drive the extrusion surface 71 to ensure that the entire structure is highly integrated, while ensuring that the end of the extrusion surface 71 facing away from the molding cavity 9 is subjected to uniform force, which can prevent the aluminum-plastic film from being damaged and ensure the thickness of the heat-conducting structure is consistent.
[0030] See also Figure 2 A plurality of first guide rods 51 vertically connected to the reference structure 6 are arrayed inside the molding component 5, the extrusion surface 71 is slidably connected to the plurality of first guide rods 51, and the plurality of first guide rods 51 are connected to both sides of the molding cavity 9 and are symmetrically arranged along the molding cavity 9.
[0031] A plurality of first guide rods 51 are provided in the molding assembly 5, and the reference structure 6 and the extrusion surface 71 are both connected to the first guide rods 51. The guide rods can limit the movement path of the extrusion surface 71 to ensure the uniformity of the force acting on the entire heat-conducting structure, so that the extrusion surface 71 can always move parallel to the reference structure 6. The plurality of first guide rods 51 can limit the molding cavity 9 to ensure the structural stability of the molding cavity 9.
[0032] See also Figure 3 The pushing structure 8 includes a stabilizing frame 81 connected to the outer periphery of the molding assembly 5, and a pushing surface 84 connected to the side of the extrusion surface 71 facing away from the molding cavity 9. The stabilizing frame 81 is provided with a first driving member 82, and the first driving member 82 is connected to the driving surface. A second guide rod parallel to the first guide rod 51 is provided between the pushing surface 84 and the driving surface.
[0033] A group of pushing structures 8 includes a stabilizing frame 81 for ensuring the stable installation of the pushing structure 8, and a pushing surface 84 connected to the extrusion surface 71. The extrusion surface 71 is driven by the pushing surface 84 to increase the contact area between the two and ensure uniform force. A first driving member 82 (generally a cylinder, but can be a motor) is provided on the stabilizing frame 81. The first driving member 82 is driven and connected to the driving surface. A plurality of second guide rods are provided between the driving surface and the pushing surface 84, which can shorten the length of the connecting rod between the driving member and the pushing surface 84 and ensure the stable movement of the pushing surface 84.
[0034] See also Figure 3 The stabilizing frame 81 is provided with a plurality of third guide rods 83 parallel to the second guide rod and connected to the driving surface, and the plurality of third guide rods 83 are wrapped around the first driving member 82. The driving surface can be limited by the third guide rods 83 to ensure the stability of the moving path of the driving surface.
[0035] See also Figures 5 and 6 The film sealing structure 4 includes a second driving member 41 connected to the outer periphery of the glue pouring component 2 and arranged toward the glue pouring cavity, and a heat sealing structure 42 connected to the second driving member 41. The bottom edge of the heat sealing structure 42 is provided with a heat sealing member toward the glue pouring cavity, and the top edge of the heat sealing structure 42 is provided with a stabilizing frame 81 parallel to the heat sealing member toward the glue pouring cavity.
[0036] The film sealing structure 4 is driven by the second driving member 41. A heat sealing structure 42 is provided at the end of the second driving member 41. The bottom of the heat sealing structure 42 is connected to the end of the second driving member 41. A heat sealing member is provided at the bottom end of the heat sealing structure 42 and a stabilizing frame 81 is provided at the top end. The stabilizing frame 81 and the heat sealing member can enclose a stable cavity. When the adjacent film sealing structures 4 are closed by the second driving member 41, the two heat sealing members are closed and heat-sealed, and the two stabilizing frames 81 can ensure the stability of the connection of the heat sealing members and prevent damage caused by uneven force when the heat sealing members are closed.
[0037] See also Figures 5 to 7 The film opening structure 3 includes a guide structure 31 provided near the glue filling mechanism 21, and a film opening member 32 connected to the guide structure 31. At least two film opening members 32 are symmetrically provided along the guide structure 31. The two film opening members 32 are provided with suction heads opposite to each other. The film opening members 32 are provided through the heat sealing structure 42 and are located between the heat sealing member and the stabilizing frame 81. The two film-opening components 32 are connected to a driving mechanism 33 .
[0038] The guide structure 31 of the film opening structure 3 is connected to the inner wall of the top of the glue filling component 2. The two film opening parts 32 can be slidably connected through the guide structure 31 (a guide rail). The film opening parts 32 include a suction head (with an air pump, which opens the film by sucking the two sides of the aluminum-plastic film respectively through two opposite suction heads), and a connecting frame for installing and extending the suction head to the stable cavity. The two film opening parts 32 can open the film synchronously through the driving mechanism 33 to ensure the accuracy and stability of the injected solution.
[0039] See also Figure 7 The driving mechanism 33 includes a third driving member provided on the top of the glue-filling assembly 2, and a driving structure 34 connected to the third driving member and connected to the two film-opening members 32. Guide portions 35 are provided at both ends of the driving structure 34, and the width of the guide portion 35 gradually decreases along the vertical downward direction; A guide groove is provided in the guide portion 35 opposite to the film opening member 32 , and the guide groove is provided parallel to the side wall of the guide portion 35 .
[0040] The third driving member is installed on the top of the glue filling component 2, which can avoid the second driving member 41, so that the whole machine is highly integrated in structure, and the relative guide structure 31 is set to ensure the stability of the driving force. The driving structure 34 can be regarded as an isosceles trapezoid with a slot on the top, and the guide part 35 is provided on both sides of the trapezoid. The guide groove is opened parallel to the side of the trapezoid. Through the above structure, when the third driving member moves up and down, the two film-opening parts 32 can be opened or avoided with the help of the guide grooves whose distance on both sides gradually increases along the vertical upward direction, so that the suction head can be stably connected and open the aluminum-plastic film.
[0041] See also Figures 1 to 4The workbench 1 is provided with a loading portion 11 and a unloading portion at both ends of the guide rail 15, and the mounting frame 14 is located between the loading portion 11 and the unloading portion. The loading portion 11 is provided with a guide assembly 12 wrapped around the forming assembly 5; The guide assembly 12 is symmetrically provided with two guide frames 13 located above the forming assembly 5 , and both guide frames 13 are provided with guide pieces connected to the forming cavity 9 along the central axis.
[0042] The two ends of the guide rail 15 are respectively a loading part 11 and a unloading part. A guide assembly 12 is provided at the loading part 11. Because the aluminum-plastic film to be processed is large in area and light in weight, the aluminum-plastic film is prone to floating during loading. The two guide frames 13 at the guide assembly 12 drive the guide plates to close with each other to form a limiting channel, which is used to guide the aluminum-plastic film to be captured by the clamping structure 61, effectively ensuring processing efficiency and processing quality.
[0043] See also Figures 1 to 7 , the workbench 1 is provided with at least two parallel guide rails 15, the glue filling components 2 are provided with at least two groups relatively, and the molding components 5 are provided with at least two groups; Each glue pouring assembly 2 is provided with at least two glue pouring mechanisms 21 . The molding assembly 5 is provided with at least two clamping structures 61 relative to the glue pouring assembly 2 . Each glue pouring mechanism 21 corresponds to one clamping structure 61 .
[0044] Through the above structure, multiple glue filling mechanisms 21 can work in conjunction with each other, which can solve the problem of mismatch in the working efficiency of the whole machine caused by high aluminum-plastic film feeding efficiency and low glue filling efficiency, and can ensure processing quality.
[0045] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0046] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.
Claims
1. A fully automatic glue filling mechanism, characterized in that: include: A workbench, wherein the workbench is provided with a mounting frame and a guide rail passing through the mounting frame; A glue pouring assembly is connected to the mounting frame and is arranged toward the guide rail. The mounting frame is provided with a lifting assembly relative to the glue pouring assembly. Two film opening structures and two film sealing structures are provided at opposite ends of the glue pouring assembly. The film sealing structure is located below the film opening structure. A glue pouring cavity is formed between the two oppositely arranged film opening structures and film sealing structures. The glue pouring assembly is provided with a glue pouring mechanism toward the glue pouring cavity. A molding assembly is connected to the guide rail and is arranged toward the glue pouring assembly. A sealing structure is provided between the molding assembly and the glue pouring assembly. A reference structure is passed through one side of the molding assembly and an extrusion structure is passed through the other side. The extrusion structure and the reference structure are parallel to each other and clamped to form a molding cavity. The molding cavity is connected to the glue pouring cavity. The reference structure is provided with a clamping structure that passes through the molding cavity.
2. A fully automatic glue pouring mechanism according to claim 1, characterized in that: The extrusion structure includes an extrusion surface parallel to the reference structure and a pushing structure connected to the periphery of the forming component and connected to the extrusion surface. There are multiple pushing structures, and the multiple pushing structures are connected to the extrusion surface in an array.
3. The fully automatic glue pouring mechanism according to claim 2, characterized in that: A plurality of first guide rods vertically connected to the reference structure are arrayed in the molding assembly, the extrusion surface is slidably connected to the plurality of first guide rods, and the plurality of first guide rods are connected to both sides of the molding cavity and symmetrically arranged along the molding cavity.
4. The fully automatic glue pouring mechanism according to claim 3, characterized in that: The pushing structure includes a stabilizing frame connected to the outer periphery of the molding assembly, and a pushing surface connected to the side of the extrusion surface facing away from the molding cavity. The stabilizing frame is provided with a first driving member, and the first driving member is connected to the driving surface. A second guide rod parallel to the first guide rod is provided between the pushing surface and the driving surface.
5. The fully automatic glue pouring mechanism according to claim 4, characterized in that: A plurality of third guide rods parallel to the second guide rods and connected to the driving surface are passed through the stabilizing frame, and the plurality of third guide rods surround the first driving member.
6. The fully automatic glue pouring mechanism according to claim 1, characterized in that: The film sealing structure includes a second driving member connected to the outer periphery of the glue pouring assembly and arranged toward the glue pouring cavity, and a heat sealing structure connected to the second driving member. The bottom edge of the heat sealing structure is provided with a heat sealing member toward the glue pouring cavity, and the top edge of the heat sealing structure is provided with a stabilizing frame parallel to the heat sealing member toward the glue pouring cavity.
7. The fully automatic glue pouring mechanism according to claim 6, characterized in that: The film opening structure includes a guide structure arranged adjacent to the glue filling mechanism and a film opening piece connected to the guide structure. At least two film opening pieces are symmetrically arranged along the guide structure. The two film opening pieces are oppositely provided with suction heads. The film opening pieces are arranged through the heat sealing structure and between the heat sealing piece and the stabilizing frame. The two film-opening parts are connected with a driving mechanism.
8. The fully automatic glue pouring mechanism according to claim 7, characterized in that: The driving mechanism includes a third driving member provided on the top of the glue-filling assembly, and a driving structure connected to the third driving member and connected to the two film-opening members. Guide portions are provided at both ends of the driving structure, and the width of the guide portions gradually decreases in the vertical downward direction. A guide groove is provided in the guide portion relative to the film opening member, and the guide groove is arranged parallel to the side wall of the guide portion.
9. The fully automatic glue pouring mechanism according to claim 1, characterized in that: The workbench is provided with a loading part and a unloading part at both ends relative to the guide rail, the mounting frame is located between the loading part and the unloading part, and the loading part is provided with a guide assembly wrapped around the forming assembly; The guide assembly is symmetrically provided with two guide frames located above the forming assembly, and both guide frames are provided with guide pieces connected to the forming cavity along the central axis.
10. The fully automatic glue pouring mechanism according to claim 1, characterized in that: The workbench is provided with at least two parallel guide rails, the glue-pouring components are provided with at least two groups opposite to each other, and the molding components are provided with at least two groups; Each of the glue pouring components is provided with at least two groups of glue pouring mechanisms, and the molding component is provided with at least two groups of clamping structures relative to the glue pouring component, and each of the glue pouring mechanisms corresponds to one clamping structure.
Citation Information
Patent Citations
Automatic membrane wire arranging machine and membrane component production equipment thereof
CN108421419A
Automatic filling and film sealing system
CN114802852A
Heat sealing mechanism and reagent strip filling equipment
CN218317662U
Automatic machine for forming, filling, and sealing bags having transverse closure strips, and bags obtained thereby
US6032437A
Chip detection and packaging device
WO2023179149A1