Semiconductor chip rinsing apparatus and cleaning method thereof

Abstract

The application relates to the technical field of semiconductor chips, in particular to a semiconductor chip flushing device and a cleaning method thereof, which comprises a cleaning table, the inner wall of the middle part of the cleaning table is provided with a cleaning frame, the cleaning table comprises a cleaning water recovery tank, the rear side of the cleaning water recovery tank is fixedly connected with a U-shaped vertical plate, and the rear side top of the U-shaped vertical plate is fixedly connected with a cleaning water tank; the device is provided with the cleaning table and the cleaning frame, rapid cleaning of wafers is realized, one wafer is flushed at the same time, another wafer is pre-flushed by using circulating water, the cleaning efficiency is effectively improved, the cleanliness of the wafer surface is ensured, in addition, the device is designed through a transmission mechanism, rapid switching of the wafer orientation is realized, the overall working efficiency is further improved, meanwhile, the recycling design of the cleaning water not only saves water resources, but also reduces production cost, and the device meets the concept of green production.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and more particularly to a semiconductor chip flushing device and a cleaning method thereof. Background Art

[0002] A semiconductor chip refers to a microcircuit with specific functions that is made of specific semiconductor materials, such as silicon, germanium or gallium arsenide, and which integrates hundreds of millions of transistors, resistors, capacitors and other components on a tiny chip through a series of complex microelectronic processes, such as photolithography, etching, ion implantation, and metallization. These microcircuits are the core components of electronic devices such as computers, mobile phones, and televisions, responsible for processing, storing and transmitting information. The performance of semiconductor chips directly determines the performance and function of electronic devices. With the continuous development of science and technology, the size of semiconductor chips is getting smaller, the integration is getting higher, and the performance is getting more powerful.

[0003] Patent document CN106971966A discloses a semiconductor cleaning device and method comprising a conveyor, a spray mechanism, a scrubbing mechanism, a rinsing mechanism, and a drying mechanism. These mechanisms are arranged sequentially along the conveying direction of the conveyor and positioned above the conveyor. This device removes contamination from the surface of semiconductor chips, converting defective chips into functional ones. The process is highly continuous and automated, effectively improving the yield of finished products, reducing product waste, and lowering the manufacturing cost of semiconductor chips.

[0004] During the manufacturing and processing of semiconductor wafers, their surfaces will inevitably be contaminated with various pollutants, such as particles, organic matter, metal ions, etc. If these pollutants are not removed in time, they will have a serious impact on the performance and reliability of the semiconductor chip. Semiconductor wafer cleaning usually involves placing the wafer on a turntable, rotating it at high speed while spraying and flushing it with cleaning fluid to remove pollutants from the wafer surface. However, traditional cleaning methods can only clean a single wafer at a time and are inefficient, unable to meet the needs of large-scale production. In addition, the flushed cleaning water cannot be effectively recycled and treated, which not only causes a waste of water resources, but may also cause certain pollution to the environment. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor chip flushing device and a cleaning method thereof. The technical problem to be solved by the present invention is that the traditional cleaning method can only clean a single wafer at a time, which is inefficient and cannot meet the needs of large-scale production. Moreover, the flushed cleaning water cannot be effectively recovered and treated, which not only causes a waste of water resources, but may also cause certain pollution to the environment.

[0006] To solve the above technical problems, the technical scheme adopted by the present application is:

[0007] A semiconductor chip rinsing device, comprising a cleaning table, an inner wall of a middle part of the cleaning table is provided with a cleaning rack;

[0008] The cleaning table comprises a cleaning water recovery tank, a rear side of the cleaning water recovery tank is fixedly connected with a U-shaped vertical plate, and a top of a rear side of the U-shaped vertical plate is fixedly connected with a cleaning water tank;

[0009] The cleaning rack comprises a cleaning turntable, and an inner side of a top of the cleaning turntable is provided with a wafer fixing assembly.

[0010] As a further scheme of the present application, a top of a front side of the U-shaped vertical plate is fixedly connected with a spray head connecting plate, an inner wall of the spray head connecting plate is fixedly connected with a spray head, a top of the spray head is fixedly connected with a water pipe, one end of the water pipe away from the spray head is fixedly connected to a top of the cleaning water tank, a top of the cleaning water recovery tank is fixedly connected with a recovery tank feeding hopper in a middle part, an outer wall of the recovery tank feeding hopper is fixedly connected with a vertical connecting rod in an annular array, an inner side of the vertical connecting rod is fixedly connected with a conical cover in a top part, inner sides of bottom parts of two vertical connecting rods are fixedly connected with two connecting rods, inner sides of the two connecting rods are fixedly connected with a bottom spray head valve, a top of the bottom spray head valve is fixedly connected with a bottom spray head, an outer wall of the bottom spray head valve is fixedly connected with a second water pipe, one end of the second water pipe away from the bottom spray head valve is fixedly connected to a front side of the cleaning water recovery tank, an inner wall of the recovery tank feeding hopper is fixedly connected with a filter screen, the top of the bottom spray head is aligned with the bottom of the spray head, a right side of the cleaning water recovery tank is fixedly connected with a motor, an output end of the motor is fixedly connected with a transmission disc, and an outer wall of the transmission disc is sleeved with a track.

[0011] As a further scheme of the present application, the cleaning turntable comprises a circular rotating sleeve, an inner wall of the circular rotating sleeve is fixedly connected with a connecting side plate in an annular array, an inner side of the connecting side plate is fixedly connected with a center disc, a bottom of the center disc is fixedly connected with a center disc rotating pipe, the center disc and the center disc rotating pipe are both hollow designed in a middle part, an outer wall of the circular rotating sleeve is rotationally connected to an inner wall bottom of the conical cover, an outer wall bottom of the center disc rotating pipe is fixedly connected with a second transmission disc, an outer wall of the second transmission disc is sleeved on an inner wall of the track on a side away from the transmission disc, and a top of the circular rotating sleeve is fixedly connected with a control member.

[0012] As a further scheme of the present application, the control member comprises a control member main body, and a rear side of a top of the control member main body is provided with a rack frame.

[0013] As a further solution of the present invention: the control component body includes two side outer rings, the outer sides of the two side outer rings are fixedly connected with inner gear discs, the tops of the outer walls of the two side outer rings are fixedly connected with inverted L-shaped connecting blocks, the inner walls of the middle parts of the tops of the two inverted L-shaped connecting blocks are slidably connected with columnar lifting rods, the tops of the two columnar lifting rods are fixedly connected with lifting side blocks, the four sides of the inner sides of the two side outer rings are fixedly connected with horizontal connecting rods, the middle parts of the two horizontal connecting rods at the top and bottom are hollowed out, and the inner parts of the horizontal connecting rods on the front and rear sides are fixedly connected. The left and right sides of the side are fixedly connected with L-shaped supporting poles, the inner walls of the two side outer rings are rotatably connected with rotating side disks, the tops of the outer sides of the two rotating side disks are rotatably connected with gears, the outer sides of the two gears are rotatably connected with hinge blocks, one side of the two hinge blocks is rotatably connected to the bottom ends of the two columnar lifting poles, the outer walls of the two gears are meshed with the inner walls of the two inner gear disks, the middle parts of the outer sides of the two rotating side disks are fixedly connected with a columnar transmission cross bar, and the outer ends of the two columnar transmission cross bars are fixedly connected with a third transmission disk.

[0014] As a further solution of the present invention: the top of the inner rear side of the two side outer rings is fixedly connected with a horizontal C-shaped connecting plate, the top middle part of the horizontal C-shaped connecting plate is fixedly connected with a second motor, the output end of the second motor is fixedly connected with a fourth transmission disc, the outer wall of the fourth transmission disc is covered with a second crawler, and the side of the second crawler away from the fourth transmission disc is covered with a fifth transmission disc, the top of the rear side of the two inverted L-shaped connecting blocks is fixedly connected with a rear guide rod, the rear sides of the two rear guide rods are fixedly connected with a hydraulic push rod connecting cross bar, and the top middle part of the hydraulic push rod connecting cross bar is fixedly connected It is connected to a hydraulic push rod, and the rear sides of the inner bottom of the two side outer rings are fixedly connected with a columnar horizontal rotation rod connecting block, the middle of the inner wall of the two columnar horizontal rotation rod connecting blocks is rotatably connected with a columnar horizontal rotation rod, and the middle of the outer wall of the columnar horizontal rotation rod is fixedly connected to the inner wall of the fifth transmission plate, and the left and right ends of the columnar horizontal rotation rod extend to the outside of the two columnar horizontal rotation rod connecting blocks and are fixedly connected to the sixth transmission plate, and the outer walls of the two sixth transmission plates are both covered with third crawlers, and the inner walls of the two third crawlers away from the sixth transmission plate are both covered on the outer walls of the two third transmission plates.

[0015] As a further solution of the present invention: the top of the bottom nozzle extends to the top of the top horizontal connecting rod through the center disk rotating tube, the middle of the center disk and the middle of the two horizontal connecting rods.

[0016] As a further solution of the present invention: the rack frame includes two vertical rack rods, the bottoms of the two vertical rack rods are slidably connected to the tops of the two rear guide rods, the rear bottoms of the two vertical rack rods are fixedly connected with connecting side blocks, the inner sides of the two connecting side blocks are fixedly connected with a U-shaped connecting frame, the middle part of the rear bottom of the U-shaped connecting frame is fixedly connected to the front end of the hydraulic push rod, the left and right sides of the top and bottom of the inner side of the U-shaped connecting frame are fixedly connected with baffle connecting rods, and the inner sides of the two groups of baffle connecting rods at the top and bottom are fixedly connected with baffles.

[0017] As a further solution of the present invention: the wafer fixing assembly includes a fixed frame, the middle of the left and right sides of the fixed frame are fixedly connected with a columnar gear connecting cross bar, the outer walls of the two columnar gear connecting cross bars are rotatably connected to the middle of the inner walls of the two lifting side blocks, the outer ends of the two columnar gear connecting cross bars extend to the outside of the two lifting side blocks and are fixedly connected with a second gear, the middle of the left and right sides of the top and bottom of the fixed frame are fixedly connected with side vertical plates, the middle of the left and right sides of the inner side of the fixed frame are fixedly connected with pneumatic push rod control component connecting blocks, the inner sides of the two pneumatic push rod control component connecting blocks are fixedly connected with a pneumatic push rod control, and the front and back sides of the outer walls of the pneumatic push rod control are fixedly connected There is a ventilation duct, and the middle parts of the front and rear sides of the fixed frame are fixedly connected with a two-way pneumatic push rod, and the ends of the two ventilation ducts away from the pneumatic push rod control parts are fixedly connected to the outer walls of the two two-way pneumatic push rods, and the inner sides of the upper and lower groups of side vertical plates on the sides away from each other are fixedly connected with round trays, and the outer walls of the two round trays are rotatably connected with hinged side blocks in a circular array, and the inner walls of the upper and lower groups of hinged side blocks are rotatably connected with Z-shaped rotating clamps, and the inner sides of the upper and lower groups of Z-shaped rotating clamps are fixedly connected with columnar push-pull blocks, and the inner ends of the upper and lower groups of columnar push-pull blocks are fixedly connected with lifting push plates, and the front and rear sides of the inner sides of the two lifting push plates are fixedly connected to the top and bottom ends of the two two-way pneumatic push rods.

[0018] In addition, the present invention also relates to a semiconductor chip flushing device and a cleaning method thereof, comprising the following steps:

[0019] Step 1: Two wafers are fixed on the inner sides of multiple Z-shaped rotating clamps at the top and bottom respectively. Two bidirectional pneumatic push rods are activated to push the lifting plate up or down, and then the wafers are firmly clamped by the columnar push-pull blocks and Z-shaped rotating clamps. At this time, the device enters the preparatory cleaning stage;

[0020] Step 2: Start the motor, drive the transmission disc to rotate the cleaning rack through the crawler belt, and the wafers rotate synchronously. At the same time, the cleaning water in the cleaning water tank flows into the nozzle through the water pipe, evenly spraying and rinsing the rotating wafers. During the rinsing process, excess cleaning water and impurities fall into the recycling box feeding funnel. After fine filtration by the filter, the impurities are effectively intercepted, and the cleaning water flows smoothly into the cleaning water recovery tank, realizing the recycling of cleaning water;

[0021] Step 3: After the top wafer has been initially rinsed, the motor stops running. At this time, the hydraulic push rod is activated to push the U-shaped connecting frame forward and backward, thereby driving the vertical rack rod to slide smoothly on the rear guide rod through the connecting side blocks. At the same time, the vertical rack rod engages with the second gear to ensure that the wafer fixing assembly can be turned smoothly;

[0022] Step 4: During the wafer holding assembly flipping process, the baffle blocks the nozzle and bottom nozzle in time to prevent the cleaning water from splashing. Then, the second motor is started, driving the rotating side disk through a series of transmission devices, which in turn drives the gear and the internal gear disk to engage and rotate. During this process, the columnar lifting rod slides up and down within the inverted L-shaped connecting block, ensuring that the wafer holding assembly can be flipped 180 degrees smoothly and accurately;

[0023] Step 5: After the wafer fixing assembly is flipped, the wafer originally fixed at the bottom faces the top, and the wafer originally at the top faces the bottom. At this time, the bottom nozzle valve closes the bottom nozzle to prevent the circulating water from causing secondary contamination to the already cleaned wafer. Subsequently, the top water nozzle continues to rinse the flipped wafer to ensure that the cleanliness of the wafer surface meets the requirements. Since the flipped wafer has been pre-cleaned, the rinsing time can be relatively shortened, thereby improving the overall cleaning efficiency;

[0024] Step 6: After all wafers are completely rinsed, the entire device stops operating. At this time, through the reverse operation of the pneumatic push rod control component, the bidirectional pneumatic push rod is shortened, and the Z-shaped rotating clamp releases the wafer, allowing the staff to easily remove the wafer for the next step of processing.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects:

[0026] (1) The efficient integration of dual-station collaborative cleaning and water resource recycling enables simultaneous processing of two wafers through the coordinated cooperation of the double-sided clamping structure of the wafer fixing assembly and the cleaning water recovery system. The top nozzle uses clean water for fine cleaning, while the bottom nozzle uses filtered circulating water for pre-rinsing, forming a closed-loop system of "fine cleaning-pre-washing-recycling-reuse". This design not only improves the cleaning efficiency per unit time, but also improves the utilization rate of water resource recycling, breaking through the limitations of traditional single-wafer cleaning devices in terms of efficiency and environmental protection.

[0027] (2) The intelligent linkage of the turnover mechanism and the anti-pollution system, the innovative rack and pinion turnover mechanism and the baffle protection system form intelligent linkage: when the hydraulic push rod drives the wafer fixing assembly to turn over, the baffle moves synchronously to shield the spraying area, and the bottom nozzle valve is automatically closed. This multi-mechanism cooperative work realizes the synchronous completion of 180° turnover and pollution prevention and control, shortens the wafer switching time, and completely avoids the secondary pollution risk of the cleaned wafer, ensuring the product yield.

[0028] (3) The cooperative optimization of dynamic stable clamping and high-speed cleaning, the design of combining the pneumatic self-adaptive clamping mechanism with the rigid rotary platform, the Z-shaped rotating clamping block can automatically adjust the clamping force according to the wafer thickness, and cooperate with the centrifugal force flow guide structure, so that the wafer still maintains high position stability under high-speed rotation. Thus, the wafer displacement deviation is reduced, the cleaning efficiency is improved, and the process reliability is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic diagram of the main body of the invention;

[0030] Figure 2 It is a schematic diagram of the main body of the invention;

[0031] Figure 3 It is a schematic diagram of the cleaning table of the invention;

[0032] Figure 4 It is a schematic diagram of the cleaning rack of the invention;

[0033] Figure 5 It is a schematic diagram of the cleaning rack of the invention;

[0034] Figure 6 It is a schematic diagram of the cleaning turntable of the invention;

[0035] Figure 7 It is a schematic diagram of the control part of the invention;

[0036] Figure 8 It is a schematic diagram of the control part of the invention;

[0037] Figure 9 It is a schematic diagram of the rack frame of the invention;

[0038] Figure 10 It is a schematic diagram of the wafer fixing assembly of the invention.

[0039] Figure: 1, cleaning table; 11, cleaning water recovery tank; 12, U-shaped vertical plate; 13, nozzle connecting plate; 14, cleaning water tank; 15, water pipe; 16, nozzle; 17, vertical connecting rod; 18, conical cover; 19, connecting rod; 110, bottom nozzle valve; 111, bottom nozzle; 112, second water pipe; 113, recovery tank feeding funnel; 114, filter; 115, motor; 116, transmission plate; 117, crawler; 2, cleaning rack; 21, cleaning turntable; 211, circular rotating sleeve; 212, connecting side plate; 2 13. Center plate; 214. Center plate rotating tube; 215. Second transmission plate; 216. Control element; 2161. Control element body; 21611. Side outer ring; 21612. Inner gear plate; 21613. Inverted L-shaped connecting block; 21614. Columnar lifting pole; 21615. Horizontal connecting rod; 21616. L-shaped supporting pole; 21617. Rotating side plate; 21618. Gear; 21619. Articulated block; 21620. Columnar transmission cross bar; 21621. Third transmission plate; 21622. Horizontal C 21623, second motor; 21624, fourth transmission plate; 21625, second crawler; 21626, fifth transmission plate; 21627, columnar horizontal rotating rod connecting block; 21628, columnar horizontal rotating rod; 21629, sixth transmission plate; 21630, third crawler; 21631, rear guide rod; 21632, hydraulic push rod connecting cross bar; 21633, hydraulic push rod; 21634, lifting side block; 2164, rack frame; 21641, vertical rack rod; 21642, U-shaped connecting rod Connecting frame; 21643, baffle connecting rod; 21644, baffle; 21645, connecting side block; 22, wafer fixing assembly; 221, fixing frame; 222, two-way pneumatic push rod; 223, pneumatic push rod control component connecting block; 224, pneumatic push rod control component; 225, ventilation duct; 226, columnar gear connecting cross bar; 227, second gear; 228, side vertical plate; 229, round tray; 2210, hinged side block; 2211, Z-shaped rotating clamp block; 2212, columnar push-pull block; 2213, lifting push plate. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0041] like Figures 1-2 As shown, the present invention provides a semiconductor chip washing device, which includes a cleaning platform 1 , and a cleaning rack 2 is provided on the inner wall of the middle part of the cleaning platform 1 .

[0042] like Figure 3 As shown, the washing station 1 includes a washing water recovery tank 11, the rear side of the washing water recovery tank 11 is fixedly connected to a U-shaped vertical plate 12, the rear top of the U-shaped vertical plate 12 is fixedly connected to a clean water tank 14, the front top of the U-shaped vertical plate 12 is fixedly connected to a nozzle connecting plate 13, the inner wall of the nozzle connecting plate 13 is fixedly connected to a nozzle 16, the top of the nozzle 16 is fixedly connected to a water pipe 15, the end of the water pipe 15 away from the nozzle 16 is fixedly connected to the top of the clean water tank 14, the top middle of the washing water recovery tank 11 is fixedly connected to a recycling tank feeding funnel 113, the top of the washing water recovery tank 11 is fixedly connected to a vertical connecting rod 17 in a circular array on the outer wall of the recycling tank feeding funnel 113, and the inner top of the vertical connecting rod 17 is fixedly connected to a cone A shaped cover 18, wherein the inner bottom of the two vertical connecting rods 17 are fixedly connected to a connecting rod 19, the inner sides of the two connecting rods 19 are fixedly connected to a bottom nozzle valve 110, the top of the bottom nozzle valve 110 is fixedly connected to a bottom nozzle 111, the outer wall of the bottom nozzle valve 110 is fixedly connected to a second water pipe 112, one end of the second water pipe 112 away from the bottom nozzle valve 110 is fixedly connected to the front side of the cleaning water recovery tank 11, the inner wall of the recovery tank feeding funnel 113 is fixedly connected to a filter screen 114, the top of the bottom nozzle 111 is aligned with the bottom of the nozzle 16, and the right side of the cleaning water recovery tank 11 is fixedly connected to a motor 115, the output end of the motor 115 is fixedly connected to a transmission disk 116, and the outer wall of the transmission disk 116 is covered with a crawler 117;

[0043] When it is necessary to clean and rinse the semiconductor wafers, first fix the two semiconductor wafers through the cleaning rack 2, then start the motor 115, so that the transmission disk 116 drives the cleaning rack 2 to rotate through the crawler 117, and the semiconductor wafers rotate accordingly. The cleaning water in the clean water tank 14 flows into the nozzle 16 through the water pipe 15, and sprays and rinses the semiconductor wafers fixed on the top of the rotating cleaning rack 2. During the rinsing process, excess cleaning water and impurities will fall into the recycling box feeding funnel 113, and the impurities are trapped on the filter screen 114 after filtration, and the cleaning water flows into the cleaning water recovery tank 11, realizing the recycling of the cleaning water. At the same time, the second water pipe 112 introduces the rinsed water into the bottom nozzle valve 110 again to control the bottom nozzle 111 to rinse the semiconductor wafers fixed at the bottom of the cleaning rack 2, forming a circulating rinsing system. The entire rinsing process has a high degree of automation, high rinsing efficiency, and can effectively save water resources.

[0044] like Figures 4-6As shown, the cleaning rack 2 comprises a cleaning turntable 21, and a wafer fixing assembly 22 is arranged on the top inner side of the cleaning turntable 21. The cleaning turntable 21 comprises a circular rotating sleeve 211, a plurality of connecting side plates 212 are fixedly connected in an annular array on the inner wall of the circular rotating sleeve 211, a center disc 213 is fixedly connected to the inner side of the connecting side plates 212, a center disc rotating tube 214 is fixedly connected to the bottom of the center disc 213, the center disc 213 and the center disc rotating tube 214 are both hollow in the middle part, the outer wall of the circular rotating sleeve 211 is rotatably connected to the inner wall bottom of the conical cover 18, the outer wall bottom of the center disc rotating tube 214 is fixedly connected with a second transmission disc 215, the outer wall of the second transmission disc 215 is sleeved on the inner wall of the track 117 away from the side of the transmission disc 116, and the top of the circular rotating sleeve 211 is fixedly connected with a control member 216.

[0045] When the motor 115 is started, the second transmission disc 215 rotates with the rotation of the track 117, thereby driving the center disc rotating tube 214 and the entire cleaning turntable 21 to rotate, and the wafer fixing assembly 22 is firmly installed on the cleaning turntable 21, so as to ensure that the semiconductor wafer remains stable during the rotation process. The control member 216 is designed to control the orientation of the two fixed wafers.

[0046] As shown in the drawings, Figures 7-10As shown, the control member 216 comprises a control member body 2161, the top rear side of the control member body 2161 is provided with a rack frame 2164, the control member body 2161 comprises two side outer rings 21611, the outer sides of the two side outer rings 21611 are fixedly connected with inner toothed discs 21612, the top of the outer walls of the two side outer rings 21611 are fixedly connected with inverted L-shaped connecting blocks 21613, the inner walls of the top middle parts of the two inverted L-shaped connecting blocks 21613 are slidably connected with columnar lifting vertical rods 21614, the top ends of the two columnar lifting vertical rods 21614 are fixedly connected with lifting side blocks 21634, the inner sides of the four sides of the two side outer rings 21611 are fixedly connected with horizontal link rods 21615, the middle parts of the two horizontal link rods 21615 at the top and the bottom are designed to be hollow, the left and right sides of the inner sides of the front and rear horizontal link rods 21615 are fixedly connected with L-shaped support vertical rods 21616, the inner walls of the two side outer rings 21611 are rotatably connected with rotary side discs 21617, the top parts of the outer sides of the two rotary side discs 21617 are rotatably connected with gears 21618, the outer sides of the two gears 21618 are rotatably connected with hinged blocks 21619, one side of each of the two hinged blocks 21619 is rotatably connected to the bottom end of the two columnar lifting vertical rods 21614, the outer walls of the two gears 21618 are in meshing connection with the inner walls of the two inner toothed discs 21612, the outer ends of the two columnar transmission cross rods 21620 are fixedly connected with third transmission discs 21621, the top parts of the inner sides of the rear sides of the two side outer rings 21611 are fixedly connected with horizontal C-shaped connecting plates 21622, the top middle parts of the horizontal C-shaped connecting plates 21622 are fixedly connected with second motors 21623, the output ends of the second motors 21623 are fixedly connected with fourth transmission discs 21624, the outer walls of the fourth transmission discs 21624 are sleeved with second track belts 21625, one side of the second track belts 21625 away from the fourth transmission discs 21624 is sleeved with fifth transmission discs 21626, the top parts of the rear sides of the two inverted L-shaped connecting blocks 21613 are fixedly connected with rear guide rods 21631, the rear sides of the two rear guide rods 21631 are fixedly connected with hydraulic push rod connecting cross rods 21632, the top middle parts of the hydraulic push rod connecting cross rods 21632 are fixedly connected with hydraulic push rods 21633, the rear sides of the bottom parts of the inner sides of the two side outer rings 21611 are fixedly connected with columnar horizontal rotary rod connecting blocks 21627, the inner wall middle parts of the two columnar horizontal rotary rod connecting blocks 21627 are rotatably connected with columnar horizontal rotary rods 21628, the outer wall middle parts of the columnar horizontal rotary rods 21628 are fixedly connected to the inner walls of the fifth transmission discs 21626, the left and right ends of the columnar horizontal rotary rods 21628 extend to the outer sides of the two columnar horizontal rotary rod connecting blocks 21627 and are fixedly connected with sixth transmission discs 21629, the outer walls of the two sixth transmission discs 21629 are sleeved with third track belts 21630,The inner walls of the two third crawlers 21630 are both sleeved on the outer walls of the two third transmission discs 21621 on one side away from the sixth transmission disc 21629. The top of the bottom nozzle 111 extends to the top of the top horizontal connecting rod 21615 through the center disc rotating tube 214, the middle of the center disc 213 and the middle of the two horizontal connecting rods 21615. The rack frame 2164 includes two vertical rack rods 21641. The bottoms of the two vertical rack rods 21641 are both slidably connected to the tops of the two rear guide rods 21631. The rear bottoms of the two vertical rack rods 21641 are fixedly connected to the connecting side blocks 21645. The inner sides of the two connecting side blocks 21645 are fixedly connected to the U-shaped The connecting frame 21642, the middle of the rear bottom of the U-shaped connecting frame 21642 is fixedly connected to the front end of the hydraulic push rod 21633, the left and right sides of the top and bottom of the inner side of the U-shaped connecting frame 21642 are fixedly connected with the baffle connecting rod 21643, the inner sides of the two sets of baffle connecting rods 21643 at the top and bottom are fixedly connected with the baffle 21644, the wafer fixing assembly 22 includes a fixed frame 221, the middle of the left and right sides of the fixed frame 221 are fixedly connected with the columnar gear connecting cross bar 226, the outer walls of the two columnar gear connecting cross bars 226 are rotatably connected to the middle of the inner walls of the two lifting side blocks 21634, and the outer walls of the two columnar gear connecting cross bars 226 are fixedly connected to the inner walls of the two lifting side blocks 21634. The ends extend to the outside of the two lifting side blocks 21634 and are fixedly connected to the second gear 227. The middle of the left and right sides of the top and bottom of the fixed frame 221 are fixedly connected to the side vertical plates 228. The middle of the left and right sides of the inner side of the fixed frame 221 are fixedly connected to the pneumatic push rod control component connection blocks 223. The inner sides of the two pneumatic push rod control component connection blocks 223 are fixedly connected to the pneumatic push rod control components 224. The front and rear sides of the outer wall of the pneumatic push rod control component 224 are fixedly connected to the ventilation pipe 225. The middle of the front and rear sides of the fixed frame 221 are fixedly connected to the two-way pneumatic push rods 222. The ends of the two ventilation pipes 225 away from the pneumatic push rod control components 224 are fixedly connected. The outer walls of the two bidirectional pneumatic push rods 222 are fixedly connected to the inner sides of the upper and lower sets of side vertical plates 228 away from each other, and the circular trays 229 are fixedly connected to the outer walls of the two circular trays 229 with hinged side blocks 2210 rotatably connected in a circular array. The inner walls of the upper and lower sets of hinged side blocks 2210 are rotatably connected to Z-shaped rotating clamping blocks 2211. The inner sides of the upper and lower sets of Z-shaped rotating clamping blocks 2211 are fixedly connected to columnar push-pull blocks 2212. The inner ends of the upper and lower sets of columnar push-pull blocks 2212 are fixedly connected to lifting push plates 2213. The front and rear sides of the inner sides of the two lifting push plates 2213 are fixedly connected to the top and bottom ends of the two bidirectional pneumatic push rods 222.

[0047] The two wafers are respectively fixed on the inner sides of the multiple Z-shaped rotating clamps 2211 at the top and the multiple Z-shaped rotating clamps 2211 at the bottom. When they need to be fixed, the pneumatic push rod control part 224 is started, and air is inflated into the two-way pneumatic push rod 222 through the ventilation pipe 225 to make it extend, thereby pushing the lifting push plate 2213 to rise or fall. The lifting push plate 2213 drives the columnar push-pull block 2212 and the Z-shaped rotating clamp 2211 to move. Since the Z-shaped rotating clamp 2211 is rotatably connected to the outer wall of the round tray 229 through the hinged side block 2210, the Z-shaped rotating clamp 2211 will rotate inward during the movement, thereby firmly clamping the wafer. At the same time, the design of the columnar gear connecting the cross bar 226 and the second gear 227 allows the fixed frame 221 to rotate in the lifting side block 21634 to change the position of the two wafers;

[0048] When the orientation of the top and bottom wafers needs to be changed, the hydraulic push rod 21633 is activated, and the hydraulic push rod 21633 pushes the U-shaped connecting frame 21642 to move forward and backward. The U-shaped connecting frame 21642 drives the two vertical rack rods 21641 to slide on the rear guide rod 21631 through the connecting side blocks 21645. At the same time, the two vertical rack rods 21641 are engaged with the two second gears 227. At this time, the two baffles 21644 block the nozzle 16 and the bottom nozzle 111 to prevent the cleaning liquid from being sprayed out to rinse the wafers at an inclined angle when the direction is changed, thereby preventing the wafers from being damaged.

[0049] Afterwards, the second motor 21623 is started, and the output end of the second motor 21623 drives the fourth transmission plate 21624 to rotate, and the fourth transmission plate 21624 drives the fifth transmission plate 21626 to rotate through the second track 21625. The rotation of the fifth transmission plate 21626 further drives the cylindrical horizontal rotating rod 21628 and the sixth transmission plate 21629 at both ends to rotate, and the sixth transmission plate 21629 drives the third transmission plate 21621 to rotate through the third track 21630. Since the third transmission plate 21621 is fixedly connected to the columnar transmission cross bar 21620, the rotating side plate 21617 rotates accordingly, thereby driving the gear 21618 to rotate. The meshing relationship between the gear 21618 and the inner gear plate 21612 enables the gear 21618 to drive the hinge block 21619 to rotate during the rotation. The rotation of the hinge block 21619 causes the columnar lifting rod 21614 to slide up and down in the inverted L-shaped connecting block 21613. As the columnar lifting rod 21614 rises and falls, the lifting side block 2163 4 also moves up and down accordingly. Since the fixing frame 221 is connected to the lifting side block 21634 through the columnar gear connecting crossbar 226 and the second gear 227, when the columnar lifting vertical rod 21614 rises and falls, when the two lifting side blocks 21634 drive the wafer fixing assembly 22 to move downward as a whole, the two second gears 227 engage with the two vertical rack rods 21641, causing the wafer fixing assembly 22 to flip as a whole, so that the wafer originally fixed at the bottom faces the top, and the wafer originally at the top faces the bottom.

[0050] The working principle of the present invention is as follows: when it is necessary to clean and rinse the semiconductor wafers, first, the two wafers are fixed on the inner sides of the multiple Z-shaped rotating clamps 2211 at the top and the multiple Z-shaped rotating clamps 2211 at the bottom respectively. When they need to be fixed, the pneumatic push rod control component 224 is started, and air is inflated into the two-way pneumatic push rod 222 through the ventilation pipe 225 to make it extend, thereby pushing the lifting push plate 2213 to rise or fall. The lifting push plate 2213 drives the columnar push-pull block 2212 and the Z-shaped rotating clamp 2211 to move. Since the Z-shaped rotating clamp 2211 is rotatably connected to the outer wall of the round tray 229 through the hinged side block 2210, the Z-shaped rotating clamp 2211 will rotate inward during the movement, thereby firmly clamping the wafer. At this time, the motor 115 is started, and the transmission disk 116 drives the cleaning rack 2 to rotate through the crawler belt 117, and the semiconductor wafer rotates accordingly. The cleaning water in the clean water tank 14 flows into the nozzle 16 through the water pipe 15, and sprays and rinses the semiconductor wafer fixed on the top of the rotating cleaning rack 2. During the rinsing process, excess cleaning water and impurities will fall into the recycling box feeding funnel 113, and the impurities will be trapped on the filter screen 114 after being filtered, and the cleaning water will flow into the cleaning water recovery tank 11, realizing the recycling of the cleaning water. At the same time, the second water pipe 112 will introduce the rinsed water into the bottom nozzle valve 110 again to control the bottom nozzle 111 to rinse the semiconductor wafer fixed at the bottom of the cleaning rack 2. When the top wafer is completely rinsed, , the motor 115 stops rotating, and the hydraulic push rod 21633 is started. The hydraulic push rod 21633 pushes the U-shaped connecting frame 21642 to move forward and backward. The U-shaped connecting frame 21642 drives the two vertical rack rods 21641 to slide on the rear guide rod 21631 through the connecting side block 21645. At the same time, the two vertical rack rods 21641 are engaged with the two second gears 227. At this time, the two baffles 21644 block the sprinkler head 16 and the bottom sprinkler head 111, and the second motor 21623 is started. The output end of the second motor 21623 drives the fourth transmission plate 21624 to rotate. The fourth transmission plate 21624 drives the fifth transmission plate 21626 to rotate through the second crawler 21625. The rotation of the fifth transmission plate 21626 further drives The columnar horizontal rotating rod 21628 and the sixth transmission disc 21629 at both ends rotate, and the sixth transmission disc 21629 drives the third transmission disc 21621 to rotate through the third crawler 21630. Since the third transmission disc 21621 is fixedly connected to the columnar transmission cross rod 21620, the rotating side disc 21617 rotates accordingly, thereby driving the gear 21618 to rotate. The meshing relationship between the gear 21618 and the inner gear disc 21612 enables the gear 21618 to drive the hinge block 21619 to rotate during rotation. The rotation of the hinge block 21619 causes the columnar lifting rod 21614 to slide up and down in the inverted L-shaped connecting block 21613. As the columnar lifting rod 21614 rises and falls, the lifting side block 21634 also moves up and down.Since the fixing frame 221 is connected to the lifting side block 21634 through the columnar gear connecting cross bar 226 and the second gear 227, when the columnar lifting vertical rod 21614 is raised and lowered, when the two lifting side blocks 21634 drive the wafer fixing assembly 22 to move downward as a whole, and then the two second gears 227 are engaged with the two vertical rack rods 21641, the wafer fixing assembly 22 is turned over as a whole, so that the wafer originally fixed at the bottom faces the top, and the wafer originally at the top faces the bottom, and at the same time, the bottom nozzle valve 110 closes the bottom nozzle 111, so that ... The nozzle 111 no longer rinses the wafers that have been rotated to the bottom, preventing the circulating water from contaminating the already cleaned wafers. At this time, the wafers originally at the top face the top. Since the wafers originally at the bottom have been pre-cleaned with circulating water, the top clean water nozzle 16 continues to rinse them to ensure the cleanliness of the wafer surface. Since the wafers originally at the bottom have been pre-cleaned, the top clean water nozzle 16 can rinse them for a relatively short time, thereby improving the overall cleaning efficiency. After the wafers originally at the bottom have been completely rinsed, the entire device stops operating. At this time, through the reverse operation of the pneumatic push rod control component 224, the two-way pneumatic push rod 222 is shortened, and the Z-shaped rotating clamp 2211 releases the wafer, allowing the staff to easily remove the wafer for the next step of processing.

[0051] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip washing device, comprising a washing station (1), characterized in that: A cleaning rack (2) is provided on the inner wall of the middle portion of the cleaning table (1); The cleaning table (1) comprises a cleaning water recovery tank (11), a U-shaped vertical plate (12) is fixedly connected to the rear side of the cleaning water recovery tank (11), and a cleaning water tank (14) is fixedly connected to the top of the rear side of the U-shaped vertical plate (12); The cleaning rack (2) comprises a cleaning turntable (21), and a wafer fixing assembly (22) is provided on the inner side of the top of the cleaning turntable (21); the wafer fixing assembly (22) can be turned over as a whole; The top of the front side of the U-shaped vertical plate (12) is fixedly connected to a nozzle connecting plate (13), the inner wall of the nozzle connecting plate (13) is fixedly connected to a nozzle (16), the top of the nozzle (16) is fixedly connected to a water pipe (15), the end of the water pipe (15) away from the nozzle (16) is fixedly connected to the top of the cleaning water tank (14), and the middle of the top of the cleaning water recovery tank (11) is fixedly connected to a recovery tank feeding funnel (113). The wafer fixing assembly (22) includes a fixing frame (221), the middle of the left and right sides of the fixing frame (221) are fixedly connected with a columnar gear connecting cross bar (226), the outer walls of the two columnar gear connecting cross bars (226) are rotatably connected to the middle of the inner walls of the two lifting side blocks (21634), the outer ends of the two columnar gear connecting cross bars (226) extend to the outside of the two lifting side blocks (21634) and are fixedly connected with a second gear (227), the middle of the left and right sides of the top and bottom of the fixing frame (221) are fixedly connected with side vertical plates (228), The inner sides of the upper and lower groups of side vertical plates (228) are fixedly connected to the sides away from each other with circular trays (229), the outer walls of the two circular trays (229) are rotatably connected to hinged side blocks (2210) in a circular array, the inner walls of the upper and lower groups of hinged side blocks (2210) are rotatably connected to Z-shaped rotating clamps (2211), the inner sides of the upper and lower groups of Z-shaped rotating clamps (2211) are fixedly connected to columnar push-pull blocks (2212), the inner ends of the upper and lower groups of columnar push-pull blocks (2212) are fixedly connected to lifting push plates (2213), and the front and rear sides of the inner sides of the two lifting push plates (2213) are fixedly connected to the top and bottom ends of two bidirectional pneumatic push rods (222).

2. A semiconductor chip flushing device according to claim 1, characterized in that: The top of the cleaning water recovery tank (11) is fixedly connected to a vertical connecting rod (17) in a circular array on the outer wall of the recovery tank feeding funnel (113), and the inner top of the vertical connecting rod (17) is fixedly connected to a conical cover (18), wherein the inner bottoms of two vertical connecting rods (17) are fixedly connected to a connecting rod (19), and the inner sides of the two connecting rods (19) are fixedly connected to a bottom nozzle valve (110), and the top of the bottom nozzle valve (110) is fixedly connected to a bottom nozzle (111), and the outer wall of the bottom nozzle valve (110) is fixedly connected to the bottom nozzle (111). Two water pipes (112), one end of the second water pipe (112) away from the bottom nozzle valve (110) is fixedly connected to the front side of the cleaning water recovery tank (11), the inner wall of the recovery tank feeding funnel (113) is fixedly connected with a filter screen (114), the top of the bottom nozzle (111) is aligned with the bottom of the nozzle (16), the right side of the cleaning water recovery tank (11) is fixedly connected with a motor (115), the output end of the motor (115) is fixedly connected with a transmission disc (116), and the outer wall of the transmission disc (116) is covered with a crawler (117).

3. A semiconductor chip flushing device according to claim 2, characterized in that: The cleaning turntable (21) comprises a circular rotating sleeve (211), the inner wall of the circular rotating sleeve (211) is fixedly connected to a connecting side plate (212) in an annular array, the inner sides of the plurality of connecting side plates (212) are fixedly connected to a center disk (213), the bottom of the center disk (213) is fixedly connected to a center disk rotating tube (214), the middle portions of the center disk rotating tube (214) and the center disk (213) are both hollowed out, the outer wall of the circular rotating sleeve (211) is rotatably connected to the bottom of the inner wall of the conical cover (18), the outer wall of the center disk rotating tube (214) is fixedly connected to a second transmission disk (215), the outer wall of the second transmission disk (215) is sleeved on a side of the inner wall of the crawler (117) away from the transmission disk (116), and the top of the circular rotating sleeve (211) is fixedly connected to a control member (216).

4. The semiconductor chip flushing device according to claim 3, characterized in that: The control member (216) comprises a control member body (2161), and a rack rack (2164) is provided on the top rear side of the control member body (2161).

5. The semiconductor chip flushing device according to claim 4, characterized in that: The control component body (2161) includes two side outer rings (21611), the outer sides of the two side outer rings (21611) are fixedly connected with an inner gear disk (21612), the tops of the outer walls of the two side outer rings (21611) are fixedly connected with an inverted L-shaped connecting block (21613), the inner walls of the middle parts of the tops of the two inverted L-shaped connecting blocks (21613) are slidably connected with a columnar lifting rod (21614), the tops of the two columnar lifting rods (21614) are fixedly connected with a lifting side block (21634), the four sides of the inner sides of the two side outer rings (21611) are fixedly connected with a transverse connecting rod (21615), the middle parts of the two transverse connecting rods (21615) at the top and bottom are both hollowed out, and the left and right sides of the inner sides of the transverse connecting rods (21615) at the front and rear sides are fixedly connected An L-shaped support vertical rod (21616) is connected, the inner walls of the two side outer rings (21611) are rotatably connected to the rotating side disk (21617), the tops of the outer sides of the two rotating side disks (21617) are rotatably connected to the gears (21618), the outer sides of the two gears (21618) are rotatably connected to the hinge blocks (21619), one side of the two hinge blocks (21619) is rotatably connected to the bottom ends of the two columnar lifting vertical rods (21614), the outer walls of the two gears (21618) are meshed with the inner walls of the two inner gear disks (21612), the middle parts of the outer sides of the two rotating side disks (21617) are fixedly connected to the columnar transmission cross bars (21620), and the outer ends of the two columnar transmission cross bars (21620) are fixedly connected to the third transmission disk (21621).

6. The semiconductor chip flushing device according to claim 5, characterized in that: A transverse C-shaped connecting plate (21622) is fixedly connected to the top of the inner rear side of the two side outer rings (21611), a second motor (21623) is fixedly connected to the middle of the top of the transverse C-shaped connecting plate (21622), an output end of the second motor (21623) is fixedly connected to a fourth transmission disc (21624), an outer wall of the fourth transmission disc (21624) is covered with a second crawler (21625), a side of the second crawler (21625) away from the fourth transmission disc (21624) is covered with a fifth transmission disc (21626), the top of the rear side of the two inverted L-shaped connecting blocks (21613) are fixedly connected to a rear guide rod (21631), the rear sides of the two rear guide rods (21631) are fixedly connected to a hydraulic push rod connecting cross bar (21632), and the middle of the top of the hydraulic push rod connecting cross bar (21632) is fixedly connected to A hydraulic push rod (21633) is provided. The rear sides of the inner bottoms of the two side outer rings (21611) are fixedly connected with columnar transverse rotating rod connecting blocks (21627). The middle parts of the inner walls of the two columnar transverse rotating rod connecting blocks (21627) are rotatably connected with columnar transverse rotating rods (21628). The middle parts of the outer walls of the columnar transverse rotating rods (21628) are fixedly connected to the inner wall of the fifth transmission disc (21626). The left and right ends of the columnar transverse rotating rods (21628) extend to the outsides of the two columnar transverse rotating rod connecting blocks (21627) and are fixedly connected with the sixth transmission disc (21629). The outer walls of the two sixth transmission discs (21629) are both covered with third crawlers (21630). The inner walls of the two third crawlers (21630) away from the sixth transmission disc (21629) are both covered with the outer walls of the two third transmission discs (21621).

7. The semiconductor chip flushing device according to claim 6, characterized in that: The top end of the bottom nozzle (111) extends to the top of the top transverse connecting rod (21615) through the center disk rotating tube (214), the middle of the center disk (213), and the middle of the two transverse connecting rods (21615).

8. The semiconductor chip flushing device according to claim 7, characterized in that: The rack frame (2164) includes two vertical rack rods (21641), the bottoms of the two vertical rack rods (21641) are slidably connected to the tops of the two rear guide rods (21631), the rear bottoms of the two vertical rack rods (21641) are fixedly connected to the connecting side blocks (21645), the inner sides of the two connecting side blocks (21645) are fixedly connected to the U-shaped connecting frame (21642), the middle part of the rear bottom of the U-shaped connecting frame (21642) is fixedly connected to the front end of the hydraulic push rod (21633), the left and right sides of the top and bottom of the inner side of the U-shaped connecting frame (21642) are fixedly connected to the baffle connecting rods (21643), and the inner sides of the two groups of baffle connecting rods (21643) at the top and bottom are fixedly connected to the baffles (21644).

9. The semiconductor chip flushing device according to claim 8, characterized in that: The middle of the left and right sides of the inner side of the fixed frame (221) are fixedly connected to the pneumatic push rod control component connection blocks (223), the inner sides of the two pneumatic push rod control component connection blocks (223) are fixedly connected to the pneumatic push rod control component (224), the front and rear sides of the outer wall of the pneumatic push rod control component (224) are fixedly connected to the ventilation pipe (225), the middle of the front and rear sides of the fixed frame (221) are fixedly connected to the bidirectional pneumatic push rod (222), and the ends of the two ventilation pipes (225) away from the pneumatic push rod control component (224) are fixedly connected to the outer walls of the two bidirectional pneumatic push rods (222).

10. The cleaning method of a semiconductor chip washing device according to claim 9, characterized in that: The following steps are involved: Step 1: Two wafers are respectively fixed on the inner sides of the top multiple Z-shaped rotating clamps (2211) and the bottom multiple Z-shaped rotating clamps (2211), and the two bidirectional pneumatic push rods (222) are started to push the lifting push plate (2213) up or down, and then the wafers are firmly clamped by the columnar push-pull blocks (2212) and the Z-shaped rotating clamps (2211). At this time, the device enters the preparatory cleaning stage; Step 2: Start the motor (115), drive the transmission disc (116) to rotate the cleaning rack (2) through the crawler (117), and the wafer rotates synchronously therewith. At the same time, the cleaning water in the cleaning water tank (14) flows into the nozzle (16) through the water pipe (15), and evenly sprays and rinses the rotating wafer. During the rinsing process, excess cleaning water and impurities fall into the recycling box feeding funnel (113). After fine filtration by the filter (114), the impurities are intercepted, and the cleaning water smoothly flows into the cleaning water recovery tank (11), thereby realizing the recycling of the cleaning water. Step 3: After the top wafer has been initially rinsed, the motor (115) stops running. At this time, the hydraulic push rod (21633) is started to push the U-shaped connecting frame (21642) forward and backward, thereby driving the vertical rack rod (21641) to slide smoothly on the rear guide rod (21631) through the connecting side block (21645). At the same time, the vertical rack rod (21641) is engaged with the second gear (227) to ensure that the wafer fixing assembly (22) can be turned smoothly; Step 4: During the flipping process of the wafer fixing assembly (22), the baffle (21644) promptly blocks the nozzle (16) and the bottom nozzle (111) to prevent the cleaning water from splashing out. Subsequently, the second motor (21623) is started to drive the rotating side disk (21617) to rotate through a series of transmission devices, thereby driving the gear (21618) and the inner gear disk (21612) to engage and rotate. During this process, the columnar lifting rod (21614) slides up and down in the inverted L-shaped connecting block (21613) to ensure that the wafer fixing assembly (22) can be flipped 180 degrees smoothly and accurately. Step 5: After the wafer fixing assembly (22) is flipped over, the wafer originally fixed at the bottom faces the top, while the wafer originally at the top faces the bottom. At this time, the bottom nozzle valve (110) closes the bottom nozzle (111) to prevent the circulating water from causing secondary contamination to the already cleaned wafer. Subsequently, the top clean water nozzle (16) continues to rinse the flipped wafer. Step 6: After all wafers are completely rinsed, the entire device stops operating. At this time, through the reverse operation of the pneumatic push rod control component (224), the bidirectional pneumatic push rod (222) is shortened, the Z-shaped rotating clamp (2211) releases the wafer, and the staff removes the wafer for the next step of processing.

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