Stretchable circuit substrate
By configuring an organic layer between the island structure of the stretchable circuit substrate and combining it with a multilayer structure, the problem of easy breakage of the inorganic layer is solved, and a circuit substrate design with high stretchability and high reliability is achieved.
Patent Information
- Application Number
- CN202510775467.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-31
- Filing Date
- 2025-06-11
- Publication Date
- 2025-09-09
AI Technical Summary
The inorganic layer of existing stretchable circuit substrates is easily broken during the stretching process, causing the circuit substrate to be disconnected and affecting reliability.
An organic layer is configured on the circuit area between the island structures of the stretchable circuit substrate, and the island structures are connected through the organic layer to improve the connection strength between the island structures. A combined structure of multiple organic layers and conductive layers is adopted to enhance the stretchability and reliability of the circuit substrate.
The maximum stretchability of the circuit substrate is significantly improved, the risk of fracture at the junction of the active area and the circuit area is reduced, and the reliability of the circuit substrate is improved.
Smart Images
Figure CN120614745A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a stretchable structure, and in particular to a stretchable circuit substrate. Background Art
[0002] In recent years, stretchable, lightweight, and flexible electronic products have gained increasing attention. The stretchable circuit substrates within these electronic products typically incorporate inorganic layers in the active and circuit areas. However, these inorganic layers are susceptible to fracture due to stretching, leading to circuit breakage in the circuit substrate. Therefore, improving the reliability of stretchable circuit substrates has become a pressing issue. Summary of the Invention
[0003] The present invention provides a stretchable circuit substrate with a high maximum stretchability and good reliability.
[0004] According to one embodiment of the present invention, a stretchable circuit substrate is provided, comprising a plurality of active regions and a plurality of circuit regions, wherein the circuit regions are respectively located between the active regions. The stretchable circuit substrate comprises a plurality of island structures, a first organic layer, and a first conductive layer. The island structures are respectively arranged on the active regions, wherein the island structures include a first island structure and a second island structure, and each island structure includes a driving structure. The first organic layer is at least arranged on the circuit region between the first island structure and the second island structure, and connects the first island structure and the second island structure. The first conductive layer is arranged on the first organic layer, and electrically connects the driving structure of the first island structure and the driving structure of the second island structure.
[0005] Based on the above, the stretchable circuit substrate provided by the embodiment of the present invention is configured with an organic layer on the circuit area between different island structures, and the corresponding island structures are connected with the organic layer, which effectively improves the maximum stretchability of the stretchable circuit substrate and is not prone to breakage at the junction between its active area and the circuit area.
[0006] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 A schematic plan view of a stretchable circuit substrate according to some embodiments of the present invention is shown.
[0008] Figure 2 According to one embodiment of the present invention, Figure 1 A schematic cross-sectional view of the curve AA' is shown.
[0009] Figure 3 According to one embodiment of the present invention, Figure 1 A schematic cross-sectional view of the curve AA' is shown.
[0010] Figures 4A to 4C According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 4D Shown along Figures 4A to 4C Schematic cross-sectional view of each line segment BB' shown.
[0011] 5A to 5D According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 5E Shown along 5A to 5D Schematic cross-sectional view of each line segment BB' shown.
[0012] Description of reference numerals:
[0013] 1: Stretchable circuit substrate
[0014] 100: Stretchable substrate
[0015] AL: Conductive layer
[0016] CR: Line area
[0017] CS: Line Structure
[0018] CW1, CW2, CW3: Contact window
[0019] DS1, DS2: drive structure
[0020] GL: Gate
[0021] IL1, IL2, IL3, IL4, IL5, IL6, IL7: Inorganic layer
[0022] IL1T: Top
[0023] IS1: first island structure
[0024] IS2: Second island structure
[0025] ML1: First conductive layer
[0026] ML2: Second conductive layer
[0027] PL1: first organic layer
[0028] PL2: Second organic layer
[0029] PL3: third organic layer
[0030] PX: Active Zone
[0031] SL: Semiconductor layer DETAILED DESCRIPTION
[0032] Reference Figure 1 , which shows a planar schematic diagram of a stretchable circuit substrate according to some embodiments of the present invention.
[0033] The stretchable circuit substrate 1 has multiple active areas PX and multiple circuit areas CR, wherein the circuit areas CR are respectively located between the active areas PX. The stretchable circuit substrate 1 includes multiple island structures and multiple circuit structures CS, wherein an island structure is disposed on each active area PX, and a circuit structure CS is disposed on each circuit area CR. The island structures include a first island structure IS1 and a second island structure IS2.
[0034] Reference Figure 2 , which shows an embodiment of the present invention along Figure 1 A schematic cross-sectional view of the curve AA' is shown.
[0035] In the first embodiment, a circuit structure CS is disposed on the circuit region CR between the first island structure IS1 and the second island structure IS2, wherein the circuit structure CS includes a first organic layer PL1 and a first conductive layer ML1 on the first organic layer PL1. The material of the first organic layer PL1 may include polyimide (PSPI), phenol-formaldehyde resin, epoxy resin, polyisoprene rubber, or the like. The material of the first conductive layer ML1 may include copper, titanium, aluminum, or other conductive materials with good ductility. Figure 2 As shown, the first organic layer PL1 on the circuit region CR connects the first island structure IS1 and the second island structure IS2. The first island structure IS1 includes a driving structure DS1, and the second island structure IS2 includes a driving structure DS2. Both driving structures DS1 and DS2 include thin-film transistors. The first conductive layer ML1 electrically connects the driving structure DS1 of the first island structure IS1 and the driving structure DS2 of the second island structure IS2.
[0036] It should be noted that in a stretchable circuit substrate provided according to a comparative example, an inorganic layer is disposed on the circuit region CR between the first island structure IS1 and the second island structure IS2, connecting the first and second island structures IS1 and IS2. However, the stretchable circuit substrate provided in this comparative example has a maximum stretchability ratio of approximately 6% and is susceptible to fracture within the circuit region CR and at the interface between the active area PX and the circuit region CR. In contrast, in a stretchable circuit substrate 1 provided according to an embodiment of the present invention, a first organic layer PL1 is disposed on the circuit region CR between the first island structure IS1 and the second island structure IS2. The maximum stretchability of this stretchable circuit substrate 1 is approximately 27.3%, which is approximately 4.55 times higher than that of the comparative example. The stretchable circuit substrate 1 is not susceptible to fracture at the interface between the active area PX and the circuit region CR, and the first organic layer PL1 within the circuit region CR is also not susceptible to fracture, demonstrating excellent reliability.
[0037] On the other hand, Figure 2 As shown, the first and second island structures IS1 and IS2 further include stacked inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, with the first organic layer PL1 further disposed on the top surface IL1T of the inorganic layer IL1. This further utilizes the adhesion between the first organic layer PL1 and the inorganic layer IL1 to enhance the structural strength of the stretchable circuit substrate 1 and prevent fracture at the interface between the active region PX and the circuit region CR.
[0038] Also refer to Figure 2 In this embodiment, the first island structure IS1 and the second island structure IS2 further include a contact window CW1 penetrating the inorganic layers IL1, IL2, and IL3, wherein the first conductive layer ML1 is electrically connected to the driving structure DS1 of the first island structure IS1 through the contact window CW1 of the first island structure IS1, and is electrically connected to the driving structure DS2 of the second island structure IS2 through the contact window CW1 of the second island structure IS2.
[0039] In order to fully illustrate the various embodiments of the present invention, other embodiments of the present invention will be described below. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same reference numerals are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.
[0040] Reference Figure 3 , which shows an embodiment of the present invention along Figure 1 A schematic cross-sectional view of the curve AA' is shown.
[0041] The stretchable circuit substrate 1 of this embodiment is Figure 2 The difference between the stretchable circuit substrate 1 and the circuit structure CS is that the circuit structure CS includes a first organic layer PL1, a second organic layer PL2, a third organic layer PL3, a first conductive layer ML1, and a second conductive layer ML2. The first organic layer PL1, the second organic layer PL2, and the third organic layer PL3 may be made of the same or similar materials. The first conductive layer ML1 and the second conductive layer ML2 may be made of the same or similar materials, with the second conductive layer ML2 disposed on the first organic layer PL1 and the second organic layer PL2.
[0042] The second organic layer PL2 is further disposed on the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 of the first and second island structures IS1 and IS2. The first and second island structures IS1 and IS2 also include contact windows CW3 extending through the second organic layer PL2. The second conductive layer ML2 is electrically connected to the driving structure DS1 of the first island structure IS1 through the contact windows CW3 of the first island structure IS1, and is electrically connected to the driving structure DS2 of the second island structure IS2 through the contact windows CW3 of the second island structure IS2.
[0043] In some embodiments, the first conductive layer ML1 can be used to transmit data signals, and the second conductive layer ML2 can be connected to a gate driver circuit, wherein the gate driver circuit can be a gate driver on array (GOA). In some embodiments, the gate driver circuit can be a gate driver on array on a single side of the stretchable circuit substrate 1, or a gate driver on array on multiple sides of the stretchable circuit substrate 1. In some embodiments, the stretchable circuit substrate 1 can be configured in a spliced display. It should be noted that the stretchable circuit substrate 1 of the present invention is not limited to Figure 3 The structure shown. Either the first conductive layer ML1 or the second conductive layer ML2 can be electrically connected to any component of the driving structure of the island structure according to design requirements. For example, in some embodiments, when the first conductive layer ML1 is used to transmit scan signals and is electrically connected to the gate driving circuit, the first conductive layer ML1 can be electrically connected to the gate GL via a through hole. In other embodiments, the second conductive layer ML2 can be electrically connected to the conductive layer AL of the driving structure via a through hole. In addition, in some embodiments, one or more other conductive layers can be configured between the first conductive layer ML1 and the second conductive layer ML2 in the circuit region CR.
[0044] The stretchable circuit substrate 1 of this embodiment is Figure 2The stretchable circuit substrate 1 also differs in that the first island structure IS1 and the second island structure IS2 further include contact windows CW2 that penetrate the inorganic layers IL1 and IL2, with the inorganic layer IL3 exposed by the contact windows CW2. The first organic layer PL1 fills the contact windows CW2 of the first and second island structures IS1 and IS2 and directly contacts the inorganic layers IL1, IL2, and IL3 within the contact windows CW2. The adhesion between the first organic layer PL1 and the inorganic layers IL1, IL2, and IL3 within the contact windows CW2 is further utilized to increase the structural strength of the stretchable circuit substrate 1 and prevent the stretchable circuit substrate 1 from breaking at the interface between the active region PX and the circuit region CR.
[0045] In the multiple embodiments to be described later, the first island structure IS1 will be taken as an example to illustrate the structures of the island structures in the stretchable circuit substrate 1 .
[0046] Please also refer to Figure 1 、 Figure 3 、 Figure 4A as well as Figure 4D ,in Figure 4A According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 4D Shown along Figure 4A Schematic cross-sectional view of each line segment BB' shown.
[0047] In this embodiment, the first organic layer PL1 is further disposed on the top surface IL1T of the inorganic layer IL1. The first organic layer PL1 on the top surface IL1T extends in both the X and Y directions and is integrally formed with the first organic layer PL1 on the corresponding circuit region CR. This increases the contact area between the first organic layer PL1 and the inorganic layer IL1, further leveraging the adhesion between the first organic layer PL1 and the inorganic layer IL1 to enhance the structural strength of the stretchable circuit substrate 1 and prevent fracture of the stretchable circuit substrate 1 at the interface between the active region PX and the circuit region CR.
[0048] Please also refer to Figure 1 、 Figure 3 、 Figure 4B as well as Figure 4D ,in Figure 4B According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 4D Shown along Figure 4B Schematic cross-sectional view of each line segment BB' shown.
[0049] In this embodiment, the first organic layer PL1 is further disposed on the top surface IL1T of the inorganic layer IL1. The first organic layer PL1 on the top surface IL1T extends along the X-direction and is integrally formed with the first organic layer PL1 on the corresponding two circuit regions CR. The two circuit regions CR are located between the first island structure IS1 and two different island structures, respectively. This further utilizes the adhesion between the first organic layer PL1 and the inorganic layer IL1 to enhance the structural strength of the stretchable circuit substrate 1 and prevent fracture at the interface between the active region PX and the circuit regions CR.
[0050] Please also refer to Figure 1 、 Figure 3 、 Figure 4C as well as Figure 4D ,in Figure 4C According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 4D Shown along Figure 4C Schematic cross-sectional view of each line segment BB' shown.
[0051] In this embodiment, the first organic layer PL1 is further disposed on the top surface IL1T of the inorganic layer IL1. The first organic layer PL1 on the top surface IL1T extends along the X and Y directions to form a closed ring structure. The first organic layer PL1 on the top surface IL1T is integrally formed with the first organic layer PL1 on the corresponding four circuit regions CR, each located between the first island structure IS1 and a different one of the four island structures. The closed ring structure on the top surface IL1T and the first organic layer PL1 on the four circuit regions CR thus collaborate to increase the structural strength of the stretchable circuit substrate 1 and prevent fracture at the interface between the active area PX and the circuit regions CR.
[0052] Please also refer to Figure 1 、 Figure 3 、 Figure 5A as well as Figure 5E ,in Figure 5A According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 5E Shown along Figure 5A Schematic cross-sectional view of each line segment BB' shown.
[0053] In this embodiment, the first organic layer PL1 is also disposed on the top surface IL1T of the inorganic layer IL1 and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, and extends along the X and Y directions. The first organic layer PL1 on the top surface IL1T and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 is integrally formed with the first organic layer PL1 on the corresponding circuit region CR. Figure 5A as well as Figure 5E As shown, the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 include multiple side surfaces facing the +X, -X, +Y, and -Y directions, respectively. This increases the contact area between the first organic layer PL1 and the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, further utilizing the adhesion between the first organic layer PL1 and the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 to increase the structural strength of the stretchable circuit substrate 1 and prevent fracture of the stretchable circuit substrate 1 at the interface between the active region PX and the circuit region CR.
[0054] Please also refer to Figure 1 、 Figure 3 、 Figure 5B as well as Figure 5E ,in Figure 5B According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 5E Shown along Figure 5B Schematic cross-sectional view of each line segment BB' shown.
[0055] In this embodiment, the first organic layer PL1 is further disposed on the top surface IL1T of the inorganic layer IL1 and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, and extends along the X direction. The first organic layer PL1 on the top surface IL1T and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 is integrally formed with the first organic layer PL1 on the corresponding two circuit regions CR, wherein the two circuit regions CR are respectively located between the first island structure IS1 and two different island structures. Figure 5B as well as Figure 5EAs shown, the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 include multiple side surfaces facing the +Y direction and the -Y direction, respectively. The adhesion between the first organic layer PL1 and the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 is further utilized to increase the structural strength of the stretchable circuit substrate 1 and prevent fracture of the stretchable circuit substrate 1 at the interface between the active region PX and the circuit region CR.
[0056] Please also refer to Figure 1 、 Figure 3 、 Figure 5C as well as Figure 5E ,in Figure 5C According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 5E Shown along Figure 5C Schematic cross-sectional view of each line segment BB' shown.
[0057] In this embodiment, the first organic layer PL1 is further disposed on the top surface IL1T of the inorganic layer IL1 and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, and extends along the X and Y directions. The first organic layer PL1 on the top surface IL1T and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 is integrally formed with the first organic layer PL1 on the corresponding four circuit regions CR, wherein the above-mentioned four circuit regions CR are respectively located between the first island structure IS1 and the four different island structures. Figure 5C as well as Figure 5E As shown, the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 include multiple side surfaces facing the +Y direction, the +X direction, and the -X direction, respectively. Consequently, the adhesion between the first organic layer PL1 and the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, as well as the cooperation of the first organic layer PL1 on the four circuit regions CR, are further utilized to increase the structural strength of the stretchable circuit substrate 1 and prevent fracture of the stretchable circuit substrate 1 at the interface between the active region PX and the circuit region CR.
[0058] Please also refer to Figure 1 、 Figure 3 、 Figure 5D as well as Figure 5E ,in Figure 5D According to one embodiment of the present invention, Figure 1 as well as Figure 3 A schematic plan view of the first island structure in FIG. Figure 5E Shown along Figure 5D Schematic cross-sectional view of each line segment BB' shown.
[0059] In this embodiment, the first organic layer PL1 is also disposed on the top surface IL1T of the inorganic layer IL1 and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7, and extends along the X and Y directions. The first organic layer PL1 on the top surface IL1T and on the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 forms a closed ring structure and is integrally formed with the first organic layer PL1 on the corresponding four circuit regions CR, wherein the above-mentioned four circuit regions CR are respectively located between the first island structure IS1 and the four different island structures, wherein the closed ring structure is a three-dimensional structure. Figure 5D as well as Figure 5E As shown, the side surfaces of the inorganic layers IL1, IL2, IL3, IL4, IL5, IL6, and IL7 include multiple side surfaces facing the +X, -X, +Y, and -Y directions, respectively. This three-dimensional closed ring structure and the collaboration of the first organic layer PL1 on the four circuit regions CR further enhance the structural strength of the stretchable circuit substrate 1, preventing breakage at the interface between the active region PX and the circuit region CR.
[0060] In summary, the stretchable circuit substrate provided by the embodiments of the present invention incorporates an organic layer in the circuit regions between different island structures, connecting the corresponding island structures with this organic layer. This effectively increases the maximum stretchability of the stretchable circuit substrate and reduces the risk of fracture at the interface between the active and circuit regions. The organic layer can also be incorporated within the island structures, enhancing the overall structural strength and further improving the reliability of the stretchable circuit substrate.
Claims
1. A stretchable circuit substrate having a plurality of active areas and a plurality of circuit areas, wherein the plurality of circuit areas are respectively located between the plurality of active areas, the stretchable circuit substrate comprising: A plurality of island structures are respectively disposed on the plurality of active regions, wherein the plurality of island structures include a first island structure and a second island structure, and each of the island structures includes a driving structure; a first organic layer, at least disposed on the circuit region between the first island structure and the second island structure, and connecting the first island structure and the second island structure; as well as A first conductive layer is disposed on the first organic layer and electrically connected to the driving structure of the first island structure and the driving structure of the second island structure.
2. A stretchable circuit substrate as described in claim 1, wherein the first island-shaped structure further includes at least one inorganic layer and a first contact window, wherein the first contact window penetrates the at least one inorganic layer, and the first conductive layer is connected to the driving structure of the first island-shaped structure through the first contact window. 3 . The stretchable circuit substrate as claimed in claim 2 , wherein the first island structure further comprises a second contact window, wherein the second contact window penetrates the at least one inorganic layer, and the first organic layer fills the second contact window. 4 . The stretchable circuit substrate as claimed in claim 1 , wherein the first island structure further comprises at least one inorganic layer, and the first organic layer is further disposed on a top surface of the at least one inorganic layer. 5 . The stretchable circuit substrate according to claim 4 , wherein the first organic layer forms a closed ring structure on the top surface of the at least one inorganic layer. 6 . The stretchable circuit substrate according to claim 4 , wherein the first organic layer is further disposed on at least one side of the at least one inorganic layer. 7 . The stretchable circuit substrate as claimed in claim 6 , wherein the at least one side surface comprises a plurality of side surfaces, and the first organic layer forms a closed ring structure on the plurality of side surfaces of the at least one inorganic layer. 8 . The stretchable circuit substrate according to claim 6 , wherein the at least one side surface comprises a plurality of side surfaces, and the first organic layer comprises a three-dimensional closed ring structure. 9 . The stretchable circuit substrate according to claim 4 , wherein the first organic layer is further disposed on the circuit region between the first island structure and a third island structure, and the first organic layer is integrally formed. 10 . The stretchable circuit substrate according to claim 1 , further comprising a second conductive layer disposed on the first organic layer and electrically connected to the driving structure of the first island structure and the driving structure of the second island structure. 11 . The stretchable circuit substrate according to claim 10 , wherein the second conductive layer is connected to an array gate driving circuit.