Circuit and image forming apparatus

Abstract

The circuit includes: an electronic component; a circuit board having a first surface on which the electronic component is arranged; and a cover device disposed on the first surface and configured to form an accommodation space for accommodating the electronic component, the cover device including a first portion and a second portion, where the first portion of the cover device is in contact with the first surface of the circuit board, where an opening is formed between the second portion of the cover device and the first surface of the circuit board, wherein a path of the air flow is formed, the path communicating from the outside of the cover device to the electronic component in the accommodation space through the opening, and wherein the cover device comprises a shielding device arranged between the opening and the electronic component in the accommodation space. The invention also relates to an image forming apparatus.

Description

Technical Field

[0001] The present disclosure relates to a circuit including a circuit board on which electronic components are mounted, and to an imaging device including such a circuit. Background Art

[0002] Imaging devices include power boards, high-voltage boards, control boards, and other components mounted on these boards to control electrical components such as various motors, sensors, and switches. Imaging devices also include protective circuit boards with protective circuits formed thereon to electrically protect the electronic components mounted on these boards from overvoltage and overcurrent. These circuit boards are primarily located in the back space of the main body of the imaging device.

[0003] Each circuit board is removed or replaced in the event of a malfunction or repair. Furthermore, to reduce the size of imaging devices, the circuit boards need to be arranged in a space-saving manner. Therefore, when assembling the imaging device or replacing components, operators must be careful not to damage the electronic components mounted on the circuit boards. Japanese Patent Application Laid-Open No. 2018-110154 proposes a circuit in which the electronic components are covered by a cover, and the circuit boards themselves are also covered by a box-shaped member.

[0004] When the circuit board itself is covered by a box-shaped component, component costs increase, and the space required to mount the circuit board in the imaging device also increases. Furthermore, when the electronic components are covered by a cover, they heat up during operation and are not cooled by the surrounding air. This situation can lead to electronic component failure and shortened component lifespan. Summary of the Invention

[0005] According to some embodiments, a circuit according to an embodiment of the present disclosure includes: an electronic component; a circuit board having a first surface on which the electronic component is arranged; and a cover device, the cover device being arranged on the first surface and being configured to form a accommodating space in which the electronic component is accommodated, the cover device including a first part and a second part, wherein the first part of the cover device is in contact with the first surface of the circuit board, wherein an opening is formed between the second part of the cover device and the first surface of the circuit board, wherein a path for air flow is formed, the path being connected from the outside of the cover device to the electronic component in the accommodating space through the opening, and wherein the cover device includes a shielding device arranged between the opening and the electronic component in the accommodating space.

[0006] According to another embodiment of the present disclosure, an imaging device includes: a module configured to perform operations related to imaging; and a circuit configured to be used in the operation of the module, wherein the circuit includes: electronic components; a circuit board having a first surface on which the electronic components are arranged; and a cover device, which is arranged on the first surface and is configured to form a housing space in which the electronic components are accommodated, the cover device including a first part and a second part, wherein the first part of the cover device contacts the first surface of the circuit board, wherein an opening is formed between the second part of the cover device and the first surface of the circuit board, wherein a path for air flow is formed, the path connecting from the outside of the cover device to the electronic components in the housing space through the opening, and wherein the cover device includes a shielding device arranged between the opening and the electronic components in the housing space.

[0007] Further features of the present disclosure will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a diagram for illustrating the configuration of an inkjet recording apparatus.

[0009] Figure 2 It is an explanatory diagram for illustrating the arrangement of a circuit.

[0010] Figure 3 It is an explanatory diagram for illustrating the configuration of a protection circuit board.

[0011] Figure 4 It is an explanatory diagram for showing the configuration of the protection circuit board in a state where the element cover is mounted.

[0012] Figure 5 It is an explanatory diagram for showing the configuration of the protection circuit board in a state where the element cover is mounted.

[0013] Figure 6A and Figure 6B It is an explanatory diagram for illustrating the configuration of the element cover.

[0014] Figure 7 It is an explanatory diagram for illustrating a state in which a protection circuit board is mounted to a cooling module.

[0015] Figure 8 It is an explanatory diagram for illustrating another example of a method of fixing the element cover.

[0016] Figure 9A and Figure 9B It is an explanatory diagram for illustrating another example of a method of fixing the element cover. DETAILED DESCRIPTION

[0017] Various exemplary embodiments, features, and aspects of the present disclosure will now be described with reference to the accompanying drawings. In view of these issues, the present disclosure advantageously provides a circuit that can protect electronic components mounted on a circuit board from damage while maintaining a long lifespan of the electronic components.

[0018] Figure 1 1 is a diagram showing the configuration of an inkjet recording apparatus as an image forming apparatus according to this embodiment. The inkjet recording apparatus 100 according to this embodiment is a sheet-feed image forming apparatus that forms an ink image on a sheet using two liquids (specifically, a reaction liquid and ink) to produce a printed product.

[0019] The inkjet recording apparatus 100 includes a sheet feeding module 1000, a printing module 2000, a drying module 3000, a fixing module 4000, a cooling module 5000, a reversing module 6000, and a sheet discharge and stacking module 7000. A cut paper-like sheet on which an image is to be printed is fed from the sheet feeding module 1000, undergoes predetermined processing related to image formation by each module, and is discharged to the sheet discharge and stacking module 7000.

[0020] The sheet feeding module 1000 includes a plurality of sheet storages 1100a to 1100c (three sheet storages in this embodiment). Each of the sheet storages 1100a to 1100c can store sheets therein. Each of the sheet storages 1100a to 1100c is configured to be pulled toward the front of the device. After the sheet storage is pulled toward the front of the device, the sheets are stored in each sheet storage. The sheet feeding module 1000 feeds the sheets one by one to the printing module 2000. Therefore, each sheet storage 1100a to 1100c includes a separator belt and conveyor rollers. The number of sheet storages 1100a to 1100c is an example and may be one, two, or four or more.

[0021] The printing module 2000 forms an image on a sheet fed from the sheet feeding module 1000. The printing module 2000 includes a pre-imaging alignment correction unit (not shown), a printing belt unit 2200, and a recording unit 2300. The pre-imaging alignment correction unit corrects the tilt and position of the sheet fed from the sheet feeding module 1000 and conveys the sheet to the printing belt unit 2200.

[0022] The printing belt unit 2200 and the recording unit 2300 are arranged downstream of the pre-imaging alignment correction unit in the sheet conveyance direction, facing each other across the sheet conveyance path. The printing belt unit 2200 conveys the sheet conveyed from the pre-imaging alignment correction unit by suction. The recording unit 2300 is a sheet processing unit that performs recording (printing) from above using a recording head to form an image on the sheet conveyed by the printing belt unit 2200. The recording head prints by ejecting ink onto the sheet. Since the printing belt unit 2200 conveys the sheet by suction, the gap between the recording head and the sheet remains constant.

[0023] Multiple recording heads are arranged along the sheet conveyance direction. In this embodiment, the recording heads are five line-type recording heads corresponding to the four colors Y (yellow), M (magenta), C (cyan), and K (black), as well as the reaction liquid. The number of colors and recording heads is not limited to five. As an inkjet system, a system using a heat generating element, a piezoelectric element, an electrostatic element, or a MEMS element can be employed. Each color of ink is supplied to the recording head from an ink tank (not shown) via an ink tube.

[0024] The sheet printed in the recording unit 2300 is conveyed by the printing belt unit 2200. An inline scanner (not shown) is arranged on the downstream side of the recording unit 2300 in the conveying direction. The inline scanner is used to detect displacement and color density of an image formed on a sheet and to correct the image to be printed.

[0025] The drying module 3000 dries the sheet on which the image has been formed by the printing module 2000. The drying module 3000 dries the sheet to reduce the liquid content in the ink, thereby improving the fixing property between the sheet and the ink. The drying module 3000 includes a separation unit 3200, a drying belt unit 3300, and a hot air blowing unit 3400.

[0026] The sheet printed in the recording unit 2300 of the printing module 2000 is conveyed to the separation unit 3200 in the drying module 3000. The separation unit 3200 gently holds and conveys the sheet using air pressure from above and belt friction. This prevents the portion of the sheet remaining on the printing belt unit 2200 from shifting while the sheet extends across the separation unit 3200 and the printing belt unit 2200.

[0027] The sheet conveyed from the separation unit 3200 is conveyed to the drying belt unit 3300 by suction. At the same time, hot air is blown onto the sheet from the hot air blowing unit 3400 arranged above the belt to dry the ink application surface (image printing surface). In addition to the hot air blowing method, the drying method may also include a method of irradiating the sheet surface with electromagnetic waves (such as ultraviolet rays and infrared rays) and a combination of a conductive heat transfer method using a contact heating element.

[0028] The fixing module 4000 heats the sheet dried in the drying module 3000 and dries the ink, thereby fixing the image onto the sheet. The fixing module 4000 includes a fixing belt unit 4100, which includes an upper belt unit 4110 and a lower belt unit 4120. The fixing module 4000 passes the sheet conveyed from the drying module 3000 between the heated upper belt unit 4110 and the lower belt unit 4120, thereby allowing the ink solvent to completely penetrate (fix) the sheet.

[0029] The cooling module 5000 cools the sheet onto which the image has been fixed by the fixing module 4000, thereby solidifying the ink softened by heat and suppressing changes in the sheet temperature caused by downstream devices. The cooling module 5000 includes a plurality of cooling units 5001. The plurality of cooling units 5001 cools the high-temperature sheet conveyed from the fixing module 4000. Each cooling unit 5001 is configured to cool the sheet by drawing outside air into a cooling box using a fan to increase the pressure in the cooling box, and by exposing the sheet to air blown from nozzles formed in a conveying guide. The plurality of cooling units 5001 are arranged on both sides of the conveying path, thereby cooling the sheet from both sides.

[0030] A conveyance path switching unit is provided in the cooling module 5000. The conveyance path switching unit switches the conveyance path of the sheet according to whether the sheet is conveyed to the reversing module 6000 or conveyed to the duplex printing conveyance path for duplex printing.

[0031] During duplex printing, a sheet is conveyed to the lower conveying path in the cooling module 5000 and then transported through the duplex printing conveying path of the fusing module 4000, drying module 3000, printing module 2000, and sheet feeding module 1000. The duplex printing conveying unit of the fusing module 4000 is equipped with a first reversing unit 4200 that reverses the front and back sides of the sheet. Once the sheet is conveyed to the first reversing unit 4200, it is reversed and conveyed to the drying module 3000, with the printed surface with the image reversed. Since the sheet is conveyed through the first reversing unit 4200, printing can be performed on the back side of the sheet. The sheet is then conveyed again to the pre-imaging alignment correction unit, printing belt unit 2200, and recording unit 2300 of the printing module 2000, where printing is performed on the sheet.

[0032] The flip module 6000 includes a second flip unit 6400. The flip module 6000 flips the front and back sides of the sheet being conveyed by the second flip unit 6400. Thus, the orientation of the front and back sides of the discharged sheet can be changed. The sheet discharge and stacking module 7000 includes a top tray 7200 and a stacking unit 7500. The sheet discharge and stacking module 7000 aligns and stacks the sheets conveyed from the flip module 6000 onto the top tray 7200 or the stacking unit 7500.

[0033] PCB layout

[0034] Figure 2 1 is an explanatory diagram for illustrating the arrangement of circuits mounted on respective modules of the inkjet recording apparatus 100. Each circuit includes a circuit board on which electronic components are mounted. Figure 2 1 is a rear view showing the inkjet recording apparatus 100. The circuit is used for predetermined operations related to, for example, imaging of each module. Figure 2 , describes the arrangement of protective circuit boards 520, each of which has a protective circuit mounted thereon, serving as an example of a circuit board included in a circuit. Typically, imaging devices are provided with protective circuits for electrically protecting electronic components mounted on the circuit boards from input overvoltage. The protective circuits are provided near portions to which power is input from the outside.

[0035] In a system including multiple modules, such as the inkjet recording apparatus 100 according to this embodiment, a protective circuit board 520 is provided for each module. The protective circuit board 520 is mounted on the back side of the corresponding module. In the inkjet recording apparatus 100 according to this embodiment, a total of eight protective circuit boards 520 are arranged in six of the seven modules. The peripheral configuration of the protective circuit board 520 of each module is different and specific to each module.

[0036] Figure 3 It is an explanatory diagram for showing the structure of the protection circuit board 520. The protection circuit board 520 includes a varistor 521, which is a voltage-dependent resistor for electrically protecting other electronic components mounted on the protection circuit board 520 in the event of an input overvoltage. On the substrate surface 525, a connector 523 is provided opposite to the varistor 521, to which the input terminal from the outside is to be connected. At positions on the right and left sides of the varistor 521, cover mounting holes 522 for mounting the component cover to be described later are provided. A plurality of substrate mounting holes 524 are provided in the edge portion of the protection circuit board 520. Using the substrate mounting holes 524, the protection circuit board 520 is fixed to the mounting support plate, which is a metal plate component to be described later, by screws. The mounting support plate is mounted to a predetermined position of the module.

[0037] Figure 4 and Figure 5 1 is an explanatory diagram for illustrating the configuration of the protection circuit board 520 in a state where the element cover is mounted. Figure 4 5 is a view for showing a state where the element cover 530 is mounted, viewed from the mounting surface side (substrate surface 525 , component surface side) of the protection circuit board 520 , Figure 5 This is the view from the solder surface.

[0038] The element cover 530 is mounted to cover the varistor 521 on the protection circuit board 520. The element cover 530 includes a side wall 537 having a cutout portion 533, which allows the element cover 530 to contact the substrate surface 525. The element cover 530 includes an engaging portion 531 on one side and a flexible engaging portion 532 on the other side. The engaging portion 531 is inserted through the cover mounting hole 522 of the protection circuit board 520 to engage with the solder surface of the protection circuit board 520.

[0039] The solder surface is the surface opposite to the substrate surface 525. The flexible joint 532 includes a flexible support portion and claws disposed at the ends of the flexible support portion. During the process of securing the component cover 530 to the substrate surface 525, the flexible joint 532 deflects. For example, while the joint 531 is being inserted through the cover mounting hole 522, the flexible joint 532 is not inserted through the cover mounting hole 522. After the joint 531 engages the solder surface, the flexible joint 532 begins to be inserted into the mounting hole 522.

[0040] When the flexible joint portion 532 is inserted through the cover mounting hole 522, the flexible support portion of the flexible joint portion 532 deflects, allowing the claw at the end to pass through the mounting hole 522. After the claw at the end passes through the mounting hole 522, the deflection of the flexible joint portion 532 is released, and the claw engages the solder surface. Alternatively, the flexible joint portion 532 is first inserted through the mounting hole 522 and engages with the substrate surface 525 without the joint portion 531 being inserted into the mounting hole 522. Then, the flexible joint portion 532 deflects, allowing the joint portion 531 to pass through the mounting hole 522.

[0041] After releasing the deflection of the flexible joint portion 532 , the joint portion 531 engages with the solder surface. By engaging the joint portion 531 and the flexible joint portion 532 with the solder surface, the element cover 530 is fixed to the substrate surface 525 and integrated with the protection circuit board 520 .

[0042] With the element cover 530 installed, the varistor 521 protruding from the substrate surface 525 of the protection circuit board 520 is protected. That is, when an operator removes the protection circuit board 520 or works near the protection circuit board 520 to perform assembly work or maintenance work, the operator is prevented from accidentally touching the varistor 521. Therefore, the varistor 521 is protected from damage.

[0043] Figure 6A and Figure 6B 5 is an explanatory diagram for illustrating the configuration of the element cover 530 . Figure 6A is a perspective view showing the element cover 530, Figure 6B By observing from below Figure 6A The element cover 530 in this embodiment is made of a flame retardant resin and formed by, for example, injection molding.

[0044] As described above, the element cover 530 includes a side wall 537 at its outer peripheral edge. The side wall 537 contacts the substrate surface 525 of the protection circuit board 520, allowing the element cover 530 to house the varistor 521 therein. A cutout 533 is provided in a portion of the side wall 537. When the side wall 537 contacts the substrate surface 525, an opening (gap) is formed between the cutout 533 and the substrate surface 525. This opening creates a path (communication path 534) for airflow from the outside of the element cover 530 to the inside. Consequently, heat generated by the varistor 521 within the element cover 530 is dissipated to the outside of the element cover 530 through this opening.

[0045] Hereinafter, the opening will be described from another perspective. The side wall 537 in this embodiment includes a first portion and a second portion. The first portion of the side wall 537 is the portion in contact with the substrate surface 525. The second portion of the side wall 537 is the portion provided with the cutout portion 533. That is, the opening is formed between the second portion of the side wall 537 and the substrate surface 525. Further, the side wall 537 includes an edge portion 539. At least a portion of the edge portion 539 is in contact with the substrate surface 525. For convenience, the edge portion 539 includes a first edge portion corresponding to the first portion of the side wall 537 and a second edge portion corresponding to the second portion of the side wall 537. That is, the edge portion 539 of the side wall 537 includes a first edge portion that will be in contact with the substrate surface 525 and a second edge portion that will not be in contact with the substrate surface 525. In this case, the second edge portion is formed as the cutout portion 533 relative to the first edge portion.

[0046] A varistor accommodation space 538 for accommodating the varistor 521 is formed within the element cover 530. Shielding ribs 535 are provided as shielding members between the cutout 533 and the varistor 521 disposed in the varistor accommodation space 538. Similar to the sidewalls 537, the ends of the shielding ribs 535 contact the substrate surface 525. The shielding ribs 535 connect the varistor accommodation space 538 and the cutout 533 via two systems of left and right communication paths 534, which are curved in a crank shape. The shielding provided by the shielding ribs 535 prevents direct visibility of the varistor 521 disposed within the varistor accommodation space 538 from the cutout 533 (opening). In other words, the communication paths 534 are formed to bypass the shielding ribs 535. Conversely, the shielding ribs 535 do not block the path of airflow from the outside of the element cover 530 to the varistor accommodation space 538. As described above, the shielding rib 535 divides the varistor accommodation space 538 into a first space facing the opening and a second space in which the varistor 521 is arranged. Further, the shielding rib 535 branches the path communicating from the first space to the second space into two systems of branch paths.

[0047] Element cover 530 includes a top surface portion substantially parallel to the mounting surface (substrate surface 525 ). Each of the first and second portions of side wall 537 and shield rib 535 includes a plate portion extending continuously from the top surface portion and substantially perpendicular to the mounting surface.

[0048] As described above, the varistor accommodating space 538 and the cutout portion 533 communicate with each other, so air is less likely to be blocked in the varistor accommodating space 538, and it is possible to suppress a temperature increase in the varistor 521. The size of the cutout portion 533 and the size of the communication path 534 are determined according to the type of electronic components accommodated in the element cover 530.

[0049] The communication path 534 has a crank-shaped labyrinthine structure, making it difficult for foreign matter to enter the varistor accommodation space 538 through the cutout 533. Furthermore, even if foreign matter does enter the varistor accommodation space 538, the provision of two communication paths 534 reduces the likelihood of the path between the cutout 533 and the varistor accommodation space 538 being completely blocked. Furthermore, the connector 523 of the protection circuit board 520 is located on the outside of the element cover 530, opposite the cutout 533 (opening). The dimensions of the connector 523 are equal to or larger than the projected area of ​​the opening formed by the cutout 533 and the substrate surface 525. Therefore, the connector 523 acts as a shield, preventing foreign matter from entering the cutout 533. While this example illustrates the connector 523 as a shield, the shield may be another electronic component.

[0050] The communication path 534 and the cutout portion 533 can be formed in the draft direction of the mold used in injection molding. Therefore, the height of the cutout portion 533 can be finely adjusted. The shielding rib 535 can also be easily processed, thereby enhancing the flexibility of the shape of the communication path 534.

[0051] In this embodiment, a configuration has been described in which an opening is formed by the cutout portion 533 and the substrate surface 525. As a modified example, a configuration in which the sidewall 537 itself has an opening (hole) can be adopted instead of the cutout portion 533. In other words, an opening whose entire periphery is surrounded by the sidewall 537 can be provided. In this case, it can be considered that an opening and a third portion, which is another different portion of the sidewall 537, are arranged between the second portion of the sidewall 537 and the substrate surface 525. Furthermore, multiple openings can be provided. In any case, the element cover 530 only needs to have a configuration in which, when at least a portion of the sidewall 537 is in contact with the substrate surface 525, an opening is provided that allows the varistor accommodation space 538 to communicate with the external space, and the electronic components arranged in the varistor accommodation space 538 are not visible from the external space.

[0052] Figure 7 5000 is an explanatory diagram for illustrating a state in which the protection circuit board 520 is mounted to the cooling module 5000. As described above, the protection circuit board 520 is mounted on the rear surface side of the cooling module 5000. Figure 7 1. Shown is a state in which the rear side outer cover of the cooling module 5000 is removed to expose the protection circuit board 520. Even when the protection circuit board 520 is mounted to other modules, a similar configuration is adopted.

[0053] The protective circuit board 520 is mounted to the mounting support plate 550 with the element cover 530 attached. With the mounting support plate 550 secured to the frame member of the cooling module 5000, the protective circuit board 520 is mounted to the cooling module 5000. In the protective circuit board 520, the electronic components (varistor 521) are protected by the element cover 530, eliminating the need for a separate protective cover or the like to protect the entire protective circuit board 520. Consequently, the protective circuit board 520 can be mounted directly beneath the outer cover.

[0054] By utilizing such a configuration, the flexibility of the arrangement of the protective circuit board 520 is enhanced. Furthermore, the number of components used in the protective circuit board 520 is reduced, and this configuration is also effective in reducing costs. The circuit according to this embodiment is completed using the configuration of the protective circuit board 520 and the component cover 530 on the circuit board, and is therefore less affected by the surrounding configuration. In this way, even when multiple modules have different internal configurations, as in the inkjet recording device 100 according to this embodiment, the configuration of the circuit formed by the protective circuit board 520 and the component cover 530 can be used in common.

[0055] Figure 8 、 Figure 9A and Figure 9B 530 is an explanatory diagram for illustrating another example of a method of fixing the element cover 530. Figure 8 , the element cover 530 is fixed to the protection circuit board 520 by screws 541. Figure 8 , screw fastening is performed from the substrate surface 525 side of the protection circuit board 520 .

[0056] exist Figure 9A and Figure 9B , screw fastening is performed from the solder surface side of the protection circuit board 520. Figure 9A As shown in , the internal thread is provided on the element cover 530 side, and as Figure 9B As shown in , screw fastening is performed from the solder surface side (the surface side opposite to the substrate surface 525 ).

[0057] As described above, in the circuit according to this embodiment, component cover 530 protects the electronic components (varistor 521) mounted on the circuit board (protective circuit board 520) from damage. When component cover 530 is mounted on protective circuit board 520, heat generated by the electronic components (varistor 521) is dissipated through openings provided in component cover 530. This suppresses temperature increases in the electronic components (varistor 521). Furthermore, since a separate cover is not required to cover the entire circuit board (protective circuit board 520), the space required to mount the circuit board (protective circuit board 520) in a device can be reduced compared to related art. Therefore, in the circuit according to this embodiment, the electronic components mounted on the circuit board can be protected from damage while maintaining a long lifespan.

[0058] While the varistor 521 has been described above as an example of an electronic component to be protected by the element cover 530, the electronic component to be protected is not limited thereto, and any component mounted on a circuit board may be an electronic component to be protected. Furthermore, the element cover 530 may be provided to cover a plurality of electronic components mounted on a circuit board. Furthermore, a plurality of element covers 530 may be mounted on a circuit board.

[0059] The circuit board is not limited to the protective circuit board 520. As long as the circuit board is a circuit board capable of mounting electronic components, such as a power supply board, a high-voltage board, or a control board, the component cover 530 can be used. Furthermore, the above description has been made of the case of single-sided mounting (where electronic components are mounted on one surface of the circuit board), but even in the case of double-sided mounting (where electronic components are mounted on both surfaces of the circuit board), the component cover 530 can be used on both surfaces.

[0060] While the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the present disclosure is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

[0061] This application claims the benefit of Japanese Patent Application No. 2024-034645, filed on March 7, 2024, which is hereby incorporated by reference herein in its entirety.

Claims

1. A circuit comprising: electronic components; a circuit board having a first surface on which the electronic component is arranged; and a cover device provided on the first surface and configured to form an accommodation space for accommodating the electronic component, the cover device including a first portion and a second portion, wherein the first portion of the cover device contacts the first surface of the circuit board, wherein an opening is formed between the second portion of the cover device and the first surface of the circuit board, wherein an air flow path is formed, the path communicating from the outside of the cover device to the electronic components in the accommodating space through the opening, and The cover device includes a shielding device arranged between the opening and the electronic component in the accommodating space.

2. The circuit according to claim 1, in, The edge of the cover device includes a first edge portion corresponding to the first portion, and a second edge portion corresponding to the second portion, wherein the first edge portion contacts the first surface of the circuit board, wherein the second edge portion is formed as a cutout portion relative to the cover, and The opening is formed between the cutout portion and the first surface.

3. The circuit according to claim 1, wherein The shielding means is arranged such that the electronic component is not visible through the opening.

4. The circuit according to claim 1, in, The path is formed to bypass the shielding device to prevent the path from being blocked by the shielding member.

5. The circuit according to claim 1, in, The cover device includes a first engaging portion having a flexible support and an engaging claw provided at an end of the flexible support, The circuit board has a first mounting hole, and the flexible support is inserted through the first mounting hole, and The engaging claw of the first engaging portion engages with a second surface of the circuit board opposite to the first surface.

6. The circuit according to any one of claims 1 to 5, in, The cover device comprises a second engaging portion, The circuit board has a second mounting hole, the second engaging portion is inserted through the second mounting hole, and The first engaging portion and the second engaging portion are respectively engaged with a second surface of the circuit board opposite to the first surface.

7. The circuit according to claim 1, in, The cover device includes a first engaging portion and a second engaging portion, The circuit board has a first mounting hole and a second mounting hole, the first engaging portion is inserted through the first mounting hole, the second engaging portion is inserted through the second mounting hole, and The first engaging portion and the second engaging portion are respectively engaged with a second surface of the circuit board opposite to the first surface.

8. The circuit according to claim 1, wherein The shielding device divides the housing space into a first space facing the opening and a second space in which the electronic component is arranged.

9. The circuit according to claim 8, in, the cover device including a top surface portion substantially parallel to the first surface of the circuit board, wherein each of the first portion, the second portion, and the shielding device includes a plate portion that is continuous from the top surface portion and extends substantially perpendicularly to the first surface of the circuit board, and Wherein, an edge of the shielding component contacts the first surface of the circuit board.

10. The circuit according to claim 8, wherein The shielding device is configured to branch the path into at least two branch paths, each branch path communicating from the first space to the second space.

11. The circuit according to claim 10, wherein The shielding means has a labyrinth structure and provides a crank shape to each of the at least two branch paths.

12. The circuit of claim 1, wherein: On the first surface of the circuit board, a shielding object is arranged outside the cover device and at a position opposite to the opening.

13. The circuit according to claim 12, wherein The size of the shielding object is equal to or larger than the projected area of ​​the opening.

14. The circuit according to claim 13, wherein The shielding object includes a connector mounted on the circuit board.

15. The circuit of claim 1, wherein The cover member is fixed to the circuit board by screws.

16. The circuit of claim 1, wherein The electronic component includes a protection circuit configured to electrically protect other electronic components mounted on the circuit board.

17. The circuit of claim 1, wherein: The electronic component includes a varistor.

18. An imaging device comprising: modules configured to perform imaging-related operations; and circuits configured to be used in the operation of the module, Wherein, the circuit includes: electronic components; a circuit board having a first surface on which the electronic component is arranged; and a cover device provided on the first surface and configured to form an accommodation space for accommodating the electronic component, the cover device including a first portion and a second portion, wherein the first portion of the cover device contacts the first surface of the circuit board, wherein an opening is formed between the second portion of the cover device and the first surface of the circuit board, wherein an air flow path is formed, the path communicating from the outside of the cover device to the electronic components in the accommodating space through the opening, and The cover device includes a shielding device arranged between the opening and the electronic component in the accommodating space.

19. The imaging device according to claim 18, wherein The circuit board is a protection circuit board having a protection circuit mounted thereon to electrically protect other electronic components mounted on the circuit board.

Images