Heat conduction enhanced liquid cooling case

Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat conduction enhanced liquid cooling case which comprises an upper guide rail cold plate and a lower guide rail cold plate which are used for being matched with a board card, and further comprises a side plate and an electrical interconnection mother board. The upper end face of the upper guide rail cold plate contact plate card dissipates heat through an upper liquid cooling channel, and the lower end face of the lower guide rail cold plate contact plate card dissipates heat through a lower liquid cooling channel. The upper guide rail cold plate and the lower guide rail cold plate are respectively provided with a plurality of auxiliary guide rails in a matched mode, and the auxiliary guide rails make contact with one side face of the board card and dissipate heat through an auxiliary liquid cooling channel. The structure of the liquid cooling case is improved, the auxiliary guide rails are arranged at the upper guide rail cold plate and the lower guide rail cold plate in a matched mode, heat dissipation is conducted on the board card synchronously, the contact heat exchange area of the board card is increased, and therefore the heat dissipation effect of the liquid cooling case on the board card is improved; meanwhile, the auxiliary guide rail is directly attached to the heat dissipation structure of the board card, the traditional auxiliary heat dissipation structure is simplified, the heat dissipation path is shortened, and the heat dissipation efficiency and the heat dissipation performance can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat-conductivity-enhanced liquid-cooling chassis. Background Art

[0002] As electronic devices rapidly advance toward higher integration and higher power density, chip heat dissipation is increasing exponentially. For example, in scenarios such as high-performance computing, 5G communication base stations, and radar systems, the heat dissipation of a single board has exceeded 200W, making traditional air cooling insufficient. Liquid cooling, due to its high heat capacity and efficient heat transfer, is becoming the mainstream cooling solution for high-power devices. However, existing liquid-cooled chassis still suffer from issues such as a single heat conduction path and high contact thermal resistance, leading to excessively high board temperatures and limiting device performance and reliability.

[0003] Traditional liquid cooling chassis achieves heat conduction by fitting the locking strips on both sides of the board with the guide rail cold plate (such as Figure 1 Its thermal resistance network mainly includes: R 板导热 : Internal conduction thermal resistance of the board cold plate; R 板-导轨 : Thermal resistance of the contact surface between the board and the guide rail; R 导轨 : thermal resistance of the guide rail; R 板-锁紧条 : Thermal resistance of the contact surface between the board and the locking strip; R 锁紧条 : Thermal conduction resistance inside the locking strip; R 锁紧条-导轨 : Thermal resistance of the contact surface between the locking strip and the guide rail; R 对流换热 : Convection heat transfer thermal resistance of the guide rail cold plate.

[0004] From the perspective of heat dissipation, the main problems are as follows: 1) Excessive contact thermal resistance: In traditional chassis, the heat dissipation edges of the card rest against the rails for heat dissipation. However, the contact area between the card and the rail is limited (for example, the contact area on one side of the rail in a standard VPX chassis is only 16.0 cm × 0.7 mm). This results in a contact thermal resistance of 2.0K·cm² / W. When the card dissipates 100W of heat, the temperature difference across the contact surface reaches 17.9°C, significantly raising the card temperature.

[0005] 2) The locking strip has poor thermal conductivity: Due to its complex structure (including screws, wedge blocks, etc.), the internal thermal resistance of the locking strip accounts for as much as 95%, and less than 5% of the heat is conducted through it.

[0006] Currently, existing improvement plans focus on the following: 1) Reduce thermal resistance R 板导热: Increase the thermal conductivity of the board cold plate, such as using a steam chamber heat sink or internally designed graphite interlayer to improve the heat diffusion in the planar direction; 2) Reduce thermal resistance R 板-导轨 : Reduce contact thermal resistance by increasing the flatness and roughness of the guide rail contact surface; 3) Reduce thermal resistance R 对流换热 : By optimizing the fin geometry in the guide rail cold plate, the convective heat transfer thermal resistance is reduced.

[0007] The above traditional methods can greatly improve the heat dissipation capacity of the board. R 锁紧条 Because the locking bar is a wedge-shaped component that locks and expands, the internal screw connected to the wedge increases the thermal resistance within the locking bar, significantly reducing its actual thermal conductivity. Simulation calculations show that the heat transferred by the locking bar accounts for less than 5% of the heat transferred from the board to the guide rail cold plate. The reduction in contact thermal resistance across all contact surfaces is limited, failing to break through the bottleneck of the heat conduction path, limiting the benefits of heat exchange enhancement in other links.

[0008] Clearly, there's still room for improvement in current board heat dissipation. Optimization is needed to further enhance board heat dissipation and eliminate the conductive thermal resistance on the locking strip side. Therefore, a more reasonable technical solution is needed to address the technical issues inherent in existing technologies. Summary of the Invention

[0009] In order to overcome at least one of the defects mentioned above, the present invention proposes a thermally conductive enhanced liquid cooling chassis. By adding movable auxiliary guide rails to the locking strips and the heat dissipation sides of the board and card, and connecting flow channels in series inside the guide rails, it can be ensured that the auxiliary guide rails and the main guide rails are simultaneously close to the front and back sides of the heat dissipation edges of the board and card, thereby achieving double-sided heat dissipation and further enhancing the heat dissipation capacity of the board and card.

[0010] In order to achieve the above objectives, the liquid cooling chassis disclosed in the present invention can adopt the following technical solutions: A heat-conducting enhanced liquid-cooled chassis includes an upper guide rail cold plate and a lower guide rail cold plate for matching boards and cards, and also includes side plates and an electrical interconnection motherboard; the upper guide rail cold plate contacts the upper end surface of the board and card and dissipates heat through the upper liquid-cooling passage, and the lower guide rail cold plate contacts the lower end surface of the board and card and dissipates heat through the lower liquid-cooling passage; the upper guide rail cold plate and the lower guide rail cold plate are respectively provided with a plurality of auxiliary guide rails, and the auxiliary guide rails contact one side of the board and card and dissipate heat through the auxiliary liquid-cooling passage.

[0011] The liquid-cooled relay chassis disclosed above is used to cool and dissipate heat for boards and cards. By embedding the boards and cards between the upper guide rail cold plate and the lower guide rail cold plate, the upper guide rail cold plate and the lower guide rail cold plate contact the upper and lower end surfaces of the boards and cards and dissipate heat. At the same time, the auxiliary rails are attached to the sides of the boards and cards to dissipate heat synchronously, thereby increasing the heat dissipation contact area and heat dissipation effect of the boards and cards, and can improve the heat dissipation performance of the liquid-cooled chassis.

[0012] Furthermore, the upper liquid cooling passage, the lower liquid cooling passage, and the auxiliary liquid cooling passage all use liquid cooling to dissipate heat. The cooling medium can be delivered in a variety of ways, and its structure is not limited to a single one. Here, an optimization is made and one feasible option is proposed: the auxiliary liquid cooling passage is connected to the upper liquid cooling passage and obtains the cooling medium of the upper liquid cooling passage, or the auxiliary liquid cooling passage is connected to the lower liquid cooling passage and obtains the cooling medium of the lower liquid cooling passage. When adopting the above solution, the upper liquid cooling passage, the lower liquid cooling passage, and the auxiliary liquid cooling passage share the cooling medium, which can improve the flow path of the cooling medium and remove more heat. The shared cooling medium also simplifies the external supply structure, which can improve the stability and reliability of the overall structure of the chassis.

[0013] Furthermore, a number of boards are arranged in parallel between the upper guide rail cold plate and the lower guide rail cold plate, and the auxiliary guide rail is arranged between adjacent boards and performs heat dissipation. The structure of the auxiliary guide rail can be constructed in various forms, and its structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: the auxiliary guide rail includes a guide rail body, the auxiliary liquid cooling passage includes an auxiliary liquid cooling channel arranged in the guide rail body, and a cooling medium inlet and a cooling medium outlet connected to the auxiliary liquid cooling channel are provided on the guide rail body. The cooling medium inlet is connected to the diversion cavity of the upper liquid cooling passage or the lower liquid cooling passage, and the cooling medium outlet is connected to the confluence cavity of the upper liquid cooling passage or the lower liquid cooling passage. When the above scheme is adopted, the auxiliary guide rails at the upper guide rail cold plate and the lower guide rail cold plate are arranged in the same manner, and after the arrangement, they respectively obtain cooling medium from the upper rail cold plate or the lower rail cold plate, thereby improving the heat dissipation effect on the upper and lower parts of the boards.

[0014] Furthermore, in order to improve the sealing performance at the cooling medium inlet and cooling medium outlet and avoid damage to the board caused by cooling medium leakage, the matching structure of the auxiliary guide rail with the upper guide rail cold plate and the lower guide rail cold plate is optimized. The structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: the cooling medium inlet and cooling medium outlet are both provided with a pressing block, and a drainage channel is provided inside the pressing block and is used to connect to the auxiliary liquid cooling channel. The cooling medium enters the auxiliary liquid cooling channel or leaves the auxiliary liquid cooling channel through the drainage channel. When the above scheme is adopted, the pressing block includes a cylindrical section and is connected to the cooling medium inlet or cooling medium outlet, and also includes a drainage section and is connected to the upper guide rail cold plate or the lower guide rail cold plate. The cylindrical section can be in the shape of a circular cover, and the cylindrical section and the drainage section are integrally formed.

[0015] Furthermore, the cooling medium in the upper guide rail cold plate and the lower guide rail cold plate enters the auxiliary guide rail during the flow process, thereby achieving auxiliary cooling of the auxiliary guide rail. The flow of the cooling medium is confined to a sealed connecting channel, which can be achieved in a variety of ways, and its structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: the diversion cavity is provided with a liquid outlet, the confluence cavity is provided with a liquid inlet, one end of the pressure block is connected to the cooling medium inlet, and the other end is inserted into the liquid outlet, and the pressure block and the guide rail body clamp and seal the liquid outlet; or one end of the pressure block is connected to the cooling medium outlet, and the other end is inserted into the liquid inlet, and the pressure block and the guide rail body clamp and seal the liquid inlet. When the above scheme is adopted, the cylindrical section of the pressure block is connected to the cooling medium inlet or the cooling medium outlet, the drainage section of the pressure block is inserted into the liquid outlet or the liquid inlet, and the upper and lower ports of the liquid inlet and the liquid outlet are both provided with seals, thereby achieving sealing of the cooling medium flow path.

[0016] Furthermore, in order to make the guide rail body fit more closely with the board and thus improve the heat dissipation effect, the guide rail body can be pushed against the board by a limiting locking structure. Its structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: a floating locking structure is provided on one side of the guide rail body, and an elastic contact structure is provided on the other side of the guide rail body. When the above scheme is adopted, the floating locking structure can adopt a conical surface tightening locking rod structure, including an intermediate rod body, the intermediate rod body fits the guide rail body and forms an inclined surface at both ends, the inclined surface cooperates with the locking block and is connected by an adjusting member, and when the adjusting member is actuated, it pushes the locking block and the intermediate rod body toward each other, thereby increasing the width of the floating locking structure in the horizontal direction, thereby pushing the guide rail body toward the board and achieving tightening. According to this scheme, the heat dissipation path of the board is simplified, and the floating locking structure is avoided from causing thermal resistance to the heat dissipation of the board, thereby improving the heat dissipation efficiency and heat dissipation performance.

[0017] Furthermore, the side panels, the electrical interconnect motherboard, the upper guide rail cold plate and the lower guide rail cold plate cooperate to form the frame of the box. There are many specific configuration methods, and the structure is not limited to a single one. Here, we optimize and propose one feasible option: the side panels include a left side panel that cooperates with the left ends of the upper guide rail cold plate and the lower guide rail cold plate, and also include a right side panel that cooperates with the right ends of the upper guide rail cold plate and the lower guide rail cold plate; the rear ends of the upper guide rail cold plate and the lower guide rail cold plate cooperate with the electrical interconnect motherboard, and when the board is inserted from the front end of the upper guide rail cold plate and the lower guide rail cold plate, it connects and cooperates with the electrical interconnect motherboard. When the above solution is adopted, the electrical interconnect motherboard is provided with an electrical connection structure, and when the board is inserted into the box, it connects and cooperates with the electrical interconnect motherboard.

[0018] Furthermore, the cooling medium is fed into the liquid-cooled chassis from the outside. To improve the cooling performance of the liquid-cooled chassis and maximize the cooling capacity of the cooling medium, the chassis itself can be used to form a medium channel. The structure is not limited to a single one. Here, an optimization is made and one feasible option is proposed: a liquid supply passage and a liquid return passage are provided on the left and / or right panels. The liquid supply passage is used to supply the cooling medium to the upper and lower liquid-cooled passages, and the liquid return passage is used to recover the cooling medium from the upper and lower liquid-cooled passages. When the above solution is adopted, the temperature of the left and right panels of the liquid-cooled chassis can be maintained at a low level, promoting the maintenance of a low temperature environment inside the liquid-cooled chassis, thereby improving cooling performance.

[0019] To further improve heat dissipation efficiency, the structures of the upper and lower rail cold plates can be optimized. While this structure is not strictly limited, one feasible option is proposed here: the upper and lower rail cold plates are provided with heat dissipation fin structures. When the cooling medium flows through the heat dissipation fin structures, heat is dissipated outward. When this solution is adopted, the fin structures increase the heat dissipation surface, thereby improving heat dissipation efficiency.

[0020] Furthermore, the upper guide rail cold plate and the lower guide rail cold plate are respectively connected with a flow channel cover, and the flow channel cover is used to cover the heat dissipation fin structure.

[0021] Compared with the prior art, some of the beneficial effects of the technical solution disclosed in the present invention include: The present invention improves the structure of the liquid-cooled chassis, arranges auxiliary guide rails at the upper guide rail cold plate and the lower guide rail cold plate, and simultaneously dissipates heat for the board and card, thereby increasing the contact heat exchange area of ​​the board and card, thereby improving the heat dissipation effect of the liquid-cooled chassis on the board and card; at the same time, the auxiliary guide rails are directly attached to the heat dissipation structure of the board and card, which simplifies the structure of traditional auxiliary heat dissipation, shortens the heat dissipation path, and can improve heat dissipation efficiency and heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only represent some embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is the thermal resistance network diagram of a traditional liquid-cooled chassis.

[0024] Figure 2 Schematic diagram of the overall structure of the liquid-cooled chassis.

[0025] Figure 3 This is a front view of the liquid cooling chassis.

[0026] Figure 4 Schematic diagram of the exploded structure of the liquid-cooled chassis.

[0027] Figure 5 Schematic diagram of the top view of the lower guide rail cold plate (the bottom view of the upper guide rail cold plate is the same).

[0028] Figure 6 This is a schematic cross-sectional view of the liquid outlet of the diversion cavity of the lower guide rail cold plate.

[0029] Figure 7 Schematic diagram of the overall structure of the auxiliary guide rail.

[0030] Figure 8 Schematic diagram of the exploded structure of the auxiliary guide rail.

[0031] Figure 9 It is a schematic diagram of the cross-sectional structure of the auxiliary guide rail at AA.

[0032] Figure 10 Schematic diagram of the thermal resistance network of the liquid-cooled chassis in the present invention.

[0033] In the above drawings, the meanings of the symbols are: 1. Upper guide rail cold plate; 101. Heat dissipation fin structure; 2. Left side plate; 3. Lower guide rail cold plate; 301. Converging chamber; 302. Liquid inlet hole; 303. Diverter chamber; 304. Liquid outlet hole; 4. Board; 5. Right side plate; 501. Liquid supply passage; 502. Liquid return passage; 6. Channel cover; 7. Floating locking structure; 8. Auxiliary guide rail; 800. Auxiliary liquid cooling channel; 801. Pressure block; 802. Seal; 803. Guide rail body; 804. Elastic contact structure; 9. Electrical interconnection motherboard. DETAILED DESCRIPTION

[0034] This embodiment will be further explained below with reference to the accompanying drawings and specific examples.

[0035] In view of the limited heat dissipation performance of the liquid-cooled chassis in the prior art, the long heat dissipation path in the chassis, the large thermal resistance, and the disadvantage of improving the heat dissipation efficiency, the following embodiments optimize and overcome the defects in the prior art.

[0036] Example 1 like Figures 2 to 9 As shown, a heat-conducting enhanced liquid-cooled chassis includes an upper guide rail cold plate 1 and a lower guide rail cold plate 3 for matching the board 4, and also includes side plates and an electrical interconnection motherboard 9; the upper guide rail cold plate 1 contacts the upper end surface of the board 4 and dissipates heat through the upper liquid-cooling passage, and the lower guide rail cold plate 3 contacts the lower end surface of the board 4 and dissipates heat through the lower liquid-cooling passage; the upper guide rail cold plate 1 and the lower guide rail cold plate 3 are respectively equipped with a plurality of auxiliary guide rails 8, and the auxiliary guide rail 8 contacts one side of the board 4 and dissipates heat through the auxiliary liquid-cooling passage.

[0037] The liquid-cooled relay chassis disclosed in this embodiment is used to cool and dissipate heat for the board 4. By embedding the board 4 between the upper guide rail cold plate 1 and the lower guide rail cold plate 3, the upper guide rail cold plate 1 and the lower guide rail cold plate 3 contact the upper and lower end surfaces of the board 4 and dissipate heat. At the same time, the auxiliary guide rail 8 is attached to the side of the board 4 to dissipate heat synchronously, thereby increasing the heat dissipation contact area and heat dissipation effect of the board 4, and can improve the heat dissipation performance of the liquid-cooled chassis.

[0038] The upper liquid cooling passage, the lower liquid cooling passage and the auxiliary liquid cooling passage all adopt liquid cooling to dissipate heat. The delivery method of the cooling medium can adopt a variety of schemes, and its structure is not limited to a single one. This embodiment optimizes and adopts one of the feasible options: Figure 6 As shown, the auxiliary liquid cooling passage connects to the upper liquid cooling passage and receives the cooling medium from the upper liquid cooling passage, or connects to the lower liquid cooling passage and receives the cooling medium from the lower liquid cooling passage. With this solution, the upper, lower, and auxiliary liquid cooling passages share the cooling medium, which improves the cooling medium's flow path and removes more heat. Sharing the cooling medium also simplifies the external supply structure, improving the stability and reliability of the chassis' overall structure.

[0039] A plurality of boards 4 are arranged in parallel between the upper guide rail cold plate 1 and the lower guide rail cold plate 3. Auxiliary guide rails 8 are arranged between adjacent boards 4 and are fitted to dissipate heat. The structure of the auxiliary guide rails 8 can be constructed in various forms and is not limited to a single form. This embodiment is optimized and adopts one of the feasible options: Figure 7 、 Figure 8 、 Figure 9As shown, the auxiliary rail 8 includes a rail body 803, and the auxiliary liquid cooling passage includes an auxiliary liquid cooling channel 800 disposed within the rail body 803. The rail body 803 is provided with a cooling medium inlet and a cooling medium outlet connected to the auxiliary liquid cooling channel 800. The cooling medium inlet is connected to the diverter cavity 303 of the upper or lower liquid cooling passage, and the cooling medium outlet is connected to the confluence cavity 301 of the upper or lower liquid cooling passage. When adopting the above solution, the auxiliary rails 8 at the upper rail cold plate 1 and the lower rail cold plate 3 are arranged in the same manner, and after installation, they respectively obtain cooling medium from the upper rail cold plate or the lower rail cold plate, thereby improving the heat dissipation effect on the upper and lower parts of the board 4.

[0040] In order to improve the sealing performance at the cooling medium inlet and outlet and avoid damage to the board 4 caused by cooling medium leakage, the matching structure of the auxiliary guide rail 8 with the upper guide rail cold plate 1 and the lower guide rail cold plate 3 is optimized. The structure is not limited to a single one. This embodiment optimizes and adopts one of the feasible options: Figure 4 、 Figure 6 As shown, the cooling medium inlet and cooling medium outlet are both provided with a pressing block 801. A drainage channel is provided inside the pressing block 801 and is connected to the auxiliary liquid cooling channel 800. The cooling medium enters or leaves the auxiliary liquid cooling channel 800 through the drainage channel. When adopting the above solution, the pressing block 801 includes a cylindrical section that is in communication with the cooling medium inlet or cooling medium outlet, and also includes a drainage section that is in communication with the upper guide rail cold plate 1 or the lower guide rail cold plate 3. The cylindrical section can be in the shape of a circular cover, and the cylindrical section and the drainage section are integrally formed.

[0041] The cooling medium in the upper guide rail cold plate 1 and the lower guide rail cold plate 3 enters the auxiliary guide rail 8 during the flow process, realizing auxiliary cooling of the auxiliary guide rail 8. The flow of the cooling medium is confined to a sealed communication channel. This can be achieved in a variety of ways, and its structure is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: Figure 5 As shown, the diversion chamber 303 is provided with a liquid outlet 304, and the confluence chamber 301 is provided with a liquid inlet 302. One end of the pressure block 801 is connected to the cooling medium inlet, and the other end is inserted into the liquid outlet 304. The pressure block 801 and the guide rail body 803 clamp and seal the liquid outlet 304. Alternatively, one end of the pressure block 801 is connected to the cooling medium outlet, and the other end is inserted into the liquid inlet 302. The pressure block 801 and the guide rail body 803 clamp and seal the liquid inlet 302. When the above solution is adopted, the cylindrical section of the pressure block 801 is connected to the cooling medium inlet or cooling medium outlet, and the drainage section of the pressure block 801 is inserted into the liquid outlet 304 or liquid inlet 302. The upper and lower ports of the liquid inlet 302 and the liquid outlet 304 are both provided with sealing members 802, thereby achieving sealing of the cooling medium flow path.

[0042] In order to make the guide rail body 803 and the board 4 fit more closely, thereby improving the heat dissipation effect, the guide rail body 803 can be pushed to press against the board 4 through the limit locking structure. The structure is not limited to the only one. This embodiment is optimized and adopts one of the feasible options: Figure 3 、 Figure 6 As shown, a floating locking structure 7 is provided on one side of the guide rail body 803, and an elastic contact structure 804 is provided on the other side of the guide rail body 803. When adopting the above solution, the floating locking structure 7 can adopt a locking rod structure with a conical surface tightening, including an intermediate rod body, which fits the guide rail body 803 and forms an inclined surface at both ends. The inclined surface cooperates with the locking block and is connected through an adjusting member. When the adjusting member is actuated, it pushes the locking block and the intermediate rod body toward each other, thereby increasing the width of the floating locking structure 7 in the lateral direction, thereby pushing the guide rail body 803 toward the board 4 and achieving tightening. Figure 1 、 Figure 10 As shown, according to this solution, the heat dissipation path of the board 4 is simplified, and the floating locking structure 7 is avoided from causing thermal resistance to the heat dissipation of the board 4, thereby improving the heat dissipation efficiency and heat dissipation performance.

[0043] Preferably, the elastic contact structure 804 in this embodiment includes an elastic spring, which is used to provide an elastic pressing force to help the auxiliary guide rail 8 to cooperate with the upper guide rail cold plate 1 or the lower guide rail cold plate 3.

[0044] The side panels, the electrical interconnection motherboard 9, the upper guide rail cold plate 1 and the lower guide rail cold plate 3 form the frame of the box. There are many ways to set it up, and its structure is not limited to the only one. This embodiment is optimized and adopts one of the feasible options: Figure 4 As shown, the side panels include a left side panel 2 that mates with the left ends of the upper and lower rail cold plates 1 and 3, and a right side panel 5 that mates with the right ends of the upper and lower rail cold plates 1 and 3. The rear ends of the upper and lower rail cold plates 1 and 3 mate with an electrical interconnect motherboard 9, which connects and mates with the board 4 when it is inserted from the front ends of the upper and lower rail cold plates 1 and 3. When this solution is adopted, the electrical interconnect motherboard 9 is provided with an electrical connection structure, which connects and mates with the board 4 when it is inserted into the box.

[0045] The cooling medium is fed into the liquid cooling box from the outside. In order to improve the cooling performance of the liquid cooling box and maximize the cooling capacity of the cooling medium, the box itself can be used to form a medium channel. Its structure is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: Figure 2As shown, the left side panel 2 and / or the right side panel 5 are provided with a liquid supply passage 501 and a liquid return passage 502. The liquid supply passage 501 is used to supply cooling medium to the upper and lower liquid cooling passages, while the liquid return passage 502 is used to recover cooling medium from the upper and lower liquid cooling passages. This solution allows the left and right sides of the liquid-cooled chassis to maintain a relatively low temperature, thereby maintaining a relatively low temperature environment within the liquid-cooled chassis and improving cooling performance.

[0046] Preferably, the upper guide rail cold plate 1 and the lower guide rail cold plate 3 are provided with communication ports corresponding to the liquid supply passage 501 and the liquid return passage 502 .

[0047] When improving the heat dissipation efficiency, the structures of the upper guide rail cold plate 1 and the lower guide rail cold plate 3 can be optimized. The structures are not limited to the only ones. This embodiment optimizes and adopts one of the feasible options: Figure 4 As shown, the upper guide rail cold plate 1 and the lower guide rail cold plate 3 are provided with a heat dissipation fin structure 101. When the cooling medium flows to the heat dissipation fin structure 101, the heat is dissipated outward. When the above solution is adopted, the fin structure increases the heat dissipation surface, thereby improving the heat dissipation efficiency.

[0048] In this embodiment, the upper guide rail cold plate 1 and the lower guide rail cold plate 3 are respectively connected with a flow channel cover 6 , and the flow channel cover 6 is used to cover the heat dissipation fin structure 101 .

[0049] Preferably, the flow channel covers 6 of the upper guide rail cold plate 1 and the lower guide rail cold plate 3 are both made of two structural plates.

[0050] Example 2 Example 1 discloses the structure of a liquid cooling chassis, and this embodiment provides its processing technology and assembly process.

[0051] Processing technology: 1. The chassis guide rail cold plate adopts CNC milling + vacuum brazing process to ensure the dimensional accuracy of the diversion cavity and the confluence cavity; 2. The internal flow channel of the auxiliary guide rail is formed by welding or 3D printing; 3. The seals at the pressing block are made of fluorosilicone rubber.

[0052] The assembly process is as follows: 1. Place the auxiliary rail parallel to the main rail and insert it into the flow holes of the upper and lower rails of the chassis; 2. Connect the pressure block to the diversion chamber and the confluence chamber to complete the liquid circuit sealing test; 3. After the board is inserted, tighten the locking mechanism and drive the auxiliary guide rail to fit against the back of the board.

[0053] Example 3 This embodiment provides a specific case to illustrate the effect of the liquid cooling chassis in Embodiment 1.

[0054] Taking a certain type of signal processing card (heat dissipation 200W) as an example, in a traditional liquid cooling chassis, only the main rail is used as the heat dissipation surface. Therefore, the temperature difference caused by the contact thermal resistance between the heat dissipation edge of the card and the main rail is calculated as follows:

[0055] Where A is the contact area of ​​the guide rail, Q is the total heat consumption of the board, θ 1 is the contact thermal resistance of the guide rail surface.

[0056] The temperature rise of the main rail body due to heat conduction and fluid convection is calculated by the following formula:

[0057] Among them, A c is the heat conduction area of ​​a single rail, H is the heat conduction distance of the rail, A t is the total convective heat transfer area of ​​the guide rail corresponding to a single guide rail, which includes the wing base area; h is the convective heat transfer coefficient, η t is the total efficiency of the corresponding local heat sink fin, If the average fluid temperature T f is 60℃, so the traditional board heat sink temperature T w for:

[0058] After adding the auxiliary rail, the thermal paths are connected in parallel. The calculated comprehensive thermal resistance of the auxiliary rail (single side) is 0.204 ℃ / W, while the comprehensive thermal resistance of the main rail (single side) is 0.217 ℃ / W. The two are very close. To simplify the calculation process, it can be considered that the total thermal resistance of the two in parallel is reduced by half. Therefore, after adding the auxiliary rail, the heat dissipation edge temperature of the board is T w1 for

[0059] It can be seen that the auxiliary rail can reduce the temperature level of the board cold plate by about 10.85°C. The reduction rate increases with the increase of the board heat consumption.

[0060] The above are the implementation methods listed in this embodiment, but this embodiment is not limited to the above optional implementation methods. Those skilled in the art can arbitrarily combine the above methods to obtain other various implementation methods. Anyone can derive other various implementation methods based on the inspiration of this embodiment. The above specific implementation methods should not be understood as limiting the scope of protection of this embodiment. The scope of protection of this embodiment should be based on the definition in the claims.

Claims

1. A thermally conductive liquid-cooled chassis, characterized in that: The invention comprises an upper guide rail cold plate (1) and a lower guide rail cold plate (3) for matching a board (4), and also comprises a side plate and an electrical interconnection motherboard (9); the upper guide rail cold plate (1) contacts the upper end surface of the board (4) and dissipates heat through an upper liquid cooling passage, and the lower guide rail cold plate (3) contacts the lower end surface of the board (4) and dissipates heat through a lower liquid cooling passage; the upper guide rail cold plate (1) and the lower guide rail cold plate (3) are respectively matched with a plurality of auxiliary guide rails (8), and the auxiliary guide rails (8) contact one side surface of the board (4) and dissipate heat through the auxiliary liquid cooling passage.

2. The thermally conductive enhanced liquid cooling chassis according to claim 1, characterized in that: The auxiliary liquid cooling passage is connected to the upper liquid cooling passage and obtains the cooling medium of the upper liquid cooling passage, or the auxiliary liquid cooling passage is connected to the lower liquid cooling passage and obtains the cooling medium of the lower liquid cooling passage.

3. The thermally conductive enhanced liquid cooling chassis according to claim 1, wherein: The auxiliary guide rail (8) includes a guide rail body (803), the auxiliary liquid cooling passage includes an auxiliary liquid cooling channel (800) arranged in the guide rail body (803), and a cooling medium inlet and a cooling medium outlet connected to the auxiliary liquid cooling channel (800) are provided on the guide rail body (803), the cooling medium inlet is connected to the diversion cavity (303) of the upper liquid cooling passage or the lower liquid cooling passage, and the cooling medium outlet is connected to the confluence cavity (301) of the upper liquid cooling passage or the lower liquid cooling passage.

4. The thermally conductive enhanced liquid cooling chassis according to claim 3, characterized in that: The cooling medium inlet and the cooling medium outlet are both provided with a pressing block (801), a drainage channel is provided inside the pressing block (801) and is used to connect to the auxiliary liquid cooling channel (800), and the cooling medium enters the auxiliary liquid cooling channel (800) or leaves the auxiliary liquid cooling channel (800) through the drainage channel.

5. The thermally conductive enhanced liquid cooling chassis according to claim 4, characterized in that: The diversion chamber (303) is provided with a liquid outlet (304), and the confluence chamber (301) is provided with a liquid inlet (302). One end of the pressing block (801) is connected to the cooling medium inlet, and the other end is inserted into the liquid outlet (304). The pressing block (801) and the guide rail body (803) clamp and seal the liquid outlet (304); or one end of the pressing block (801) is connected to the cooling medium outlet, and the other end is inserted into the liquid inlet (302). The pressing block (801) and the guide rail body (803) clamp and seal the liquid inlet (302).

6. The thermally conductive enhanced liquid cooling chassis according to any one of claims 3 to 5, characterized in that: A floating locking structure (7) is provided on one side of the guide rail body (803), and an elastic contact structure (804) is provided on the other side of the guide rail body (803).

7. The thermally conductive enhanced liquid cooling chassis according to claim 1, characterized in that: The side plate includes a left side plate (2) that cooperates with the left ends of the upper guide rail cold plate (1) and the lower guide rail cold plate (3), and also includes a right side plate (5) that cooperates with the right ends of the upper guide rail cold plate (1) and the lower guide rail cold plate (3); the rear ends of the upper guide rail cold plate (1) and the lower guide rail cold plate (3) cooperate with the electrical interconnection motherboard (9), and when the board (4) is inserted from the front ends of the upper guide rail cold plate (1) and the lower guide rail cold plate (3), it is connected and cooperated with the electrical interconnection motherboard (9).

8. The thermally conductive enhanced liquid cooling chassis according to claim 7, characterized in that: A liquid supply passage (501) and a liquid return passage (502) are provided on the left side plate (2) and / or the right side plate (5), wherein the liquid supply passage (501) is used to supply cooling medium to the upper liquid cooling passage and the lower liquid cooling passage, and the liquid return passage (502) is used to recover cooling medium from the upper liquid cooling passage and the lower liquid cooling passage.

9. The thermally conductive enhanced liquid cooling chassis according to claim 1, characterized in that: The upper guide rail cold plate (1) and the lower guide rail cold plate (3) are provided with a heat dissipation fin structure (101), and when the cooling medium flows to the heat dissipation fin structure (101), heat is dissipated outwards.

10. The thermally conductive enhanced liquid cooling chassis according to claim 9, characterized in that: The upper guide rail cold plate (1) and the lower guide rail cold plate (3) are respectively connected to a flow channel cover (6), and the flow channel cover (6) is used to cover the heat dissipation fin structure (101).

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