Double-fluid nozzle and substrate processing equipment

Abstract

The invention discloses a double-fluid nozzle and substrate processing equipment. The double-fluid nozzle comprises a liquid outlet main body, the first buffer part is arranged on the first extension part; a plurality of circulation channels are formed in the first buffer piece; the shell is provided with a liquid outlet, and the liquid outlet main body is sleeved with the shell; a buffer space is defined by the inner wall of the shell, the end of the liquid outlet body, the end of the first buffer piece and the side wall of the first extending part and used for gathering fluid in the second pipeline to slow down the flow speed. A substrate processing device comprises a two-fluid nozzle, a bearing part and a supply part. The bearing part is used for bearing a wafer; the double-fluid nozzle sprays fluid to the wafer; the supply part comprises a supply device, a first supply pipeline and a second supply pipeline, one end of the first supply pipeline is communicated with the supply device, and the other end is communicated with the first pipeline; one end of the second supply pipeline is communicated with the supply device, and the other end is communicated with the second pipeline. The liquid drop forming speed can be increased, and meanwhile damage to the surface of the wafer is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a dual-fluid nozzle and substrate processing equipment. Background Art

[0002] In the semiconductor device manufacturing process, two-fluid nozzles are commonly used to clean particles from the wafer surface. These nozzles use a mixture of gas and liquid to create a jet of droplets that impact the wafer surface. The kinetic energy of the droplets physically removes particles and other impurities adhering to the wafer surface. Compared to brushing and ultrasonic cleaning, two-fluid nozzle cleaning causes less damage to the substrate surface and is therefore widely used for cleaning substrates with fine patterns.

[0003] To increase the effective removal rate of particles from the substrate surface, one approach is to increase the gas flow rate fed into the two-fluid nozzle to increase the median diameter of the droplets ejected from the nozzle. However, increasing the gas flow rate increases the velocity of the droplets, increasing damage to the substrate pattern and reducing yield.

[0004] Therefore, it is necessary to provide a new dual-fluid nozzle and substrate processing equipment to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by the present application is to provide a dual-fluid nozzle and substrate processing equipment that can increase the droplet formation speed while reducing damage to the wafer surface.

[0006] To solve the above technical problems, according to an embodiment of the present application, a dual-fluid nozzle is provided, comprising a liquid outlet body, wherein the end of the liquid outlet body has a first extension portion; a first pipeline and a second pipeline are formed on the liquid outlet body, wherein the first pipeline passes through the liquid outlet body and the first extension portion, and the second pipeline passes through the liquid outlet body; a first buffer member disposed on an outer wall of the first extension portion; the first buffer member is provided with a plurality of flow channels; The shell has a liquid outlet, the shell is sleeved on the liquid outlet body, and the inner wall of the shell abuts the side wall of the first buffer member; the inner wall of the shell, the end of the liquid outlet body, the end of the first buffer member and the side wall of the first extension portion form a buffer space, the buffer space is connected to the second pipeline, the buffer space is used to gather the fluid in the second pipeline to slow down the flow rate, and the fluid in the buffer space flows through the circulation channel and mixes with the liquid in the first pipeline and is discharged through the liquid outlet.

[0007] A substrate processing device includes a dual-fluid nozzle, a carrying portion, and a supply portion; The carrying portion is used to carry the wafer; The dual-fluid nozzle is arranged corresponding to the supporting portion to spray fluid toward the wafer on the supporting portion; The supply part includes a supply device, a first supply pipeline and a second supply pipeline, one end of the first supply pipeline is connected to the supply device, and the other end is connected to the first pipeline; one end of the second supply pipeline is connected to the supply device, and the other end is connected to the second pipeline.

[0008] By adopting the above technical solution, a first buffer is provided on the dual-fluid nozzle, allowing the gas flowing through the second pipeline to directly contact the first buffer and be discharged through the circulation channel of the first buffer, thereby reducing the flow rate of the fluid flowing through the second pipeline and the impact force on the wafer surface. At the same time, a buffer space is formed between the housing and the liquid outlet body. The fluid flowing through the second pipeline first enters the buffer space. The buffer space has a certain buffering effect, cooperating with the first buffer to reduce the flow rate of the fluid flowing through the second pipeline and the impact force on the wafer, thereby reducing damage to the pattern on the wafer surface.

[0009] According to an embodiment of the present application, a convergence annular groove is provided at the bottom of the first buffer component, and the circulation channel is connected to the convergence annular groove, so that the fluid in the multiple circulation channels converges in the convergence annular groove and is discharged through the liquid outlet.

[0010] According to an embodiment of the present application, the bottom of the first buffer member has a first boss, the first boss has a first plane and a first inclined surface, and the two ends of the first inclined surface extend to the first plane and the side wall of the first buffer member respectively; the first plane is used to define the converging annular groove, and the first inclined surface abuts against the inner wall of the housing; The circulation channel passes through the first plane and the first inclined surface, so that part of the fluid is blocked by the shell and then enters the converging annular groove.

[0011] According to an embodiment of the present application, the top of the first buffer member has a second boss, the second boss has a second plane and a second inclined surface, and the two ends of the second inclined surface extend to the second plane and the side wall of the first buffer member respectively; one side of the circulation channel passes through the side wall of the first buffer member, and the other side extends to the second plane, so that the circulation channel is set at an angle.

[0012] According to an embodiment of the present application, the top of the circulation channel passes through the second inclined surface; the circulation channel includes a first wall, which is inclined and extends from the edge of the second plane to the middle of the first plane, so that the fluid enters the circulation channel from the second inclined surface, and part of the fluid in the circulation channel enters the convergence annular groove from the top of the convergence annular groove, and part of the fluid enters the convergence annular groove from the side of the convergence annular groove.

[0013] According to an embodiment of the present application, the inner wall of the shell includes a first vertical section, an inclined section and a second vertical section; the interval between the first vertical section and the side wall of the first extension portion is defined as a first interval, and the interval between the second vertical section and the side wall of the first extension portion is defined as a second interval; the first interval is larger than the second interval; the inclined section is inclined and connects the first vertical section and the second vertical section, and the inclined section is used to block the fluid to slow down the flow rate of the fluid.

[0014] According to an embodiment of the present application, a second buffer member is further included, which is arranged on the side wall of the first extension portion, and there is a third gap between the second buffer member and the first vertical section for passing fluid; the top wall of the second buffer member is inclined so that the fluid flowing through the second pipeline is blocked by the second buffer member and then flows to the third gap; after flowing through the third gap, it is blocked by the inclined section and flows to the circulation channel.

[0015] According to an embodiment of the present application, a second buffer member is further included. The second buffer member is arranged on the side wall of the first extension portion, and the side wall of the second buffer member is in contact with the first vertical section; a plurality of buffer holes are opened through the second buffer member to allow fluid to pass through.

[0016] According to an embodiment of the present application, a control part is further included, and the control part includes: a lifting mechanism connected to the dual-fluid nozzle to drive the dual-fluid nozzle to move; The rotating mechanism is connected to the bearing part to drive the bearing part to rotate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A main body cross-sectional view of a dual-fluid nozzle according to an embodiment of the present invention; Figure 2 for Figure 1 Enlarged view of part A; Figure 3 A partial cross-sectional view of a structure in which a buffer hole is provided on a second buffer member according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the main structure of a first buffer member according to an embodiment of the present invention; Figure 5 A bottom view of the main structure of a first buffer member according to an embodiment of the present invention; Figure 6 Schematic diagram of the inclination direction of the first wall of the flow channel in the first buffer member according to an embodiment of the present invention; Figure 7 The figure is a schematic diagram of the main structure of a substrate processing device according to an embodiment of the present invention.

[0018] Reference numerals: 100, liquid outlet body; 110, first extension part; 120, first pipeline; 130, second pipeline; 140, buffer space; 200, first buffer member; 210, circulation channel; 211, first wall; 220, converging ring groove; 230, first boss; 231, first plane; 232, first inclined surface; 240, second boss; 241, second plane; 242, second inclined surface; 300, shell; 310, liquid outlet; 320, first vertical section; 330, inclined section; 340, second vertical section; 400, second buffer member; 410, buffer hole; 500, bearing part; 510, supporting member; 520, bearing member; 600, supply device; 610, first supply pipeline; 620, second supply pipeline; 630, first supply member; 640, second supply member; 700, lifting mechanism; 800, rotating mechanism. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0020] The following is combined with Figure 1-7 , the specific implementation methods of the present invention are further described in detail.

[0021] An embodiment of the present invention provides a dual-fluid nozzle, which is used for wafer processing to spray liquid onto the wafer surface during wafer processing. The dual-fluid nozzle includes a liquid outlet body 100, with a first extension portion 110 at the end of the liquid outlet body 100; a first pipeline 120 and a second pipeline 130 are formed on the liquid outlet body 100, the first pipeline 120 passes through the liquid outlet body 100 and the first extension portion 110, and the second pipeline 130 passes through the liquid outlet body 100; The first buffer member 200 is disposed on the outer wall of the first extension portion 110 ; the first buffer member 200 is provided with a plurality of flow channels 210 ; The shell 300 has a liquid outlet 310. The shell 300 is mounted on the liquid outlet body 100, and the inner wall of the shell 300 abuts against the side wall of the first buffer component 200. The inner wall of the shell 300, the end of the liquid outlet body 100, the end of the first buffer component 200 and the side wall of the first extension portion 110 form a buffer space 140. The buffer space 140 is connected to the second pipeline 130. The buffer space 140 is used to gather the fluid in the second pipeline 130 to slow down the flow rate. The fluid in the buffer space 140 flows through the circulation channel 210 and mixes with the liquid in the first pipeline 120 and is discharged through the liquid outlet 310.

[0022] In some embodiments, the end of the liquid outlet body 100 has a first extension portion 110, wherein the cross-section of the liquid outlet body 100 can be circular or polygonal, which is not limited here, and its circular cross-section is only used as an example; the cross-section of the first extension portion 110 can be circular or polygonal, which is not limited here, and its circular cross-section is only used as an example; the liquid outlet body 100 and the first extension portion 110 are coaxially arranged, and the connection method between the two can be bonding, welding or integral molding, etc., which is not limited here, and the fixed connection between the two is mainly used.

[0023] In some embodiments, the first pipe 120 passes through the liquid outlet body 100 and the first extension portion 110 along the axial direction of the liquid outlet body 100, one end of which is used for liquid inlet and the other end for liquid discharge; the end of the first pipe 120 used for liquid inlet is defined as the top end of the liquid outlet body 100, and the end of the first pipe 120 used for liquid discharge is defined as the bottom end of the liquid outlet body 100; at the same time, the first pipe 120 is coaxially arranged with the liquid outlet body 100, so that the first pipe 120 can simultaneously pass through the liquid outlet body 100 and the first extension portion 110. 0; the axis of the second pipeline 130 is parallel to the axis of the first pipeline 120, and the second pipeline 130 is eccentrically arranged on the liquid outlet body 100, so that the second pipeline 130 can only pass through the liquid outlet body 100; since the first pipeline 120 and the second pipeline 130 are parallel, their liquid inlet ends are both located at the top of the liquid outlet body 100. When connecting the pipeline for liquid inlet, the pipeline can be directly connected to the top of the liquid outlet body 100 instead of being connected to the side wall of the liquid outlet body 100, so as to save installation space.

[0024] In some embodiments, a first buffer member 200 is provided on the outer wall of the first extension portion 110. The first buffer member 200 may be attached by bonding, snap-fitting, or integrally formed, without limitation, provided that relative movement between the first buffer member 200 and the first extension portion 110 is prevented. The first buffer member 200 is provided with a plurality of flow channels 210 for passing fluid.

[0025] In some embodiments, the dual-fluid nozzle further includes a housing 300, which is sleeved on the bottom end of the liquid outlet body 100, and the bottom end of the housing 300 has a liquid outlet 310, so that the fluid flowing through the liquid outlet body 100 can be discharged through the liquid outlet 310. Specifically, the inner wall of the housing 300 abuts against the inner wall of the first buffer member 200, so that the inner wall of the housing 300, the end of the liquid outlet body 100, the end of the first buffer member 200, and the side wall of the first extension portion 110 surround and form a buffer space 140. That is, the fluid flowing through the first pipeline 120 is directly discharged through the liquid outlet 310, and the fluid flowing through the second pipeline 130 first enters the buffer space 140, and then flows through the circulation channel 210 and is discharged through the liquid outlet 310. The fluid can gather in the buffer space 140, thereby slowing down the flow rate. More specifically, the fluid flowing through the first pipeline 120 is liquid, and the fluid flowing through the second pipeline 130 is gas. By reducing the flow rate of the gas in the buffer space 140, the flow rate of the gas discharged from the liquid outlet 310 is reduced to reduce the impact of the gas on the wafer surface.

[0026] A converging annular groove 220 is defined at the bottom of the first buffer 200 . The circulation channels 210 are connected to the converging annular groove 220 , so that the fluids in the circulation channels 210 converge in the converging annular groove 220 and are discharged through the liquid outlet 310 .

[0027] In some embodiments, a convergence groove 220 is provided at the bottom of the first buffer member 200, and the circulation channel 210 is connected to the convergence groove 220, so that the fluid in multiple circulation channels 210 can converge in the convergence groove 220, thereby further reducing the flow rate of the fluid. At the same time, after the fluid converges in the convergence groove 220, it is closer to the first pipeline 120, thereby facilitating the mixing of the fluid flowing through the second pipeline 130 and the fluid flowing through the first pipeline 120.

[0028] The first buffer member 200 has a first boss 230 at its bottom. The first boss 230 has a first plane 231 and a first inclined surface 232. The first inclined surface 232 extends to the first plane 231 and the sidewall of the first buffer member 200, respectively. The first plane 231 defines the converging annular groove 220, and the first inclined surface 232 abuts against the inner wall of the housing 300. The circulation channel 210 penetrates the first plane 231 and the first inclined surface 232 , so that part of the fluid is blocked by the housing 300 and then enters the converging annular groove 220 .

[0029] In some embodiments, the cross-section of the first buffer 200 can be circular or polygonal, mainly so as to be able to abut against the inner wall of the shell 300. Here, the cross-section of the first buffer 200 is circular as an example; the bottom of the first buffer 200 has a first boss 230, wherein the first boss 230 has a first plane 231 and a first inclined surface 232, so that the bottom of the first buffer 200 is inclined from the side wall toward the middle; the converging annular groove 220 is opened on the first plane 231, and the converging annular groove 220 and the first buffer 200 are coaxially arranged; the first inclined surface 232 simultaneously abuts against the inner wall of the shell 300.

[0030] In some specific embodiments, the circulation channel 210 passes through the first plane 231 and the first inclined surface 232, so that the circulation channel 210 is connected to the side wall of the converging annular groove 220. That is, after the fluid flows through the circulation channel 210, it can enter the converging annular groove 220 from the side of the converging annular groove 220. More specifically, in order to enable the fluid to enter the converging annular groove 220 from the side, the first inclined surface 232 is arranged to abut against the inner wall of the housing 300. Since the first inclined surface 232 is arranged at an angle, the inner wall of the housing 300 abutting against the first inclined surface 232 is also arranged at an angle. The fluid flows from top to bottom in the circulation channel 210. The inner wall of the housing 300 has a guiding effect on the fluid, so that the fluid enters the converging annular groove 220 from the side, thereby further reducing the flow rate of the fluid flowing through the second pipeline 130.

[0031] The top of the first buffer member 200 has a second boss 240, the second boss 240 has a second plane 241 and a second inclined surface 242, and the two ends of the second inclined surface 242 extend to the second plane 241 and the side wall of the first buffer member 200 respectively; one side of the circulation channel 210 passes through the side wall of the first buffer member 200, and the other side extends to the second plane 241, so that the circulation channel 210 is set at an angle.

[0032] In some embodiments, the top of the first buffer member 200 has a second boss 240, which has a second flat surface 241 and a second inclined surface 242, causing the top of the first buffer member 200 to tilt from the sidewall toward the center of the first buffer member 200. The flow channel 210 extends from the sidewall of the first buffer member 200 on one side to the edge of the second flat surface 241 on the other side. Furthermore, the flow channel 210 forms an angle with the radial direction of the first buffer member 200, resulting in an inclined arrangement of the flow channel 210. This can be understood as the flow channel 210 forming an umbrella-shaped arrangement in a top or bottom view of the first buffer member 200. Therefore, fluid entering the converging annular groove 220 through the side thereof, constrained by the inclined flow channel 210 and the inner wall of the housing 300, will move circumferentially within the converging annular groove 220, further reducing the fluid's flow rate.

[0033] The top of the circulation channel 210 passes through the second inclined surface 242; the circulation channel 210 includes a first wall 211, which is arranged at an angle and extends from the edge of the second plane 241 to the middle of the first plane 231, so that the fluid enters the circulation channel 210 from the second inclined surface 242, and part of the fluid in the circulation channel 210 enters the converging annular groove 220 from the top of the converging annular groove 220, and part of the fluid enters the converging annular groove 220 from the side of the converging annular groove 220.

[0034] In some embodiments, the top of the circulation channel 210 passes through the second inclined surface 242. At the same time, since the side wall of the first buffer member 200 abuts against the inner wall of the shell 300, the circulation channel 210 extends to the edge of the second plane 241, so that the fluid in the buffer space 140 enters the circulation channel 210 through the second inclined surface 242.

[0035] In some specific embodiments, the circulation channel 210 includes a first wall 211, a second wall, and a third wall. Since the circulation channel 210 extends through the first inclined surface 232, the second inclined surface 242, and the sidewalls of the first buffer 200, the circulation channel 210 only includes the aforementioned three sidewalls. The second wall and the third wall are disposed opposite each other, and the first wall 211 connects the second wall and the third wall, respectively. Furthermore, the first wall 211 is disposed opposite the sidewalls of the first buffer 200. More specifically, the first wall 211 is inclined, extending from the edge of the second plane 241 toward the center of the first plane 231, such that the circulation channel 210 extends through a portion of the top wall of the converging annular groove 220. As the fluid within the circulation channel 210 enters the converging annular groove 220, some of the fluid enters the converging annular groove 220 from the side, while the remaining fluid enters the converging annular groove 220 from the top, thereby facilitating mixing of the fluids within the multiple circulation channels 210 within the converging annular groove 220.

[0036] The inner wall of the shell 300 includes a first vertical section 320, an inclined section 330 and a second vertical section 340; the interval between the first vertical section 320 and the side wall of the first extension portion 110 is defined as the first interval, and the interval between the second vertical section 340 and the side wall of the first extension portion 110 is defined as the second interval; the first interval is larger than the second interval; the inclined section 330 is inclined and connects the first vertical section 320 and the second vertical section 340, and the inclined section 330 is used to block the fluid to slow down the flow rate of the fluid.

[0037] In some embodiments, the inner wall of the shell 300 includes a first vertical section 320, an inclined section 330 and a second vertical section 340 from top to bottom; for the sake of convenience of description, the interval between the first vertical section 320 and the side wall of the first extension portion 110 is defined as the first interval, and the interval between the second vertical section 340 and the side wall of the first extension portion 110 is defined as the second interval; wherein, the first interval is greater than the second interval, that is, the second vertical section 340 is closer to the first extension portion 110.

[0038] In some specific embodiments, the inclined section 330 connects the first vertical section 320 and the second vertical section 340, so that the inclined section 330 is set at an angle, wherein the inclined section 330 is set for the second pipeline 130, so that the fluid flowing through the second pipeline 130 can impact the inclined section 330 to reduce the flow rate of the fluid. At the same time, since the inclined section 330 is set at an angle, the inclined section 330 has a guiding function, so that the fluid can flow to the second interval, so that the fluid flows through the circulation channel 210 and is discharged.

[0039] The dual-fluid nozzle also includes a second buffer member 400, which is arranged on the side wall of the first extension portion 110, and there is a third gap between the second buffer member 400 and the first vertical section 320 to allow fluid to pass through; the top wall of the second buffer member 400 is arranged to be inclined so that the fluid flowing through the second pipeline 130 is blocked by the second buffer member 400 and flows to the third gap; after flowing through the third gap, it is blocked by the inclined section 330 and flows to the circulation channel 210.

[0040] In some embodiments, the two-fluid nozzle may further include a second buffer member 400. Specifically, when the two-fluid nozzle includes the second buffer member 400, the second buffer member 400 is disposed on the sidewall of the first extension portion 110. The second buffer member 400 may be mounted by snap-fitting, bonding, or integrally formed, without limitation herein, provided that the second buffer member 400 can be fixed to the sidewall of the first extension portion 110. A third gap is defined between the sidewall of the second buffer member 400 and the first vertical section 320, allowing fluid to pass through the third gap.

[0041] In some specific embodiments, the outlet of the second pipeline 130 is set for the second buffer member 400 so that the fluid flowing through the second pipeline 130 first impacts the surface of the second buffer member 400 to reduce the impact force and flow rate of the fluid flowing through the second pipeline 130.

[0042] In some more specific embodiments, the top wall of the second buffer component 400 is inclined, and the top wall of the second buffer component 400 is inclined from the middle of the second buffer component 400 toward the edge, so that the middle of the second buffer component 400 is higher than the edge; the fluid flowing through the second pipeline 130 will impact the top wall of the second buffer component 400. Since the top wall of the second buffer component 400 is inclined, the top wall of the second buffer component 400 also has a guiding function, which can guide the fluid in contact with the top wall of the second buffer component 400 to the third interval; that is, the fluid flowing through the second pipeline 130 will first enter the buffer space 140, contact the top wall of the second buffer component 400 in the buffer space 140, and under the guiding action of the top wall of the second buffer component 400, after passing through the third interval, contact the inclined section 330, and finally flow through the circulation channel 210 and be discharged through the liquid outlet 310.

[0043] The dual-fluid nozzle further includes a second buffer member 400 , which is disposed on the sidewall of the first extension portion 110 and abuts against the first vertical section 320 . A plurality of buffer holes 410 are formed through the second buffer member 400 for passing fluid.

[0044] In some embodiments, the inner wall of the second buffer member 400 is arranged on the side wall of the first extension portion 110, and the outer wall is in contact with the first vertical section 320. At the same time, a buffer hole 410 is also provided on the second buffer member 400, and the buffer hole 410 penetrates the second buffer member 400 along the axial direction of the liquid outlet body 100.

[0045] In some specific embodiments, a plurality of buffer holes 410 are provided on the second buffer component 400, and the plurality of buffer holes 410 are circumferentially spaced apart on the second buffer component 400; the fluid flowing through the second pipeline 130 contacts the top wall of the second buffer component 400 and then flows down through the buffer holes 410, thereby further adjusting the flow rate and impact force of the fluid flowing through the second pipeline 130.

[0046] The embodiments of the present application also disclose a substrate processing device, which is used to process wafers. Specifically, the substrate processing device is used to clean wafers. Specifically, the substrate processing device includes the above-mentioned dual-fluid nozzle, a carrying part 500 and a supply part; The carrying portion 500 is used to carry the wafer; The dual-fluid nozzle is disposed corresponding to the supporting portion 500 to spray fluid toward the wafer on the supporting portion 500; The supply part includes a supply device 600, a first supply pipeline 610 and a second supply pipeline 620. One end of the first supply pipeline 610 is connected to the supply device 600, and the other end is connected to the first pipeline 120; one end of the second supply pipeline 620 is connected to the supply device 600, and the other end is connected to the second pipeline 130.

[0047] In some embodiments, the substrate processing apparatus includes a supporting portion 500, which includes a support member 510 and a carrier member 520. The support member 510 is fixedly disposed and can be placed on the ground or other supportable location to ensure the stability of the supporting portion 500. The carrier member 520 is connected to the support member 510 by bonding, clamping, or integral molding, etc., which are not limited herein, and the support member 510 is mainly capable of stably supporting the carrier member 520. The carrier member 520 is used to carry the wafer 520.

[0048] In some specific embodiments, the nozzle is disposed corresponding to the supporting portion 500. Specifically, the nozzle is disposed corresponding to the supporting member 520 of the supporting portion 500. Since the supporting member 520 can be placed on the wafer, after the wafer is placed on the supporting member 520, the wafer is placed between the dual-fluid nozzle and the supporting member 520, so that the dual-fluid nozzle can spray fluid toward the wafer.

[0049] In some more specific embodiments, the supply portion includes a supply device 600, a first supply line 610, and a second supply line 620. The supply device 600 includes a first supply element 630 and a second supply element 640. One end of the first supply line is connected to the supply device 600 and the other end is connected to the first line 120. The second supply line 620 is connected to the supply device 600 at one end and to the second line 130 at the other end. Specifically, the first supply line 610 is connected to the first supply element 630 at one end and to the first line 120 at the other end. The second supply line 620 is connected to the second supply element 640 at one end and to the second line 130 at the other end. The first supply element 630 is used to supply liquid, and the second supply element 640 is used to supply gas. Liquid can enter the first line 120 through the first supply line 610, and gas can enter the second line 130 through the second supply line 620, thereby facilitating wafer cleaning. In some more specific embodiments, the carrier 520 is a rotary chuck, which is a prior art and will not be described in detail here.

[0050] The substrate processing device further includes a control section, which includes: The lifting mechanism 700 is connected to the dual-fluid nozzle to drive the dual-fluid nozzle to move; The rotating mechanism 800 is connected to the carrying part 500 to drive the carrying part 500 to rotate.

[0051] In some embodiments, the substrate processing equipment also includes a control part, which includes a lifting mechanism 700 and a rotating mechanism 800, wherein the lifting mechanism 700 is used to control and adjust the position of the dual-fluid nozzle in the vertical direction to adjust the distance between the dual-fluid nozzle and the end face of the supporting part 500; the rotating mechanism 800 is used to drive the supporting part 500 to rotate, thereby driving the wafer to rotate, so as to facilitate the wafer cleaning process.

[0052] In some specific embodiments, the lifting mechanism 700 is connected to the dual-fluid nozzle by bonding, clamping, or bolting, without limitation. The primary focus is on the lifting mechanism 700 being able to drive the dual-fluid nozzle vertically upward or downward, or horizontally. More specifically, the lifting mechanism 700 can be an electric cylinder, a pneumatic cylinder, or other device capable of driving the dual-fluid nozzle. The primary focus is on the ability to drive the dual-fluid nozzle horizontally.

[0053] In some specific embodiments, the rotating mechanism 800 is connected to the bearing portion 500 by bonding, clamping, or bolting, etc., which is not limited here, and the rotating mechanism 800 is mainly capable of driving the bearing portion 500 to rotate. This is a prior art and will not be described in detail here.

[0054] In some more specific embodiments, the median diameter of the droplet volume supplied by the two-fluid nozzle is less than 22 microns, and more preferably the median diameter of the droplet volume is about 15 microns. In order to obtain an excellent particle removal rate. When the gas flow rate is 30-35 L / min, the median diameter of the droplet volume is about 15 microns, and when the gas flow rate is 20-22 L / min, the median diameter of the droplet volume is about 22 microns. Among them, the liquid flowing through the first pipeline 120 can be a carbon dioxide aqueous solution, or it can be pure water, a mixture of ammonia water, hydrogen peroxide solution and water. The gas ejected from the above-mentioned two-fluid nozzle can form a circular ring surrounding the liquid outlet under the restriction of the converging ring groove 220. At this time, the outer diameter of the gas outlet of the circular ring is preferably greater than 2.5 mm and less than 3.3 mm. The width of the circular ring is greater than 0.1 mm and less than 0.3 mm.

[0055] In some more specific embodiments, the second supply member 640 supplies gas to the second pipeline 130 at a flow rate of more than 10 liters per minute and less than 40 liters per minute. In actual use, different flow rates are used for different process nodes to ensure minimal damage to the substrate pattern while achieving the best particle removal effect.

[0056] In some more specific embodiments, when the two-fluid nozzle supplies droplets of the aforementioned processing liquid to a wafer, the distance between the two-fluid nozzle and the wafer surface is 5-10 mm, thereby maintaining a high median diameter of the droplets on the substrate surface. More specifically, this can inhibit or prevent the droplets from contacting each other and coalescing into larger droplets as they reach the substrate surface.

[0057] In some more specific embodiments, control valves are provided on both the first supply line 610 and the second supply line 620. The valve on the first supply line 610 is used to control the on / off state of the first supply line 610 and adjust the flow rate of the first supply line 610; the valve on the second supply line 620 is used to control the on / off state of the second supply line 620 and adjust the flow rate of the second supply line 620. This is prior art and will not be described in detail here.

[0058] The implementation principle of a dual-fluid nozzle and substrate processing equipment in an embodiment of the present application is to place a wafer on a supporting part 500, and adjust the distance between the dual-fluid nozzle and the supporting part 500 by a lifting mechanism 700. When the distance between the two is appropriate, the dual-fluid nozzle is controlled to spray fluid. At the same time, since a first buffer member 200 and a second buffer member 400 are provided in the dual-fluid nozzle, the impact force of the gas flowing through the dual-fluid nozzle on the wafer surface is weakened, thereby reducing damage to the wafer surface; when cleaning the surface of the wafer, the wafer set on the supporting part 520 is rotated by the rotating mechanism 800, and the lifting mechanism 700 drives the dual-fluid nozzle to move in a vertical direction or a horizontal direction to clean the wafer. The dual-fluid nozzle proposed in this invention achieves smaller particle size than traditional dual-fluid nozzles at equivalent flow rates. With a gas flow rate of 30-35 L / min, the median droplet diameter (MDD) is approximately 15 microns. This provides superior cleaning performance at advanced process nodes below 28 nm. For mature process nodes above 28 nm, a MDD of 22 microns is achieved with a gas flow rate of only 20-22 L / min, resulting in excellent cleaning performance. Low flow rates minimize pattern damage and improve yield. Furthermore, the dual-fluid nozzle's co-directional flow of gas and liquid allows the air and liquid inlet pipes to be placed inside the support arm, reducing space and eliminating the issues of complex piping and inconvenience.

[0059] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations of these embodiments are possible. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the invention described herein is susceptible to other embodiments and may be practiced or implemented in a variety of ways.

Claims

1. A two-fluid nozzle, characterized in that: The invention comprises a liquid outlet body (100), wherein the end of the liquid outlet body (100) has a first extension portion (110); a first pipeline (120) and a second pipeline (130) are provided on the liquid outlet body (100), wherein the first pipeline (120) passes through the liquid outlet body (100) and the first extension portion (110), and the second pipeline (130) passes through the liquid outlet body (100); A first buffer member (200) is provided on the outer wall of the first extension portion (110); a plurality of flow channels (210) are provided on the first buffer member (200); The shell (300) has a liquid outlet (310). The shell (300) is sleeved on the liquid outlet body (100), and the inner wall of the shell (300) abuts against the side wall of the first buffer member (200); the inner wall of the shell (300), the end of the liquid outlet body (100), the end of the first buffer member (200) and the side wall of the first extension portion (110) surround and form a buffer space (140). The buffer space (140) is communicated with the second pipeline (130). The buffer space (140) is used to gather the fluid in the second pipeline (130) to slow down the flow rate. The fluid in the buffer space (140) flows through the circulation channel (210) and is mixed with the liquid in the first pipeline (120) and discharged through the liquid outlet (310).

2. The two-fluid nozzle according to claim 1, characterized in that: A convergence annular groove (220) is provided at the bottom of the first buffer (200), and the circulation channel (210) is connected to the convergence annular groove (220), so that the fluid in the plurality of circulation channels (210) converges in the convergence annular groove (220) and is discharged through the liquid outlet (310).

3. The two-fluid nozzle according to claim 2, characterized in that: The bottom of the first buffer (200) has a first boss (230), the first boss (230) has a first plane (231) and a first inclined surface (232), and the two ends of the first inclined surface (232) extend to the first plane (231) and the side wall of the first buffer (200) respectively; the first plane (231) is used to open the converging annular groove (220), and the first inclined surface (232) abuts against the inner wall of the shell (300); The circulation channel (210) passes through the first plane (231) and the first inclined surface (232), so that part of the fluid is blocked by the housing (300) and then enters the converging annular groove (220).

4. The two-fluid nozzle according to claim 3, characterized in that: The top of the first buffer (200) has a second boss (240), the second boss (240) has a second plane (241) and a second inclined surface (242), and the two ends of the second inclined surface (242) extend to the second plane (241) and the side wall of the first buffer (200) respectively; one side of the circulation channel (210) passes through the side wall of the first buffer (200), and the other side extends to the second plane (241), so that the circulation channel (210) is set at an angle.

5. The two-fluid nozzle according to claim 4, characterized in that: The top of the circulation channel (210) passes through the second inclined surface (242); the circulation channel (210) includes a first wall (211), the first wall (211) is inclined and extends from the edge of the second plane (241) to the middle of the first plane (231), so that the fluid enters the circulation channel (210) from the second inclined surface (242), part of the fluid in the circulation channel (210) enters the converging annular groove (220) from the top of the converging annular groove (220), and part of the fluid enters the converging annular groove (220) from the side of the converging annular groove (220).

6. The two-fluid nozzle according to claim 1, characterized in that: The inner wall of the shell (300) includes a first vertical section (320), an inclined section (330) and a second vertical section (340); the interval between the first vertical section (320) and the side wall of the first extension portion (110) is defined as a first interval, and the interval between the second vertical section (340) and the side wall of the first extension portion (110) is defined as a second interval; the first interval is greater than the second interval; the inclined section (330) is inclined and connects the first vertical section (320) and the second vertical section (340), and the inclined section (330) is used to block the fluid to slow down the flow rate of the fluid.

7. The two-fluid nozzle according to claim 6, characterized in that: The invention also includes a second buffer member (400), which is arranged on the side wall of the first extension portion (110), and a third gap is provided between the second buffer member (400) and the first vertical section (320) for passing fluid; the top wall of the second buffer member (400) is arranged to be inclined so that the fluid flowing through the second pipeline (130) is blocked by the second buffer member (400) and then flows to the third gap; after flowing through the third gap, the fluid is blocked by the inclined section (330) and flows to the circulation channel (210).

8. The two-fluid nozzle according to claim 6, characterized in that The invention also includes a second buffer member (400), which is arranged on the side wall of the first extension portion (110), and the side wall of the second buffer member (400) is in contact with the first vertical section (320); a plurality of buffer holes (410) are formed through the second buffer member (400) to allow fluid to pass through.

9. A substrate processing device, characterized in that: It comprises the dual-fluid nozzle according to any one of claims 1 to 8, a carrying portion (500) and a supply portion; The carrying portion (500) is used for carrying a wafer; The dual-fluid nozzle is arranged corresponding to the supporting portion (500) to spray fluid toward the wafer on the supporting portion (500); The supply part comprises a supply device (600), a first supply pipeline (610) and a second supply pipeline (620), wherein one end of the first supply pipeline (610) is connected to the supply device (600), and the other end is connected to the first pipeline (120); one end of the second supply pipeline (620) is connected to the supply device (600), and the other end is connected to the second pipeline (130).

10. The substrate processing equipment according to claim 9, wherein Also included is a control section, the control section including: a lifting mechanism (700), connected to the dual-fluid nozzle to drive the dual-fluid nozzle to move; The rotating mechanism (800) is connected to the bearing part (500) to drive the bearing part (500) to rotate.

Images