Automatic photoresist coating and drying equipment and method for wafer

Abstract

The invention relates to automatic photoresist coating and drying equipment and method for wafers, and relates to the technical field of semiconductor preparation, the automatic photoresist coating and drying equipment for the wafers comprises a base and further comprises a wafer placing table, the wafer placing table is fixedly connected to the outer wall of the top end of the base, and the wafer placing table is fixedly connected to the outer wall of the top end of the base; the outer wall of the top end of the base is fixedly connected with a gluing head; the using method of the automatic photoresist coating and drying equipment for the wafer comprises the following steps that S1, the wafer to be coated is placed on a wafer placing table, the wafer is grabbed through an automatic gripper, and a wafer suction cup is jacked upwards through an electric push rod in a set of photoresist coating and spinning table; through the arrangement of the glue coating and spinning tables, the baking modules and the like, a wafer to be baked can be grabbed through the automatic grabber and placed in the glue coating and spinning tables, glue coating operation is conducted through the glue coating head, the two glue coating and spinning tables and the two baking modules are arranged and can be alternately used, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an automated photoresist coating and drying device and method for wafers. Background Art

[0002] At present, wafer photoresist coating and drying equipment is a key equipment used in the semiconductor manufacturing process to evenly coat photoresist on the wafer surface and perform drying treatment. It uses the coating module to accurately coat the photoresist on the wafer surface to form a film of uniform thickness. The drying module is then used to heat the coated wafer to evaporate the solvent in the photoresist and solidify it to meet the requirements of the subsequent photolithography process for the film performance. The accuracy and stability of this equipment directly affect the process yield and performance parameters of semiconductor devices.

[0003] In some existing technologies, the operator is required to hold a glue-dropping tool filled with photoresist, such as a dropper, syringe, etc., to evenly apply the glue liquid to the center of the wafer, and then place the wafer on the suction cup of the glue-spinning machine, start the equipment to use centrifugal force to throw out the excess glue liquid along the edge, and finally form a glue film of uniform thickness on the surface of the substrate. The amount of glue applied during the whole process is completely controlled by the operator, and manual control may not be able to control it more accurately, resulting in more or less glue applied, and the efficiency of manual operation is low, affecting the production rate.

[0004] In response to the above-mentioned related technologies, an automated photoresist coating and drying device and method for wafers are proposed. Summary of the Invention

[0005] The purpose of this application is to provide an automated photoresist coating and drying device and method for wafers.

[0006] In the first aspect, the present application provides an automated photoresist coating and drying device for wafers, which adopts the following technical solutions: An automated photoresist coating and drying device for wafers, comprising a base and: Wafer placement table, the wafer placement table is fixedly connected to the top outer wall of the base, the top outer wall of the base is fixedly connected with a glue coating head, the top outer wall of the base is fixedly connected with a baking module, the top outer wall of the base is fixedly connected with an automatic gripper, the top outer wall of the base is fixedly connected with a glue coating and throwing table, the inner wall of the glue coating and throwing table is provided with an electric push rod through a cleaning mechanism, the movable end of the electric push rod is provided with a wafer suction cup, and the bottom outer wall of the glue coating and throwing table is fixedly connected with a collection mechanism; Wherein, the cleaning mechanism includes a motor, and the output shaft of the motor is fixedly connected to the rotating rod; the collecting mechanism includes a fixed block, and the inner wall of the fixed block is clamped with the collecting box.

[0007] Preferably, a square groove is provided on the outer wall of the rotating rod, a moving rod is slidably connected to the inner wall of the rotating rod, a square block is elastically connected to the inner wall of the moving rod through an elastic member A, a handle is fixedly connected to the outer wall of the moving rod, a convex rod is fixedly connected to the outer wall of the gluing and glue throwing platform, a sloped bottom is fixedly connected to the inner wall of the gluing and glue throwing platform, through grooves are provided on the outer wall of the sloped bottom, a rotating block is fixedly connected to the outer wall of the rotating block, a scraper is fixedly connected to the outer wall of the rotating block, and a groove is provided on the outer wall of the rotating block.

[0008] Preferably, the motor is fixedly connected to the top outer wall of the base, the rotating rod passes through the outer wall of the bottom end of the glue coating and spinning platform and the inclined bottom, and the handle passes through the outer wall of the rotating rod.

[0009] Preferably, one end of the elastic member A is fixedly connected to the outer wall of the square block, the other end of the elastic member A is fixedly connected to the inner wall of the moving rod, the outer wall of the square block is slidingly connected to the inner wall of the moving rod, and the square block is clamped in the square groove.

[0010] Preferably, the protruding rod is engaged with the groove, the protruding rod passes through the outer wall of the rotating rod, and the scraper contacts the inner wall of the glue coating and glue throwing platform.

[0011] Preferably, the inner wall of the fixed block is elastically connected to the limiting block through an elastic member B, the inner wall of the fixed block is slidably connected to a sliding rod, the inner wall of the fixed block is slidably connected to a trapezoidal block, and a limiting groove is provided on the outer wall of the collecting box.

[0012] Preferably, the fixing block is fixedly connected to the outer wall of the bottom end of the glue coating and spinning platform, and the outer wall of the collecting box is in contact with the inner wall of the fixing block.

[0013] Preferably, one end of the elastic member B is fixedly connected to the outer wall of the limiting block, and the other end of the elastic member B is fixedly connected to the inner wall of the fixing block.

[0014] Preferably, the limit block is engaged with the limit groove, the limit block is slidably connected to the inner wall of the fixed block, one end of the sliding rod is slidably connected to the outer wall of the trapezoidal block, the other end of the sliding rod is fixedly connected to the outer wall of the limit block, and the trapezoidal block passes through the outer wall of the fixed block.

[0015] In a second aspect, the present application also proposes a method for using an automated photoresist coating and drying device for wafers, comprising the following steps: S1. Place the wafer to be coated on the wafer placement table. The wafer is grabbed by an automatic gripper. A set of electric push rods in the coating and spinning table lift the wafer suction cup upward. The automatic gripper transfers the wafer to the wafer suction cup, and the wafer suction cup generates suction to fix the wafer. S2, the electric push rod moves downward, and the glue coating head coats the wafer with glue. After the glue coating is completed, the motor starts to drive the rotating rod, the electric push rod and the wafer suction cup to rotate, and the glue is thrown off the wafer; S3. After the glue is spun off, the electric push rod drives the wafer suction cup to rise again, and the automatic gripper grabs the wafer and moves it to a set of wafer suction cups of the baking module for fixation and baking. After the wafer is baked, the automatic gripper grabs it and puts it in the storage position for storage. S4. Then the automatic gripper grabs another wafer and repeats the above steps to continuously complete the wafer coating and drying work.

[0016] In summary, this application includes at least one of the following beneficial technical effects: 1. The present invention is provided with a glue coating and spinning table, a baking module, etc., and an automatic gripper can grab the wafer to be baked and place it on the glue coating and spinning table. The glue coating operation is performed by the glue coating head, and the motor is used to rotate the wafer suction cup and the wafer at a high speed to spin the glue. After the glue coating and spinning are completed, the automatic gripper can transfer the wafer to the baking module for baking operation. It is more convenient and does not require manual glue coating by an operator. In addition, two groups of glue coating and spinning tables and baking modules are provided, which can be used alternately, thereby improving work efficiency. 2. The present invention provides a cleaning mechanism. During the process of gluing and throwing glue, the protruding rod does not contact the groove and does not drive the scraper to rotate. After the gluing and throwing glue is completed, the square block can be pressed and the movable rod can be moved downward to make the protruding rod engage in the groove. At this time, the motor can be started to drive the rotating block and the scraper to rotate slowly through the protruding rod to scrape and clean the glue remaining on the inner wall and the bottom surface of the inclined surface of the gluing and throwing glue table. This avoids the problem of using a set of motors for the scraper and the wafer suction cup to save costs, which causes the scraper to rotate with it during the high-speed rotation of the gluing and throwing glue, causing greater wear. 3. The present invention sets a collection mechanism. By pressing the trapezoidal block, the limit block moves to both sides and breaks away from the limit groove, so that the collection box can be released from the limit and removed for cleaning. Similarly, when installing the collection box, press the trapezoidal block and place the collection box into the fixing block. The limit block is engaged with the limit groove to complete the fixing of the collection box. The operation is relatively convenient and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application; Figure 2 This is a schematic diagram of the explosion structure of the glue coating and spinning table, electric push rod, and wafer suction cup in Example 1 of the present application; Figure 3 This is a schematic diagram of the cross-sectional structure of the gluing and spinning table and the inclined bottom of Example 1 of the present application; Figure 4This is a schematic diagram of the exploded structure of the rotating rod, electric push rod, and wafer suction cup in the first embodiment of the present application; Figure 5 1. It is a cross-sectional view of the rotating rod and an exploded structural diagram of the electric push rod of the first embodiment of the present application; Figure 6 This is a schematic cross-sectional view of the fixing block according to the second embodiment of the present application; Figure 7 This is the second embodiment of the present application Figure 6 A partial enlarged schematic diagram of part A.

[0018] Explanation of the accompanying reference numerals: 1. Base; 2. Glue coating and spinning table; 3. Cleaning mechanism; 301. Motor; 302. Rotating rod; 303. Rotating block; 304. Scraper; 305. Groove; 306. Moving rod; 307. Handle; 308. Elastic part A; 309. Square block; 310. Protruding rod; 311. Through groove; 312. Slanted bottom; 313. Square groove; 4. Collecting mechanism; 401. Fixed block; 402. Collecting box; 403. Limiting groove; 404. Sliding rod; 405. Trapezoidal block; 406. Elastic part B; 407. Limiting block; 5. Automatic gripper; 6. Baking module; 7. Gluing head; 8. Wafer placement table; 9. Electric push rod; 10. Wafer suction cup. DETAILED DESCRIPTION

[0019] The following combination Figures 1 to 7 , further details of this application are given.

[0020] Example 1 An automated photoresist coating and drying equipment for wafers, please refer to Figures 1 to 5 , including a base 1, and also including: a wafer placement table 8, the wafer placement table 8 is fixedly connected to the top outer wall of the base 1, the top outer wall of the base 1 is fixedly connected with a glue coating head 7, the top outer wall of the base 1 is fixedly connected with a baking module 6, the top outer wall of the base 1 is fixedly connected with an automatic gripper 5, the top outer wall of the base 1 is fixedly connected with a glue coating and throwing platform 2, the inner wall of the glue coating and throwing platform 2 is provided with an electric push rod 9 through a cleaning mechanism 3, the movable end of the electric push rod 9 is provided with a wafer suction cup 10, and the bottom outer wall of the glue coating and throwing platform 2 is fixedly connected with a collecting mechanism 4; The cleaning mechanism 3 includes a motor 301 , the output shaft of the motor 301 is fixedly connected to a rotating rod 302 ; the collecting mechanism 4 includes a fixed block 401 , the inner wall of which is clamped with a collecting box 402 .

[0021] Adopting the above scheme: the wafer to be coated with glue can be placed on the wafer placement table 8, ready for the glue coating operation, the automatic gripper 5 can move up and down, and can rotate to grab and move the wafer; the glue coating and glue throwing table 2 and the baking module 6 are both provided with a wafer suction cup 10, and the wafer suction cup 10 is a prior art. After the wafer is placed on the wafer suction cup 10 by the automatic gripper 5, suction can be generated on the bottom of the wafer by generating negative pressure to fix it; after the wafer is grabbed by the automatic gripper 5, the glue coating and glue throwing table can be started 2, so that it drives the wafer suction cup 10 to move up and above the top of the glue coating and glue throwing platform 2. The automatic gripper 5 can fix the wafer on the wafer suction cup 10, and then move the electric push rod 9 down, so that the wafer suction cup 10 drives the wafer to move to the inside of the glue coating and glue throwing platform 2, and the glue coating head 7 can be used to coat the surface of the wafer with glue. During the gluing process, the motor 301 can drive the rotating rod 302 and the electric push rod 9 and the wafer suction cup 10 to rotate, so that the wafer rotates synchronously at high speed, making the glue coating more uniform.

[0022] After the glue coating is completed, the electric push rod 9 drives the wafer suction cup 10 to move up again, and the wafer suction cup 10 releases the suction force on the wafer. The automatic gripper 5 removes the wafer and transfers it to a wafer suction cup 10 of a baking module 6. After the wafer is fixed, it can be baked to dry the surface glue and complete one operation; the glue coating and throwing table 2 and the baking module 6 are each provided with two groups, which can be used alternately, thereby improving work efficiency and eliminating the need for manual glue coating on the wafer surface, which is more efficient.

[0023] like Figures 3 to 5 As shown, a square groove 313 is provided on the outer wall of the rotating rod 302, and a moving rod 306 is slidably connected to the inner wall of the rotating rod 302. The inner wall of the moving rod 306 is elastically connected to a square block 309 through an elastic member A308. The outer wall of the moving rod 306 is fixedly connected to a handle 307, and the outer wall of the moving rod 306 is fixedly connected to a convex rod 310. The inner wall of the gluing and glue coating platform 2 is fixedly connected to a sloped bottom 312. The sloped bottom 312 and the inner wall of the gluing and glue coating platform 2 are both provided with a through groove 311. The outer wall of the sloped bottom 312 is fixedly connected to a rotating block 303, the outer wall of the rotating block 303 is fixedly connected to a scraper 304, and the outer wall of the rotating block 303 is provided with a groove 305.

[0024] The above scheme is adopted: when the wafer rotates in the glue coating and throwing table 2, the excess glue on its surface will be thrown onto the inner wall of the glue coating and throwing table 2, and the glue remaining on its inner wall can be scraped and cleaned by the cleaning mechanism 3, and enter the collection box 402 for collection, which can be recycled or centrally processed to avoid adhering to the inner wall of the glue coating and throwing table 2 and causing caking; the motor 301 is a prior art, which can drive the rotating rod 302 to rotate when started, and drive the electric push rod 9 at its top to rotate synchronously with the wafer suction cup 10 at high speed to perform the glue coating and throwing operation; since the operating speed of the motor 301 is too high during the glue coating and throwing process, if the scraper 304 rotates synchronously at this time, it will cause greater wear. By setting the cleaning mechanism 3, the scraper 304 can be kept stationary during the glue coating and throwing process, and after the operation is completed, the motor 301 is rotated at a low speed to drive the scraper 304 to slowly scrape along the inner wall of the glue coating and throwing table 2, reducing the wear of the scraper 304.

[0025] When the moving rod 306 moves to the point where the protruding rod 310 is out of contact with the groove 305 on the outer wall of the rotating block 303, the rotating rod 302 and the moving rod 306 can rotate synchronously. At this time, the scraper 304 can rotate and perform scraping and cleaning. When the moving rod 306 moves to the point where the protruding rod 310 is out of contact with the groove 305, the rotation of the rotating rod 302 will not drive the rotating block 303 to rotate, so that the scraper 304 is in a stationary state.

[0026] like Figures 3 to 5 As shown, the motor 301 is fixedly connected to the top outer wall of the base 1, the rotating rod 302 passes through the outer wall of the bottom end of the glue coating and glue throwing platform 2 and the inclined bottom 312, and the handle 307 passes through the outer wall of the rotating rod 302; one end of the elastic member A308 is fixedly connected to the outer wall of the square block 309, and the other end of the elastic member A308 is fixedly connected to the inner wall of the moving rod 306, the outer wall of the square block 309 is slidably connected to the inner wall of the moving rod 306, and the square block 309 is clamped with the square groove 313; the protruding rod 310 is clamped with the groove 305, the protruding rod 310 passes through the outer wall of the rotating rod 302, and the scraper 304 contacts the inner wall of the glue coating and glue throwing platform 2.

[0027] The above solution is adopted: the square groove 313 is provided with two groups, upper and lower. Under normal conditions, the elastic member A308 makes the square block 309 always engage with one group of square grooves 313 due to its own elastic force, which can fix the moving rod 306 and the rotating rod 302. The operator can press the square block 309 inward to compress the elastic member A308 and disengage it from the one group of square grooves 313, thereby releasing the limit of the moving rod 306 and moving the handle 307 to move it up and down; after the moving rod 306 moves up, the protruding rod 310 will engage with the groove 313. 05 is disengaged, at this time the square block 309 is engaged with a set of square grooves 313 above, and when it moves downward, the protruding rod 310 can be engaged with the groove 305, and the square block 309 is engaged with the square groove 313 below, maintaining the position of the moving rod 306; the scraper 304 is in contact with the inner wall of the glue coating and glue throwing platform 2 and the outer wall of the inclined bottom 312, and the glue thrown out will remain on the inner wall of the glue coating and glue throwing platform 2 and the outer wall of the inclined bottom 312. The glue scraped by the scraper 304 will flow out from the through groove 311 and flow into the collection box 402 for collection.

[0028] Example 2 like Figures 6 and 7 As shown, the inner wall of the fixed block 401 is elastically connected to the limiting block 407 through the elastic member B406, the inner wall of the fixed block 401 is slidably connected to the slide rod 404, the inner wall of the fixed block 401 is slidably connected to the trapezoidal block 405, and the outer wall of the collection box 402 is provided with a limiting groove 403.

[0029] The above-mentioned solution is adopted: two groups of limit blocks 407, elastic parts B406 and sliding rods 404 are provided, which are symmetrically distributed on the inner walls on both sides of the fixed block 401; the collection box 402 can be fixed in the fixed block 401 through the limit groove 403 and the limit block 407, and the opening of the collection box 402 corresponds to the position of the through groove 311, so that the glue can flow into the collection box 402; through the setting of the collection mechanism 4, the collection box 402 can be easily disassembled and installed, and it is convenient to remove it for cleaning.

[0030] like Figures 6 and 7 As shown, the fixed block 401 is fixedly connected to the outer wall of the bottom end of the glue coating and spinning platform 2, and the outer wall of the collecting box 402 contacts the inner wall of the fixed block 401; one end of the elastic member B406 is fixedly connected to the outer wall of the limit block 407, and the other end of the elastic member B406 is fixedly connected to the inner wall of the fixed block 401; the limit block 407 is engaged with the limit groove 403, and the limit block 407 is slidably connected to the inner wall of the fixed block 401, one end of the slide rod 404 is slidably connected to the outer wall of the trapezoidal block 405, and the other end of the slide rod 404 is fixedly connected to the outer wall of the limit block 407, and the trapezoidal block 405 passes through the outer wall of the fixed block 401.

[0031] The above solution is adopted: when not affected by external force, the elastic member B406 keeps the limit block 407 in a pop-up state due to the elastic force. At this time, the limit block 407 drives the slide bar 404 to a certain position, and the slide bar 404 contacts the short side slope of the trapezoidal block 405; when the trapezoidal block 405 is pressed against the inner wall of the fixed block 401, the slopes on both sides of the trapezoidal block 405 squeeze the slide bars 404 on both sides, so that the slide bars 404 drive the limit block 407 to move to both sides, and the limit block 407 moves to the fixed After the collecting box 402 is inserted into the inner wall of the block 401, the collecting box 402 can be placed into the fixing block 401 so that the limiting groove 403 corresponds to the position of the limiting block 407, and the trapezoidal block 405 is released. Under the elastic force of the elastic part B406, the limiting block 407 pops out and is inserted into the corresponding limiting groove 403 to complete the fixation; when removing the collecting box 402, the trapezoidal block 405 is also pressed to disengage the limiting block 407 from the limiting groove 403, so that the collecting box 402 can be quickly and conveniently released from its fixed state and removed.

[0032] The present application also provides a method for using an automated photoresist coating and drying device for wafers, comprising the following steps: S1. Place the wafer to be coated on the wafer placement table 8. The wafer is grabbed by the automatic gripper 5. A set of electric push rods 9 in the coating and spinning table 2 lift the wafer suction cup 10 upward. The automatic gripper 5 transfers the wafer to the wafer suction cup 10. The wafer is fixed by the suction force generated by the wafer suction cup 10. S2, the electric push rod 9 moves downward, and the glue coating head 7 applies glue to the wafer. After the glue coating is completed, the motor 301 starts to drive the rotating rod 302, the electric push rod 9 and the wafer suction cup 10 to rotate, and the glue is thrown off the wafer; S3. After the glue is thrown off, the electric push rod 9 drives the wafer suction cup 10 to rise again, and the automatic gripper 5 grabs the wafer and moves it to the wafer suction cup 10 of a group of baking modules 6 for fixation and baking. After the wafer is baked, the automatic gripper grabs it to the storage position for storage; S4, then the automatic gripper 5 grabs another wafer, and the above steps are repeated to continuously complete the wafer coating and drying work.

[0033] The working principle and use process of the present invention: Place the wafer to be coated with glue on the wafer placement table 8 to prepare for the subsequent gluing operation, start the automatic gripper 5, grab the wafer to be coated with glue on the wafer placement table 8, and then transfer the wafer to the gluing and glue throwing table 2; in this process, start the electric push rod 9 in the gluing and glue throwing table 2 to drive the wafer suction cup 10 to move up, higher than the top of the gluing and glue throwing table 2. After the automatic gripper 5 places the wafer on the wafer suction cup 10, the wafer suction cup 10 generates suction to the wafer to fix it, and the electric push rod 9 moves down again, and the wafer suction cup 10 drives the wafer to move to the inside of the gluing and glue throwing table 2. After the wafer is in place, the glue coating head 7 starts to coat the surface of the wafer with glue. At the same time, the motor 301 is started to drive the rotating rod 302 to rotate, thereby causing the electric push rod 9, the wafer suction cup 10 and the wafer to rotate synchronously at high speed to ensure uniform glue coating. At this time, since the protruding rod 310 of the moving rod 306 is disengaged from the groove 305 on the outer wall of the rotating block 303, the scraper 304 remains stationary. After the glue coating is completed, the electric push rod 9 drives the wafer suction cup 10 to move upward, the wafer suction cup 10 releases the suction on the wafer, the automatic gripper 5 removes the wafer, and transfers it to the wafer suction cup 10 of the baking module 6; after the wafer is fixed, the baking module 6 bakes it to dry the glue on the surface, completing a glue coating and drying operation; the glue coating and throwing table 2 and the baking module 6 are each provided with two groups, which can be used alternately. When one group is coating or baking, the other group can perform operations such as wafer placement and grabbing, thereby improving work efficiency.

[0034] After the gluing and drying operation is completed, some glue will remain on the inner wall of the gluing and glue-spinning platform 2. At this time, the operator can press the square block 309 inward to compress the elastic part A308 and disengage it from the upper set of square grooves 313, thereby releasing the limit of the moving rod 306 and moving the moving rod 306 downward by toggling the handle 307 so that the protruding rod 310 is engaged with the groove 305; then the motor 301 is started to rotate at a low speed, and the rotating block 303 and the scraper 304 are driven by the protruding rod 310 to slowly rotate along the inner wall of the gluing and glue-spinning platform 2 and the top surface of the inclined bottom 312 to scrape off the residual glue; the scraped glue flows out from the through groove 311 and flows into the collection box 402 for collection.

[0035] When there is too much glue in the collection box 402 and it needs to be cleaned, press the trapezoidal block 405 into the inner wall of the fixed block 401. The inclined surfaces on both sides of the trapezoidal block 405 squeeze the slide bars 404 on both sides, so that the slide bars 404 drive the limit blocks 407 to move to both sides. The limit blocks 407 are out of contact with the limit grooves 403, and the collection box 402 can be removed for cleaning. After the cleaning is completed, put the collection box 402 into the fixed block 401 so that the limit grooves 403 correspond to the positions of the limit blocks 407, release the trapezoidal block 405, and the limit blocks 407 pop out under the elastic force of the elastic part B406 and are stuck in the corresponding limit grooves 403, completing the fixed installation of the collection box 402. The equipment can continue to the next round of wafer glue coating and drying operations.

[0036] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. An automated photoresist coating and drying device for wafers, comprising a base (1), characterized in that: Also includes: A wafer placement table (8), wherein the wafer placement table (8) is fixedly connected to the top outer wall of the base (1), the top outer wall of the base (1) is fixedly connected to a glue coating head (7), the top outer wall of the base (1) is fixedly connected to a baking module (6), the top outer wall of the base (1) is fixedly connected to an automatic gripper (5), the top outer wall of the base (1) is fixedly connected to a glue coating and throwing table (2), the inner wall of the glue coating and throwing table (2) is provided with an electric push rod (9) through a cleaning mechanism (3), the movable end of the electric push rod (9) is provided with a wafer suction cup (10), and the bottom outer wall of the glue coating and throwing table (2) is fixedly connected to a collecting mechanism (4); Wherein, the cleaning mechanism (3) comprises a motor (301), and the output shaft of the motor (301) is fixedly connected to a rotating rod (302); The collecting mechanism (4) comprises a fixed block (401), and a collecting box (402) is clamped on the inner wall of the fixed block (401).

2. The automated photoresist coating and drying equipment for wafers according to claim 1, wherein: The outer wall of the rotating rod (302) is provided with a square groove (313), the inner wall of the rotating rod (302) is slidably connected to the moving rod (306), the inner wall of the moving rod (306) is elastically connected to the square block (309) via the elastic member A (308), the outer wall of the moving rod (306) is fixedly connected to the handle (307), the outer wall of the moving rod (306) is fixedly connected to the protruding rod (310), the inner wall of the gluing and glue-spreading platform (2) is fixedly connected to the inclined bottom (312), the inclined bottom (312) and the inner wall of the gluing and glue-spreading platform (2) are both provided with a through groove (311), the outer wall of the inclined bottom (312) is fixedly connected to the rotating block (303), the outer wall of the rotating block (303) is fixedly connected to the scraper (304), and the outer wall of the rotating block (303) is provided with a groove (305).

3. The wafer automated photoresist coating and drying equipment according to claim 2, characterized in that: The motor (301) is fixedly connected to the top outer wall of the base (1), the rotating rod (302) passes through the outer wall of the bottom end of the glue coating and spinning platform (2) and the inclined bottom (312), and the handle (307) passes through the outer wall of the rotating rod (302).

4. The automated photoresist coating and drying equipment for wafers according to claim 2, wherein: One end of the elastic member A (308) is fixedly connected to the outer wall of the square block (309), and the other end of the elastic member A (308) is fixedly connected to the inner wall of the moving rod (306). The outer wall of the square block (309) is slidably connected to the inner wall of the moving rod (306), and the square block (309) is snap-fitted to the square groove (313).

5. The automated photoresist coating and drying equipment for wafers according to claim 2, characterized in that: The protruding rod (310) is engaged with the groove (305), the protruding rod (310) passes through the outer wall of the rotating rod (302), and the scraper (304) contacts the inner wall of the glue coating and spinning platform (2).

6. The automated photoresist coating and drying equipment for wafers according to claim 1, characterized in that: The inner wall of the fixed block (401) is elastically connected to the limiting block (407) via an elastic member B (406), the inner wall of the fixed block (401) is slidably connected to a slide rod (404), the inner wall of the fixed block (401) is slidably connected to a trapezoidal block (405), and the outer wall of the collecting box (402) is provided with a limiting groove (403).

7. The automated photoresist coating and drying equipment for wafers according to claim 6, characterized in that: The fixed block (401) is fixedly connected to the outer wall of the bottom end of the glue coating and spinning platform (2), and the outer wall of the collecting box (402) is in contact with the inner wall of the fixed block (401).

8. The automated photoresist coating and drying equipment for wafers according to claim 6, characterized in that: One end of the elastic member B (406) is fixedly connected to the outer wall of the limiting block (407), and the other end of the elastic member B (406) is fixedly connected to the inner wall of the fixing block (401).

9. The automated photoresist coating and drying equipment for wafers according to claim 6, characterized in that: The limit block (407) is engaged with the limit groove (403), and the limit block (407) is slidably connected to the inner wall of the fixed block (401). One end of the slide rod (404) is slidably connected to the outer wall of the trapezoidal block (405), and the other end of the slide rod (404) is fixedly connected to the outer wall of the limit block (407). The trapezoidal block (405) passes through the outer wall of the fixed block (401).

10. A method for using an automated photoresist coating and drying device for wafers, applied to the automated photoresist coating and drying device for wafers as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Place the wafer to be coated on the wafer placement table (8), grab the wafer with the automatic gripper (5), and a set of electric push rods (9) in the coating and spinning table (2) lift the wafer suction cup (10) upwards. The automatic gripper (5) transfers the wafer to the wafer suction cup (10), and the wafer suction cup (10) generates suction to fix the wafer; S2, the electric push rod (9) moves downward, and the glue coating head (7) coats the wafer with glue. After the glue coating is completed, the motor (301) starts to drive the rotating rod (302), the electric push rod (9) and the wafer suction cup (10) to rotate, and the glue is thrown off the wafer; S3. After the glue is thrown off, the electric push rod (9) drives the wafer suction cup (10) to rise again, and the automatic gripper (5) grabs the wafer and moves it to the wafer suction cup (10) of a set of baking modules (6) for fixation and baking. After the wafer is baked, the automatic gripper grabs it and stores it in the storage position; S4, then the automatic gripper (5) grabs another wafer, and the above steps are repeated to continuously complete the wafer coating and drying work.

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