A polishing device for electronic package outline production

Abstract

The application relates to the technical field of electronic packaging, and more specifically discloses a polishing device for electronic packaging appearance production, which comprises a rotating push wheel, a motor, a wafer substrate and the like, is characterized in that the top end of the middle part of the inner ring of the rotating push wheel is provided with a positioning plate, the output shaft at the bottom end of the motor is fixedly connected with a hydraulic assembly, the output shaft at the bottom end of the hydraulic assembly is fixedly connected with the middle part of the top end of the positioning plate, and the bottom of the outer ring of the rotating push wheel is fixedly installed with a connecting block; the adjacent two polishing installation discs and polishing pieces are driven by the boost straight rods to respectively ascend and descend reciprocatingly one above the other; in the polishing process of the polishing pieces, the polishing pieces are separated from the wafer substrate for a short time, the contact surface of the wafer substrate for polishing is suspended in the air or the cooling liquid with a relatively low temperature, the wafer substrate is more favorable for heat dissipation of the polishing pieces, and the risk of residual thermal stress in the wafer substrate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and more particularly to a polishing device for producing electronic packaging outlines. Background Art

[0002] As wafer size increases (e.g., from 6 inches to 8 inches or larger), the surface area that needs to be processed increases significantly, which directly leads to the need for materials with higher hardness to complete the process. For high-hardness materials, third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have extremely high hardness and brittleness, which makes it more likely to have problems such as cracks, breakage or surface damage during the grinding and polishing process. These problems are especially serious on large-size wafers.

[0003] During the grinding and polishing process, residual stress may be generated inside the wafer due to the effects of mechanical stress and thermal stress. These residual mechanical and thermal stresses may cause the wafer to deform or crack in subsequent processes. Moreover, as the wafer size increases, the impact of residual stress may become more significant. After grinding and polishing, the wafer needs to be cleaned to avoid the adhesion of contaminants. However, due to factors such as electrostatic force, the debris generated during the grinding process will be adsorbed to the wafer surface and difficult to remove, which increases the complexity of the cleaning work. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a polishing device for producing the outline of an electronic package to solve the problems existing in the above-mentioned background technology.

[0005] The application provides the following technical scheme: a polishing device for electronic package appearance production, comprising a rotating push wheel, a motor, a wafer substrate, and further comprising: a positioning plate arranged at the top end of the middle part of the inner ring of the rotating push wheel, a hydraulic assembly fixedly connected to the output shaft at the bottom end of the motor, an output shaft at the bottom end of the hydraulic assembly fixedly connected to the middle part of the top end of the positioning plate, a connecting block fixedly installed at the bottom of the outer ring of the rotating push wheel, the connecting block being arranged in an annular array around the bottom of the outer ring of the rotating push wheel, a U-shaped rod fixedly installed at the bottom of the connecting block, a long shaft cam movably connected to the middle part of the bottom end of the U-shaped rod, one side of the long shaft cam provided with a counterweight and provided with a rotating groove, the long shaft cam movably connected to a connecting bent rod through the rotating groove, the connecting bent rod fixedly connected to the positioning plate through the top end of the rotating push wheel inner ring middle part, a boosting bent rod movably connected to the front and back surfaces of the long shaft cam close to the middle part, a boosting straight rod arranged below the boosting bent rod, a groove arranged at the top of the boosting straight rod and a connecting straight rod fixedly installed on the inner wall of the groove, the boosting straight rod movably connected to the bottom of the boosting bent rod through the connecting straight rod, a polishing mounting disc fixedly connected to the bottom of the boosting straight rod, a polishing piece arranged at the bottom end of the polishing mounting disc, the polishing mounting disc arranged in an annular array around the center point of the rotating push wheel, and a retaining disc arranged at the outside of the top of the polishing mounting disc.

[0006] Further, the boosting straight rods are arranged in two annular arrays around the center point of the rotating push wheel, the boosting straight rods close to the center point of the rotating push wheel are fixedly installed with an upper boosting rod one, the boosting straight rods away from the center point of the rotating push wheel are fixedly installed with an upper boosting rod two, the outside of the polishing piece is fixedly connected with a lower boosting rod, and the top end of the lower boosting rod is movably connected with an auxiliary cylinder.

[0007] Further, the auxiliary cylinder comprises a cylinder body, a limiting rod fixedly installed on the inner wall of the cylinder body, a rotating circular groove arranged on one side of the top of the lower boosting rod, the lower boosting rod movably connected to the limiting rod through the rotating circular groove, a reset spring arranged at the bottom of the inner wall of the cylinder body, one end of the reset spring fixedly connected to the middle part of the lower boosting rod, and the lower boosting rod elastically connected to the cylinder body through the reset spring.

[0008] Further, the bottom end of the upper boosting rod two is wedge-shaped and matched with the side of the top end of the lower boosting rod away from the rotating circular groove.

[0009] Further, the bottom end of the lower boosting rod is fixedly connected to the outside of the polishing layer, and the polishing layer is deformed when subjected to a right pulling force.

[0010] Further, the bottom end of the lower boosting rod is fixedly connected to the outside of the polishing layer, and the polishing layer is deformed when subjected to a right pulling force.

[0011] Furthermore, after the top end of the lower auxiliary pull rod is squeezed by the bottom end of the upper auxiliary pull rod, the lower auxiliary pull rod can rotate counterclockwise around the limiting rod, and the rotation angle is 0 to 25 degrees.

[0012] Technical effects and advantages of the present invention:

[0013] 1. This invention utilizes a booster rod to drive the two adjacent polishing mounting plates and polishing pads in a reciprocating upward and downward motion. During the polishing process, the polishing pads are briefly separated from the wafer substrate, allowing their contact surfaces with the wafer substrate to float above the surface, where they can come into contact with cooler air or coolant. This facilitates heat dissipation from the polishing pads and reduces the risk of residual thermal stress within the wafer substrate.

[0014] 2. This invention changes the contact path between the polishing pad and the wafer substrate, switching from downward pressure contact in the prior art to sweeping contact from above. This effectively reduces the risk of excessive mechanical stress within the wafer substrate during polishing, avoids cracks and breakage during polishing, and helps improve product production yield.

[0015] 3. After the return spring completes its reset function, the present invention retains a portion of its internal elastic potential energy. This residual elasticity can be used to eject and clean debris generated during the polishing process. This can pre-separate debris adsorbed on the wafer substrate by static electricity during the polishing process from the wafer substrate surface, facilitating the subsequent removal of debris during cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a schematic top view of the overall structure of the present invention.

[0018] Figure 3 This is a schematic top view of the rotating driving wheel structure of the present invention.

[0019] Figure 4 It is a schematic diagram of the structure of the booster assembly of the present invention.

[0020] Figure 5 This is a schematic structural diagram of the pulling-assisting assembly of the present invention.

[0021] Figure 6 Schematic diagram of the internal structure of the pulling-assisting assembly of the present invention.

[0022] Figure 7 This is a simplified diagram of the polishing process of the present invention. Figure 1 .

[0023] Figure 8 This is a simplified diagram of the polishing process of the present invention. Figure 2 .

[0024] Figure 9 This is a simplified diagram of the polishing process of the present invention. Figure 3 .

[0025] Figure 10 This is a simplified diagram of the polishing process of the present invention. Figure 4 .

[0026] Figure 11 It is a schematic structural diagram of the grinding sheet of the present invention.

[0027] The accompanying drawings are marked as follows: 1. Rotating push wheel; 2. Positioning plate; 3. Hydraulic assembly; 301. Connecting bent rod; 4. Motor; 5. Connecting block; 6. U-shaped rod; 7. Long-axis cam; 8. Boosting bent rod; 9. Connecting straight rod; 10. Boosting straight rod; 11. Grinding mounting plate; 12. Grinding sheet; 1201. Elastic base; 1202. Grinding layer; 13. Retaining plate; 14. Upper auxiliary pull rod one; 15. Upper auxiliary pull rod two; 16. Auxiliary cylinder; 1601. Cylinder body; 1602. Limiting rod; 1603. Reset spring; 17. Lower auxiliary pull rod; 1701. Rotating circular groove; 18. Wafer substrate. DETAILED DESCRIPTION

[0028] The technical solutions of the present invention will be described clearly and completely below in conjunction with the drawings in the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples. The polishing device for electronic packaging appearance production involved in the present invention is not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] Reference Figures 1 to 11The present invention provides a polishing device for producing the appearance of an electronic package, comprising a rotating driving wheel 1, a motor 4, and a wafer substrate 18. The device also comprises: a positioning plate 2 is provided at the top of the middle portion of the inner ring of the rotating driving wheel 1, an output shaft at the bottom end of the motor 4 is fixedly connected to a hydraulic assembly 3, an output shaft at the bottom end of the hydraulic assembly 3 is fixedly connected to the middle portion of the top end of the positioning plate 2, a connecting block 5 is fixedly installed at the bottom of the outer ring of the rotating driving wheel 1, the connecting blocks 5 are distributed in a ring array around the bottom of the outer ring of the rotating driving wheel 1, a U-shaped rod 6 is fixedly installed at the bottom of the connecting block 5, a long-axis cam 7 is movably connected to the middle portion of the bottom end of the U-shaped rod 6, a rotating groove is provided on one side of the long-axis cam 7 provided with a counterweight, and the long-axis cam 7 is movably connected to the long-axis cam 7 through the rotating groove thereon. The top of the connecting bent rod 301 passes through the middle of the inner ring of the rotating pushing wheel 1 and is fixedly connected to the positioning plate 2. The front and back sides of the long-axis cam 7 near the middle are respectively movably connected with the boosting bent rod 8. A boosting straight rod 10 is provided below the boosting bent rod 8. A groove is provided on the top of the boosting straight rod 10 and a connecting straight rod 9 is fixedly installed on the inner wall of the groove. The boosting straight rod 10 is movably connected to the bottom of the boosting bent rod 8 through the connecting straight rod 9. The bottom of the boosting straight rod 10 is fixedly connected with a grinding mounting disk 11. A grinding sheet 12 is provided at the bottom of the grinding mounting disk 11. The grinding mounting disks 11 are distributed in a circular array around the bottom of the center point of the rotating pushing wheel 1. A retaining disk 13 is provided on the outer side of the top of the grinding mounting disk 11.

[0030] The booster straight rods 10 are distributed in two circles around the center point of the rotating pushing wheel 1, and the upper booster straight rod 14 is fixedly installed on the booster straight rod 10 close to the center point of the rotating pushing wheel 1, and the upper booster straight rod 15 is fixedly installed on the booster straight rod 10 away from the center point of the rotating pushing wheel 1. The outer side of the grinding plate 12 is fixedly connected to the lower booster rod 17, and the top end of the lower booster rod 17 is movably connected to the auxiliary tube 16. The top end of the auxiliary tube 16 is movably connected to the booster straight rod 10 at different positions through the upper booster rod 14 and the upper booster rod 15.

[0031] The auxiliary cylinder 16 includes a cylinder body 1601, and a limiting rod 1602 is fixedly installed on the inner wall of the cylinder body 1601. A rotating circular groove 1701 is opened on one side of the top of the lower auxiliary pulling rod 17, and the lower auxiliary pulling rod 17 is movably connected with the limiting rod 1602 through the rotating circular groove 1701 thereon. A reset spring 1603 is provided at the bottom of the inner wall of the cylinder body 1601, and one end of the reset spring 1603 is fixedly connected to the middle part of the lower auxiliary pulling rod 17. The lower auxiliary pulling rod 17 is elastically connected to the cylinder body 1601 through the reset spring 1603.

[0032] The bottom end of the upper auxiliary pull rod 15 is wedge-shaped and cooperates with the side of the top end of the lower auxiliary pull rod 17 away from the rotating circular groove 1701.

[0033] The polishing sheet 12 includes an elastic base 1201 . The polishing sheet 12 is made of rubber material with a certain elasticity. A polishing layer 1202 is provided on the inner side of the elastic base 1201 .

[0034] The bottom end of the lower auxiliary pull rod 17 is fixedly connected to the outer side of the polishing layer 1202, and the polishing layer 1202 is deformed when subjected to a rightward pulling force.

[0035] After the top end of the lower auxiliary pull rod 17 is squeezed by the bottom end of the upper auxiliary pull rod 15 , the lower auxiliary pull rod 17 can rotate counterclockwise around the limiting rod 1602 , and the rotation angle is 0 to 25 degrees.

[0036] The working principle of the present invention is: after adjusting the wafer substrate 18 to be polished to a preset position, the motor 4 is turned on, and the motor 4 drives the hydraulic assembly 3 and the entire device below it to start rotating, and the entire device is adjusted to a preset height above the wafer substrate 18 (for specific height, refer to Figure 7 The hydraulic assembly 3 is turned on after the output shaft of the hydraulic assembly 3 pushes the connecting bent rod 301 fixedly connected thereto to perform an up and down reciprocating motion. At the same time, the connecting bent rod 301 pushes the end of the long-axis cam 7 with a counterweight to perform a reciprocating motion of 15 degrees clockwise or counterclockwise around the middle of the U-shaped rod 6, thereby realizing that the long-axis cam 7 drives the booster straight rods 10 on both sides thereof to respectively perform an up and down reciprocating motion; Figure 8 and Figure 9 : When the assist straight rod 10 moves downward, the upper auxiliary pull rod 15 fixedly connected thereto moves downward in the same direction and distance. During the downward movement of the upper auxiliary pull rod 15, its bottom end squeezes one side of the end of the lower auxiliary pull rod 17. After the lower auxiliary pull rod 17 is squeezed by the bottom of the upper auxiliary pull rod 15 at its top, it starts to rotate counterclockwise around the limit rod 1602. The bottom of the lower auxiliary pull rod 17 generates a pulling force on one side of the grinding plate 12, causing it to rotate counterclockwise. Figures 8 and 9 The upper auxiliary rod 15 is disconnected from the lower auxiliary rod 17, and the middle part of the lower auxiliary rod 17 begins to rotate clockwise around the limit rod 1602 under the elastic force of the return spring 1603. At this time, the bottom of the lower auxiliary rod 17 generates a thrust on one side of the grinding sheet 12 until the grinding layer 1202 and the wafer substrate 18 are squeezed and fitted together (for specific state, refer to Figure 10 ), the process of the grinding sheet 12 sweeping over the surface of the wafer substrate 18 is completed, and at the same time, a part of the elastic potential energy is still retained inside the reset spring 1603, which can eject and clean the debris generated during the grinding process.

[0037] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A polishing device for producing an electronic package shape, comprising a rotating driving wheel (1), a motor (4), and a wafer substrate (18), characterized in that: Also includes: A positioning plate (2) is provided at the top of the middle portion of the inner ring of the rotating driving wheel (1), an output shaft at the bottom end of the motor (4) is fixedly connected to a hydraulic assembly (3), and an output shaft at the bottom end of the hydraulic assembly (3) is fixedly connected to the middle portion of the top end of the positioning plate (2), a connecting block (5) is fixedly installed at the bottom of the outer ring of the rotating driving wheel (1), and the connecting blocks (5) are distributed in a circular array around the bottom of the outer ring of the rotating driving wheel (1), a U-shaped rod (6) is fixedly installed at the bottom of the connecting block (5), and a long axis cam (7) is movably connected to the middle portion of the bottom end of the U-shaped rod (6), a rotation groove is provided on one side of the long axis cam (7) provided with a counterweight, and the long axis cam (7) is movably connected to a connecting bent rod (301) through the rotation groove thereon, and the top end of the connecting bent rod (301) passes through the rotating driving wheel (1) The middle of the inner ring of the moving wheel (1) is fixedly connected to the positioning plate (2), and the front and back surfaces of the long-axis cam (7) near the middle are movably connected to the booster curved rods (8), and a booster straight rod (10) is provided below the booster curved rod (8). The top of the booster straight rod (10) is provided with a groove, and a connecting straight rod (9) is fixedly installed on the inner wall of the groove. The booster straight rod (10) is movably connected to the bottom of the booster curved rod (8) through the connecting straight rod (9). The bottom of the booster straight rod (10) is fixedly connected to a grinding mounting plate (11), and a grinding sheet (12) is provided at the bottom end of the grinding mounting plate (11). The grinding mounting plates (11) are distributed in a circular array around the bottom of the center point of the rotating driving wheel (1), and a retaining plate (13) is provided on the outer side of the top of the grinding mounting plate (11); The boosting straight rods (10) are distributed in two annular circles around the center point of the rotating pushing wheel (1), and an upper boosting rod (14) is fixedly installed on the boosting straight rod (10) close to the center point of the rotating pushing wheel (1), and an upper boosting rod (15) is fixedly installed on the boosting straight rod (10) away from the center point of the rotating pushing wheel (1). The outer side of the grinding plate (12) is fixedly connected to a lower boosting rod (17), and the top end of the lower boosting rod (17) is movably connected to an auxiliary cylinder (16). The top end of the auxiliary cylinder (16) is movably connected to the boosting straight rods (10) at different positions through the upper boosting rod (14) and the upper boosting rod (15). The auxiliary cylinder (16) includes a cylinder (1601), a limiting rod (1602) is fixedly installed on the inner wall of the cylinder (1601), a rotating circular groove (1701) is opened on one side of the top of the lower auxiliary pull rod (17), and the lower auxiliary pull rod (17) is movably connected to the limiting rod (1602) through the rotating circular groove (1701) thereon, and a return spring (1603) is provided at the bottom of the inner wall of the cylinder (1601), one end of the return spring (1603) is fixedly connected to the middle part of the lower auxiliary pull rod (17), and the lower auxiliary pull rod (17) is elastically connected to the cylinder (1601) through the return spring (1603).

2. The polishing device for producing an electronic package shape according to claim 1, characterized in that: The bottom end of the second upper auxiliary pull rod (15) is wedge-shaped and cooperates with the side of the top end of the lower auxiliary pull rod (17) away from the rotating circular groove (1701).

3. The electronic packaging outer shape production polishing device according to claim 1, characterized in that: The polishing sheet (12) comprises an elastic base (1201), the polishing sheet (12) is made of a rubber material with a certain elasticity, and a polishing layer (1202) is provided on the inner side of the elastic base (1201).

4. The electronic packaging outer shape production polishing device according to claim 1, characterized in that: The bottom end of the lower auxiliary pull rod (17) is fixedly connected to the outer side of the polishing layer (1202), and the polishing layer (1202) is deformed when subjected to a rightward pulling force.

5. The polishing device for producing an electronic package shape according to claim 1, characterized in that: After the top end of the lower auxiliary pull rod (17) is squeezed by the bottom end of the upper auxiliary pull rod (15), it can rotate counterclockwise around the limiting rod (1602) with a rotation angle of 0 to 25 degrees.

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