Cleaning device for wafer box cover mold

Abstract

The invention relates to the technical field of cleaning devices, in particular to a cleaning device for a wafer box cover mold, which comprises a mounting seat, a guide column, a first bidirectional cylinder, an upper mold cavity and a lower mold cavity, the lower end of the mounting seat is symmetrically provided with discharge ports inclined downwards, the lower end of the mounting seat is provided with a mounting cavity, and a motor is fixedly mounted in the mounting cavity. The output end of the motor is fixedly connected with a second two-way air cylinder located in the mounting cavity, the output end of the second two-way air cylinder is fixedly connected with an ejector rod, and a pressure sensing area is mounted at the top end of the ejector rod. According to the invention, the pressure sensing area is arranged on the ejector rod, the pressure borne by each ejection operation is detected in real time, and the cleaning trigger signal is generated and the cleaning operation is executed based on the detected pressure change, so that excessive molding residues are prevented from being accumulated and transferred to the surface of a molded product, and the yield of the molded product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning devices, and in particular to a cleaning device for a wafer box cover mold. Background Art

[0002] Wafer cassette lid molds are key specialized tooling used in the injection molding of wafer cassette lids. Wafer cassettes are the core carrier for storing and transporting wafers in semiconductor manufacturing, and their lids are crucial for protecting wafers from contamination and maintaining a clean environment.

[0003] During the use of wafer box cover molds, trace contaminants such as plastic residue, release agent, and grease are easily attached to the lower cavity and upper mold surfaces. Once these contaminants accumulate to a certain level, they can easily migrate to the surface of the subsequent molded product, causing defects such as scratches, pits, spots, and uneven gloss. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the wafer box cover mold is very likely to cause adverse effects on the product after being contaminated, and to propose a cleaning device for the wafer box cover mold.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A cleaning device for a wafer box cover mold comprises a mounting seat, a guide column, a first bidirectional cylinder, an upper mold and a lower mold cavity, wherein the lower end of the mounting seat is symmetrically provided with downwardly inclined discharge outlets, the lower end of the mounting seat is provided with a mounting cavity, a motor is fixedly installed in the mounting cavity, the output end of the motor is fixedly connected to a second bidirectional cylinder located in the mounting cavity, the output end of the second bidirectional cylinder is fixedly connected to an ejection rod, the top end of the ejection rod is provided with a pressure sensing area, the lower end of the lower mold cavity is slidably connected to a sealing plate, the mounting seat is provided with a driving part for driving the horizontal displacement of the sealing plate, the mounting seat is provided with a water storage cavity surrounding the lower mold cavity, and the mounting seat is provided with a cleaning part for cleaning the upper mold and the lower mold cavity.

[0006] Preferably, the discharge port and the upper and lower corresponding areas of the sealing plate are inclined slopes.

[0007] Preferably, a movable hole for movably accommodating the ejection rod is provided at the middle end of the sealing plate, movable grooves are provided on both sides of the ejection rod, a rotating rod is installed on the pin shaft of the inner wall of the movable groove, a sliding block is slidably installed in the movable groove, and a connecting rod is pin-connected between the sliding block and the rotating rod.

[0008] Preferably, the driving unit includes: A driving cavity, the driving cavity being symmetrically arranged on both sides of the mounting seat; a third bidirectional cylinder, the third bidirectional cylinder being fixedly installed in the driving chamber; A driving rod is fixedly connected between the output end of the third bidirectional cylinder and the sealing plate.

[0009] Preferably, the driving cavity is opened at one end close to the outer wall of the mounting seat, and the end of the driving cavity away from the outer wall of the mounting seat is communicated with the discharge port.

[0010] Preferably, the cleaning unit includes: A scraper, the scraper being slidably mounted on the mounting seat, wherein four scrapers are provided, and the four scrapers correspond to four side surfaces of the upper mold; Push rods, the push rods are fixedly connected to the scraper, and four push rods are provided; A magnetic isolation cover, the magnetic isolation cover is fixedly mounted on the mounting base, two magnetic isolation covers are provided, and two symmetrically arranged push rods are slidably sleeved on both sides of one magnetic isolation cover; a first electromagnet, wherein the first electromagnet is fixedly connected to the magnetic shield; A second electromagnet, the second electromagnet being slidably mounted on the magnetic shield, two second electromagnets being provided, and the two second electromagnets being symmetrically arranged on both sides of the first electromagnet; a first spring, wherein the first spring is fixedly connected between the first electromagnet and the second electromagnet; A receiving chamber, the receiving chamber being provided on the mounting seat and being in communication with the water storage chamber; A force-bearing rod, the force-bearing rod is movably sleeved in the receiving cavity, and the top end of the force-bearing rod is movably opposed to the bottom end of the scraper; A resisting member, the resisting member is fixedly connected to the bottom end of the force-bearing rod; a second spring, the second spring being fixedly connected between the force-bearing rod and the resisting member; a drain outlet, the drain outlet being provided on the mounting seat; A wedge block, the wedge block being slidably mounted in the drain outlet and movably abutting against the abutment member; A pressing plate, the pressing plate being fixedly connected to one end of the wedge block close to the abutment member; A third spring is fixedly connected between the pressure plate and the drain outlet.

[0011] Preferably, the longitudinal section of one end of the scraper close to the upper mold is a triangular structure, and the two symmetrically arranged push rods are not in the same horizontal plane as the other two symmetrically arranged push rods.

[0012] Preferably, the top end of the force-bearing rod is a semicircular structure, and the resistance member is composed of a cylinder and a semicircular sphere.

[0013] Preferably, the drain outlet is composed of two rectangular holes of different lengths, the longer rectangular hole is located above the shorter rectangular hole, the longer rectangular hole is open at both ends, and the shorter rectangular hole is open on one side, the longitudinal section of the end of the wedge block close to the resistance member is a triangular structure, the wedge block is slidably installed in the longer rectangular hole, and the third spring is arranged in the shorter rectangular hole.

[0014] Preferably, a trigger is fixedly connected to the upper mold, and a recorder is fixedly connected to the mounting seat.

[0015] Compared with the prior art, the present invention has the following advantages: 1. The present invention provides a pressure sensing area on the ejector rod to detect the pressure applied during each ejection operation in real time. Based on the detected pressure changes, a cleaning trigger signal is generated and a cleaning operation is performed to prevent excessive accumulation of molding residues and their migration to the surface of the molded product, thereby improving the yield rate of the molded product.

[0016] 2. The present invention uses a scraper to scrape off the residue on the outer wall of the upper mold, and uses a cleaning liquid to clean the residue on the inner wall of the lower mold cavity. The cleaning liquid is driven by a rotating rod and an ejector rod to generate a vortex to improve the cleaning effect.

[0017] 3. The present invention records the number of times the mold is operated through a recorder and a trigger, and establishes a complete data set of how many times the mold is operated before the cleaning device is automatically triggered to perform the cleaning operation, so as to facilitate traceability by staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of a cleaning device for a wafer box cover mold proposed by the present invention; Figure 2 This is a first exploded view of a cleaning device for a wafer box cover mold proposed by the present invention; Figure 3 This is a second exploded view of a cleaning device for a wafer box cover mold proposed by the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of the locally enlarged structure of A proposed in; Figure 5 This is a schematic diagram of the connection structure of the wedge block, the pressure plate, the third spring and the drain port proposed in the present invention; Figure 6 This is a schematic diagram of the ejector rod structure proposed by the present invention; Figure 7 This is an exploded view of the ejector rod of the present invention.

[0019] In the figure: 1. Mounting seat; 2. Guide column; 3. First bidirectional cylinder; 4. Upper mold; 5. Lower mold cavity; 6. Discharge port; 7. Mounting cavity; 8. Motor; 9. Second bidirectional cylinder; 10. Ejector rod; 11. Sealing plate; 12. Drive cavity; 13. Water storage cavity; 14. Pressure sensing area; 15. Movable groove; 16. Rotating rod; 17. Sliding block; 18. Connecting rod; 19. Third bidirectional cylinder; 20. Drive rod; 21. Scraper; 22. Push rod; 23. Magnetic shield; 24. First electromagnet; 25. Second electromagnet; 26. First spring; 27. Storage cavity; 28. Force rod; 29. ​​Resistance member; 30. Second spring; 31. Wedge block; 32. Pressure plate; 33. Third spring; 34. Discharge port; 35. Trigger; 36. Recorder. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Reference Figure 1-Figure 7 A cleaning device for a wafer box cover mold includes a mounting base 1, a guide column 2, a first bidirectional cylinder 3, an upper mold 4 and a lower mold cavity 5. It should be noted that the cross-sections of the upper mold 4 and the lower mold cavity 5 are both square structures, and the lower end of the mounting base 1 is symmetrically provided with a downwardly inclined discharge port 6. The upper and lower corresponding areas of the discharge port 6 and the sealing plate 11 are inclined slopes, so that after entering the discharge port 6, the liquid or solid will move downward under the action of gravity until it is discharged from the mounting base 1.

[0022] An installation cavity 7 is provided at the lower end of the mounting base 1, in which a motor 8 is fixedly installed. The output end of the motor 8 is fixedly connected to a second bidirectional cylinder 9 located in the installation cavity 7, and the output end of the second bidirectional cylinder 9 is fixedly connected to an ejector rod 10. The motor 8 and the second bidirectional cylinder 9 give the ejector rod 10 the functions of rotation and extension.

[0023] A pressure sensing area 14 is installed at the top of the ejector rod 10. The pressure sensing area 14 includes at least one pressure sensor and a matching central processing unit or dedicated control module. In each ejection cycle, when the ejector rod 10 contacts and pushes the molded product out of the mold cavity, the product exerts a reaction force on the ejector rod 10. The magnitude of this reaction force is affected by many factors, among which the accumulation of residue on the mold surface is a key variable. The increase in residue will lead to increased friction, which in turn significantly increases the ejection pressure borne by the ejector rod 10. The pressure sensing area 14 captures the pressure signal during the ejection process in real time, continuously or at high frequency, and converts it into an electrical signal for output. It should be noted that: the pressure sensing area 14 The core sensing element of the pressure sensor is embedded in the body of the ejector rod 10. The force on the rod end or the rod body is transmitted to the sensing element only through a rigid force transmission structure. The sensor circuit part is also sealed and packaged. At the same time, the pressure sensing area 14 adopts a multi-layer, high-reliability sealing structure. A high-temperature resistant and chemical-resistant sealing ring is used. The sensitive surface of the sensor is covered with a corrosion-resistant and high-hardness protective diaphragm. The diaphragm is welded or strongly bonded to the body of the ejector rod 10 to form a completely sealed cavity. The protective diaphragm directly withstands external pressure and material contact, and transmits it to the internal sensor, while isolating it from the intrusion of external fluids and pollutants. The sensor lead outlet is strictly sealed with a high-pressure gland or a potting sealant. The seal helps to extend the service life of the pressure sensing area 14. The lower end of the lower mold cavity 5 is seamlessly slidably connected with a sealing plate 11. The middle end of the sealing plate 11 is provided with a movable hole for movably accommodating the ejector rod 10. It should be noted that the ejector rod 10 and the movable port are seamlessly slidably connected with each other with a precise clearance fit to prevent the wafer box cover material from flowing from the movable hole to the discharge port 6. Movable grooves 15 are provided on both sides of the ejector rod 10. The inner wall pin of the movable groove 15 is installed with a rotating rod 16. The ejector rod 10 rotates around its own axis under the drive of the motor 8. At this time, the rotating rod 16 is affected by the centrifugal force generated by the rotation of the ejector rod 10 to overcome any possible constraint force and generate a radial force away from the rotation axis. The movable groove 15 is provided with a sliding block 17, and the sliding block 17 and the rotating rod 16 are connected with each other by a pin. The sliding block 17 and the rotating rod 16 are connected by a connecting rod 18. The sliding block 17 and the connecting rod 18 are connected by a pin. The sliding block 17 and the rotating rod 16 are connected with each other by a pin. The sliding block 17 and the connecting rod 18 are connected with each other by a pin. The sliding block 17 and the connecting rod 18 are connected with each other by a pin.

[0024] The mounting base 1 is provided with a driving unit for driving the sealing plate 11 to move horizontally. The driving unit includes a driving chamber 12, a third bidirectional cylinder 19 and a driving rod 20. The components are arranged as follows: The driving chamber 12 is symmetrically opened on both sides of the mounting base 1. The driving chamber 12 is opened at one end close to the outer wall of the mounting base 1, and the end of the driving chamber 12 away from the outer wall of the mounting base 1 is connected to the discharge port 6. The third bidirectional cylinder 19 is fixedly installed in the driving chamber 12, and the driving rod 20 is fixedly connected between the output end of the third bidirectional cylinder 19 and the sealing plate 11. The third bidirectional cylinder 19 controls the sealing plate 11 to move horizontally through the driving rod 20, thereby controlling the opening and closing of the bottom end of the lower model cavity 5 to facilitate the discharge of residues and cleaning liquid.

[0025] The mounting base 1 is provided with a water storage chamber 13 surrounding the lower mold cavity 5. The mounting base 1 is provided with a cleaning portion for cleaning the upper mold 4 and the lower mold cavity 5. The motor 8, the second bidirectional cylinder 9, the driving portion and the cleaning portion are activated and perform corresponding cleaning operations when the electrical signal monitored by the pressure sensing area 14 changes. The cleaning portion includes a scraper 21, a push rod 22, a magnetic shield 23, a first electromagnet 24, a second electromagnet 25, a first spring 26, a receiving chamber 27, a force-bearing rod 28, a resistance member 29, a second spring 30, a drain port 34, a wedge block 31, a pressure plate 32 and a third spring 33. The components are arranged as follows: The scraper 21 is slidably mounted on the mounting base 1. There are four scrapers 21, which correspond to the four sides of the upper mold 4. The longitudinal section of the end of the scraper 21 close to the upper mold 4 is a triangular structure. The inclined surface of the scraper 21 prevents the residue scraped from the outer wall of the upper mold 4 by the scraper 21 from floating out of the lower mold cavity 5. The push rod 22 is fixedly connected to the scraper 21. There are four push rods 22. Two symmetrically arranged push rods 22 are not in the same horizontal plane as the other two symmetrically arranged push rods 22, thereby avoiding mutual interference between the push rods 22. The magnetic isolation cover 23 is fixedly mounted on the mounting base 1. There are two magnetic isolation covers 23, and the two symmetrically arranged push rods 22 slide sleeves Installed on both sides of a magnetic isolation cover 23, the first electromagnet 24 is fixedly connected to the magnetic isolation cover 23, and the second electromagnet 25 is slidably sleeved on the magnetic isolation cover 23. There are two second electromagnets 25. The magnetic isolation cover 23 limits the magnetic influence range of the first electromagnet 24 and the second electromagnet 25, thereby preventing other parts of the mold from being damaged by the magnetic force. The two second electromagnets 25 are symmetrically arranged on both sides of the first electromagnet 24. The first spring 26 is fixedly connected between the first electromagnet 24 and the second electromagnet 25 so that when the first electromagnet 24 and the second electromagnet 25 are not in the operating state, they can be reset by the elastic force of the first spring 26; The receiving chamber 27 is provided on the mounting base 1 and is communicated with the water storage chamber 13. The force rod 28 is movably mounted in the receiving chamber 27. The top end of the force rod 28 is movably opposed to the bottom end of the scraper 21. The top end of the force rod 28 is a semicircular structure. The resistance member 29 is fixedly connected to the bottom end of the force rod 28. The resistance member 29 is composed of a cylinder and a semi-sphere. The receiving chamber 27 is composed of a cylindrical cavity with a larger diameter and a cylindrical cavity with a smaller diameter. The cylindrical cavity with a larger diameter corresponds to the resistance member 29, and the cylindrical cavity with a smaller diameter corresponds to the force rod 28. The second spring 30 is fixedly connected between the force-bearing rod 28 and the resistance member 29. A drain port 34 is provided on the mounting base 1. The drain port 34 is composed of two rectangular holes of different lengths. The longer rectangular hole is located above the shorter rectangular hole. The longer rectangular hole is open at both ends, while the shorter rectangular hole is open at one side. The wedge block 31 is slidably installed in the drain outlet 34. The wedge block 31 and the resistance member 29 are movably opposed to each other. The longitudinal section of the end of the wedge block 31 close to the resistance member 29 is a triangular structure, so that when the triangular end of the wedge block 31 moves to the drain outlet 34, a gap is generated between the drain outlet 34, thereby discharging the cleaning liquid from the water storage chamber 13 into the lower mold cavity 5. The wedge block 31 is slidably installed in the longer rectangular hole. The pressure plate 32 is fixedly connected to the end of the wedge block 31 close to the resistance member 29. The third spring 33 is fixedly connected between the pressure plate 32 and the drain outlet 34. The third spring 33 is set in the shorter rectangular hole, so that when the wedge block 31 is not squeezed by external force, it will be reset under the elastic force of the third spring 33; A trigger 35 is fixedly connected to the upper mold 4, and a recorder 36 is fixedly connected to the mounting base 1. The trigger 35 and the recorder 36 work together to record the number of times the mold is operated, and the cleaning operation performed on the mold is marked to facilitate traceability by the staff.

[0026] The present invention can be explained through the following operation mode: The second bidirectional cylinder 9 is activated to drive the ejector rod 10 to move upward. When the ejector rod 10 ejects the formed wafer box cover, the pressure sensing area 14 senses the pressure on the ejector rod 10. When the pressure changes, the first bidirectional cylinder 3 is activated to drive the upper mold 4 to move vertically downward, so that the upper mold 4 enters the lower mold cavity 5. The first electromagnet 24 and the second electromagnet 25 are activated. At this time, the first electromagnet 24 and the second electromagnet 25 drive the push rod 22 to move horizontally. The push rod 22 drives the scraper 21 to actively contact the side wall of the upper mold 4. When the scraper 21 squeezes the force-bearing rod 28 and moves vertically downward, the force-bearing rod 28 drives the resistance member 29 to move vertically downward, the resistance member 29 drives the second spring 30 to stretch, and the resistance member 29 drives the wedge block 31 to move toward the lower mold cavity 5. The wedge block 31 drives the pressure plate 32 to move horizontally, and the pressure plate 32 drives the third spring 33 to contract, and the wedge block 31 enters the drain port 34. Since the end of the wedge block 31 is a triangular structure, a gap will be generated in the drain port 34 during the movement of the wedge block 31, so that the water in the water storage chamber 13 enters the lower mold cavity 5; At this time, the first bidirectional cylinder 3 drives the upper mold 4 to move vertically upward. Under the action of the scraper 21, the residue on the upper mold 4 is scraped into the lower mold cavity 5. At the same time, a large amount of cleaning liquid is stored in the lower mold cavity 5. The second bidirectional cylinder 9 is started to drive the ejector rod 10 to move upward. The ejector rod 10 extends into the lower mold cavity 5. The motor 8 is started to drive the second bidirectional cylinder 9 to rotate. The second bidirectional cylinder 9 drives the ejector rod 10 to rotate. Under the action of centrifugal force, the rotating rod 16 opens to both sides. The rotating rod 16 drives the sliding block 17 to move vertically upward through the connecting rod 18, so that the cleaning liquid is driven to rotate through the ejector rod 10 and the rotating rod 16 to form a vortex, so that the residue is quickly peeled off from the lower mold cavity 5. After cleaning is completed, the third bidirectional cylinder 19 is started, and the third bidirectional cylinder 19 drives the sealing plate 11 to move horizontally away from the lower mold cavity 5 through the driving rod 20, so that the cleaning liquid with residue is discharged from the discharge port 6; At the same time, the recorder 36 and the trigger 35 record the number of times the mold is operated, and a complete data set is established to automatically trigger the cleaning device to perform the cleaning operation when the mold is operated, so as to facilitate traceability by the staff.

[0027] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A cleaning device for a wafer box cover mold, comprising a mounting seat (1), a guide column (2), a first bidirectional cylinder (3), an upper mold (4) and a lower mold cavity (5), characterized in that: A downwardly inclined discharge port (6) is symmetrically provided at the lower end of the mounting seat (1), a mounting cavity (7) is provided at the lower end of the mounting seat (1), a motor (8) is fixedly installed in the mounting cavity (7), an output end of the motor (8) is fixedly connected to a second bidirectional cylinder (9) located in the mounting cavity (7), an output end of the second bidirectional cylinder (9) is fixedly connected to an ejection rod (10), a pressure sensing area (14) is installed at the top end of the ejection rod (10), a sealing plate (11) is slidably connected to the lower end of the lower mold cavity (5), a driving portion for driving the sealing plate (11) to move horizontally is provided in the mounting seat (1), a water storage cavity (13) surrounding the lower mold cavity (5) is provided on the mounting seat (1), and a cleaning portion for cleaning the upper mold (4) and the lower mold cavity (5) is provided on the mounting seat (1).

2. A wafer box cover mold cleaning device according to claim 1, characterized in that: The upper and lower corresponding areas of the discharge port (6) and the sealing plate (11) are inclined slopes.

3. The wafer box cover mold cleaning device according to claim 1, characterized in that: A movable hole for movably receiving the ejection rod (10) is provided at the middle end of the sealing plate (11), and movable grooves (15) are provided on both sides of the ejection rod (10). A rotating rod (16) is installed on the inner wall of the movable groove (15) via a pin shaft, and a sliding block (17) is slidably installed in the movable groove (15). A connecting rod (18) is connected to the rotating rod (16) via a pin shaft between the sliding block (17).

4. The wafer box cover mold cleaning device according to claim 1, characterized in that: The driving unit includes: A drive cavity (12), the drive cavity (12) being symmetrically arranged on both sides of the mounting seat (1); a third bidirectional cylinder (19), the third bidirectional cylinder (19) being fixedly mounted in the drive chamber (12); A driving rod (20) is fixedly connected between the output end of the third bidirectional cylinder (19) and the sealing plate (11).

5. The wafer box cover mold cleaning device according to claim 4, characterized in that: The drive cavity (12) is opened at one end close to the outer wall of the mounting seat (1), and the end of the drive cavity (12) away from the outer wall of the mounting seat (1) is connected to the discharge port (6).

6. The wafer box cover mold cleaning device according to claim 1, characterized in that: The cleaning unit includes: A scraper (21), the scraper (21) being slidably mounted on the mounting seat (1), four scrapers (21) being provided, and the four scrapers (21) corresponding to four side surfaces of the upper mold (4); Push rods (22), the push rods (22) are fixedly connected to the scraper (21), and four push rods (22) are provided; A magnetic shield (23), the magnetic shield (23) is fixedly mounted on the mounting base (1), two magnetic shields (23) are provided, and two symmetrically arranged push rods (22) are slidably sleeved on both sides of one magnetic shield (23); a first electromagnet (24), the first electromagnet (24) being fixedly connected to the magnetic shield (23); A second electromagnet (25), the second electromagnet (25) is slidably mounted on the magnetic shield (23), two second electromagnets (25) are provided, and the two second electromagnets (25) are symmetrically arranged on both sides of the first electromagnet (24); a first spring (26), the first spring (26) being fixedly connected between the first electromagnet (24) and the second electromagnet (25); A receiving chamber (27), the receiving chamber (27) being provided on the mounting seat (1), and the receiving chamber (27) being in communication with the water storage chamber (13); A force-bearing rod (28), the force-bearing rod (28) is movably sleeved in the receiving cavity (27), and the top end of the force-bearing rod (28) movably abuts against the bottom end of the scraper (21); A resisting member (29), the resisting member (29) being fixedly connected to the bottom end of the force-bearing rod (28); a second spring (30), the second spring (30) being fixedly connected between the force-bearing rod (28) and the resisting member (29); A drain outlet (34), the drain outlet (34) being provided on the mounting seat (1); a wedge-shaped block (31), the wedge-shaped block (31) being slidably mounted in the drain outlet (34), the wedge-shaped block (31) movably abutting against the abutting member (29); A pressure plate (32), the pressure plate (32) being fixedly connected to one end of the wedge block (31) close to the abutment member (29); A third spring (33), the third spring (33) is fixedly connected between the pressure plate (32) and the drain outlet (34).

7. The wafer box cover mold cleaning device according to claim 6, characterized in that: The longitudinal section of one end of the scraper (21) close to the upper mold (4) is a triangular structure, and the two symmetrically arranged push rods (22) are not in the same horizontal plane as the other two symmetrically arranged push rods (22).

8. The wafer box cover mold cleaning device according to claim 6, characterized in that: The top end of the force-bearing rod (28) is a semicircular structure, and the resisting member (29) is composed of a cylinder and a semicircular sphere.

9. The wafer box cover mold cleaning device according to claim 6, characterized in that: The drain outlet (34) is composed of two rectangular holes of different lengths, the longer rectangular hole is located above the shorter rectangular hole, the longer rectangular hole is open at both ends, and the shorter rectangular hole is open at one side, the longitudinal section of one end of the wedge block (31) close to the abutment (29) is a triangular structure, the wedge block (31) is slidably installed in the longer rectangular hole, and the third spring (33) is arranged in the shorter rectangular hole.

10. The wafer box cover mold cleaning device according to claim 1, characterized in that: A trigger (35) is fixedly connected to the upper mold (4), and a recorder (36) is fixedly connected to the mounting base (1).

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