Crack monitoring method, device, system and equipment and storage medium

Abstract

The invention provides a crack monitoring method, device, system and equipment and a storage medium, and relates to the technical field of physical detection. The crack monitoring method comprises the following steps: acquiring sound wave signals generated by cracks and collected by two sound emission sensors on a monitoring part; based on the material information of the monitoring part, the distance between the two acoustic emission sensors and the time difference of receiving the acoustic wave signals, the crack initiation position of the crack is determined; the material information comprises the density and Young modulus of the monitoring part; based on the material information, the crack initiation position and the sound wave signal, obtaining sound wave characteristic information of the crack at the crack initiation position; and based on the sound wave characteristic information, acquiring the development condition of the crack. According to the crack monitoring method, the two acoustic emission sensors are arranged on the monitoring part, and real-time monitoring of the dynamic crack process of the important pressure-bearing part of the nuclear power plant can be completed.

Description

Technical Field

[0001] The present disclosure relates to the field of physical detection technology, and in particular to a crack monitoring method, device, system, equipment and storage medium. Background Art

[0002] Critical pressure-bearing components of nuclear power plants, such as the reactor pressure vessel, steam generator, main pump casing, and main piping, are among the most critical equipment in the nuclear island system. Their operating environment typically involves high temperatures, high pressures, and radioactive media. These components are subjected to complex stresses over long periods of time, making them susceptible to crack damage during service. Failure of the pressure boundary integrity of these pressure-bearing components can lead to leakage of high-temperature, high-pressure, and radioactive materials, posing a serious threat to the safe and stable operation of the nuclear power plant and potentially causing environmental pollution and human health risks.

[0003] In pressurized water reactor nuclear power plants, crack initiation and propagation are one of the main failure modes of critical pressure-bearing components. Traditional crack detection methods primarily include ultrasonic testing (UT) and radiographic testing (RT). However, these methods require offline inspections during refueling overhauls and are unable to track the dynamic process of crack initiation and propagation in real time. Furthermore, due to their long inspection cycles, potential risks are difficult to detect promptly. These two detection methods have limitations in terms of their scope of application, monitoring accuracy, and adaptability to complex geometric components, making them difficult to meet the requirements for the long-term safe operation of nuclear power plant pressure-bearing components.

[0004] Therefore, it is necessary to provide a crack monitoring method, device, system, equipment and storage medium to timely detect and evaluate the crack initiation and propagation behavior of pressure-bearing components, thereby improving the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present disclosure is to provide a crack monitoring method, device, system, equipment and storage medium to improve the technical defects of the current method for monitoring crack initiation and propagation on pressure-bearing components of nuclear power plants, such as poor timeliness and insufficient accuracy.

[0006] To achieve the above objectives and other related objectives, in a first aspect, the present disclosure provides a crack monitoring method, which comprises the following steps: Acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at two ends of an extension direction of the monitoring component; determining a crack initiation location based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; wherein the material information includes a density and a Young's modulus of the monitoring component; Acquiring acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0007] In a second aspect, the present disclosure provides a crack monitoring device, which includes a controller and two acoustic emission sensors.

[0008] Among them, two acoustic emission sensors are respectively arranged at both ends of the monitoring component along the extension direction; a controller is communicatively connected to the two acoustic emission sensors, and the controller is configured to: obtain the acoustic wave signals collected by the two acoustic emission sensors on the monitoring component; determine the crack initiation position based on the material information of the monitoring component, the distance between the two acoustic emission sensors and the time difference of receiving the acoustic wave signals; the material information includes the density and Young's modulus of the monitoring component; based on the material information, the crack initiation position and the acoustic wave signal, obtain the acoustic wave characteristic information of the crack at the crack initiation position; based on the acoustic wave characteristic information, obtain the development status of the crack.

[0009] In a third aspect, the present disclosure provides a crack monitoring system, comprising: a signal acquisition module for acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at both ends of an extension direction of the monitoring component; a position determination module for determining a crack initiation position based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; the material information including a density and Young's modulus of the monitoring component; a feature acquisition module, which acquires acoustic wave feature information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; A situation assessment module is configured to obtain the development status of the crack based on the acoustic wave characteristic information.

[0010] In a fourth aspect, the present disclosure provides a computer device, which includes a processor, a memory, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the method described in any one of the above examples are implemented.

[0011] In a fifth aspect, the present disclosure provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps of the method described in any of the above examples are implemented.

[0012] The crack monitoring method provided by the present disclosure sets two acoustic emission sensors on the monitoring component to collect the acoustic wave signals released by the crack initiation and expansion, determines the crack initiation position based on the distance between the two acoustic emission sensors and the time difference of receiving the acoustic wave signals, uses the collected acoustic wave signals to restore the acoustic wave characteristic information of the crack at the initiation position, and finally obtains the development status of the crack based on the acoustic wave characteristic information.

[0013] This crack monitoring method can complete real-time monitoring of the dynamic process of cracks in important pressure-bearing components of nuclear power plants by simply setting two acoustic emission sensors on the monitoring components. No human intervention is required during the monitoring process. In particular, after installing monitoring instruments in some high-radiation areas, in-service inspections of the area can be exempted, improving the work safety of maintenance personnel. The monitoring accuracy and sensitivity are high, and the monitored crack scale can reach the sub-millimeter level. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The features and advantages of the present disclosure will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present disclosure in any way. In the accompanying drawings: Figure 1 Shown is a flow chart of a crack monitoring method according to an embodiment of the present disclosure; Figure 2 Shown is a flow chart of step S1 in one embodiment of the present disclosure; Figure 3 Shown is a flow chart of step S2 in one embodiment of the present disclosure; Figure 4 Shown is a flow chart of step S3 in one embodiment of the present disclosure; Figure 5 Shown is a flow chart of step S4 in one embodiment of the present disclosure; Figure 6 Shown is a schematic structural diagram of a crack monitoring device in one embodiment of the present disclosure; Figure 7 Shown is a structural block diagram of a crack monitoring system in one embodiment of the present disclosure; Figure 8 Shown is a structural block diagram of a computer device in one embodiment of the present disclosure.

[0015] Component number description: 100. Monitoring component; 200. Acoustic emission sensor; 10. Crack monitoring system; 11. Signal acquisition module; 12. Position determination module; 13. Feature acquisition module; 14. Situation assessment module. DETAILED DESCRIPTION

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0017] See also Figures 1 to 8 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present disclosure. Therefore, the diagrams only show components related to the present disclosure and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0018] See Figures 1 to 5 In a first aspect, the present disclosure provides a crack monitoring method, the crack monitoring method comprising the following steps: Step S1: Acquire acoustic wave signals collected by two acoustic emission sensors on a monitoring component.

[0019] like Figure 6 As shown, the present disclosure uses acoustic emission (AE) technology to collect information about crack initiation and growth on a monitoring component 100. Specifically, two AE sensors 200 are provided on the monitoring component 100, one at each end of the monitoring component 100's extension direction. When a crack initiates or grows on the monitoring component 100, energy is released and high-frequency elastic sound waves (typically in the 20 kHz to 2 MHz frequency band) are generated. The two AE sensors 200 capture the high-frequency elastic sound waves transmitted along the surface of the monitoring component 100 at their respective detection positions, thereby monitoring the crack growth status on the monitoring component 100 in real time.

[0020] It should be noted that the components monitored by acoustic emission sensors can be critical pressure-bearing components of a nuclear power plant, such as reactor pressure vessels, steam generators, main pump casings, and main pipelines. Installing acoustic emission sensors on these pressure-bearing components allows for real-time crack monitoring during normal operation of the nuclear power plant.

[0021] like Figure 2 As shown, in some embodiments, step S1 includes the following steps: S11. Obtain the electrical signals collected by the two acoustic emission sensors. The electrical signals are voltage signals that vary with time. The electrical signals are expressed as V(t) .

[0022] S12. Convert the electrical signal into an acoustic wave signal. The acoustic wave signal is an acoustic wave amplitude signal that changes with time. The acoustic wave signal is expressed as v(t).

[0023] Since the acoustic emission sensor converts elastic waves into electrical signals through the piezoelectric effect, in step S12, the quantitative relationship between the electrical signal and the acoustic wave signal can be determined based on the material information of the monitored component and the sensor information of the acoustic emission sensor; and based on the quantitative relationship between the electrical signal and the acoustic wave signal, the electrical signal is converted into an acoustic wave signal. Among them, the material information includes the density of the material of the monitored component. ρ (kg / m³) and Young's modulus E (N / m 2 ); sensor information includes the piezoelectric constant of the piezoelectric material in the acoustic emission sensor d (C / N), effective area A (m 3 ) and the circuit equivalent capacitance C (F).

[0024] Among them, the quantitative relationship between electrical signals and acoustic signals can be expressed as V(t) = K ( d,ρ,E,A,C )· v(t) , parameter coefficients K ( d,ρ,E,A,C ) can be adapted according to the type of acoustic emission sensor. For example, in one example, the quantitative relationship between the electrical signal and the acoustic wave signal can be expressed as: Formula (1) In the formula, the coefficient k and sound wave frequency f Proportional to the frequency of the sound wave f It can be obtained by performing spectrum analysis on the electrical signal.

[0025] Next, step S2 is executed to determine the crack initiation position based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal.

[0026] like Figure 3 As shown, in some embodiments, step S2 includes the following steps: S21. Determine the propagation speed of the sound wave in the monitored component based on the material information.

[0027] In step S21, the density of the material information of the monitoring component is ρ (kg / m³) and Young's modulus E (N / m 2 ), determine the propagation speed of the sound wave in the monitored component c(m / s), the propagation speed is expressed as .

[0028] S22. Determine the crack initiation position based on the propagation velocity, the distance between the two acoustic emission sensors, and the time difference between the two acoustic emission sensors receiving the acoustic wave signals.

[0029] like Figure 6 As shown, in step S22, first, based on the propagation speed of the sound wave in the monitoring component 100, the distance between the two acoustic emission sensors 200, and the time difference between the two acoustic emission sensors 200 receiving the sound wave signals, the distance between the crack and the nearest acoustic emission sensor 200 is determined; for example, in one example, the distance between the crack and the nearest acoustic emission sensor 200 can be determined according to the relationship of formula (2), which is as follows: Formula (2) Among them, l is the distance between the crack and the nearest acoustic emission sensor 200, l is the distance between the two acoustic emission sensors 200, △ t is the time difference between the two acoustic emission sensors 200 receiving the acoustic wave signals, c is the propagation speed of the sound wave in the monitoring component 100.

[0030] Then, based on the position of the nearest acoustic emission sensor 200 and the distance between the crack and the nearest acoustic emission sensor 200 , the crack initiation position on the monitoring component 100 is determined.

[0031] Next, step S3 is performed to obtain acoustic wave characteristic information of the crack at the crack initiation position based on the material information, the crack initiation position and the acoustic wave signal.

[0032] In step S3, the acoustic wave signal is subjected to spectrum analysis, and the source acoustic wave intensity of the acoustic wave signal at the crack initiation position is restored to obtain acoustic wave characteristic information that can represent the crack development status.

[0033] like Figure 4 As shown, in some embodiments, step S3 includes the following steps: S31. Obtain the frequency of the sound wave signal.

[0034] In step S31, the acoustic signal is subjected to spectrum analysis to obtain the frequency of the acoustic signal. For example, the acoustic signal is first subjected to background noise filtering, and then the filtered acoustic signal is subjected to Fourier transform processing to obtain spectral characteristics such as the frequency and amplitude of the acoustic signal.

[0035] S32. Determine the source acoustic wave intensity of the acoustic wave signal at the crack initiation location based on the frequency of the acoustic wave signal, material information of the monitoring component, the acoustic wave signal collected by the acoustic emission sensor, and the relative distance between the acoustic emission sensor and the crack initiation location.

[0036] In step S32, the acoustic wave signal is first converted from the acoustic wave amplitude signal v(t) Converted into sound wave intensity signal I(t) Specifically, the acoustic wave amplitude signal can be converted into v(t) Converted into sound wave intensity signal I(t) , formula (3) is as follows: Formula (3) The acoustic wave intensity signal represents the acoustic wave intensity detected by the acoustic emission sensor at the measuring point. The acoustic wave intensity signal is shown in formula (3) and can be obtained from the acoustic wave amplitude signal v(t) It can also be converted from electrical signals V(t) Converted.

[0037] Then, based on the characteristic that the intensity of the acoustic wave signal decays exponentially with the propagation distance when it propagates in the medium, the acoustic wave signal (i.e., the acoustic wave intensity signal) collected at the acoustic emission sensor is inverted to the crack initiation position by utilizing the frequency of the acoustic wave signal, the acoustic wave propagation speed corresponding to the material information of the monitoring component, and the relative distance between the acoustic emission sensor and the crack initiation position to obtain the source acoustic wave intensity of the acoustic wave signal at the crack initiation position.

[0038] Specifically, the acoustic wave intensity signal collected at the acoustic emission sensor can be inverted and converted into the source acoustic wave intensity at the crack initiation location according to the relationship in formula (4), which is as follows: Formula (4) in, Indicates the sound wave signal (i.e., the transmission time t and transmission distance x Changing sound wave intensity signal), is the source sound wave intensity at the cracking location, f is the frequency of the sound wave, c is the speed of sound waves, It is the loss factor of the sound wave transmitted in the monitoring component.

[0039] S33. The frequency of the sound wave and the intensity of the source sound wave at the crack initiation location are used as sound wave characteristic information. The frequency of the sound wave can be used to classify the type of crack initiation or propagation; the intensity of the source sound wave represents the amount of energy released by the crack initiation or propagation, and can be used to assess the impact of the crack initiation or propagation behavior on the structural stability of the monitored component, thereby assessing the crack stability.

[0040] Next, step S4 is executed to obtain the development status of the crack based on the acoustic wave characteristic information.

[0041] In step S4, based on the acoustic wave characteristic information, the development status of the crack is matched and confirmed in the established voiceprint database, and the development status includes the failure mode and cracking degree of the crack on the monitored component. Figure 5 As shown, in some embodiments, step S4 includes the following steps: S41. Determine the crack failure mode corresponding to the frequency in the sound wave characteristic information from the voiceprint database. The crack failure mode includes fatigue crack, tear crack, and stress corrosion crack.

[0042] In step S41, the frequency in the acoustic wave characteristic information is compared with the frequency range of each crack failure mode in the voiceprint database to obtain a crack failure mode that matches the frequency.

[0043] S42: Determine the safe sound intensity limit corresponding to the failure mode from the voiceprint database, wherein the safe sound intensity limit represents the intensity of the sound wave generated by the maximum destructive force crack that the monitoring component can withstand under the failure mode.

[0044] S43. Determine the crack initiation degree according to the source sound wave intensity and the safety sound intensity limit, where the crack initiation degree is the ratio of the safety sound intensity limit to the sound wave intensity.

[0045] For example, in one example, as shown in Table 1, Table 1 shows the established voiceprint database information. In step S4, if the frequency of the acoustic wave characteristic information is between 60-100KHz, the crack failure mode of the monitored component is confirmed to be fatigue crack based on the voiceprint database; then, the safety sound intensity limit corresponding to the fatigue crack failure mode is determined to be 0.02W / mm from the voiceprint database. 2 ; Finally, the source sound wave intensity in the sound wave characteristic information is compared with the safe sound intensity limit to determine the degree of crack initiation.

[0046] Table 1: Voiceprint database information diagram

[0047] In some embodiments, the process of establishing the voiceprint database used in step S4 includes the following steps: obtaining crack acoustic emission data of the test sample under each failure mode, the crack acoustic emission data including the acoustic wave signal corresponding to the initiation or expansion of the crack on the test sample, and the test sample and the monitoring component have the same material and shape; then, based on the crack acoustic emission data, using finite element analysis to analyze the stability impact of each failure mode crack on the test sample and the corresponding acoustic wave signal, and determine the frequency range and safe sound intensity limit of the acoustic wave vibration of the monitoring component under the action of each failure mode crack; finally, based on the frequency range and safe sound intensity limit corresponding to each failure mode, establish a voiceprint database.

[0048] Furthermore, in some embodiments, step S4 further includes determining the stability of the monitoring component based on the cracking degree. For example, if the cracking degree is greater than or equal to 2, the monitoring component is determined to be structurally stable and no maintenance is required. If the cracking degree is greater than 1 and less than 2, the monitoring component is determined to be at risk of structural stability and can be repaired during the next nuclear power plant maintenance. If the cracking degree is less than or equal to 1, the monitoring component is determined to be structurally unstable and maintenance intervention is required.

[0049] See Figure 6 In a second aspect, the present disclosure provides a crack monitoring device, comprising a controller and two acoustic emission sensors 200. The two acoustic emission sensors 200 are disposed on a monitoring component 100, with one of the two acoustic emission sensors 200 disposed at one end of the monitoring component 100 and the other disposed at the other end of the monitoring component 100. The two acoustic emission sensors 200 capture, at their respective detection positions, high-frequency elastic sound waves generated by crack initiation and propagation in the monitoring component 100.

[0050] The controller is in communication with the two acoustic emission sensors 200, and the controller obtains the acoustic wave signals collected by the two acoustic emission sensors 200 on the monitoring component 100; the controller determines the crack initiation position based on the material information of the monitoring component 100, the distance between the two acoustic emission sensors 200, and the time difference between the two acoustic emission sensors 200 receiving the acoustic wave signals, wherein the material information includes the density and Young's modulus of the material of the monitoring component 100; the controller obtains the acoustic wave characteristic information of the crack at the crack initiation position based on the material information, the crack initiation position, and the acoustic wave signal; and the controller obtains the development status of the crack based on the acoustic wave characteristic information.

[0051] It should be noted that the monitoring component 100 provided with the acoustic emission sensor 200 may be an important pressure-bearing component of a nuclear power plant, such as a reactor pressure vessel, a steam generator, a main pump housing, a main pipeline, and the like.

[0052] In a third aspect, the present invention provides a crack monitoring system 10 , which corresponds one-to-one to the crack monitoring method in the above embodiment.

[0053] like Figure 7 As shown, the crack monitoring system 10 includes a signal acquisition module 11, a position determination module 12, a feature acquisition module 13 and a situation assessment module 14. The functional modules are described in detail as follows: A signal acquisition module 11 acquires acoustic wave signals collected by two acoustic emission sensors on a monitoring component, wherein the acoustic wave signals are generated by cracks on the monitoring component, and the two acoustic emission sensors are respectively arranged at two ends of the extension direction of the monitoring component; a position determination module 12 for determining a crack initiation position based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; the material information including the density and Young's modulus of the monitoring component; A feature acquisition module 13 acquires acoustic wave feature information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; The situation assessment module 14 obtains the development status of the crack based on the acoustic wave characteristic information.

[0054] In one embodiment, the signal acquisition module 11 is specifically configured to: The electrical signals collected by the two acoustic emission sensors are acquired; and the electrical signals are converted into acoustic wave signals.

[0055] In one embodiment, the signal acquisition module 11 is specifically configured to: Determining a quantitative relationship between the electrical signal and the acoustic wave signal based on material information of the monitoring component and sensor information of the acoustic emission sensor; wherein the sensor information includes a piezoelectric constant, an effective active area, and a circuit equivalent capacitance of the acoustic emission sensor; Based on the quantitative relationship between the electrical signal and the acoustic signal, the electrical signal is converted into an acoustic signal.

[0056] In one embodiment, the location determination module 12 is specifically configured to: determining a propagation speed of the sound wave in the monitoring component based on the material information; The crack initiation position is determined based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal.

[0057] In one embodiment, the location determination module 12 is specifically configured to: determining the distance between the crack and the nearest acoustic emission sensor based on the propagation velocity, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal; The crack initiation position is determined based on the position of the nearest acoustic emission sensor and the distance between the crack and the nearest acoustic emission sensor.

[0058] In one embodiment, the position determination module 12 is specifically configured to determine the distance between the crack and the nearest acoustic emission sensor according to formula (I), where formula (I) is: Formula (I) Among them, l is the distance between the crack and the nearest acoustic emission sensor, l is the distance between the two acoustic emission sensors, △ t is the time difference between the two acoustic emission sensors receiving the acoustic wave signal, c is the propagation speed.

[0059] In one embodiment, the feature acquisition module 13 is specifically configured to: Obtaining the frequency of the sound wave signal; determining a source acoustic wave intensity of the acoustic wave signal at the crack initiation location based on the frequency, the material information, the acoustic wave signal collected by the acoustic emission sensor, and a relative distance between the acoustic emission sensor and the crack initiation location; The frequency and the source sound wave intensity are used as sound wave characteristic information.

[0060] In one embodiment, the feature acquisition module 13 is specifically configured to: Based on the frequency, the propagation speed corresponding to the material information, and the relative distance between the acoustic emission sensor and the crack initiation location, the acoustic wave signal collected at the acoustic emission sensor is inverted to the crack initiation location to obtain the source acoustic wave intensity of the acoustic wave signal at the crack initiation location.

[0061] In one embodiment, the feature acquisition module 13 is specifically configured to determine the source sound wave intensity according to formula (II), where formula (II) is: Formula (II) in, represents the acoustic wave signal, is the source sound wave intensity, f is the frequency, c is the propagation speed, is the loss factor of the monitoring component material.

[0062] In one embodiment, the situation assessment module 14 is specifically configured to: match and confirm the development status of the crack in a voiceprint database based on the acoustic wave characteristic information, where the development status includes the failure mode and initiation degree of the crack.

[0063] In one embodiment, the situation assessment module 14 is specifically configured to: Determining a crack failure mode corresponding to the frequency from the voiceprint database; Determining a safe sound intensity limit corresponding to the failure mode from the voiceprint database; The crack initiation degree is determined according to the source sound wave intensity and the safety sound intensity limit, where the crack initiation degree is the ratio of the safety sound intensity limit to the source sound wave intensity.

[0064] In one embodiment, the situation assessment module 14 is specifically configured to: Acquiring crack acoustic emission data of a test sample under various failure modes, the crack acoustic emission data including acoustic wave signals corresponding to crack initiation or propagation; the test sample and the monitoring component have the same shape and material; Determining, based on the crack acoustic emission data, a frequency range and a safe sound intensity limit of the acoustic wave vibration of the monitoring component under the action of each failure mode crack; A voiceprint database is established based on the frequency range and safe sound intensity limit corresponding to each failure mode.

[0065] The specific definition of the crack monitoring system 10 can be found in the definition of the crack monitoring method above and will not be repeated here. Each module in the crack monitoring system 10 described above can be implemented in whole or in part through software, hardware, or a combination thereof. Each of these modules can be embedded in or independent of a processor in a computer device in hardware form, or stored in a computer device memory in software form, so that the processor can call and execute the corresponding operations of each module.

[0066] In one embodiment, a computer device is provided, wherein the internal structure of the computer device can be as follows: Figure 8 As shown. The computer device includes a processor, memory, a network interface, a display screen, and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external server via a network connection. When executed by the processor, the computer program implements the functions or steps of a crack monitoring method.

[0067] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the following steps are performed: Acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at two ends of an extension direction of the monitoring component; determining a crack initiation location based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; wherein the material information includes a density and a Young's modulus of the monitoring component; Acquiring acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0068] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented: Acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at two ends of an extension direction of the monitoring component; determining a crack initiation location based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; wherein the material information includes a density and a Young's modulus of the monitoring component; Acquiring acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0069] It should be noted that the above functions or steps that can be implemented by the computer-readable storage medium or computer device can be found in the relevant descriptions of the server side and the client side in the aforementioned method embodiment. To avoid repetition, they will not be described one by one here.

[0070] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (Synchlink), DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

Claims

1. A crack monitoring method, characterized in that: include: Acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at two ends of the monitoring component in an extending direction; determining a crack initiation location based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; wherein the material information includes a density and a Young's modulus of the monitoring component; Acquiring acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

2. The crack monitoring method according to claim 1, characterized in that: The step of obtaining the acoustic wave signals caused by the cracks collected by the two acoustic emission sensors on the monitoring component includes: Acquiring electrical signals collected by the two acoustic emission sensors; The electrical signal is converted into an acoustic wave signal.

3. The crack monitoring method according to claim 2, characterized in that: The converting of the electrical signal into an acoustic wave signal comprises: Determining a quantitative relationship between the electrical signal and the acoustic wave signal based on material information of the monitoring component and sensor information of the acoustic emission sensor; wherein the sensor information includes a piezoelectric constant, an effective active area, and a circuit equivalent capacitance of the acoustic emission sensor; Based on the quantitative relationship between the electrical signal and the acoustic signal, the electrical signal is converted into an acoustic signal.

4. The crack monitoring method according to claim 1, characterized in that: The determining of the crack initiation position based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal includes: determining a propagation speed of the sound wave in the monitoring component based on the material information; The crack initiation position is determined based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal.

5. The crack monitoring method according to claim 4, characterized in that: The determining of the crack initiation position based on the propagation velocity, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal comprises: determining the distance between the crack and the nearest acoustic emission sensor based on the propagation velocity, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signal; The crack initiation position of the crack is determined based on the position of the nearest acoustic emission sensor and the distance between the crack and the nearest acoustic emission sensor.

6. The crack monitoring method according to claim 5, characterized in that: The distance between the crack and the nearest acoustic emission sensor is determined according to formula (I), which is: Formula (I) Among them, △ l is the distance between the crack and the nearest acoustic emission sensor, l is the distance between the two acoustic emission sensors, △ t is the time difference between the two acoustic emission sensors receiving the acoustic wave signal, c is the propagation speed.

7. The crack monitoring method according to claim 1, characterized in that: The acquiring, based on the material information, the crack initiation location, and the acoustic wave signal, acoustic wave characteristic information of the crack at the crack initiation location includes: Obtaining the frequency of the sound wave signal; determining a source acoustic wave intensity of the acoustic wave signal at the crack initiation location based on the frequency, the material information, the acoustic wave signal collected by the acoustic emission sensor, and a relative distance between the acoustic emission sensor and the crack initiation location; The frequency and the source sound wave intensity are used as sound wave characteristic information.

8. The crack monitoring method according to claim 7, characterized in that: The determining, based on the frequency, the material information, the acoustic wave signal collected by the acoustic emission sensor, and the relative distance between the acoustic emission sensor and the crack initiation location, of the source acoustic wave intensity of the acoustic wave signal at the crack initiation location includes: Based on the frequency, the propagation speed corresponding to the material information, and the relative distance between the acoustic emission sensor and the crack initiation location, the acoustic wave signal collected at the acoustic emission sensor is inverted to the crack initiation location to obtain the source acoustic wave intensity of the acoustic wave signal at the crack initiation location.

9. The crack monitoring method according to claim 7 or 8, characterized in that: The source sound wave intensity is determined according to formula (II), which is: Formula (II) in, represents the acoustic wave signal, is the source sound wave intensity, f is the frequency, c is the propagation speed, is the loss factor of the monitoring component material.

10. The crack monitoring method according to claim 7, characterized in that: The obtaining of the development status of the crack based on the acoustic wave characteristic information includes: Based on the acoustic wave characteristic information, the development status of the crack is matched and confirmed in the voiceprint database, and the development status includes the failure mode and the degree of cracking of the crack.

11. The crack monitoring method according to claim 10, characterized in that: The step of matching and confirming the development status of the crack in a voiceprint database based on the acoustic wave characteristic information includes: Determining a crack failure mode corresponding to the frequency from the voiceprint database; Determining a safe sound intensity limit corresponding to the failure mode from the voiceprint database; The crack initiation degree is determined according to the source sound wave intensity and the safety sound intensity limit, where the crack initiation degree is the ratio of the safety sound intensity limit to the source sound wave intensity.

12. The crack monitoring method according to claim 10, characterized in that: The process of establishing the voiceprint database includes: Acquiring crack acoustic emission data of a test sample under various failure modes, the crack acoustic emission data including acoustic wave signals corresponding to crack initiation or propagation; the test sample and the monitoring component have the same shape and material; Determining, based on the crack acoustic emission data, a frequency range and a safe sound intensity limit of the acoustic wave vibration of the monitoring component under the action of each failure mode crack; A voiceprint database is established based on the frequency range and safe sound intensity limit corresponding to each failure mode.

13. A crack monitoring device, characterized in that: include: Two acoustic emission sensors are respectively arranged at both ends of the extension direction of the monitoring component; A controller is communicatively connected to the two acoustic emission sensors, and the controller is configured to: Acquiring acoustic wave signals collected by the two acoustic emission sensors on a monitoring component; determining a crack initiation location based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference between receiving the acoustic wave signals; the material information including a density and Young's modulus of the monitoring component; acquiring acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signals; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

14. A crack monitoring system, characterized in that: include: a signal acquisition module for acquiring acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at two ends of an extension direction of the monitoring component; a position determination module for determining a crack initiation position based on material information of the monitoring component, a distance between the two acoustic emission sensors, and a time difference in receiving the acoustic wave signal; the material information including a density and Young's modulus of the monitoring component; a feature acquisition module, which acquires acoustic wave feature information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signal; A situation assessment module is configured to obtain the development status of the crack based on the acoustic wave characteristic information.

15. A computer device, characterized in that: include: processor and memory; The memory is used to store computer programs; The processor is connected to the memory, and is configured to execute a computer program stored in the memory, so that the computer device performs the steps of the method according to any one of claims 1 to 12.

16. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 12 are implemented.

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