Intelligent detection method and device for semiconductor parts

Abstract

The invention belongs to the technical field of cleanliness detection, and particularly relates to an intelligent detection method and device for semiconductor parts, the device comprises a clean room, a top cover mounted at the top of the clean room and a bottom box mounted at the bottom of the clean room, and a test assembly is mounted on the side wall of the clean room; a nitrogen supply device supplies gas to the interior of the cleaning chamber through a gas inlet pipe, and nitrogen purges dust particles on the surfaces of parts in the cleaning chamber and enters a three-way pipe through a first exhaust pipe; the nitrogen supply device is turned off, the rotating plate drives the two sets of push blocks to move, the valve plate on one side of one set of push blocks plugs the first air inlet pipe, then the nitrogen supply device is turned on, the nitrogen supply device supplies air into the cleaning chamber through the second air inlet pipe at the moment, and dust particles at dead corners of parts in the cleaning chamber are purged through nitrogen; the particles enter the particle collecting device through the exhaust pipe II and the three-way pipe, so that the particles on the surface of the semiconductor part are completely collected, and the test accuracy is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of cleanliness detection, and in particular relates to an intelligent detection method and device for semiconductor parts. Background Art

[0002] Semiconductor components, also known as semiconductor devices or semiconductor elements, are key components in electronic circuits. The cleanliness requirements for semiconductor components are extremely stringent, and the cleanliness of semiconductor components is directly related to the quality of the processed wafer products.

[0003] The existing technology uses a nitrogen purge system to blow a constant gas flow through the inlet end into the detection device, blowing the dust particles on the surface of the part to float, and then enter the particle collection system from the outlet end for collection and detection. The cleanliness of the metal part surface is determined by the particle collection system, for example, the patent publication number CN116481987A.

[0004] The existing technology has the following technical problems in the detection process: First, the nitrogen purge direction in the existing technology is fixed, making it difficult for the nitrogen to purge the dust particles on the back of the part, resulting in incomplete collection of dust particles, which in turn affects the measurement results and reduces the measurement accuracy. Second, before testing the next set of parts, the semiconductor clean room and the pipes connecting to the clean room need to be cleaned to prevent residual dust in the clean room or pipes from affecting the test results. The cleaning method of the existing technology is extremely simple. After the parts are taken out of the clean room, the nitrogen supply device continues to ventilate the empty clean room and collect the dust through the particle collection device. However, after the gas enters the clean room through the air inlet pipe, it diffuses, which causes loss. The larger the volume of the clean room, the greater the gas loss, resulting in a decrease in the air pressure of the outlet pipe and a decrease in the cleaning capacity of the outlet pipe. In addition, due to the presence of cleaning dead corners in the clean room, such as the bottom edge of the clean room box, when the gas enters the clean room through the air inlet pipe, the particles remaining in the air inlet pipe follow the air flow into the cleaning dead corner of the clean room, which not only fails to clean the air inlet pipe, but also causes the residual particles to accumulate in the clean room. Summary of the Invention

[0005] The purpose of the present invention is to provide an intelligent detection method and device for semiconductor parts to solve the technical problems in the prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions: an intelligent detection device for semiconductor parts, which includes a clean room and a top cover installed on the top of the clean room and a bottom box installed on the bottom of the clean room, wherein strip holes are provided on the side walls of the bottom box, and a test assembly is installed on the side walls of the clean room, the test assembly includes an intake pipe 1, an exhaust pipe 1, an intake pipe 2 and an exhaust pipe 2 respectively installed on the side walls of the clean room, the intake pipe 1 and the exhaust pipe 1 are symmetrically arranged, and the intake pipe 2 and the exhaust pipe 2 are symmetrically arranged; the intake pipe 1 is connected to the exhaust pipe 1 through a short pipe, and the intake pipe 2 is connected to the exhaust pipe 2 through a short pipe, a central groove is installed in the middle of the short pipe, a partition is installed in the short pipe, the partition divides the short pipe into a small-aperture groove and a plate groove, a push block is slidably installed inside the central groove, valve plates are installed on both sides of the push block through sliding rods, and the sliding rods and the valve plates are both located in the plate grooves and slide; the exhaust pipe 1 and the exhaust pipe 2 are respectively connected to a particle collection device and a miscellaneous particle collection device through a three-way pipe, and the intake pipe 1 and the intake pipe 2 are connected to a nitrogen supply device.

[0007] As a further optimization or improvement of this solution, a top mesh plate is installed at the bottom of the clean room, a motor is installed in the bottom box, the output end of the motor is connected to the bottom mesh plate, and the bottom mesh plate is rotated to be installed at the bottom of the top mesh plate; the rotation of the motor drives the through holes on the bottom mesh plate to coincide with or interlace with the through holes on the top mesh plate.

[0008] As a further optimization or improvement of this solution, a bracket is installed on the top of the top cover, a cylinder is fixedly installed on the bracket, an output end of the cylinder is connected to a plug plate, and the plug plate is located inside the clean room.

[0009] As a further optimization or improvement of this solution, the sliding rod is slidably connected to the push block, a cam is rotatably installed inside the push block, a push plate is slidably installed inside the push block, the push plate is connected to the sliding rod through a connecting rod, the cam is in contact with the push plate, and a driving source for driving the cam to rotate is installed inside the push block.

[0010] As a further optimization or improvement of this solution, an arc-shaped groove is provided at the bottom of the central groove, and the rotating plate passes through the arc-shaped groove and is connected to the push block.

[0011] As a further optimization or improvement of this solution, a slide groove is installed inside the push block, the push plate is slidably connected to the slide groove, a spring is installed in the slide groove, and one end of the spring is connected to the push plate.

[0012] As a further optimization or improvement of this solution, a sealing gasket is installed on the outer wall of the push block. When the push block moves to both sides of the central groove, the push block blocks the small-aperture groove through the sealing gasket.

[0013] A method for intelligent detection of semiconductor parts, the method being applied to the intelligent detection device for semiconductor parts as described above, the method comprising the following steps: Step S1: Place the semiconductor component to be tested inside the clean room, and then cover the top of the clean room; Step S2: The motor drives the bottom screen to rotate so that the through holes on the bottom screen intersect with the through holes on the top screen. The through holes on the top screen are blocked by the bottom screen. At this time, the clean room is in a sealed state. At the same time, the three-way pipe is connected to the particle collection device. Step S3: The nitrogen supply device supplies air into the clean room through the air inlet pipe 1. The nitrogen blows away the dust particles on the surface of the parts inside the clean room. The nitrogen enters the tee pipe through the exhaust pipe 1 and then enters the particle collection device through the tee pipe. The particle collection device intelligently distinguishes the particle size and displays the number of particles collected by different particle sizes. Step S4: Turn off the nitrogen supply device and rotate the rotating plate, which simultaneously drives the two groups of push blocks to move, so that the valve plate on one side of one group of push blocks blocks the first inlet pipe, and similarly, the valve plate on one side of the other group of push blocks blocks the first exhaust pipe; Step S5: Turn on the nitrogen supply device. At this time, the nitrogen supply device supplies gas to the inside of the clean room through the second air inlet pipe. The nitrogen sweeps away the dust particles in the blind spots of the parts inside the clean room, and enters the particle collection device through the second exhaust pipe and the three-way pipe, thereby collecting all the particles on the surface of the semiconductor parts.

[0014] Beneficial effects of the present invention: (1) The nitrogen supply device of the present invention supplies air to the interior of the clean room through the air inlet pipe 1. The nitrogen blows away the dust particles on the surface of the parts inside the clean room, enters the tee pipe through the exhaust pipe 1, and enters the particle collection device through the tee pipe. The particle collection device intelligently distinguishes the particle size and displays the collected number of particles of different particle sizes, and at the same time obtains the particle size; During the testing process, the present invention closes the nitrogen gas supply device, rotates the rotating plate, and simultaneously drives the two groups of push blocks to move, so that the valve plate on one side of one group of push blocks blocks the first air inlet pipe, and similarly, the valve plate on the other group of push blocks blocks the first exhaust pipe. Then, the nitrogen gas supply device is turned on. At this time, the nitrogen gas supply device supplies gas to the interior of the clean room through the second air inlet pipe. The nitrogen sweeps away the dust particles in the blind spots of the parts inside the clean room, and enters the particle collection device through the second exhaust pipe and the three-way pipe, thereby collecting all the particles on the surface of the semiconductor parts, thereby improving the accuracy of the test.

[0015] (2) The present invention isolates gas from entering the clean room by closing the air inlet pipe 1, the air exhaust pipe 1, the air inlet pipe 2 and the air exhaust pipe 2, thereby preventing residual particles in the air inlet pipe 1 and the air inlet pipe 2 from entering the cleaning dead corner of the clean room; at the same time, the present invention reduces gas loss by connecting the air inlet pipe 1 and the air exhaust pipe 2 with the small-aperture groove; Specifically, when the gas passes through the intake pipe one, the small-aperture slot and the exhaust pipe two in sequence, the gas will purge the residual particles inside the intake pipe one and the exhaust pipe two. During this process, since the aperture of the small-aperture slot is smaller than that of the intake pipe one, the air pressure of the gas entering the exhaust pipe two through the small-aperture slot increases, thereby increasing the gas's cleaning power on the residual particles on the inner wall of the exhaust pipe two; at the same time, the wind speed entering the small-aperture slot through the intake pipe one increases, thereby preventing the residual particles on the inner wall of the intake pipe one from being retained inside the small-aperture slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 Schematic diagram of the connection structure between the clean room and the top cover.

[0019] Figure 3 Schematic diagram of the structure of the rotating plate.

[0020] Figure 4 It is a cross-sectional view of the overall structure of the present invention.

[0021] Figure 5 This is a cross-sectional view of the overall structure of the test component.

[0022] Figure 6 It is a schematic diagram of the push block structure.

[0023] Figure 7 Schematic diagram of the connection structure between the push block and the slide rod.

[0024] Figure 8 Schematic diagram of the connection structure between the cam and the push plate.

[0025] Figure 9 This is a schematic diagram of the first working state of the present invention.

[0026] Figure 10 This is a schematic diagram of the second working state of the present invention.

[0027] Indicated in the figure: 1. Clean room; 2. Top cover; 3. Bottom box; 4. Bracket; 5. Cylinder; 6. Test assembly; 601. Intake pipe 1; 602. Exhaust pipe 1; 603. Intake pipe 2; 604. Exhaust pipe 2; 605. Short pipe; 606. Partition plate; 607. Small-aperture slot; 608. Plate slot; 609. Center slot; 610. Push block; 611. Sliding rod; 612. Valve plate; 613. Cam; 614. Push plate; 615. Connecting rod; 7. Rotating plate; 8. Strip holes; 9. Plug plate; 10. Top mesh plate; 11. Bottom mesh plate; 12. Protective shell; 13. Motor. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] See also Figures 1-10 An intelligent detection device for semiconductor parts includes a clean room 1, a top cover 2 installed on the top of the clean room 1, and a bottom box 3 installed at the bottom of the clean room 1. The side wall of the bottom box 3 is provided with strip holes 8. A test assembly 6 is installed on the side wall of the clean room 1. The test assembly 6 includes an air inlet pipe 1 601, an exhaust pipe 1 602, an air inlet pipe 2 603 and an exhaust pipe 2 604 respectively installed on the side wall of the clean room 1. The air inlet pipe 1 601 and the exhaust pipe 1 602 are symmetrically arranged, and the air inlet pipe 2 603 and the exhaust pipe 2 604 are symmetrically arranged; Air pipe one 601 is connected to exhaust pipe one 602 through a short pipe 605, and air intake pipe two 603 is connected to exhaust pipe two 604 through a short pipe 605. A central groove 609 is installed in the middle of the short pipe 605, and a partition 606 is installed in the short pipe 605. The partition 606 divides the short pipe 605 into a small-aperture groove 607 and a plate groove 608. A push block 610 is slidably installed inside the central groove 609. Valve plates 612 are installed on both sides of the push block 610 through sliding rods 611, and the sliding rods 611 and the valve plates 612 are both located in the plate groove 608 and slide.

[0030] Specifically, the exhaust pipe 1 602 and the exhaust pipe 2 604 are connected to the particle collection device and the miscellaneous particle collection device respectively through a tee pipe, and the intake pipe 1 601 and the intake pipe 2 603 are connected to the nitrogen supply device.

[0031] Specifically, a sealing gasket is installed on the outer wall of the push block 610. When the push block 610 moves to both sides of the central groove 609, the push block 610 blocks the small-aperture groove 607 through the sealing gasket.

[0032] It should be noted that a sealing gasket is installed at the bottom of the top cover 2 to achieve a sealed connection between the top cover 2 and the clean room 1. A protective shell 12 for protecting the motor 13 is installed outside the motor 13.

[0033] The semiconductor parts to be tested are placed inside the clean room 1, and then the top cover 2 is placed on the top of the clean room 1; the bottom mesh plate 11 is driven to rotate by the motor 13 so that the through holes on the bottom mesh plate 11 are staggered with the through holes on the top mesh plate 10, and the through holes on the top mesh plate 10 are blocked by the bottom mesh plate 11. At this time, the clean room 1 is in a closed state, and the three-way pipe is connected to the particle collection device.

[0034] In the initial state, see Figure 9 Inlet pipe 2 603 and exhaust pipe 2 604 are blocked by valve plate 612. The nitrogen supply device now supplies air to clean room 1 through inlet pipe 1 601. The nitrogen sweeps away dust particles from the surfaces of components within clean room 1. The nitrogen enters the tee pipe through exhaust pipe 1 602 and then the particle collection device. The particle collection device intelligently distinguishes particle sizes, displays the number of particles collected by different sizes, and simultaneously calculates the particle size. This allows the nitrogen to reach blind spots in components, improving test accuracy. During the testing process of the present invention, the nitrogen gas supply device is turned off, and the rotating plate 7 is rotated. The rotating plate 7 simultaneously drives the two groups of push blocks 610 to move, so that the valve plate 612 on one side of one group of push blocks 610 blocks the inlet pipe 1 601. Similarly, the valve plate 612 on the other group of push blocks 610 blocks the exhaust pipe 1 602. Then the nitrogen gas supply device is turned on. At this time, the nitrogen gas supply device supplies gas to the interior of the clean room 1 through the inlet pipe 2 603. The nitrogen gas sweeps away the dust particles in the blind spots of the parts inside the clean room 1, and enters the particle collection device through the exhaust pipe 2 604 and the tee pipe, thereby collecting all the particles on the surface of the semiconductor parts, thereby improving the accuracy of the test.

[0035] Specifically, the reason why the present invention turns off the nitrogen gas supply device in the process of changing the direction of the airflow; during the test process, the parts need to be purged with a constant gas flow rate. In the process of rotating the rotating plate 7 to block the air inlet pipe 1 601 and the exhaust pipe 1 602, the air inlet pipe 1 601, the exhaust pipe 1 602, the air inlet pipe 2 603 and the exhaust pipe 2 604 are all in the open state. If the nitrogen gas supply device is in the open state, the air inlet pipe 1 601 and the air inlet pipe 2 603 simultaneously transport gas to the inside of the clean room 1, causing the air pressure inside the clean room 1 to change, affecting the stability of the test.

[0036] It should be noted that the valve plate 612 is in contact with the inner wall of the plate groove 608. When the push block 610 moves to the side of the middle groove 609, see Figure 6At this time, the small-aperture groove 607 is blocked by the sealing gasket on the outer wall of the push block 610, and the valve plate 612 blocks the plate groove 608. At this time, the exhaust pipe 2 604 is closed and the intake pipe 1 601 is opened; when the push block 610 moves to the other side of the middle groove 609, the push block 610 blocks the small-aperture groove 607, the intake pipe 1 601 is closed, and the exhaust pipe 2 604 is opened; when the push block 610 moves to other positions, the push block 610 is disengaged from the blockage of the small-aperture groove 607, and the intake pipe 1 601 and the exhaust pipe 2 604 are connected through the small-aperture groove 607.

[0037] See also Figures 1-8 A top mesh plate 10 is installed at the bottom of the clean room 1, and a motor 13 is installed in the bottom box 3. The output end of the motor 13 is connected to the bottom mesh plate 11, and the bottom mesh plate 11 is rotated to be installed at the bottom of the top mesh plate 10; the rotation of the motor 13 drives the through holes on the bottom mesh plate 11 to coincide with or intersect with the through holes on the top mesh plate 10.

[0038] Specifically, a bracket 4 is installed on the top of the top cover 2 , a cylinder 5 is fixedly installed on the bracket 4 , an output end of the cylinder 5 is connected to a plug plate 9 , and the plug plate 9 is located inside the clean room 1 .

[0039] Specifically, the slide rod 611 is slidably connected to the push block 610, a cam 613 is rotatably installed inside the push block 610, a push plate 614 is slidably installed inside the push block 610, the push plate 614 is connected to the slide rod 611 through a connecting rod 615, the cam 613 is in contact with the push plate 614, and a driving source for driving the cam 613 to rotate is installed inside the push block 610.

[0040] It should be noted that before testing the next set of parts, it is necessary to clean the clean room 1 and test assembly 6 of any remaining particles to prevent them from affecting the test. The existing cleaning method is very simple: after removing the parts from the clean room 1, the nitrogen supply device continues to ventilate the empty clean room 1, allowing the nitrogen to enter the particle collection device through the three-way pipe.

[0041] The above-mentioned existing technical solutions have the following technical problems: after the gas enters the clean room 1, it diffuses and then produces loss. The larger the volume of the clean room 1, the greater the gas loss, resulting in a decrease in the air pressure at the outlet, and further resulting in a decrease in the gas's ability to clean the residues on the inner walls of the exhaust pipe 1 602 and the exhaust pipe 2 604; not only that, since there are cleaning dead corners in the clean room 1, such as the bottom edge of the clean room 1, when the gas enters the clean room 1 through the air inlet pipe 1 601 and the air inlet pipe 2 603, the particles remaining inside the air inlet pipe 1 601 and the air inlet pipe 2 603 enter the cleaning dead corners of the clean room 1 with the air flow, which not only fails to play the role of cleaning the air inlet pipe 1 601 and the air inlet pipe 2 603, but also causes the residual particles to accumulate in the clean room 1.

[0042] Before testing the next group of parts, the present invention moves the push block 610 to the center position of the middle slot 609 by rotating the rotating plate 7. At this time, the push block 610 disengages from the blockage of the small-aperture slot 607, and the air inlet pipe 1 601 is connected to the exhaust pipe 2 604 through the small-aperture slot 607. Similarly, the exhaust pipe 1 602 is connected to the air inlet pipe 2 603 through the small-aperture slot 607. Then, the driving source drives the cam 613 to rotate, so that the cam 613 pushes the push plate 614 to move. The push plate 614 drives the slide bar 611 to move relative to it through the connecting rod 615. The slide bar 611 drives the valve plate 612 to respectively block the air inlet pipe 1 601, the exhaust pipe 1 602, the air inlet pipe 2 603 and the exhaust pipe 2 604, thereby isolating the gas from entering the clean room 1. Then, the three-way pipe is connected to the particle collection device.

[0043] Gas is supplied to the second intake pipe 603 and the first intake pipe 601 via a nitrogen supply device. The gas inside the second intake pipe 603 flows directly through the small-aperture slot 607 to the first exhaust pipe 602, from which it enters the particle collection device. The gas inside the first intake pipe 601 flows directly through the small-aperture slot 607 to the second exhaust pipe 604, from which it enters the particle collection device. The present invention isolates gas from entering the clean room 1 by closing the first intake pipe 601, the first exhaust pipe 602, the second intake pipe 603, and the second exhaust pipe 604. This prevents residual particles inside the first intake pipe 601 and the second intake pipe 603 from entering the blind spots of the clean room 1. Furthermore, the present invention reduces gas loss by connecting the small-aperture slot 607 to the first intake pipe 601 and the second exhaust pipe 604.

[0044] Specifically, when the gas passes through the intake pipe 1 601, the small-aperture groove 607 and the exhaust pipe 2 604 in sequence, the gas will purge the residual particles inside the intake pipe 1 601 and the exhaust pipe 2 604. During this process, since the aperture of the small-aperture groove 607 is smaller than that of the intake pipe 1 601, the air pressure of the gas entering the exhaust pipe 2 604 through the small-aperture groove 607 increases, thereby increasing the gas's cleaning power on the residual particles on the inner wall of the exhaust pipe 2 604; at the same time, the wind speed entering the small-aperture groove 607 through the intake pipe 1 601 increases, thereby preventing the residual particles on the inner wall of the intake pipe 1 601 from being retained inside the small-aperture groove 607.

[0045] It should be noted that the present invention uses a motor 13 to rotate the bottom screen 11, causing the through-holes on the bottom screen 11 to overlap with the top screen 10. The cylinder 5 then pushes the plug plate 9 downward, which forces the air inside the clean room 1 to circulate from the top to the bottom. The air carries residual particles in the blind corners at the bottom of the clean room 1 through the through-holes in the top and bottom screens 10, 11, and enters the bottom box 3 for collection. The present invention provides a chamfered edge at the bottom edge of the clean room 1 to improve the efficiency of collecting particles in the blind corners at the bottom of the clean room 1.

[0046] See also Figure 3The bottom of the central groove 609 is provided with an arc groove, and the rotating plate 7 passes through the arc groove and is connected to the push block 610.

[0047] It should be noted that a driving source for driving the rotating plate 7 to rotate can be installed separately to achieve intelligent driving adjustment.

[0048] See also Figure 8 A slide groove is installed inside the push block 610, and the push plate 614 is slidably connected to the slide groove. A spring is installed in the slide groove, and one end of the spring is connected to the push plate 614.

[0049] It should be noted that, after the work is completed, the cam 613 is reset, and the spring further drives the push plate 614 to reset.

[0050] See also Figures 1-6 As shown, the present invention is an intelligent detection method for semiconductor parts, which is applied to the intelligent detection device for semiconductor parts as described in the above embodiment, and includes the following steps: Step S1: placing the semiconductor component to be tested inside the clean room 1, and then covering the top of the clean room 1 with the top cover 2; Step S2: The motor 13 drives the bottom screen 11 to rotate, so that the through holes on the bottom screen 11 are staggered with the through holes on the top screen 10. The through holes on the top screen 10 are blocked by the bottom screen 11. At this time, the clean room 1 is in a sealed state, and the three-way pipe is connected to the particle collection device. Step S3: The nitrogen supply device supplies air into the clean room 1 through the air inlet pipe 1 601. The nitrogen sweeps away the dust particles on the surfaces of the parts inside the clean room 1. The nitrogen enters the tee pipe through the exhaust pipe 1 602 and then enters the particle collection device through the tee pipe. The particle collection device intelligently distinguishes the particle size and displays the number of particles collected by different particle sizes. Step S4: Turn off the nitrogen supply device and rotate the rotating plate 7, which simultaneously drives the two sets of push blocks 610 to move, so that the valve plate 612 on one side of one set of push blocks 610 blocks the inlet pipe 1 601. Similarly, the valve plate 612 on the other set of push blocks 610 blocks the exhaust pipe 1 602. Step S5: Turn on the nitrogen gas supply device. At this time, the nitrogen gas supply device supplies gas to the inside of the clean room 1 through the second inlet pipe 603. The nitrogen gas sweeps away the dust particles in the blind spots of the parts inside the clean room 1, and enters the particle collection device through the second exhaust pipe 604 and the three-way pipe, thereby collecting all the particles on the surface of the semiconductor parts.

[0051] The implementation principle of the present invention is as follows: the semiconductor parts to be tested are placed inside the clean room 1, and then the top cover 2 is placed on the top of the clean room 1; the bottom mesh plate 11 is driven to rotate by the motor 13, so that the through holes on the bottom mesh plate 11 are staggered with the through holes of the top mesh plate 10, and the through holes on the top mesh plate 10 are blocked by the bottom mesh plate 11. At this time, the clean room 1 is in a closed state, and the three-way pipe is connected to the particle collection device.

[0052] In the initial state, see Figure 9 Inlet pipe 2 603 and exhaust pipe 2 604 are blocked by valve plate 612. The nitrogen supply device now supplies air to clean room 1 through inlet pipe 1 601. The nitrogen sweeps away dust particles from the surfaces of components within clean room 1. The nitrogen enters the tee pipe through exhaust pipe 1 602 and then the particle collection device. The particle collection device intelligently distinguishes particle sizes, displays the number of particles collected by different sizes, and simultaneously calculates the particle size. This allows the nitrogen to reach blind spots in components, improving test accuracy. During the testing process of the present invention, the nitrogen gas supply device is turned off, and the rotating plate 7 is rotated. The rotating plate 7 simultaneously drives the two groups of push blocks 610 to move, so that the valve plate 612 on one side of one group of push blocks 610 blocks the inlet pipe 1 601. Similarly, the valve plate 612 on the other group of push blocks 610 blocks the exhaust pipe 1 602. Then the nitrogen gas supply device is turned on. At this time, the nitrogen gas supply device supplies gas to the interior of the clean room 1 through the inlet pipe 2 603. The nitrogen gas sweeps away the dust particles in the blind spots of the parts inside the clean room 1, and enters the particle collection device through the exhaust pipe 2 604 and the tee pipe, thereby collecting all the particles on the surface of the semiconductor parts, thereby improving the accuracy of the test.

[0053] Before testing the next set of parts, it is necessary to clean the clean room 1 and test assembly 6 of any remaining particles to prevent them from affecting the test. The existing cleaning method is very simple: after removing the parts from the clean room 1, the nitrogen supply device continues to ventilate the empty clean room 1, allowing the nitrogen to enter the particle collection device through the three-way pipe.

[0054] The above-mentioned existing technical solution has the following technical problems: after the gas enters the clean room 1, it diffuses and then produces loss. The larger the volume of the clean room 1, the greater the gas loss, which leads to a decrease in the air pressure at the outlet, and further leads to a decrease in the gas's ability to clean the residues on the inner walls of the exhaust pipe 1 602 and the exhaust pipe 2 604; not only that, since there are cleaning dead corners in the clean room 1, such as the bottom edge of the clean room 1, when the gas enters the clean room 1 through the air inlet pipe 1 601 and the air inlet pipe 2 603, the particles remaining inside the air inlet pipe 1 601 and the air inlet pipe 2 603 enter the cleaning dead corners of the clean room 1 with the air flow, which not only fails to play the role of cleaning the air inlet pipe 1 601 and the air inlet pipe 2 603, but also causes the residual particles to accumulate in the clean room 1.

[0055] Based on this, before conducting the next group of parts testing, the present invention moves the push block 610 to the center position of the middle slot 609 by rotating the rotating plate 7. At this time, the push block 610 disengages from the blockage of the small-aperture slot 607, and the air intake pipe 1 601 is connected to the exhaust pipe 2 604 through the small-aperture slot 607. Similarly, the exhaust pipe 1 602 is connected to the air intake pipe 2 603 through the small-aperture slot 607; then the driving source drives the cam 613 to rotate, so that the cam 613 pushes the push plate 614 to move, and the push plate 614 drives the slide bar 611 to move relative to each other through the connecting rod 615, and the slide bar 611 drives the valve plate 612 to respectively block the air intake pipe 1 601, the exhaust pipe 1 602, the air intake pipe 2 603 and the exhaust pipe 2 604, thereby isolating the gas from entering the clean room 1, and then the three-way pipe is connected to the particle collection device.

[0056] Gas is supplied to the second intake pipe 603 and the first intake pipe 601 via a nitrogen supply device. The gas inside the second intake pipe 603 flows directly through the small-aperture slot 607 to the first exhaust pipe 602, from which it enters the particle collection device. The gas inside the first intake pipe 601 flows directly through the small-aperture slot 607 to the second exhaust pipe 604, from which it enters the particle collection device. The present invention isolates gas from entering the clean room 1 by closing the first intake pipe 601, the first exhaust pipe 602, the second intake pipe 603, and the second exhaust pipe 604. This prevents residual particles inside the first intake pipe 601 and the second intake pipe 603 from entering the blind spots of the clean room 1. Furthermore, the present invention reduces gas loss by connecting the small-aperture slot 607 to the first intake pipe 601 and the second exhaust pipe 604.

[0057] Specifically, when the gas passes through the intake pipe 1 601, the small-aperture groove 607 and the exhaust pipe 2 604 in sequence, the gas will purge the residual particles inside the intake pipe 1 601 and the exhaust pipe 2 604. During this process, since the aperture of the small-aperture groove 607 is smaller than that of the intake pipe 1 601, the air pressure of the gas entering the exhaust pipe 2 604 through the small-aperture groove 607 increases, thereby increasing the gas's cleaning power on the residual particles on the inner wall of the exhaust pipe 2 604; at the same time, the wind speed entering the small-aperture groove 607 through the intake pipe 1 601 increases, thereby preventing the residual particles on the inner wall of the intake pipe 1 601 from being retained inside the small-aperture groove 607.

[0058] The present invention drives the bottom mesh plate 11 to rotate through the motor 13, so that the through holes on the bottom mesh plate 11 coincide with the top mesh plate 10, and then the plug plate 9 is pushed downward by the cylinder 5. The plug plate 9 pushes the internal gas of the clean room 1 to flow from the top to the bottom. The gas carries the residual particles in the edge dead corner of the bottom of the clean room 1 through the through holes of the top mesh plate 10 and the bottom mesh plate 11 into the bottom box 3 for collection.

[0059] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. An intelligent detection device for semiconductor parts, characterized in that: The invention comprises a clean room (1), a top cover (2) installed on the top of the clean room (1), and a bottom box (3) installed on the bottom of the clean room (1); a strip hole (8) is provided on the side wall of the bottom box (3); a test assembly (6) is installed on the side wall of the clean room (1); the test assembly (6) comprises an air inlet pipe 1 (601), an exhaust pipe 1 (602), an air inlet pipe 2 (603), and an exhaust pipe 2 (604) respectively installed on the side wall of the clean room (1); the air inlet pipe 1 (601) and the exhaust pipe 1 (602) are symmetrically arranged, and the air inlet pipe 2 (603) and the exhaust pipe 2 (604) are symmetrically arranged; The first intake pipe (601) is connected to the first exhaust pipe (602) via a short pipe (605), and the second intake pipe (603) is connected to the second exhaust pipe (604) via a short pipe (605). A center groove (609) is installed in the middle of the short pipe (605), and a partition (606) is installed in the short pipe (605). The partition (606) divides the short pipe (605) into a small-aperture groove (607) and a plate groove (608). A push block (610) is slidably installed inside the center groove (609). Valve plates (612) are installed on both sides of the push block (610) via sliding rods (611), and the sliding rods (611) and the valve plates (612) are both located in the plate groove (608) and slide. The exhaust pipe 1 (602) and the exhaust pipe 2 (604) are respectively connected to the particle collection device and the miscellaneous particle collection device through a three-way pipe, and the intake pipe 1 (601) and the intake pipe 2 (603) are connected to the nitrogen supply device.

2. The intelligent detection device for semiconductor components according to claim 1, characterized in that: A top mesh plate (10) is installed at the bottom of the clean room (1), a motor (13) is installed in the bottom box (3), an output end of the motor (13) is connected to the bottom mesh plate (11), and the bottom mesh plate (11) is rotatably installed at the bottom of the top mesh plate (10); the through holes on the bottom mesh plate (11) are driven to overlap or intersect with the through holes on the top mesh plate (10) by the rotation of the motor (13).

3. The intelligent detection device for semiconductor components according to claim 2, characterized in that: A bracket (4) is installed on the top of the top cover (2), a cylinder (5) is fixedly installed on the bracket (4), an output end of the cylinder (5) is connected to a plug plate (9), and the plug plate (9) is located inside the clean room (1).

4. The intelligent detection device for semiconductor components according to claim 1, characterized in that: The slide rod (611) is slidably connected to the push block (610), a cam (613) is rotatably installed inside the push block (610), a push plate (614) is slidably installed inside the push block (610), the push plate (614) is connected to the slide rod (611) through a connecting rod (615), the cam (613) is in contact with the push plate (614), and a driving source for driving the cam (613) to rotate is installed inside the push block (610).

5. The intelligent detection device for semiconductor components according to claim 1, characterized in that: An arc-shaped groove is provided at the bottom of the central groove (609), and the rotating plate (7) passes through the arc-shaped groove and is connected to the push block (610).

6. The intelligent detection device for semiconductor components according to claim 1, characterized in that: A slide groove is installed inside the push block (610), and the push plate (614) is slidably connected to the slide groove. A spring is installed in the slide groove, and one end of the spring is connected to the push plate (614).

7. The intelligent detection device for semiconductor components according to claim 1, characterized in that: The outer wall of the push block (610) is installed with a sealing gasket. When the push block (610) moves to both sides of the middle groove (609), the push block (610) blocks the small-aperture groove (607) through the sealing gasket.

8. An intelligent detection method for semiconductor parts, characterized in that: The method is applied to the intelligent detection device for semiconductor parts according to any one of claims 1 to 7, and the method comprises the following steps: Step S1: placing the semiconductor component to be tested inside the clean room (1), and then covering the top of the clean room (1) with a top cover (2); Step S2: The bottom screen plate (11) is driven to rotate by the motor (13), so that the through holes on the bottom screen plate (11) are staggered with the through holes on the top screen plate (10), and the through holes on the top screen plate (10) are blocked by the bottom screen plate (11). At this time, the clean room (1) is in a sealed state, and the three-way pipe is connected to the particle collection device; Step S3: The nitrogen supply device supplies air to the interior of the clean room (1) through the air inlet pipe 1 (601). The nitrogen blows away the dust particles on the surface of the internal parts of the clean room (1), enters the three-way pipe through the exhaust pipe 1 (602), and enters the particle collection device through the three-way pipe. The particle collection device intelligently distinguishes the particle size and displays the collected number of particles of different particle sizes; Step S4: Turn off the nitrogen supply device and rotate the rotating plate (7). The rotating plate (7) simultaneously drives the two groups of push blocks (610) to move, so that the valve plate (612) on one side of one group of push blocks (610) blocks the first air inlet pipe (601). Similarly, the valve plate (612) on the other group of push blocks (610) blocks the first air outlet pipe (602). Step S5: Turn on the nitrogen supply device. At this time, the nitrogen supply device supplies gas to the inside of the clean room (1) through the second air inlet pipe (603). The nitrogen blows away the dust particles in the blind spots of the internal parts of the clean room (1), and enters the particle collection device through the second exhaust pipe (604) and the three-way pipe, thereby collecting all the particles on the surface of the semiconductor parts.

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