Probe card manufacturing method, electronic equipment and probe card

Abstract

The invention discloses a manufacturing method of a probe card, electronic equipment and the probe card. The method comprises the following steps: acquiring a basic model of a reinforcer of the probe card and element position information and element height information of a printed circuit board; setting a hollow area at a position corresponding to each element on the basic model based on the element position information; a protrusion is arranged in each hollow area based on the element height information, and the through holes of the hollow areas penetrate through the protrusions; manufacturing the stiffener based on the basic model of the stiffener; and assembling the upper cover of the probe card, the reinforcer, the printed circuit board and the mechanical bearing layer in sequence to obtain the probe card. According to the invention, the hollowed-out area is arranged at the position corresponding to each element on the basic model based on the element position information, and the hollowed-out area comprises the through hole capable of accommodating the element on the printed circuit board, so that the area, where the element can be arranged, on the printed circuit board can be enlarged, and the number of the elements capable of being accommodated on the printed circuit board is increased; and the test efficiency of the probe card can be improved.

Description

Technical Field

[0001] The present invention relates to the field of new generation information technology, and in particular to a manufacturing method of a probe card, an electronic device and the probe card. Background Art

[0002] The chip industry is currently booming. During the chip production process, wafers must be inspected before they are packaged to prevent unqualified wafers from being processed. Probe cards are used to inspect wafers. These cards contain multiple probes that transmit test signals by directly contacting the pads or bumps on the wafer.

[0003] Currently, with the increasing demand for test efficiency, the number of chips that need to be tested simultaneously by a probe card has to increase, so the number of components on the printed circuit board of the probe card has also been increasing.

[0004] However, the physical space of the printed circuit board is limited, and a contact area with a reinforcement member for enhancing the mechanical strength of the probe card must be reserved, resulting in a significant restriction on the number of components that can be accommodated on the printed circuit board. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present application provides a method for manufacturing a probe card, an electronic device and a probe card. A hollow area is set at the position corresponding to each component on the basic model of the reinforcement of the probe card based on the component position information. The hollow area includes through holes that can accommodate components on the printed circuit board. This can increase the area on the printed circuit board where components can be set, thereby increasing the number of components that can be accommodated on the printed circuit board, which is beneficial to improving the testing efficiency of the probe card.

[0006] In order to solve the above problems, the present invention provides the following technical solutions: In a first aspect, an embodiment of the present application provides a method for manufacturing a probe card, comprising: obtaining a basic model of a reinforcement member of the probe card and component position information and component height information of a printed circuit board of the probe card; Based on the component position information, a hollow area is set at a position corresponding to each component on the basic model of the reinforcement of the probe card, wherein the hollow area includes a through hole capable of accommodating the component on the printed circuit board; A protrusion having a height not less than that of the corresponding component is provided in each of the hollow regions based on the component height information, wherein the through hole in the hollow region passes through the protrusion; manufacturing the reinforcement member based on a basic model of the reinforcement member provided with the hollowed-out area; The upper cover, the reinforcement, the printed circuit board and the mechanical bearing layer of the probe card are assembled in sequence to obtain the probe card.

[0007] In some embodiments, the protrusion is a boss, and the boss is away from the upper surface of the printed circuit board and parallel to the surface of the printed circuit board.

[0008] In some embodiments, the boss is a column, a table, or an irregular three-dimensional shape, and the cross-sectional shape of the boss is a circle, a polygon, or an irregular geometric shape.

[0009] In some embodiments, the through hole in the hollow area penetrates the protrusion along the axial direction of the protrusion.

[0010] In some embodiments, a cross-sectional profile of the through-holes in the hollow area matches a projection profile of a component that can be accommodated in the hollow area on the reinforcement.

[0011] In some embodiments, positions of all the hollow areas are symmetrical about a symmetry center of the reinforcement.

[0012] In some embodiments, setting a hollow area at a position corresponding to each component on a basic model of a reinforcement member of a probe card based on the component position information includes: determining a region of a fastener on a basic model of the reinforcement based on the element position information; providing a boss in the region of each of said fasteners; Based on the component position information, the hollow area is set at a position corresponding to each component in an area of ​​the reinforcement except the area of ​​the fastener.

[0013] In some embodiments, manufacturing the reinforcement member based on a basic model of the reinforcement member provided with the hollowed-out area includes: Manufacturing the main body of the reinforcement member and the through hole of the hollow area on the main body based on the basic model of the reinforcement member provided with the hollow area; The bulge is manufactured on each of the hollow areas using an elastic material to obtain the reinforcement.

[0014] In a second aspect, an embodiment of the present application provides an electronic device, comprising: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor. The instructions are executed by the at least one processor to enable the at least one processor to perform the method for manufacturing a probe card according to the first aspect.

[0015] In a third aspect, an embodiment of the present application provides a probe card, wherein the probe card is manufactured using the manufacturing method of the probe card according to the first aspect; The probe card includes an upper cover, a reinforcement, a printed circuit board and a mechanical bearing layer. The reinforcement includes a hollow area. The hollow area includes through holes and protrusions that can accommodate components on the printed circuit board. The through holes in the hollow area pass through the protrusions.

[0016] The present application provides a method for manufacturing a probe card, an electronic device and a probe card. The present application sets a hollow area at a position corresponding to each component on a basic model of a reinforcement of the probe card based on component position information. The hollow area includes through holes that can accommodate components on a printed circuit board. This can increase the area on the printed circuit board where components can be set, thereby increasing the number of components that can be accommodated on the printed circuit board, which is beneficial to improving the test efficiency of the probe card. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a flow chart of the method for manufacturing the probe card provided in an embodiment of the present application.

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the basic model of the reinforcement provided in the embodiment of the present application.

[0019] Figure 3 It is a front view structural schematic diagram of the basic model of the reinforcement provided in the embodiment of the present application.

[0020] Figure 4 This is a structural diagram of an electronic device provided in an embodiment of the present application.

[0021] Figure 5 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0024] The present application provides a method for manufacturing a probe card, an electronic device, and a probe card. A hollow area is set at a position corresponding to each component on a basic model of a reinforcement of the probe card based on component position information. The hollow area includes through holes that can accommodate components on a printed circuit board. This can increase the area on the printed circuit board where components can be set, thereby increasing the number of components that can be accommodated on the printed circuit board, which is beneficial to improving the test efficiency of the probe card.

[0025] The manufacturing method of the probe card provided in the present application will be described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1 , Figure 1 FIG. 1 is a flow chart of a method for manufacturing a probe card according to an embodiment of the present application. Figure 1 As shown, the manufacturing method of the probe card includes: steps S100 to S500.

[0027] Step S100 : obtaining a basic model of a reinforcement member of a probe card and component position information and component height information of a printed circuit board of the probe card.

[0028] In some embodiments, a plurality of electronic components are disposed on a printed circuit board of the probe card. The component position information includes information about the position of each electronic component on the printed circuit board, and the component height information includes information about the height of each electronic component on the printed circuit board. The height of the electronic component refers to the height of the electronic component above the surface of the printed circuit board facing the reinforcement.

[0029] Step S200: setting a hollow area at a position corresponding to each component on a basic model of a reinforcement of a probe card based on the component position information.

[0030] The hollowed-out area includes a through-hole that can accommodate components on the printed circuit board. Since components may partially protrude from the surface of the printed circuit board when mounted on the printed circuit board, this method allows the protruding portion of the component to be accommodated in the through-hole, preventing the reinforcement from being dislodged, facilitating subsequent assembly of the reinforcement and printed circuit board.

[0031] In some embodiments, because the probe card's reinforcement member and the probe card's printed circuit board are stacked, a contact area between the reinforcement member and the printed circuit board can be pre-determined on a basic model of the probe card's reinforcement member. Based on the component position information and the contact area with the printed circuit board on the basic model, the position coordinates corresponding to the position of each component on the printed circuit board in the contact area of ​​the basic model can be determined. Furthermore, based on the position coordinates of each component in the contact area of ​​the basic model, the position coordinates corresponding to each component on the upper surface of the basic model away from the printed circuit board can be determined.

[0032] Optionally, on the upper surface of the basic model away from the printed circuit board, the position coordinates corresponding to each component are determined as the center coordinates of the hollow area, and a preset area range including the center coordinates of the hollow area is determined as the hollow area.

[0033] Optionally, the preset area range may be a circular area range, a rectangular area range, or an area range of other shapes.

[0034] Exemplarily, a circular area range with the center coordinates of the hollowed-out area as the center and a radius of a preset radius can be determined.

[0035] Optionally, the through hole may be a circular through hole, a rectangular through hole, or an irregularly shaped through hole.

[0036] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the three-dimensional structure of the basic model of the reinforcement provided in the embodiment of the present application, Figure 3 : is a front view structural diagram of the basic model of the reinforcement provided in the embodiment of the present application. Figure 2 and Figure 3 As shown, in some embodiments, a plurality of hollow areas A are provided on the basic model D of the reinforcement member. The hollow areas A include a first hollow area A1, a second hollow area A2, a third hollow area A3, a fourth hollow area A4, a fifth hollow area A5, and a sixth hollow area A6. For example, the first hollow area A1 includes a through hole X.

[0037] In some embodiments, the cross-sectional profile of the through-holes in the hollowed-out region matches the projected profile of the component accommodated in the hollowed-out region on the reinforcement. The projected profile of the component on the reinforcement refers to the projected profile of the component along the assembly direction of the reinforcement and the printed circuit board. In this way, the through-holes can serve as a position limiter for the component and minimize the area occupied by the through-holes.

[0038] Optionally, the distance between the sidewall of the through hole in the hollow area and the component that can be accommodated in the hollow area is a first preset distance. In this way, even if there are certain manufacturing errors, the through hole can still accommodate the corresponding component, thereby facilitating the assembly of the probe card.

[0039] Exemplarily, the first preset distance is 0.001 millimeter (mm), 0.005 mm, or 0.01 mm, etc.

[0040] Optionally, the center coordinates of the hollowed-out area are used as the center coordinates of the through hole, and the through hole is then arranged according to the center coordinates of the through hole.

[0041] In some embodiments, the reinforcement and printed circuit board need to be fixed together using fasteners. The area on the reinforcement where the fasteners are installed cannot be hollowed out, otherwise the fixing strength will be affected. In this case, step S200 includes steps S210 to S230.

[0042] Step S210: Determine the area of ​​the fastener on the basic model of the reinforcement based on the component position information.

[0043] The fasteners are used to fix the reinforcement member to the printed circuit board. Optionally, the fasteners may include screws and rivets.

[0044] In some embodiments, the component position information also includes position information of fasteners to be mounted on the printed circuit board. Based on the component position information and the contact area on the base model with the printed circuit board, the corresponding position coordinates of each fastener on the printed circuit board in the base model's contact area can be determined. Furthermore, based on the position coordinates of each fastener in the base model's contact area, the corresponding position coordinates of each fastener on the base model's upper surface away from the printed circuit board can be determined.

[0045] Optionally, on the upper surface of the basic model away from the printed circuit board, a preset area range including the position coordinates corresponding to each fastener is determined as the area of ​​the fastener.

[0046] Step S220: providing a boss in the region of each fastener.

[0047] The boss is away from the upper surface of the printed circuit board and parallel to the surface of the printed circuit board. In this way, the boss has a large contact area with the upper cover of the probe card, and the pressure generated under the same pressure is small, which is beneficial to protecting the upper cover and can facilitate the installation of the upper cover on the reinforcement.

[0048] like Figure 2 and Figure 3 As shown, for example, a boss Z is provided in region B2 of the fastener.

[0049] Step S230: Based on the component position information, a hollow area is set at a position corresponding to each component in an area of ​​the reinforcement except for the area of ​​the fastener.

[0050] like Figure 2 and Figure 3 As shown, for example, areas B on the basic model D are provided with fasteners, such as areas B1 and B2. Fastener areas B1 and B2 do not include through-holes. This prevents the areas where the fasteners are installed from being hollowed out, thereby improving the fixing strength between the reinforcement and the printed circuit board.

[0051] Step S300: providing a protrusion with a height not less than that of the corresponding component in each hollow area based on the component height information.

[0052] The through hole in the hollow area passes through the protrusion. Figure 2 and Figure 3 As shown, for example, the through hole X of the first hollow area A1 passes through the protrusion Y. In this way, when the component is accommodated in the through hole, the protrusion can protect the component.

[0053] Preferably, the height of the protrusion is equal to the height of the corresponding element.

[0054] In some embodiments, the protrusion is a boss, and the boss is away from the upper surface of the printed circuit board and parallel to the surface of the printed circuit board.

[0055] In some embodiments, the boss is a column, a table, or an irregular three-dimensional shape. The cross-sectional shape of the boss is a circle, a polygon, or an irregular geometric shape.

[0056] like Figure 2 and Figure 3 As shown, exemplarily, the protrusion Y is a boss. Optionally, the cross-sectional shape of the protrusion Y is a circle or an irregular geometric figure.

[0057] Optionally, the specific shape of the boss can be designed according to actual needs and component shape.

[0058] In some embodiments, the through hole in the hollow area penetrates the protrusion along the axial direction of the protrusion.

[0059] Optionally, the axial direction of the protrusion may be the geometric symmetry axis of the protrusion, or may be a pre-specified axial direction.

[0060] In some embodiments, positions of all hollow areas are symmetrical about a center of symmetry of the reinforcement member.

[0061] The symmetry center of the reinforcement includes the symmetry axis and the symmetry center point.

[0062] It should be understood that the definition of symmetry in this application does not mean absolute symmetry. Rather, it means that, where conditions permit, the positions of all hollow areas should be as close to absolute symmetry as possible about the symmetry center of the reinforcement. For example, in the presence of a fastener area, it may not be possible to make all hollow areas absolutely symmetrical about the symmetry center of the reinforcement, but the positions of all hollow areas can be made as close to absolute symmetry about the symmetry center of the reinforcement.

[0063] By aligning the positions of all hollow areas symmetrically with respect to the symmetry center of the reinforcement, the overall deformation of the reinforcement in a high-temperature environment can be uniform, thereby reducing deformation of the probe card.

[0064] Optionally, when the basic model has a symmetry center point, for each hollow area, there is a corresponding hollow area that is centrosymmetric to the hollow area about the symmetry center point.

[0065] like Figure 3 As shown, for example, when the basic model D is circular, the basic model D has a center O, which is the center point of symmetry. The first hollow area A1 and the second hollow area A2 are centrosymmetric about the center O. The third hollow area A3 and the fifth hollow area A5 are centrosymmetric about the center O. The fourth hollow area A4 and the sixth hollow area A6 are centrosymmetric about the center O.

[0066] Optionally, when the basic model has an axis of symmetry, the positions of all hollow regions may be symmetrical about the axis of symmetry. For each hollow region, there is a corresponding hollow region that is symmetrical to the hollow region about the axis of symmetry.

[0067] In some embodiments, the upper surface of the protrusions facing away from the printed circuit board may have a serrated or wavy surface, and the upper cover mounted on the reinforcement may include a groove that matches the surface of each protrusion. For example, when the upper surface of the protrusions has a serrated surface, the upper cover may include a serrated groove that matches the serrated surface. In this way, the protrusions can also serve as a position limiter for the upper cover.

[0068] Step S400: manufacturing a reinforcement member based on a basic model of the reinforcement member provided with a hollow area.

[0069] In some embodiments, an integrally formed reinforcement is manufactured based on a basic reinforcement model.

[0070] In some embodiments, the protrusions may be made of elastic material. In this case, step S400 includes steps S410 to S420.

[0071] Step S410: manufacturing a main body of the reinforcement member and through holes in the hollow area on the main body based on a basic model of the reinforcement member provided with the hollow area.

[0072] Optionally, the through holes of the hollowed-out area are manufactured simultaneously with the manufacture of the main body of the reinforcement.

[0073] Step S420: using elastic material to make protrusions on each hollow area to obtain a reinforcement.

[0074] Optionally, the elastic material includes rubber, silicone, polyurethane and the like.

[0075] In some embodiments, an elastic film may be provided on the protrusion, thereby preventing the protrusion from damaging the circuit board.

[0076] In some implementations, step S400 may include steps S430 to S450.

[0077] Step S430: Assemble the probe card model based on the basic model of the reinforcement with the hollow area and the preset models of the probe card's upper cover, printed circuit board and mechanical bearing layer, and perform physical simulation based on the probe card model to obtain simulation results.

[0078] Among them, physical simulation includes thermal simulation and mechanical simulation.

[0079] Optionally, the deformation of the probe card under a preset high-temperature environment may be calculated based on the model of the probe card, and the mechanical strength of the probe card under preset mechanical simulation conditions may be calculated.

[0080] Optionally, the preset mechanical simulation conditions may include preset collision conditions and preset stretching conditions, etc.

[0081] Step S440: When it is determined that the simulation result does not meet the preset conditions, the basic model of the reinforcement is modified according to the simulation result to obtain an optimized basic model.

[0082] For example, when the mechanical strength of the probe card under preset mechanical simulation conditions is less than a preset strength, the number of hollow regions may be reduced.

[0083] For example, when the deformation of the probe card under a preset high temperature environment is greater than a preset deformation, the hollow areas may be reduced to make the positions of all hollow areas closer to absolute symmetry with respect to the symmetry center of the reinforcement.

[0084] Step S450: manufacturing a reinforcement member based on the optimized basic model.

[0085] The method for manufacturing a reinforcement member based on the optimized basic model is described above.

[0086] In some embodiments, when it is determined that the simulation result meets a preset condition, the reinforcement may be manufactured based on the current basic model.

[0087] Step S500: assembling the upper cover, the reinforcement, the printed circuit board and the mechanical bearing layer of the probe card in sequence to obtain the probe card.

[0088] In some embodiments, the present application further provides a probe card, which is a probe card manufactured using the manufacturing method of the probe card described above.

[0089] In some embodiments, the probe card includes a top cover, a reinforcement, a printed circuit board, and a mechanical support layer. The reinforcement includes a hollow region, the hollow region includes a through hole and a protrusion for accommodating components on the printed circuit board, and the through hole in the hollow region passes through the protrusion.

[0090] Optionally, fasteners are used to securely assemble the reinforcement member to the printed circuit board.

[0091] Optionally, the mechanical bearing layer includes an intermediary layer and a bottom layer. The intermediary layer includes an intermediary layer protective cover and an intermediary layer body. The intermediary layer protective cover is used to improve the fixing strength between the intermediary layer body and the printed circuit board.

[0092] Optionally, the probe card is a micro-electro-mechanical systems (MEMS) probe card.

[0093] In summary, the method for manufacturing a probe card provided in the embodiments of the present application has the following advantages: 1. By setting a hollow area at the position corresponding to each component on the basic model of the probe card reinforcement based on the component position information, the hollow area includes through holes that can accommodate components on the printed circuit board. This can increase the area on the printed circuit board where components can be set, thereby increasing the number of components that can be accommodated on the printed circuit board, which is beneficial to improving the test efficiency of the probe card.

[0094] 2. By providing a hollow area at the position corresponding to each component in the area of ​​the reinforcement except the area of ​​the fastener, the area where the fastener is installed will not be hollowed out, which can improve the fixing strength between the reinforcement and the printed circuit board.

[0095] 3. By aligning the positions of all hollow areas symmetrically with respect to the symmetry center of the reinforcement, the overall deformation of the reinforcement in a high temperature environment can be made uniform, thereby reducing deformation of the probe card.

[0096] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 As shown, the electronic device 400 includes: one or more processors 410 and a memory 420, Figure 4 A processor 410 is taken as an example.

[0097] In some embodiments, the processor 410 and the memory 420 may be connected via a bus or other means. Figure 4 The bus connection is taken as an example.

[0098] In some embodiments, the processor 410 is used to obtain a basic model of the reinforcement of the probe card and component position information and component height information of the printed circuit board of the probe card; based on the component position information, a hollow area is set at a position corresponding to each component on the basic model of the reinforcement of the probe card, and the hollow area includes a through hole that can accommodate the component on the printed circuit board; based on the component height information, a protrusion with a height not less than the height of the corresponding component is set in each hollow area, and the through hole in the hollow area passes through the protrusion; the reinforcement is manufactured based on the basic model of the reinforcement; the upper cover, reinforcement, printed circuit board and mechanical bearing layer of the probe card are assembled in sequence to obtain the probe card.

[0099] The processor 410 can manufacture the reinforcement based on the basic model of the reinforcement by controlling the probe card manufacturing equipment; and assemble the upper cover, reinforcement, printed circuit board and mechanical bearing layer of the probe card in sequence to obtain the probe card.

[0100] In some embodiments, the memory 420, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules of the probe card manufacturing method in the embodiments of the present application. The processor 410 executes the non-volatile software programs, instructions, and modules stored in the memory 420 to execute various functional applications and data processing of the electronic device 400, thereby implementing the probe card manufacturing method of the above-mentioned method embodiment.

[0101] In some embodiments, the memory 420 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device 400, etc. In addition, the memory 420 may include a high-speed random access memory and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 420 may optionally include a memory remotely located relative to the processor 410, and these remote memories may be connected to the controller via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0102] In some embodiments, one or more modules are stored in the memory 420, and when executed by one or more processors 410, the manufacturing method of the probe card in any of the above method embodiments is executed, for example, the manufacturing method described above is executed. Figure 1 Method steps S100 to S500.

[0103] Please refer to Figure 5 , Figure 5The computer-readable storage medium 500 stores program code 510, which can be called by a processor to execute the manufacturing method of the probe card described in the above method embodiment.

[0104] The computer-readable storage medium 500 can be an electronic memory such as flash memory, electrically erasable programmable read-only memory (EEPROM), a hard disk, or read-only memory (ROM). Alternatively, the computer-readable storage medium includes non-volatile computer-readable media. The computer-readable storage medium 500 has storage space for program code that executes any method step in the above-described method for manufacturing a probe card. This program code can be read from or written to one or more computer program products. The program code can be compressed, for example, in a suitable format.

[0105] The present application also provides a computer program product, including a computer program, which implements the above-mentioned method for manufacturing the probe card when executed by a processor.

[0106] In summary, the present application provides a method for manufacturing a probe card, an electronic device, and a probe card. The method for manufacturing the probe card includes: obtaining a basic model of a reinforcement member of the probe card and component position information and component height information of a printed circuit board of the probe card; setting a hollow area at a position corresponding to each component on the basic model of the reinforcement member of the probe card based on the component position information, the hollow area including a through hole that can accommodate a component on the printed circuit board; setting a protrusion with a height not less than the height of the corresponding component in each hollow area based on the component height information, the through hole in the hollow area passing through the protrusion; manufacturing the reinforcement member based on the basic model of the reinforcement member; assembling the upper cover, reinforcement member, printed circuit board, and mechanical bearing layer of the probe card in sequence to obtain the probe card. The present application sets a hollow area at a position corresponding to each component on the basic model of the reinforcement member of the probe card based on the component position information, the hollow area including a through hole that can accommodate a component on the printed circuit board, thereby increasing the area on the printed circuit board where components can be set, thereby increasing the number of components that can be accommodated on the printed circuit board, which is beneficial to improving the test efficiency of the probe card.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for manufacturing a probe card, characterized in that: include: obtaining a basic model of a stiffener of the probe card and component position information and component height information of a printed circuit board of the probe card; Based on the component position information, a hollow area is set at a position corresponding to each component on the basic model of the reinforcement of the probe card, wherein the hollow area includes a through hole capable of accommodating the component on the printed circuit board; A protrusion having a height not less than that of the corresponding component is provided in each of the hollow regions based on the component height information, wherein the through hole in the hollow region passes through the protrusion; manufacturing the reinforcement member based on a basic model of the reinforcement member provided with the hollowed-out area; The upper cover, the reinforcement, the printed circuit board and the mechanical bearing layer of the probe card are assembled in sequence to obtain the probe card.

2. The method for manufacturing a probe card according to claim 1, wherein: The protrusion is a boss, and the boss is away from the upper surface of the printed circuit board and parallel to the surface of the printed circuit board.

3. The method for manufacturing a probe card according to claim 2, wherein: The boss is in the shape of a column, a table or an irregular three-dimensional shape, and the cross-section of the boss is in the shape of a circle, a polygon or an irregular geometric shape.

4. The method for manufacturing a probe card according to claim 1, wherein: The through hole in the hollow area penetrates the protrusion along the axial direction of the protrusion.

5. The method for manufacturing a probe card according to claim 1, wherein: The cross-sectional profile of the through hole in the hollow area matches the projection profile of the element that can be accommodated in the hollow area on the reinforcement.

6. The method for manufacturing a probe card according to any one of claims 1 to 5, wherein: The positions of all the hollow areas are symmetrical about the symmetry center of the reinforcement.

7. The method for manufacturing a probe card according to claim 1, wherein: The step of setting a hollow area at a position corresponding to each component on a basic model of a reinforcement member of the probe card based on the component position information includes: determining a region of a fastener on a basic model of the reinforcement based on the element position information; providing a boss in the region of each of said fasteners; Based on the component position information, the hollow area is set at a position corresponding to each component in an area of ​​the reinforcement except the area of ​​the fastener.

8. The method for manufacturing a probe card according to claim 1, wherein: The manufacturing of the reinforcement member based on the basic model of the reinforcement member provided with the hollowed-out area comprises: Manufacturing the main body of the reinforcement member and the through hole of the hollow area on the main body based on the basic model of the reinforcement member provided with the hollow area; The bulge is manufactured on each of the hollow areas using an elastic material to obtain the reinforcement.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method for manufacturing a probe card according to any one of claims 1 to 8.

10. A probe card, characterized in that: The probe card is a probe card manufactured by the method for manufacturing a probe card according to any one of claims 1 to 8; The probe card includes an upper cover, a reinforcement, a printed circuit board and a mechanical bearing layer. The reinforcement includes a hollow area. The hollow area includes through holes and protrusions that can accommodate components on the printed circuit board. The through holes in the hollow area pass through the protrusions.

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