Inductor component

Abstract

The invention relates to an inductor component. An inductor component (10) is provided with: a first magnetic layer (21); an inductor wiring (30) laminated on the main surface of the first magnetic layer (21); a second magnetic layer (22) disposed in the same layer as the inductor wiring (30); a third magnetic layer (23) disposed on a main surface of the inductor wiring (30) and the second magnetic layer (22) on the opposite side from the first magnetic layer (21); and an insulating layer (80) of a non-magnetic material that is in contact with a part of the surface of the inductor wiring (30). The entire surface of the inductor wiring (30) on the first magnetic layer (21) side is in contact with the first magnetic layer (21), and the surface of the inductor wiring (30) on the second magnetic layer (22) side is in contact with the insulating layer (80).

Description

[0001] This application is a divisional application of the invention patent application with application number 202110216765.9, application date February 26, 2021, applicant Murata Manufacturing Co., Ltd., and invention name “Inductor Component”. Technical Field

[0002] The present invention relates to inductor components. Background Art

[0003] In the inductor component described in Patent Document 1, an inductor wiring is laminated on the surface of an insulating substrate. The surface of the inductor wiring not covered by the insulating substrate is covered with an insulating layer. Furthermore, the outer surface of the laminated structure consisting of the inductor wiring, insulating substrate, and insulating layer is covered with a magnetic layer.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-225718

[0005] In the inductor component described in Patent Document 1, if the overall volume of the inductor component remains the same, a smaller proportion of the insulating substrate and insulating layer allows a larger proportion of the magnetic layer, which is advantageous in terms of improving inductance. On the other hand, completely omitting the insulating substrate and insulating layer raises concerns about not ensuring the required insulation, making this unrealistic. Summary of the Invention

[0006] In order to solve the above-mentioned problems, one embodiment of the present invention provides an inductor component, which comprises: a first magnetic layer; an inductor wiring, which is stacked on the main surface of the above-mentioned first magnetic layer; a second magnetic layer, which is arranged in the same layer as the above-mentioned inductor wiring; a third magnetic layer, which is arranged on the main surface of the above-mentioned inductor wiring and the above-mentioned second magnetic layer on the opposite side of the above-mentioned first magnetic layer; and an insulating layer of non-magnetic material, which is in contact with a portion of the surface of the above-mentioned inductor wiring, the entire surface of the above-mentioned inductor wiring on the side of the above-mentioned first magnetic layer is in contact with the above-mentioned first magnetic layer, and the surface of the above-mentioned inductor wiring on the side of the above-mentioned second magnetic layer is in contact with the above-mentioned insulating layer.

[0007] According to the above structure, the entire surface of the inductor wiring on the first magnetic layer side contacts the first magnetic layer without intervening an insulating layer. Therefore, there is no insulating layer on the first magnetic layer side of the inductor wiring, which correspondingly reduces the proportion of the insulating layer in the inductor component. Furthermore, the insulating layer is sandwiched within the same layer as the inductor wiring, making it easier to ensure insulation within the same layer as the inductor wiring. Furthermore, the surface of the inductor wiring refers to the outer surface that serves as the boundary between the inductor wiring and the outside world.

[0008] The ratio of the insulating layer can be made relatively small, and insulation properties can be easily ensured within the same layer as the inductor wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an exploded perspective view of the inductor component according to the first embodiment.

[0010] Figure 2 is a top view of the second layer of the first embodiment.

[0011] Figure 3 The inductor component of the first embodiment is Figure 2 Cross-sectional view along line AA.

[0012] Figure 4 This is an enlarged cross-sectional view of the contact portion between the inductor wiring and the magnetic layer according to the first embodiment.

[0013] Figure 5 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0014] Figure 6 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0015] Figure 7 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0016] Figure 8 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0017] Figure 9 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0018] Figure 10 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0019] Figure 11 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0020] Figure 12 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0021] Figure 13 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0022] Figure 14 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0023] Figure 15 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0024] Figure 16These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0025] Figure 17 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0026] Figure 18 These are diagrams for explaining the method for manufacturing the inductor component according to the first embodiment.

[0027] Figure 19 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0028] Figure 20 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0029] Figure 21 It is an exploded perspective view of the inductor component according to the second embodiment.

[0030] Figure 22 is a top view of the second layer of the second embodiment.

[0031] Figure 23 The inductor component of the second embodiment is Figure 22 Cross-sectional view of line BB in.

[0032] Figure 24 It is an enlarged cross-sectional view of the inductor component according to the second embodiment.

[0033] Figure 25 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0034] Figure 26 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0035] Figure 27 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0036] Figure 28 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0037] Figure 29 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0038] Figure 30 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0039] Figure 31 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0040] Figure 32It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0041] Figure 33 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0042] Figure 34 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0043] Figure 35 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0044] Figure 36 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0045] Figure 37 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0046] Figure 38 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0047] Figure 39 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0048] Figure 40 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0049] Figure 41 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0050] Figure 42 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0051] Explanation of Reference Numerals: 10 ...inductor component; 21 ...first magnetic layer; 22 ...second magnetic layer; 23 ...third magnetic layer; 30 ...inductor wiring; 30B ...first wiring layer; 30C ...second wiring layer; 80 ...insulating layer. DETAILED DESCRIPTION

[0052] The following describes an inductor component and embodiments of the inductor component. The drawings may show components in an enlarged form for easier understanding. The dimensional ratios of components may differ from the actual dimensional ratios or dimensional ratios in other drawings.

[0053] <First embodiment>

[0054] Hereinafter, a first embodiment of the inductor component will be described.

[0055] like Figure 1As shown in FIG, the inductor component 10 has a structure in which three thin plate-shaped layers are stacked in the thickness direction. In the following description, the stacking direction of each of the three layers is described as the vertical direction.

[0056] The first layer L1 is roughly square when viewed from the top and bottom. The first layer L1 is composed only of the first magnetic layer 21. The first magnetic layer 21 is a mixture of resin and metal magnetic powder, and is a magnetic body as a whole. Figure 4 As shown, in the first magnetic layer 21, metal magnetic powder 20B is dispersed within a base material 20A composed of an insulating material. Therefore, the entire first magnetic layer 21 is composed of a magnetic material. Furthermore, the base material 20A is composed of an epoxy resin and an inorganic filler having an average particle size of 1.0 μm or less. Furthermore, the metal magnetic powder 20B is an alloy composed of iron, silicon, and chromium, and has an average particle size of 5.0 μm or less. In this embodiment, the first layer L1 is the bottommost layer in the vertical direction. Specifically, the side in the vertical direction where the external electrode 70, described later, is located is the top side, and the opposite side is the bottom side.

[0057] like Figure 1 As shown, a second layer L2, identical to the first layer L1 and having a square shape when viewed from above and below, is stacked on the upper surface of the first layer L1 in the stacking direction. In this embodiment, the surface of the second layer L2 that contacts the first layer L1 is the principal surface MF of the second layer L2. The second layer L2 is composed of the inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the second magnetic layer 22, and the first insulating portion 81. In other words, the inductor wiring 30, which constitutes a portion of the second layer L2, is stacked on the principal surface of the first magnetic layer 21 that constitutes the first layer L1.

[0058] like Figure 2 As shown, in the second layer L2, the inductor wiring 30 is composed of a wiring main body 31, a first pad 32, and a second pad 33. When viewed from above in the vertical direction, the inductor wiring 30 extends in a spiral shape centered on the center of the square in the second layer L2. Specifically, when viewed from above in the vertical direction, the wiring main body 31 of the inductor wiring 30 is spirally wound counterclockwise from a radially outer peripheral end 31A toward a radially inner peripheral end 31B.

[0059] The number of turns of inductor wiring 30 is determined based on a virtual vector. The starting point of the virtual vector is located on a virtual centerline that passes through the center of the inductor wiring 30's width and extends along the direction of extension of the inductor wiring 30. Furthermore, regarding the virtual vector, when viewed from the normal direction, if the starting point of the inductor wiring 30 is moved from one end to the other end of the virtual centerline, the number of turns is determined to be 1.0 when the direction of the virtual vector is rotated 360 degrees. Therefore, for example, if the inductor wiring 30 is wound 180 degrees, the number of turns is 0.5. In this embodiment, the virtual vector virtually arranged on the inductor wiring is rotated 540 degrees. Therefore, the number of turns of the inductor wiring 30 in this embodiment is 1.5.

[0060] The first pad 32 is connected to the outer peripheral end 31A of the wiring main body 31. The first pad 32 is substantially circular when viewed from the top and bottom. The diameter of the circle of the first pad 32 is larger than the wiring width of the wiring main body 31.

[0061] The first dummy wiring 41 extends from the first pad 32 toward the outer edge of the second layer L2 . The first dummy wiring 41 extends to the side surface of the second layer L2 and is exposed on the outer surface of the inductor component 10 .

[0062] The second pad 33 is connected to the inner peripheral end 31B of the wiring main body 31. The second pad 33 is substantially circular when viewed from the top and bottom. The diameter of the circle of the second pad 33 is larger than the wiring width of the wiring main body 31.

[0063] A second dummy wiring 42 extends from the portion between the outer peripheral end 31A and the inner peripheral end 31B of the wiring main body 31, wound 0.5 turns from the outer peripheral end 31A. The second dummy wiring 42 extends to the side surface of the second layer L2 and is exposed on the outer surface of the inductor component 10. In this embodiment, the inductor wiring 30, the first dummy wiring 41, and the second dummy wiring 42 are integrated.

[0064] like Figure 4 As shown, the inductor wiring 30 has a stacked structure including a catalyst layer 30A, a first wiring layer 30B, and a second wiring layer 30C in this order from the first magnetic layer 21 side constituting the first layer L1. The catalyst layer 30A of the inductor wiring 30 contacts the upper surface of the first magnetic layer 21 and constitutes the main surface MF of the second layer L2. The material of the catalyst layer 30A is palladium. Figure 4 In FIG. 1 , only the inductor wiring 30 and the first magnetic layer 21 described above are shown, and illustration of other structures is omitted.

[0065] The first wiring layer 30B is directly stacked on the upper surface of the catalyst layer 30A. The ratio of copper in the material of the first wiring layer 30B is less than 99wt%, and the ratio of nickel is more than 0.1wt%. The thickness TB of the first wiring layer 30B is less than one tenth of the wiring width of the inductor wiring 30. In the present embodiment, the thickness TB of the first wiring layer 30B is 2.0μm. Here, within an observation field of view of a cross section along the stacking direction observed with a 1500x microscope, the dimensions from the upper end of the first magnetic layer 21 to the upper end of the first wiring layer 30B are measured at three locations, and the thickness TB of the first wiring layer 30B is determined as the average value of the measured values ​​at these three locations. In the present embodiment, the thickness TB of the first wiring layer 30B is approximately constant. In addition, Figure 4 The thickness of the catalyst layer 30A is exaggerated in the figure, but it is actually much smaller than the thickness of the first wiring layer 30B. Therefore, when measuring the thickness TB of the first wiring layer 30B, it does not matter if the thickness TB is measured from the top end of the first magnetic layer 21, that is, including the thickness of the catalyst layer 30A. However, if the interface of the catalyst layer 30A can be clearly identified, the thickness TB can also be measured from the top surface of the catalyst layer 30A. The wiring width of the inductor wiring 30 is determined as the average of the width dimensions of the inductor wiring 30 at three locations near the center of the inductor wiring 30 in the extension direction.

[0066] The second wiring layer 30C is directly stacked on the surface of the first wiring layer 30B on the third magnetic layer 23 side, that is, the upper surface. The thickness TC of the second wiring layer 30C is more than 5 times the thickness TB of the first wiring layer 30B. In this embodiment, the thickness TC of the second wiring layer 30C is 45 μm. Therefore, Figure 3 As shown, the total thickness TA of the inductor wiring 30 is the sum of the thickness TB of the first wiring layer 30B and the thickness TC of the second wiring layer 30C, which is approximately 47 μm. The copper content of the second wiring layer 30C is 99 wt % or more, and the nickel content is below the detection limit.

[0067] like Figure 4 As shown, anchor portions 34 extend from principal surface MF of inductor wiring 30. Anchor portions 34 cover the surfaces of the plurality of metal magnetic powders 20B in first magnetic layer 21 that are in contact with principal surface MF. Therefore, anchor portions 34 extend from principal surface MF into the space between substrate 20A and metal magnetic powder 20B in first magnetic layer 21. Furthermore, the metal magnetic powder 20B covered by anchor portions 34 includes a cross-section where at least one-third of the surface of the metal magnetic powder 20B is covered by anchor portions 34 when viewed in cross section. In this embodiment, this cross-section is perpendicular to principal surface MF.

[0068] like Figure 1As shown, in the inductor trace 30 on the second layer L2, the 0.5-turn portion on the first pad 32 side and the 0.5-turn portion on the second pad 33 side extend parallel to each other. Furthermore, the distance between the traces in the inductor trace 30 is minimized between the radially inner side of the 0.5-turn portion on the first pad 32 side and the radially outer side of the 0.5-turn portion on the second pad 33 side. Furthermore, in the second layer L2, a first insulating portion 81 is interposed between the radially inner side of the 0.5-turn portion on the first pad 32 side and the radially outer side of the 0.5-turn portion on the second pad 33 side. Specifically, the first insulating portion 81 is interposed at the location where the distance between the inductor traces 30 is minimized and extends in an arc shape along the inductor trace 30. Furthermore, the first insulating portion 81 is composed of an epoxy resin and an inorganic filler with an average particle size of 1.0 μm or less.

[0069] In the second layer L2, the portion other than the inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, and the first insulating portion 81 constitutes the second magnetic layer 22. Therefore, the second magnetic layer 22 exists in the center of the second layer L2, outside the inductor wiring 30. Consequently, the surface of the inductor wiring 30 opposite the first insulating portion 81 is in contact with the second magnetic layer 22. Furthermore, the second magnetic layer 22 is made of the same material as the first magnetic layer 21. Thus, the second magnetic layer 22 is located in the same layer as the inductor wiring 30.

[0070] A third layer L3, identical to the second layer L2 and having a square shape when viewed from above and below, is stacked on the upper surface of the second layer L2. The third layer L3 is composed of a first vertical wiring 51, a second vertical wiring 52, the third magnetic layer 23, and a second insulating portion 82. The first and second vertical wirings 51 and 52 are connected to the inductor wiring 30 and penetrate the third magnetic layer 23 from the principal surface of the third magnetic layer 23 on the inductor wiring 30 side toward the principal surface of the third magnetic layer 23 on the side opposite the inductor wiring 30 side.

[0071] The first vertical wiring 51 is directly connected to the upper surface of the first pad 32 without passing through other layers. The first vertical wiring 51 is cylindrical, with the cylindrical axis oriented in the vertical direction. When viewed from above, the diameter of the circular first vertical wiring 51 is smaller than the diameter of the first pad 32. The material of the first vertical wiring 51 is the same as that of the second wiring layer 30C of the inductor wiring 30.

[0072] The second vertical wiring 52 is directly connected to the upper surface of the second pad 33 without passing through other layers. The second vertical wiring 52 is cylindrical, and the axial direction of the cylinder is consistent with the up-down direction. When viewed from the up-down direction, the diameter of the circular second vertical wiring 52 is smaller than the diameter of the second pad 33. The material of the second vertical wiring 52 is the same as that of the second wiring layer 30C of the inductor wiring 30. In addition, the second wiring layer 30C of the inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the first vertical wiring 51 and the second vertical wiring 52 are integrated. In addition, in Figure 2 In FIG. 5 , the first vertical wiring 51 and the second vertical wiring 52 are virtually illustrated by two-dot chain lines.

[0073] like Figure 1 As shown, the second insulating portion 82 is directly connected to the upper surface of the first insulating portion 81 without passing through other layers. The second insulating portion 82 covers a wider range than the first insulating portion 81 in the width direction orthogonal to the extension direction of the first insulating portion 81. As a result, the second insulating portion 82 covers a portion of the upper surface of the 0.5-turn portion on the side of the first pad 32 and a portion of the upper surface of the 0.5-turn portion on the side of the second pad 33 in the inductor wiring 30. The thickness of the second insulating portion 82 is smaller than the thickness of the third layer L3, in which the third magnetic layer 23 is stacked on the upper side of the second insulating portion 82. In addition, the second insulating portion 82 is composed of an epoxy resin and an inorganic filler with an average particle size of less than 1.0 μm, similar to the first insulating portion 81. In addition, in this embodiment, the insulating layer 80 is formed by the first insulating portion 81 and the second insulating portion 82. In addition, Figure 2 In FIG, the second insulating portion 82 is virtually indicated by a two-dot chain line.

[0074] like Figure 1 As shown, in the third layer L3, the portion other than the second insulating portion 82, the first vertical wiring 51, and the second vertical wiring 52 constitutes the third magnetic layer 23. Therefore, the third magnetic layer 23 is stacked on the main surfaces of the inductor wiring 30 and the second magnetic layer 22 on the upper side in the stacking direction, opposite to the first magnetic layer 21.

[0075] like Figure 3 As shown, a cover layer 60 made of an insulating material is laminated on the main surface of the third layer L3, which is on the upper side, opposite to the inductor wiring 30. The cover layer 60 covers substantially the entire upper surface of the third layer L3. However, holes are formed in locations corresponding to the first and second vertical wirings 51 and 52 in the third layer L3. In other words, the upper surfaces of the first and second vertical wirings 51 and 52, which are opposite to the inductor wiring 30, are not covered by the cover layer 60.

[0076] An external electrode 70 is connected to the upper surface of the first vertical wiring 51. The external electrode 70 penetrates the cover layer 60, and the upper surface of the external electrode 70 is exposed from the cover layer 60. The external electrode 70 has a three-layer structure, consisting of a copper layer 70A, a nickel layer 70B, and a gold layer 70C in order from the bottom in the stacking direction. In addition, an external electrode 70 is also connected to the upper surface of the second vertical wiring 52. Figure 1 In the figure, the cover layer 60 and the external electrode 70 are omitted.

[0077] Next, a method for manufacturing the inductor component 10 according to the first embodiment will be described.

[0078] like Figure 5 As shown, the manufacturing method of the inductor component 10 includes a first magnetic layer processing step, a first covering step, an inductor wiring processing step, a first resist layer removal step, an insulating layer processing step, a second covering step, a vertical wiring processing step, a second resist layer removal step, a second magnetic layer processing step, a covering layer processing step, a base substrate removal step, an external electrode processing step, and a singulation step.

[0079] When manufacturing the inductor component 10, first, a first magnetic layer processing step is performed. Figure 6 As shown in FIG. 1 , a base substrate 95 with copper foil is prepared. The base substrate 96 of the base substrate 95 with copper foil is in the form of a plate. Copper foil 97 is laminated on the upper surface of the base substrate 96 in the lamination direction. Figure 7 As shown, a first magnetic layer 21 composed of a base material 20A and metal magnetic powder 20B is formed on the upper surface of the copper foil 97 of the base substrate 95 with copper foil. When forming the first magnetic layer 21, an insulating resin containing the metal magnetic powder 20B is applied and solidified by stamping to form the base material 20A. Then, the upper portions of the base material 20A and the metal magnetic powder 20B are ground to adjust the vertical dimensions of the first magnetic layer 21 to the desired dimensions. In addition, it is preferable to form a micro-gap at the interface between the base material 20A and the metal magnetic powder 20B by adjusting the process parameters during grinding. For example, the metal magnetic powder 20B exposed from the base material 20A can be vibrated by a grinding tool to form a micro-gap between the base material 20A and the base material 20A. More specifically, when grinding the upper portion of substrate 20A and metal magnetic powder 20B, the grinding tool comes into contact with substrate 20A and metal magnetic powder 20B. Since metal magnetic powder 20B is harder than substrate 20A, which is made of insulating resin, the grinding tool vibrates accordingly, causing the metal magnetic powder 20B to vibrate more. This difference in vibration between substrate 20A and metal magnetic powder 20B creates a slight gap.

[0080] After the first magnetic layer processing step, the first covering step is performed. Figure 8As shown, in the first covering step, a first resist layer 91 covering the portion of the upper surface of the first magnetic layer 21 where the inductor wiring 30, the first dummy wiring 41, and the second dummy wiring 42 are not formed is patterned using photolithography. Specifically, a photosensitive dry film resist is first applied to the entire upper surface of the first magnetic layer 21. Next, the portion of the upper surface of the first magnetic layer 21 where the inductor wiring 30, the first dummy wiring 41, and the second dummy wiring 42 are not formed is exposed. As a result, the exposed portion of the applied dry film resist cures. The uncured portion of the applied dry film resist is then removed using a chemical solution. The cured portion of the applied dry film resist thus forms the first resist layer 91. On the other hand, the first magnetic layer 21 is exposed in the portion of the applied dry film resist that has been removed by the chemical solution and is not covered by the first resist layer 91.

[0081] After the first covering step, the inductor wiring process is performed. In the inductor wiring process, the inductor wiring 30 composed of the catalyst layer 30A, the first wiring layer 30B and the second wiring layer 30C is formed on the upper surface of the first magnetic layer 21. Specifically, first, as shown in FIG. Figure 9 As shown, palladium is adsorbed onto the portion of the upper surface of the first magnetic layer 21 not covered by the first resist layer 91. The palladium adsorbed onto the upper surface of the first magnetic layer 21 thus forms a catalyst layer 30A. Next, electroless copper plating is performed by immersing the layer in an electroless copper plating solution, forming a first wiring layer 30B having a copper ratio of 99 wt% or less and a nickel ratio of 0.1 wt% or greater on the upper surface of the catalyst layer 30A. The electroless copper plating solution is an alkaline solution containing copper salts such as copper chloride and copper sulfate. Meanwhile, the metal magnetic powder 20B is made of iron, which has a greater ionization tendency than the copper that forms the first wiring layer 30B. Therefore, during the inductor wiring process, the iron on the surface of the metal magnetic powder 20B melts, and copper forms a film on the surface of the metal magnetic powder 20B in its place.

[0082] Here, the electroless copper plating solution also enters the minute gap between substrate 20A and metal magnetic powder 20B. Therefore, iron is replaced by copper not only on the exposed surface of metal magnetic powder 20B, but also on the surface of metal magnetic powder 20B inside substrate 20A. Furthermore, the copper film formed on the surface of metal magnetic powder 20B inside substrate 20A functions as anchor 34.

[0083] The coating amount is adjusted in this manner so that the copper film formed on the surface of the metal magnetic powder 20B on the inner side of the substrate 20A covers at least one-third of the surface area of ​​the metal magnetic powder 20B. Specifically, this can be adjusted based on the voltage application time and current of the electroless copper plating, the copper content of the plating solution, the catalyst content, and other factors.

[0084] After electroless copper plating, Figure 10 As shown, electrolytic copper plating is performed. This forms second wiring layer 30C having a copper ratio of 99 wt % or more on the surface of first wiring layer 30B. In this way, inductor wiring 30 is formed by adsorption of palladium, electroless copper plating, and electrolytic copper plating.

[0085] After the inductor wiring process, the first resist layer removal process is performed to remove the first resist layer 91. Figure 11 As shown, in the first resist layer removal step, the first resist layer 91 is separated from the first magnetic layer 21 and peeled off.

[0086] After the first resist layer removal process, the insulating layer processing process is performed. Figure 12 As shown, in the insulating layer processing step, first, insulating resin is applied to the upper surface of the first magnetic layer 21, the inductor wiring 30, the first dummy wiring 41 and the second dummy wiring 42. Figure 13 As shown, the portions forming the first insulating portion 81 and the second insulating portion 82 are exposed. As a result, the exposed portions are cured. Then, the uncured portions of the insulating resin are removed using a chemical stripping solution. Thus, the cured portions of the applied insulating resin form the insulating layer 80.

[0087] After the insulating layer processing step, the second covering step is performed. Figure 14 As shown, in the second covering step, the second resist layer 92 is patterned to cover the upper surface of the first magnetic layer 21 and the upper surface of the second wiring layer 30C, where the first vertical wiring 51 and the second vertical wiring 52 are not formed. The photolithography method in the second covering step is the same as that in the first covering step, and therefore a detailed description thereof is omitted.

[0088] After the second covering step, a vertical wiring processing step is performed to form the first vertical wiring 51 and the second vertical wiring 52. In the vertical wiring processing step, electrolytic copper plating is performed to form the first vertical wiring 51 and the second vertical wiring 52 with a copper ratio of 99 wt % or greater on the portion of the upper surface of the second wiring layer 30C not covered by the second resist layer 92.

[0089] After the vertical wiring process, such as Figure 15As shown, a second resist layer removal step is performed to remove the second resist layer 92. In the second resist layer removal step, similarly to the first resist layer removal step, the second resist layer 92 is separated from the first magnetic layer 21 and peeled off.

[0090] After the second resist layer removal process, the second magnetic layer processing process is performed. Figure 16 As shown, in the second magnetic layer processing step, magnetic material is first filled from the upper surface of the first magnetic layer 21 to the upper side in the stacking direction above the upper ends of the first vertical wiring 51 and the second vertical wiring 52. Next, grinding is performed from the upper side in the stacking direction until the upper ends of the first vertical wiring 51 and the second vertical wiring 52 are exposed, thereby forming the second magnetic layer 22 and the third magnetic layer 23.

[0091] After the second magnetic layer processing step, the cover layer processing step is performed. Figure 17 As shown, in the covering layer processing step, the solder resist functioning as the covering layer 60 is patterned by photolithography on the portion of the upper surface of the third magnetic layer 23, the upper surface of the first vertical wiring 51, and the upper surface of the second vertical wiring 52 where the external electrode 70 is not formed.

[0092] After the cover layer processing step, the base substrate removal step is performed. Figure 18 As shown, in the base substrate removal step, base substrate 95 with copper foil is removed. Specifically, base substrate 96 is separated from first magnetic layer 21 and peeled off. Next, copper foil 97 is removed by etching. Furthermore, first magnetic layer 21 is ground from the lower side in the stacking direction until the dimension from the lower end of first magnetic layer 21 to the upper end of cover layer 60 reaches the desired value.

[0093] After the base substrate removal process, the external electrode processing process is carried out. Figure 19 As shown, an external electrode 70 is formed on the upper surface of the first vertical wiring 51. Furthermore, an external electrode 70 is formed on the upper surface of the second vertical wiring 52. The external electrodes 70 are electrolessly plated with copper, nickel, and gold, respectively, to form a copper layer 70A, a nickel layer 70B, and a gold layer 70C. This results in a three-layer structure for the external electrodes 70.

[0094] After the external electrode processing step, the singulation step is performed. Figure 20 As shown, the inductor component 10 is singulated by dicing along the dotted line DL. Thus, the inductor component 10 is obtained. In this case, the first dummy wiring 41 and the second dummy wiring 42 included in the dotted line DL are exposed on the side surfaces of the inductor component 10.

[0095] Next, the effects of the above-mentioned first embodiment will be described.

[0096] (1) According to the inductor component 10 of the first embodiment described above, in the second layer L2 where the inductor wiring 30 is arranged, an insulating layer 80 is arranged on a portion of the side surface of the inductor wiring 30. Therefore, insulation between the inductor wirings 30 can be ensured. Meanwhile, the surface of the inductor wiring 30 facing the first magnetic layer 21 is not covered by the insulating layer 80 but is in contact with the first magnetic layer 21. The absence of the insulating layer 80 on the surface facing the first magnetic layer 21 allows the proportion of the insulating layer 80 in the inductor component 10 to be reduced, while the proportion of the first magnetic layer 21 in the inductor component 10 can be increased. Therefore, if the volume of the inductor component 10 remains the same, the larger proportion of the first magnetic layer 21 is advantageous in terms of inductance.

[0097] (2) In the inductor component 10 of the first embodiment, the number of turns of the inductor wiring 30 is 1.5. Since the number of turns of the inductor wiring 30 is greater than 1.0, there is a range where the inductor wiring 30 is relatively close together. According to the first embodiment, an insulating layer 80 is interposed between the inductor wirings 30 at the location where the distance between the inductor wirings 30 is the smallest. This ensures insulation at the location most susceptible to short circuits between the inductor wirings 30.

[0098] (3) According to the inductor component 10 of the first embodiment, a portion of the surface of the inductor wiring 30 on the third magnetic layer 23 side is covered with the insulating layer 80. This facilitates ensuring insulation from the third magnetic layer 23 side where the external electrode 70 is arranged.

[0099] (4) According to the inductor component 10 of the first embodiment, the thickness TC of the second wiring layer 30C is five times or more the thickness TB of the first wiring layer 30B. Therefore, the thickness TA of the inductor wiring 30 can be increased accordingly, thereby reducing the DC resistance.

[0100] (5) According to the method for manufacturing the inductor component 10 of the first embodiment, electrolytic copper plating is performed to form the second wiring layer 30C on the surface of the first wiring layer 30B, wherein the copper content is 99 wt% or greater and the nickel content is below the detection limit. Therefore, compared to electroless copper plating, the second wiring layer 30C can be efficiently formed with a greater thickness.

[0101] (6) According to the inductor component 10 of the first embodiment, the catalyst layer 30A is disposed on the first magnetic layer 21 side of the first wiring layer 30B. The catalyst layer 30A activates the deposition of copper during electroless copper plating. Therefore, the palladium serving as the catalyst is adsorbed in a layered manner across the entire surface of the first magnetic layer 21. This allows copper to be deposited across the entire surface of the first magnetic layer 21 during electroless copper plating, making it easier to form the first wiring layer 30B with a uniform thickness.

[0102] (7) According to the inductor component 10 of the first embodiment, the cover layer 60 covers the upper surface of the third layer L3. Therefore, it is easy to ensure insulation from the outside.

[0103] (8) According to the inductor component 10 of the first embodiment, the insulating layer 80 contains an epoxy resin and an inorganic filler. Therefore, even if the thickness of the first magnetic layer 21 is reduced accordingly, physical defects such as cracks are less likely to occur, and sufficient strength can be maintained without providing a separate insulating substrate.

[0104] (9) According to the inductor component 10 of the first embodiment described above, the anchor portion 34 extends from the surface below the catalyst layer 30A, which constitutes the main surface MF of the inductor wiring 30. Furthermore, the anchor portion 34 covers the surface of the metal magnetic powder 20B dispersed in the substrate 20A of the first magnetic layer 21. Therefore, the anchor portion 34 provides an anchoring effect between the inductor wiring 30 and the first magnetic layer 21. As a result, the adhesion between the inductor wiring 30 and the first magnetic layer 21 is improved. Thus, in the inductor component 10, the required adhesion is ensured between the inductor wiring 30 and the first magnetic layer 21, and the inductor wiring 30 is directly laminated on the first magnetic layer 21.

[0105] (10) According to the inductor component 10 of the first embodiment, the metal magnetic powder 20B covered by the anchor portion 34 includes a cross-section in which at least one-third of the surface of the metal magnetic powder 20B is covered by the anchor portion 34 when the metal magnetic powder 20B is observed in cross section. Therefore, the anchor portion 34 is relatively large, and thus the inductor wiring 30 and the first magnetic layer 21 can be securely and closely bonded.

[0106] (11) According to the manufacturing method of the inductor component 10 of the first embodiment described above, during the inductor wiring processing step, the metal magnetic powder 20B is exposed on a portion of the surface of the first magnetic layer 21. By immersing the first magnetic layer 21 in a plating solution, the inductor wiring 30 is formed on a portion of the surface of the first magnetic layer 21. Therefore, by allowing the plating solution to enter between the substrate 20A and the metal magnetic powder 20B in the first magnetic layer 21, the anchor portion 34 can be formed on the surface of the metal magnetic powder 20B on the inner side of the substrate 20A.

[0107] (12) According to the manufacturing method of the inductor component 10 of the first embodiment described above, electroless copper plating is performed by immersing the inductor component 10 in an electroless copper plating solution to form the first wiring layer 30B having a copper ratio of 99 wt% or less and a nickel ratio of 0.1 wt% or greater on the upper surface of the catalyst layer 30A. Therefore, when forming the first wiring layer 30B by sputtering or the like, for example, damage to the surface of the first magnetic layer 21 is relatively minimal, and the first wiring layer 30B can be formed without excessively reducing the amount of the metal magnetic powder 20B in the first magnetic layer 21.

[0108] (13) According to the inductor component 10 of the first embodiment, iron, the material of the metal magnetic powder 20B, has a higher ionization tendency than copper, the material of the first wiring layer 30B. Therefore, between the copper salt in the electroless copper plating and the surface of the metal magnetic powder 20B, the iron, which has a higher ionization tendency, becomes ions, and copper, which has a lower ionization tendency, precipitates. Consequently, even when the substrate 20A and the metal magnetic powder 20B are relatively close together, copper can be precipitated to cover the surface of the metal magnetic powder 20B.

[0109] <Second embodiment>

[0110] Hereinafter, a second embodiment of the inductor component will be described.

[0111] like Figure 21 As shown in FIG, the inductor component 110 as a whole has a structure in which six plate-shaped layers are stacked in the thickness direction. In the following description, the stacking direction of the six stacked layers is described as the vertical direction.

[0112] The first layer L11 is rectangular when viewed from the top and bottom. The first layer L11 is composed only of the first magnetic layer 121. Figure 24 As shown, in the first magnetic layer 121, metal magnetic powder 120B is dispersed within a base material 120A made of an insulating material. Therefore, the entire first magnetic layer 121 is composed of a magnetic material. Specifically, base material 120A is composed of an epoxy resin and an inorganic filler with an average particle size of 1.0 μm or less, while metal magnetic powder 120B is an alloy of iron, silicon, and chromium, with an average particle size of 5.0 μm or less. In this embodiment, the first layer L11 is the bottommost layer in the vertical direction. Specifically, the side in the vertical direction where the external electrode 230 (described later) is located is considered the top side, and the opposite side is considered the bottom side.

[0113] like Figure 21As shown, a second layer L12, identical to the first layer L11 and having a rectangular shape when viewed from above and below, is stacked on the upper surface of the first layer L11 in the stacking direction. In this embodiment, the surface of the second layer L12 that contacts the first layer L11 is the principal surface MF2 of the second layer L12. The second layer L12 is composed of a second magnetic layer 122, a first inductor trace 130, a first dummy trace 141, a first connecting trace 146, and a first insulating portion 181. The first inductor trace 130 consists of a first trace body 131 with a substantially constant trace width, a first pad 132 connected to a first end of the first trace body 131, and a second pad 133 connected to a second end of the first trace body 131. Therefore, the first inductor trace 130 is stacked on the outer surface of the first magnetic layer 121.

[0114] like Figure 22 As shown, in the second layer L12, when viewed from above in the vertical direction, the first wiring main body 131 of the first inductor wiring 130 extends in a spiral shape centered near the center of the rectangular surface of the second layer L12 opposite the main surface MF2. Specifically, the first wiring main body 131 of the first inductor wiring 130 is wound in a clockwise spiral from a first end on the radially outer side toward a second end on the radially inner side.

[0115] In this embodiment, the first inductor wiring 130 is wound at an angle of 540 degrees. Therefore, in this embodiment, the number of turns of the first inductor wiring 130 is 1.5. Furthermore, in this embodiment, when viewing the second layer L12 from above, along the longitudinal direction of the rectangular second layer L12, the side where the first end of the first wiring main body 131 is arranged is designated as the first end side, and the side where the second end of the first wiring main body 131 is arranged is designated as the second end side.

[0116] A first pad 132 is connected to a first end on one side of the first wiring main body 131 in its extending direction. First pad 132 has a generally rectangular shape when viewed from above. It constitutes the first end portion of first inductor wiring 130. First pad 132 is positioned near a corner of the rectangular second layer L12 when viewed from above. The width of first pad 132 is greater than the width of the first wiring main body 131 connected to it.

[0117] A second pad 133 is connected to the second end on the other side of the first wiring main body 131 in the extending direction. Second pad 133 has a circular shape when viewed from above in the vertical direction. Second pad 133 constitutes the second end portion of first inductor wiring 130. The diameter of the circle of second pad 133 is larger than that of first wiring main body 131 to which it is connected.

[0118] A first dummy wiring 141 is connected to the first pad 132 . The first dummy wiring 141 extends from a portion of the first pad 132 opposite to the first wiring body 131 to the side surface of the second layer L12 and is exposed on the outer surface of the inductor component 110 .

[0119] In the second layer L12, when viewed from the top in the vertical direction, a first connecting wiring 146 is arranged near a corner of the rectangular second layer L12 on the side opposite to the first pad 132 in the short-side direction and on the first end side in the long-side direction. The first connecting wiring 146 has the same shape as the first pad 132 and the first dummy wiring 141, and is linearly symmetrical about a straight line passing through the center of the short-side direction of the second layer L12 and extending in the long-side direction of the second layer L12 as an axis of symmetry.

[0120] like Figure 23 As shown, first inductor wiring 130 has a stacked structure comprising a first wiring layer 130B and a second wiring layer 130C, sequentially from the first magnetic layer 121 side of first layer L11. First wiring layer 130B of first inductor wiring 130 contacts the top surface of first magnetic layer 121 and occupies most of the surface of first inductor wiring 130, which forms main surface MF2 of second layer L12.

[0121] The copper content of the first wiring layer 130B is less than 99 wt %, and the nickel content is 0.1 wt %. The thickness TB2 of the first wiring layer 130B is less than one-tenth the width of the inductor wiring 30. In this embodiment, the thickness TB2 of the first wiring layer 130B is 2.0 μm. Within a single field of view of a cross-section along the stacking direction observed at 1500x magnification, the dimensions from the upper end of the first magnetic layer 121 to the upper end of the first wiring layer 130B are measured at three locations in the stacking direction. The thickness TB2 of the first wiring layer 130B is determined as the average of the values ​​measured at these three locations. In this embodiment, the thickness TB2 of the first wiring layer 130B is substantially constant. Furthermore, the width of the first inductor wiring 130 is determined as the average of the three measurements taken near the center of the first inductor wiring 130's width in the direction of extension.

[0122] A second wiring layer 130C is stacked on the upper surface of first wiring layer 130B, opposite first magnetic layer 121. Second wiring layer 130C covers a slightly wider area from the upper side in the stacking direction than first wiring layer 130B. Specifically, the side surfaces of first wiring layer 130B that face perpendicular to the stacking direction are covered by second wiring layer 130C. Furthermore, a portion of the outer surface of second wiring layer 130C forms part of the surface of first inductor wiring 130 that constitutes main surface MF2 of second layer L12.

[0123] The thickness TC2 of the second wiring layer 130C is at least five times the thickness TB2 of the first wiring layer 130B. In this embodiment, the thickness TC2 of the second wiring layer 130C is 45 μm. Therefore, the thickness of the first inductor wiring 130, consisting of the first wiring layer 130B and the second wiring layer 130C, is approximately 47 μm. Within a single field of view, a cross-section including the stacking direction is observed at 1500x magnification. The dimensions in the stacking direction from the upper end of the first wiring layer 130B to the upper end of the second wiring layer 130C are measured at three locations. The thickness TC of the second wiring layer 130C is determined as the average of the three measured values. The copper content of the material of the second wiring layer 130C is at least 99 wt%, and the nickel content is below the detection limit.

[0124] like Figure 24 As shown, anchor portion 134 extends from principal surface MF2 of first inductor wiring 130. In this embodiment, anchor portion 134 extends from either first wiring layer 130B or second wiring layer 130C, which constitute principal surface MF2 of first inductor wiring 130. Anchor portion 134 covers the surface of metal magnetic powder 120B in contact with principal surface MF2, among the plurality of metal magnetic powders 120B in first magnetic layer 121. Therefore, anchor portion 134 extends from principal surface MF2 into the space between substrate 120A and metal magnetic powder 120B in first magnetic layer 121. Furthermore, the metal magnetic powder 120B covered by anchor portion 134 includes a cross-section where, when viewed in cross-section, at least one-third of the surface of the metal magnetic powder 120B is covered by anchor portion 134.

[0125] like Figure 22 As shown, in the second layer L12, the side surfaces of the first inductor wiring 130, the side surfaces of the first dummy wiring 141, and the side surfaces of the first connecting wiring 146 are covered by the first insulating portion 181. Specifically, the first inductor wiring 130, the first dummy wiring 141, and the first connecting wiring 146 are surrounded by the first insulating portion 181. The first insulating portion 181 is made of insulating resin and has higher insulation properties than the first inductor wiring 130. Furthermore, the first insulating portion 181 contains an inorganic filler. Furthermore, the portion excluding the first inductor wiring 130, the first dummy wiring 141, the first connecting wiring 146, and the first insulating portion 181 constitutes the second magnetic layer 122. Therefore, the second magnetic layer 122 is disposed in the center, at both ends of the second layer L12 in the short-side direction, and at the first end of the second layer L12 in the long-side direction. The material of the second magnetic layer 122 is the same as that of the first magnetic layer 121. Furthermore, as described above, the first layer L11 is composed only of the first magnetic layer 121 . Therefore, the lower surface of the first inductor wiring 130 is in contact with the first magnetic layer 121 without the first insulating portion 181 being interposed therebetween.

[0126] A third layer L13 having the same rectangular shape as the second layer L12 is stacked on the upper surface of the second layer L12. The third layer L13 includes a second insulating portion 182, a first via 191, a second via 192, a third via 193, and a third magnetic layer 123.

[0127] The first via 191 is located above the first pad 132 of the second layer L12 and is connected to the first pad 132. The second via 192 is located above the first connection wiring 146 of the second layer L12 and is connected to the first connection wiring 146. The third via 193 is located above the second pad 133 of the second layer L12 and is connected to the second pad 133. These first, second, and third vias 191, 192, and 193 are columnar, with their axial directions aligned with the stacking direction. The dimensions of the first, second, and third vias 191, 192, and 193 in the stacking direction are identical to those of the third layer L13. Therefore, the first, second, and third vias 191, 192, and 193 penetrate the third magnetic layer 123 in the stacking direction.

[0128] Second insulating portion 182 covers first inductor wiring 130, first dummy wiring 141, first connecting wiring 146, and first insulating portion 181 from above. Specifically, second insulating portion 182 covers the entire upper surface of each wiring arranged in second layer L12, except for the areas where first vias 191, second vias 192, and third vias 193 are arranged. When viewed from above, second insulating portion 182 has a shape that covers an area slightly wider than the outer edges of first inductor wiring 130, first dummy wiring 141, and first connecting wiring 146. Second insulating portion 182 is made of the same insulating resin as first insulating portion 181 and contains an inorganic filler. In this embodiment, first insulating portion 181 and second insulating portion 182 constitute first insulating layer 180. Specifically, in this embodiment, the upper surface in the stacking direction and the surface on the second magnetic layer 122 side of the first inductor wiring 130 , excluding the first and third vias 191 and 193 , are covered by and in contact with the first insulating layer 180 .

[0129] The third layer L13, excluding the first conductive via 191, the second conductive via 192, the third conductive via 193, and the second insulating portion 182, constitutes the third magnetic layer 123. Therefore, the third magnetic layer 123 is disposed in the center of the third layer L13, at both ends in the short-side direction of the third layer L13, and at the first end in the long-side direction of the third layer L13. The third magnetic layer 123 is made of the same magnetic material as the first magnetic layer 121 described above.

[0130] Stacked on the upper surface of the third layer L13 is a fourth layer L14, which is similar to the third layer L13 and has a rectangular shape when viewed from above. The fourth layer L14 is composed of a second inductor wiring 135, a second dummy wiring 142, a second connecting wiring 147, a third insulating portion 183, and the fourth magnetic layer 124. The second inductor wiring 135 consists of a second wiring main body 136 with a substantially constant wiring width, a third pad 137 connected to the first end of the second wiring main body 136, and a fourth pad 138 connected to the second end of the second wiring main body 136. Specifically, the second inductor wiring 135 is arranged on the upper principal surface of the third magnetic layer 123, which is opposite to the first inductor wiring 130, and is stacked in the stacking direction with a gap corresponding to the third layer L13. In this embodiment, the third pad 137 represents the first end of the second inductor wiring 135, and the fourth pad 138 represents the second end of the second inductor wiring 135.

[0131] On the fourth layer L14, when viewed from above in the vertical direction, the second wiring main body 136 of the second inductor wiring 135 extends in a spiral shape centered near the center of the rectangular surface of the fourth layer L14 opposite the main surface MF3. Specifically, the second wiring main body 136 of the second inductor wiring 135 is spirally wound counterclockwise from a first end on the radially outer side toward a second end on the radially inner side. In other words, the winding direction of the second inductor wiring 135 is opposite to the winding direction of the first inductor wiring 130.

[0132] In this embodiment, the second inductor wiring 135 is wound at an angle of 540 degrees. Therefore, in this embodiment, the second inductor wiring 135 is wound 1.5 times.

[0133] A third pad 137 is connected to a first end on one side of the second wiring main body 136 in the direction in which it extends. Third pad 137 has a generally rectangular shape when viewed from above and below. It constitutes the first end portion of the second inductor wiring 135. Third pad 137 is positioned near a corner of the rectangular fourth layer L14 when viewed from above and below. Third pad 137 has a wider wiring width than the second wiring main body 136 to which it is connected.

[0134] A fourth pad 138 is connected to the second end on the other side of the second wiring main body 136 in the direction of its extension. Fourth pad 138 has a circular shape when viewed from above and below. Fourth pad 138 is located above second pad 133 in second layer L12 and is connected to second pad 133 via third via 193. Fourth pad 138 has a wider wiring width than second wiring main body 136 connected to it. Fourth pad 138 constitutes the second end portion of second inductor wiring 135.

[0135] A second dummy wiring 142 is connected to the third pad 137 . The second dummy wiring 142 extends from a portion of the third pad 137 opposite to the second wiring body 136 to the side surface of the fourth layer L14 and is exposed on the outer surface of the second inductor wiring 135 .

[0136] In the fourth layer L14, when viewed from the upper side in the vertical direction, a second connecting wiring 147 is arranged near the corner of the rectangular fourth layer L14 on the opposite side of the third pad 137 in the short side direction and on the first end side in the long side direction. The second connecting wiring 147 has the same shape as the third pad 137 and the second dummy wiring 142, and is linearly symmetrical with a straight line passing through the center of the short side direction of the fourth layer L14 and extending in the long side direction of the fourth layer L14 as the axis of symmetry. Figure 22 In FIG, the second inductor wiring 135 and the second connection wiring 147 are indicated by dotted lines.

[0137] Here, as Figure 23 As shown, third via 193 is integrated with second inductor wiring 135. Furthermore, although not shown, second via 192 and second dummy wiring 142 are also integrated with second inductor wiring 135. Furthermore, second connecting wiring 147 is integrated with first via 191. In the following description, this integrated structure is referred to as second conductive layer 200. Second conductive layer 200 has a stacked structure comprising a third wiring layer 200A and a fourth wiring layer 200B. Third wiring layer 200A forms a portion of the lower end of second conductive layer 200. Therefore, the portion of third wiring layer 200A located below first via 191 and third via 193 contacts first inductor wiring 130. Furthermore, the portion of third wiring layer 200A located below second via 192 contacts first connecting wiring 146. Furthermore, the lower portion of the third wiring layer 200A, excluding the first via 191, the second via 192, and the third via 193, contacts the upper surface of the second insulating portion 182. The material of the third wiring layer 200A includes titanium and chromium.

[0138] The fourth wiring layer 200B is stacked on the upper surface of the third wiring layer 200A, which is opposite to the third magnetic layer 123. The ratio of copper in the material of the fourth wiring layer 200B is 99 wt% or more.

[0139] The upper end of the fourth wiring layer 200B is flush with the upper end of the fourth layer L14 .

[0140] like Figure 21As shown, in fourth layer L14, the side surfaces of second inductor traces 135 are covered by third insulating portion 183. Therefore, third insulating portion 183 is interposed between the shortest distances between second inductor traces 135. Third insulating portion 183 is made of insulating resin and has higher insulation properties than second inductor traces 135. Furthermore, unlike first insulating layer 180, third insulating portion 183 does not contain inorganic filler. Third insulating portion 183 is generally curved.

[0141] Furthermore, the portion excluding the second inductor wiring 135, the second dummy wiring 142, the second connecting wiring 147, and the third insulating portion 183 constitutes the fourth magnetic layer 124. Therefore, the fourth magnetic layer 124 is disposed in the center portion of the fourth layer L14, at both ends in the short-side direction of the fourth layer L14, and at the first end in the long-side direction of the fourth layer L14. The fourth magnetic layer 124 is made of the same material as the first magnetic layer 121.

[0142] A fifth layer L15, identical to the fourth layer L14 and having a rectangular shape when viewed from above, is stacked on the upper surface of the fourth layer L14. The fifth layer L15 is composed of a fifth magnetic layer 125, a fourth insulating portion 184, a first pillar-shaped wiring 194, a second pillar-shaped wiring 195, and a third pillar-shaped wiring 196. The fifth magnetic layer 125 is arranged on the upper side, opposite to the first inductor wiring 130, of the second inductor wiring 135 and the fourth magnetic layer 124. The first pillar-shaped wiring 194, the second pillar-shaped wiring 195, and the third pillar-shaped wiring 196 penetrate the fifth layer L15 in the stacking direction, that is, from the surface facing the fourth magnetic layer 124 to the surface facing the opposite side. In this embodiment, these pillar-shaped wirings function as vertical wirings.

[0143] Fourth insulating portion 184 is directly connected to the upper surface of third insulating portion 183 without passing through any other layers. Fourth insulating portion 184 covers a wider area than third insulating portion 183 in a width direction perpendicular to the extension direction of third insulating portion 183. The thickness of fourth insulating portion 184 is the same as that of fifth layer L15. Fourth insulating portion 184 is made of the same insulating resin as third insulating portion 183, and has higher insulation properties than second inductor wiring 135. Furthermore, in this embodiment, third insulating portion 183 and fourth insulating portion 184 constitute second insulating layer 185. Second insulating layer 185 is a non-magnetic material that contacts a portion of the surface of second inductor wiring 135. Furthermore, the surface of second inductor wiring 135 on the first inductor wiring 130 side contacts first insulating layer 180, and the surface of second inductor wiring 135 on the fourth magnetic layer 124 side contacts second insulating layer 185.

[0144] The fifth layer L15, excluding the first columnar wiring 194, the second columnar wiring 195, the third columnar wiring 196, and the fourth insulating portion 184, is a fifth magnetic layer 125. The fifth magnetic layer 125 is made of the same magnetic material as the first magnetic layer 121.

[0145] A sixth layer L16 having a rectangular shape when viewed from above and below is stacked on the upper surface of the fifth layer L15 . The sixth layer L16 includes a sixth magnetic layer 126 , a fourth columnar wiring 197 , a fifth columnar wiring 198 , and a sixth columnar wiring 199 .

[0146] The fourth columnar wiring 197 is arranged above the second connecting wiring 147 in the fourth layer L14 and is connected to the second connecting wiring 147 via the second columnar wiring 195. The sixth columnar wiring 199 is arranged above the third pad 137 in the fourth layer L14 and is connected to the third pad 137 via the first columnar wiring 194. The fourth columnar wiring 197 and the sixth columnar wiring 199 are prismatic in shape, with their axial directions aligned with the stacking direction. The stacking-direction dimensions of the fourth columnar wiring 197 and the sixth columnar wiring 199 are the same as those of the sixth layer L16. Therefore, the fourth columnar wiring 197 and the sixth columnar wiring 199 penetrate the sixth layer L16 in the stacking direction. In other words, in this embodiment, the first columnar wiring 194 and the sixth columnar wiring 199 constitute a first vertical wiring. Furthermore, the second columnar wiring 195 and the fourth columnar wiring 197 constitute a third vertical wiring.

[0147] In addition, the fifth columnar wiring 198 is arranged above the fourth pad 138 of the second inductor wiring 135 in the fourth layer L14 and is connected to the fourth pad 138 via the third columnar wiring 196. That is, in this embodiment, the third columnar wiring 196 and the fifth columnar wiring 198 constitute a second vertical wiring. Figure 22 In FIG. 1 , the fourth columnar wiring 197 , the fifth columnar wiring 198 , and the sixth columnar wiring 199 are indicated by two-dot chain lines.

[0148] like Figure 21 As shown, the portion of the sixth layer L16 excluding the fourth columnar wiring 197, the fifth columnar wiring 198, and the sixth columnar wiring 199 constitutes the sixth magnetic layer 126. Therefore, the sixth magnetic layer 126 is stacked on the upper side of the second inductor wiring 135. The sixth magnetic layer 126 is made of the same magnetic material as the first magnetic layer 121 described above.

[0149] like Figure 23 As shown in FIG. 1 , an external electrode 230 is stacked on the upper surface of the fifth columnar wiring 198. In addition, an external electrode 230 is connected to the upper surface of the fourth columnar wiring 197 and the sixth columnar wiring 199. Figure 21 In the figure, the external electrode 230 is omitted.

[0150] Next, a method for manufacturing the inductor component 110 according to the second embodiment will be described.

[0151] like Figure 25 As shown, the method for manufacturing inductor component 110 includes a first magnetic layer processing step, a first covering step, a first wiring layer processing step, a first resist layer removal step, a second covering step, a second wiring layer processing step, a second resist layer removal step, and a first insulating layer processing step, thereby forming first inductor wiring 130. Furthermore, the method for manufacturing inductor component 110 includes a third wiring layer processing step, a third covering step, a fourth wiring layer processing step, a fourth covering step, a vertical wiring processing step, a fourth resist layer removal step, a third resist layer removal step, a second insulating layer processing step, a second magnetic layer processing step, a base substrate removal step, an external electrode processing step, and a singulation step, thereby forming second inductor wiring 135 and the like.

[0152] When manufacturing the inductor component 110, first, a first magnetic layer processing step is performed. Figure 26 As shown in FIG. 2 , a base substrate 210 with copper foil is prepared. The base substrate 211 of the base substrate 210 with copper foil is in the form of a plate. Copper foil 212 is laminated on the upper surface of the base substrate 211 in the lamination direction. Figure 27 As shown, a first magnetic layer 121 composed of a base material 120A and metal magnetic powder 120B is formed on the upper surface of copper foil 212 in a base substrate 210 with copper foil. To form the first magnetic layer 121, an insulating resin containing metal magnetic powder 120B is applied and solidified by stamping to form the base material 120A. The upper portions of the base material 120A and metal magnetic powder 120B are then ground to achieve the desired vertical dimensions of the first magnetic layer 121. During the grinding process, preferably, the grinding process parameters are adjusted to form a slight gap at the interface between the base material 120A and the metal magnetic powder 120B.

[0153] After the second magnetic layer processing step, the first covering step is performed. Figure 28As shown, in the first covering step, the first resist layer 221 covering the portion of the upper surface of the first magnetic layer 121 where the first wiring layer 130B is not formed is patterned. Specifically, a photosensitive dry film resist is first applied to the entire upper surface of the first magnetic layer 121. Next, the portion of the upper surface of the first magnetic layer 121 where the first wiring layer 130B is not formed is exposed. As a result, the exposed portion of the applied dry film resist is cured. Then, the uncured portion of the applied dry film resist is removed using a chemical solution. Thus, the cured portion of the applied dry film resist forms the first resist layer 221. On the other hand, the first magnetic layer 121 is exposed in the portion of the applied dry film resist that has been removed by the chemical solution and is not covered by the first resist layer 221.

[0154] After the first covering process, the first wiring layer processing process is performed. Figure 29 As shown, during the first wiring layer processing step, first wiring layer 130B is formed on the upper surface of first magnetic layer 121. Specifically, electroless copper plating is performed by immersing the first wiring layer 121 in an electroless copper plating solution. First wiring layer 130B is formed with a copper content of 99 wt% or less and a nickel content of 0.1 wt% or greater on the upper surface of first magnetic layer 121 exposed from first resist layer 221. The electroless copper plating solution is an alkaline solution containing copper salts such as copper chloride and copper sulfate. Meanwhile, metal magnetic powder 120B is made of iron, which has a greater ionization tendency than copper, the material of first wiring layer 130B. Therefore, during the first wiring layer processing step, the iron on the surface of metal magnetic powder 120B melts, and copper forms a film on the surface of metal magnetic powder 120B in its place.

[0155] Here, the electroless copper plating solution also enters the minute gap between substrate 120A and metal magnetic powder 120B. Therefore, iron is replaced by copper not only on the exposed surface of metal magnetic powder 120B, but also on the surface of metal magnetic powder 120B inside substrate 120A. Furthermore, the copper film formed on the surface of metal magnetic powder 120B inside substrate 120A functions as anchor 134. Thus, electroless copper plating forms anchor 134 extending from the lower surface of first wiring layer 130B.

[0156] After the first wiring processing step, a first resist layer removal step of removing the first resist layer 221 is performed. Figure 30 As shown, in the first resist layer removal step, the first resist layer 221 is separated from the first magnetic layer 121 and peeled off.

[0157] After the first resist layer removal process, the second covering process is performed. Figure 31As shown, in the second covering step, the second resist layer 222 covering the portion of the upper surface of the first magnetic layer 121 where the second wiring layer 130C is not formed is patterned. In this embodiment, the second resist layer 222 is patterned to expose a slightly wider area than the first wiring layer 130B. The photolithography method in the second covering step is the same as that in the first covering step, and therefore a detailed description thereof is omitted.

[0158] After the second covering step, the second wiring layer processing step is performed. In the second wiring layer processing step, the second wiring layer 130C is formed on the portion not covered by the second resist layer 222. Specifically, the second wiring layer 130C having a copper ratio of 99 wt % or more is formed on the surface that has been subjected to electrolytic copper plating and is not covered by the second resist layer 222. At this time, as shown in FIG. Figure 24 As shown, the end portion of second wiring layer 130C is directly in contact with first magnetic layer 121, which is not covered by first wiring layer 130B. Therefore, during electrolytic copper plating, the plating solution enters the gap between substrate 120A and metal magnetic powder 120B in first magnetic layer 121, which is in contact with the lower surface of second wiring layer 130C. The copper deposited from the plating solution entering this gap functions as anchor 134. In this embodiment, the first and second wiring processing steps described above serve as inductor wiring processing steps.

[0159] After the second wiring layer processing step, the second resist layer removal step is performed. Figure 32 As shown, in the second resist layer removal step, the second resist layer 222 is separated from the first magnetic layer 121 and peeled off.

[0160] After the second resist layer removal process, the first insulating layer processing process is performed. Figure 33 As shown, the first inductor wiring 130 is covered from above in the lamination direction by an insulating material. Thus, the first insulating layer including the first insulating portion 181 and the second insulating portion 182 is formed over the entire upper surface of the first magnetic layer 121 and the first inductor wiring 130 .

[0161] After the first insulating layer processing step, the third wiring processing step is performed. Figure 34 As shown, first, a hole is formed through the second insulating portion 182 on the upper surface of the first inductor wiring 130 at the location where the third via 193 is to be formed using a laser. This exposes the upper surface of the first inductor wiring 130 at the location where the third via 193 is to be formed. Next, a third wiring layer 200A, which functions as a seed layer, is formed from the upper side in the stacking direction by sputtering. The material of the third wiring layer 200A includes titanium and chromium.

[0162] After the third wiring processing step, a third covering step is performed. In the third covering step, the third resist layer 223 is patterned to cover the portion of the surface of the third wiring layer 200A where the fourth wiring layer 200B is not formed. The photolithography method in the third covering step is the same as that in the first covering step, and therefore a detailed description thereof will be omitted.

[0163] After the third covering step, a fourth wiring layer processing step is performed. In the fourth wiring layer processing step, electrolytic copper plating is performed to form a fourth wiring layer 200B having a copper ratio of 99 wt % or more on the portion of the surface of the third wiring layer 200A not covered by the third resist layer 223 .

[0164] After the fourth wiring process, the fourth covering process is performed. In the fourth covering process, Figure 35 As shown, the fourth resist layer 224 is patterned to cover the portion where the vertical wiring is not formed. That is, although not shown, only the portions where the first columnar wiring 194, the second columnar wiring 195, the third columnar wiring 196, the fourth columnar wiring 197, the fifth columnar wiring 198, and the sixth columnar wiring 199 are formed are exposed from the fourth resist layer 224.

[0165] After the fourth covering step, a vertical wiring process is performed. In this process, electrolytic copper plating is performed to form vertical wirings with a copper ratio of 99 wt% or greater on the surface of the second wiring layer 130C that is not covered by the fourth resist layer 224. Specifically, third columnar wiring 196 and fifth columnar wiring 198 are formed. Furthermore, although not shown, first columnar wiring 194, second columnar wiring 195, fourth columnar wiring 197, and sixth columnar wiring 199 are also formed.

[0166] After the vertical wiring process, the fourth resist layer removal process and the third resist layer removal process are performed simultaneously. Figure 36 As shown, the third resist layer 223 and the fourth resist layer 224 are separated and peeled off from the first magnetic layer 121. Then, the third wiring layer 200A functioning as a seed layer exposed on the surface is removed by etching.

[0167] After the third resist layer removal process, the second insulating layer processing process is performed. Figure 37 As shown in FIG. 1 , in the second insulating layer processing step, insulating resin is applied to the upper surface. Specifically, first, insulating resin is applied from the upper side in the stacking direction to the extent that it completely covers the fourth wiring layer 200B. Next, the portion where the fourth insulating portion 184 is to be formed is exposed. Then, the uncured portion of the applied insulating resin is stripped away using a chemical solution. The result is as shown in FIG. Figure 38As shown in FIG. 1 , the exposed portion of the applied insulating resin is cured to form the third insulating portion 183 and the fourth insulating portion 184. Figure 39 As shown, portions of the first insulating layer including the first insulating portion 181 and the second insulating portion 182 where the first insulating portion 181 and the second insulating portion 182 are not formed are removed by laser.

[0168] After the second insulating layer processing step, the second magnetic layer processing step is performed. Figure 40 As shown, in the second magnetic layer processing step, magnetic material is filled to the upper side in the stacking direction, above the upper end of the fifth columnar wiring 198. Next, grinding is performed from the upper side in the stacking direction until the upper ends of each vertical wiring are exposed. This forms the second magnetic layer 122, the third magnetic layer 123, the fourth magnetic layer 124, the fifth magnetic layer 125, and the sixth magnetic layer 126.

[0169] After the second magnetic layer processing step, the base substrate removal step is performed. Figure 41 As shown, in the base substrate removal step, the base substrate 210 with the copper foil is removed. Specifically, the base substrate 211 is separated from the first magnetic layer 121 and peeled off. Next, the copper foil is removed by etching. Furthermore, the first magnetic layer 121 is ground from the bottom side in the stacking direction until the dimension from the bottom end of the first magnetic layer 121 to the top end of the sixth magnetic layer 126 reaches the desired value.

[0170] After the base substrate removal step, the external electrode processing step is performed. Specifically, external electrodes composed of a single layer or a stacked structure containing any of copper, nickel, gold, and tin are formed on the upper surfaces of each vertical wiring, that is, the upper surfaces of the fourth columnar wiring 197, the fifth columnar wiring 198, and the sixth columnar wiring 199, by electroless plating, electrolytic plating, printing, sputtering, or the like.

[0171] After the external electrode processing step, the singulation step is performed. Figure 42 As shown, the inductor component 110 is singulated by dicing along the dotted line DL. This provides the inductor component 110. In this case, the first dummy wiring 141 and the second dummy wiring 142 included on the dotted line DL are exposed on the side surfaces of the inductor component 110.

[0172] Next, the effects of the second embodiment will be described. According to the second embodiment, in addition to the effects (1) to (5) and (9) to (13) of the first embodiment, the following effects are also achieved.

[0173] (14) According to the inductor component 110 of the second embodiment, a portion of the second wiring layer 130C reaches the layer where the first wiring layer 130B is arranged, and is sandwiched between the first wiring layer 130B and the second magnetic layer 122. Therefore, the contact area between the first wiring layer 130B and the second wiring layer 130C is increased, and the adhesion between the first wiring layer 130B and the second wiring layer 130C is improved.

[0174] (15) According to the inductor component 110 of the second embodiment, the entire fourth wiring layer 200B is stacked on the upper surface of the third wiring layer 200A and is not interposed between the third wiring layer 200A and the fourth magnetic layer 124. Therefore, different resist designs can be used when manufacturing the first inductor wiring 130 and the second inductor wiring 135, thereby increasing the degree of design freedom.

[0175] (16) According to the inductor component 110 of the second embodiment, the first inductor wiring 130 and the second inductor wiring 135 are arranged along the stacking direction. In other words, the inductor wiring is not a single layer, but multiple layers. Therefore, the inductor component 110 can have a higher overall inductance.

[0176] (17) According to the inductor component 110 of the second embodiment, the first insulating layer 180 contains the insulating resin and the inorganic filler. Therefore, the strength of the first insulating layer 180 can be improved.

[0177] (18) According to the inductor component 110 of the second embodiment, the copper content of the material of the first wiring layer 130B is 99 wt% or less, and the nickel content is 0.1 wt% or more. Therefore, it can be manufactured by electroless plating. Furthermore, the third wiring layer 200A contains chromium or titanium. Therefore, it can be manufactured by sputtering. As a result, wiring layers arranged in different layers can be manufactured using different manufacturing methods, thereby increasing the degree of flexibility in the manufacturing process.

[0178] The above-mentioned embodiments can be implemented with modifications as follows. The embodiments and the following modifications can be implemented in combination within a range that does not technically conflict.

[0179] In the above-described embodiments, the inductor wiring may be any wiring that generates magnetic flux in the magnetic layer when current flows, thereby providing inductance to the inductor component.

[0180] In the above-described embodiments, the shape of the inductor wiring is not limited to the examples shown in the embodiments. For example, the inductor wiring may be curved with less than 1 turn or straight with 0 turns. Furthermore, some of the multiple inductor wirings may have a different shape from the other inductor wirings. Furthermore, in each embodiment, the inductor wiring may have a curved shape.

[0181] In the first embodiment described above, multiple inductor traces 30 may be provided within the same layer. In this case, the inclusion of multiple inductor traces 30 increases the overall inductance, and since they are arranged within the same layer, the overall size in the stacking direction can be prevented from becoming excessively large. Furthermore, an inductor component 10 having multiple inductor traces 30 provided within the same layer may be divided into multiple inductor components for use.

[0182] In the above-described embodiments, the wiring structure of the inductor wiring is not limited to the examples in the embodiments. For example, in the inductor wiring, the shapes of the first and second pads may be changed, or the first and second pads themselves may be omitted.

[0183] In the first embodiment described above, catalyst layer 30A and second wiring layer 30C may be omitted from inductor wiring 30, with inductor wiring 30 consisting solely of first wiring layer 30B. In this case, the lower surface of first wiring layer 30B constitutes main surface MF of inductor wiring 30, and anchor portion 34 may simply extend from the lower surface of first wiring layer 30B.

[0184] In the above embodiments, the amount of coverage by the anchor portion is not limited to the examples in the above embodiments. For example, the anchor portion may not cover the entire surface of the metal magnetic powder in contact, or may cover less than one-third of the surface. In this case, the metal magnetic powder covered by the anchor portion may not include a cross-section where at least one-third of the surface of the metal magnetic powder is covered by the anchor portion when the metal magnetic powder is observed in cross section. Furthermore, the anchor portion may not cover the entire surface of the metal magnetic powder in contact with the main surface of the inductor wiring. Furthermore, the anchor portion may be omitted.

[0185] In the above-described embodiments, the formation of the anchor portion and the adjustment of the anchor portion coverage are not limited to the examples in the above-described embodiments. For example, in the first embodiment, during the surface treatment to remove resin residue and the like from the first magnetic layer 21, an alkaline chemical solution that dissolves the substrate 20A of the first magnetic layer 21 but does not dissolve the metal magnetic powder 20B may be used, and the interface state between the substrate 20A and the metal magnetic powder 20B may be adjusted by adjusting the treatment time.

[0186] In the first embodiment described above, a slight gap is formed between the substrate 20A and the metal magnetic powder 20B during grinding, and the electroless copper plating solution flows into this gap during the inductor wiring process. However, other known methods can also be used as long as the anchor portion 34 can be formed. In particular, even if there is no clear gap at the interface between the substrate 20A and the metal magnetic powder 20B, the electroless copper plating solution can intrude along the interface between the substrate 20A and the metal magnetic powder 20B, resulting in the aforementioned replacement of the iron with copper. Therefore, it is also possible to eliminate the gap between the substrate 20A and the metal magnetic powder 20B during grinding.

[0187] In the first embodiment described above, the catalyst layer 30A and the second wiring layer 30C may be omitted from the inductor wiring 30 , and the inductor wiring 30 may be composed only of the first wiring layer 30B.

[0188] In the above embodiments, the material of the first wiring layer is not limited to the examples in the above embodiments. For example, the nickel content of the first wiring layer may be 99 wt% or less, and the phosphorus content may be 0.5 wt% or more and 10 wt% or less. In this case, the inclusion of phosphorus can adjust the stress built into the nickel and alleviate the residual stress in the inductor component. Furthermore, the inclusion of nickel in the first wiring layer can suppress electromigration.

[0189] In each of the above embodiments, the second wiring layer may be made of a metal other than copper. Furthermore, the boundary between the second wiring layer and the first wiring layer is not always clear, and a clear interface may not be identified between the two depending on circumstances.

[0190] In each of the above embodiments, the thickness of the second wiring layer may be less than 5 times the thickness of the first wiring layer.

[0191] In the first embodiment, the material of the catalyst layer 30A is not limited to the example in the above embodiment. The material of the catalyst layer 30A may be any material as long as it contains at least one metal selected from palladium, platinum, silver, and gold.

[0192] In the first embodiment described above, the thickness TA of the inductor wiring 30 is not limited to that in the example of the embodiment described above. If the thickness TA of the inductor wiring 30 is 40 μm or greater, the DC resistance can be relatively low. Furthermore, if the thickness TA of the inductor wiring 30 is 120 μm or less, the wiring width relative to the thickness TA can be kept within a reasonable range.

[0193] In the first embodiment, the thickness TB of the first wiring layer 30B is not limited to that of the embodiment above. If the thickness TB of the first wiring layer 30B is 0.3 μm or more and 10 μm or less, it can be easily formed by electroless copper plating.

[0194] In the above embodiments, the material of the insulating layer is not limited to the examples in the above embodiments. For example, it is preferable to ensure the strength of the magnetic layer if the insulating layer material includes at least one of epoxy resin, phenolic resin, acrylic resin, polyimide resin, and liquid crystal polymer resin, and an inorganic filler with an average particle size of 1 μm or less. Furthermore, the material of the insulating layer is not limited to this and may simply be an insulating resin.

[0195] In the above-described embodiments, the extent to which the insulating layer covers the inductor wiring is not limited to the examples in the above-described embodiments. It is sufficient that at least the surface of the inductor wiring on the first magnetic layer side is not covered by the insulating layer and is in contact with the first magnetic layer, and the surface of the inductor wiring on the second magnetic layer side is covered by the insulating layer. For example, in the first embodiment, the entire surface of the inductor wiring 30 on the second magnetic layer 22 side may be covered by the insulating layer 80. Alternatively, the entire surface of the inductor wiring 30 on the third magnetic layer 23 side may be covered by the insulating layer 80. Furthermore, the surface of the inductor wiring 30 on the third magnetic layer 23 side may not be covered by the insulating layer 80. Furthermore, as long as a portion of the surface of the inductor wiring 30 on the second magnetic layer 22 side is covered by the insulating layer 80, the insulating layer 80 may not be provided in the area where the distance between the inductor wirings 30 is the smallest.

[0196] In the second embodiment, the first inductor wiring 130 and the second inductor wiring 135 may be made of the same material.

[0197] In the second embodiment, the fourth wiring layer 200B in the second inductor wiring 135 may not extend to the layer where the third wiring layer 200A is arranged, and may not be interposed between the third wiring layer 200A and the fifth magnetic layer 125 .

[0198] In the manufacturing method of each of the above embodiments, the singulation step can be omitted. In this case, for example, if the inductor component is manufactured in the size of a single inductor component starting from the first magnetic layer processing step, the singulation step can be omitted.

[0199] In the above-described embodiment, the boundaries of the magnetic layers in each layer may be integrated to the extent that the interface cannot be confirmed, or may be separate bodies in which the interface can be confirmed.

Claims

1. An inductor component comprising: a first magnetic layer; an inductor wiring layer stacked on the main surface of the first magnetic layer and including a wiring body, a first pad, and a second pad; a second magnetic layer disposed in the same layer as the inductor wiring; a third magnetic layer disposed on a main surface of the inductor wiring and the second magnetic layer on a side opposite to the first magnetic layer; as well as an insulating layer which is a non-magnetic material and is arranged along a portion of the surface of the inductor wiring, The entire surface of the inductor wiring on the first magnetic layer side is in contact with the first magnetic layer. A portion of the surface of the inductor wiring is exposed from the insulating layer and is in contact with the second magnetic layer. A portion of the surface of the inductor wiring is exposed from the insulating layer and is in contact with the third magnetic layer. The insulating layer includes a second insulating portion and a first insulating portion located in the same layer as the inductor wiring. The first pad is connected to the outer peripheral end of the wiring body. The second pad is connected to the inner peripheral end of the wiring body. In the inductor wiring, at least a 0.5-turn portion on the first pad side and at least a 0.5-turn portion on the second pad side extend parallel to each other, The first insulating portion is interposed between the radially inner side of at least 0.5 turns of the first pad side and the radially outer side of at least 0.5 turns of the second pad side, at a location where the distance between wirings in the inductor wiring is smallest. The first insulating portion extends in an arc shape along the inductor wiring. The second insulating portion is directly connected to the upper surface of the first insulating portion without passing through other layers. The second insulating portion covers a portion of the upper surface of at least a 0.5-turn portion on the first pad side of the inductor wiring and a portion of the upper surface of at least a 0.5-turn portion on the second pad side.

2. The inductor component according to claim 1, wherein A surface of the inductor wiring on the third magnetic layer side is in contact with the insulating layer.

3. The inductor component according to claim 1, wherein In the layer where the inductor wiring is arranged, the inductor wiring is wound more than 1.0 turn.

4. The inductor component according to any one of claims 1 to 3, wherein The inductor component further includes a vertical wiring connected to the inductor wiring, and the vertical wiring penetrates the third magnetic layer from a main surface of the third magnetic layer on the inductor wiring side toward a main surface of the third magnetic layer on the side opposite to the inductor wiring side. A surface of the vertical wiring on the third magnetic layer side is in contact with the insulating layer.

5. The inductor component according to any one of claims 1 to 3, wherein The insulating layer includes at least one resin selected from epoxy resin, phenolic resin, acrylic resin, polyimide resin, and liquid crystal polymer resin.

6. The inductor component according to any one of claims 1 to 3, wherein The insulating layer contains an inorganic filler having an average particle size of 1.0 μm or less.

7. The inductor component according to any one of claims 1 to 3, wherein The inductor wiring has a stacked structure including a first wiring layer on the first magnetic layer side and a second wiring layer stacked on a surface of the first wiring layer on the third magnetic layer side. A portion of the second wiring layer reaches into a layer in which the first wiring layer is arranged and is interposed between the first wiring layer and the second magnetic layer.

8. The inductor component according to claim 7, wherein The inductor wiring includes a catalyst layer containing at least one metal selected from the group consisting of palladium, platinum, silver, and gold. The catalyst layer is arranged on the first magnetic layer side of the first wiring layer.

9. The inductor component according to claim 7, wherein The first wiring layer has a copper content of 99 wt % or less and a nickel content of 0.1 wt % or more.

10. The inductor component according to claim 7, wherein The first wiring layer has a nickel content of 99 wt % or less and a phosphorus content of 0.5 wt % or more and 10 wt % or less in the material.

11. The inductor component according to claim 7, wherein The thickness of the inductor wiring is not less than 40 μm and not more than 120 μm, The thickness of the first wiring layer is greater than or equal to 0.3 μm and less than or equal to 10 μm.

12. The inductor component according to any one of claims 1 to 3, wherein The inductor component further includes a vertical wiring connected to the inductor wiring, and the vertical wiring penetrates the third magnetic layer from a main surface of the third magnetic layer on the inductor wiring side toward a main surface of the third magnetic layer on the side opposite to the inductor wiring side. A cover layer made of an insulating material is stacked on a main surface of the third magnetic layer on the side opposite to the inductor wiring. The surface of the vertical wiring opposite to the inductor wiring is not covered by the cover layer. An external electrode is connected to a portion of the vertical wiring exposed from the cover layer.

13. The inductor component according to any one of claims 1 to 3, wherein: When the inductor wiring is a first inductor wiring and the insulating layer is a first insulating layer, the inductor component further includes: a second inductor wiring arranged on a main surface of the third magnetic layer on the opposite side from the first inductor wiring; a fourth magnetic layer disposed in the same layer as the second inductor wiring; a fifth magnetic layer disposed on a side of the second inductor wiring and the fourth magnetic layer opposite to the first inductor wiring; as well as a second insulating layer, which is a non-magnetic material, in contact with a portion of the surface of the second inductor wiring, The surface of the first inductor wiring on the third magnetic layer side is in contact with the first insulating layer. The surface of the second inductor wiring on the first inductor wiring side is in contact with the first insulating layer. A surface of the second inductor wiring on the fourth magnetic layer side is in contact with the second insulating layer.

14. The inductor component according to claim 13, wherein A portion of the surface of the second inductor wiring is exposed from the second insulating layer and is in contact with the fourth magnetic layer.

15. The inductor component according to claim 13, wherein The first insulating layer contains an inorganic filler, The second insulating layer does not contain the inorganic filler.

16. The inductor component according to claim 15, wherein The first inductor wiring has a laminated structure including a first wiring layer and a second wiring layer laminated on a surface of the first wiring layer opposite to the first magnetic layer. The second inductor wiring has a laminated structure including a third wiring layer and a fourth wiring layer laminated on a surface of the third wiring layer opposite to the third magnetic layer. The ratio of copper in the material of the first wiring layer is 99 wt % or less, and the ratio of nickel is 0.1 wt % or more. The material of the third wiring layer includes chromium or titanium.

17. The inductor component according to claim 15 or 16, wherein: The first inductor wiring has a laminated structure including a first wiring layer and a second wiring layer laminated on a surface of the first wiring layer opposite to the first magnetic layer. The second inductor wiring has a laminated structure including a third wiring layer and a fourth wiring layer laminated on a surface of the third wiring layer opposite to the third magnetic layer. A portion of the second wiring layer reaches the layer in which the first wiring layer is arranged and is interposed between the first wiring layer and the second magnetic layer. The entire fourth wiring layer is stacked on a surface of the third wiring layer opposite to the third magnetic layer.

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