Wafer liquid supply device and wafer processing apparatus

Abstract

The application discloses a wafer liquid medicine supply device and a wafer processing equipment. The wafer liquid medicine supply device comprises a mixed liquid cavity, a liquid supply part, a liquid outlet part, a first cleaning pipeline, a first supply device, a liquid discharge pipe and a nozzle assembly. One end of the first cleaning pipeline is arranged at the bottom of the mixed liquid cavity and communicates with the mixed liquid cavity, and the other end is used for connecting the first supply device. The first supply device is used for providing cleaning liquid, so that the cleaning liquid flows through the first cleaning pipeline and then enters the mixed liquid cavity. The liquid discharge pipe is arranged at the top of the mixed liquid cavity and communicates with the mixed liquid cavity, so as to discharge the cleaning liquid in the mixed liquid cavity. The wafer processing equipment comprises the wafer liquid medicine supply device, a wafer bearing device and a wafer driving device. The wafer bearing device is used for bearing the wafer. The wafer driving device is connected with the wafer bearing device, so as to drive the wafer to rotate. The nozzle assembly is arranged corresponding to the wafer bearing device, so as to spray the processing liquid to the surface in the wafer. The wafer liquid medicine supply device can improve the pipeline cleaning effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a wafer liquid supply device and wafer processing equipment. BACKGROUND

[0002] In the manufacturing process of semiconductor devices, various treatments are required for semiconductor wafers, liquid crystal display substrates, etc. In a single substrate processing process, one or more liquids are sprayed through a nozzle.

[0003] In the prior art, a multi-union valve is arranged on the liquid path for spraying the treatment liquid, and a flow passage is formed in the multi-union valve. The multi-union valve is connected to a plurality of pipes, which can provide a plurality of treatment liquids for the substrate. After supplying the treatment liquid each time, the pipeline needs to be cleaned. In the prior art, the cleaning liquid is introduced from the liquid inlet. When the flow rate of the cleaning liquid is low, the internal flow channel of the multi-union valve cannot be completely filled, and the cleaning is not sufficient.

[0004] Therefore, it is necessary to provide a new wafer liquid supply device and wafer processing equipment to solve the above problems in the prior art. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a wafer liquid supply device and wafer processing equipment that improves the cleaning effect.

[0006] To solve the above technical problems, according to an embodiment of the present application, a wafer liquid supply device is provided, comprising a liquid mixing cavity:

[0007] A liquid supply part is arranged in the liquid mixing cavity and communicates with the liquid mixing cavity to supply a treatment liquid into the liquid mixing cavity;

[0008] A liquid outlet part comprises a nozzle assembly and a liquid outlet unit. One end of the liquid outlet unit is arranged in the liquid mixing cavity and communicates with the liquid mixing cavity. The other end is used to communicate with the nozzle assembly, so that the treatment liquid in the liquid mixing cavity flows through the liquid outlet unit and enters the nozzle assembly;

[0009] A first cleaning pipeline has one end arranged at the bottom of the liquid mixing cavity and communicating with the liquid mixing cavity, and the other end is used to connect a first supply device. The first supply device is used to provide a cleaning liquid, so that the cleaning liquid flows through the first cleaning pipeline and enters the liquid mixing cavity;

[0010] A liquid discharge pipe is arranged at the top of the liquid mixing cavity and communicates with the liquid mixing cavity to discharge the cleaning liquid in the liquid mixing cavity;

[0011] When the first cleaning pipeline and the liquid discharge pipeline are working, the liquid supply part and the liquid outlet part stop working, so that the cleaning liquid moves from the bottom of the mixing cavity to the top of the mixing cavity to clean the mixing cavity.

[0012] A wafer processing device includes a wafer liquid supply device, a wafer bearing device and a wafer driving device.

[0013] The wafer bearing device is configured to bear a wafer.

[0014] The wafer driving device is connected with the wafer bearing device to drive the wafer to rotate.

[0015] The nozzle assembly is configured to spray the processing liquid to the surface of the wafer.

[0016] By using the above technical solution, the first cleaning pipeline is arranged at the bottom of the mixing cavity, and the liquid discharge pipeline is arranged at the top of the mixing cavity, so that the cleaning liquid can enter the mixing cavity from the bottom of the mixing cavity and be discharged from the top of the mixing cavity, thereby improving the problem that the cleaning liquid flow is small in the prior art, the mixing cavity cannot be completely filled with the cleaning liquid, liquid residue is generated, and complete cleaning cannot be completed. Therefore, the cleaning effect is improved.

[0017] According to the embodiments of the present application, the nozzle assembly includes a first nozzle and a second nozzle.

[0018] The liquid outlet unit includes:

[0019] The first liquid outlet unit has a first liquid outlet pipeline and a first liquid outlet control valve. One end of the first liquid outlet pipeline is in communication with the mixing cavity, and the other end is in communication with the first nozzle. The first liquid outlet control valve is arranged in the first liquid outlet pipeline to control the opening and closing of the first liquid outlet pipeline.

[0020] The second liquid outlet unit has a second liquid outlet pipeline and a second liquid outlet control valve. One end of the second liquid outlet pipeline is in communication with the mixing cavity, and the other end is in communication with the second nozzle. The second liquid outlet control valve is arranged in the second liquid outlet pipeline to control the opening and closing of the second liquid outlet pipeline. The second liquid outlet control valve cooperates with the first liquid outlet control valve to make the processing liquid flow through the first nozzle and / or the second nozzle and then be sprayed.

[0021] According to the embodiments of the present application, the liquid supply part includes a plurality of liquid supply units, and the liquid supply unit includes:

[0022] a liquid supply pipe, one end of which is in communication with the mixing cavity and the other end of which is configured to communicate with a third supply device, the third supply device being configured to supply a treatment liquid so that the treatment liquid flows through the liquid supply pipe and then enters the mixing cavity;

[0023] a liquid supply control valve, which is arranged in the liquid supply pipe to control the opening and closing of the liquid supply pipe.

[0024] According to the embodiments of the present application, the liquid suction unit comprises:

[0025] a liquid suction pipe, which is arranged in the second liquid outlet pipe and in communication with the second liquid outlet pipe, and is arranged vertically so that the treatment liquid is discharged from the bottom of the liquid suction pipe;

[0026] a liquid suction control valve, which is arranged in the liquid suction pipe to control the opening and closing of the liquid suction pipe, and is arranged in a normally closed manner so that the treatment liquid is accumulated in the liquid suction pipe; when the liquid suction control valve is opened, the accumulated treatment liquid in the liquid suction pipe is discharged so that the treatment liquid in the second liquid outlet pipe is discharged through the liquid suction pipe.

[0027] According to the embodiments of the present application, the flow detection control device is arranged in the liquid outlet unit and / or the liquid supply part to detect and control the flow of liquid flowing through the flow detection control device in the liquid outlet unit and / or the liquid supply part.

[0028] According to the embodiments of the present application, the flow detection control device is arranged in the first liquid outlet pipe and is disposed between the first nozzle and the first liquid outlet control valve to detect and control the flow of liquid flowing through the first liquid outlet pipe.

[0029] According to the embodiments of the present application, the flow detection control device is arranged in the liquid supply pipe and is disposed on the side of the liquid supply control valve away from the mixing cavity to detect and control the flow of liquid in the liquid supply pipe.

[0030] According to the embodiments of the present application, the flow detection control device comprises a flow detection member and a flow control member.

[0031] When the flow detection control device is arranged in the first liquid outlet pipe, the flow control member is disposed between the flow detection member and the first liquid outlet control valve.

[0032] When the flow detection control device is arranged on the liquid supply pipeline, the flow detection member is arranged between the flow control member and the liquid supply control valve. The flow detection control devices are cooperated with each other to accurately control the flow of the processing liquid, and the problem that it is difficult to accurately control the flow of the mixed processing liquid at the liquid spraying end in the prior art due to the special structure of the double-fluid nozzle is solved.

[0033] According to the embodiment of the present application, the adjusting pipeline is arranged in communication with the mixing cavity at one end and connected with the second supply device at the other end, and the second supply device is used to supply deionized water, so that the deionized water flows through the adjusting pipeline and then enters the mixing cavity, thereby adjusting the concentration of the cleaning liquid or the liquid added in the mixing cavity.

[0034] According to the embodiment of the present application, the control device is arranged in connection with the nozzle assembly and used to drive the nozzle assembly to move in the vertical direction or the horizontal direction, so as to adjust the relative position between the nozzle assembly and the wafer carrying device. BRIEF DESCRIPTION OF DRAWINGS

[0035] Fig. 1 FIG. 1 is a schematic view of a main body structure of a wafer liquid supply device according to an embodiment of the present application;

[0036] Fig. 2 FIG. 6 is a schematic view of a setting position of a flow detection control device according to an embodiment of the present application.

[0037] REFERENCE NUMERALS:

[0038] 100, mixing cavity; 200, liquid supply part; 210, liquid supply unit; 211, liquid supply pipeline; 212, liquid supply control valve; 310, nozzle assembly; 311, first nozzle; 312, second nozzle; 320, liquid outlet unit; 321, first liquid outlet unit; 322, first liquid outlet pipeline; 323, first liquid outlet control valve; 324, second liquid outlet unit; 325, second liquid outlet pipeline; 326, second liquid outlet control valve; 410, first cleaning pipeline; 411, first cleaning control valve; 420, liquid discharge pipeline; 421, liquid discharge control valve; 500, liquid suction unit; 510, liquid suction pipeline; 520, liquid suction control valve; 600, flow detection control device; 610, flow detection member; 620, flow control member; 710, adjusting pipeline; 711, adjusting control valve; 800, wafer carrying device; 810, support part; 820, carrying part. DETAILED DESCRIPTION

[0039] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall into the scope of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as their common meanings to those of ordinary skill in the art to which the present application belongs. The words such as "comprise" and the like used herein mean that the elements or objects before the words encompass the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings. Figs. 1-2 The specific embodiments of the present application will be further described in detail.

[0041] The embodiments of the present application provide a wafer liquid supply device for spraying a liquid on the surface of a wafer in a wafer processing process. Specifically, the wafer liquid supply device comprises a liquid mixing cavity 100:

[0042] A liquid supply part 200 is arranged in the liquid mixing cavity 100 and communicates with the liquid mixing cavity 100 to supply a processing liquid into the liquid mixing cavity 100.

[0043] A liquid outlet part comprises a nozzle assembly 310 and a liquid outlet unit 320. One end of the liquid outlet unit 320 is arranged in the liquid mixing cavity 100 and communicates with the liquid mixing cavity 100. The other end of the liquid outlet unit 320 communicates with the nozzle assembly 310, so that the processing liquid in the liquid mixing cavity 100 flows through the liquid outlet unit 320 and then enters the nozzle assembly 310.

[0044] A first cleaning pipeline 410 is arranged at the bottom of the liquid mixing cavity 100 and communicates with the liquid mixing cavity 100. The other end of the first cleaning pipeline 410 is connected to a first supply device. The first supply device is used to supply a cleaning liquid, so that the cleaning liquid flows through the first cleaning pipeline 410 and then enters the liquid mixing cavity 100.

[0045] A liquid discharge pipe 420 is arranged at the top of the liquid mixing cavity 100 and communicates with the liquid mixing cavity 100 to discharge the cleaning liquid in the liquid mixing cavity 100.

[0046] When the first cleaning pipeline 410 and the liquid discharge pipe 420 are working, the liquid supply part 200 and the liquid outlet part stop working, so that the cleaning liquid moves from the bottom of the liquid mixing cavity 100 to the top of the liquid mixing cavity 100 to clean the liquid mixing cavity 100.

[0047] In some embodiments, the wafer can be sprayed with a single treatment liquid or a mixture of different treatment liquids. Therefore, the treatment liquid supply device includes a mixing chamber 100 for containing the treatment liquid, and different types of treatment liquid can be mixed in the mixing chamber 100.

[0048] In some specific embodiments, in order to facilitate the treatment liquid to enter the mixing chamber 100, the treatment liquid supply device further includes a liquid supply part 200 for supplying liquid to the mixing chamber 100, which can supply a single type of treatment liquid to the mixing chamber 100 or supply different types of treatment liquid. Specifically, the liquid supply part 200 is in communication with the mixing chamber 100 to supply treatment liquid to the mixing chamber 100. More specifically, the liquid supply part 200 includes a plurality of pipes, one end of which is in communication with the mixing chamber 100, and the other end is in communication with a part for supplying treatment liquid, which will be described in detail later.

[0049] In some specific embodiments, in order to facilitate the treatment liquid in the mixing chamber 100 to be sprayed onto the wafer surface, the treatment liquid supply device further includes a liquid outlet part in communication with the mixing chamber 100 to facilitate the transfer of the treatment liquid to the wafer surface. Specifically, the liquid outlet part includes a nozzle assembly 310 and a liquid outlet unit 320; wherein the liquid outlet unit 320 is a pipe, one end of which is arranged in the mixing chamber 100 and is in communication with the mixing chamber 100; the arrangement can be adhesive, clamping or bolted, etc., which is not limited here, as long as the position of the liquid outlet unit 320 in the mixing chamber 100 does not change, and the liquid outlet unit 320 is in communication with the mixing chamber 100, so that the liquid in the mixing chamber 100 can be mainly discharged through the liquid outlet unit 320; the other end of the liquid outlet unit 320 is connected with the nozzle assembly 310, and the two are in communication with each other, so that the liquid in the mixing chamber 100 can flow through the liquid outlet unit 320 to the nozzle assembly 310, and be discharged to the wafer surface through the nozzle assembly 310.

[0050] In some specific embodiments, after the liquid is passed, the liquid remains in the mixing chamber 100, and before the different types of liquid are passed, the mixing chamber 100 needs to be cleaned; therefore, a first cleaning pipe 410 and a liquid discharge pipe 420 are provided, wherein one end of the first cleaning pipe 410 is arranged in the mixing chamber 100 and is in communication with the inside of the mixing chamber 100, and the other end is used to communicate with a first supply device, wherein the first supply device is used to supply cleaning liquid, and the cleaning liquid supplied by the first supply device can enter the mixing chamber 100 through the first cleaning pipe 410 to clean the mixing chamber 100, and be discharged through the liquid discharge pipe 420.

[0051] In some more specific embodiments, the first cleaning pipe 410 is arranged at the bottom of the mixing cavity 100 to clean the mixing cavity 100 with the cleaning liquid transferred from the mixing cavity 100; the liquid discharge pipe 420 is arranged at the top of the mixing cavity 100 to discharge the cleaning liquid; that is, the cleaning liquid can clean from the bottom of the mixing cavity 100 and be discharged from the top of the mixing cavity 100, so that the cleaning liquid can fully contact the inner wall of the mixing cavity 100, thereby fully cleaning the inner wall of the mixing cavity 100. One end of the liquid discharge pipe 420 communicates with the mixing cavity 100, and the other end is provided with a collecting device to collect the cleaning liquid discharged by the liquid discharge pipe 420.

[0052] In some more specific embodiments, the first supply device is used to supply the carbon dioxide aqueous solution to clean the inner wall of the mixing cavity 100.

[0053] In some more specific embodiments, the first cleaning pipe 410 is provided with a cleaning control valve, which is used to control the opening and closing of the first cleaning pipe 410 and can control the flow of the cleaning liquid flowing through the first cleaning pipe 410.

[0054] In some more specific embodiments, the liquid discharge pipe 420 is provided with a liquid discharge control valve 421, which is used to control the opening and closing of the liquid discharge pipe 420 and can control the flow of the cleaning liquid flowing through the liquid discharge pipe 420.

[0055] It is worth noting that when the first cleaning pipe 410 and the liquid discharge pipe 420 are working, the liquid supply part 200 and the liquid outlet part stop working to avoid mixing of the treatment liquid and the cleaning liquid; when the liquid supply part 200 and the liquid outlet part are working, the first cleaning pipe 410 and the liquid discharge pipe 420 stop working.

[0056] The nozzle assembly 310 includes a first nozzle 311 and a second nozzle 312;

[0057] The liquid outlet unit 320 includes:

[0058] The first liquid outlet unit 321 has a first liquid outlet pipe 322 and a first liquid outlet control valve 323; one end of the first liquid outlet pipe 322 communicates with the mixing cavity 100, and the other end communicates with the first nozzle 311; the first liquid outlet control valve 323 is arranged on the first liquid outlet pipe 322 to control the opening and closing of the first liquid outlet pipe 322;

[0059] The second liquid outlet unit 324 has a second liquid outlet pipeline 325 and a second liquid outlet control valve 326. One end of the second liquid outlet pipeline 325 is in communication with the mixed liquid cavity 100, and the other end is in communication with the second nozzle 312. The second liquid outlet control valve 326 is arranged on the second liquid outlet pipeline 325 to control the opening and closing of the second liquid outlet pipeline 325. The second liquid outlet control valve 326 cooperates with the first liquid outlet control valve 323 to make the treatment liquid flow through the first nozzle 311 and / or the second nozzle 312 and then be sprayed out.

[0060] In some embodiments, in order to spray the treatment liquid to different positions of the wafer, the nozzle assembly 310 is arranged to include the first nozzle 311 and the second nozzle 312.

[0061] In some embodiments, in order to be able to supply the treatment liquid to the first nozzle 311 and the second nozzle 312, the liquid outlet unit 320 is arranged to include the first liquid outlet unit 321 and the second liquid outlet unit 324. The first liquid outlet unit 321 is connected to the first nozzle 311 and in communication with each other, so that the treatment liquid in the mixed liquid cavity 100 can flow through the first liquid outlet unit 321 and then enter the first nozzle 311. The second liquid outlet unit 324 is connected to the second nozzle 312 and in communication with each other, so that the treatment liquid in the mixed liquid cavity 100 can flow through the second liquid outlet unit 324 and then enter the second nozzle 312.

[0062] In some specific embodiments, the first liquid outlet unit 321 has a first liquid outlet pipeline 322 and a first liquid outlet control valve 323. One end of the first liquid outlet pipeline 322 is arranged in the mixed liquid cavity 100 and in communication with the mixed liquid cavity 100. The arrangement mode can be bonding, clamping or bolt fixing, etc., which is not limited here. The position of the first liquid outlet pipeline 322 in the mixed liquid cavity 100 does not change, and the connection between the two is sealed, so that the liquid in the mixed liquid cavity 100 can enter the first liquid outlet pipeline 322. The other end of the first liquid outlet pipeline 322 is arranged in the first nozzle 311 and in communication with the first nozzle 311, so that the treatment liquid in the mixed liquid cavity 100 can flow through the first liquid outlet pipeline 322 and then enter the first nozzle 311. The first liquid outlet control valve 323 is arranged on the first liquid outlet pipeline 322 to control the opening and closing of the first liquid outlet pipeline 322, and can adjust the flow of the treatment liquid in the first liquid outlet pipeline 322.

[0063] In some embodiments, the second liquid outlet unit 324 has a second liquid outlet pipe 325 and a second liquid outlet control valve 326. One end of the second liquid outlet pipe 325 is arranged in the mixing cavity 100 and communicates with the mixing cavity 100. The arrangement mode can be bonding, clamping or bolt fixing, which is not limited herein. The position of the second liquid outlet pipe 325 in the mixing cavity 100 does not change, and the connection between the second liquid outlet pipe 325 and the mixing cavity 100 is sealed, so that the liquid in the mixing cavity 100 can enter the second liquid outlet pipe 325. The other end of the second liquid outlet pipe 325 is arranged in the second nozzle 312 and communicates with the second nozzle 312, so that the treatment liquid in the mixing cavity 100 can flow through the second liquid outlet pipe 325 and enter the second nozzle 312. The second liquid outlet control valve 326 is arranged in the second liquid outlet pipe 325 to control the opening and closing of the second liquid outlet pipe 325 and adjust the flow of the treatment liquid in the second liquid outlet pipe 325.

[0064] In some more specific embodiments, by controlling the first liquid outlet control valve 323 to be closed and the second liquid outlet control valve 326 to be opened, the first nozzle 311 does not spray the treatment liquid, and the second nozzle 312 sprays the treatment liquid.

[0065] In some more specific embodiments, by controlling the first liquid outlet control valve 323 to be opened and the second liquid outlet control valve 326 to be opened, the first nozzle 311 sprays the treatment liquid, and the second nozzle 312 does not spray the treatment liquid.

[0066] In some more specific embodiments, by controlling the first liquid outlet control valve 323 to be closed and the second liquid outlet control valve 326 to be closed, the first nozzle 311 does not spray the treatment liquid, and the second nozzle 312 does not spray the treatment liquid.

[0067] In some more specific embodiments, by controlling the first liquid outlet control valve 323 to be opened and the second liquid outlet control valve 326 to be opened, the first nozzle 311 sprays the treatment liquid, and the second nozzle 312 sprays the treatment liquid.

[0068] In some more specific embodiments, the first cleaning pipe 410 is arranged at the bottom of the mixing cavity 100, which means that the inner bottom of the first cleaning pipe 410 is flush with the inner bottom wall of the mixing cavity 100. The liquid discharge pipe 420 is arranged at the top of the mixing cavity 100, which means that the inner top wall of the liquid discharge pipe 420 is flush with the inner top of the mixing cavity 100.

[0069] In some more specific embodiments, the first cleaning pipe 410 is arranged at the bottom of the mixing cavity 100, which means that the inner bottom of the first cleaning pipe 410 is flush with the inner bottom wall of the mixing cavity 100. The liquid discharge pipe 420 is arranged at the top of the mixing cavity 100, which means that the inner top wall of the liquid discharge pipe 420 is flush with the inner top of the mixing cavity 100.

[0070] The wafer chemical liquid supply device further comprises a back suction unit 500, the back suction unit 500 comprising:

[0071] A back suction pipeline 510 is arranged in the second liquid outlet pipeline 325 and communicates with the second liquid outlet pipeline 325; the back suction pipeline 510 is vertically arranged to discharge the treatment liquid from the bottom of the back suction pipeline 510;

[0072] A back suction control valve 520 is arranged in the back suction pipeline 510 to control the opening and closing of the back suction pipeline 510; the back suction control valve 520 is normally closed to make the treatment liquid accumulated in the back suction pipeline 510; when the back suction control valve 520 is opened, the accumulated treatment liquid in the back suction pipeline 510 is discharged to make the treatment liquid in the second liquid outlet pipeline 325 discharged after passing through the back suction pipeline 510.

[0073] In some embodiments, in order to improve the cleaning efficiency of the second liquid outlet pipeline 325, the wafer chemical liquid supply device is further provided with the back suction unit 500 to further clean the second liquid outlet pipeline 325.

[0074] In some specific embodiments, the back suction unit 500 comprises the back suction pipeline 510 and the back suction control valve 520; one end of the back suction pipeline 510 is arranged in the side wall of the second liquid outlet pipeline 325 and communicates with the second liquid outlet pipeline 325; the arrangement mode can be bonding, clamping or bolt fixing, etc., which is not limited here, as long as the position of the back suction pipeline 510 in the second liquid outlet pipeline 325 does not change and the connection between the two is sealed to make the liquid in the second liquid outlet pipeline 325 enter the back suction pipeline 510.

[0075] In some specific embodiments, the back suction control valve 520 is arranged on the back suction pipeline 510 to control the opening and closing of the back suction pipeline 510 and can control the liquid flow of the back suction pipeline 510.

[0076] In some more specific embodiments, the back-suction control valve 520 is in a normally closed setting; and the back-suction pipe 510 is in a vertical setting, the top of the back-suction pipe 510 is in communication with the second liquid outlet pipe 325, when the treatment liquid in the mixing chamber 100 flows through the second liquid outlet pipe 325, due to the normally closed setting of the back-suction control valve 520, part of the treatment liquid will gather in the back-suction pipe 510, the part of the treatment liquid gathered in the back-suction pipe 510 will stay in the back-suction pipe 510, and will not affect the process of the second nozzle 312 spraying the treatment liquid, when it is necessary to clean the second liquid outlet pipe 325, the second liquid outlet control valve 326 is opened, and the back-suction control valve 520 is opened, at this time, the treatment liquid gathered in the back-suction pipe 510 is discharged, with the discharge of the treatment liquid gathered in the back-suction pipe 510, the pressure in the back-suction pipe 510 changes, due to the communication between the back-suction pipe 510 and the second liquid outlet pipe 325, at this time, the pressure in the second liquid outlet pipe 325 also changes; specifically, with the discharge of the treatment liquid gathered in the back-suction pipe 510, the pressure in the back-suction pipe 510 decreases, thereby generating a siphon effect, so that the residual treatment liquid in the second liquid outlet pipe 325 is sucked into the back-suction pipe 510, thereby facilitating the cleaning of the second liquid outlet pipe 325.

[0077] In some specific embodiments, the first nozzle 311 is a double-fluid nozzle, and the first liquid outlet pipe 322 is in communication with the liquid supply part 200 of the first nozzle 311; the gas supply part of the first nozzle 311 is connected with a device for supplying gas, which is a prior art and will not be described here.

[0078] In some embodiments, the back-suction control valve 520 is a pneumatic back-suction device. In the working process, there are three processes: gas supply stage, volume change and back-suction effect, wherein the gas supply stage is that when compressed air is introduced into the upper chamber, the air pressure pushes the diaphragm to deform downward. The volume change is that after the diaphragm protrudes downward, the volume of the lower chamber (the space in communication with the head) suddenly increases, forming a transient negative pressure (similar to the injection syringe pulling the piston). The back-suction effect is that the treatment liquid is sucked back into the lower chamber of the valve due to the negative pressure, avoiding the residual or dripping of liquid drops. The process is a prior art and will not be described here.

[0079] In some embodiments, if treatment liquid remains after cleaning, it will cause the remaining treatment liquid to mix with other treatment liquid when other treatment liquid is supplied, which may cause crystallization in the internal flow area of the multi-way valve, thereby generating particles. At this time, the back-suction unit 500 can solve the problem that the residual liquid in the pipe may cause the treatment liquid to drop onto the surface of the substrate when the nozzle assembly 310 stops supplying liquid, causing contamination.

[0080] In some specific embodiments, the back-suction unit 500 can also be provided on the first liquid outlet pipe 322, which will not be described here.

[0081] The liquid supply part 200 comprises a plurality of liquid supply units 210, and each of the liquid supply units 210 is in communication with the mixing cavity 100 to supply the processing liquid into the mixing cavity 100.

[0082] The liquid supply pipe 211 is in communication with the mixing cavity 100 at one end and is in communication with a third supply device at the other end, and the third supply device is used to supply the processing liquid to flow through the liquid supply pipe 211 and then into the mixing cavity 100.

[0083] The liquid supply control valve 212 is arranged on the liquid supply pipe 211 to control the opening and closing of the liquid supply pipe 211.

[0084] In some embodiments, the liquid supply part 200 comprises a plurality of liquid supply units 210, and each of the liquid supply units 210 is in communication with the mixing cavity 100 to supply the processing liquid into the mixing cavity 100. Specifically, the plurality of liquid supply units 210 can supply different kinds of processing liquid.

[0085] In some specific embodiments, the liquid supply unit 210 comprises a liquid supply pipe 211, one end of the liquid supply pipe 211 is arranged in the mixing cavity 100 and is in communication with the mixing cavity 100, and the arrangement mode can be bonding, clamping or bolt fixing, etc., which is not limited herein, and the position of the liquid supply pipe 211 in the mixing cavity 100 does not change and the connection between the two is sealed so that the liquid in the liquid supply pipe 211 can enter the mixing cavity 100; the other end of the liquid supply pipe 211 is in communication with a third supply device, and the third supply device is used to supply the processing liquid to flow through the liquid supply pipe 211 and then into the mixing cavity 100 for mixing.

[0086] In some more specific embodiments, the processing liquid supplied by the plurality of third supply devices can be the same or different, and in actual use, the same or different processing liquid is set according to the use requirement.

[0087] In some more specific embodiments, the plurality of liquid supply pipes 211 are uniformly distributed in the side wall of the mixing cavity 100.

[0088] In some more specific embodiments, the processing liquid can be sulfuric acid, hydrochloric acid, nitric acid, hydrofluoric acid, hydrogen peroxide, ammonia, organic acid (for example, citric acid, etc.), organic base (for example, TMAH, etc.), organic solvent and surfactant, etc., which is not limited herein, and in actual use, different processing liquid is selected according to the requirement.

[0089] The wafer liquid supply device further comprises a flow detection control device 600 arranged on the liquid outlet unit 320 and / or the liquid supply part 200 to detect and control the flow of the liquid flowing through the flow detection control device 600 in the liquid outlet unit 320 and / or the liquid supply part 200.

[0090] In some embodiments, the flow detection control device 600 is only arranged on the liquid outlet unit 320.

[0091] In some embodiments, the flow detection control device 600 is only arranged on the liquid supply part 200.

[0092] In some embodiments, the flow detection control device 600 is arranged on both the liquid outlet unit 320 and the liquid supply part 200.

[0093] The flow detection control device 600 is arranged on the first liquid outlet pipeline 322 and is disposed between the first nozzle 311 and the first liquid outlet control valve 323 to detect and control the liquid flow in the first liquid outlet pipeline 322.

[0094] In some embodiments, in order to facilitate the control of the liquid flow in the first liquid outlet pipeline 322, the flow detection control device 600 is arranged on the first liquid outlet pipeline 322, which can be clamped or bolted, without limitation, as long as it can detect and control the liquid flow in the first liquid outlet pipeline 322. The flow detection control device 600 is disposed between the liquid mixing cavity 100 and the first liquid outlet control valve 323 to facilitate the detection and control of the liquid flow from the liquid mixing cavity 100 into the first liquid outlet pipeline 322.

[0095] The flow detection control device 600 is arranged on the liquid supply pipeline 211 and is disposed on the side of the liquid supply control valve 212 away from the liquid mixing cavity 100 to detect and control the liquid flow in the liquid supply pipeline 211.

[0096] In some embodiments, in order to facilitate the control of the liquid flow in each liquid supply pipeline 211, the flow detection control device 600 is arranged on the liquid supply pipeline 211, which can be clamped or bolted, without limitation, as long as it can detect and control the liquid flow in the liquid supply pipeline 211. The flow detection control device 600 is disposed between the liquid mixing cavity 100 and the liquid supply control valve 212 to detect the flow of the treatment liquid flowing through the liquid supply pipeline 211 into the liquid mixing cavity 100.

[0097] The flow detection control device 600 comprises a flow detection member 610 and a flow control member 620.

[0098] When the flow detection control device 600 is arranged on the first liquid outlet pipeline 322, the flow control member 620 is disposed between the flow detection member 610 and the first liquid outlet control valve 323.

[0099] When the flow detection control device 600 is arranged on the liquid supply pipeline 211, the flow detection member 610 is arranged between the flow control member 620 and the liquid supply control valve 212.

[0100] In some embodiments, the flow detection control device 600 comprises a flow detection member 610 and a flow control member 620, wherein the flow detection member 610 is configured to detect the size of the liquid flow, and the flow control member 620 is configured to control the flow of the liquid. In some specific embodiments, the flow detection member 610 is a flow meter, and the flow control member 620 is an electrically operated needle valve.

[0101] In some specific embodiments, when the flow detection control device 600 is arranged in the first liquid outlet pipeline 322, the flow control member 620 is arranged between the flow detection member 610 and the first liquid outlet control valve 323; that is, the treatment liquid flowing from the mixing cavity 100 into the first liquid outlet pipeline 322 passes through the flow control member 620 and then the flow detection member 610. By controlling the flow control member 620, the size of the flow of the treatment liquid flowing from the mixing cavity 100 into the first liquid outlet pipeline 322 can be controlled.

[0102] In some specific embodiments, when the flow detection control device 600 is arranged in the liquid supply pipeline 211, the flow detection member 610 is arranged between the flow control member 620 and the liquid supply control valve 212; that is, the treatment liquid flowing from the liquid supply pipeline 211 into the mixing cavity 100 passes through the flow control member 620 and then the flow detection member 610. By controlling the flow control member 620, the size of the flow of the treatment liquid flowing from the liquid supply pipeline 211 into the mixing cavity 100 can be controlled.

[0103] The wafer liquid supply device further comprises an adjusting pipeline 710, one end of the adjusting pipeline 710 is in communication with the mixing cavity 100, and the other end is configured to be connected to a second supply device; the second supply device is configured to supply deionized water, so that the deionized water flows through the adjusting pipeline 710 and then enters the mixing cavity 100; so as to adjust the concentration of the cleaning liquid or the added liquid in the mixing cavity 100.

[0104] In some embodiments, the wafer liquid supply device further comprises an adjusting pipeline 710, the adjusting pipeline 710 is configured to adjust the concentration of the treatment liquid in the mixing cavity 100. One end of the adjusting pipeline 710 is arranged in the mixing cavity 100 and is in communication with the mixing cavity 100, and the arrangement mode can be bonding, clamping or bolt fixing, etc., which is not limited herein. The position of the adjusting pipeline 710 in the mixing cavity 100 does not change, and the connection between the two is sealed, so that the liquid in the adjusting pipeline 710 can enter the mixing cavity 100. The other end of the adjusting pipeline 710 is connected to a second supply device, wherein the liquid supplied by the second supply device can enter the mixing cavity 100 through the adjusting pipeline 710.

[0105] In some specific embodiments, the adjusting pipeline 710 is provided with an adjusting control valve 711, so as to control the opening and closing of the adjusting pipeline 710 and control the flow of the liquid flowing through the adjusting pipeline 710.

[0106] In some specific embodiments, the adjusting pipe 710 is arranged at the bottom of the mixing cavity 100, so that the liquid enters the mixing cavity 100 from the bottom of the mixing cavity 100.

[0107] In some more specific embodiments, the liquid supplied by the second supply device is deionized water.

[0108] It is worth noting that when the liquid supply part 200 and the liquid outlet part work, the adjusting pipe 710 can supply deionized water to the mixing cavity 100, or can not supply deionized water to the mixing cavity 100. In actual use, deionized water is supplied according to the needs. At the same time, after the mixing cavity 100 is cleaned, deionized water can be supplied to the mixing cavity 100 to completely remove the carbon dioxide aqueous solution in the mixing cavity 100, so as to reduce the possibility of mixing the cleaning liquid and the processing liquid.

[0109] Furthermore, each time the processing liquid is supplied, pre-spraying is required. At this time, the processing liquid will not be sprayed to the wafer surface. After the pre-spraying is completed, the processing liquid is sprayed to the wafer surface to completely remove the cleaning liquid in the mixing cavity 100.

[0110] Embodiments of the present application also disclose a wafer processing device, which comprises a wafer liquid supply device, a wafer bearing device 800 and a wafer driving device.

[0111] The wafer bearing device 800 is used for bearing the wafer.

[0112] The wafer driving device is connected with the wafer bearing device 800, so as to drive the wafer to rotate.

[0113] The nozzle assembly 310 is arranged corresponding to the wafer bearing device 800, so as to spray the processing liquid to the surface of the wafer.

[0114] In some embodiments, the wafer processing device is used for processing the wafer, wherein the wafer processing device comprises a wafer liquid supply device, a wafer bearing device 800 and a wafer driving device. Specifically, the wafer bearing device 800 is used for bearing the wafer, wherein the wafer bearing device 800 comprises a supporting part 810 and a clamping part, and the supporting part 810 is used for supporting the clamping part. Specifically, the supporting part 810 is a supporting table, and the clamping part is an electrostatic chuck, which is a prior art and will not be described here.

[0115] In some specific embodiments, the wafer driving device is connected with the wafer bearing device 800, so as to drive the wafer to move. Specifically, the wafer driving device can be a motor or other devices capable of driving the wafer to rotate, which is not limited here. The wafer driving device is connected with the clamping part, so as to drive the clamping part and the wafer to rotate synchronously.

[0116] In some embodiments, the nozzle assembly 310 is arranged corresponding to the wafer carrier 800, and specifically, the first nozzle 311 and the second nozzle 312 are arranged corresponding to the clamping portion, so as to spray the processing liquid to the surface of the wafer, which is a prior art and will not be described herein.

[0117] The wafer processing apparatus further comprises a control device connected with the nozzle assembly 310, for driving the nozzle assembly 310 to move in the vertical direction or the horizontal direction, so as to adjust the relative position between the nozzle assembly 310 and the wafer carrier 800.

[0118] In some embodiments, the control device is capable of controlling the movement of the nozzle assembly 310. Specifically, the control device is capable of driving the nozzle assembly 310 to move in the vertical direction or the horizontal direction, so as to adjust the relative position between the nozzle assembly 310 and the wafer carrier 800. More specifically, the control device drives the nozzle assembly 310 to move in the vertical direction, so as to adjust the interval between the nozzle assembly 310 and the wafer carrier 800 in the vertical direction. The control device drives the nozzle assembly 310 to move in the horizontal direction, so as to adjust the interval between the nozzle assembly 310 and the wafer carrier 800 in the horizontal direction.

[0119] In some embodiments, the nozzle assembly 310 is driven to move in the vertical direction by a pneumatic cylinder or an electric cylinder. The nozzle assembly 310 is driven to move in the horizontal direction by a motor, for example, the wafer processing apparatus is provided with a swing arm, the nozzle assembly 310 is arranged at one end of the swing arm, and the motor is arranged at the other end of the swing arm. The motor is started to drive the swing arm to rotate, so as to drive the nozzle assembly 310 to rotate, thereby driving the nozzle assembly 310 to move in the horizontal direction. This is a prior art and will not be described herein.

[0120] The implementation principle of the wafer liquid supply device and the wafer processing apparatus according to the embodiments of the present application is as follows. The wafer is placed on the wafer carrier 800, the relative position between the nozzle assembly 310 and the wafer carrier 800 is adjusted by the control device, so that the nozzle assembly 310 corresponds to the position of the wafer. The processing liquid is supplied to the mixing cavity 100 by the third supply device, and the cleaning liquid is sprayed to the surface of the wafer through the liquid outlet portion. After each spraying process is completed, the first supply device needs to be started to supply the cleaning liquid to the mixing cavity 100, so as to clean the processing liquid in the mixing cavity 100, thereby reducing the influence of the residual processing liquid in the mixing cavity 100 on the next spraying process. In addition, the first cleaning pipeline 410 and the liquid discharge pipeline 420 are arranged at the bottom and the top of the mixing cavity 100 respectively, and other pipelines are arranged between the first cleaning pipeline 410 and the liquid discharge pipeline 420, so that the cleaning process can clean the plurality of pipelines between the first cleaning pipeline 410 and the liquid discharge pipeline 420, thereby improving the cleaning efficiency.

[0121] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A wafer liquid supply device, characterized in that: It includes a liquid mixing chamber (100): a liquid supply portion (200), disposed in the liquid mixing chamber (100) and in communication with the liquid mixing chamber (100) to supply the treatment liquid into the liquid mixing chamber (100); The liquid outlet portion comprises a nozzle assembly (310) and a liquid outlet unit (320), one end of the liquid outlet unit (320) being arranged on the liquid mixing chamber (100) and communicating with the liquid mixing chamber (100); and the other end thereof being used to communicate with the nozzle assembly (310), so that the treated liquid in the liquid mixing chamber (100) flows through the liquid outlet unit (320) and then enters the nozzle assembly (310); a first cleaning pipe (410), one end of the first cleaning pipe (410) being arranged at the bottom of the liquid mixing chamber (100) and communicating with the liquid mixing chamber (100), and the other end being connected to a first supply device; the first supply device being used to provide cleaning liquid, so that the cleaning liquid flows through the first cleaning pipe (410) and then enters the liquid mixing chamber (100); a liquid discharge pipe (420), disposed at the top of the liquid mixing chamber (100) and in communication with the liquid mixing chamber (100) to discharge the cleaning liquid in the liquid mixing chamber (100); When the first cleaning pipe (410) and the liquid discharge pipe (420) are in operation, the liquid supply part (200) and the liquid discharge part stop operating, so that the cleaning liquid moves from the bottom of the liquid mixing chamber (100) toward the top of the liquid mixing chamber (100) to clean the liquid mixing chamber (100).

2. The wafer chemical solution supply device according to claim 1, characterized in that: The nozzle assembly (310) includes a first nozzle (311) and a second nozzle (312); The liquid outlet unit (320) comprises: A first liquid outlet unit (321) comprises a first liquid outlet pipe (322) and a first liquid outlet control valve (323); one end of the first liquid outlet pipe (322) is in communication with the liquid mixing chamber (100), and the other end is in communication with the first nozzle (311); the first liquid outlet control valve (323) is provided on the first liquid outlet pipe (322) to control the opening and closing of the first liquid outlet pipe (322); The second liquid outlet unit (324) comprises a second liquid outlet pipe (325) and a second liquid outlet control valve (326); one end of the second liquid outlet pipe (325) is connected to the liquid mixing chamber (100), and the other end is connected to the second nozzle (312); the second liquid outlet control valve (326) is provided on the second liquid outlet pipe (325) to control the on-off of the second liquid outlet pipe (325); the second liquid outlet control valve (326) cooperates with the first liquid outlet control valve (323) to allow the treated liquid to flow through the first nozzle (311) and / or the second nozzle (312) and then be sprayed out.

3. The wafer chemical solution supply device according to claim 2, characterized in that: The liquid supply part (200) includes a plurality of liquid supply units (210), and the liquid supply units (210) include: a liquid supply pipe (211), one end of which is in communication with the liquid mixing chamber (100), and the other end of which is in communication with a third supply device; the third supply device is used to supply the treatment liquid, so that the treatment liquid flows through the liquid supply pipe (211) and then enters the liquid mixing chamber (100); A liquid supply control valve (212) is provided on the liquid supply pipeline (211) to control the on-off of the liquid supply pipeline (211).

4. The wafer chemical solution supply device according to claim 3, characterized in that: The invention also includes a back-sucking unit (500), wherein the back-sucking unit (500) includes: A back-suction pipe (510) is provided on the second liquid outlet pipe (325) and is in communication with the second liquid outlet pipe (325); the back-suction pipe (510) is vertically arranged so that the treated liquid is discharged from the bottom of the back-suction pipe (510); A back-suction control valve (520) is provided in the back-suction pipe (510) to control the on-off of the back-suction pipe (510). The back-suction control valve (520) is normally closed so that the treatment liquid accumulates in the back-suction pipe (510). When the back-suction control valve (520) is opened, the treatment liquid accumulated in the back-suction pipe (510) is discharged, so that the treatment liquid in the second liquid outlet pipe (325) is discharged after passing through the back-suction pipe (510).

5. The wafer chemical solution supply device according to claim 3 or 4, characterized in that: The invention also includes a flow detection and control device (600), which is arranged in the liquid outlet unit (320) and / or the liquid supply part (200) to detect and control the flow of liquid flowing through the flow detection and control device (600) in the liquid outlet unit (320) and / or the liquid supply part (200).

6. The wafer chemical solution supply device according to claim 5, characterized in that: The flow detection and control device (600) is provided in the first liquid outlet pipe (322) and placed between the first nozzle (311) and the first liquid outlet control valve (323) to detect and control the liquid flow rate flowing through the first liquid outlet pipe (322).

7. The wafer chemical solution supply device according to claim 5, characterized in that: The flow detection and control device (600) is provided in the liquid supply pipeline (211) and is placed on a side of the liquid supply control valve (212) away from the liquid mixing chamber (100) to detect and control the liquid flow in the liquid supply pipeline (211).

8. The wafer chemical solution supply device according to claim 7, characterized in that: The flow detection and control device (600) comprises a flow detection component (610) and a flow control component (620); When the flow detection control device (600) is provided in the first liquid outlet pipe (322), the flow control component (620) is placed between the flow detection component (610) and the first liquid outlet control valve (323); When the flow detection control device (600) is provided in the liquid supply pipeline (211), the flow detection component (610) is provided between the flow control component (620) and the liquid supply control valve (212).

9. The wafer chemical solution supply device according to claim 5, characterized in that: The apparatus further comprises a regulating pipe (710), one end of which is in communication with the liquid mixing chamber (100), and the other end of which is used to connect to a second supply device; the second supply device is used to supply deionized water, so that the deionized water flows through the regulating pipe (710) and then enters the liquid mixing chamber (100), thereby regulating the concentration of the cleaning liquid or the treatment liquid in the liquid mixing chamber (100).

10. A wafer processing device, characterized in that: It comprises the wafer liquid supply device, wafer carrying device (800) and wafer driving device according to any one of claims 1 to 9; The wafer carrying device (800) is used for carrying wafers; The wafer driving device is connected to the wafer carrying device (800) to drive the wafer to rotate; The nozzle assembly (310) is arranged corresponding to the wafer carrying device (800) to spray the processing liquid onto the surface inside the wafer.

11. The wafer processing equipment according to claim 10, wherein: It also includes a control device, which is connected to the nozzle assembly (310) and is used to drive the nozzle assembly (310) to move in a vertical direction or a horizontal direction to adjust the relative position of the nozzle assembly (310) and the wafer carrying device (800).

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