Transmission arm, wafer transmission device and semiconductor detection equipment

Abstract

The invention provides a transmission arm, a wafer transmission device and semiconductor detection equipment. The transmission arm is arranged in the wafer transmission device to transmit wafers. The transmission arm comprises a mounting section, two bending sections and two bearing sections; the mounting section extends in the length direction of the mounting section, and the transmission arm is mounted on a wafer transmission device through the mounting section; the two bent sections are respectively connected with the mounting section at the end parts of the mounting section in the length direction, and the two bent sections are bent towards the same side of the mounting section; the two bearing sections are connected to the ends, away from the mounting section, of the bending sections in a one-to-one correspondence mode, each bearing section comprises a plurality of bearing branches extending in different directions, and the bearing branches can be distributed on the same bearing face to bear the wafer. The rotation angle of the transmission arm is smaller than 180 degrees when the wafer is transmitted, the transmission efficiency can be improved, a supporting column in the wafer transmission device can be avoided, the span between different bearing branches is increased, and stable transmission of the wafer is achieved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a transmission arm, a wafer transmission device and a semiconductor detection equipment. Background Art

[0002] In the semiconductor manufacturing industry, wafer transport is a critical step in the production process. Its efficiency and stability directly impact the quality and production efficiency of semiconductor products. Furthermore, wafer transport operates in a complex environment. Improving the efficiency and stability of wafer transport within these complex conditions has become a pressing challenge for researchers in this field. Summary of the Invention

[0003] The embodiments of the present application provide a transfer arm, a wafer transfer device, and a semiconductor detection device, which can improve the transfer efficiency and stability of wafers.

[0004] In a first aspect, an embodiment of the present application provides a transfer arm, which is arranged in a wafer transfer device to transfer wafers. The transfer arm includes a mounting section, two bending sections, and two supporting sections; the mounting section extends along its own length, and the transfer arm is mounted on the wafer transfer device through the mounting section; the two bending sections are respectively connected to the mounting section at the ends of the mounting section in the length direction, and the two bending sections are bent toward the same side of the mounting section; the two supporting sections are connected one-to-one to the end of each bending section away from the mounting section, and each supporting section includes multiple supporting branches extending in different directions, and the multiple supporting branches can be distributed on the same supporting surface to support the wafer.

[0005] Optionally, each of the bending sections starts from an end of the mounting section, first bends and extends toward one side of the mounting section, and then bends and extends toward a direction away from another bending section.

[0006] Optionally, the direction in which the bending section bends and extends toward one side of the mounting section forms an obtuse angle with the length direction of the mounting section; the direction in which the bending section extends away from the other bending section forms an acute angle with the direction in which the bending section bends and extends toward one side of the mounting section.

[0007] Optionally, an angle between a direction in which the bending section bends and extends toward one side of the mounting section and a length direction of the mounting section is in a range of 100° to 140°.

[0008] Optionally, an angle between a direction in which the bending segment extends away from the other bending segment and a direction in which the bending segment bends and extends toward one side of the mounting segment is in a range of 65° to 85°.

[0009] Optionally, the multiple supporting branches include a main supporting branch, a secondary supporting branch and an auxiliary supporting branch; the main supporting branch is connected to the bending section and extends away from the bending section; the secondary supporting branch is connected to the main supporting branch and extends toward the installation section; the auxiliary supporting branch is connected to the main supporting branch and extends away from the main supporting branch.

[0010] Optionally, the main supporting branch is arc-shaped, and the arc center and the secondary supporting branch are respectively located on both sides of the main supporting branch.

[0011] Optionally, the free end of the secondary supporting branch is spaced apart from the bending section, and the secondary supporting branch extends radially along the main supporting branch.

[0012] Optionally, an included angle between an extension direction of the secondary supporting branch and a bending extension direction of the bending section toward the installation section is in a range of 20° to 40°.

[0013] Optionally, the supporting section further includes a reinforcing rib, which is connected to the auxiliary supporting support and the bending section to improve the connection strength of the auxiliary supporting support.

[0014] Optionally, the supporting section further includes a weight-reducing opening, which is located between the reinforcing rib, the auxiliary supporting support, and the bending section, and the contour of the weight-reducing opening is circular.

[0015] Optionally, the transmission arm also includes a main friction part, a secondary friction part and an auxiliary friction part respectively arranged at the ends of different supporting branches, and the main friction part, the secondary friction part and the auxiliary friction part are used to jointly support the wafer, and the projection of the center of gravity of the wafer is located within the triangle enclosed by the connecting lines of the main friction part, the secondary friction part and the auxiliary friction part.

[0016] Optionally, the transmission arm also includes a reinforced friction part and an expanded friction part arranged in the bending section; in the length direction of the mounting section, the reinforced friction part is located on the outside of the triangle, and the distance between the expanded friction part and the mounting section is smaller than the distance between the reinforced friction part and the mounting section; the main friction part, the secondary friction part, the auxiliary friction part, and the reinforced friction part are used to collaboratively support first-specification wafers; the main friction part, the secondary friction part, the auxiliary friction part, the reinforced friction part, and the expanded friction part are used to collaboratively support second-specification wafers; the outer diameter of the second-specification wafer is larger than the outer diameter of the first-specification wafer.

[0017] In the second aspect, an embodiment of the present application provides a wafer transmission device, comprising a transmission chamber and a transmission mechanism; the transmission chamber comprises a wafer input chamber, a wafer output chamber and a working chamber, the wafer input chamber is used to receive wafers, the wafer output chamber is used to output wafers, and the working chamber is used to provide a wafer operating space; the transmission mechanism is arranged in the transmission chamber, the transmission mechanism comprises a power assembly and a transmission arm, the power assembly is arranged in the transmission chamber to provide power for the transmission arm, the transmission arm rotates back and forth at a rotation angle of less than 180° based on the power of the power assembly to transmit wafers between the working chamber and the wafer input chamber and the wafer output chamber; wherein the transmission arm is the transmission arm in the technical solution of the first aspect.

[0018] Optionally, the reciprocating angle of the transmission arm is R, wherein 100°≤R<180°.

[0019] Optionally, 130°≤R≤150°.

[0020] Optionally, the power assembly includes a linear assembly and a rotating assembly, the linear assembly is arranged on the top wall of the transmission chamber, the rotating assembly is arranged on the linear assembly and connected to the transmission arm, the linear assembly is used to drive the rotating assembly to translate toward or away from the top wall of the transmission chamber, and the rotating assembly is used to drive the transmission arm to rotate back and forth.

[0021] Optionally, the transfer chamber further includes a carrier support column arranged in the working chamber, and the carrier support column is fixedly arranged on the carrier stage in the working chamber, for exchanging wafers with the transfer arm; the carrier stage is arranged on the bottom wall of the working chamber, for translating along the bottom wall of the working chamber to move the wafer.

[0022] Optionally, the transfer chamber includes a plurality of support columns, including a film input support column and / or a film output support column; the film input support column is fixedly arranged on the bottom wall of the film input chamber, and is used to exchange wafers with the transfer arm; the film output support column is fixedly arranged on the bottom wall of the film output chamber, and is used to exchange wafers with the transfer arm.

[0023] In a third aspect, an embodiment of the present application provides a semiconductor testing device, which includes the wafer transfer device in the above technical solution.

[0024] An embodiment of the present application provides a transfer arm, wherein the two bent sections of the transfer arm bend toward the same side of the installation section at the end of the installation section. The transfer arm transfers wafers at a rotation angle of less than 180°, thereby improving wafer transfer efficiency while avoiding support columns within a wafer transfer device. The support section is extended between the support columns of the wafer transfer device to avoid interference and achieve stable wafer transfer. The multiple support branches of the support section extend in different directions. When supporting a wafer, the span between the different support branches can be increased, further improving the stability of wafer transfer.

[0025] An embodiment of the present application provides a wafer transmission device, the transmission chamber of which includes a wafer input chamber, a wafer output chamber and a working chamber. The wafer input chamber and the wafer output chamber cooperate with a transmission arm. When transmitting wafers, the wafers are received and sent out by different chambers. The rotation angle of the transmission arm is less than 180°, which can shorten the displacement of the wafer and improve the transmission efficiency. At the same time, it can also reduce the time for establishing a vacuum environment in the wafer input chamber and the wafer output chamber, further improving the wafer transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 1 ;

[0028] Figure 2 For this application Figure 1 Schematic diagram of the rotation of the transmission arm;

[0029] Figure 3 Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 2 ;

[0030] Figure 4 For this application Figure 3 Schematic diagram of the rotation of the transmission arm;

[0031] Figure 5 Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 3 ;

[0032] Figure 6 For this application Figure 5 Schematic diagram of the rotation of the transmission arm;

[0033] Figure 7 For this application Figure 1 Schematic diagram of the supporting section structure of the middle transmission arm;

[0034] Figure 8 For this application Figure 1 Schematic diagram of the middle transfer arm supporting the wafer;

[0035] Figure 9 This is a schematic structural diagram of a wafer transfer device according to some embodiments of the present application;

[0036] Figure 10 This is a schematic diagram of the interior of a wafer transfer device according to some embodiments of the present application;

[0037] Figure 11 A schematic diagram of a wafer transfer device transferring a wafer according to some embodiments of the present application;

[0038] Figure 12 This is a schematic structural diagram of the transmission mechanism of some embodiments of the present application.

[0039] In the attached figure:

[0040] 1-Installation section; 2-Bending section; 3-Support section; 31-Main support; 32-Secondary support; 33-Auxiliary support; 34-Reinforcement rib; 35-Weight reduction opening; 4-Main friction member; 5-Secondary friction member; 6-Auxiliary friction member; 7-Reinforced friction member; 8-Expanded friction member; 9-Wafer; 91-First specification wafer; 92-Second specification wafer; O-Rotation axis;

[0041] 100 - transmission mechanism; 110 - transmission arm; 120 - power assembly; 121 - linear assembly; 122 - rotation assembly; 200 - transmission chamber; 210 - film feed chamber; 211 - film feed support column; 220 - film discharge chamber; 221 - film discharge support column; 230 - working chamber; 231 - load support column. DETAILED DESCRIPTION

[0042] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0043] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0044] Wafers, ranging in size from a few inches to over ten inches (with 6-inch and 8-inch wafers still holding a significant position in the semiconductor market), are the fundamental material for semiconductor chips. In the semiconductor manufacturing industry, the efficiency and stability of wafer transport directly impact the production efficiency and quality of semiconductor products.

[0045] In some semiconductor testing equipment, wafers need to be exchanged between two chambers. When transferring wafers, a wafer is placed at each end of the robotic arm. When the robotic arm rotates 180°, the positions of the two wafers can be swapped to achieve wafer interaction between the two chambers. In order to exchange wafers with the robotic arm (remove wafers from the robotic arm and / or place wafers on the robotic arm), interactive components (such as components with support columns) are provided in the two chambers to cooperate with the robotic arm. The robotic arm needs to avoid these interactive components when rotating to avoid interference, so the robotic arm also faces the problem of a complex working environment when rotating.

[0046] The inventors have discovered that wafer displacement during wafer transfer affects transfer efficiency and stability. Smaller wafer displacement during transfer results in higher transfer efficiency, and reduced displacement helps reduce the likelihood of wafer slippage during transfer. Reducing the robotic arm's rotation angle can reduce wafer displacement during transfer, thereby improving both transfer efficiency and stability.

[0047] Based on the above considerations, the present application provides a transfer arm, a wafer transfer device and a semiconductor detection equipment, which can improve the transmission efficiency and stability of wafers in complex working conditions.

[0048] Please refer to Figures 1 to 6 , Figure 1 Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 1 ; Figure 2 For this application Figure 1 Schematic diagram of the rotation of the transmission arm; Figure 3Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 2 ; Figure 4 For this application Figure 3 Schematic diagram of the rotation of the transmission arm;

[0049] Figure 5 Schematic diagram of the structure of the transmission arm in some embodiments of the present application Figure 3 ; Figure 6 For this application Figure 5 Schematic diagram of the rotation of the transmission arm.

[0050] On the first aspect, an embodiment of the present application provides a transmission arm, which is arranged in a wafer transmission device to transmit wafers. The transmission arm includes a mounting section 1, two bending sections 2 and two supporting sections 3; the mounting section 1 extends along its own length direction, and the transmission arm is installed on the wafer transmission device through the mounting section 1; the two bending sections 2 are respectively connected to the mounting section 1 at the ends of the length direction of the mounting section 1, and the two bending sections 2 are bent toward the same side of the mounting section 1; the two supporting sections 3 are connected one by one to the end of each bending section 2 away from the mounting section 1, and each supporting section 3 includes a plurality of supporting branches extending in different directions, and the plurality of supporting branches can be distributed on the same supporting surface to support the wafer. In other words, one side surface of the plurality of supporting branches in the thickness direction is located in the same supporting surface, and can support wafers at the same time.

[0051] For example, the mounting section 1, two bent sections 2, and two supporting sections 3 of the transmission arm can be integrally formed from sheet metal. The thicknesses of the mounting section 1, bent sections 2, and supporting sections 3 can be the same or different. The mounting section 1 can be elongated and extend along its length, while the bent sections 2 can also be strip-shaped and connect to the ends of the mounting section 1. The width of the bent sections 2 can be the same as or different from that of the mounting section 1.

[0052] When the transfer arm is arranged in the wafer transfer device to transfer wafers, it can reciprocate around the rotation axis O under the action of the power mechanism of the transfer device, thereby transferring the wafers between different chambers.

[0053] In the transmission arm, e.g. Figure 2 、 Figure 4 and Figure 6 As shown, the two bending sections 2 bend toward the same side of the mounting section 1. In order to avoid interference, the support columns in different chambers are staggered (for example, along the Figure 2 In the vertical projection, the projection of the support column in the upper left corner chamber is spaced apart from the projection of the support column in the lower chamber, and the projection of the support column in the upper right corner chamber is spaced apart from the projection of the support column in the lower chamber). The rotation angle of the transfer arm is less than 180° when transferring the wafer.

[0054] For example, Figure 3 and Figure 4 As shown, when the transmission arm reciprocates around the rotation axis O, the rotation axis O may be located on the mounting section 1 .

[0055] For example, when the transmission arm reciprocates around the rotation axis O, the rotation axis O may be located on one side of the installation section 1 and spaced apart from the installation section 1 .

[0056] Preferably, the rotation axis O is located on one side of the mounting section 1, such as Figure 1 and Figure 2 As shown, it can be located on the same side as the bending section 2, such as Figure 5 and Figure 6 As shown, it can also be located on a different side from the bending section 2.

[0057] Each chamber of the wafer transfer device is equipped with support columns for supporting wafers, and the wafers are exchanged with the transfer arm through the support columns. There are three support columns in each chamber (forming three support positions to stably support the wafers).

[0058] When transferring wafers, the transfer arm supports the wafers below the transfer arm through at least the supporting segments 3. Each supporting segment 3 supports one wafer, and when the transfer arm reciprocates around the rotation axis O, the wafers can be moved between different chambers. Specifically, when the supporting segments 3 of the transfer arm rotate to a position where the wafers can be moved between chambers, they need to extend between the multiple support columns of the chamber, thereby allowing the multiple support columns of the chamber to lift the wafer from the transfer arm or place the wafer on the transfer arm.

[0059] In the technical solution of the above embodiment, the transmission arm can rotate back and forth in the wafer transmission device to realize wafer transmission. The two bending sections 2 are bent toward the same side of the mounting section 1 at the end of the mounting section 1, and the transmission arm transmits the wafer at a rotation angle of less than 180°, thereby improving the wafer transmission efficiency while avoiding the support columns in the wafer transmission device, and extending the supporting section 3 between the support columns of the wafer transmission device to avoid interference and realize stable transmission of the wafer. The multiple supporting branches of the supporting section 3 extend in different directions. When supporting the wafer, the span between different supporting branches can be increased, thereby improving the stability of the wafer during transmission.

[0060] In the semiconductor manufacturing industry, wafers come in a variety of sizes, and transfer arms and wafer transfer devices need to adapt to these different sizes, thereby improving versatility and reducing equipment costs. To improve versatility, the support columns of the wafer transfer device are designed based on the smallest wafer size they accommodate. This allows them to accommodate large wafers while also meeting the requirements for small wafers. The transfer arm design must accommodate both small and large wafers, while also meeting the transfer stability requirements for different wafers.

[0061] Please refer to Figure 7 and Figure 8, Figure 7 For this application Figure 1 Schematic diagram of the supporting section structure of the middle transmission arm; Figure 8 For this application Figure 1 Schematic diagram of the transfer arm supporting the wafer.

[0062] In some embodiments of the present application, each bending segment 2 starts from an end of the installation segment 1 , first bends and extends toward one side of the installation segment 1 , and then bends and extends in a direction away from another bending segment 2 .

[0063] When the transfer arm is installed in the wafer transfer device, the bending section 2 and the rotation axis O are located on the same side of the installation section 1 .

[0064] The bent section 2 itself has a bend, with a portion of the bent section 2 located between the bend and the mounting portion, and another portion located between the bend and the supporting section 3. When supporting a small wafer, the supporting section 3 and the portion of the bent section 2 located between the bend and the supporting section 3 can jointly support the wafer 9. When supporting a large wafer, the supporting section 3, the portion of the bent section 2 located between the bend and the supporting section 3, and the portion of the bent section 2 located between the bend and the mounting portion can jointly support the wafer 9.

[0065] The bending section 2 itself does not have a bend (such as Figure 3 or Figure 5 For the transfer arm shown in FIG. 1 , the portion of the bent section 2 between the bend and the mounting section 1 significantly increases contact between large wafers and the bent section 2. Furthermore, the bend allows the bent section 2 to clear the support columns of the wafer transfer device at the bend. This allows the bent section 2 to pass between the support columns, avoiding interference with the columns while still allowing the supporting section 3 to be placed between them.

[0066] In the technical solution of the above embodiment, each bending section 2 itself has a bend. By forming the bend, the contact between the bending section 2 and the wafer can be increased when the transmission arm supports the large-size wafer, thereby improving the stability of the large-size wafer during transmission.

[0067] like Figure 7 As shown, in some embodiments of the present application, the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 forms an obtuse angle (R1) with the length direction of the mounting section 1. The direction in which the bending section 2 extends away from the other bending section 2 forms an acute angle (R2) with the direction in which the bending section 2 bends and extends toward one side of the mounting section 1.

[0068] like Figure 2As shown, relative to clamping a right angle or acute angle, the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 forms an obtuse angle with the length direction of the mounting section 1. In the length direction of the mounting section 1, the proportion of the bending section 2 in the transmission arm can be increased, thereby shortening the length of the mounting section 1.

[0069] like Figure 2 As shown, compared with clamping a right angle or an obtuse angle, the direction in which the bending section 2 extends away from the other bending section 2 and the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 clamp an acute angle, which can make the center of gravity of the bending section 2 closer to the mounting section 1.

[0070] In the technical solution of the above embodiment, the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 forms an obtuse angle with the length direction of the mounting section 1. In the length direction of the mounting section 1, the proportion of the bending section 2 in the transmission arm is increased, and the length of the mounting section 1 can be shortened, thereby avoiding interference between the mounting section 1 and the support column when the transmission arm rotates, thereby improving the stability of the transmission of the wafer 9; the direction in which the bending section 2 extends away from the other bending section 2 forms an acute angle with the direction in which the bending section 2 bends and extends toward one side of the mounting section 1, thereby making the center of gravity of the bending section 2 closer to the mounting section 1, thereby reducing the bending moment when the transmission arm supports the wafer 9, thereby improving the stability of the transmission of the wafer 9.

[0071] Preferably, the angle between the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 and the length direction of the mounting section 1 is in the range of 100° to 140°, for example, it can be any value among 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135°, 140°, or any intermediate value between any two adjacent values ​​mentioned above.

[0072] Preferably, the angle between the direction in which the bending section 2 extends away from the other bending section 2 and the direction in which the bending section 2 bends and extends toward one side of the mounting section 1 is in the range of 65° to 85°. For example, it can be any value among 65°, 70°, 75°, 80°, 85°, or any intermediate value between any two adjacent values ​​mentioned above.

[0073] In the bending section 2, further setting the included angle within the above-mentioned range can also make the center of gravity of the transmission arm tend to the installation section 1, slow down the bending deformation of the transmission arm, and extend the service life; and, can also leave space between the bending point of the bending section 2 and the supporting section 3, so as to facilitate the layout of the supporting branches of the supporting section 3.

[0074] like Figure 7As shown, in some embodiments of the present application, the multiple supporting branches include a main supporting branch 31, a secondary supporting branch 32, and an auxiliary supporting branch 33. The main supporting branch 31 is connected to the bending section 2 and extends away from the bending section 2. The secondary supporting branch 32 is connected to the main supporting branch 31 and extends toward the mounting section 1. The auxiliary supporting branch 33 is connected to the main supporting branch 31 and extends away from the main supporting branch 31.

[0075] When the main supporting branch 31 extends away from the bending section 2, there may be various extension forms. For example, the main supporting branch 31 may extend along a straight line or along a curve. The curve may be an arc, a wavy line, or the like.

[0076] like Figure 7 As shown, the dotted line between the bending section 2 and the main support 31 represents the boundary between the bending section 2 and the main support 31; the dotted line between the main support 31 and the auxiliary support 33 represents the boundary between the main support 31 and the auxiliary support 33. These dotted lines are only for the purpose of making the structure and connection of the main support 31, the auxiliary support 33, and the bending section 2 more intuitive, and do not represent the physical structure of the transmission arm.

[0077] In the technical solution of the above embodiment, the auxiliary support 33 extends away from the main support 31, which can increase the span with the main support 31. The auxiliary support 32 is separated from the main support 31, which can further disperse the support position. When the wafer 9 is transferred, the support position of the wafer 9 by the support section 3 can be more dispersed, thereby improving the stability during support.

[0078] like Figure 7 As shown, in some embodiments of the present application, the main supporting branch 31 is arc-shaped, and the arc center and the secondary supporting branch 32 are respectively located on both sides of the main supporting branch 31.

[0079] When supporting the wafer 9 , the arc center of the main supporting support 31 is located on the axis of the wafer 9 . The auxiliary supporting support 32 extends away from the main supporting support 31 .

[0080] In the technical solution of the above embodiment, the middle part of the main supporting support 31 is bent toward the auxiliary supporting support 32, which can reduce the extension length of the auxiliary supporting support 32 and improve the structural strength of the auxiliary supporting support 32, thereby improving the stability and reliability when transferring the wafer 9.

[0081] like Figure 7 As shown, in some embodiments of the present application, the free end of the secondary supporting branch 32 is spaced apart from the bending section 2 , and the secondary supporting branch 32 extends radially along the main supporting branch 31 .

[0082] Preferably, the angle (R3) between the extension direction of the secondary support 32 and the bending extension direction of the bending section 2 toward the mounting section 1 is in the range of 20° to 40°, for example, it can be any value among 20°, 22°, 24°, 26°, 28°, 30°, 32°, 34°, 36°, 38°, 40°, or any intermediate value between any two adjacent values ​​mentioned above.

[0083] In the technical solution of the above-described embodiment, the free end of the secondary support leg 32 is spaced apart from the bent section 2, avoiding the support posts and allowing the support section 3 to enter between the multiple support posts, thereby improving the stability of the wafer 9 during interaction. The secondary support leg 32 extends radially along the main support leg 31. When the free end of the secondary support leg 32 needs to reach a predetermined position, compared to other extension methods, the length of the secondary support leg 32 can be reduced, thereby increasing its structural strength and thus improving stability.

[0084] Furthermore, the extension direction of the auxiliary support 32 forms an acute angle with the extension direction of the bending section 2 toward the installation section 1 , and the angle is designed to be within the above range, which can increase the avoidance space reserved for the support column.

[0085] like Figure 7 As shown, in some embodiments of the present application, the supporting segment 3 further includes a reinforcing rib 34 , and the reinforcing rib 34 is connected to the auxiliary supporting support 33 and the bending segment 2 .

[0086] On the supporting section 3 , the connection between the auxiliary supporting support 33 and the bending section 2 at the junction is relatively weak. Improving the connection strength between the auxiliary supporting support 33 and the bending section 2 can improve the structural strength of the auxiliary supporting support 33 .

[0087] In the technical solution of the above embodiment, the reinforcing rib 34 is connected to the auxiliary support 33 and the bending section 2, which can strengthen the connection between the bending section 2 and the auxiliary support 33, improve the connection strength of the auxiliary support 33, and thus improve the stability when supporting the wafer 9.

[0088] like Figure 7 As shown, in some embodiments of the present application, the supporting segment 3 further includes a weight-reducing opening 35 , which is located between the reinforcing rib 34 , the auxiliary supporting support 33 , and the bending segment 2 , and the outline of the weight-reducing opening 35 is circular.

[0089] like Figure 7 As shown, the dashed line between the bent section 2 and the reinforcing rib 34 represents the boundary between the bent section 2 and the reinforcing rib 34; the dashed line between the auxiliary support 33 and the reinforcing rib 34 represents the boundary between the auxiliary support 33 and the reinforcing rib 34. These dashed lines are merely for the purpose of making the structure and connection between the main support 31, the auxiliary support 33, the reinforcing rib 34, and the bent section 2 more intuitive, and do not represent the physical structure of the transmission arm.

[0090] In the technical solution of the above embodiment, the provision of the weight reduction opening 35 can reduce the weight of the transfer arm, thereby reducing the load during the transfer of the wafer 9. The weight reduction opening 35 is circular and can be formed by drilling, which facilitates processing and reduces processing costs.

[0091] like Figure 8 As shown, in some embodiments of the present application, the transmission arm also includes a main friction part 4, a secondary friction part 5 and an auxiliary friction part 6 respectively arranged at the ends of different supporting branches. The main friction part 4, the secondary friction part 5 and the auxiliary friction part 6 are used to jointly support the wafer 9, and the projection of the center of gravity of the wafer 9 is located in the triangle enclosed by the connecting lines of the main friction part 4, the secondary friction part 5 and the auxiliary friction part 6.

[0092] When transferring the wafer 9 , the transfer arm contacts the wafer 9 via the main friction member 4 , the secondary friction member 5 and the auxiliary friction member 6 , which provide support on the lower surface of the wafer 9 .

[0093] Exemplarily, the main friction member 4 is arranged on the top surface of the main support 31 and is located at the free end of the main friction member 4; the auxiliary friction member 5 is arranged on the top surface of the auxiliary support 32 and is located at the free end of the auxiliary support 32; the auxiliary friction member 6 is arranged on the top surface of the auxiliary support 33 and is located at the free end of the auxiliary support 33.

[0094] The main friction member 4 , the secondary friction member 5 and the auxiliary friction member 6 may all be friction columns, or the main friction member 4 , the secondary friction member 5 and the auxiliary friction member 6 may all be O-rings.

[0095] The main friction part 4, the secondary friction part 5 and the auxiliary friction part 6 are preferably friction columns, and O-rings are arranged one by one next to them. The O-rings can serve as auxiliary and spare parts for the friction columns, cooperating with the friction columns to support the wafer 9 or replacing the friction columns to support the wafer 9 when the friction columns fail (for example, the friction columns are removed for maintenance).

[0096] Exemplarily, the friction column can be made of a material with a friction coefficient of 3.4 or more with the wafer 9 (such as a viscoelastic polymer, which increases the friction coefficient based on molecular chain entanglement and viscous effects, such as a combination of synthetic rubber and other materials), which can provide friction for the stable transmission of the wafer 9 and control the offset of the wafer 9 within 30μm.

[0097] In the technical solution of the above embodiment, the transfer arm supports the wafer 9 via the primary friction member 4, the secondary friction member 5, and the auxiliary friction member 6. These three supporting positions can provide stable support for the wafer 9. Furthermore, when supporting the wafer 9, the projection of the center of gravity of the wafer 9 is located within the triangle enclosed by the connecting lines of the primary friction member 4, the secondary friction member 5, and the auxiliary friction member 6, which can further improve the support stability and prevent the wafer 9 from tipping over.

[0098] like Figure 8 As shown, in some embodiments of the present application, the transmission arm further includes a strengthening friction member 7 and an expansion friction member 8 provided on the bending section 2. In the length direction of the mounting section 1, the strengthening friction member 7 is located outside the triangle, and the distance between the expansion friction member 8 and the mounting section 1 is smaller than the distance between the strengthening friction member 7 and the mounting section 1.

[0099] For example, the transfer arm can be used to transfer wafers of two sizes. Both the reinforced friction member 7 and the expanded friction member 8 are located on the bending section 2. When transferring wafer 9, the reinforced friction member 7 can cooperate with the primary friction member 4, the secondary friction member 5, and the auxiliary friction member 6 to support a wafer 91 of the first size. The expanded friction member 8 can cooperate with the primary friction member 4, the secondary friction member 5, the auxiliary friction member 6, and the reinforced friction member 7 to support a wafer 92 of the second size. The outer diameter of the second size wafer 92 is larger than that of the first size wafer 91.

[0100] In the technical solution of the above embodiment, the reinforced friction member 7 is located outside the triangle and, in conjunction with the primary friction member 4, the secondary friction member 5, and the auxiliary friction member 6, provides four support positions, thereby improving the stability of the support for first-size wafers 91. The distance between the extended friction member 8 and the mounting section 1 is smaller than the distance between the reinforced friction member 7 and the mounting section 1. When supporting second-size wafers 92, the extended friction member 8 is closer to the edge of the second-size wafer 92, not only increasing the number of support positions but also allowing them to be dispersed from other support positions, increasing the span between different support positions and further improving stability.

[0101] Please refer to Figures 9 to 12 , Figure 9 This is a schematic structural diagram of a wafer transfer device according to some embodiments of the present application; Figure 10 This is a schematic diagram of the interior of a wafer transfer device according to some embodiments of the present application; Figure 11 A schematic diagram of a wafer transfer device transferring a wafer according to some embodiments of the present application; Figure 12 This is a schematic structural diagram of the transmission mechanism of some embodiments of the present application.

[0102] In a second aspect, an embodiment of the present application provides a wafer transfer device, comprising a transfer chamber 200 and a transfer mechanism 100. The transfer chamber 200 comprises a wafer inlet chamber 210, a wafer outlet chamber 220, and a working chamber 230; the transfer mechanism 100 is disposed in the transfer chamber 200, and the transfer mechanism 100 comprises a power assembly 120 and a transfer arm 110. The power assembly 120 is disposed in the transfer chamber 200 and provides power for the transfer arm 110. The transfer arm 110 reciprocates at a rotation angle of less than 180° based on the power of the power assembly 120, and transfers wafers 9 between the working chamber 230 and the wafer inlet chamber 210 and the wafer outlet chamber 220; wherein the transfer arm 110 is the transfer arm in any of the above embodiments.

[0103] In the transfer chamber 200, the wafer input chamber 210 is used to receive wafers 9, the wafer output chamber 220 is used to output wafers 9, and the working chamber 230 is used to provide an operating space for wafers 9. The wafer input chamber 210 can be connected to the working chamber 230, and the transfer arm 110 transfers wafers 9 between the wafer input chamber 210 and the working chamber 230. The wafer output chamber 220 can be connected to the working chamber 230, and the transfer arm transfers wafers 9 between the wafer output chamber 220 and the working chamber 230. The wafer input chamber 210 and the wafer output chamber 220 are not connected, and the two do not interact with each other for wafers 9. Both the wafer input chamber 210 and the wafer output chamber 220 can be connected to the outside of the transfer chamber 200, so that an external robot can place wafers 9 into the wafer input chamber 210 and remove wafers 9 from the wafer output chamber 220.

[0104] Specifically, the film feeding chamber 210 and the working chamber 230 can be closed and connected by a sealing mechanism. Before the film feeding chamber 210 completes the establishment of the vacuum environment, the film feeding chamber 210 and the working chamber 230 are closed by a sealing mechanism. After the film feeding chamber 210 completes the establishment of the vacuum environment, the film feeding chamber 210 is connected to the working chamber 230, and the transmission arm 110 can transmit the wafer 9 from the film feeding chamber 210 to the working chamber 230. After the transmission is completed, the film feeding chamber 210 and the working chamber 230 are closed by the sealing mechanism, and the film feeding chamber 210 receives a new wafer 9 from the outside. This is repeated to achieve continuous transmission of wafers 9.

[0105] The wafer discharge chamber 220 and the working chamber 230 can be closed and connected by a closing mechanism. Before the vacuum environment of the wafer discharge chamber 220 is established, the wafer discharge chamber 220 and the working chamber 230 are closed by the closing mechanism. After the vacuum environment of the wafer discharge chamber 220 is established, the wafer discharge chamber 220 is connected with the working chamber 230, and the transfer arm 110 can transfer the wafer 9 from the working chamber 230 to the wafer discharge chamber 220. After the transfer is completed, the wafer discharge chamber 220 and the working chamber 230 are closed by the closing mechanism, and the external robot takes the wafer 9 from the wafer discharge chamber 220. This is repeated to achieve continuous transfer of wafer 9. Figure 6 As shown, in this posture, the transfer arm places the wafer 9 into the working chamber 230 and places the wafer 9 into the wafer discharge chamber 220 .

[0106] The power assembly 120 is capable of at least driving the transfer arm 110 to reciprocate (alternately rotate clockwise and counterclockwise) about the rotation axis O. The power assembly 120 may only drive the transfer arm 110 to rotate about the rotation axis O, or it may not only drive the transfer arm 110 to rotate about the rotation axis O but also drive the transfer arm 110 to translate along the rotation axis O.

[0107] The wafer inlet chamber 210 and the wafer outlet chamber 220 both serve as buffer chambers for transporting wafers 9, preventing the working chamber 230 from being directly exposed to the atmosphere. In the wafer transport device, the buffer chambers are divided into the wafer inlet chamber 210 and the wafer outlet chamber 220, and the transport arm 110 rotates less than 180° during wafer 9 transport.

[0108] In the technical solution of the above embodiment, the transfer chamber 200 includes a wafer inlet chamber 210, a wafer outlet chamber 220, and a working chamber 230, dividing the buffer chamber into two, namely, a wafer inlet chamber 210 and a wafer outlet chamber 220. In conjunction with the transfer arm 110, when transferring the wafer 9, the wafer 9 is received and sent out by different chambers, which can reduce the time for the wafer inlet chamber 210 and the wafer outlet chamber 220 to establish a vacuum environment, thereby improving the transfer efficiency. The wafer inlet chamber 210 and the wafer outlet chamber 220 are separately provided. When the working chamber 230 exchanges wafers 9 with the wafer inlet chamber 210 or the wafer outlet chamber 220, the rotation angle of the transfer arm 110 is less than 180°, which can shorten the displacement of the wafer 9 and further improve the transfer efficiency.

[0109] like Figure 11 As shown, in some embodiments of the present application, the reciprocating angle of the transmission arm 110 is R, wherein 100°≤R<180°.

[0110] Exemplarily, R can be any value among 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170°, and 179°, or any intermediate value between any two adjacent values ​​mentioned above.

[0111] In the structural arrangement of the transfer chamber 200, the film input chamber 210 and the film output chamber 220 are arranged side by side, and both are connected to the working chamber 230. The width direction of the transfer chamber 200 is from the film input chamber 210 to the film output chamber 220; the length direction of the transfer chamber 200 is from the film input chamber 210 (or the film output chamber 220) to the working chamber 230. If the angle of reciprocating movement of the transfer arm 110 is small (for example, 90°), the width of the transfer chamber 200 needs to be increased to meet the requirements of transferring films at a smaller angle, and the corresponding vacuum environment establishment time increases, affecting the film transfer efficiency; if the angle of reciprocating movement of the transfer arm 110 is large (for example, 160°), the length of the transfer chamber 200 needs to be increased to meet the requirements of transferring films at a larger angle, which not only affects the vacuum environment establishment time, but also increases the action time of the transfer arm 110, affecting the film transfer efficiency.

[0112] In the technical solution of the above embodiment, 100°≤R<180°, which can reduce the rotation time of the transmission arm 110 and improve the transmission efficiency of the wafer 9; and, within this range, it is also possible to coordinate the volumes of the transmission arm 110, the wafer input chamber 210, the wafer output chamber 220 and the working chamber 230, thereby shortening the time to establish a vacuum environment, improving the transmission efficiency of the wafer 9 and saving production costs.

[0113] Preferably, the value range of R is 130°≤R≤150°, for example, any value among 130°, 132°, 134°, 136°, 138°, 140°, 142°, 144°, 146°, 148°, 150°, or any intermediate value between any two adjacent values ​​mentioned above, which can further coordinate the time for the transmission arm 110 to transmit the wafer 9 and the time for the input chamber 210 and the output chamber 220 to establish a vacuum environment, and based on the two factors of transmission efficiency and production cost, further optimize the transmission efficiency and stability of the wafer 9.

[0114] like Figure 12 As shown, in some embodiments of the present application, the power component 120 includes a linear component 121 and a rotating component 122. The linear component 121 is arranged on the top wall of the transmission chamber 200, and the rotating component 122 is arranged on the linear component 121 and connected to the transmission arm 110. The linear component 121 is used to drive the rotating component 122 to translate toward or away from the top wall of the transmission chamber 200, and the rotating component 122 is used to drive the transmission arm 110 to rotate back and forth.

[0115] For example, the linear assembly 121 can be any of an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder, capable of providing a linear driving force to drive the rotational assembly 122 in translation. The rotational assembly 122 can be any of an electric motor, a rotary cylinder, or a hydraulic motor, capable of providing a rotational driving force to drive the transfer arm 110 in reciprocating rotation. The linear assembly 121 and the rotational assembly can be powered by the same energy source (e.g., electricity, pneumatic energy, or hydraulic energy) or different energy sources.

[0116] In the technical solution of the above embodiment, the power component 120 includes a linear component 121 and a rotating component 122. The rotating component 122 can drive the transfer arm 110 to rotate, thereby realizing the transmission of the wafer 9 between the wafer input chamber 210 and the working chamber 230 and between the working chamber 230 and the wafer output chamber 220; the linear component 121 can increase the axial translational freedom of the transfer arm 110 along the rotation axis O, thereby facilitating the transfer arm 110 to flexibly adjust the height in the transfer chamber 200, thereby facilitating the interaction of the wafer 9.

[0117] like Figure 10 and Figure 11 As shown, in some embodiments of the present application, the transfer chamber 200 also includes a plurality of support columns, and the plurality of support columns include a carrier support column 231 arranged in the working chamber 230, and the carrier support column 231 is fixedly arranged on the carrier table in the working chamber 230, and is used to interact with the wafer 9 with the transfer arm 110; the carrier table is arranged on the bottom wall of the working chamber 230, and is used to translate along the bottom wall of the working chamber 230 to move the wafer 9.

[0118] The stage is the component that supports the wafer 9 within the working chamber 230. After the transfer arm 110 receives the wafer 9, the stage can move the wafer 9 in a three-dimensional space, facilitating operations on the wafer 9 (for example, facilitating inspection of the wafer 9 by a scanning electron microscope). An X-coordinate and a Y-coordinate that are perpendicular to each other are established in the horizontal plane, and a Z-coordinate that is perpendicular to the X-coordinate and the Y-coordinate is established in the vertical plane. The stage can move the wafer 9 along the X-coordinate, Y-coordinate, and Z-coordinate directions.

[0119] Exemplarily, the stage includes a base, a drive mechanism, a carrier plate, and a carrier support column 231. The drive mechanism is mounted on the base, and the carrier plate is mounted on the drive mechanism. The drive mechanism can drive the carrier plate to translate along the X, Y, and Z coordinates. The carrier support column 231 is fixed to the base and is used to exchange wafers 9 with the transfer arm 110.

[0120] As the transfer arm 110 and the stage exchange wafer 9, the power assembly 120 drives the transfer arm 110 downward until the wafer 9 is released from the transfer arm 110 and supported by the carrier support column 231. The stage then moves the wafer 9 to a position where it is free from the projection of the transfer arm 110 along the Z coordinate. The drive mechanism then drives the carrier plate upward until the wafer 9 is released from the carrier support column 231 and supported by the carrier plate, completing the placement of the wafer 9 on the stage.

[0121] When the transfer arm 110 exchanges wafer 9 with the worktable, the drive mechanism of the worktable drives the carrier plate to descend, so that the wafer 9 is lifted up by the carrier support column 231, and then the wafer 9 is sent to the top of the transfer arm 110. The linear component 121 drives the transfer arm to rise until the wafer 9 is separated from the carrier support column 231 and supported by the transfer arm 110, thus completing the removal of the wafer 9 from the worktable.

[0122] In the technical solution of the above embodiment, the carrier support column 231 is fixed to the carrier stage and has no vertical freedom. When the carrier stage and the transfer arm 110 exchange wafers 9, the linear assembly 121 drives the transfer arm 110 to move horizontally, thereby achieving vertical transfer of the wafers 9 between the carrier stage and the transfer arm 110. This simplifies the carrier stage structure and improves the smoothness of wafer 9 transfer.

[0123] like Figure 10 and Figure 11 As shown, in some embodiments of the present application, the plurality of support columns further include a wafer inlet support column 211 and / or a wafer outlet support column 221. The wafer inlet support column 211 is fixedly disposed on the bottom wall of the wafer inlet chamber 210 and is used to exchange wafers 9 with the transfer arm 110; the wafer outlet support column 221 is fixedly disposed on the bottom wall of the wafer outlet chamber 220 and is used to exchange wafers 9 with the transfer arm 110.

[0124] For example, the number of wafer inlet support columns 211 may be three, which can form three stable support positions when supporting the wafer 9. The number of wafer outlet support columns 221 may be three, which can form three stable support positions when supporting the wafer 9. The number of object support columns 231 may be three, and they are distributed in a circular array, with the angle between adjacent object support columns 231 being 120°.

[0125] The wafer infeed support column 211 and the wafer outfeed support column 221 are both fixed, while the loading support column 231 is fixed to the loading platform but can move with the platform. The bending section 2 positions the support section 3 to one side of the mounting section 1. When the transfer arm 110 rotates, the support section 3 can avoid one loading support column 231 and enter between three loading support columns 231, thereby improving stability during wafer 9 exchange.

[0126] In the technical solution of the above embodiment, the wafer input support column 211 is fixedly arranged on the bottom wall of the wafer input chamber 210, and the wafer output support column 221 is fixedly arranged on the bottom wall of the wafer output chamber 220. Only by relying on the linear displacement of the transmission arm 110, the transmission arm 110 can interact with the wafer input support column 211 and interact with the wafer output support column 221 to move the wafer 9, thereby simplifying the structure of the wafer input chamber 210 and the wafer output chamber 220, reducing costs, and improving the smoothness of the transmission of the wafer 9.

[0127] On the third aspect, an embodiment of the present application provides a semiconductor detection device, which includes the wafer transfer device in any of the above embodiments, and thus has all the advantages of the wafer transfer device in the above embodiments and all the advantages of the transfer arm in the above embodiments, which will not be repeated here one by one.

[0128] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A transfer arm, arranged in a wafer transfer device to transfer wafers, characterized in that: The transmission arm comprises: A mounting section (1) extending along its own length direction, wherein the transmission arm is mounted on the wafer transmission device via the mounting section (1); Two bending sections (2) are respectively connected to the mounting section (1) at the ends in the longitudinal direction of the mounting section (1), and the two bending sections (2) are bent toward the same side of the mounting section (1); Two supporting sections (3) are connected one by one to one end of each bending section (2) away from the mounting section (1), and each supporting section (3) includes a plurality of supporting branches extending in different directions, and the plurality of supporting branches can be distributed on the same supporting surface to support the wafer.

2. The transmission arm according to claim 1, characterized in that Each of the bending sections (2) starts from the end of the mounting section (1), first bends and extends toward one side of the mounting section (1), and then bends and extends in a direction away from the other bending section (2).

3. The transmission arm according to claim 2, characterized in that The direction in which the bending section (2) bends and extends toward one side of the mounting section (1) forms an obtuse angle with the length direction of the mounting section (1); the direction in which the bending section (2) extends away from the other bending section (2) forms an acute angle with the direction in which the bending section (2) bends and extends toward one side of the mounting section (1); Preferably, the angle between the direction in which the bending section (2) bends and extends toward one side of the mounting section (1) and the length direction of the mounting section (1) is in the range of 100° to 140°; Preferably, the angle between the direction in which the bending section (2) extends away from the other bending section (2) and the direction in which the bending section (2) bends and extends toward one side of the mounting section (1) is in the range of 65° to 85°.

4. The transmission arm according to claim 1, characterized in that The plurality of supporting branches include a main supporting branch (31), a secondary supporting branch (32) and an auxiliary supporting branch (33); the main supporting branch (31) is connected to the bending section (2) and extends away from the bending section (2); the secondary supporting branch (32) is connected to the main supporting branch (31) and extends toward the installation section (1); the auxiliary supporting branch (33) is connected to the main supporting branch (31) and extends away from the main supporting branch (31).

5. The transmission arm according to claim 4, characterized in that The main supporting branch (31) is in an arc shape, and the arc center and the secondary supporting branch (32) are respectively located on both sides of the main supporting branch (31).

6. The transmission arm according to claim 5, characterized in that The free end of the secondary supporting branch (32) is spaced apart from the bending section (2), and the secondary supporting branch (32) extends radially along the main supporting branch (31); Preferably, the included angle between the extension direction of the secondary support (32) and the bending extension direction of the bending section (2) toward the installation section (1) is in the range of 20° to 40°.

7. The transmission arm according to claim 1, characterized in that The invention also includes a main friction member (4), a secondary friction member (5) and an auxiliary friction member (6) respectively arranged at different ends of the supporting branches, wherein the main friction member (4), the secondary friction member (5) and the auxiliary friction member (6) are used to support the wafer (9) in a coordinated manner, and the projection of the center of gravity of the wafer (9) is located within a triangle enclosed by the connecting lines of the main friction member (4), the secondary friction member (5) and the auxiliary friction member (6).

8. The transmission arm according to claim 7, characterized in that It also includes a reinforcing friction part (7) and an expanding friction part (8) arranged on the bending section (2); in the length direction of the mounting section (1), the reinforcing friction part (7) is located on the outside of the triangle, and the distance between the expanding friction part (8) and the mounting section (1) is smaller than the distance between the reinforcing friction part (7) and the mounting section (1); the main friction part (4), the secondary friction part (5), the auxiliary friction part (6), and the reinforcing friction part (7) are used to collaboratively support a first-specification wafer (91); the main friction part (4), the secondary friction part (5), the auxiliary friction part (6), the reinforcing friction part (7), and the expanding friction part (8) are used to collaboratively support a second-specification wafer (92); the outer diameter of the second-specification wafer (92) is larger than the outer diameter of the first-specification wafer (91).

9. A wafer transfer device, characterized in that: include: The transfer chamber (200) comprises a wafer inlet chamber (210), a wafer outlet chamber (220) and a working chamber (230), wherein the wafer inlet chamber (210) is used to receive the wafer (9), the wafer outlet chamber (220) is used to transfer the wafer (9), and the working chamber (230) is used to provide a wafer operation space; A transmission mechanism (100) is provided in the transmission chamber (200), the transmission mechanism (100) comprising a power assembly (120) and a transmission arm (110), the power assembly (120) being provided in the transmission chamber (200) for providing power to the transmission arm (110), the transmission arm (110) reciprocatingly rotating at a rotation angle less than 180° based on the power of the power assembly (120) to transmit the wafer (9) between the working chamber (230) and the wafer inlet chamber (210) and the wafer outlet chamber (220); Wherein, the transmission arm (110) is the transmission arm according to any one of claims 1 to 8.

10. A semiconductor testing device, characterized in that: Comprising the wafer transfer device as claimed in claim 9.

Images