Flash etching device for fine circuit processing of PCB (Printed Circuit Board)

Abstract

The invention discloses a flash etching device for fine circuit processing of a PCB (Printed Circuit Board), and relates to the technical field of PCB processing, the flash etching device comprises a workbench, the top of the workbench is fixedly connected with a mounting frame and a fixing frame, the mounting frame is arranged on the outer side of the fixing frame, the fixing frame is rotatably connected with conveying rollers at equal intervals, and the flash etching device further comprises a center adjusting mechanism and a dynamic spraying mechanism, through the arrangement of the center adjusting mechanism, in the process of moving and transporting the PCBs from the left side of the fixing frame to the interior of the mounting frame, axial reciprocating motion of the moving ring frame can be achieved through the design of a fixing sleeve, the moving ring frame and a push plate, and then the push plate is driven to dynamically adjust the transportation center of the PCBs placed on the transportation rollers; therefore, the transportation center of the PCB is corrected in real time, it is ensured that the transportation center is always centered, the uniformity and consistency of follow-up spraying are improved, the problem that follow-up spraying is not uniform due to deviation of the transportation center is solved, the spraying efficiency and the product quality are improved, and the defective rate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a flash etching device for processing fine circuits of a PCB board. Background Art

[0002] The flash etching process for circuit boards uses photosensitive etchant and UV exposure technology to cure the photosensitive etchant under UV light to form a light-shielding pattern. The copper layer in the unetched area is then removed by chemical etching. In the existing flash etching process for fine circuit processing on PCB boards, the spraying process is one of the key links, used to clean or treat the PCB board surface to ensure the accuracy and consistency of the subsequent etching process.

[0003] During the actual production process, PCB boards are often transported by transport rollers to the bottom of the spray head for the spraying process. However, due to factors such as equipment wear, installation errors or slight vibrations during transportation, the transportation center of the PCB board easily deviates from the center position of the transport roller. In the existing technology, there is a lack of dynamic adjustment function for the transportation center of the PCB board. This deviation will cause the flash etching liquid to be unable to evenly cover the entire surface of the PCB board during the subsequent spraying process, resulting in local insufficient spraying or excessive spraying, which seriously affects product quality and leads to inconsistent etching effects on the surface of the PCB board. Some areas will not be completely etched due to insufficient spraying, while other areas will be over-etched due to excessive spraying. This not only affects the precision and reliability of the circuit, but also causes circuit failure.

[0004] In view of this, the present invention proposes a flash etching device for fine circuit processing of PCB boards to remedy and improve the shortcomings of the prior art. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a flash etching device for fine circuit processing of PCB boards to solve the corresponding technical problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solutions: a flash etching device for fine circuit processing of PCB boards, comprising a workbench, a mounting frame and a fixing frame fixedly connected to the top of the workbench, wherein the mounting frame is arranged outside the fixing frame, and transport rollers are equidistantly connected to the fixing frame for rotation. The device also comprises: a center adjustment mechanism and a dynamic spray mechanism, wherein the center adjustment mechanism is arranged on the left side of the mounting frame, and the dynamic spray mechanism is arranged inside the mounting frame;

[0007] The center adjustment mechanism includes a fixed sleeve, a movable ring frame and a push plate. The fixed sleeve is symmetrically arranged on the left side of the mounting frame, the movable ring frame is coaxially arranged outside the fixed sleeve, and the push plate is symmetrically arranged above the transport roller.

[0008] The dynamic spray mechanism includes a gear rod, a gear, a diverter pipe and a spray head. The gear rod is equidistantly penetrated and slidably connected to the top of the mounting frame. The gear is meshed and arranged on the right side of the gear rod. The diverter pipe is equidistantly arranged above the fixing frame. The spray head is equidistantly fixed and connected to the outer surface of the diverter pipe.

[0009] Preferably, the center adjustment mechanism also includes a side plate symmetrically fixedly connected to the left side of the mounting frame, and a rotating shaft is rotatably connected between the side plates. A drive motor is fixedly connected to one of the side plates, and the output end of the drive motor is fixedly connected to the rotating shaft. The fixed sleeve is symmetrically fixedly connected to the outer surface of the rotating shaft coaxially.

[0010] Preferably, a continuous V-groove is provided on the outer surface of the fixed sleeve, an extension plate is symmetrically fixedly connected to the outer surface of the movable ring frame, a sliding ball is fixedly connected to the inner wall of one end of the extension plate facing the fixed sleeve, and the sliding ball is slidably connected to the continuous V-groove.

[0011] Preferably, the push plate is fixedly connected to the outer surface of the movable ring frame, and the push plate is arranged vertically downward, and the push plate is used to push the PCB board.

[0012] Preferably, the facing surfaces of the side plates are symmetrically fixedly connected with bending plates with the rotating shaft as the axis, the facing surfaces of the bending plates are provided with a first slide groove, the outer surface of the movable ring frame is symmetrically fixedly connected with a first slider, and the first slider is slidably connected in the first slide groove, and a first return spring is fixedly connected between the first slider and the first slide groove.

[0013] Preferably, the dynamic spray mechanism also includes a linkage shaft symmetrically connected to the lower end of the inner wall on the rear side of the mounting frame, and a transmission member is connected to the linkage shaft, the outer surface of the linkage shaft is fixedly connected to a first rotating plate, the end of the first rotating plate away from the linkage shaft is rotationally connected to the second rotating plate, and the end of the second rotating plate away from the first rotating plate is rotationally connected to the bottom block.

[0014] Preferably, a connecting plate is fixedly connected between the tops of the bottom blocks, the top of the connecting plate is fixedly connected to the bottom of the gear rod, the upper end of the rear inner wall of the mounting frame is equidistantly connected to a driven shaft for rotation, and the gear is coaxially fixedly connected to the outer surface of the driven shaft.

[0015] Preferably, a second sliding groove is equidistantly provided on the upper end of the inner wall on the rear side of the mounting frame, a second slider is equidistantly fixedly connected to the rear side of the connecting plate, and the second slider is slidably connected in the second sliding groove, and a second return spring is fixedly connected between the second slider and the second sliding groove.

[0016] Preferably, a central tube is fixedly connected to the upper end of the front inner wall of the mounting frame, and a liquid guide tube is fixedly connected to the right side of the central tube, and the liquid guide tube is used to introduce flash liquid into the interior of the central tube.

[0017] Preferably, the outer surface of the central tube is fixedly connected to a sealing joint, the rear end of the diverter tube is fixedly connected to the driven shaft, and the front end of the diverter tube is rotatably connected to the sealing joint.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) Through the setting of the center adjustment mechanism, in the process of the PCB board moving from the left side of the fixed frame to the installation frame, the design of the fixed sleeve, the movable ring frame and the push plate can realize the axial reciprocating movement of the movable ring frame, thereby driving the push plate to dynamically adjust the transportation center of the PCB board placed on the transport roller, so as to correct the transportation center of the PCB board in real time, ensure that it is always centered, improve the uniformity and consistency of subsequent spraying, reduce the problem of subsequent uneven spraying caused by deviation of the transportation center, thereby improving the spraying efficiency and product quality, and reducing the defective rate. In addition, through dynamic adjustment, the device can also adapt to PCB boards of different sizes and shapes without frequent shutdowns to adjust the equipment, thereby improving production efficiency.

[0020] (2) By setting up the center adjustment mechanism and utilizing the sliding fit design of the continuous V-groove and the sliding ball, the rotational motion of the rotating shaft can be converted into the axial reciprocating motion of the mobile ring frame, so that the sliding ball can move along a predetermined path when sliding in the continuous V-groove, thereby ensuring that the motion trajectory of the mobile ring frame is accurate and stable. No complex mechanical transmission device is required, which simplifies the equipment structure. The shape and size of the continuous V-groove can accurately control the motion path of the sliding ball, reduce the deviation during the motion process, improve the operation accuracy of the equipment, ensure that the transportation center of the PCB board can be accurately adjusted, and reduce the problem of transportation center deviation caused by mechanical error;

[0021] Among them, the first slider and the first sliding groove are provided between the movable ring frame and the side plate, and are equipped with a first return spring, which can not only guide the axial movement of the movable ring frame, but also buffer the impact force of the movable ring frame during the movement through the elastic action of the first return spring, thereby ensuring that the movement of the movable ring frame is smooth and repeatable.

[0022] (3) Through the setting of the dynamic spray mechanism, in the process of using the two push plates in the center adjustment mechanism to adjust the center of the PCB board transported by the left end of the fixed frame, the design of the linkage shaft, the driven shaft, the gear rod and the gear can synchronously drive the diversion pipe to cooperate with the spray head to swing back and forth above the PCB board with the driven shaft as the axis, thereby increasing the coverage range of the spray head, enabling the spray head to spray the PCB board more evenly, reducing defects caused by uneven spraying, and the design of the dynamic spray mechanism can also reduce the direct contact between the spray head and the PCB board, reduce the mechanical wear caused by the flash liquid injection force, reduce the deposition of the flash liquid inside the spray head, extend the service life of the spray head, reduce the maintenance frequency and cost of the equipment, and reduce the downtime caused by equipment failure;

[0023] Among them, the design of the linkage shaft, the first rotating plate, the second rotating plate and the driven shaft can ensure that the swing trajectory of the sprinkler head is accurate and stable, reduce the motion deviation caused by mechanical errors, and the design of the first rotating plate and the second rotating plate can disperse mechanical stress, reduce the wear of individual components, effectively buffer the impact force during movement, and extend the service life of mechanical components. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the connection portion of the mounting frame shown in the present invention;

[0026] Figure 3 The present invention shows Figure 2 A in the middle is an enlarged structural diagram;

[0027] Figure 4 This is a schematic diagram of the structure of the rotating shaft connection shown in the present invention;

[0028] Figure 5 This is a schematic diagram of the disassembled structure of the fixed sleeve and the movable ring frame shown in the present invention;

[0029] Figure 6 The present invention shows Figure 5 The enlarged structural diagram at B in the middle;

[0030] Figure 7 This is a schematic diagram of the gear rod connection structure shown in the present invention.

[0031] The numbers in the figure are:

[0032] 1. Workbench; 2. Mounting frame; 3. Fixed frame; 4. Transport roller;

[0033] 5. Center adjustment mechanism; 501. Side plate; 502. Drive motor; 503. Rotating shaft; 504. Fixed sleeve; 505. Continuous V-groove; 506. Movable ring frame; 507. Extension plate; 508. Sliding ball; 509. First slider; 510. First return spring; 511. Push plate; 512. Bending plate; 513. First slide groove;

[0034] 6. Dynamic spray mechanism; 601. Transmission member; 602. Linkage shaft; 603. First rotating plate; 604. Second rotating plate; 605. Bottom block; 606. Connecting plate; 607. Second slider; 608. Second return spring; 609. Gear rod; 610. Driven shaft; 611. Gear; 612. Diverter pipe; 613. Sprinkler head; 614. Center pipe; 615. Sealing joint; 616. Second chute; 617. Liquid guide tube. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] Embodiment 1 of the present invention:

[0037] Please refer to Figures 1 to 7 As shown, a flash etching device for fine circuit processing of PCB boards includes a workbench 1, a mounting frame 2 and a fixing frame 3 are fixedly connected to the top of the workbench 1, and the mounting frame 2 is arranged outside the fixing frame 3. Transport rollers 4 are equidistantly connected to the fixing frame 3 for rotation. The workbench 1 also includes: a center adjustment mechanism 5 and a dynamic spray mechanism 6, and the center adjustment mechanism 5 is arranged on the left side of the mounting frame 2, and the dynamic spray mechanism 6 is arranged inside the mounting frame 2;

[0038] The center adjustment mechanism 5 includes a fixed sleeve 504, a movable ring frame 506, and a push plate 511. The fixed sleeve 504 is symmetrically arranged on the left side of the mounting frame 2, the movable ring frame 506 is coaxially arranged outside the fixed sleeve 504, and the push plate 511 is symmetrically arranged above the transport roller 4.

[0039] The dynamic spray mechanism 6 includes a gear rod 609, a gear 611, a diverter pipe 612, and a spray head 613. The gear rod 609 is equidistantly connected to the top of the mounting frame 2 through a sliding connection. The gear 611 is meshed and disposed on the right side of the gear rod 609. The diverter pipe 612 is equidistantly disposed above the fixing frame 3. The spray head 613 is equidistantly fixed and connected to the outer surface of the diverter pipe 612.

[0040] The center adjustment mechanism 5 also includes side plates 501 symmetrically fixedly connected to the left side of the mounting frame 2. A rotating shaft 503 is rotatably connected between the side plates 501. A drive motor 502 is fixedly connected to one of the side plates 501. The output end of the drive motor 502 is fixedly connected to the rotating shaft 503. A fixed sleeve 504 is fixedly connected to the outer surface of the rotating shaft 503 symmetrically coaxially.

[0041] A continuous V-groove 505 is formed on the outer surface of the fixed sleeve 504. An extension plate 507 is symmetrically fixedly connected to the outer surface of the movable ring frame 506. A sliding ball 508 is fixedly connected to the inner wall of the extension plate 507 at one end facing the fixed sleeve 504. The sliding ball 508 is slidably connected to the continuous V-groove 505.

[0042] The push plate 511 is fixedly connected to the outer surface of the movable ring frame 506 and is arranged vertically downward. The push plate 511 is used to push the PCB board;

[0043] The facing surfaces of the side plates 501 are symmetrically fixedly connected with the bending plates 512 with the rotating shaft 503 as the axis. The facing surfaces of the bending plates 512 are provided with first sliding grooves 513. The outer surface of the movable ring frame 506 is symmetrically fixedly connected with the first slider 509, and the first slider 509 is slidably connected in the first sliding groove 513. A first return spring 510 is fixedly connected between the first slider 509 and the first sliding groove 513.

[0044] The effects achieved by this embodiment are as follows: compared with the prior art, through the setting of the center adjustment mechanism 5, in the process of the PCB board being moved and transported from the left side of the fixed frame 3 to the mounting frame 2, the design of the fixed sleeve 504, the movable ring frame 506 and the push plate 511 can realize the axial reciprocating movement of the movable ring frame 506, thereby driving the push plate 511 to dynamically adjust the transportation center of the PCB board placed on the transport roller 4, so as to correct the transportation center of the PCB board in real time to ensure that it is always centered, improve the uniformity and consistency of subsequent spraying, reduce the problem of subsequent uneven spraying caused by deviation of the transportation center, thereby improving the spraying efficiency and product quality, and reducing the defective rate. In addition, through dynamic adjustment, the device can also adapt to PCB boards of different sizes and shapes without the need for frequent shutdowns to adjust the equipment, thereby improving production efficiency.

[0045] The sliding fit design of the continuous V-groove 505 and the sliding ball 508 can convert the rotational motion of the rotating shaft 503 into axial reciprocating motion of the mobile ring frame 506, so that the sliding ball 508 can move along a predetermined path when sliding in the continuous V-groove 505, thereby ensuring that the motion trajectory of the mobile ring frame 506 is accurate and stable. This eliminates the need for a complex mechanical transmission device and simplifies the device structure. The shape and size of the continuous V-groove 505 can precisely control the motion path of the sliding ball 508, reducing deviations during the motion process and improving the operating accuracy of the device. This ensures that the transport center of the PCB board can be accurately adjusted and reduces the problem of transport center deviation caused by mechanical errors.

[0046] Among them, the first slider 509 and the first sliding groove 513 provided between the movable ring frame 506 and the side plate 501, and equipped with a first return spring 510, can not only guide the axial movement of the movable ring frame 506, but also buffer the impact force of the movable ring frame 506 during the movement through the elastic action of the first return spring 510, thereby ensuring that the movement of the movable ring frame 506 is smooth and repeatable.

[0047] Embodiment 2 of the present invention:

[0048] Please refer to Figures 1 to 7 As shown, the dynamic spray mechanism 6 also includes a linkage shaft 602 symmetrically connected to the lower end of the inner wall of the rear side of the mounting frame 2, and a transmission member 601 is transmission-connected between the linkage shaft 602 and the rotating shaft 503. A first rotating plate 603 is fixedly connected to the outer surface of the linkage shaft 602. The end of the first rotating plate 603 away from the linkage shaft 602 is rotationally connected to the second rotating plate 604. The end of the second rotating plate 604 away from the first rotating plate 603 is rotationally connected to the bottom block 605.

[0049] A connecting plate 606 is fixedly connected between the tops of the bottom blocks 605. The top of the connecting plate 606 is fixedly connected to the bottom of the gear rod 609. A driven shaft 610 is equidistantly connected to the upper end of the rear inner wall of the mounting frame 2. A gear 611 is coaxially fixed to the outer surface of the driven shaft 610.

[0050] Second sliding grooves 616 are equidistantly formed on the upper end of the inner wall of the rear side of the mounting frame 2. Second sliders 607 are equidistantly fixedly connected to the rear side of the connecting plate 606. The second sliders 607 are slidably connected to the second sliding grooves 616. A second return spring 608 is fixedly connected between the second sliders 607 and the second sliding grooves 616.

[0051] A central tube 614 is fixedly connected to the upper end of the inner wall of the front side of the mounting frame 2. A liquid guide tube 617 is fixedly connected to the right side of the central tube 614. The liquid guide tube 617 is used to introduce flash etching liquid into the interior of the central tube 617.

[0052] The outer surface of the central tube 614 is fixedly connected to a sealing joint 615 . The rear end of the diverter tube 612 is fixedly connected to the driven shaft 610 , and the front end of the diverter tube 612 is rotatably connected to the sealing joint 615 .

[0053] The effects achieved by this embodiment are as follows: compared with the prior art, through the setting of the dynamic spray mechanism 6, in the process of using the two push plates 511 in the center adjustment mechanism 5 to center the PCB board transported by the left end of the fixing frame 3, the design of the linkage shaft 602, the driven shaft 610, the gear rod 609 and the gear 611 can synchronously drive the shunt pipe 612 to cooperate with the spray head 613 to reciprocate above the PCB board with the driven shaft 610 as the axis, thereby increasing the coverage range of the spray head 613, enabling the spray head 613 to spray the PCB board more evenly, reducing defects caused by uneven spraying, and the design of the dynamic spray mechanism 6 can also reduce direct contact between the spray head 613 and the PCB board, reduce mechanical wear caused by the spray force of the flash liquid, reduce the deposition of the flash liquid inside the spray head 613, extend the service life of the spray head 613, reduce the maintenance frequency and cost of the equipment, and reduce the downtime caused by equipment failure;

[0054] Among them, the design of the linkage shaft 602, the first rotating plate 603, the second rotating plate 604 and the driven shaft 610 can ensure that the swing trajectory of the sprinkler head 613 is accurate and stable, and the movement deviation caused by mechanical errors is reduced. In addition, the design of the first rotating plate 603 and the second rotating plate 604 can disperse mechanical stress, reduce the wear of individual components, effectively buffer the impact force during movement, and extend the service life of mechanical components.

[0055] The complete usage steps and working principle of the above embodiment are as follows:

[0056] It should be noted in advance that if Figure 1 As shown, when the equipment is running, the PCB board is transported from the left side of the fixing frame 3 through the transport roller 4, first transported to the installation frame 2, sprayed through the internal spray structure of the installation frame 2, and then output from the right side of the fixing frame 3. It should also be noted that the above are all existing technologies and will not be elaborated on here.

[0057] The following is the working process of the center adjustment mechanism 5 to adjust and control the transportation center of the PCB board above the transportation roller 4:

[0058] During the transportation of the PCB board from the left side of the fixing frame 3 to the inside of the mounting frame 2, as shown in FIG. Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 as well as Figure 6As shown, since the side plates 501 are symmetrically fixed on the left side of the mounting frame 2, and a rotating shaft 503 is rotatably arranged between the side plates 501, a driving motor 502 is fixedly arranged on one of the side plates 501, and the output end of the driving motor 502 is fixedly connected to the rotating shaft 503, the driving motor 502 can be synchronously turned on during the operation of the equipment, and the rotating shaft 503 is driven to rotate between the two side plates 501 by the driving motor 502. Moreover, because the outer surface of the rotating shaft 503 is symmetrically fixed with a fixed sleeve 504 coaxially, and the outer surface of the fixed sleeve 504 is provided with a continuous V-groove 505, when the rotating shaft 503 rotates, the two fixed sleeves 504 installed on its outer surface synchronously follow and rotate with the rotating shaft 503 as the axis. Figure 5 The outer surface of the fixed sleeve 504 is movably provided with a movable ring frame 506, and the outer surface of the movable ring frame 506 is symmetrically fixed with an extension plate 507. The inner surface of the extension plate 507 facing the fixed sleeve 504 is fixed with a sliding ball 508 that is compatible with the continuous V-groove 505, and the sliding ball 508 is slidably set in the continuous V-groove 505. Therefore, when the rotating shaft 503 rotates to drive the fixed sleeve 504 to rotate synchronously, the continuous V-groove 505 is constantly changed, and the design of the sliding ball 508 can make the sliding ball 508 follow the opening path of the continuous V-groove 505, driving the movable ring frame 506 to move axially back and forth synchronously with the outer surface of the fixed sleeve 504. In addition, because the push plate 511 is fixedly provided on the outer surface of the movable ring frame 506, and the push plate 511 is vertically downward, the sliding ball 508 is driven by the continuous V-groove 505, and the two push plates 511 can be synchronously driven under the connection action of the movable ring frame 506. The axial reciprocating movement (i.e., moving toward or away from each other) is performed above the transport roller 4, thereby adjusting the transport center of the PCB board transported on the transport roller 4, so that the PCB board can be centered on the transport roller 4, so that the dynamic spraying mechanism 6 can spray the PCB board in the subsequent step. In the above process, the design of the center adjustment mechanism 5 can realize the axial reciprocating movement of the mobile ring frame 506, thereby driving the push plate 511 to dynamically adjust the transport center of the PCB board placed on the transport roller 4, so as to correct the transport center of the PCB board in real time to ensure that it is always centered, improve the uniformity and consistency of subsequent spraying, reduce the problem of uneven subsequent spraying caused by deviation of the transport center, thereby improving spraying efficiency and product quality, and reducing the defective rate. In addition, through dynamic adjustment, the device can also adapt to PCB boards of different sizes and shapes, without the need for frequent shutdowns to adjust the equipment, thereby improving production efficiency;

[0059] The sliding fit design of the continuous V-groove 505 and the sliding ball 508 can convert the rotational motion of the rotating shaft 503 into axial reciprocating motion of the mobile ring frame 506, so that the sliding ball 508 can move along a predetermined path when sliding in the continuous V-groove 505, thereby ensuring that the motion trajectory of the mobile ring frame 506 is accurate and stable. This eliminates the need for a complex mechanical transmission device and simplifies the device structure. The shape and size of the continuous V-groove 505 can precisely control the motion path of the sliding ball 508, reducing deviations during the motion process and improving the operating accuracy of the device. This ensures that the transport center of the PCB board can be accurately adjusted and reduces the problem of transport center deviation caused by mechanical errors.

[0060] like Figure 4 、 Figure 5 as well as Figure 6 As shown, bending plates 512 are symmetrically fixedly provided on the facing surfaces of the side plates 501, and first sliding grooves 513 are provided on the opposite surfaces of the two bending plates 512 on the same side. First sliders 509 adapted to the first sliding grooves 513 are symmetrically fixedly provided on the outer surface of the movable ring frame 506, and the first sliders 509 are slidably set in the first sliding grooves 513. A first return spring 510 is fixedly provided between the first slider 509 and the groove wall of the first sliding groove 513. Therefore, when the fixed sleeve 504 rotates to drive the movable ring frame 506 to reciprocate axially, the first slider 509 will slide synchronously in the first sliding groove 513, compressing or releasing the first return spring 510, thereby cooperating with the axial movement of the movable ring frame 506, avoiding the axial movement direction of the movable ring frame 506 from being offset, thereby improving the stability of the movable ring frame 506 and the push plate 511 in pushing the PCB board.

[0061] Please refer to the above working process Figures 1 to 7 .

[0062] The following is the working process of the dynamic spray mechanism 6, which simultaneously swings and sprays the PCB board below while regulating the PCB board transportation center:

[0063] After the two push plates 511 in the center adjustment mechanism 5 are used to center the PCB board transported by the left end of the fixing frame 3, the PCB board will be transported by the transport roller 4 and gradually moved into the mounting frame 2 for the spraying step, such as Figure 2 、 Figure 3 as well as Figure 7As shown, since a linkage shaft 602 is symmetrically provided at the lower end of the inner wall on the rear side of the mounting frame 2 for rotation, and a transmission member 601 is connected to the outer surface of the linkage shaft 602 and the outer surface of the rotating shaft 503 for transmission (it should be noted that the transmission member 601 is composed of a plurality of transmission wheels and a transmission belt connected between the plurality of transmission wheels, and the number of transmission wheels is consistent with the overall number of the rotating shaft 503 and the linkage shaft 602, that is, the outer surfaces of the rotating shaft 503 and the linkage shaft 602 are fixedly provided with transmission wheels, and the transmission belt is connected between the outer surfaces of these transmission wheels), when the rotating shaft 503 rotates to drive the two push plates 511 to move toward each other to push the PCB board in the center, the two symmetrical linkage shafts 602 can be driven to rotate synchronously on the inner wall at the lower end of the rear side of the mounting frame 2 through the transmission action of the transmission member 601. Figure 3 and Figure 7 As shown, a first rotating plate 603 is rotatably provided on the outer surface of the linkage shaft 602, and a second rotating plate 604 is rotatably provided on the end of the first rotating plate 603 away from the linkage shaft 602, and a bottom block 605 is rotatably provided on the end of the second rotating plate 604 away from the first rotating plate 603. Therefore, when the linkage shaft 602 rotates on the inner wall of the mounting frame 2, it can synchronously drive the first rotating plate 603 to rotate with the linkage shaft 602 as the axis. The rotation of the first rotating plate 603 can continue to drive the second rotating plate 604 to move. Since the bottom block 605 is fixedly mounted on the bottom of the connecting plate 606, and the connecting plate 606 is slidably provided on the inner wall of the upper end of the rear side of the mounting frame 2, the axial movable direction of the connecting plate 606 is limited. When the first rotating plate 603 rotates, the linkage design of the second rotating plate 604 can make the bottom block 605 cooperate with the connecting plate 606 to move vertically, thereby realizing the up and down reciprocating displacement of the connecting plate 606.

[0064] Among them, the inner wall of the upper end of the rear side of the mounting frame 2 is symmetrically provided with a second sliding groove 616, and the rear side of the connecting plate 606 is symmetrically fixed with a second slider 607, and a second return spring 608 is fixedly provided between the second slider 607 and the groove wall of the second sliding groove 616. While the second rotating plate 604 pushes the connecting plate 606 to move up and down reciprocatingly, it limits the axial movement path of the connecting plate 606, making the movement process of the connecting plate 606 more stable, and at the same time, providing a reliable foundation for subsequent dynamic spraying;

[0065] refer to Figure 2 、 Figure 3 as well as Figure 7As shown, a central tube 614 is fixedly provided on the inner wall of the upper end of the front side of the mounting frame 2, and a liquid guide tube 617 is fixedly provided on the central tube 614. A flash liquid tank is provided in the workbench 1. The end of the liquid guide tube 617 away from the central tube 614 is fixedly connected to the flash liquid tank, and the flash liquid tank corresponds to the position of the mounting frame 2. The sprayed flash liquid eventually flows into the flash liquid tank under the influence of gravity, and the flash liquid is repeatedly extracted and utilized through the liquid guide tube 617 (it should be noted that a corresponding filtering structure is provided between the liquid guide tube 617 and the flash liquid tank to prevent impurities from entering the interior of the central tube 614 and causing blockage of the spray head 613. The design between the liquid guide tube 617 and the flash liquid tank is the existing technology and will not be elaborated on here).

[0066] A driven shaft 610 is equidistantly provided on the inner wall of the upper end of the rear side of the mounting frame 2, and a gear rod 609 is equidistantly fixed on the top of the connecting plate 606, and the gear rod 609 is slidably connected to the top of the mounting frame 2. When the second rotating plate 604 moves to drive the connecting plate 606 to move vertically back and forth, the gear rod 609 installed thereon can move synchronously and slide through the top of the mounting frame 2. Because the gear rod 609 and the gear 611 on its right side are in meshing contact with each other, and the gear 611 is coaxially fixed on the outer surface of the driven shaft 610, when the connecting plate 606 moves upward, the gear rod 609 is connected to the top of the mounting frame 2 through the teeth. The meshing can drive the gear 611 to rotate back and forth, and because the outer surface of the central tube 614 is fixedly connected with a sealing joint 615, and the number and position of the sealing joint 615 correspond to the driven shaft 610, the inner surface of the sealing joint 615 is sealed and rotated with a shunt pipe 612, and the end of the shunt pipe 612 away from the sealing joint 615 is fixedly connected to the driven shaft 610. Therefore, in the process of the gear rod 609 driving the gear 611 to rotate back and forth and driving the driven shaft 610 to move synchronously, the driven shaft 610 can rotate synchronously with the shunt pipe 612 through the fixed design of the driven shaft 610 and the shunt pipe 612. When the shunt pipe 612 is driven to rotate and swing back and forth at the upper end of the mounting frame 2, the spray head 613 connected to the shunt pipe 612 is synchronously followed to swing back and forth, thereby increasing the spray range of the PCB board and improving the spray efficiency. In the above process, by setting the dynamic spray mechanism 6, in the process of using the two push plates 511 in the center adjustment mechanism 5 to center the PCB board transported by the left end of the fixing frame 3, the design of the linkage shaft 602, the driven shaft 610, the gear rod 609 and the gear 611 can be used to synchronously drive the shunt pipe 612 to cooperate with the spray head 6 The dynamic spray mechanism 613 reciprocates above the PCB board with the driven shaft 610 as the axis, thereby increasing the coverage range of the spray head 613, enabling the spray head 613 to spray the PCB board more evenly, reducing defects caused by uneven spraying. In addition, the design of the dynamic spray mechanism 6 can also reduce direct contact between the spray head 613 and the PCB board, reduce mechanical wear caused by the spray force of the flash liquid, reduce the deposition of the flash liquid inside the spray head 613, extend the service life of the spray head 613, reduce the maintenance frequency and cost of the equipment, and reduce the downtime caused by equipment failure.

[0067] Please refer to the above working process Figures 1 to 7 .

[0068] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0069] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A flash etching device for fine circuit processing of PCB boards, comprising a workbench (1), a mounting frame (2) and a fixing frame (3) fixedly connected to the top of the workbench (1), and the mounting frame (2) is arranged outside the fixing frame (3), and a transport roller (4) is equidistantly connected to the fixing frame (3), characterized in that: It also includes: a central adjustment mechanism (5) and a dynamic spraying mechanism (6); The center adjustment mechanism (5) comprises a fixed sleeve (504), a movable ring frame (506) and a push plate (511), wherein the fixed sleeve (504) is symmetrically arranged on the left side of the mounting frame (2), the movable ring frame (506) is coaxially arranged outside the fixed sleeve (504), and the push plate (511) is symmetrically arranged above the transport roller (4); The dynamic spray mechanism (6) comprises a gear rod (609), a gear (611), a diverter pipe (612) and a spray head (613), wherein the gear rod (609) is equidistantly penetrated and slidably connected to the top of the mounting frame (2), the gear (611) is meshed and arranged on the right side of the gear rod (609), the diverter pipe (612) is equidistantly arranged above the fixing frame (3), and the spray head (613) is equidistantly fixed and connected to the outer surface of the diverter pipe (612).

2. A flash etching device for fine circuit processing of PCB board according to claim 1, characterized in that: The center adjustment mechanism (5) further comprises a side plate (501) symmetrically fixedly connected to the left side of the mounting frame (2); a rotating shaft (503) is rotatably connected between the side plates (501); a driving motor (502) is fixedly connected to one of the side plates (501); an output end of the driving motor (502) is fixedly connected to the rotating shaft (503); and the fixing sleeve (504) is symmetrically fixedly connected to the outer surface of the rotating shaft (503) coaxially.

3. The flash etching device for PCB fine circuit processing according to claim 2, characterized in that: The outer surface of the fixed sleeve (504) is provided with a continuous V-groove (505), the outer surface of the movable ring frame (506) is symmetrically fixedly connected with an extension plate (507), the inner wall of one end of the extension plate (507) facing the fixed sleeve (504) is fixedly connected with a sliding ball (508), and the sliding ball (508) is slidably connected to the continuous V-groove (505).

4. The flash etching device for PCB fine circuit processing according to claim 1, characterized in that: The push plate (511) is fixedly connected to the outer surface of the movable ring frame (506), and the push plate (511) is arranged vertically downward. The push plate (511) is used to push the PCB board.

5. The flash etching device for fine circuit processing of PCB board according to claim 2, characterized in that: The facing surfaces of the side plates (501) are symmetrically fixedly connected with the bending plates (512) with the rotating shaft (503) as the axis, and the facing surfaces of the bending plates (512) are provided with first sliding grooves (513). The outer surface of the movable ring frame (506) is symmetrically fixedly connected with a first slider (509), and the first slider (509) is slidably connected in the first sliding groove (513). A first return spring (510) is fixedly connected between the first slider (509) and the first sliding groove (513).

6. The flash etching device for fine circuit processing of PCB board according to claim 2, characterized in that: The dynamic spray mechanism (6) further comprises a linkage shaft (602) symmetrically connected to the lower end of the inner wall on the rear side of the mounting frame (2), and a transmission member (601) is connected to the rotation shaft (503) in a transmission manner, a first rotating plate (603) is fixedly connected to the outer surface of the linkage shaft (602), an end of the first rotating plate (603) away from the linkage shaft (602) is rotationally connected to a second rotating plate (604), and an end of the second rotating plate (604) away from the first rotating plate (603) is rotationally connected to a bottom block (605).

7. The flash etching device for fine circuit processing of PCB board according to claim 6, characterized in that: A connecting plate (606) is fixedly connected between the tops of the bottom blocks (605), the top of the connecting plate (606) is fixedly connected to the bottom of the gear rod (609), the upper end of the rear inner wall of the mounting frame (2) is equidistantly connected to a driven shaft (610), and the gear (611) is coaxially fixedly connected to the outer surface of the driven shaft (610).

8. The flash etching device for fine circuit processing of PCB board according to claim 7, characterized in that: A second sliding groove (616) is equidistantly provided at the upper end of the inner wall on the rear side of the mounting frame (2), a second slider (607) is equidistantly fixedly connected to the rear side of the connecting plate (606), and the second slider (607) is slidably connected in the second sliding groove (616), and a second return spring (608) is fixedly connected between the second slider (607) and the second sliding groove (616).

9. The flash etching device for fine circuit processing of PCB board according to claim 1, characterized in that: The upper end of the front inner wall of the mounting frame (2) is fixedly connected to a central tube (614), and the right side of the central tube (614) is fixedly connected to a liquid guide tube (617), and the liquid guide tube (617) is used to introduce flash etching liquid into the interior of the central tube (614).

10. The flash etching device for fine circuit processing of PCB board according to claim 9, characterized in that: The outer surface of the central tube (614) is fixedly connected to a sealing joint (615), the rear end of the diverter tube (612) is fixedly connected to the driven shaft (610), and the front end of the diverter tube (612) is rotatably connected to the sealing joint (615).

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