Preparation process of magnetic conductive foam

Abstract

The invention discloses a preparation process of magnetic conductive foam. The preparation process comprises the following steps: 1, die-cutting a first foam body with a first width to form a plurality of positioning grooves with limiting parts on the upper surface of the first foam body; 2, performing die cutting on an even number of second foam bodies with a second width to form a plurality of convex insertion blocks on the lower surfaces of the second foam bodies, and performing die cutting on one sides of the second foam bodies to form 1 / 2 dovetail grooves; thirdly, the even number of second foam bodies are compounded on the first foam body together, a plurality of inverted-T-shaped inserting blocks are correspondingly inserted into a plurality of positioning grooves, and 1 / 2 dovetail grooves in every two adjacent second foam bodies are spliced to form a whole dovetail groove; fourthly, a swallow-tailed magnetic attraction material is implanted into each whole swallow-tailed groove; and 5, coating a layer of hot melt adhesive outside the first foam body and the second foam body, and wrapping a layer of conductive cloth outside the first foam body and the second foam body to form the magnetic conductive foam. The magnetic conductive foam prepared by the preparation process disclosed by the invention has good flexibility and stability.

Description

Technical Field

[0001] The invention relates to the technical field of electronic materials, and specifically discloses a process for preparing magnetic conductive foam. Background Art

[0002] At present, although conventional conductive foam can achieve basic conductive and electromagnetic shielding functions, it cannot simultaneously possess high conductivity, strong magnetic attraction, good flexibility and stability, which limits its application in some complex electromagnetic environments or scenarios with high requirements for material multifunctionality, such as flexible electronics, smart wearable devices, etc.

[0003] In order to solve the deficiencies in the prior art, the present application discloses a process for preparing magnetic conductive foam that can produce high-performance magnetic conductive foam. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the present invention discloses a process for preparing magnetic conductive foam.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: a process for preparing magnetic conductive foam, comprising the following steps:

[0006] In the first step, a first foam body of a first width is die-cut to form a plurality of positioning grooves with limiting portions on its upper surface;

[0007] The second step is to die-cut an even number of second foam bodies of the second width so that a plurality of convex-shaped inserts are formed on the lower surface thereof and a 1 / 2 dovetail groove is die-cut on one side thereof;

[0008] The third step is to laminate an even number of second foam bodies onto the first foam body and insert a plurality of convex-shaped inserts into a plurality of positioning grooves, and to splice the 1 / 2 dovetail grooves on every two adjacent second foam bodies to form a complete dovetail groove;

[0009] The fourth step is to implant a dovetail-shaped magnetic material into each dovetail groove;

[0010] In the fifth step, a layer of hot melt adhesive is coated on the outside of the first foam body and the second foam body and wrapped with a layer of conductive cloth to form magnetic conductive foam.

[0011] Further preferably, the limiting portion includes two protruding blocks integrally provided on two opposite inner side walls of the positioning groove.

[0012] It is further preferred that a first width of the first foam body is greater than a second width of the second foam body.

[0013] It is further preferred that the first foam body and the second foam body are any one of polyurethane foam, polyethylene foam, polypropylene foam, and silicone rubber foam.

[0014] It is further preferred that the overall height of the first foam body and the second foam body after being combined is 0.5-100 mm.

[0015] Further preferably, the dovetail-shaped magnetic material is one of a neodymium iron boron magnet, a samarium cobalt magnet, a ferrite magnet or an alnico magnet.

[0016] Further preferably, the hot melt adhesive is any one of polyester hot melt adhesive or polyamide hot melt adhesive.

[0017] Further preferably, the conductive cloth is any one of stainless steel-plated conductive cloth, copper-nickel-plated conductive cloth, silver-plated conductive cloth or gold-plated conductive cloth.

[0018] Further preferably, the thickness of the conductive cloth is 0.01-0.3 mm.

[0019] Further preferably, the conductive cloth is provided with conductive glue on the outside of a side away from the dovetail-shaped magnetic material.

[0020] The present invention achieves the following beneficial effects:

[0021] The magnetic conductive foam produced by the preparation process provided in this application not only has high conductivity, ensuring the transmission stability of electronic signals; it also has high magnetic attraction, which can play a unique role in complex electromagnetic environments. At the same time, it has good flexibility and stability, ensuring reliability in different shapes and usage environments, and has high use value.

[0022] As for other features and advantages of the present invention, they will be described in the following description, and part of them will become obvious from the description, or they will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0024] Figure 1 It is a schematic diagram of the overall structure disclosed in the present invention;

[0025] Figure 2 This is a schematic diagram of the product structure with conductive adhesive disclosed in the present invention;

[0026] In the figure: 10, first foam body; 11, positioning groove; 111, limiting portion; 1111, protruding block; 20, second foam body; 21, convex plug block; 22, 1 / 2 dovetail groove; 30, dovetail-shaped magnetic material; 40, hot melt adhesive; 50, conductive cloth; 60, conductive adhesive. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] Example

[0030] In order to solve the shortcomings of the conductive foam in the existing technology that cannot be used in some complex electromagnetic environments or scenes with high requirements for material multi-functions, reference Figure 1 As shown, in some embodiments, the present application discloses a process for preparing a magnetic conductive foam, comprising the following steps: first, die-cutting a first foam body 10 of a first width so that a plurality of positioning grooves 11 are formed on the upper surface thereof, each having a limiting portion 111. The limiting portion 111 is preferably designed as two protruding blocks 1111 integrally provided on two opposite inner side walls of the positioning groove 11;

[0031] In the second step, an even number of second foam bodies 20 of the second width are die-cut to form a plurality of convex plugs 21 on their lower surfaces and a 1 / 2 dovetail groove 22 is die-cut on one side thereof; note: the first width set for the first foam body 10 of the present application is greater than the second width set for the second foam body 20.

[0032] In the third step, an even number of second foam bodies 20 are laminated onto the first foam body 10, and a plurality of convex-shaped inserts 21 are correspondingly inserted into a plurality of positioning grooves 11. The 1 / 2 dovetail grooves 22 on each two adjacent second foam bodies 20 are spliced ​​together to form a complete dovetail groove. When the convex-shaped inserts 21 are inserted into the positioning grooves 11, the two protruding blocks 1111 retain the convex-shaped inserts 21 in the positioning grooves 11, thereby securing the first foam body 10 and the second foam body 20.

[0033] refer to Figure 1As shown, in this step, an even number of second foam bodies 20 can be composited at any position on the first foam body 10, and spaces can be customized on both sides or in the middle to avoid electrical components, which can facilitate the installation of the entire magnetic conductive foam;

[0034] In the fourth step, a dovetail-shaped magnetic material 30 is implanted inside each entire dovetail groove. By setting the dovetail-shaped magnetic material 30, it can be stably fixed with the entire dovetail groove formed. And according to this design, it can be obviously known that a plurality of small dovetail-shaped magnetic materials 30 are provided in the magnetic conductive foam body formed by the present application. In this way, not only the cost investment of the magnetic material is reduced, but also, arranging these dovetail-shaped magnetic materials 30 separately can achieve multi-point adsorption, ensuring that the entire magnetic conductive foam and the electronic device have a better adsorption effect.

[0035] In the fifth step, a layer of hot melt adhesive 40 is coated on the outside of the first foam body 10 and the second foam body 20 and wrapped with a layer of conductive cloth 50 to form a magnetic conductive foam. During the actual bonding process, the hot melt adhesive 40 must be heated to a temperature of 150-200°C to better bond the first foam body 10 and the second foam body 20 with the conductive cloth 50, and after the first foam body 10 and the second foam body 20 are bonded with the conductive cloth 50, a cooling treatment must be performed.

[0036] The magnetic conductive foam made by the above preparation process can realize the functions of conducting electricity and absorbing waves of traditional conductive foam. In the specific implementation, the magnetic conductive foam is directly placed close to the side of the dovetail-shaped magnetic material 30 against the electronic component, and the corresponding dovetail-shaped magnetic material 30 can automatically adsorb to the electronic component. The installation is relatively convenient and quick, and it can be used in application scenarios such as high electromagnetic waves and high heat, and has strong stability.

[0037] In one of the preferred embodiments, the first foam body 10 and the second foam body 20 of the present application are any one of polyurethane foam, polyethylene foam, polypropylene foam, and silicone rubber foam. The overall height of the first foam body 10 and the second foam body 20 after compounding is 0.5-100mm. In addition to the above four types of foam, the present application can also use other types of foam bodies, and the specific thickness of the first foam body 10 and the second foam body 20 should be selected according to the use requirements of the electronic product. The present application will not go into details here.

[0038] In one of the preferred embodiments, the dovetail-shaped magnetic material 30 of the present application is one of a neodymium iron boron magnet, a samarium cobalt magnet, a ferrite magnet or an aluminum nickel cobalt magnet. The above-mentioned magnetic materials are all flexible magnetic materials with good flexibility. They can be adjusted and installed according to changes in the spatial environment and shape, and are relatively stable to use. In addition, in addition to the above-mentioned four flexible magnetic materials, the dovetail-shaped magnetic material 30 of the present application can also use other types of flexible magnetic materials, which will not be described in detail here.

[0039] In one preferred embodiment, the hot melt adhesive 40 of the present application is any one of polyester hot melt adhesive 40 or polyamide hot melt adhesive 40. In addition to the above two types of hot melt adhesive 40, the present application can also use other types of hot melt adhesive 40, which will not be described in detail here.

[0040] In one of the preferred embodiments, the conductive cloth 50 of the present application is any one of stainless steel-plated conductive cloth, copper-nickel-plated conductive cloth, silver-plated conductive cloth or gold-plated conductive cloth, and the thickness of the conductive cloth 50 is 0.01-0.3 mm. In addition to the above four types of conductive cloth 50, the present application can also use other types of conductive cloth 50, and the specific thickness of the conductive cloth 50 is selected according to the use requirements of the electronic product, which will not be described in detail here.

[0041] refer to Figure 2 As shown, based on the above embodiment, the conductive cloth 50 of the present application is provided with a conductive glue 60 on the outside of the side away from the dovetail-shaped magnetic material 30. In some usage scenarios, one side of the magnetic conductive foam can be adsorbed to the electronic components through the dovetail-shaped magnetic material 30, and the other side can be adsorbed to the electronic components through the conductive glue 60. It can be flexibly adjusted according to the usage requirements of different scenarios, and the use effect is greatly increased.

[0042] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0043] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made based on the spirit and essence of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A process for preparing magnetic conductive foam, characterized in that: The steps include: In the first step, a first foam body of a first width is die-cut to form a plurality of positioning grooves with limiting portions on its upper surface; The second step is to die-cut an even number of second foam bodies of the second width so that a plurality of convex-shaped inserts are formed on the lower surface thereof and a 1 / 2 dovetail groove is die-cut on one side thereof; The third step is to laminate an even number of second foam bodies onto the first foam body and insert a plurality of convex-shaped inserts into a plurality of positioning grooves, and to splice the 1 / 2 dovetail grooves on every two adjacent second foam bodies to form a complete dovetail groove; The fourth step is to implant a dovetail-shaped magnetic material into each dovetail groove; In the fifth step, a layer of hot melt adhesive is coated on the outside of the first foam body and the second foam body and wrapped with a layer of conductive cloth to form magnetic conductive foam.

2. A process for preparing magnetic conductive foam according to claim 1, characterized in that: The limiting portion includes two protruding blocks integrally arranged on two opposite inner side walls of the positioning groove.

3. The process for preparing a magnetic conductive foam according to claim 1, characterized in that: The first foam body is provided with a first width greater than a second width of the second foam body.

4. The process for preparing a magnetic conductive foam according to claim 1, characterized in that: The first foam body and the second foam body are any one of polyurethane foam, polyethylene foam, polypropylene foam, and silicone rubber foam.

5. The process for preparing magnetic conductive foam according to claim 1, characterized in that: The overall height of the first foam body and the second foam body after being combined is 0.5-100 mm.

6. The process for preparing magnetic conductive foam according to claim 1, characterized in that: The dovetail-shaped magnetic material is one of a neodymium iron boron magnet, a samarium cobalt magnet, a ferrite magnet or an alnico magnet.

7. The process for preparing magnetic conductive foam according to claim 1, characterized in that: The hot melt adhesive is any one of polyester hot melt adhesive and polyamide hot melt adhesive.

8. The process for preparing magnetic conductive foam according to claim 1, characterized in that: The conductive cloth is any one of stainless steel-plated conductive cloth, copper-nickel-plated conductive cloth, silver-plated conductive cloth or gold-plated conductive cloth.

9. A process for preparing magnetic conductive foam according to claim 8, characterized in that: The thickness of the conductive cloth is 0.01-0.3 mm.

10. A process for preparing magnetic conductive foam according to claim 9, characterized in that: The conductive cloth is provided with conductive glue on the outside of a side away from the dovetail-shaped magnetic attraction material.

Images