Electronic component processing equipment

Through integrated and automated electronic component processing equipment, the problems of low label bonding and pin bending precision in traditional processing have been solved, fully automated processing has been achieved, processing efficiency and consistency have been improved, and it is suitable for high-precision, large-scale production.

CN120640668APending Publication Date: 2025-09-12DONGGUAN GUANJIA ELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202510999742.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-21
Publication Date
2025-09-12

AI Technical Summary

Technical Problem

Traditional electronic component processing relies on manual labor or single-function equipment. Label lamination is prone to problems such as position deviation and bubbles. The pin bending accuracy is low and the consistency is poor. The sleeve and heat shrink processes are carried out step by step, which can easily lead to loosening. The overall processing efficiency is low, making it difficult to meet the needs of high-precision and large-scale production.

Method used

An integrated and automated electronic component processing equipment is designed, including a feeding mechanism, a first processing mechanism and a blanking mechanism. Through the coordinated cooperation of multiple processing devices, precise control and automated processing of processes such as label lamination, pin bending, sleeve and heat shrink can be achieved.

Benefits of technology

It realizes fully automated processing from feeding to unloading, improves the firmness of label bonding and the quality of pin shape, reduces manual operation, improves processing efficiency and product consistency, and is suitable for mass production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of electronic component machining, in particular to electronic component machining equipment, and full-automatic machining from feeding to final discharging is achieved through cooperation of all mechanisms and devices. In the label attaching link, the firmness of the label is guaranteed through multi-dimensional pressing and re-pressing; during pin processing, the procedures of step-by-step bending, sleeving, thermal shrinkage and the like are accurate and controllable, and the pin shape and the sleeving fixing quality are improved; due to the automatic design of transferring and discharging links, manual operation is reduced, the overall machining efficiency and the product consistency are improved, meanwhile, the damage risk of components is reduced due to application of the flexible assembly, and the device is suitable for the batch production requirement. The invention aims to provide the electronic component processing equipment with high precision and high efficiency.
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic component processing, and in particular to electronic component processing equipment. Background Art

[0002] Traditional electronic component processing mostly relies on manual labor or single-function equipment. Label lamination is prone to position deviation, bubbles and other problems. Pin bending relies on manual or simple machinery, with low precision and poor consistency. The casing and heat shrink processes are carried out step by step, which can easily cause the casing to loosen during transportation. The overall processing efficiency is low and the labor cost is high, making it difficult to meet the needs of high-precision, large-scale production. An integrated and automated processing equipment is urgently needed to solve the above problems. Summary of the Invention

[0003] Based on this, an object of the present invention is to provide a high-precision and high-efficiency electronic component processing equipment.

[0004] The present invention adopts the following technical solutions:

[0005] An electronic component processing device includes a feeding mechanism, a first processing mechanism, a second processing mechanism and a blanking mechanism;

[0006] The feeding mechanism is used to transport electronic components to the first processing mechanism;

[0007] The first processing mechanism is provided on one side of the second processing mechanism and is used to perform label paper laminating operations on electronic components. The first processing mechanism includes a first processing turntable, and a labeling device, a first label pressing device, a second label pressing device, a steering device, a re-pressing device and a first transfer device sequentially arranged along the circumference of the first processing turntable.

[0008] The second processing mechanism is provided on one side of the blanking mechanism and is used to perform bending and sleeve operations on the pins of the electronic components. The second processing mechanism includes a second processing turntable, and a positioning device, a first bending device, a second bending device, a third bending device, a first sleeve device, a second sleeve device, a tube pressing device, a pin cutting device, a first heat shrink device, a second heat shrink device and a second transfer device arranged in sequence along the circumference of the second processing turntable.

[0009] The blanking mechanism is used to grab the electronic components processed by the second processing mechanism and transport the blanks.

[0010] A further improvement to the above technical solution is that the feeding mechanism includes a conveying channel, a channel driving assembly, a pedicure assembly, and a feeding assembly; the conveying channel is used to convey electronic components;

[0011] The material channel drive assembly is used to drive the conveyor channel to move, and includes a first transmission plate, a first transmission module, an extension plate, a second transmission plate, and a second transmission module; the first transmission plate is connected to the bottom of the conveyor channel; the first transmission module is used to drive the first transmission plate to perform linear motion in the horizontal direction; the extension plate is connected to the rear of the first transmission module and is connected to the second transmission plate, and a slider is provided on the rear side of the extension plate, and the slider is slidably matched with the slide rail; the first transmission plate is connected to the second transmission module; the second transmission module is used to drive the first transmission plate, and drive the extension plate to perform lifting motion along the slide rail through the first transmission plate;

[0012] There are two pedicure assemblies, which are respectively arranged on both sides of the conveying channel and are used to perform pedicure operations on the pins on both sides of the electronic components;

[0013] The feeding assembly is used to grab electronic components from the conveying channel and move them to the fixture of the first processing turntable.

[0014] A further improvement to the above technical solution is that the labeling device includes a labeling transmission module, a label feeding assembly, and a labeling camera; the labeling transmission module is used to grab labels from the label feeding assembly; the labeling camera is arranged on one side of the labeling transmission module, and is used to visually locate the label paper grabbed by the labeling transmission module to obtain position information, angle information, or appearance defect information of the label paper;

[0015] The first label pressing device is used to press one end of the label paper, and includes a presser foot assembly, a roller pressing assembly, and an oblique pressing assembly;

[0016] The presser foot assembly includes a presser foot drive module and a pin pressing block; the presser foot drive module is used to drive the pin pressing block to move up and down, and the pin pressing block is used to press the pins on both sides of the electronic component;

[0017] The rolling assembly includes a rolling drive module, a vertical elastic pressure block, and an edge roller; the rolling drive module is used to drive the vertical elastic pressure block to perform lifting and lowering movements; a vertical pressing surface adapted to the outer peripheral surface of the electronic component is provided below the vertical elastic pressure block; the edge roller is provided on one side of the vertical elastic pressure block and connected to the side surface of the vertical elastic pressure block through a spring, and the edge roller is used to roll and press one end of the label paper onto the surface of the electronic component;

[0018] The oblique pressure assembly includes an oblique pressure transmission module and an oblique elastic pressure block; the oblique pressure transmission module is used to drive the oblique elastic pressure block to move toward the electronic component; an oblique pressing surface adapted to the outer peripheral surface of the electronic component is provided below the oblique elastic pressure block, and the oblique pressing surface is used to further compact the label paper;

[0019] The second label pressing device is used to press the other end of the label paper, and its structure is consistent with that of the first label pressing device;

[0020] The steering device is used to rotate the electronic components. A steering limit assembly is provided on one side of the steering device. The steering limit assembly is used to press the pins on both sides of the electronic components.

[0021] A further improvement to the above technical solution is that the re-pressing device includes two re-pressing blocks, a re-pressing clamping claw, and a re-pressing drive module arranged opposite to each other; the inner sides of the two re-pressing blocks are each provided with a re-pressing surface; the two clamping ends of the re-pressing clamping claw are respectively connected to the two re-pressing blocks, and are used to drive the two re-pressing blocks to move closer or farther away from each other; the re-pressing drive module is used to drive the re-pressing clamping claw to perform linear motion and lifting motion, so as to re-press the electronic components through the re-pressing surfaces of the re-pressing blocks;

[0022] The first transfer device is used to transfer the electronic components processed by the first processing turntable to the second processing mechanism.

[0023] A further improvement to the above technical solution is that the positioning device is used to adjust the posture of the electronic component, including two relatively arranged positioning jaws, a positioning lifting module, and a clamping module; the positioning jaws are provided with an avoidance groove for the pin to pass through, and one of the positioning jaws is configured as an elastic positioning jaw; the positioning lifting module is used to drive the two positioning jaws to perform lifting motion; and the clamping module is used to drive the two positioning jaws to move closer or farther away;

[0024] The first bending device is used to perform an oblique upward bending operation on the first pin of the electronic component, and includes a first clamping plate and a first bending assembly;

[0025] The first clamping plate is in contact with one side of the electronic component, and a first bent pressing surface is formed on the bottom of the first clamping plate. The first bent pressing surface is provided with a first receiving groove for receiving the first pin, and the first receiving groove is vertically connected to a first bending groove extending in an oblique upward direction, and the first bending groove passes through the side surface of the first clamping plate;

[0026] The first bending assembly is arranged along the axial direction of the first bending groove, and includes a first flexible pressure plate and a first bending roller. The circumferential surface of the first bending roller is provided with a first annular rolling groove adapted to the outer diameter of the first pin. When in operation, the first bending assembly moves obliquely upward along the axial direction of the first bending groove under the action of the driving mechanism. At this time, the first flexible pressure plate abuts against the first bending pressing surface, and the first bending roller rolls in contact with the first pin through its first annular rolling groove, driving the first pin to plastically deform along the inclined direction of the first bending groove.

[0027] The second bending device is used to perform an upward bending operation on the second pin of the electronic component, and includes a second clamping plate and a second bending assembly;

[0028] The second clamping plate abuts against one side of the electronic component, and a second bent pressing surface is formed on the bottom of the second clamping plate. The second bent pressing surface is provided with a second receiving groove for receiving the second pin, and the second receiving groove is connected to a second bending groove extending in an upward direction, and the second bending groove passes through the side surface of the second clamping plate;

[0029] The second bending assembly is arranged along the axial direction of the second bending groove, and includes a second flexible pressure plate and a second bending roller. The circumferential surface of the second bending roller is provided with a second annular rolling groove adapted to the outer diameter of the second pin. When working, the second bending assembly moves upward along the axial direction of the second bending groove under the action of the driving mechanism. At this time, the second flexible pressure plate abuts against the second bending pressing surface, and the second bending roller rolls in contact with the second pin through its second annular rolling groove, driving the second pin to plastically deform along the extension direction of the second bending groove.

[0030] The third bending device is used to perform a secondary bending operation on the first pin processed by the first bending device and the second pin processed by the second bending device, and includes a first pin secondary bending component and a second pin secondary bending component;

[0031] The first pin secondary bending assembly includes a first forming die base, a limiting pressing block arranged opposite to the first forming die base, and a flexible abutting block elastically connected to the lower side of the limiting pressing block;

[0032] The side surface of the first forming die base is provided with a bending plane and an abutting arc surface connected to the lower side of the bending plane; both sides of the bending plane are respectively provided with embedded positioning grooves extending in the horizontal direction;

[0033] The side surface of the limiting pressure block is provided with a limiting plane and a limiting arc surface connected to the lower side of the limiting plane; the limiting plane is provided with a limiting guide groove for accommodating the first pin, and the limiting guide groove extends to the limiting arc surface; wedge-shaped positioning blocks adapted to the embedded positioning groove are provided on both sides of the limiting guide groove, and the inclined guide surface of the wedge-shaped positioning block faces the limiting guide groove; the limiting arc surface is arranged to abut against the upper part of the abutting arc surface;

[0034] One end of the flexible abutment block is provided with an abutment slope, and the abutment slope is elastically abutted with the lower part of the abutment arc surface;

[0035] The second pin secondary bending assembly includes a forming push cylinder, a second forming die base connected to the output end of the forming push cylinder, and a flexible pressing block elastically connected to the second forming die base;

[0036] The front end of the second forming die base is provided with a forming bending groove extending along a preset bending track; the front side of the flexible pressing block is provided with a forming pressing groove adapted to the forming bending groove, and the rear side of the flexible pressing block is provided with a buffer cylinder;

[0037] During operation, the forming push cylinder drives the second forming die base to move toward the second pin, driving the flexible pressure block to move synchronously until the rear side of the flexible pressure block abuts against the output end of the buffer cylinder; at this time, the forming pressure groove on the front side of the flexible pressure block and the forming bending groove of the second forming die base are closed to form a bending cavity adapted to the second pin, and the second pin is plastically deformed along the trajectory of the forming bending groove through elastic pressure.

[0038] A further improvement to the above technical solution is that the first sleeve device is used to perform a sleeve operation on the first pin of the electronic component, including a tube feeding assembly, a tube pulling assembly, a cutting blade, and a tube clamping assembly;

[0039] The pipe feeding assembly is used to feed continuous pipe to the pipe traction assembly; the pipe traction assembly includes a traction drive motor, a first transmission gear, a second transmission gear, a first roller, and a second roller; the output shaft of the traction drive motor is connected to the first transmission gear, the first transmission gear is meshed with the second transmission gear, the shaft end of the first transmission gear is connected to the first roller, and the shaft end of the second transmission gear is connected to the second roller; the circumferential surface of the first roller is provided with a traction guide groove adapted to the outer diameter of the pipe;

[0040] The cutting blade is used to cut the pipe between the pipe pulling assembly and the pipe clamping assembly;

[0041] The pipe clamping assembly includes two meshed pipe clamping jaws, and the centers of the two pipe clamping jaws are provided with a pipe through-hole for the pipe to pass through;

[0042] The second sleeve device is used to perform a sleeve operation on the second pin of the electronic component, and its structure is the same as that of the first sleeve device.

[0043] A further improvement to the above technical solution is that the tube pressing device includes two elastic tube pressing heads and a tube pressing die base arranged opposite to each other; the elastic tube pressing head is provided with a front end pressing surface on the side close to the tube pressing die base; the tube pressing die base is provided with a pressing groove adapted to the front end pressing surface, and the tube pressing die base is provided with a receiving groove perpendicularly connected to the pressing groove, the receiving groove being used to receive the pins of the electronic components and the sleeves sleeved on the pins; the elastic tube pressing head is used to move toward the tube pressing die base under the action of the driving mechanism, and the sleeves are pressed tightly onto the pins through the cooperation between the front end pressing surface and the pressing groove;

[0044] The pin cutting device is arranged at the downstream station of the tube pressing device, and is used to cut and trim the pins and sleeves under the action of the driving mechanism; a third heat shrinking device is provided on the opposite side of the pin cutting device, and the third heat shrinking device is used to heat shrink and fix the sleeve at one end of the pin close to the electronic component.

[0045] A further improvement to the above technical solution is that the first heat shrink device is used to further heat shrink and fix the sleeve of the pin, and includes a first heating component and a first heat flow guide component; the first heating component is used to generate and transport a hot air flow; the first heat flow guide component includes a first air guide channel and a first air outlet, the first air guide channel is connected to the first heating component, and the first air outlet is arranged toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation;

[0046] The second heat shrink device is used to further heat shrink and fix the sleeve of the pin, and it includes a second heating component and a second heat flow guide component; the second heating component is used to generate and transport hot air flow; the second heat flow guide component includes a second air guide channel and a second air outlet, the second air guide channel is connected to the first heating component, and the second air outlet is arranged toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation.

[0047] A further improvement to the above technical solution is that the second transfer device is used to transfer the electronic components processed by the second processing turntable to the unloading mechanism, and the second transfer device is connected to a clamping and flipping assembly, which includes two flipping jaws arranged opposite to each other and a flip driving assembly connected to the flipping jaws; the flip driving assembly includes two flipping clamps, a flip cylinder, a flip transmission rack and a flip transmission gear; the two flip clamps are respectively rotatably connected to the two flip clamps, and the two flip clamps are connected by a guide shaft; the output end of the flip cylinder is connected to the flip transmission rack; the flip transmission rack is meshed and transmission-connected with the flip transmission gear; the flip transmission gear is transmission-connected to one of the flip clamps;

[0048] The flip drive cylinder drives the flip transmission rack to move linearly, and the flip transmission gear drives the flip clamp to rotate around the axis relative to the flip clamp claw, thereby realizing a 180° flip of the electronic component.

[0049] A further improvement to the above technical solution is that the blanking mechanism includes a positioning and cutting component and a blanking manipulator provided on one side of the positioning and cutting component; the positioning and cutting component includes a blanking turntable, and positioning stations, cutting stations, inspection stations, and blanking stations arranged in sequence along the circumference of the blanking turntable;

[0050] The unloading turntable is used to rotate the electronic components to each station in sequence; the positioning station includes a positioning air gripper, which is used to clamp the pins of the electronic components and adjust their position and posture; the cutting station includes a cutter assembly, which is used to cut and trim the pins of the electronic components; the detection station includes a position sensor, which is used to detect the position of the electronic components; the unloading station is used for the gripper of the unloading robot to grab the processed electronic components;

[0051] The end of the unloading robot is connected to a tray for storing electronic components, and a lifting unloading assembly is provided at the bottom of the tray. The lifting unloading assembly is used to drive the tray full of electronic components to a preset height for closing and unloading.

[0052] The beneficial effects of the present invention are:

[0053] Through the coordinated cooperation of various mechanisms and devices, this invention achieves fully automated processing from feeding to final unloading. During the label application process, multi-dimensional pressing and re-pressing ensure the label is secure. During pin processing, the step-by-step bending, sleeve, heat shrinking and other processes are precisely controlled to improve the pin shape and sleeve fixation quality. The automated design of the transfer and unloading process reduces manual operation, improves overall processing efficiency and product consistency, and the use of flexible components reduces the risk of component damage, making it suitable for mass production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a structural schematic diagram of the electronic component processing equipment of the present invention;

[0055] Figure 2 for Figure 1 A structural diagram of a first processing mechanism of an electronic component processing equipment;

[0056] Figure 3 for Figure 1 A structural diagram of a second processing mechanism of an electronic component processing equipment;

[0057] Figure 4 for Figure 1 A structural diagram of a feeding mechanism of an electronic component processing equipment;

[0058] Figure 5 for Figure 4 A structural diagram of a material channel drive assembly of a feeding mechanism;

[0059] Figure 6 for Figure 4 A schematic structural diagram of the material channel drive assembly of the feeding mechanism from another angle;

[0060] Figure 7 for Figure 2 A schematic structural diagram of a first pressure marking device of a first processing mechanism;

[0061] Figure 8 for Figure 7 A partial enlarged view of circle A of the first pressure marking device;

[0062] Figure 9 for Figure 2 A schematic structural diagram of a steering device of a first processing mechanism;

[0063] Figure 10 for Figure 2 A schematic structural diagram of a re-pressing device of a first processing mechanism;

[0064] Figure 11 for Figure 3 A schematic structural diagram of a positioning device of a second processing mechanism;

[0065] Figure 12 for Figure 3 A schematic structural diagram of a first bending device of a second processing mechanism;

[0066] Figure 13 for Figure 12 A partial enlarged view of circle B of the first bending device;

[0067] Figure 14 for Figure 12 A schematic structural diagram of a first clamping plate of a first bending device;

[0068] Figure 15 for Figure 3 A schematic structural diagram of a second bending device of a second processing mechanism;

[0069] Figure 16 for Figure 15 A partial enlarged view of circle C of the second bending device;

[0070] Figure 17 for Figure 3 A schematic structural diagram of the third bending device of the second processing mechanism;

[0071] Figure 18 for Figure 17 A partial enlarged view of circle D of the third bending device;

[0072] Figure 19 for Figure 17 A schematic structural diagram of a first pin secondary bending assembly of a third bending device;

[0073] Figure 20 for Figure 19 A partial enlarged view of circle E of the first pin secondary bending component;

[0074] Figure 21 for Figure 17 A schematic structural diagram of a second pin secondary bending assembly of a third bending device;

[0075] Figure 22 for Figure 21 A partial enlarged view of circle F of the second pin secondary bending component;

[0076] Figure 23 for Figure 3 A schematic structural diagram of a first sleeve device of a second processing mechanism;

[0077] Figure 24 for Figure 23 A schematic structural diagram of a pipe feeding assembly of a first casing device;

[0078] Figure 25 for Figure 3 A schematic structural diagram of a tube pressing device of a second processing mechanism;

[0079] Figure 26 for Figure 25 A partial enlarged view of circle G of the pipe pressing device;

[0080] Figure 27 for Figure 3 A schematic structural diagram of a pin cutting device of a second processing mechanism;

[0081] Figure 28 for Figure 3 A schematic structural diagram of a first heat shrinking device and a second heat shrinking device of a second processing mechanism;

[0082] Figure 29 for Figure 3 A schematic structural diagram of a second transfer device of a second processing mechanism;

[0083] Figure 30 for Figure 29 A schematic structural diagram of a clamping and flipping assembly of a second transfer device;

[0084] Figure 31 for Figure 1 A structural diagram of a blanking mechanism of electronic component processing equipment;

[0085] Figure 32 for Figure 31 Schematic diagram of the structure of the positioning and cutting components of the blanking mechanism.

[0086] The numbers in the figure are:

[0087] 100. Feeding mechanism; 111. Conveying channel;

[0088] 112, material channel drive assembly; 1121, first transmission plate; 1122, first transmission module; 1123, extension plate; 1124, second transmission plate; 1125, second transmission module; 1126, slider; 1127, slide rail;

[0089] 113. Pedicure assembly; 114. Feeding assembly;

[0090] 200, first processing mechanism; 211, first processing turntable;

[0091] 212. Labeling device; 2121. Labeling transmission module; 2122. Label feeding assembly; 2123. Labeling camera;

[0092] 213, first marking device; 218, presser foot assembly; 2181, presser foot drive module; 2182, pin pressing block; 219, roller pressing assembly; 2191, roller pressing drive module; 2192, vertical elastic pressing block; 2193, edge roller; 2194, vertical pressing surface; 221, oblique pressing assembly; 2211, oblique pressing transmission module; 2212, oblique elastic pressing block; 2213, oblique pressing surface;

[0093] 214. Second pressure marking device; 215. Steering device; 2151. Steering limit assembly;

[0094] 216, re-pressing device; 2161, re-pressing block; 2162, re-pressing clamp; 2163, re-pressing drive module; 2164, re-pressing surface;

[0095] 217. First transfer device;

[0096] 300, second processing mechanism; 311, second processing turntable;

[0097] 312, positioning device; 3121, positioning clamp; 3122, positioning lifting module; 3123, clamping module; 3124, avoidance groove;

[0098] 313, first bending device; 3131, first clamping plate; 3132, first bending pressing surface; 3133, first receiving groove; 3134, first bending groove;

[0099] 600, first bending assembly; 611, first flexible pressure plate; 612, first bending roller; 6121, first annular rolling groove;

[0100] 314, second bending device; 3141, second clamping plate; 3142, second bending pressing surface; 3143, second receiving groove; 3144, second bending groove;

[0101] 700, second bending assembly; 711, second flexible pressure plate; 712, second bending roller; 7121, second annular rolling groove;

[0102] 315, third bending device;

[0103] 800, first pin secondary bending assembly; 811, first forming die base; 8111, bending plane; 8112, abutting arc surface; 8113, embedded positioning groove; 812, limiting pressure block; 8121, limiting plane; 8122, limiting arc surface; 8123, limiting guide groove; 8124, wedge-shaped positioning block; 813, flexible abutting block; 8131, abutting inclined surface;

[0104] 900, second pin secondary bending assembly; 911, forming push cylinder; 912, second forming die base; 9121, forming bending groove; 913, flexible pressing block; 9131, forming pressing groove; 9132, buffer cylinder;

[0105] 316a, first sleeve device; 3161, pipe feeding assembly; 3162, cutting blade; 3163, pipe clamping assembly; 31631, pipe clamping jaw; 31632, pipe punching; 3164, traction drive motor; 3165, first transmission gear; 3166, second transmission gear; 3167, first roller; 3168, second roller; 3169, traction guide groove; 316b, second sleeve device;

[0106] 317, tube pressing device; 3171, elastic tube pressing head; 3172, tube pressing die base; 3173, front end pressing surface; 3174, pressing groove; 3175, receiving groove;

[0107] 318, cutting device; 3181, third heat shrink device;

[0108] 319, first heat shrink device; 3191, first heating assembly; 3192, first heat flow guide assembly; 3193, first air guide channel; 3194, first air outlet;

[0109] 321, second heat shrink device; 3211, second heating assembly; 3212, second heat flow guide assembly; 3213, second air guide channel; 3214, second air outlet;

[0110] 322. Second transfer device; 323. Clamping and flipping assembly; 3231. Flipping clamp; 3232. Flipping drive assembly; 3233. Flipping clamp; 3234. Flipping cylinder; 3235. Flipping transmission rack; 3236. Flipping transmission gear; 3237. Guide shaft;

[0111] 400, unloading mechanism; 411, positioning and cutting assembly; 412, unloading robot; 413, unloading turntable; 414, positioning station; 4141, positioning air gripper; 415, cutting station; 4151, cutter assembly; 416, detection station; 4161, position sensor; 417, unloading station; 418, tray; 419, lifting and unloading assembly; 500, electronic components; 511, first pin; 512, second pin. DETAILED DESCRIPTION

[0112] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0113] In the description of the present invention, it should be noted that the terms "vertical," "upper," "lower," and "horizontal," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0114] It should also be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0115] like Figures 1 to 32 FIG. 1 is an embodiment of the present invention, which relates to an electronic component processing device, including a feeding mechanism 100 , a first processing mechanism 200 , a second processing mechanism 300 and a blanking mechanism 400 ;

[0116] The feeding mechanism 100 is used to transport the electronic components 500 to the first processing mechanism 200;

[0117] The first processing mechanism 200 is provided on one side of the second processing mechanism 300 and is used to perform label paper application operation on the electronic components 500. The first processing mechanism 200 includes a first processing turntable 211, and a labeling device 212, a first label pressing device 213, a second label pressing device 214, a steering device 215, a re-pressing device 216, and a first transfer device 217 sequentially arranged along the circumference of the first processing turntable 211.

[0118] The second processing mechanism 300 is provided on one side of the blanking mechanism 400 and is used to perform bending and sleeve operations on the pins of the electronic components 500. The second processing mechanism 300 includes a second processing turntable 311, and a positioning device 312, a first bending device 313, a second bending device 314, a third bending device 315, a first sleeve device 316a, a second sleeve device 316b, a tube pressing device 317, a pin cutting device 318, a first heat shrinking device 319, a second heat shrinking device 321, and a second transfer device 322, which are sequentially arranged along the circumference of the second processing turntable 311.

[0119] The unloading mechanism 400 is used to grab the electronic components 500 processed by the second processing mechanism 300 and transport the unloading.

[0120] Specifically, by integrating the feeding mechanism 100, the first processing mechanism 200, the second processing mechanism 300 and the unloading mechanism 400, the entire process of electronic components 500 from transportation to label bonding, pin processing to unloading is automated, reducing manual intervention, improving processing efficiency and consistency, and each mechanism has a clear division of labor, laying the foundation for precise coordination of subsequent processes.

[0121] like Figure 4 As shown, the feeding mechanism 100 includes a conveying channel 111, a channel driving assembly 112, a pedicure assembly 113, and a feeding assembly 114; the conveying channel 111 is used to convey electronic components 500;

[0122] like Figure 5 and Figure 6As shown, the material channel driving assembly 112 is used to drive the conveying material channel 111 to move, and includes a first transmission plate 1121, a first transmission module 1122, an extension plate 1123, a second transmission plate 1124, and a second transmission module 1125; the first transmission plate 1121 is connected to the bottom of the conveying material channel 111; the first transmission module 1122 is used to drive the first transmission plate 1121 to perform linear motion in the horizontal direction; the extension plate 1123 is connected to the rear of the first transmission module 1122 and is connected to the second transmission plate 1124, and a slider 1126 is provided on the rear side of the extension plate 1123, and the slider 1126 is slidably matched with the slide rail 1127; the first transmission plate 1121 is connected to the second transmission module 1125; the second transmission module 1125 is used to drive the first transmission plate 1121, and drive the extension plate 1123 to perform lifting motion along the slide rail 1127 through the first transmission plate 1121;

[0123] The two foot-repairing assemblies 113 are respectively provided on both sides of the conveying channel 111 for performing foot-repairing operations on the pins on both sides of the electronic component 500;

[0124] The feeding assembly 114 is used to grab the electronic components 500 from the conveying channel 111 and move them to the fixture of the first processing turntable 211.

[0125] Specifically, in the feeding mechanism 100, the horizontal and lifting movements of the material channel driving component 112 are coordinated, and the position of the conveying channel 111 can be flexibly adjusted to adapt to components of different specifications; the foot trimming component 113 can pre-trim the pins to ensure the accuracy of subsequent processing; the feeding component 114 accurately grasps and transfers, improves the loading stability, and overall optimizes the reliability and adaptability of the feeding link.

[0126] like Figure 2 As shown, the labeling device 212 includes a labeling transmission module 2121, a label feeding assembly 2122 and a labeling camera 2123; the labeling transmission module 2121 is used to grab labels from the label feeding assembly 2122; the labeling camera 2123 is arranged on one side of the labeling transmission module 2121, and is used to visually locate the label paper grabbed by the labeling transmission module 2121, and obtain position information, angle information or appearance defect information of the label paper;

[0127] like Figure 7 As shown, the first label pressing device 213 is used to press one end of the label paper, which includes a presser foot assembly 218, a roller pressing assembly 219, and an oblique pressing assembly 221;

[0128] like Figure 7 and Figure 8As shown, the presser foot assembly 218 includes a presser foot driving module 2181 and a pin pressing block 2182; the presser foot driving module 2181 is used to drive the pin pressing block 2182 to move up and down, and the pin pressing block 2182 is used to press the pins on both sides of the electronic component 500;

[0129] like Figure 8 As shown, the rolling assembly 219 includes a rolling drive module 2191, a vertical elastic pressure block 2192, and an edge roller 2193; the rolling drive module 2191 is used to drive the vertical elastic pressure block 2192 to perform lifting and lowering movements; a vertical pressing surface 2194 adapted to the outer peripheral surface of the electronic component 500 is provided below the vertical elastic pressure block 2192; the edge roller 2193 is provided on one side of the vertical elastic pressure block 2192 and connected to the side of the vertical elastic pressure block 2192 via a spring, and the edge roller 2193 is used to roll and press one end of the label paper onto the surface of the electronic component 500;

[0130] like Figure 8 As shown, the oblique pressure assembly 221 includes an oblique pressure transmission module 2211 and an oblique elastic pressure block 2212; the oblique pressure transmission module 2211 is used to drive the oblique elastic pressure block 2212 to move toward the electronic component 500; an oblique pressing surface 2213 adapted to the outer peripheral surface of the electronic component 500 is provided below the oblique elastic pressure block 2212, and the oblique pressing surface 2213 is used to further compact the label paper;

[0131] The second label pressing device 214 is used to press the other end of the label paper, and its structure is consistent with that of the first label pressing device 213;

[0132] like Figure 9 As shown, the steering device 215 is used to rotate the electronic component 500 , and a steering limit assembly 2151 is provided on one side of the steering device 215 . The steering limit assembly 2151 is used to press the pins on both sides of the electronic component 500 .

[0133] Specifically, the labeling device 212 is combined with visual positioning to ensure accurate label fitting; the first pressing device 213 and the second pressing device 214 cooperate with multiple components to compact the label from different angles and forces to avoid bubbles and wrinkles; the steering device 215 cooperates with the limiting component to ensure the stability of the pins when the components are turned, thereby improving the label fitting quality and the posture accuracy of subsequent processing.

[0134] like Figure 10As shown, the re-pressing device 216 includes two re-pressing blocks 2161 arranged opposite to each other, a re-pressing clamping claw 2162, and a re-pressing driving module 2163; the inner sides of the two re-pressing blocks 2161 are each provided with a re-pressing surface 2164; the two clamping ends of the re-pressing clamping claw 2162 are respectively connected to the two re-pressing blocks 2161, and are used to drive the two re-pressing blocks 2161 to move relatively closer or farther away; the re-pressing driving module 2163 is used to drive the re-pressing clamping claw 2162 to perform linear motion and lifting motion, so as to re-press the electronic component 500 through the re-pressing surface 2164 of the re-pressing block 2161;

[0135] The first transfer device 217 is used to transfer the electronic components 500 processed on the first processing turntable 211 to the second processing mechanism 300. Specifically, the clamping jaws of the re-pressing device 216 drive the re-pressing block 2161 to move relative to each other, coordinating with the multi-dimensional movement of the drive module to perform a secondary compaction on the label, enhancing the lamination effect. The first transfer device 217 achieves seamless connection between the two processing mechanisms, reducing transfer time and ensuring processing continuity.

[0136] like Figure 11 As shown, the positioning device 312 is used to adjust the posture of the electronic component 500, and includes two relatively arranged positioning jaws 3121, a positioning lifting module 3122, and a clamping module 3123; the positioning jaws 3121 are provided with an avoidance groove 3124 for the pin to pass through, and one of the positioning jaws 3121 is configured as an elastic positioning jaw 3121; the positioning lifting module 3122 is used to drive the two positioning jaws 3121 to perform lifting motion; and the clamping module 3123 is used to drive the two positioning jaws 3121 to move closer or farther away.

[0137] like Figure 12 As shown, the first bending device 313 is used to perform an oblique upward bending operation on the first pin 511 of the electronic component 500, and includes a first clamping plate 3131 and a first bending assembly 600;

[0138] like Figure 12 As shown, the first clamping plate 3131 abuts against one side of the electronic component 500. The bottom of the first clamping plate 3131 defines a first bent pressing surface 3132. The first bent pressing surface 3132 defines a first receiving groove 3133 for receiving the first pin 511. The first receiving groove 3133 is perpendicularly connected to a first bending groove 3134 extending in an oblique upward direction. The first bending groove 3134 passes through the side of the first clamping plate 3131.

[0139] like Figure 13 and Figure 14As shown, the first bending assembly 600 is arranged along the axial direction of the first bending groove 3134, and includes a first flexible pressure plate 611 and a first bending roller 612. The circumferential surface of the first bending roller 612 is provided with a first annular rolling groove 6121 adapted to the outer diameter of the first pin 511. During operation, the first bending assembly 600 moves obliquely upward along the axial direction of the first bending groove 3134 under the action of the driving mechanism. At this time, the first flexible pressure plate 611 abuts against the first bending pressing surface 3132, and the first bending roller 612 rolls in contact with the first pin 511 through its first annular rolling groove 6121, driving the first pin 511 to plastically deform along the inclined direction of the first bending groove 3134.

[0140] like Figure 15 and Figure 16 As shown, the second bending device 314 is used to perform an upward bending operation on the second pin 512 of the electronic component 500, and includes a second clamping plate 3141 and a second bending assembly 700;

[0141] The second clamping plate 3141 abuts against one side of the electronic component 500. The second clamping plate 3141 defines a second bent pressing surface 3142 at its bottom. The second bent pressing surface 3142 defines a second receiving groove 3143 for receiving the second pin 512. The second receiving groove 3143 is connected to a second bent groove 3144 extending upward. The second bent groove 3144 passes through the side of the second clamping plate 3141.

[0142] like Figure 16 As shown, the second bending assembly 700 is arranged along the axial direction of the second bending groove 3144, and includes a second flexible pressure plate 711 and a second bending roller 712. The circumferential surface of the second bending roller 712 is provided with a second annular rolling groove 7121 adapted to the outer diameter of the second pin 512. When working, the second bending assembly 700 moves upward along the axial direction of the second bending groove 3144 under the action of the driving mechanism. At this time, the second flexible pressure plate 711 abuts against the second bending pressing surface 3142, and the second bending roller 712 rolls in contact with the second pin 512 through its second annular rolling groove 7121, driving the second pin 512 to plastically deform along the extension direction of the second bending groove 3144.

[0143] like Figure 17 As shown, the third bending device 315 is used to perform a secondary bending operation on the first pin 511 processed by the first bending device 313 and the second pin 512 processed by the second bending device 314, and includes a first pin secondary bending component 800 and a second pin secondary bending component 900;

[0144] like Figure 18 and Figure 19 As shown, the first pin secondary bending assembly 800 includes a first forming die base 811, a limiting pressing block 812 arranged opposite to the first forming die base 811, and a flexible abutting block 813 elastically connected to the lower side of the limiting pressing block 812;

[0145] like Figure 18 As shown, the side surface of the first forming die base 811 is provided with a bending plane 8111 and an abutting arc surface 8112 connected to the lower side of the bending plane 8111; both sides of the bending plane 8111 are respectively provided with embedded positioning grooves 8113 extending in the horizontal direction;

[0146] like Figure 18 and Figure 20 As shown, the side of the limiting pressure block 812 is provided with a limiting plane 8121 and a limiting arc surface 8122 connected to the lower side of the limiting plane 8121; the limiting plane 8121 is provided with a limiting guide groove 8123 for accommodating the first pin 511, and the limiting guide groove 8123 extends to the limiting arc surface 8122; wedge-shaped positioning blocks 8124 adapted to the embedded positioning groove 8113 are provided on both sides of the limiting guide groove 8123, and the inclined guide surface of the wedge-shaped positioning block 8124 faces the limiting guide groove 8123; the limiting arc surface 8122 is arranged to abut against the upper part of the abutting arc surface 8112;

[0147] like Figure 20 As shown, one end of the flexible abutting block 813 is provided with an abutting inclined surface 8131, and the abutting inclined surface 8131 elastically abuts against the lower portion of the abutting arc surface 8112;

[0148] like Figure 21 As shown, the second pin secondary bending assembly 900 includes a forming push cylinder 911, a second forming die base 912 connected to the output end of the forming push cylinder 911, and a flexible pressing block 913 elastically connected to the second forming die base 912;

[0149] like Figure 22 As shown, the front end of the second forming die base 912 is provided with a forming bending groove 9121 extending along a preset bending track; the front side of the flexible pressing block 913 is provided with a forming pressing groove 9131 adapted to the forming bending groove 9121, and the rear side of the flexible pressing block 913 is provided with a buffer cylinder 9132;

[0150] During operation, the forming push cylinder 911 drives the second forming die base 912 to move toward the second pin 512, driving the flexible pressure block 913 to move synchronously until the rear side of the flexible pressure block 913 abuts against the output end of the buffer cylinder 9132; at this time, the forming pressure groove 9131 on the front side of the flexible pressure block 913 and the forming bending groove 9121 of the second forming die base 912 are closed to form a bending cavity adapted to the second pin 512, and the second pin 512 is plastically deformed along the trajectory of the forming bending groove 9121 through elastic pressure.

[0151] Specifically, the positioning device 312 accurately adjusts the posture of the components through elastic clamps and lifting and clamping modules 3123; multiple bending devices bend the pins at different angles in steps, and use flexible pressure and trajectory guidance to avoid pin damage, improve bending accuracy and consistency, and meet the requirements of complex pin shapes.

[0152] like Figure 23 As shown, the first sleeve device 316a is used to perform a sleeve operation on the first pin 511 of the electronic component 500, and includes a tube feeding assembly 3161, a tube pulling assembly, a cutting blade 3162, and a tube clamping assembly 3163;

[0153] like Figure 24 As shown, the pipe feeding assembly 3161 is used to feed continuous pipe to the pipe pulling assembly; the pipe pulling assembly includes a pulling drive motor 3164, a first transmission gear 3165, a second transmission gear 3166, a first roller 3167, and a second roller 3168; the output shaft of the pulling drive motor 3164 is connected to the first transmission gear 3165, which meshes with the second transmission gear 3166; the shaft end of the first transmission gear 3165 is connected to the first roller 3167, and the shaft end of the second transmission gear 3166 is connected to the second roller 3168; the circumferential surface of the first roller 3167 is provided with a pulling guide groove 3169 adapted to the outer diameter of the pipe;

[0154] like Figure 23 As shown, the cutting blade 3162 is used to cut the pipe between the pipe pulling assembly and the pipe clamping assembly 3163;

[0155] like Figure 24 As shown, the pipe clamping assembly 3163 includes two meshed pipe clamping jaws 31631 , and a pipe through-hole 31632 for the pipe to pass through is provided in the center of the two pipe clamping jaws 31631 ;

[0156] The second sleeve device 316 b is used to perform a sleeve operation on the second pin 512 of the electronic component 500 , and its structure is the same as that of the first sleeve device 316 a .

[0157] Specifically, the first sleeve device 316a and the second sleeve device 316b achieve precise sleeve installation of the pipe through roller traction, jaw clamping and cutting. The two devices with the same structure are adapted to the two pins, which improves the sleeve efficiency and symmetry and lays the foundation for subsequent processing.

[0158] like Figure 25 and Figure 26 As shown, the tube pressing device 317 includes two elastic tube pressing heads 3171 and a tube pressing die base 3172 arranged opposite to each other; the elastic tube pressing head 3171 is provided with a front pressing surface 3173 on the side close to the tube pressing die base 3172; the tube pressing die base 3172 is provided with a pressing groove 3174 adapted to the front pressing surface 3173, and the tube pressing die base 3172 is provided with a receiving groove 3175 perpendicularly connected to the pressing groove 3174, and the receiving groove 3175 is used to receive the pins of the electronic component 500 and the sleeve sleeved on the pins; the elastic tube pressing head 3171 is used to move toward the tube pressing die base 3172 under the action of the driving mechanism, and the sleeve is pressed onto the pin through the cooperation of the front pressing surface 3173 and the pressing groove 3174;

[0159] like Figure 27 As shown, the pin cutting device 318 is provided at the downstream station of the tube pressing device 317, and is used to cut and trim the pins and sleeves under the action of the driving mechanism; a third heat shrinking device 3181 is provided on the opposite side of the pin cutting device 318, and the third heat shrinking device 3181 is used to heat shrink and fix the sleeve at one end of the pin close to the electronic component 500.

[0160] Specifically, the elastic pressing of the tube pressing device 317 cooperates with the mold base to ensure that the sleeve fits tightly to the pin; the pin cutting device 318 cooperates with the third heat shrink device 3181 to trim the pin and fix the sleeve, thereby improving the firmness of the connection between the pin and the sleeve and reducing the risk of falling off later.

[0161] like Figure 28 As shown, the first heat shrink device 319 is used to further heat shrink and fix the sleeve of the pin, and includes a first heating component 3191 and a first heat flow guide component 3192; the first heating component 3191 is used to generate and transport a hot air flow; the first heat flow guide component 3192 includes a first air guide channel 3193 and a first air outlet 3194, the first air guide channel 3193 is connected to the first heating component 3191, and the first air outlet 3194 is arranged toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation;

[0162] like Figure 28As shown, the second heat shrink device 321 is used to further heat shrink and fix the sleeve of the pin, which includes a second heating component 3211 and a second heat flow guide component 3212; the second heating component 3211 is used to generate and transport hot air flow; the second heat flow guide component 3212 includes a second air guide channel 3213 and a second air outlet 3214, the second air guide channel 3213 is connected to the first heating component 3191, and the second air outlet 3214 is set toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation.

[0163] Specifically, the first heat shrink device 319 and the second heat shrink device 321 heat the sleeve in steps, and accurately deliver heat through the guide component to make the sleeve fully shrink, enhance the insulation and fixing effects, and double heating ensures the uniformity of heat shrinkage and improves the reliability of components.

[0164] like Figure 29 and Figure 30 As shown, the second transfer device 322 is used to transfer the electronic components 500 processed by the second processing turntable 311 to the unloading mechanism 400, and the second transfer device 322 is connected to a clamping and flipping assembly 323, which includes two flipping jaws 3231 arranged opposite to each other and a flip driving assembly 3232 connected to the flipping jaws 3231; the flip driving assembly 3232 includes two flip clamps 3233, a flip cylinder 3234, a flip transmission rack 3235 and a flip transmission gear 3236; the two flip clamps 3233 are rotatably connected to the two flip clamps 3231 respectively, and the two flip clamps 3233 are connected by a guide shaft 3237; the output end of the flip cylinder 3234 is connected to the flip transmission rack 3235; the flip transmission rack 3235 is meshed and transmission-connected with the flip transmission gear 3236; the flip transmission gear 3236 is transmission-connected to one of the flip clamps 3233;

[0165] The flip driving cylinder drives the flip transmission rack 3235 to move linearly, and drives the flip clamp 3233 to rotate around the axis relative to the flip clamp 3231 through the flip transmission gear 3236, thereby realizing a 180° flip of the electronic component 500.

[0166] Specifically, the clamping and flipping assembly 323 of the second transfer device 322 is flipped 180° through a gear rack transmission, and the guide shaft 3237 of the clamping block slides, ensuring the stability of the components during the flipping and clamping process, facilitating the subsequent unloading process and improving the flexibility of transportation.

[0167] like Figure 31As shown, the blanking mechanism 400 includes a positioning and cutting component 411, and a blanking manipulator 412 provided on one side of the positioning and cutting component 411; the positioning and cutting component 411 includes a blanking turntable 413, and a positioning station 414, a cutting station 415, a detection station 416, and a blanking station 417 sequentially arranged along the circumference of the blanking turntable 413;

[0168] like Figure 32 As shown, the unloading turntable 413 is used to rotate the electronic components 500 to each station in sequence; the positioning station 414 includes a positioning air gripper 4141, which is used to clamp the pins of the electronic components 500 and adjust their position and posture; the cutting station 415 includes a cutter assembly 4151, which is used to cut and trim the pins of the electronic components 500; the detection station 416 includes a position sensor 4161, which is used to detect the position of the electronic components 500; the unloading station 417 is used for the gripper of the unloading robot 412 to grab the processed electronic components 500;

[0169] like Figure 31 As shown, the end of the unloading robot 412 is connected to a material tray 418 for storing electronic components 500, and a lifting unloading assembly 419 is provided at the bottom of the material tray 418. The lifting unloading assembly 419 is used to drive the material tray 418 full of electronic components 500 to a preset height for closing and unloading.

[0170] Specifically, the multi-station turntable of the blanking mechanism 400 realizes the integration of positioning, cutting, detection and blanking. The positioning air claws 4141 and sensors ensure the accurate posture and position of the components; the lifting and blanking assembly 419 automatically transfers the full material tray 418, improves the blanking efficiency, reduces the labor intensity, and realizes the closed-loop processing.

[0171] The various power devices, such as modules, involved in the present invention can be replaced by existing pneumatic cylinders, electric cylinders, pneumatic grippers, or linear actuators, depending on the actual application requirements of the present invention. Since the structures and models of these alternative power devices are common knowledge in the art, they will not be described in detail here.

[0172] The working principle of the present invention is:

[0173] When the electronic component processing equipment is working, the feeding mechanism 100 transports the components to the first processing turntable 211, and completes labeling, multi-pass pressure labeling, steering and re-pressing in sequence to ensure that the labels are firmly attached; after being transferred to the second processing turntable 311 by the first transfer device 217, the posture is first adjusted by the positioning device 312, and then multi-step bending, sleeve, tube pressing, tube cutting and heat shrinkage are performed in sequence to make the pins reach the preset shape and the sleeve is fixed; then the clamping and flipping assembly 323 of the second transfer device 322 flips the components and transfers them to the unloading mechanism 400. After the unloading turntable 413 is processed through multiple stations, the robot transfers the finished product to the material tray 418. After it is full, the lifting assembly transfers the unloading, realizing full-process automated processing.

[0174] Through the coordinated cooperation of various mechanisms and devices, this invention achieves fully automated processing from feeding to final unloading. During the label application process, multi-dimensional pressing and re-pressing ensure the label is secure. During pin processing, the step-by-step bending, sleeve, heat shrinking and other processes are precisely controlled to improve the pin shape and sleeve fixation quality. The automated design of the transfer and unloading process reduces manual operation, improves overall processing efficiency and product consistency, and the use of flexible components reduces the risk of component damage, making it suitable for mass production needs.

[0175] The above description merely represents the preferred technical solution of the present invention. While the description is relatively specific and detailed, it should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present invention, and the present invention is intended to encompass such modifications and variations.

Claims

1. An electronic component processing equipment, characterized in that: It includes a feeding mechanism, a first processing mechanism, a second processing mechanism and a blanking mechanism; The feeding mechanism is used to transport electronic components to the first processing mechanism; The first processing mechanism is provided on one side of the second processing mechanism and is used to perform label paper laminating operations on electronic components. The first processing mechanism includes a first processing turntable, and a labeling device, a first label pressing device, a second label pressing device, a steering device, a re-pressing device and a first transfer device sequentially arranged along the circumference of the first processing turntable. The second processing mechanism is provided on one side of the blanking mechanism and is used to perform bending and sleeve operations on the pins of the electronic components. The second processing mechanism includes a second processing turntable, and a positioning device, a first bending device, a second bending device, a third bending device, a first sleeve device, a second sleeve device, a tube pressing device, a pin cutting device, a first heat shrink device, a second heat shrink device and a second transfer device arranged in sequence along the circumference of the second processing turntable. The blanking mechanism is used to grab the electronic components processed by the second processing mechanism and transport the blanks.

2. The electronic component processing equipment according to claim 1, characterized in that: The feeding mechanism includes a conveying channel, a channel driving assembly, a pedicure assembly, and a feeding assembly; the conveying channel is used to convey electronic components; The material channel drive assembly is used to drive the conveyor channel to move, and includes a first transmission plate, a first transmission module, an extension plate, a second transmission plate, and a second transmission module; the first transmission plate is connected to the bottom of the conveyor channel; the first transmission module is used to drive the first transmission plate to perform linear motion in the horizontal direction; the extension plate is connected to the rear of the first transmission module and is connected to the second transmission plate, and a slider is provided on the rear side of the extension plate, and the slider is slidably matched with the slide rail; the first transmission plate is connected to the second transmission module; the second transmission module is used to drive the first transmission plate, and drive the extension plate to perform lifting motion along the slide rail through the first transmission plate; There are two pedicure assemblies, which are respectively arranged on both sides of the conveying channel and are used to perform pedicure operations on the pins on both sides of the electronic components; The feeding assembly is used to grab electronic components from the conveying channel and move them to the fixture of the first processing turntable.

3. The electronic component processing equipment according to claim 1, characterized in that: The labeling device includes a labeling transmission module, a label feeding assembly, and a labeling camera; the labeling transmission module is used to grab labels from the label feeding assembly; the labeling camera is arranged on one side of the labeling transmission module and is used to visually locate the label paper grabbed by the labeling transmission module to obtain position information, angle information, or appearance defect information of the label paper; The first label pressing device is used to press one end of the label paper, and includes a presser foot assembly, a roller pressing assembly, and an oblique pressing assembly; The presser foot assembly includes a presser foot drive module and a pin pressing block; the presser foot drive module is used to drive the pin pressing block to move up and down, and the pin pressing block is used to press the pins on both sides of the electronic component; The rolling assembly includes a rolling drive module, a vertical elastic pressure block, and an edge roller; the rolling drive module is used to drive the vertical elastic pressure block to perform lifting and lowering movements; a vertical pressing surface adapted to the outer peripheral surface of the electronic component is provided below the vertical elastic pressure block; the edge roller is provided on one side of the vertical elastic pressure block and connected to the side surface of the vertical elastic pressure block through a spring, and the edge roller is used to roll and press one end of the label paper onto the surface of the electronic component; The oblique pressure assembly includes an oblique pressure transmission module and an oblique elastic pressure block; the oblique pressure transmission module is used to drive the oblique elastic pressure block to move toward the electronic component; an oblique pressing surface adapted to the outer peripheral surface of the electronic component is provided below the oblique elastic pressure block, and the oblique pressing surface is used to further compact the label paper; The second label pressing device is used to press the other end of the label paper, and its structure is consistent with that of the first label pressing device; The steering device is used to rotate the electronic components. A steering limit assembly is provided on one side of the steering device. The steering limit assembly is used to press the pins on both sides of the electronic components.

4. The electronic component processing equipment according to claim 1, characterized in that: The re-pressing device includes two re-pressing blocks arranged opposite to each other, a re-pressing clamping claw, and a re-pressing driving module; the inner sides of the two re-pressing blocks are each provided with a re-pressing surface; the two clamping ends of the re-pressing clamping claw are respectively connected to the two re-pressing blocks, for driving the two re-pressing blocks to move relatively closer or farther away; the re-pressing driving module is used to drive the re-pressing clamping claw to perform linear motion and lifting motion, so as to re-press the electronic components through the re-pressing surfaces of the re-pressing blocks; The first transfer device is used to transfer the electronic components processed by the first processing turntable to the second processing mechanism.

5. The electronic component processing equipment according to claim 1, characterized in that: The positioning device is used to adjust the posture of electronic components and includes two relatively arranged positioning jaws, a positioning lifting module, and a clamping module; the positioning jaws are provided with an avoidance groove for the pins to pass through, and one of the positioning jaws is configured as an elastic positioning jaw; the positioning lifting module is used to drive the two positioning jaws to perform lifting and lowering movements; and the clamping module is used to drive the two positioning jaws to move closer or further away; The first bending device is used to perform an oblique upward bending operation on the first pin of the electronic component, and includes a first clamping plate and a first bending assembly; The first clamping plate is in contact with one side of the electronic component, and a first bent pressing surface is formed on the bottom of the first clamping plate. The first bent pressing surface is provided with a first receiving groove for receiving the first pin, and the first receiving groove is vertically connected to a first bending groove extending in an oblique upward direction, and the first bending groove passes through the side surface of the first clamping plate; The first bending assembly is arranged along the axial direction of the first bending groove, and includes a first flexible pressure plate and a first bending roller. The circumferential surface of the first bending roller is provided with a first annular rolling groove adapted to the outer diameter of the first pin. When in operation, the first bending assembly moves obliquely upward along the axial direction of the first bending groove under the action of the driving mechanism. At this time, the first flexible pressure plate abuts against the first bending pressing surface, and the first bending roller rolls in contact with the first pin through its first annular rolling groove, driving the first pin to plastically deform along the inclined direction of the first bending groove. The second bending device is used to perform an upward bending operation on the second pin of the electronic component, and includes a second clamping plate and a second bending assembly; The second clamping plate abuts against one side of the electronic component, and a second bent pressing surface is formed on the bottom of the second clamping plate. The second bent pressing surface is provided with a second receiving groove for receiving the second pin, and the second receiving groove is connected to a second bending groove extending in an upward direction, and the second bending groove passes through the side surface of the second clamping plate; The second bending assembly is arranged along the axial direction of the second bending groove, and includes a second flexible pressure plate and a second bending roller. The circumferential surface of the second bending roller is provided with a second annular rolling groove adapted to the outer diameter of the second pin. When working, the second bending assembly moves upward along the axial direction of the second bending groove under the action of the driving mechanism. At this time, the second flexible pressure plate abuts against the second bending pressing surface, and the second bending roller rolls in contact with the second pin through its second annular rolling groove, driving the second pin to plastically deform along the extension direction of the second bending groove. The third bending device is used to perform a secondary bending operation on the first pin processed by the first bending device and the second pin processed by the second bending device, and includes a first pin secondary bending component and a second pin secondary bending component; The first pin secondary bending assembly includes a first forming die base, a limiting pressing block arranged opposite to the first forming die base, and a flexible abutting block elastically connected to the lower side of the limiting pressing block; The side surface of the first forming die base is provided with a bending plane and an abutting arc surface connected to the lower side of the bending plane; both sides of the bending plane are respectively provided with embedded positioning grooves extending in the horizontal direction; The side surface of the limiting pressure block is provided with a limiting plane and a limiting arc surface connected to the lower side of the limiting plane; the limiting plane is provided with a limiting guide groove for accommodating the first pin, and the limiting guide groove extends to the limiting arc surface; wedge-shaped positioning blocks adapted to the embedded positioning groove are provided on both sides of the limiting guide groove, and the inclined guide surface of the wedge-shaped positioning block faces the limiting guide groove; the limiting arc surface is arranged to abut against the upper part of the abutting arc surface; One end of the flexible abutment block is provided with an abutment slope, and the abutment slope is elastically abutted with the lower part of the abutment arc surface; The second pin secondary bending assembly includes a forming push cylinder, a second forming die base connected to the output end of the forming push cylinder, and a flexible pressing block elastically connected to the second forming die base; The front end of the second forming die base is provided with a forming bending groove extending along a preset bending track; the front side of the flexible pressing block is provided with a forming pressing groove adapted to the forming bending groove, and the rear side of the flexible pressing block is provided with a buffer cylinder; During operation, the forming push cylinder drives the second forming die base to move toward the second pin, driving the flexible pressure block to move synchronously until the rear side of the flexible pressure block abuts against the output end of the buffer cylinder; at this time, the forming pressure groove on the front side of the flexible pressure block and the forming bending groove of the second forming die base are closed to form a bending cavity adapted to the second pin, and the second pin is plastically deformed along the trajectory of the forming bending groove through elastic pressure.

6. The electronic component processing equipment according to claim 1, characterized in that: The first sleeve device is used to perform a sleeve operation on the first pin of the electronic component, and includes a tube feeding assembly, a tube pulling assembly, a cutting blade, and a tube clamping assembly; The pipe feeding assembly is used to feed continuous pipe to the pipe traction assembly; the pipe traction assembly includes a traction drive motor, a first transmission gear, a second transmission gear, a first roller, and a second roller; the output shaft of the traction drive motor is connected to the first transmission gear, the first transmission gear is meshed with the second transmission gear, the shaft end of the first transmission gear is connected to the first roller, and the shaft end of the second transmission gear is connected to the second roller; the circumferential surface of the first roller is provided with a traction guide groove adapted to the outer diameter of the pipe; The cutting blade is used to cut the pipe between the pipe pulling assembly and the pipe clamping assembly; The pipe clamping assembly includes two meshed pipe clamping jaws, and the centers of the two pipe clamping jaws are provided with a pipe through-hole for the pipe to pass through; The second sleeve device is used to perform a sleeve operation on the second pin of the electronic component, and its structure is the same as that of the first sleeve device.

7. The electronic component processing equipment according to claim 1, characterized in that: The tube pressing device includes two elastic tube pressing heads and a tube pressing die base arranged opposite to each other; the elastic tube pressing head is provided with a front pressing surface on a side close to the tube pressing die base; the tube pressing die base is provided with a pressing groove adapted to the front pressing surface, and the tube pressing die base is provided with a receiving groove perpendicularly connected to the pressing groove, the receiving groove being used to receive the pins of the electronic components and the sleeves sleeved on the pins; the elastic tube pressing head is used to move toward the tube pressing die base under the action of a driving mechanism, and the sleeves are pressed tightly onto the pins through the cooperation between the front pressing surface and the pressing groove; The pin cutting device is arranged at the downstream station of the tube pressing device, and is used to cut and trim the pins and sleeves under the action of the driving mechanism; a third heat shrinking device is provided on the opposite side of the pin cutting device, and the third heat shrinking device is used to heat shrink and fix the sleeve at one end of the pin close to the electronic component.

8. The electronic component processing equipment according to claim 1, characterized in that: The first heat shrink device is used to further heat shrink and fix the sleeve of the pin, and includes a first heating component and a first heat flow guide component; the first heating component is used to generate and transport a hot air flow; the first heat flow guide component includes a first air guide channel and a first air outlet, the first air guide channel is connected to the first heating component, and the first air outlet is arranged toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation; The second heat shrink device is used to further heat shrink and fix the sleeve of the pin, and it includes a second heating component and a second heat flow guide component; the second heating component is used to generate and transport hot air flow; the second heat flow guide component includes a second air guide channel and a second air outlet, the second air guide channel is connected to the first heating component, and the second air outlet is arranged toward the sleeve to be heat shrunk, and is used to guide the hot air flow to the surface of the sleeve to achieve heat shrinkage and fixation.

9. The electronic component processing equipment according to claim 1, characterized in that: The second transfer device is used to transfer the electronic components processed by the second processing turntable to the unloading mechanism. The second transfer device is connected to a clamping and flipping assembly, which includes two flipping jaws arranged opposite to each other and a flip driving assembly connected to the flipping jaws; the flip driving assembly includes two flipping clamps, a flip cylinder, a flip transmission rack and a flip transmission gear; the two flip clamps are respectively rotatably connected to the two flip clamps, and the two flip clamps are connected by a guide shaft; the output end of the flip cylinder is connected to the flip transmission rack; the flip transmission rack is meshed and transmission-connected with the flip transmission gear; the flip transmission gear is transmission-connected to one of the flip clamps; The flip drive cylinder drives the flip transmission rack to move linearly, and the flip transmission gear drives the flip clamp to rotate around the axis relative to the flip clamp claw, thereby realizing a 180° flip of the electronic component.

10. The electronic component processing equipment according to claim 1, characterized in that: The blanking mechanism includes a positioning and cutting component and a blanking manipulator provided on one side of the positioning and cutting component; the positioning and cutting component includes a blanking turntable, and positioning stations, cutting stations, inspection stations, and blanking stations arranged in sequence along the circumference of the blanking turntable; The unloading turntable is used to rotate the electronic components to each station in sequence; the positioning station includes a positioning air gripper, which is used to clamp the pins of the electronic components and adjust their position and posture; the cutting station includes a cutter assembly, which is used to cut and trim the pins of the electronic components; The detection station includes a position sensor, which is used to detect the position of the electronic component; The blanking station is used for the clamping claws of the blanking manipulator to grab the processed electronic components; The end of the unloading robot is connected to a tray for storing electronic components, and a lifting unloading assembly is provided at the bottom of the tray. The lifting unloading assembly is used to drive the tray full of electronic components to a preset height for closing and unloading.