Optocoupler SMD LED device and preparation method thereof

Abstract

The invention provides an optocoupler SMD LED device and a preparation method thereof. The preparation method comprises the following steps: S1, preparing a light-emitting component and a photosensitive component, wherein the side walls of the light-emitting component and the photosensitive component are provided with packaging pins; s2, preparing an optocoupler device substrate, and arranging second pins on the optocoupler device substrate; s3, oppositely welding the light-emitting component and the photosensitive component on the second pin; s4, carrying out mold pressing of black glue on the outer sides of the light-emitting part and the photosensitive part to form a light-proof sealing layer; the transmitting chip and the receiving chip are oppositely arranged, so that the transmission efficiency is stable.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic devices, and in particular to an optical coupler SMD LED device and a preparation method thereof. Background Art

[0002] The existing optocoupler packaging process is relatively complex, typically requiring the light-emitting chip and the photosensitive chip to be fixed on two separate lead frames, and then precisely aligned and positioned to ensure that the two chips are arranged in an up-and-down facing manner. This process requires very high alignment accuracy, resulting in low production efficiency and high loss costs. For example, patent CN116313841A discloses a high-reliability, small-size, controllable transmission ratio optocoupler packaging method and packaging structure. The method includes the following steps: wiring conductors on the surfaces of a first substrate and a second substrate, respectively, according to the model of the optocoupler device; bonding the light emitter to the first substrate and the light receiver to the second substrate, with the light emitter and the light receiver positioned opposite each other; electrically interconnecting the first substrate and the light emitter, and electrically interconnecting the second substrate and the light receiver; bonding an integrated enclosure to the second substrate; adjusting the optocoupler transmission ratio by adjusting the height of the integrated enclosure and the bonding position of the light emitter; and bonding the first substrate to the integrated enclosure to complete the optocoupler packaging. By adjusting the height of the integrated frame and the bonding position of the light emitter, the optocoupler transmission ratio can be adjusted to achieve precise control of the optocoupler transmission ratio, effectively improving the reliability of the optocoupler during operation. However, placing the transmitting chip and the receiving chip one above the other requires high alignment accuracy, and the input and output pins are not on the same plane, making the device difficult to use. For example, patent CN116130476A relates to a planar optocoupler isolation packaging structure and its packaging process. The packaging structure includes an optical coupling module, a first substrate, a second substrate for packaging the optical coupling module together, a metal wiring layer for interconnecting the chips, and a passivation layer for isolating the optical coupling module from the metal wiring layer. The optical coupling module includes a transmitting chip, a transmitter, a receiving chip, and an optical lens. The passivation layer and the metal wiring layer together connect the chip signals. The structure of the present invention is completely different from that of traditional optocoupler devices. It can realize single-channel or multi-channel optocoupler isolation, with good optical isolation effect between channels, small packaging structure, high reliability and low cost. It is completely different from the traditional optocoupler packaging process. The packaging process is simple and efficient, greatly reducing costs and improving isolation reliability and isolation performance. However, the optical signal of the transmitting device is reflected by the lens, resulting in poor consistency of optocoupler transmission efficiency between devices. Summary of the Invention

[0003] The present invention solves the problems of complex optocoupler packaging process and poor consistency of optocoupler transmission efficiency, proposes an optocoupler SMD LED device and a preparation method thereof, places the transmitting chip and the receiving chip opposite to each other, and stabilizes the transmission efficiency.

[0004] In order to achieve the above objectives, the following technical solutions are proposed: A method for preparing an optical coupler SMD LED device comprises the following steps: S1, preparing a light-emitting component and a photosensitive component with packaging pins on the side walls; S2, preparing an optocoupler device substrate, so that a second pin is arranged on the optocoupler device substrate; S3, soldering the light-emitting component and the photosensitive component to the second pin opposite to each other; S4, black glue is molded on the outer sides of the light-emitting component and the photosensitive component to form a light-proof sealing layer.

[0005] The present invention provides packaging pins on the side walls of the light-emitting component and the photosensitive component, facilitating welding of the light-emitting component and the photosensitive component to the optocoupler device substrate, simplifying the production process and significantly reducing costs. The present invention places the light-emitting component and the photosensitive component opposite each other, ensuring stable transmission efficiency.

[0006] Preferably, the S1 comprises the following steps: S101, providing a plurality of first pins and pads on a PCB substrate; S102, opening a plurality of through holes on the first pin and filling the through holes with tin metal; S103, die-bonding an optocoupler chip onto the pad and completing wire bonding between the optocoupler chip and the first pin, wherein the optocoupler chip includes a light-emitting chip and a photosensitive chip; S104, performing molding and sealing on the PCB substrate to obtain a chip assembly with an external sealing body; S105, cutting the chip assembly so that the tin metal is flat and exposed on the outside to form packaging pins, obtaining cut monomers, wherein the cut monomers encapsulating the light-emitting chip serve as the light-emitting component, and the cut monomers encapsulating the photosensitive chip serve as the photosensitive component.

[0007] Since the through hole is filled with tin metal in advance, the hole wall after cutting can be used as a welding pad of the device.

[0008] Preferably, the S1 comprises the following steps: S101, providing a plurality of first pins and pads on a PCB substrate; S102, opening a plurality of resin semi-plugged holes on the first pin and tinning or silver-plating the hole walls of the resin semi-plugged holes; S103, die-bonding an optocoupler chip onto the pad and completing wire bonding between the optocoupler chip and the first pin, the optocoupler chip including a light-emitting chip and a photosensitive chip; S104, performing molding and sealing on the PCB substrate to obtain a chip assembly with an external sealing body; S105, cutting the chip assembly so that the tinned or silver-plated hole wall of the resin half-plug hole is flat and exposed on the outside to form the package pin, and obtaining a cutting monomer. The cutting monomer encapsulating the light-emitting chip is used as the light-emitting component, and the cutting monomer encapsulating the photosensitive component is used as the photosensitive component.

[0009] The through holes of the light-emitting component and the photosensitive component of the present invention are semi-plugged holes with resin. In the semi-plugged holes with resin solution, the hole walls are tinned or silver-plated before being cut into individual devices to form solderable pins.

[0010] Preferably, the S3 specifically includes the following steps: welding the light-emitting component and the photosensitive component relative to each other on the second lead pin with the distance between the light-emitting component and the photosensitive component being less than or equal to 0.05 mm.

[0011] The present invention places the light-emitting component and the photosensitive component opposite to each other, and the transmission efficiency is stable.

[0012] Preferably, in said S3, the maximum temperature of the welding furnace in which the light-emitting component and the photosensitive component are welded to the second lead pin is controlled to be 270°C±5°C.

[0013] When S3 of the present invention is welded, the maximum temperature of the welding furnace is controlled at 270°C±5°C. During the welding process, the outer layers of the outer sealing colloids of the light-emitting component and the photosensitive component will soften and contact each other to form an inseparable whole, that is, a transparent light channel. Therefore, there is no need to fill other glue between the light-emitting component and the photosensitive component.

[0014] Preferably, the soldering method of S3 is: fixing the light-emitting component and the photosensitive component to the optocoupler device substrate after reflow soldering through solder paste.

[0015] An optocoupler SMD LED device adopts the above-mentioned method for preparing an optocoupler SMD LED device, including an optocoupler device substrate provided with a second pin, a light-emitting component, and a photosensitive component. The light-emitting component and the photosensitive component are relatively welded on the second pin through the packaging pins arranged on the side. The light-emitting component and the photosensitive component are in contact with each other through an external sealing colloid to form a transparent light channel. The outer side of the overall device is encapsulated with an opaque sealing layer.

[0016] Preferably, the light-emitting component includes a PCB substrate provided with a solder pad and a first pin, a light-emitting chip is encapsulated on the solder pad, the light-emitting chip is connected to the first pin by a solder wire, the first pin extends to a groove on the outer wall of the light-emitting component, the groove is provided with a tin metal connected to the first pin, the tin metal serves as a packaging pin on the side of the light-emitting component, the outside of the light-emitting chip is encapsulated with an external sealing colloid, and the photosensitive component is consistent with the light-emitting component except that the photosensitive chip is encapsulated on the solder pad.

[0017] Preferably, the optocoupler device substrate is made of the same material as the PCB substrate, the first pin, the second pin and the pad are gold-plated, silver-plated or tin-plated, and the thickness of the optocoupler device substrate is in the range of 0.1 mm-1.0 mm.

[0018] Preferably, the outer sealing colloid is a thermoplastic glue that begins to slowly soften or liquefy above 260°C.

[0019] The beneficial effects of the present invention are: 1. The transmitting chip and the receiving chip are placed opposite to each other, and the transmission efficiency is stable; 2. The device is easy to use; 3. The production process is simple, which greatly reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the photosensitive component or light-emitting component before cutting of the present invention.

[0021] Figure 2 It is a schematic diagram of the cutting position of the present invention and the photosensitive component or light-emitting component monomer after cutting.

[0022] Figure 3 It is a schematic diagram of the installation positions of the photosensitive component and the light-emitting component of the present invention.

[0023] Figure 4 It is a schematic diagram of welding and packaging of the photosensitive component and the light-emitting component of the present invention.

[0024] Among them: 1. PCB substrate; 2. First pin; 3. Tin metal; 4. Optocoupler chip; 5. Cutting unit; 6. External sealing colloid; 7. Optocoupler device substrate; 8. Second pin; 9. Light-proof sealing layer; 41. Light-emitting chip; 42. Photosensitive chip; 51. Light-emitting component; 52. Photosensitive component. DETAILED DESCRIPTION

[0025] Example 1: This embodiment provides a method for preparing an optically coupled SMD LED device, comprising the following steps: S1, first prepare a photosensitive component 52 and a light-emitting component 51 with packaging pins on the side walls; S1 of the present invention specifically comprises the following steps: S101, reference Figure 1 , a number of first pins 2 and pads are etched on the PCB substrate 1, and some of the first pins 2 are connected to the pads; S102, then opening a plurality of through holes on some of the first pins 2, and then filling the through holes with tin metal 3, so that the tin metal 3 is in contact with and connected to the first pins 2; S103 , then die-bonding the optocoupler chip 4 on the pad, where the optocoupler chip 4 is a light-emitting chip 41 or a photosensitive chip 42 , and completing the wire bonding between the light-emitting chip 41 or the photosensitive chip 42 and the first pin 2 .

[0026] S104, performing molding and sealing on the PCB substrate 1 to form a chip assembly with an outer sealing body 6, wherein the outer sealing body 6 covers the light-emitting chip 41 or the photosensitive chip 42; S105, according to Figure 2 The cutting method shown is used to cut the chip assembly, so that the tin metal 3 is exposed flatly on the outside of the cutting unit 5 to form the packaging pins. The cutting unit 5 encapsulating the light-emitting chip 41 becomes the light-emitting component 51, and the cutting unit 5 encapsulating the photosensitive chip 42 becomes the photosensitive component 52.

[0027] Since the through hole is filled with tin metal in advance, the hole wall after cutting can be used as a welding pad of the device.

[0028] S2, then preparing an optocoupler device substrate 7, on which a second pin 8 for welding to the photosensitive component 52 and the light-emitting component 51 is arranged; S3, then solder the photosensitive component 52 and the light-emitting component 51 to the second pin 8; refer to Figure 3 S3 of the present invention specifically includes the following steps: Light-emitting component 51 and photosensitive component 52 are soldered relative to second lead pin 8 of optocoupler substrate 7 to form a transmitting point and a receiving point. Based on design requirements, the spacing L between light-emitting component 51 and photosensitive component 52 is controlled to be L ≤ 0.05 mm. This arrangement of light-emitting component 51 and photosensitive component 52 relative to each other ensures stable transmission efficiency.

[0029] The specific welding method S3 of the present invention is to reflow the photosensitive component 52 and the light-emitting component 51 through solder paste, and then fix them to the second lead pin 8 of the substrate 7 of the optocoupler device.

[0030] S4, finally, black glue is molded on the outer sides of the photosensitive component 52 and the light-emitting component 51, that is, the outer side of the entire device to form an opaque sealing layer.

[0031] The present invention provides packaging pins on the side walls of the light-emitting component 51 and the photosensitive component 52, which facilitates welding of the light-emitting component 51 and the photosensitive component 52 to the optocoupler device substrate 7, simplifies the production process, and greatly reduces costs.

[0032] This embodiment proposes an optocoupler SMD LED device, which uses the above-mentioned method for preparing an optocoupler SMD LED device, including an optocoupler device substrate 7, a light-emitting component 51, and a photosensitive component 52. The optocoupler device substrate 7 is provided with a second pin 8. The sides of the light-emitting component 51 and the photosensitive component 52 are both provided with packaging pins. The light-emitting component 51 and the photosensitive component 52 are soldered to the second pin 8 via the packaging pins. The light-emitting component 51 and the photosensitive component 52 are arranged relative to each other. The outer sides of the light-emitting component 51 and the photosensitive component 52 are both provided with an external sealing colloid 6, and the external sealing colloid 6 contacts each other to form a transparent light channel. The present invention also encapsulates an opaque sealing layer 9 on the outer side of the entire device. The present invention places the light-emitting component 51 and the photosensitive component 52 relative to each other, and the transmission efficiency is stable.

[0033] The photosensitive component 52 of the present invention includes a PCB substrate 1 provided with a first pin 2 and a soldering pad, a photosensitive chip 42 is encapsulated on the soldering pad, the photosensitive chip 42 is connected to the first pin 2 with a solder wire, the first pin 2 extends to the groove on the outer wall of the photosensitive component 52, a tin metal 3 is provided on the groove, the tin metal 3 is connected to the first pin 2, the tin metal 3 serves as the encapsulation pin on the side of the photosensitive component 52, the outer side of the photosensitive chip 42 is encapsulated with an external sealing colloid 6, and the light-emitting component 51 is consistent with the photosensitive component 52 except that the light-emitting chip 41 is encapsulated on the soldering pad.

[0034] Example 2: This embodiment optimizes S3 based on embodiment 1 and proposes a method for preparing an optocoupler SMD LED device, including the following steps: S1, first prepare a photosensitive component 52 and a light-emitting component 51 with packaging pins on the side walls; S1 of the present invention specifically comprises the following steps: S101, reference Figure 1 , a number of first pins 2 and pads are etched on the PCB substrate 1, and some of the first pins 2 are connected to the pads; S102, then opening a plurality of through holes on some of the first pins 2, and then filling the through holes with tin metal 3, so that the tin metal 3 is in contact with and connected to the first pins 2; S103 , then die-bonding the optocoupler chip 4 on the pad, where the optocoupler chip 4 is a light-emitting chip 41 or a photosensitive chip 42 , and completing the wire bonding between the light-emitting chip 41 or the photosensitive chip 42 and the first pin 2 .

[0035] S104, performing molding and sealing on the PCB substrate 1 to form a chip assembly with an outer sealing body 6, wherein the outer sealing body 6 covers the light-emitting chip 41 or the photosensitive chip 42; S105, according to Figure 2The cutting method shown is used to cut the chip assembly, so that the tin metal 3 is exposed flatly on the outside of the cutting unit 5 to form the packaging pins. The cutting unit 5 encapsulating the light-emitting chip 41 becomes the light-emitting component 51, and the cutting unit 5 encapsulating the photosensitive chip 42 becomes the photosensitive component 52.

[0036] Since the through hole is filled with tin metal in advance, the hole wall after cutting can be used as a welding pad of the device.

[0037] S2, then preparing an optocoupler device substrate 7, on which a second pin 8 for welding to the photosensitive component 52 and the light-emitting component 51 is arranged; S3, then solder the photosensitive component 52 and the light-emitting component 51 to the second pin 8; refer to Figure 3 S3 of the present invention specifically includes the following steps: Light-emitting component 51 and photosensitive component 52 are soldered relative to second lead pin 8 of optocoupler substrate 7 to form a transmitting point and a receiving point. Based on design requirements, the spacing L between light-emitting component 51 and photosensitive component 52 is controlled to be L ≤ 0.05 mm. This arrangement of light-emitting component 51 and photosensitive component 52 relative to each other ensures stable transmission efficiency.

[0038] The specific welding method S3 of the present invention is to reflow the photosensitive component 52 and the light-emitting component 51 through solder paste, and then fix them to the second lead pin 8 of the substrate 7 of the optocoupler device.

[0039] refer to Figure 4 When S3 of the present invention is welded, the maximum temperature of the welding furnace is controlled at 270℃±5℃. During the welding process, the outer layer of the outer sealing colloid 6 of the light-emitting component 51 and the photosensitive component 52 will soften and contact each other to form an inseparable whole, that is, a transparent light channel. Therefore, there is no need to fill other glue between the light-emitting component 51 and the photosensitive component 52.

[0040] S4, finally, black glue is molded on the outer sides of the photosensitive component 52 and the light-emitting component 51, that is, the outer side of the entire device to form an opaque sealing layer.

[0041] The present invention provides packaging pins on the side walls of the light-emitting component 51 and the photosensitive component 52, which facilitates welding of the light-emitting component 51 and the photosensitive component 52 to the optocoupler device substrate 7, simplifies the production process, and greatly reduces costs.

[0042] This embodiment proposes an optocoupler SMD LED device, which uses the above-mentioned method for preparing an optocoupler SMD LED device, including an optocoupler device substrate 7, a light-emitting component 51, and a photosensitive component 52. The optocoupler device substrate 7 is provided with a second pin 8. The sides of the light-emitting component 51 and the photosensitive component 52 are both provided with packaging pins. The light-emitting component 51 and the photosensitive component 52 are soldered to the second pin 8 via the packaging pins. The light-emitting component 51 and the photosensitive component 52 are arranged relative to each other. The outer sides of the light-emitting component 51 and the photosensitive component 52 are both provided with an external sealing colloid 6, and the external sealing colloid 6 contacts each other to form a transparent light channel. The present invention also encapsulates an opaque sealing layer 9 on the outer side of the entire device. The present invention places the light-emitting component 51 and the photosensitive component 52 relative to each other, and the transmission efficiency is stable.

[0043] The photosensitive component 52 of the present invention includes a PCB substrate 1 provided with a first pin 2 and a soldering pad, a photosensitive chip 42 is encapsulated on the soldering pad, the photosensitive chip 42 is connected to the first pin 2 with a solder wire, the first pin 2 extends to the groove on the outer wall of the photosensitive component 52, a tin metal 3 is provided on the groove, the tin metal 3 is connected to the first pin 2, the tin metal 3 serves as the encapsulation pin on the side of the photosensitive component 52, the outer side of the photosensitive chip 42 is encapsulated with an external sealing colloid 6, and the light-emitting component 51 is consistent with the photosensitive component 52 except that the light-emitting chip 41 is encapsulated on the soldering pad.

[0044] The outer sealing colloid 6 of the light emitting component 51 and the photosensitive component 52 of the present invention is thermoplastic glue, and the outer sealing colloid 6 will begin to slowly soften or liquefy at a temperature above 260°C.

[0045] Example 3: This embodiment optimizes the optocoupler device substrate 7 based on Example 2, and proposes a method for preparing an optocoupler SMD LED device, including the following steps: S1, first prepare a photosensitive component 52 and a light-emitting component 51 with packaging pins on the side walls; S1 of the present invention specifically comprises the following steps: S101, reference Figure 1 , a number of first pins 2 and pads are etched on the PCB substrate 1, and some of the first pins 2 are connected to the pads; S102, then opening a plurality of through holes on some of the first pins 2, and then filling the through holes with tin metal 3, so that the tin metal 3 is in contact with and connected to the first pins 2; S103 , then die-bonding the optocoupler chip 4 on the pad, where the optocoupler chip 4 is a light-emitting chip 41 or a photosensitive chip 42 , and completing the wire bonding between the light-emitting chip 41 or the photosensitive chip 42 and the first pin 2 .

[0046] S104, performing molding and sealing on the PCB substrate 1 to form a chip assembly with an outer sealing body 6, wherein the outer sealing body 6 covers the light-emitting chip 41 or the photosensitive chip 42; S105, according to Figure 2 The cutting method shown is used to cut the chip assembly, so that the tin metal 3 is exposed flatly on the outside of the cutting unit 5 to form the packaging pins. The cutting unit 5 encapsulating the light-emitting chip 41 becomes the light-emitting component 51, and the cutting unit 5 encapsulating the photosensitive chip 42 becomes the photosensitive component 52.

[0047] Since the through hole is filled with tin metal in advance, the hole wall after cutting can be used as a welding pad of the device.

[0048] S2, then preparing an optocoupler device substrate 7, on which a second pin 8 for welding to the photosensitive component 52 and the light-emitting component 51 is arranged; S3, then solder the photosensitive component 52 and the light-emitting component 51 to the second pin 8; refer to Figure 3 S3 of the present invention specifically includes the following steps: Light-emitting component 51 and photosensitive component 52 are soldered relative to second lead pin 8 of optocoupler substrate 7 to form a transmitting point and a receiving point. Based on design requirements, the spacing L between light-emitting component 51 and photosensitive component 52 is controlled to be L ≤ 0.05 mm. This arrangement of light-emitting component 51 and photosensitive component 52 relative to each other ensures stable transmission efficiency.

[0049] The specific welding method S3 of the present invention is to reflow the photosensitive component 52 and the light-emitting component 51 through solder paste, and then fix them to the second lead pin 8 of the substrate 7 of the optocoupler device.

[0050] refer to Figure 4 When S3 of the present invention is welded, the maximum temperature of the welding furnace is controlled at 270℃±5℃. During the welding process, the outer layer of the outer sealing colloid 6 of the light-emitting component 51 and the photosensitive component 52 will soften and contact each other to form an inseparable whole, that is, a transparent light channel. Therefore, there is no need to fill other glue between the light-emitting component 51 and the photosensitive component 52.

[0051] S4, finally, black glue is molded on the outer sides of the photosensitive component 52 and the light-emitting component 51, that is, the outer side of the entire device to form an opaque sealing layer.

[0052] The present invention provides packaging pins on the side walls of the light-emitting component 51 and the photosensitive component 52, which facilitates welding of the light-emitting component 51 and the photosensitive component 52 to the optocoupler device substrate 7, simplifies the production process, and greatly reduces costs.

[0053] This embodiment proposes an optocoupler SMD LED device, which uses the above-mentioned method for preparing an optocoupler SMD LED device, including an optocoupler device substrate 7, a light-emitting component 51, and a photosensitive component 52. The optocoupler device substrate 7 is provided with a second pin 8. The sides of the light-emitting component 51 and the photosensitive component 52 are both provided with packaging pins. The light-emitting component 51 and the photosensitive component 52 are soldered to the second pin 8 via the packaging pins. The light-emitting component 51 and the photosensitive component 52 are arranged relative to each other. The outer sides of the light-emitting component 51 and the photosensitive component 52 are both provided with an external sealing colloid 6, and the external sealing colloid 6 contacts each other to form a transparent light channel. The present invention also encapsulates an opaque sealing layer 9 on the outer side of the entire device. The present invention places the light-emitting component 51 and the photosensitive component 52 relative to each other, and the transmission efficiency is stable.

[0054] The photosensitive component 52 of the present invention includes a PCB substrate 1 provided with a first pin 2 and a soldering pad, a photosensitive chip 42 is encapsulated on the soldering pad, the photosensitive chip 42 is connected to the first pin 2 with a solder wire, the first pin 2 extends to the groove on the outer wall of the photosensitive component 52, a tin metal 3 is provided on the groove, the tin metal 3 is connected to the first pin 2, the tin metal 3 serves as the encapsulation pin on the side of the photosensitive component 52, the outer side of the photosensitive chip 42 is encapsulated with an external sealing colloid 6, and the light-emitting component 51 is consistent with the photosensitive component 52 except that the light-emitting chip 41 is encapsulated on the soldering pad.

[0055] The optocoupler device substrate 7 of the present invention is made of the same material as the PCB substrate 1 and the material is not limited. The thickness is in the range of 0.1mm-1.0mm and the color is not limited. The second pin 8 on the optocoupler device substrate 7 and the first pin 2 and the pad on the PCB substrate 1 are gold-plated, silver-plated or tin-plated.

[0056] The outer sealing colloid 6 of the light emitting component 51 and the photosensitive component 52 of the present invention is thermoplastic glue, and the outer sealing colloid 6 will begin to slowly soften or liquefy at a temperature above 260°C.

[0057] Example 4: This embodiment replaces S1 with the solution in Embodiment 3 and proposes a method for preparing an optocoupler SMD LED device, including the following steps: S1, first prepare a photosensitive component 52 and a light-emitting component 51 with packaging pins on the side walls; S1 of the present invention specifically comprises the following steps: S101, reference Figure 1 , a number of first pins 2 and pads are etched on the PCB substrate 1, and some of the first pins 2 are connected to the pads; S102, a plurality of resin semi-plug holes are then formed on some of the first pins 2, and the hole walls of the resin semi-plug holes are tinned or silver-plated so that the tinned or silver-plated holes are in contact with the first pins 2; S103 , then die-bonding the optocoupler chip 4 on the pad, where the optocoupler chip 4 is a light-emitting chip 41 or a photosensitive chip 42 , and completing the wire bonding between the light-emitting chip 41 or the photosensitive chip 42 and the first pin 2 .

[0058] S104, performing molding and sealing on the PCB substrate 1 to form a chip assembly with an outer sealing body 6, wherein the outer sealing body 6 covers the light-emitting chip 41 or the photosensitive chip 42; S105, according to Figure 2 The cutting method shown is used to cut the chip assembly, so that the tin-plated or silver-plated hole wall of the resin semi-plug hole is flatly exposed on the outside of the cutting unit 5 to form a packaging pin. The cutting unit 5 encapsulating the light-emitting chip 41 becomes the light-emitting component 51, and the cutting unit 5 encapsulating the photosensitive chip 42 becomes the photosensitive component 52.

[0059] The through holes of the light-emitting component 51 and the photosensitive component 52 of the present invention are semi-plugged holes with resin. In the semi-plugged holes with resin solution, the hole walls are tinned or silver-plated before being cut into individual devices to form solderable pins.

[0060] S2, then preparing an optocoupler device substrate 7, on which a second pin 8 for welding to the photosensitive component 52 and the light-emitting component 51 is arranged; S3, then solder the photosensitive component 52 and the light-emitting component 51 to the second pin 8; refer to Figure 3 S3 of the present invention specifically includes the following steps: Light-emitting component 51 and photosensitive component 52 are soldered relative to second lead pin 8 of optocoupler substrate 7 to form a transmitting point and a receiving point. Based on design requirements, the spacing L between light-emitting component 51 and photosensitive component 52 is controlled to be L ≤ 0.05 mm. This arrangement of light-emitting component 51 and photosensitive component 52 relative to each other ensures stable transmission efficiency.

[0061] The specific welding method S3 of the present invention is to reflow the photosensitive component 52 and the light-emitting component 51 through solder paste, and then fix them to the second lead pin 8 of the substrate 7 of the optocoupler device.

[0062] refer to Figure 4 When S3 of the present invention is welded, the maximum temperature of the welding furnace is controlled at 270℃±5℃. During the welding process, the outer layer of the outer sealing colloid 6 of the light-emitting component 51 and the photosensitive component 52 will soften and contact each other to form an inseparable whole, that is, a transparent light channel. Therefore, there is no need to fill other glue between the light-emitting component 51 and the photosensitive component 52.

[0063] S4, finally, black glue is molded on the outer sides of the photosensitive component 52 and the light-emitting component 51, that is, the outer side of the entire device to form an opaque sealing layer.

[0064] The present invention provides packaging pins on the side walls of the light-emitting component 51 and the photosensitive component 52, which facilitates welding of the light-emitting component 51 and the photosensitive component 52 to the optocoupler device substrate 7, simplifies the production process, and greatly reduces costs.

[0065] This embodiment proposes an optocoupler SMD LED device, which uses the above-mentioned method for preparing an optocoupler SMD LED device, including an optocoupler device substrate 7, a light-emitting component 51, and a photosensitive component 52. The optocoupler device substrate 7 is provided with a second pin 8. The sides of the light-emitting component 51 and the photosensitive component 52 are both provided with packaging pins. The light-emitting component 51 and the photosensitive component 52 are soldered to the second pin 8 via the packaging pins. The light-emitting component 51 and the photosensitive component 52 are arranged relative to each other. The outer sides of the light-emitting component 51 and the photosensitive component 52 are both provided with an external sealing colloid 6, and the external sealing colloid 6 contacts each other to form a transparent light channel. The present invention also encapsulates an opaque sealing layer 9 on the outer side of the entire device. The present invention places the light-emitting component 51 and the photosensitive component 52 relative to each other, and the transmission efficiency is stable.

[0066] The photosensitive component 52 of the present invention includes a PCB substrate 1 provided with a first pin 2 and a soldering pad, a photosensitive chip 42 is encapsulated on the soldering pad, the photosensitive chip 42 is connected to the first pin 2 with a solder wire, the first pin 2 extends to the semi-plug hole groove on the outer wall of the photosensitive component 52, the semi-plug hole groove is provided with a tin-plated or silver-plated structure, the tin-plated or silver-plated structure is connected to the first pin 2, the tin-plated or silver-plated structure serves as the encapsulation pin on the side of the photosensitive component 52, the outer side of the photosensitive chip 42 is encapsulated with an external sealing colloid 6, and the light-emitting component 51 is consistent with the photosensitive component 52 except that the light-emitting chip 41 is encapsulated on the soldering pad.

[0067] The optocoupler device substrate 7 of the present invention is made of the same material as the PCB substrate 1 and the material is not limited. The thickness is in the range of 0.1mm-1.0mm and the color is not limited. The second pin 8 on the optocoupler device substrate 7 and the first pin 2 and the pad on the PCB substrate 1 are gold-plated, silver-plated or tin-plated.

[0068] The outer sealing colloid 6 of the light emitting component 51 and the photosensitive component 52 of the present invention is thermoplastic glue, and the outer sealing colloid 6 will begin to slowly soften or liquefy at a temperature above 260°C.

Claims

1. A method for preparing an optocoupler SMD LED device, characterized in that: The following steps are involved: S1, preparing a light-emitting component (51) and a photosensitive component (52) with packaging pins provided on the side walls; S2, preparing an optocoupler device substrate (7), so that a second pin (8) is arranged on the optocoupler device substrate (7); S3, welding the light-emitting component (51) and the photosensitive component (52) relative to each other on the second pin (8); S4, black glue is molded on the outer sides of the light-emitting component (51) and the photosensitive component (52) to form a light-proof sealing layer.

2. The method for preparing an optical coupler SMD LED device according to claim 1, wherein: Said S1 comprises the following steps: S101, a plurality of first pins (2) and pads are provided on a PCB substrate (1); S102, opening a plurality of through holes on the first pin (2), and filling the through holes with tin metal (3); S103, die-bonding the optocoupler chip (4) on the pad and completing wire bonding between the optocoupler chip (4) and the first pin (2), wherein the optocoupler chip (4) includes a light-emitting chip (41) and a photosensitive chip (42); S104, performing molding and sealing on the PCB substrate (1) to obtain a chip assembly with an outer sealing body (6); S105, cutting the chip assembly so that the tin metal (3) is flatly exposed on the outside to form a package pin, and obtaining a cut monomer (5). The cut monomer (5) encapsulating the light-emitting chip (41) serves as a light-emitting component (51), and the cut monomer (5) encapsulating the photosensitive chip (42) serves as a photosensitive component (52).

3. The method for preparing an optical coupler SMD LED device according to claim 1, wherein: Said S1 comprises the following steps: S101, a plurality of first pins (2) and pads are provided on a PCB substrate (1); S102, opening a plurality of resin semi-plug holes on the first pin (2), and performing tin plating or silver plating on the hole walls of the resin semi-plug holes; S103, die-bonding the optocoupler chip (4) on the pad and completing wire bonding between the optocoupler chip (4) and the first pin (2), wherein the optocoupler chip (4) includes a light-emitting chip (41) and a photosensitive chip (42); S104, performing molding and sealing on the PCB substrate (1) to obtain a chip assembly with an outer sealing body (6); S105, cutting the chip assembly so that the tinned or silver-plated hole wall of the resin half-plug hole is flat and exposed on the outside to form a package pin, thereby obtaining a cut monomer (5), wherein the cut monomer (5) encapsulating the light-emitting chip (41) serves as the light-emitting component (51), and the cut monomer (5) encapsulating the photosensitive component (52) serves as the photosensitive component (52).

4. The method for preparing an optical coupler SMD LED device according to claim 1, wherein: Said S3 specifically comprises the following steps: welding the light-emitting component (51) and the photosensitive component (52) relative to each other on the second lead pin (8), with the spacing between the light-emitting component (51) and the photosensitive component (52) being less than or equal to 0.05 mm.

5. The method for preparing an optical coupler SMD LED device according to claim 1, wherein: In the above-mentioned S3, the maximum temperature of the welding furnace in which the light-emitting component (51) and the photosensitive component (52) are relatively welded to the second lead pin (8) is controlled to be 270°C±5°C.

6. The method for preparing an optical coupler SMD LED device according to claim 1, wherein: The welding method of S3 is: fixing the light-emitting component (51) and the photosensitive component (52) to the optocoupler device substrate (7) after reflow soldering through solder paste.

7. An optocoupler SMD LED device, produced using the method for producing an optocoupler SMD LED device according to any one of claims 2 to 6, characterized in that: The invention comprises an optocoupler device substrate (7) provided with a second pin (8), a light-emitting component (51), and a photosensitive component (52); the light-emitting component (51) and the photosensitive component (52) are relatively welded on the second pin (8) via packaging pins provided on the side thereof; the light-emitting component (51) and the photosensitive component (52) are in contact with each other via an external sealing colloid (6) to form a transparent light channel; and an opaque sealing layer (9) is encapsulated on the outside of the overall device.

8. The optical coupler SMD LED device according to claim 7, characterized in that: The light-emitting component (51) comprises a PCB substrate (1) provided with a soldering pad and a first pin (2); a light-emitting chip (41) is packaged on the soldering pad; the light-emitting chip (41) is connected to the first pin (2) by a soldering wire; the first pin (2) extends to a groove on the outer wall of the light-emitting component (51); a tin metal (3) connected to the first pin (2) is provided on the groove; the tin metal (3) serves as a packaging pin on the side of the light-emitting component (51); an outer sealing colloid (6) is packaged on the outer side of the light-emitting chip (41); and the light-sensitive component (52) is consistent with the light-emitting component (51) in terms of configuration except that the light-sensitive chip (42) is packaged on the soldering pad.

9. The optical coupler SMD LED device according to claim 8, wherein: The optocoupler device substrate (7) is made of the same material as the PCB substrate (1); the first pin (2), the second pin (8) and the solder pad are gold-plated, silver-plated or tin-plated; and the thickness of the optocoupler device substrate (7) is within the range of 0.1 mm to 1.0 mm.

10. An optocoupler SMD LED device according to claim 8 or 9, characterized in that: The outer sealing colloid (6) is a thermoplastic glue that begins to slowly soften or liquefy above 260°C.

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