Character photoetching process

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly discloses a character photoetching process, which comprises the following steps of: printing characters on a surface A of a circuit board through a laser marking machine, cleaning the surface A of the circuit board subjected to laser photoetching through a non-contact cleaning device, overturning the circuit board through an overturning device, and printing the characters on a surface B of the circuit board by using the laser marking machine. Cleaning the B surface of the circuit board by using a non-contact cleaning device; the circuit board character photoetching effect can be achieved through laser photoetching of the circuit board, impurities attached to the two faces of the surface of the circuit board after laser photoetching are cleaned through the non-contact cleaning device, and pollution to the circuit board is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, in particular to a text photolithography process. Background Art

[0002] Photolithography is a very important process in semiconductor manufacturing. It is the process of transferring the pattern on the mask to the substrate through exposure. It is considered the core step in large-scale integrated circuit manufacturing. The series of complex and time-consuming photolithography processes in semiconductor manufacturing are mainly completed by corresponding exposure machines.

[0003] The problems existing in the prior art are disclosed in patent publication (announcement) number: CN116184764A, which discloses a semiconductor photolithography process including the following steps: Step 1: Preparation of substrate; Step 2: Applying photoresist; Step 3: Soft drying treatment; Step 4: Exposure and development; Step 5: Hard drying treatment. The present invention can clean particulate contamination by mechanical cleaning, and can clean inorganic and polymer deposits on the substrate by plasma stripping, so that the cleaning effect of the substrate is better, and by applying DELO-MONOPOX single-component epoxy adhesive adhesion promoter, while improving the adhesion ability of the substrate, it also has the functions of heat conduction and insulation, and then the photoresist solution is applied by the spinning method, and after soft drying, the semiconductor is exposed and developed, and finally the photolithography processing of the semiconductor is completed by hard drying treatment, so that the processing quality of the semiconductor is improved and the use of the semiconductor is convenient; it solves the problems of the prior art;

[0004] However, the text lithography process is still not as good as the traditional text printing process, and it still requires the process of glue coating, baking, exposure, and development. The disadvantages of the traditional text printing process are that the use of various main and auxiliary materials and developer solutions will produce waste water and waste liquid, which will pollute the motherboard and cause poor text printing. The baking equipment consumes a lot of electricity.

[0005] Of course, it is possible to implement the photolithography process by using specific mechanical cleaning and specific baking equipment, as disclosed in Patent Publication (Announcement) No.: CN116184764A, which discloses a semiconductor photolithography process. However, this photolithography process still requires specific inks, specific glue coatings, and specific baking equipment. It is still inevitable that the board surface will be contaminated, resulting in poor text quality, or that the specific baking equipment will cause excessive power consumption.

[0006] We urgently need a text lithography process that does not require traditional complex film production or traditional screen production, so as to solve the problems of wastewater and waste, personnel and equipment costs, excessive power consumption of specific baking equipment, and surface contamination causing text defects or defects. Summary of the Invention

[0007] The purpose of the present invention is to solve the shortcomings of the prior art and propose a text lithography process, which solves the problems raised in the above background technology through double-sided solder mask baking, board casting, character printing A-side laser lithography, contactless cleaning, flipping equipment, character printing B-side laser lithography, and contactless cleaning.

[0008] In order to achieve the above purpose, the present invention adopts the following technical solution: a text lithography process, including double-sided baking of solder mask, and also includes the following steps: step 1: board casting; step 2: laser lithography; step 3: cleaning.

[0009] As a preferred technical solution of the present invention: it also includes step four: flipping; step five: laser lithography; and step six: cleaning.

[0010] As a preferred technical solution of the present invention: in step 1, the circuit board is placed on the laser lithography machine through the board placement machine, and the circuit board is cleaned after the laser lithography.

[0011] As a preferred technical solution of the present invention: it also includes a photolithography process production line, which includes a board projection machine, a laser marking machine, a cleaning device, and a flipping device. The circuit board is sequentially photolithographically processed through the photolithography process production line.

[0012] As a preferred technical solution of the present invention: in step 2, characters are printed on surface A of the circuit board by a laser marking machine, in step 3, surface A of the circuit board after laser etching is cleaned by a contactless cleaning device, and then the circuit board is flipped over by the flipping device in step 4, and then characters are printed on surface B of the circuit board by a laser marking machine in step 5, and then surface B of the circuit board is cleaned by a contactless cleaning device in step 6.

[0013] As a preferred technical solution of the present invention: it also includes step seven: collecting the board, and storing the circuit board after the text is photoetched by using a board collecting device.

[0014] As a preferred technical solution of the present invention: the cleaning device includes a cleaning shell; a cleaning chamber is provided inside the cleaning shell, a conveying mechanism is horizontally symmetrically provided inside the cleaning chamber, and also includes a cleaning mechanism arranged on the surface of the conveying mechanism; the cleaning mechanism is sequentially provided with a vacuum adsorption group, a blowing group, a vacuum dust collection group, and an electrostatic adsorption group, and the vacuum adsorption group, the blowing group, the vacuum dust collection group, and the electrostatic adsorption group are symmetrically arranged on the surface of the conveying mechanism; the product skin passes through the cleaning mechanism through the conveying mechanism without contact.

[0015] As a preferred technical solution of the present invention, the nozzle of the blowing group is downward and inclined 10°-60° toward the dust suction group to form a blowing and suction group, and at least one blowing and suction group is arranged between the vacuum adsorption group and the electrostatic adsorption group.

[0016] As a preferred technical solution of the present invention: the cleaning mechanism is sequentially provided with a cyclone vacuum adsorption group, a first strong blowing group, a first strong vacuum cleaning group, an electrostatic adsorption group, and relatively provided with a cyclone vacuum adsorption group, a second strong blowing group, a second strong vacuum cleaning group and an electrostatic adsorption group; an ion wind outlet is provided between the first strong blowing group and the first strong vacuum cleaning group, the second strong blowing group and the second strong vacuum cleaning group located at the upper part, and a tape recovery roller is provided on the side of the electrostatic adsorption group.

[0017] As a preferred technical solution of the present invention: the conveying mechanism includes a conveying belt, an active roller, a driven roller and a transmission roller. The conveying belt is distributed in a rectangular shape, and the bottom two ends of the conveying belt are respectively conveyed by an active roller and a driven roller, and the top two ends of the conveying belt are conveyed by two transmission rollers.

[0018] As a preferred technical solution of the present invention: an ion wind static removal rod is provided at the tail end of the conveying mechanism, and an auxiliary roller is provided below the ion wind static removal rod.

[0019] As a preferred technical solution of the present invention: vacuum ports are symmetrically opened on the upper and lower sides of the cleaning chamber, and a dust suction port is opened on the surface of the cleaning shell, and the vacuum port and the dust suction port are connected to each other.

[0020] As a preferred technical solution of the present invention: an observation window is provided on the surface of the cleaning shell at a position corresponding to the cleaning cavity, and an operation display screen is provided on the surface of the cleaning shell above the observation window.

[0021] As an optimal technical solution of the present invention: a speed regulator and an air pressure regulator are provided on the surface of the cleaning shell, an emergency stop button is provided on the top side of the cleaning shell, the bottom of the cleaning shell is fixed to the ground surface through the equipment chassis, and an air switch is provided on the surface of the equipment chassis.

[0022] As a preferred technical solution of the present invention: an oil-water separator is installed on the bottom surface of the cleaning shell, and the top of the oil-water separator is connected to the inside of the cleaning chamber through a pipeline.

[0023] As a preferred technical solution of the present invention, the nozzle of the blowing group is directed toward the product surface and is inclined 36 degrees toward the center line of the nozzle of the dust collection group.

[0024] The present invention has the following beneficial effects: the present invention can realize the circuit board text lithography effect by laser lithography, clean the impurities attached to both sides of the circuit board surface after laser lithography through a contactless cleaning device, and avoid circuit board pollution; it does not require traditional complex film production methods or traditional stencil production methods, and will not cause poor or defective lithographic text due to board surface pollution; it does not require customized or traditional text post-baking technology; it solves the problems of wastewater and waste, personnel and equipment costs, excessive power consumption of specific baking equipment, and board surface pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the process of the present invention;

[0026] Figure 2 Schematic diagram of the photolithography production line of the present invention;

[0027] Figure 3 It is a front view of the cleaning device of the present invention;

[0028] Figure 4 Schematic diagram of the internal structure of the cleaning device of the present invention;

[0029] Figure 5 A side view of the cleaning device of the present invention;

[0030] Figure 6 It is a rear view of the cleaning device of the present invention.

[0031] Legend:

[0032] 101. Board ejector; 102. Laser marking machine; 103. Cleaning device; 104. Turning device; 105. Hand trigger; 1. Cleaning housing; 2. Cleaning chamber; 3. Conveyor belt; 4. Active roller; 5. Driven roller; 6. Transmission roller; 7. Cyclone vacuum adsorption group; 8. First powerful blowing group; 9. First powerful vacuum cleaning group; 10. Second powerful blowing group; 11. Second powerful vacuum cleaning group; 12. Static adsorption group; 13. Ion wind static elimination rod; 14. Auxiliary roller; 15. Vacuum port; 16. Dust removal port; 17. Observation window; 18. Operation display screen; 19. Speed ​​regulator; 20. Air pressure regulator; 21. Emergency stop button; 22. Equipment chassis; 23. Oil-water separator; 24. Air switch; 25. Ion wind outlet. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention; the terms "first", "second", and "third" are only used for descriptive purposes and should not be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or it can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] See also Figure 1-2 The present invention provides a technical solution: a text photolithography process, including double-sided solder mask baking, characterized in that it also includes the following steps: step 1: board casting, the circuit board is cast into the laser lithography through the board casting machine 101, and the circuit board is cleaned after the laser lithography; step 2: laser lithography; step 3: cleaning; also includes step 4: flipping; step 5: laser lithography; step 6: cleaning; also includes step 7: board collection, the circuit board after the text lithography is collected and stored by the board collection device 105.

[0036] The system also includes a photolithography production line, which includes a board projection machine 101, a laser marking machine 102, a cleaning device 103, and a flipping device 104. The circuit board is sequentially subjected to text photolithography through the photolithography production line. In step 2, the characters preset in the laser marking machine 102 can be printed on the A side of the circuit board by laser. In step 3, the non-contact cleaning device 103 cleans impurities or ions from the laser-etched A side of the circuit board to prevent contamination of the circuit board. In step 4, the flipping device 104 flips the circuit board over, placing the laser-etched A side of the circuit board below the B side of the circuit board. In step 5, the characters preset in the laser marking machine 102 can be printed on the B side of the circuit board by laser, thereby achieving laser photolithography on both sides of the circuit board. In step 6, the non-contact cleaning device 103 is used to clean the B side of the circuit board to achieve double-sided cleaning of the circuit board.

[0037] See also Figure 3-6 , the present invention provides a technical solution: a contactless cleaning device, comprising a cleaning shell 1; a cleaning chamber 2 is provided inside the cleaning shell 1, and a conveying mechanism is horizontally symmetrically provided inside the cleaning chamber 2. The conveying mechanism and the cleaning shell 1 are designed to be split, which can be adjusted according to the thickness of the plate and the conveying height can be adjusted. An observation window 17 is provided on the surface of the cleaning shell 1 at a position corresponding to the cleaning chamber 2, and an operation display screen 18 is provided on the surface of the cleaning shell 1 above the observation window 17. After the product enters the cleaning chamber 2, it is conveyed by the conveying mechanisms provided on the upper and lower sides to realize a contactless cleaning process. An observation window 17 is provided on the surface of the cleaning shell 1 to facilitate staff to observe the cleaning condition of the product in the cleaning chamber 2;

[0038] The conveying mechanism includes a conveying belt 3, an active roller 4, a driven roller 5 and a transmission roller 6. The conveying belt 3 is distributed in a rectangular shape. The active roller 4 and the driven roller 5 are respectively provided at the two ends of the bottom side of the conveying belt 3 for conveying. The two ends of the top of the conveying belt 3 are conveyed by two transmission rollers 6. The rectangular distribution of the conveying belt 3 can shorten the distance between the cleaning mechanism and the product, thereby achieving a better cleaning effect.

[0039] A cleaning mechanism is symmetrically arranged on the surface of the conveying mechanism, and the cleaning mechanism is sequentially provided with a vacuum adsorption group, an air blowing group, a vacuum dust collection group, and an electrostatic adsorption group. The vacuum adsorption group, air blowing group, vacuum dust collection group, and electrostatic adsorption group are symmetrically arranged on the surface of the conveying mechanism; starting the symmetrical vacuum adsorption group, air blowing group, vacuum dust collection group, and electrostatic adsorption group at the same time can blow and suck part of the product surface into the air to a certain extent, thereby achieving the effect of no contact with the product during the cleaning process of the product surface, and being able to clean both sides of the product surface.

[0040] The nozzle of the blowing group is downward and inclined at 10°-60°, preferably 36°, toward the dust suction group, which can maximize the effect of the dust suction group in adsorbing impurities, forming a blowing and suction group. At least one blowing and suction group is set between the vacuum adsorption group and the electrostatic adsorption group. Setting multiple blowing and suction groups can ensure that the product surface is truly clean.

[0041] The cleaning mechanism is provided with a cyclone vacuum adsorption group, a first strong blowing group (8), a first strong vacuum dust collection group, an electrostatic adsorption group (12) in sequence, and a cyclone vacuum adsorption group (7), a second strong blowing group, a second strong vacuum dust collection group (9) and an electrostatic adsorption group are provided in a relative manner; an ion wind outlet (25) is provided between the first strong blowing group (8) and the first strong vacuum dust collection group, the second strong blowing group (10) and the second strong vacuum dust collection group at the upper part; an ion wind static removal rod 13 is provided at the tail end of the conveying mechanism, and an auxiliary roller 14 is provided below the ion wind static removal rod 13;

[0042] Among them, the first powerful blowing group 8 and the second powerful blowing group 10 use a high-pressure blowing mechanism, which can be an ion air knife, the first powerful vacuum cleaning group 9 uses a vacuum cleaner, and the second powerful vacuum cleaning group 11 uses a booster vacuum cleaner. The ion wind outlet 25 can blow out compressed air ion gas wind;

[0043] Vacuum ports 15 are symmetrically opened on the upper and lower sides of the cleaning chamber 2, and a dust suction port 16 is opened on the surface of the cleaning shell 1. The vacuum port 15 and the dust suction port 16 are connected to each other, and the sucked dust is discharged from the cleaning shell 1 through the vacuum port 15 and the dust suction port 16.

[0044] A speed regulator 19 and an air pressure regulator 20 are provided on the surface of the cleaning shell 1, an emergency stop button 21 is provided on the top of the side of the cleaning shell 1, the bottom of the cleaning shell 1 is fixed to the ground surface through an equipment base 22, and an air switch 24 is provided on the surface of the equipment base 22. An oil-water separator 23 is installed on the bottom surface of the cleaning shell 1, and the top of the oil-water separator 23 is connected to the inside of the cleaning chamber 2 through a pipe.

[0045] like Figure 3-6As shown, the cleaning device of the present invention places the product between the two conveying mechanisms when it is working, and the two conveying mechanisms drive the product to move in the cleaning chamber 2, and the rectangularly distributed conveying belt 3 can shorten the distance between the cleaning mechanism and the product, so as to achieve a better cleaning effect. After the product enters the cleaning mechanism, it is first cyclone-cleaned by the cyclone vacuum adsorption group 7 to avoid residual heavy foreign matter, light sticky foreign matter and semi-structural foreign matter on the product, and then the first strong blowing group 8, the first strong vacuum cleaning group 9, the second strong blowing group 10 and the second strong vacuum cleaning group 11 blow and adsorb the product respectively to achieve the effect of cleaning and dust removal, and finally the electrostatic adsorption group 12 enhances the cleaning effect. When the workpiece moves to the tail end of the conveying mechanism, the ion wind anti-static rod 13 removes the static electricity on the surface of the product, and the auxiliary roller 14 helps the product to be discharged to realize a contactless cleaning process for the product.

[0046] It is worth noting that the entire device is controlled by a master control button. Since the devices matched with the control button are commonly used devices and belong to existing common knowledge technology, their electrical connection relationship and specific circuit structure will not be described in detail here.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A text lithography process including double-sided solder mask baking, characterized in that: The process also includes the following steps: step 1: casting; step 2: laser lithography; and step 3: cleaning.

2. The text photolithography process according to claim 1, wherein: It also includes step four: flipping; step five: laser lithography; and step six: cleaning.

3. The text photolithography process according to claim 1, wherein: In the step 1, the circuit board is placed on the laser etching machine, and the circuit board is cleaned after the laser etching.

4. The text photolithography process according to claim 2, wherein: It also includes a photolithography process production line, which includes a board projection machine, a laser marking machine, a cleaning device, and a flipping device. The circuit board is sequentially photolithographically processed through the photolithography process production line.

5. The text photolithography process according to claim 4, characterized in that: In the step 2, characters are printed on the A side of the circuit board by a laser marking machine. In the step 3, the A side of the circuit board after laser etching is cleaned by a non-contact cleaning device. Then, the circuit board is flipped over by the flipping device in the step 4. Then, characters are printed on the B side of the circuit board by the laser marking machine in the step 5. Then, the B side of the circuit board is cleaned by the non-contact cleaning device in the step 6.

6. The text photolithography process according to claim 2, wherein: The method also includes step seven: collecting the board, and storing the printed circuit board after the text is photoetched by a board collecting device.

7. The text photolithography process according to claim 4, wherein: The cleaning device includes a cleaning shell; a cleaning chamber is provided inside the cleaning shell, a conveying mechanism is horizontally symmetrically provided inside the cleaning chamber, and also includes a cleaning mechanism provided on the surface of the conveying mechanism; the cleaning mechanism is provided with a vacuum adsorption group, a blowing group, a vacuum dust collection group, and an electrostatic adsorption group in sequence, and the vacuum adsorption group, the blowing group, the vacuum dust collection group, and the electrostatic adsorption group are symmetrically provided on the surface of the conveying mechanism; the surface of the product passes through the cleaning mechanism through the conveying mechanism in a contactless manner.

8. The text photolithography process according to claim 6, wherein: The nozzle of the blowing group is downward and inclined at 10°-60° toward the dust collection group to form a blowing and suction group. At least one blowing and suction group is arranged between the vacuum adsorption group and the electrostatic adsorption group.

9. The text photolithography process according to claim 6, wherein: An ion wind static removal rod is provided at the tail end of the conveying mechanism, and an auxiliary roller is provided below the ion wind static removal rod.

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