Valve hole machining method, machining equipment and high-pressure rotary valve

Abstract

The invention relates to the technical field of valve hole machining, and discloses a valve hole machining method, machining equipment and a high-pressure rotary valve. The method comprises the following steps: prefabricating a blind hole in a rotary valve head by adopting a punching mechanism; a grinding mechanism is adopted for grinding the working face of the rotary valve head, so that the blind hole is machined into a valve hole communicating with the non-working face and the working face of the rotary valve head; and a rounding mechanism is adopted for conducting rounding machining on the hole opening wall of the valve hole, so that the shape of the hole opening wall is machined to be the target angle value, and a fillet structure with the first target finish degree is achieved. According to the embodiment of the invention, bad features generated in the machining process of the orifice wall of the valve hole can be efficiently removed in batches.

Description

Technical Field

[0001] The present application relates to the technical field of valve hole processing, and in particular to a valve hole processing method, processing equipment and a high-pressure rotary valve. Background Art

[0002] High-pressure rotary valves, used for high-pressure liquid separation, are subject to long-term application. Due to the high-pressure contact and relative rotational motion of the rotary valve head and valve core within the rotary valve, when the orifice wall of the valve hole, which houses the valve core, has burrs or vertical edges, the metal-made rotary valve head can easily scratch the wear-resistant material-made valve core. Therefore, the machining quality of the orifice wall of the rotary valve head directly impacts the performance and lifespan of the high-pressure rotary valve. However, after the valve hole is machined, fine adhesives remain on the orifice wall. These adhesives cannot be removed during the flat grinding, polishing, and cleaning stages, resulting in the formation of undesirable features such as burrs or vertical edges on the orifice wall. Furthermore, due to the small diameter of the valve hole, these undesirable features can only be removed manually under a microscope, resulting in low machining efficiency and an inability to guarantee yield in batches. Summary of the Invention

[0003] The purpose of this application is to provide a valve hole processing method, processing equipment and high-pressure rotary valve, which can efficiently and batch-remove undesirable features of the orifice wall of the valve hole generated during the processing.

[0004] The present invention provides a method for machining a valve hole, including: A punching mechanism is used to prefabricate a blind hole on the rotary valve head; the blind hole is opened from the non-working surface of the rotary valve head toward the working surface; Using a grinding mechanism to grind the working surface of the rotary valve head to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head; A chamfering mechanism is used to perform chamfering processing on the orifice wall of the valve hole, so as to process the shape of the orifice wall into a rounded structure with a target angle value and a first target smoothness.

[0005] In some embodiments, the prefabricated blind hole on the rotary valve head comprises: The rotary valve head is fixed to the hole-making station, and the tool of the punching mechanism is driven to drill from the non-working surface toward the working surface. During the drilling process, the tool is fed and chips are removed periodically until the distance between the blind hole and the working surface reaches the target blind hole distance; the tool feed speed of the tool of the punching mechanism is 100 mm / min, and the target blind hole distance is 0.11 mm to 0.15 mm.

[0006] In some embodiments, grinding the working surface of the rotary valve head includes: The rotary valve head is transported to the grinding station, and the grinding mechanism is driven to perform periodic gradient feed grinding and cooling treatment on the working surface. During the grinding process, a cleaning liquid is introduced into the working surface and the generated adhesive is cleaned; the grinding feed amount of the single gradient feed grinding is 0.005mm, 0.003mm and 0.003mm respectively.

[0007] In some embodiments, the rounding of the orifice wall of the valve hole comprises: The rotary valve head is transported to the polishing station, and the chamfering mechanism is driven to use polishing and grinding to chamfer the orifice wall of the valve hole; the polishing and grinding is made of a blended material, the replacement frequency of the polishing and grinding is 90 pcs / h, the processing time of the chamfering is 25 minutes, the target angle value is not less than 40°, and the first target finish is .

[0008] In some embodiments, before performing chamfering on the orifice wall of the valve hole, the method further comprises: A cleaning mechanism is used to perform high-pressure pulse cleaning on the inner wall and the orifice wall of the valve hole, so that the inner wall and the orifice wall of the valve hole are free of burrs, protrusions and adhesives; the cleaning liquid flow rate of the high-pressure pulse cleaning is 300 ml / min, the cleaning frequency of the high-pressure pulse cleaning is 0.25 Hz and 0.5 Hz alternating cycles, and the cleaning pressure of the high-pressure pulse cleaning is 1.2 MPa.

[0009] In some embodiments, before performing chamfering on the orifice wall of the valve hole, the method further comprises: The working surface is polished by a polishing mechanism to achieve the target flatness and the second target smoothness. The polishing axial speed of the polishing process is 200 rad / min, the polishing time of the polishing process is 15 minutes, diamond grinding fluid is used for the polishing process, and the second target smoothness is 15 minutes. , the target flatness is 0.005 mm.

[0010] In some embodiments, the valve hole machining method further includes: A detection mechanism is used to perform angle value detection and smoothness detection on the orifice wall of the valve hole after chamfering, and the angle detection value is compared with a preset angle value interval and the smoothness detection value is compared with a preset smoothness interval to obtain corresponding angle value detection results and smoothness detection results.

[0011] In some embodiments, the diameter of the valve hole is no more than 0.5 mm, the cross-section of the valve hole is elliptical, and the angle between the valve hole and the working surface is 50° to 70°.

[0012] The present application also provides a valve hole processing device, including: A punching mechanism is used to prefabricate a blind hole on the rotary valve head; the blind hole is opened from the non-working surface of the rotary valve head toward the working surface; a grinding mechanism for grinding the working surface of the rotary valve head to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head; The chamfering mechanism is used to perform chamfering and polishing processing on the orifice wall of the valve hole, so as to process the shape of the orifice wall into a rounded structure with a target radian value and a target smoothness.

[0013] An embodiment of the present application further provides a high-pressure rotary valve, comprising a rotary valve head, wherein a valve hole of the rotary valve head is machined by the above-mentioned valve hole machining method.

[0014] The beneficial effects of this application are as follows: the process of through-processing the valve hole is decomposed into two stages: prefabricating a blind hole from the non-working surface toward the working surface by a punching mechanism, and grinding the working surface by a grinding mechanism to punch the blind hole into a valve hole. This not only avoids the stress mutation at the moment of penetration, but also creates favorable conditions for subsequent chamfering processing, which can largely eliminate the initial generation of large-scale adhesives and burr features on the orifice wall of the valve hole. The shape of the orifice wall of the valve hole is processed into a rounded structure with a target angle value and a first target smoothness by the chamfering mechanism, which can further eliminate small-scale adhesives and burr features formed during the processing, and efficiently remove the undesirable features of the orifice wall of the valve hole generated during the processing in batches. The high-pressure rotary valve processed by the valve hole processing method has no undesirable features such as visible burrs, vertical edges, adhesives, and impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a flow chart of the valve hole processing method provided in an embodiment of the present application.

[0016] Figure 2 This is a rendering of the effect of prefabricated blind holes on the rotary valve head provided in an embodiment of the present application.

[0017] Figure 3 This is a rendering of the effect of grinding the working surface of the rotary valve head provided in an embodiment of the present application.

[0018] Figure 4 This is a rendering of the effect of chamfering the orifice wall of the valve hole provided in an embodiment of the present application.

[0019] Figure 5 This is a diagram showing the effect of high-pressure pulse cleaning of the valve hole provided in an embodiment of the present application.

[0020] Figure 6It is a structural schematic diagram of the valve hole processing equipment provided in an embodiment of the present application.

[0021] Figure 7 This is a rendering of a valve hole processed by the valve hole processing method of the prior art.

[0022] Figure 8 This is a rendering of the valve hole processed by the valve hole processing method of an embodiment of the present application.

[0023] Figure 9 This is a diagram showing the effect of a valve hole processed by the valve hole processing method of the prior art after use.

[0024] Figure 10 This is a diagram showing the effect of a valve hole processed by the valve hole processing method of an embodiment of the present application after use.

[0025] Figure 11 This is a diagram showing the scratching effect of a valve hole processed by the valve hole processing method of the prior art.

[0026] Figure 12 This is a diagram showing the scratching effect of a valve hole processed by the valve hole processing method of an embodiment of the present application.

[0027] Figure 13 This is a diagram showing the burr effect of a valve hole processed by the valve hole processing method of the prior art.

[0028] Figure 14 This is a diagram showing the burr effect of a valve hole processed by the valve hole processing method according to an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0030] It should be noted that although the device schematics illustrate functional module divisions and the flowcharts illustrate logical sequences, in certain circumstances, the steps illustrated may be performed in a sequence that differs from the module divisions in the device or the sequence in the flowcharts. Terms such as "first" and "second" in the specification, claims, and drawings are used to distinguish similar items and are not intended to describe a specific sequence or precedence.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0032] Figure 1 This is a flow chart of the valve hole processing method provided by the embodiment of the present application. Figure 1 In some embodiments, the method includes but is not limited to steps S101 to S103.

[0033] Step S101: using a punching mechanism to prefabricate a blind hole on the rotary valve head.

[0034] The blind hole is opened from the non-working surface of the rotary valve head toward the working surface.

[0035] The punching mechanism refers to a drilling device with an axial feed function, which can adopt a servo motor-driven drilling system to achieve blind hole prefabrication by controlling the tool path. Preferably, the punching mechanism uses a five-axis machining center.

[0036] Step S102 : grinding the working surface of the rotary valve head using a grinding mechanism to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head.

[0037] The grinding mechanism is a precision grinding machine equipped with a cooling system, which removes material through the relative motion between the grinding wheel and the rotary valve head. Preferably, the grinding mechanism is a flat grinding machine.

[0038] In step S103 , a chamfering mechanism is used to perform chamfering on the orifice wall of the valve hole, so as to shape the orifice wall into a rounded structure with a target angle value and a first target smoothness.

[0039] The chamfering mechanism refers to a processing device with a flexible polishing component, such as a pneumatically controlled rotating grinding head, which is used to form the curvature of the hole edge. Preferably, the chamfering mechanism is a polishing vertical machine tool.

[0040] During the blind hole prefabrication stage, the drilling depth of the punching mechanism is controlled to drill holes starting from the non-working surface of the rotary valve head toward the working surface, and a thin layer of material on the working surface side is retained as a subsequent grinding allowance. During the working surface grinding stage, the grinding mechanism uses a progressive grinding removal method to eliminate the residual material at the end of the blind hole while ensuring the flatness of the working surface. This progressive grinding removal method can largely eliminate the initial generation of large-scale adhesives and burr features on the orifice wall of the valve hole. During the chamfering processing stage, the chamfering mechanism uses a flexible contact method to shape the orifice wall of the valve hole, so that the shape of the orifice wall is processed to a rounded structure with a target angle value and a first target smoothness, thereby eliminating small-scale adhesives and burr features formed during the processing. Therefore, the process of through-processing the valve hole is decomposed into two stages: prefabricating a blind hole from the non-working surface to the working surface by a punching mechanism; and grinding the working surface by a grinding mechanism to punch the blind hole into a valve hole. This not only avoids the stress mutation at the moment of penetration, but also creates favorable conditions for subsequent chamfering processing, which can largely eliminate the initial generation of large-scale adhesives and burr features on the orifice wall of the valve hole. The shape of the orifice wall of the valve hole is processed into a rounded structure with a target angle value and a first target smoothness by the chamfering mechanism, which can further eliminate small-scale adhesives and burr features formed in the processing process, and efficiently remove the undesirable features of the orifice wall of the valve hole generated in the processing process in batches.

[0041] In some embodiments, preforming a blind hole in a rotary valve head includes: securing the rotary valve head to a drilling station, driving a tool of a drilling mechanism to drill a hole from a non-working surface toward a working surface, and periodically feeding the tool and removing chips during the drilling process until the distance between the blind hole and the working surface reaches a target blind hole distance. The tool feed rate of the drilling mechanism is 100 mm / min, and the target blind hole distance is 0.11 mm to 0.15 mm.

[0042] The drilling station refers to a processing platform used to fix the rotary valve head and perform drilling operations. Specifically, it can be achieved by using a hydraulic clamp in conjunction with a positioning pin. Its function is to ensure that the rotary valve head maintains a stable posture during the processing. Periodic feeding of the tool refers to controlling the feed action of the tool in an intermittent motion manner. Specifically, it can be achieved by using a servo motor to drive a ball screw mechanism. This method can avoid the heat accumulation caused by continuous cutting. The target blind hole distance refers to the reserved thickness between the bottom of the blind hole and the working surface. Specifically, the drilling depth can be monitored in real time by a displacement sensor. This parameter setting can prevent the tool from penetrating the working surface, resulting in the generation of large-sized adhesives and burr features on the orifice wall of the valve hole.

[0043] During the prefabrication of blind holes, after the rotary valve head is clamped in the hole-making station, the tool of the punching mechanism performs drilling operations in the axial direction at a preset speed. After each stroke of the punching mechanism tool, a short pause is performed to achieve chip discharge, and the cutting area is flushed with coolant. When the displacement detection system recognizes that the blind hole depth has reached the target value, the tool of the punching mechanism immediately stops feeding and returns to the initial position. For example, the tool feed speed of the punching mechanism is controlled within the range of 100mm / min, so that the cutting force is maintained in a reasonable range to avoid plastic deformation of the material. Therefore, by periodically feeding the tool operation of the punching mechanism and coordinating with the forced chip removal mechanism, the chips in the processing area can be effectively removed. At the same time, the setting of the target blind hole distance forms a uniform allowance layer between the bottom of the blind hole and the working surface, providing a controllable processing benchmark for the subsequent grinding process on the basis of eliminating the initial generation of large-scale adhesives and burr features on the orifice wall of the valve hole. The effect after prefabricating the blind hole on the rotary valve head is as follows: Figure 2 shown.

[0044] In some embodiments, grinding the working surface of the rotary valve head includes: transporting the rotary valve head to a grinding station, driving a grinding mechanism to perform periodic gradient feed grinding and cooling on the working surface, and supplying a cleaning fluid to the working surface during the grinding process to clean any adhesive deposits. The grinding feed amounts for the single gradient feed grinding are 0.005 mm, 0.003 mm, and 0.003 mm, respectively.

[0045] Periodic gradient feed grinding involves gradually reducing the grinding depth in stages. This can be achieved using the axial displacement control system of a CNC machine tool. This reduces stress concentration in the material by gradually reducing the amount of stock removal. Cooling treatment involves the simultaneous injection of a cooling medium during the grinding process. This can be achieved using a circulating coolant injection device, which reduces the temperature in the grinding area and prevents thermal deformation of the material.

[0046] During the work surface grinding phase, the rotary valve head is fixed in the grinding station, and the grinding mechanism periodically performs a gradient feed. Each gradient feed grinding process involves three axial feeds according to a preset gradient, with the feed rate gradually decreasing. During each feed, coolant is continuously injected into the grinding area of ​​the work surface to control the temperature. Simultaneously, cleaning fluid is sprayed onto the work surface through a pipeline to flush out metal debris and adhesives generated by grinding. For example, the initial feed rate may be 0.005mm to remove most of the excess, followed by two subsequent feed rates of 0.003mm each for fine finishing. During this process, the simultaneous action of the coolant and cleaning fluid prevents overheating of the material and maintains a clean machined surface. Thus, the gradient feed method reduces cutting resistance. The combined effects of cooling and cleaning effectively prevent secondary adhesion of debris, simultaneously remove machining residues during the grinding phase, eliminate the conditions for burr formation on the valve hole wall, and ensure that the work surface reaches the desired flatness before subsequent chamfering. This improves valve hole processing yield and reduces manual finishing steps. The effect of grinding the working surface of the rotary valve head is as follows Figure 3 shown.

[0047] In some embodiments, performing chamfering on the orifice wall of the valve hole includes: transporting the rotary valve head to a polishing station, driving the chamfering mechanism to perform chamfering on the orifice wall of the valve hole using a polishing abrasive. The polishing abrasive is made of a blended material, the replacement frequency of the polishing abrasive is 90 pieces / hour, the processing time of the chamfering is 25 minutes, the target angle value is not less than 40 degrees, and the first target finish is .

[0048] Polishing and grinding are flexible grinding tools used for surface polishing. They can be made by laminating blended fibers and abrasives, accommodating abrasive debris through interfiber gaps and maintaining an even distribution of grinding force. The replacement frequency refers to the number of times the polishing and grinding dermis is replaced per unit time. This can be achieved by setting an automatic replacement device to prevent excessive wear of the dermis, which can lead to a decrease in surface finish quality. The target angle value refers to the angular range at the connection between the fillet and the orifice wall. This can be achieved by adjusting the curvature radius of the grinding path to meet the requirements for optimizing the fillet structure's resistance to fluid flow.

[0049] During the rounding process, the polishing abrasive made of blended material is installed on the rotating shaft of the rounding mechanism, and the stable grinding capacity is maintained by periodically replacing the abrasive. After the rotary valve head is fixed in the polishing station, the polishing abrasive is reciprocated along the predetermined trajectory of the orifice wall. During the grinding process, the elastic deformation of the blended fiber makes the abrasive contact the orifice wall surface evenly, gradually removing the burrs and forming fillets. In this process, the grinding parameters are dynamically adjusted according to the target angle value and the finish requirements. For example, by controlling the contact pressure and rotation speed between the abrasive and the orifice wall, it is ensured that the angle and surface quality of the fillet structure meet the preset standards. Therefore, through the automated rounding process, combined with the material properties and parametric control of the blended abrasive, efficient batch processing of tiny orifice wall structures is achieved, quality fluctuations introduced by manual operation are avoided, and small-sized adhesives and burr features formed during the processing can be further eliminated. The effect of the orifice wall of the valve hole after rounding is as follows. Figure 4 shown.

[0050] In some embodiments, before rounding the orifice wall of the valve hole, the process further includes: using a cleaning mechanism to perform high-pressure pulse cleaning on the inner wall and orifice wall of the valve hole to remove burrs, protrusions, and adhesives. The cleaning fluid flow rate for high-pressure pulse cleaning is 300 ml / min, the cleaning frequency is an alternating cycle of 0.25 Hz and 0.5 Hz, and the cleaning pressure is 1.2 MPa.

[0051] High-pressure pulse cleaning involves periodically alternating high-pressure fluid impacts to clean the hole walls. This can be achieved using a cleaning pump equipped with a pulse control module. Alternating pulse frequencies enhance penetration into tiny gaps. The alternating cleaning frequency refers to the dynamic variation in the intervals between high-pressure pulses. This can be achieved by programming the pulse sequence using a programmable logic controller. The alternating frequency can adapt to the peeling requirements of adhesives of varying sizes.

[0052] Before the rounding process, the rotary valve head is transported to the cleaning station, and the cleaning mechanism uses high-pressure pulses to spray the cleaning liquid to the inner wall of the valve hole and the orifice wall. The alternating pulse frequency causes the fluid to produce periodic impact force, which, combined with the specific flow rate and pressure, can peel off tiny metal debris and processing residues attached to the hole wall. During the cleaning process, the dynamically changing pulse mode can cover adhesives in different positions, while avoiding the cleaning blind spots caused by a single frequency. Thus, through the combination of high-pressure pulses and dynamic frequencies, automated and efficient cleaning is achieved without relying on manual intervention under a microscope, while avoiding the problem of valve core scratches caused by burr residues. The effect of cleaning the inner wall of the valve hole and the orifice wall is as follows: Figure 5 shown.

[0053] In some embodiments, before the rounding process is performed on the orifice wall of the valve hole, the process further includes: using a polishing mechanism to polish the working surface so that the working surface reaches the target flatness and the second target finish. The polishing axial speed of the polishing process is 200 rad / min, the polishing time of the polishing process is 15 minutes, diamond grinding fluid is used for the polishing process, and the second target finish is 15 minutes. , the target flatness is 0.005mm.

[0054] Polishing axial speed refers to the rate at which the polishing tool moves in the axial direction. This speed control is achieved using a servo motor and a ball screw. This speed control directly impacts polishing uniformity. Target flatness refers to the maximum allowable surface fluctuation deviation of the work surface. This is measured using a laser interferometer and fed back to the polishing mechanism for closed-loop control, ensuring surface flatness after processing.

[0055] After the valve hole is ground, the rotary valve head is transferred to the polishing station. The polishing mechanism drives the polishing tool with diamond abrasive slurry to move along the axial direction of the working surface at a set speed while maintaining constant pressure contact. During the polishing process, the diamond particles in the abrasive slurry cut the microscopic protrusions on the working surface. After 15 minutes, the surface roughness is reduced to the second target finish, and the flatness error is controlled within 0.005mm. As a result, the working surface forms a uniform and smooth surface, eliminating the microscopic scratches and adhesive residues left during the grinding stage. By adding a polishing step, surface defects on the working surface are completely eliminated before chamfering, avoiding the outward burrs on the orifice wall caused by the unevenness of the substrate.

[0056] In some embodiments, the valve hole processing method also includes: using a detection mechanism to perform angle value detection and smoothness detection on the orifice wall of the valve hole after chamfering, comparing the angle detection value with the preset angle value interval and comparing the smoothness detection value with the preset smoothness interval to obtain corresponding angle value detection results and smoothness detection results.

[0057] Angle value detection refers to the quantitative analysis of the geometric angles of the orifice wall fillet structure using optical measuring instruments. This can be achieved using a laser profilometer or digital image processing system, which collects orifice wall profile data and calculates angle deviation values. Finish detection refers to the quantitative evaluation of the orifice wall surface microtopography. This can be achieved using a contact surface roughness tester or white light interferometer, which measures the surface height distribution and calculates roughness parameters. The preset angle value range and preset finish range refer to the qualified judgment range pre-set according to the valve core assembly requirements. This can be determined through experimental data statistics or process verification.

[0058] After the chamfering process is completed, the inspection mechanism uses a non-contact measurement device to perform a three-dimensional topographic scan of the orifice wall, generating inspection data including angles and surface topography. The angle detection module automatically compares the measured angle value with a preset angle value range and determines it as qualified if it falls within the range. The finish detection module simultaneously analyzes surface roughness parameters and determines it as meeting the standard if the measured value does not exceed the preset finish threshold. The inspection results are transmitted to the control system in real time via a data interface, achieving closed-loop feedback on processing quality. In one specific embodiment, the orifice wall of the valve hole after the chamfering process is inspected for angles. Specifically, the inspection mechanism uses an image detection module to focus on a reference position of the orifice wall and automatically records the Z coordinate information of the reference position. The tester then adjusts the image detection module to a calibration position and automatically records the Z coordinate information of the calibration position. The orifice wall angle measurement value is fitted based on the Z coordinate information of both the reference and calibration positions. This fitted angle measurement value is then compared with the upper and lower limits of the preset angle value range to determine whether the angle measurement value meets the inspection requirements. Therefore, the automated detection system can achieve simultaneous quantitative evaluation of angle and smoothness, eliminating the risk of missed detection caused by manual intervention, while the detection speed can adapt to the batch production rhythm.

[0059] In the above embodiment, the diameter of the valve hole is no more than 0.5 mm, the cross section of the valve hole is elliptical, and the angle between the valve hole and the working surface is 50° to 70°.

[0060] See also Figure 6 The embodiment of the present application further provides a valve hole processing device that can implement the above valve hole processing method. The valve hole processing device includes: Punching mechanism 601 is used to prefabricate blind holes on the rotary valve head; the blind holes are opened from the non-working surface of the rotary valve head toward the working surface; A grinding mechanism 602 is used to grind the working surface of the rotary valve head to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head; The chamfering mechanism 603 is used to perform chamfering and polishing processing on the orifice wall of the valve hole, so as to process the shape of the orifice wall into a rounded structure with a target radian value and a target smoothness.

[0061] In some embodiments, the valve hole processing equipment also includes a cleaning mechanism, which is used to perform high-pressure pulse cleaning on the inner wall and the orifice wall of the valve hole before chamfering the orifice wall of the valve hole, so that the inner wall and the orifice wall of the valve hole are free of burrs, protrusions and adhesives; the cleaning liquid flow rate of the high-pressure pulse cleaning is 300 ml / min, the cleaning frequency of the high-pressure pulse cleaning is 0.25 Hz and 0.5 Hz alternating cycles, and the cleaning pressure of the high-pressure pulse cleaning is 1.2 MPa.

[0062] In some embodiments, the valve hole processing equipment further includes a polishing mechanism for polishing the working surface before rounding the orifice wall of the valve hole, so that the working surface reaches the target flatness and the second target finish; the polishing axial speed of the polishing process is 200 rad / min, the polishing time of the polishing process is 15 minutes, diamond grinding fluid is used for the polishing process, and the second target finish is 15 minutes. , the target flatness is 0.005mm.

[0063] In some embodiments, the valve hole processing equipment also includes a detection mechanism for performing angle value detection and smoothness detection on the orifice wall of the valve hole after chamfering processing, comparing the angle detection value with the preset angle value interval and comparing the smoothness detection value with the preset smoothness interval to obtain corresponding angle value detection results and smoothness detection results.

[0064] The specific implementation of the valve hole processing equipment is basically the same as the specific embodiment of the valve hole processing method described above, and will not be repeated here.

[0065] The embodiment of the present application also provides a high-pressure rotary valve. The high-pressure rotary valve includes a rotary valve head, and the valve hole of the rotary valve head is processed by the valve hole processing method described above. Figures 7 to 14 Compared with the valve hole processed by the valve hole processing method of the prior art, the valve hole processed by the valve hole processing method of this embodiment has no obvious burrs, vertical edges, adhesives, impurities and other undesirable features, and after being used for a period of time, the valve hole has no obvious edge collapse and the valve core has no obvious scratches.

[0066] In summary, the valve hole processing method and processing equipment provided in the embodiments of the present application decompose the process of through-processing the valve hole into two stages: prefabricating a blind hole from the non-working surface toward the working surface by a punching mechanism, and grinding the working surface by a grinding mechanism to open the blind hole into a valve hole. This not only avoids the stress mutation at the moment of penetration, but also creates favorable conditions for subsequent chamfering processing, and can largely eliminate the initial generation of large-scale adhesives and burr features on the orifice wall of the valve hole. The shape of the orifice wall of the valve hole is processed into a rounded structure with a target angle value and a first target smoothness by the chamfering mechanism, which can further eliminate small-scale adhesives and burr features formed during the processing, and efficiently remove the undesirable features of the orifice wall of the valve hole generated during the processing in batches. The high-pressure rotary valve whose valve hole is processed by this valve hole processing method has no undesirable features such as visible burrs, vertical edges, adhesives, and impurities.

[0067] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0068] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A valve hole processing method, characterized in that: include: A punching mechanism is used to prefabricate a blind hole on the rotary valve head; the blind hole is opened from the non-working surface of the rotary valve head toward the working surface; Using a grinding mechanism to grind the working surface of the rotary valve head to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head; A chamfering mechanism is used to perform chamfering processing on the orifice wall of the valve hole, so as to process the shape of the orifice wall into a rounded structure with a target angle value and a first target smoothness.

2. The valve hole processing method according to claim 1, characterized in that: The blind hole prefabricated on the rotary valve head comprises: The rotary valve head is fixed to the hole-making station, and the tool of the punching mechanism is driven to drill from the non-working surface toward the working surface. During the drilling process, the tool is fed and chips are removed periodically until the distance between the blind hole and the working surface reaches the target blind hole distance; the tool feed speed of the tool of the punching mechanism is 100 mm / min, and the target blind hole distance is 0.11 mm to 0.15 mm.

3. The valve hole processing method according to claim 1, characterized in that: The grinding process on the working surface of the rotary valve head includes: The rotary valve head is transported to the grinding station, and the grinding mechanism is driven to perform periodic gradient feed grinding and cooling treatment on the working surface. During the grinding process, a cleaning liquid is introduced into the working surface and the generated adhesive is cleaned; the grinding feed amount of the single gradient feed grinding is 0.005mm, 0.003mm and 0.003mm respectively.

4. The valve hole processing method according to claim 1, characterized in that: The rounding of the orifice wall of the valve hole comprises: The rotary valve head is transported to the polishing station, and the chamfering mechanism is driven to use polishing and grinding to chamfer the orifice wall of the valve hole; the polishing and grinding is made of a blended material, the replacement frequency of the polishing and grinding is 90 pcs / h, the processing time of the chamfering is 25 minutes, the target angle value is not less than 40°, and the first target finish is .

5. The valve hole processing method according to claim 1, characterized in that: Before the rounding of the orifice wall of the valve hole is performed, the method further comprises: A cleaning mechanism is used to perform high-pressure pulse cleaning on the inner wall and the orifice wall of the valve hole, so that the inner wall and the orifice wall of the valve hole are free of burrs, protrusions and adhesives; the cleaning liquid flow rate of the high-pressure pulse cleaning is 300 ml / min, the cleaning frequency of the high-pressure pulse cleaning is 0.25 Hz and 0.5 Hz alternating cycles, and the cleaning pressure of the high-pressure pulse cleaning is 1.2 MPa.

6. The valve hole machining method according to claim 1, characterized in that: Before the rounding of the orifice wall of the valve hole is performed, the method further comprises: The working surface is polished by a polishing mechanism to achieve the target flatness and the second target smoothness. The polishing axial speed of the polishing process is 200 rad / min, the polishing time of the polishing process is 15 minutes, diamond grinding fluid is used for the polishing process, and the second target smoothness is 15 minutes. , the target flatness is 0.005 mm.

7. The valve hole machining method according to claim 1, characterized in that: Also includes: A detection mechanism is used to perform angle value detection and smoothness detection on the orifice wall of the valve hole after chamfering, and the angle detection value is compared with a preset angle value interval and the smoothness detection value is compared with a preset smoothness interval to obtain corresponding angle value detection results and smoothness detection results.

8. The valve hole machining method according to any one of claims 1 to 7, characterized in that: The diameter of the valve hole is no more than 0.5 mm, the cross-section of the valve hole is elliptical, and the angle between the valve hole and the working surface is 50° to 70°.

9. A valve hole processing device, characterized in that: include: A punching mechanism is used to prefabricate a blind hole on the rotary valve head; the blind hole is opened from the non-working surface of the rotary valve head toward the working surface; a grinding mechanism for grinding the working surface of the rotary valve head to process the blind hole into a valve hole connecting the non-working surface and the working surface of the rotary valve head; The chamfering mechanism is used to perform chamfering and polishing processing on the orifice wall of the valve hole, so as to process the shape of the orifice wall into a rounded structure with a target radian value and a target smoothness.

10. A high-pressure rotary valve, characterized in that: It comprises a rotary valve head, wherein the valve hole of the rotary valve head is machined by the valve hole machining method according to any one of claims 1 to 8.

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