Preparation method of metal grid line

Abstract

The invention discloses a preparation method of a metal grid line. The preparation method comprises the following steps in sequence: step 1, immersing a female die with a plurality of forming grooves prefabricated in the surface into a main body metal electroplating bath with main body metal electroplating liquid; the bottoms of the forming grooves of the female die are made of metal materials, and the parts, except the forming grooves, of the surface of the female die are made of non-conductive materials; secondly, the female die is operated and electroplated, so that main metal of main metal electroplating liquid in a main metal electroplating bath is deposited in all forming grooves of the female die, and a plurality of metal grid lines are formed; and step 3, the adsorption film is unwound, and the metal grid lines on the female die are adsorbed on the surface of the adsorption film, so that the metal grid lines are stripped from the female die. The metal grid line can be conveniently prepared, and the prepared metal grid line has the advantages of being good in consistency, high in processing efficiency and low in cost.

Description

Technical Field

[0001] The present invention relates to the field of solar cells, and in particular to a method for preparing a metal grid line. Background Art

[0002] With the continuous development of solar cell technology, the application of solar cells is becoming more and more extensive, playing an important role in the fields of energy recovery and renewable energy.

[0003] The mainstream method for producing metal gridlines in existing solar cells is through screen printing of silver paste. However, this method has disadvantages such as high silver paste cost, wide gridline width, and large light-shielding area. Furthermore, the existing method of producing metal gridlines through copper electroplating, while reducing material costs, is complex and requires multiple steps, such as film application, exposure, development, electroplating, and stripping, resulting in high equipment investment and maintenance costs.

[0004] In view of the above problems, it is necessary to study a method for preparing metal grid lines to solve the deficiencies in the prior art. Summary of the Invention

[0005] The object of the present invention is to provide a method for preparing a metal grid line to solve the deficiencies in the prior art.

[0006] In order to achieve the above object, the solution of the present invention is: A method for preparing a metal grid line comprises the following steps in sequence: Step 1: Immerse a master mold having a plurality of pre-formed grooves in its surface in a bulk metal electroplating bath containing bulk metal electroplating solution; the bottom of the grooves in the master mold is made of metal, and the surface of the master mold other than the grooves is made of a non-conductive material; Step 2: operating the master mold and performing electroplating, so that the main metal of the main metal plating solution in the main metal plating tank is deposited in each forming groove of the master mold, thereby forming a plurality of metal grid lines; Step 3: Unwind the adsorption film and allow the metal grid lines on the master mold to be adsorbed on the surface of the adsorption film, so as to peel the metal grid lines from the master mold.

[0007] The molding grooves of the master mold form an open figure; and the plurality of metal grid lines formed in step 2 form an incompletely closed metal pattern.

[0008] The molding grooves of the master mold form multiple graphic units, each graphic unit has multiple molding grooves distributed in an interdigitated shape; the metal grid lines formed in step 2 form multiple metal pattern units, each metal pattern unit has multiple metal grid lines distributed in an interdigitated shape.

[0009] The width of the molding groove of the master mold is 20 to 400 μm; the width of the metal grid line is 20 to 400 μm.

[0010] The widths of the molding grooves of the master mold are the same, completely different, or different.

[0011] The master mold is a roller structure or a flat belt structure.

[0012] The adsorption film includes a composite film layer and an elastic layer, and the elastic layer is used for adsorption with the metal grid line.

[0013] The adsorption film has a gram weight of 30 to 100 gsm.

[0014] The film layer of the adsorption film is a biaxially stretched film.

[0015] The biaxially oriented film is a biaxially oriented polyethylene film, a biaxially oriented polypropylene film or a biaxially oriented polyester film.

[0016] The elastic layer of the adsorption film is made of ethylene-vinyl acetate copolymer or polyolefin.

[0017] In step three, after the metal grid line is adsorbed on the surface of the adsorption film, the metal grid line and the adsorption film are placed together in at least one metal plating tank having a metal plating solution for electroplating, so that the metal plating solution in the metal plating tank is plated on the surface of the metal grid line, so that the surface of the metal grid line is covered with a plating layer.

[0018] When the number of the coating metal electroplating tanks is greater than or equal to two, the coating metal electroplating solutions in the respective metal electroplating tanks are the same, completely different, or not identical.

[0019] The metal plating solution for the plated layer is a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or an alloy plating solution.

[0020] The main layer metal electroplating solution is a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution or an alloy electroplating solution.

[0021] The method for preparing a metal grid line is characterized by further comprising a fourth step: the fourth step is to roll up the adsorption film and the metal grid lines adsorbed on the surface of the adsorption film together, thereby obtaining a metal grid line coil.

[0022] After adopting the above scheme, the present invention realizes the electroplating forming of metal grid lines by prefabricating forming grooves on the surface of the master mold and performing electroplating, which can avoid the problems of poor consistency and low processing efficiency existing in the traditional screen printing manufacturing method; moreover, during the electroplating process, since the metal is only deposited inside the forming grooves, the end faces of the metal lines of the formed metal mesh are smooth and free of burrs, while also avoiding the waste of silver paste in the traditional screen printing process, improving material utilization and reducing production costs. In addition, the present invention uses an adsorption film to adsorb the metal grid lines on the surface of the adsorption film so as to peel the metal grid lines from the master mold, so that the peeling of the metal grid lines is very simple and there is no glue removal problem in the existing copper electroplating process; moreover, the present invention can ensure the structural stability and consistency of the metal grid lines by controlling the tensile deformation properties and grammage of the adsorption film, thereby improving the quality and performance of the product. At the same time, the metal grid lines are directly prepared by the electroplating process. During the electroplating process, since the metal is only deposited inside the formed grooves, the end faces of the metal lines of the formed metal mesh are smooth and free of burrs. At the same time, it also avoids the waste of silver paste in the traditional screen printing process, improves material utilization and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the cooperation between the main metal electroplating tank and the mother mold in embodiment 1 of the present invention.

[0024] Figure 2 Schematic diagram of the partial structure of the master mold of Example 1 of the present invention.

[0025] Figure 3 Schematic diagram of preparing metal gate lines according to the first embodiment of the present invention.

[0026] Figure 4 Schematic diagram of the partial structure of the metal gate line according to the first embodiment of the present invention.

[0027] Figure 5 Schematic diagram of the cooperation between the main metal electroplating tank and the mother mold in the second embodiment of the present invention.

[0028] Figure 6 This is a schematic diagram of the partial structure of the master mold of Example 2 of the present invention.

[0029] Figure 7 This is a schematic diagram of preparing metal gate lines according to the second embodiment of the present invention.

[0030] Figure 8 Schematic diagram of the partial structure of the metal gate line according to the second embodiment of the present invention.

[0031] Figure 9 Schematic diagram of the coordination between the main metal electroplating tank and the master mold according to the third embodiment of the present invention.

[0032] Figure 10 This is a schematic diagram of the partial structure of the master mold of Example 3 of the present invention.

[0033] Figure 11 Schematic diagram of a partial structure of a metal grid line according to a third embodiment of the present invention (the surface of the metal grid line is not coated with a metal plating layer).

[0034] Figure 12 It is a partial cross-sectional schematic diagram of the metal grid line of the third embodiment of the present invention (the surface of the metal grid line is coated with a metal plating layer).

[0035] Figure 13 This is a schematic diagram of preparing metal gate lines according to the third embodiment of the present invention.

[0036] Description of labels: Mother mold A, graphic unit A0, molding groove A1, first molding groove A11, second molding groove A12, Main metal plating tank B, main metal plating solution b, Coating metal electroplating tank C, coating metal electroplating solution c, Adsorption film D, Metal grid line 1, first metal grid line 101, second metal grid line 102, plating layer 11, metal pattern unit 10, Metal grid coil 2. DETAILED DESCRIPTION

[0037] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0038] Example 1: Cooperate Figures 1 to 4 As shown, in the first embodiment of the present invention, a method for preparing a metal gate line 1 of the present invention includes the following steps in sequence: Step 1: Immerse a master mold A, having a plurality of preformed forming grooves A1 on its surface, in a main metal electroplating tank B containing a main metal electroplating solution B. The master mold A is a roller structure, the bottom of the forming grooves A1 of the master mold A is made of metal, and the surface of the master mold A, excluding the forming grooves A1, is made of a non-conductive material. The forming grooves A1 of the master mold A form an open pattern, and the width of the forming grooves A1 is 20 to 400 μm. The main metal electroplating solution can be a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution, or an alloy electroplating solution. Step 2: Operate the master mold A and perform electroplating, so that the main metal of the main metal plating solution b in the main metal plating tank B is deposited in each forming groove A1 of the master mold A, thereby forming a plurality of metal grid lines 1. The formed plurality of metal grid lines 1 constitute an incompletely closed metal pattern, and the width of the metal grid lines 1 is 20 to 400 μm. Step 3: Unwinding the adsorption film D and allowing each metal grid line 1 on the master mold A to be adsorbed on the surface of the adsorption film D, so as to peel the metal grid lines 1 from the master mold A; wherein, the unwound adsorption film D is pressed against the surface of the master mold A by a pressure roller. As the master mold A rotates and the adsorption film D moves, the metal grid lines 1 on the master mold A are adsorbed by the adsorption film D and transferred to the adsorption film D. The adsorption film D may include a composite film layer and an elastic layer. The elastic layer is used to adsorb the metal grid lines 1. The deformation performance of the film layer is lower than that of the elastic layer. The film layer plays a supporting role. The gram weight of the adsorption film D is 30 to 100 gsm. Step 4: Roll up the adsorption film D and the metal grid lines 1 adsorbed on the surface of the adsorption film D together, thereby obtaining a metal grid line coil 2 .

[0039] In embodiment 1 of the present invention, the present invention realizes the electroplating forming of the metal grid line 1 by prefabricating the forming groove A1 on the surface of the mother mold A and performing electroplating, thereby avoiding the problems of poor consistency and low processing efficiency in the traditional screen printing manufacturing method; moreover, during the electroplating process, since the metal is only deposited inside the forming groove A1, the end face of the metal line of the formed metal mesh is smooth and has no burrs, and at the same time, it also avoids the waste of silver paste in the traditional screen printing process, improves material utilization and reduces production costs.

[0040] In the first embodiment of the present invention, the film layer of the adsorption film D is a biaxially oriented film layer, specifically a biaxially oriented polyethylene film, a biaxially oriented polypropylene film, or a biaxially oriented polyester film. The elastic layer of the adsorption film D is a thin film structure, and the elastic layer can be made of ethylene-vinyl acetate copolymer (EVA), polyolefin (POE), or other elastic materials. The present invention uses the adsorption film D to adsorb the metal grid lines 1 onto the surface of its elastic layer, thereby peeling the metal grid lines 1 from the master mold A. This makes peeling the metal grid lines 1 very simple and eliminates the adhesive removal issues encountered in existing copper electroplating processes. The tensile deformation performance of the adsorption film D can be measured by the elastic modulus. The elastic modulus is the ratio of stress to strain of the material within the elastic range. It describes the ability of the material to resist deformation when subjected to stress and reflects the degree of deformation of the material when subjected to external force. The higher the elastic modulus, the greater the rigidity of the material and the smaller the deformation. In this application, the tensile deformation performance and gram weight of the adsorption film D can be controlled by the film layer, so that the elastic modulus of the adsorption film D is greater than or equal to 1200 MPa and the gram weight of the adsorption film D is 30 to 100 gsm, thereby ensuring the structural stability and consistency of the metal grid line 1 adsorbed on the adsorption film D, thereby improving the quality and performance of the product.

[0041] In embodiment 1 of the present invention, the specific parameters of the metal grid line 1 prepared by the present invention may be: the material of the metal grid line 1 is copper (that is, the main metal electroplating solution b is copper electroplating solution), the widths of the forming grooves A1 of the mother mold A are the same; the film layer of the adsorption film D is a biaxially oriented polyethylene film, and the material of the elastic layer of the adsorption film D is ethylene-vinyl acetate copolymer.

[0042] Example 2: Cooperate Figures 4 to 7 As shown, in the second embodiment of the present invention, a method for preparing a metal gate line 1 of the present invention includes the following steps in sequence: Step 1: Immerse a master mold A, having a plurality of preformed molding grooves A1 on its surface, in a bulk metal electroplating bath B containing a bulk metal electroplating solution B. The master mold A is a flat strip structure, the bottom of the molding grooves A1 of the master mold A is made of metal, and the surface of the master mold A, excluding the molding grooves A1, is made of a non-conductive material. The molding grooves A1 of the master mold A form an open pattern. The molding grooves A1 of the master mold A can form a plurality of graphic units A0, each of which has a plurality of molding grooves A1 distributed in an interdigitated pattern (the molding grooves A1 of each graphic unit A0 are divided into a first molding groove A11 and a second molding groove A12, and the first molding grooves A11 and the second molding grooves A12 are arranged alternately). Step 2: Operate the master mold A and perform electroplating, so that the main metal of the main metal electroplating solution b in the main metal electroplating tank B is deposited in each forming groove A1 of the master mold A, thereby forming a plurality of metal grid lines 1. The formed plurality of metal grid lines 1 constitute an incompletely closed metal pattern. Each of the formed metal grid lines 1 forms a plurality of metal pattern units 10. Each metal pattern unit 10 has a plurality of metal grid lines 1 distributed in an interdigitated manner (the metal grid lines 1 of each metal pattern unit 10 are divided into a first metal grid line 101 and a second metal grid line 102, and the first metal grid lines 101 and the second metal grid lines 102 are arranged in an alternating manner). The width of the metal grid lines 1 is 20 to 400 μm (i.e., the width of the forming groove A1 is 20 to 400 μm). Step 3: Unwinding the adsorption film D and allowing each metal grid line 1 on the master mold A to be adsorbed on the surface of the adsorption film D, so as to peel the metal grid lines 1 from the master mold A; wherein, the unwound adsorption film D is pressed against the surface of the master mold A by a pressure roller. As the master mold A rotates and the adsorption film D moves, the metal grid lines 1 on the master mold A are adsorbed by the adsorption film D and transferred to the adsorption film D. The adsorption film D may include a composite film layer and an elastic layer. The elastic layer is used to adsorb the metal grid lines 1. The deformation performance of the film layer is lower than that of the elastic layer. The film layer plays a supporting role. The gram weight of the adsorption film D is 30 to 100 gsm. Step 4: Roll up the adsorption film D and the metal grid lines 1 adsorbed on the surface of the adsorption film D together, thereby obtaining a metal grid line coil 2 .

[0043] In the second embodiment of the present invention, the mother mold A of the present invention is a flat belt structure with a plurality of prefabricated forming grooves A1 on its surface. By operating the mother mold A, the main metal in the main metal electroplating solution b is deposited in the forming grooves A1, thereby forming the metal grid lines 1. The mother mold A of the flat belt structure can be adjusted in length according to the size of the prefabricated forming grooves A1, and is not affected by the size and layout of the forming grooves A1. Moreover, the length of the mother mold A of the flat belt structure is longer than the circumference of the mother mold A of the roller structure, so the setting of the forming grooves A1 of the mother mold A of the flat belt structure is more flexible, and even forming grooves A1 of different design layouts can be set on the mother mold A of the flat belt structure. At the same time, the mother mold A of the flat belt structure has a longer running stroke, which is more conducive to metal deposition, so that the thickness of the formed metal grid lines 1 is uniform. In addition, the metal grid lines 1 formed in the second embodiment form a plurality of metal pattern units 10, each metal pattern unit 10 having a plurality of metal grid lines 1 distributed in an interdigitated shape. Such metal grid lines 1 can be used in interdigitated back contact batteries (IBC batteries); and compared with existing printed silver grid lines, the cost of the metal grid lines 1 can be greatly reduced, and the problem of easy grid breakage can be solved.

[0044] In the second embodiment of the present invention, the specific parameters for preparing the metal grid line 1 of the present invention may be: the first metal grid line 101 and the second metal grid line 102 are both made of copper-silver alloy (that is, the main metal electroplating solution b is a copper-silver alloy electroplating solution), and the widths of the first forming grooves A11 and the second forming grooves A12 are the same or different; the film layer of the adsorption film D is a biaxially oriented polypropylene film, and the material of the elastic layer of the adsorption film D is polyolefin.

[0045] Example 3: Cooperate Figures 9 to 13 As shown, in the third embodiment of the present invention, the method for preparing the metal gate line 1 of the present invention includes the following steps in sequence: Step 1: Immerse a master mold A, having a plurality of preformed molding grooves A1 on its surface, in a bulk metal electroplating tank B containing a bulk metal electroplating solution B. The master mold A is a roller structure, the bottom of the molding grooves A1 of the master mold A is made of metal, and the surface of the master mold A, excluding the molding grooves A1, is made of a non-conductive material. The molding grooves A1 of the master mold A form an open pattern. The molding grooves A1 of the master mold A can form a plurality of graphic units A0, each graphic unit A0 having a plurality of molding grooves A1 distributed in an interdigitated manner (the molding grooves A1 of each graphic unit A0 are divided into a first molding groove A11 and a second molding groove A12, and the first molding grooves A11 and the second molding grooves A12 are arranged alternately). Step 2: Operate the master mold A and perform electroplating, so that the main metal of the main metal electroplating solution b in the main metal electroplating tank B is deposited in each forming groove A1 of the master mold A, thereby forming a plurality of metal grid lines 1. The formed plurality of metal grid lines 1 constitute an incompletely closed metal pattern. Each of the formed metal grid lines 1 forms a plurality of metal pattern units 10. Each metal pattern unit 10 has a plurality of metal grid lines 1 distributed in an interdigitated manner (the metal grid lines 1 of each metal pattern unit 10 are divided into a first metal grid line 101 and a second metal grid line 102, and the first metal grid lines 101 and the second metal grid lines 102 are arranged in an alternating manner). The width of the metal grid lines 1 is 20 to 400 μm (i.e., the width of the forming groove A1 is 20 to 400 μm). Step 3: Unwind the adsorption film D, and allow each metal grid line 1 on the master mold A to be adsorbed on the surface of the adsorption film D, so as to peel the metal grid line 1 from the master mold A; and after the metal grid line 1 is adsorbed on the surface of the adsorption film D, the metal grid line 1 and the adsorption film D are placed together in at least one coating metal electroplating tank C having a coating metal electroplating solution c for electroplating, so that the coating 11 metal in the coating metal electroplating solution c in the coating metal electroplating tank C is coated on the surface of the metal grid line 1, so that the metal grid line 1 is coated with a coating 11; wherein, the unwound adsorption film D is pressed against the surface of the mother mold A by a pressure roller. As the mother mold A rotates and the adsorption film D moves, the metal grid lines 1 on the mother mold A are adsorbed by the adsorption film D and transferred to the adsorption film D. The adsorption film D may include a composite film layer and an elastic layer. The elastic layer is used to adsorb the metal grid lines 1. The deformation performance of the film layer is lower than that of the elastic layer. The film layer plays a supporting role. The gram weight of the adsorption film D is 30 to 100 gsm. Step 4: Roll up the adsorption film D and the metal grid lines 1 adsorbed on the surface of the adsorption film D together, thereby obtaining a metal grid line coil 2 .

[0046] In the third embodiment of the present invention, after the metal grid line 1 is peeled off from the mother mold A, it enters the coating metal electroplating tank C for electroplating, so that the surface of the metal grid line 1 is covered with a layer of metal coating 11; the main metal and the coating 11 metal can be made of the same metal material, so that the overall width, thickness and other properties of the formed metal grid line 1 are more uniform; the main metal and the coating 11 metal can also be made of different metal materials, so that they can have the characteristics of different metal materials and can also reduce manufacturing costs (the main metal uses low-cost metal and the coating 11 metal uses high-performance metal).

[0047] In the third embodiment of the present invention, after the metal grid line 1 is adsorbed on the surface of the adsorption film D, the metal grid line 1 can enter multiple metal plating tanks C for electroplating and perform multiple electroplating processes; when the number of metal plating tanks C is greater than or equal to two, the metal plating solutions c in each metal plating tank C can be the same or completely different or not exactly the same, and can be flexibly designed and operated according to the purpose of the metal grid line 1; the metal plating solution c in the metal plating tank C can be a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or an alloy plating solution.

[0048] In embodiment three of the present invention, the specific parameters for preparing the metal grid line 1 of the present invention may be: the material of the metal grid line 1 is nickel (that is, the main metal electroplating solution b is a nickel electroplating solution), the plating layer 11 is a copper plating layer 11 (that is, the plating metal electroplating solution c is a copper electroplating solution), the widths of the first molding groove A11 and the second molding groove A12 of the mother mold A are completely different, the film layer of the adsorption film D is a biaxially oriented polyester film, and the material of the elastic layer of the adsorption film D is a polyurethane elastic resin.

[0049] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present invention.

Claims

1. A method for preparing a metal grid line, characterized in that: The following steps are included: Step 1: Immerse a master mold having a plurality of pre-formed grooves in its surface in a bulk metal electroplating bath containing bulk metal electroplating solution; the bottom of the grooves in the master mold is made of metal, and the surface of the master mold other than the grooves is made of a non-conductive material; Step 2: operating the master mold and performing electroplating, so that the main metal of the main metal plating solution in the main metal plating tank is deposited in each forming groove of the master mold, thereby forming a plurality of metal grid lines; Step 3: Unwind the adsorption film and allow the metal grid lines on the master mold to be adsorbed on the surface of the adsorption film, so as to peel the metal grid lines from the master mold.

2. The method for preparing a metal grid line according to claim 1, wherein: The molding grooves of the master mold form an open figure; and the plurality of metal grid lines formed in step 2 form an incompletely closed metal pattern.

3. The method for preparing a metal grid line according to claim 2, wherein: The molding grooves of the master mold form multiple graphic units, each graphic unit has multiple molding grooves distributed in an interdigitated shape; the metal grid lines formed in step 2 form multiple metal pattern units, each metal pattern unit has multiple metal grid lines distributed in an interdigitated shape.

4. The method for preparing a metal grid line according to claim 1, wherein: The width of the molding groove of the master mold is 20 to 400 μm; the width of the metal grid line is 20 to 400 μm.

5. The method for preparing a metal grid line according to claim 1 or 4, wherein: The widths of the molding grooves of the master mold are the same, completely different, or different.

6. The method for preparing a metal grid line according to claim 1, wherein: The master mold is a roller structure or a flat belt structure.

7. The method for preparing a metal grid line according to claim 1, wherein: The adsorption film comprises a composite film layer and an elastic layer, and the elastic layer is used for adsorption with the metal grid line.

8. The method for preparing a metal grid line according to claim 1 or 7, wherein: The adsorption film has a gram weight of 30 to 100 gsm.

9. The method for preparing a metal grid line according to claim 7, wherein: The film layer of the adsorption film is a biaxially stretched film.

10. The method for preparing a metal grid line according to claim 9, wherein: The biaxially oriented film is a biaxially oriented polyethylene film, a biaxially oriented polypropylene film or a biaxially oriented polyester film.

11. The method for preparing a metal grid line according to claim 7, wherein: The elastic layer of the adsorption film is made of ethylene-vinyl acetate copolymer or polyolefin.

12. The method for preparing a metal grid line according to claim 1, wherein: In step three, after the metal grid line is adsorbed on the surface of the adsorption film, the metal grid line and the adsorption film are placed together in at least one metal plating tank having a metal plating solution for electroplating, so that the metal plating solution in the metal plating tank is plated on the surface of the metal grid line, so that the surface of the metal grid line is covered with a plating layer.

13. The method for preparing a metal grid line according to claim 12, wherein: When the number of the coating metal electroplating tanks is greater than or equal to two, the coating metal electroplating solutions in the respective metal electroplating tanks are the same, completely different, or not identical.

14. A method for preparing a metal grid line according to claim 12 or 13, characterized in that: The metal plating solution for the plated layer is a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or an alloy plating solution.

15. The method for preparing a metal grid line according to claim 1, wherein: The main layer metal electroplating solution is a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution or an alloy electroplating solution.

16. The method for preparing a metal grid line according to claim 1, wherein: Also includes step four; Step 4: Rolling up the adsorption film and the metal grid lines adsorbed on the surface of the adsorption film together to obtain a metal grid line coil.

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