Condition setting assistance method, storage medium, and condition setting assistance device

Abstract

The invention relates to a condition setting assistance method and apparatus, and a storage medium, which can grasp the distribution of the supply amount of a developing solution supplied into a substrate surface along with developing processing. The condition setting assistance method includes: a step of acquiring process information indicating a condition of a developing process including a process of supplying a developer from a nozzle to a surface of a substrate while moving the nozzle along the surface of the substrate; a step of repeating the first step and the second step by assuming the nozzle to move in stages at any time interval to calculate the supply amount of the developer supplied to each of a plurality of positions on the surface of the substrate; and outputting the calculation result of the supply amount of the developing solution supplied to each of the plurality of positions. In the first step, the moving position of the nozzle is calculated according to the operation of the nozzle based on the processing information, and in the second step, the amount of the developing solution corresponding to the time interval is added to one or more target positions corresponding to the calculation result in the first step.

Description

Technical Field

[0001] The present invention relates to a condition setting auxiliary method, a storage medium and a condition setting auxiliary device. Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus, a substrate processing method, a substrate processing system, and a method for generating learning data, which can reduce the burden on an operator.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-108367 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a condition setting assisting method, a storage medium, and a condition setting assisting device capable of grasping the distribution of the supply amount of a developer supplied to a substrate surface during a development process.

[0008] Technical solutions to technical problems

[0009] A condition setting support method according to one aspect of the present invention includes: acquiring processing information indicating conditions for a development process, wherein the development process includes supplying a developer from a nozzle capable of discharging the developer to the substrate surface while moving the nozzle along the substrate surface; calculating the amount of developer supplied to each of a plurality of locations on the substrate surface by repeatedly performing steps 1 and 2, assuming that the nozzle moves in stages at arbitrary time intervals; and outputting the calculated results of the amounts of developer supplied to each of the plurality of locations. In step 1, the nozzle movement position is calculated based on the nozzle movement based on the processing information, and in step 2, the developer amount corresponding to the time interval is added to one or more target locations among the plurality of locations corresponding to the calculated results of the nozzle movement position in step 1.

[0010] Effects of the Invention

[0011] According to the present invention, a condition setting support method, a storage medium, and a condition setting support device capable of grasping the distribution of the amount of developer supplied into the substrate surface during development processing can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view schematically showing an example of a wafer processing system.

[0013] Figure 2It is a front view schematically showing an example of a wafer processing system.

[0014] Figure 3 It is a schematic diagram showing an example of an apparatus for performing a development process.

[0015] Figure 4 This is a block diagram showing an example of the functional configuration of a setting support device.

[0016] Figure 5 This is a diagram illustrating a plurality of measurement positions set within a wafer surface.

[0017] Figure 6 This is a flowchart illustrating a process flow for calculating the supply amount of the developer within the wafer surface.

[0018] Figure 7 (a) Figure 7 (b) Figure 7 (c) and Figure 7 (d) is a schematic diagram for explaining an example of a process of calculating the supply amount of the developer in the wafer surface.

[0019] Figure 8 (a) and Figure 8 (b) is a schematic diagram illustrating a situation of determining whether the measurement position is located within a circular nozzle. Figure 8 (c) and Figure 8 (d) is a schematic diagram illustrating a situation of determining whether the measurement position is located within a rectangular nozzle.

[0020] Figure 9 This is a block diagram showing an example of the hardware configuration of the setting support device.

[0021] Figure 10 (a) is a schematic diagram illustrating the initial position of the nozzle during the development process. Figure 10 (b) is a graph illustrating the relationship between the supply amount of the developer and the line width.

[0022] Figure 11 This is a diagram illustrating a plurality of measurement positions set along the radial direction of the wafer.

[0023] Figure 12 (a) is a graph illustrating the measurement results of the line width distribution in the radial direction. Figure 12 (b) is a graph illustrating the calculation results of the developer supply amount in the radial direction.

[0024] Description of Reference Numerals

[0025] 1…wafer processing system, W…wafer, Wa…surface, 200…setting auxiliary device, 202…computer main body, 204…input device, 206…monitor, 212…processing information acquisition unit, 216…supply quantity calculation unit, 218…result output unit, 222…line width data acquisition unit, 224…data accumulation unit, 226…parameter calculation unit, 228…relational expression construction unit. DETAILED DESCRIPTION

[0026] Hereinafter, a wafer processing system as a substrate processing apparatus according to the present embodiment will be described with reference to the accompanying drawings. In this specification, elements having substantially the same functional configuration are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0027] Wafer processing system

[0028] First, the configuration of the wafer processing system according to this embodiment will be described. Figure 1 、 2 1 and 2 are a plan view and a front view schematically showing the general structure of the wafer processing system 1. In this embodiment, the wafer processing system 1 is described as an example of a photolithography processing system that forms and develops a resist film on a wafer W (substrate).

[0029] like Figure 1 As shown, the wafer processing system 1 has: a box station 2, which can carry a box C containing a plurality of wafers W into and out of the box station 2; and a processing station 3, which includes a plurality of various processing devices for performing predetermined processing on the wafers W. The wafer processing system 1 has a structure in which the box station 2, the processing station 3 and the interface station 4 are integrally connected, and the interface station 4 is used to transfer the wafers W between the exposure device (not shown) adjacent to the opposite side of the processing station 3. In addition, the processing station 3 is as shown in FIG. Figure 1 As shown, two are provided between the cassette station 2 and the interface station 4, but one or more may be provided.

[0030] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. The cassette station 2 uses the wafer transfer device 22 or 23 to transfer wafers W between the cassette C mounted on the mounting table 12 and the processing station 3. To this end, the wafer transfer devices 22 and 23 each have a drive mechanism in the X direction, Y direction, vertical direction, and direction around the vertical axis (θ direction) as required, and may also have a drive mechanism in all directions.

[0031] At least one of the wafer conveyors 22 and 23 can transfer wafers W to and from the cassette C, and can also transfer wafers W to and from the processing station 3. Transferring wafers W to and from the processing station 3, for example, involves transferring wafers W to and from the third block G3. The third block G3 includes transfer devices accessible to a wafer conveyor 33 within the processing station 3, described later. The third block G3 may also include a plurality of transfer devices (not shown) arranged in a vertical direction.

[0032] Furthermore, the cassette station 2 may be provided with an inspection device (not shown) for inspecting the wafer W at a position accessible by either of the wafer transport devices 22 and 23 .

[0033] In the processing station 3, a plurality of blocks are provided, for example, the first block, the second block, and the fourth block, namely, three blocks G1, G2, and G4. Figure 2 As shown, a plurality of layers 31 including the first block, the second block G1, and the second block G2 are stacked in the vertical direction. For example, on the front side of the processing station 3 ( Figure 1 The first block G1 is provided on the negative side of the X direction of the processing station 3. Figure 1 The second block G2 is provided on the positive X direction side of the processing station 3. Figure 1 A fourth block G4 is provided in the portion connected to another adjacent processing station 3 (on the positive Y direction side) or in the portion connected to the adjacent processing station 3. The fourth block G4 may also include multiple transfer devices arranged in a vertical direction. In addition, the third block G3 described above may also be provided within the processing station 3.

[0034] Multiple processing devices are arranged in the first block G1, such as a patterning film forming apparatus and a development processing apparatus (not shown). The patterning film forming apparatus may include, for example, an anti-reflective film forming apparatus in addition to a resist film forming apparatus. For example, multiple processing devices may be arranged side by side in a horizontal direction. The number, arrangement, and type of these processing devices can be arbitrarily selected.

[0035] These pattern-forming film forming devices and development processing devices perform processes such as supplying a predetermined processing liquid or supplying a predetermined gas onto the wafer W. Thus, the pattern-forming film forming device forms a resist film used as a mask when forming a pattern of the underlying film, and forms an antireflection film for efficiently performing light irradiation processes such as exposure. Furthermore, the development processing device removes a portion of the exposed resist film to form the concave and convex shapes that serve as the mask. The first block G1 may also include a development unit U3 as an example of a device that performs development processing.

[0036] For example, in the second block G2, heat treatment devices (not shown) for performing heat treatments such as heating and cooling of the wafer W are arranged side by side in the vertical direction and in the horizontal direction. In addition, in the second block G2, a hydrophobic treatment device for performing hydrophobic treatment to improve the fixability of the resist liquid to the wafer W and a peripheral exposure device for exposing the outer periphery of the wafer W are arranged side by side in the vertical direction ( Figure 2 The number and arrangement of these heat treatment devices, hydrophobic treatment devices, and peripheral exposure devices can also be arbitrarily selected.

[0037] like Figure 1 As shown in FIG. 1 , a region sandwiched between the first block G1 and the second block G2 in a plan view forms a wafer conveyance region 32. In the wafer conveyance region 32, for example, a wafer conveyance device 33 is disposed.

[0038] The wafer conveyor 33 has a conveying arm that can move in the X direction, the Y direction, the θ direction, and the vertical direction. The wafer conveyor 33 can move within the wafer conveying area 32 and can convey the wafer W to the predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. Figure 1 In the case where there are multiple processing stations 3, the chip conveying device 33 installed in the processing station 3 located on the side of the interface station 4 can convey the chip W to the specified devices in the 1st block, the 2nd block, the 4th block G1, G2, G4 and the 5th block G5 described later.

[0039] For example, a plurality of wafer conveying devices 33 are arranged vertically. One wafer conveying device 33 can convey the wafer W to a plurality of layers 31 stacked vertically (see Figure 2 ) are provided at the height of the plurality of upper layers 31. Other wafer conveying devices 33 can convey wafers W to the height of the plurality of layers 31 located below these layers 31. A plurality of wafer conveying areas 32 are provided to enable such conveyance of wafers W. Furthermore, the number of wafer conveying devices 33 and the number of layers 31 corresponding to one wafer conveying device 33 can be arbitrarily selected, such as by providing a wafer conveying device 33 for each layer 31.

[0040] Furthermore, a shuttle device (not shown) may be provided in the wafer transfer area 32 or the first block G1 or the second block G2 to linearly transfer wafers W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0041] The interface station 4 is equipped with a fifth block G5 comprising multiple transfer devices, and wafer conveyors 41 and 42. The interface station 4 uses the wafer conveyor 41 or 42 to transport wafers W between the fifth block G5, where wafers W are transferred using the wafer conveyor 33, and the exposure unit. To this end, the wafer conveyors 41 and 42 each have drive mechanisms for the X direction, Y direction, vertical direction, and direction around the vertical axis (θ direction), as needed. Alternatively, they may have drive mechanisms for all directions. At least one of the wafer conveyors 41 and 42 can support a wafer W and transport it between the transfer device and the exposure unit within the fifth block G5.

[0042] The cleaning device for cleaning the surface of the wafer W and the aforementioned edge exposure device can be installed in the interface station 4 at a position that can be reached by either the wafer conveying device 41 or 42 .

[0043] The inspection device may be provided in the cassette station 2 as described above, but may also be provided in any of the transport arms ( Figure 1 or Figure 2 The position that can be reached by 33, 41, 42).

[0044] The wafer processing system 1 described above is provided with a control device 100. The control device 100 is, for example, a computer and includes a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of the drive systems of the various processing devices, transport devices, and the like described above, thereby implementing wafer processing in the wafer processing system 1. Alternatively, the program may be recorded on a computer-readable storage medium H and installed from the storage medium H into the control device 100.

[0045] The wafer processing system 1 may include a line width measuring device 49. The line width measuring device 49 measures the line width of the resist pattern on the surface of the wafer W after the development process. The line width measuring device 49 can measure the line width of the resist pattern in any manner. The line width measuring device 49 can also be configured to measure the line width at multiple measurement positions on the surface of the wafer W (for example, multiple measurement positions with different positions in the radial direction of the wafer W). The above-mentioned inspection device can function as the line width measuring device 49, and the inspection device can also measure the line width based on the image obtained by photographing the surface of the wafer W after development. A line width measuring device having the same function as the line width measuring device 49 can also be provided outside the wafer processing system 1. That is, the line width measuring device can also be a device outside the wafer processing system 1.

[0046] The wafer processing system 1 may include a setup assistance device 200. The setup assistance device 200 may be a computer independent of the control device 100. Alternatively, the setup assistance device 200 may be communicatively connected to the control device 100 via a wired, wireless, or communication network. If the linewidth measurement device is located outside the wafer processing system 1, the setup assistance device 200 may also be communicatively connected to the linewidth measurement device via a wired, wireless, or communication network. Details of the setup assistance device 200 will be described later.

[0047] Wafer Processing System Operation

[0048] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0049] First, a cassette C containing a plurality of wafers W is brought into the cassette station 2 of the wafer processing system 1 and placed on the cassette stage 21. Subsequently, the wafers W in the cassette C are sequentially removed by the wafer transfer device 22 or 23 and transferred to the transfer device in the third block G3.

[0050] The wafer W delivered to the transfer device of the third block G3 is supported by the wafer conveyor 33 and delivered to the hydrophobic treatment device located in the second block G2 for hydrophobic treatment. The wafer W is then delivered by the wafer conveyor 33 to the resist film forming device to form a resist film on the wafer W. After that, the wafer W is delivered to the heat treatment device for pre-baking treatment and then delivered to the transfer device of the fifth block G5. Figure 1 、 2 In such a case where there are multiple processing stations 3, the wafer W is temporarily placed in the transfer device of the fourth block G4 before being transferred to the transfer device of the fifth block G5, and then transferred between multiple wafer transfer devices 33. In addition, the wafer W can also be transferred to the peripheral exposure device by the wafer transfer device 33 as needed to perform exposure processing on the peripheral edge of the wafer W.

[0051] The wafer W transferred to the transfer device of the fifth block G5 is transferred to the exposure device by the wafer transfer devices 41 and 42 and subjected to exposure processing in a predetermined pattern. In addition, the wafer W can be cleaned by the cleaning device before the exposure processing.

[0052] The wafer W that has undergone the exposure process is transported to the transfer device in the fifth block G5 by the wafer transport devices 41 and 42. Thereafter, the wafer W is transported to the thermal treatment device by the wafer transport device 33 for post-exposure baking.

[0053] The wafer W that has undergone the post-exposure baking process is transported by the wafer transport device 33 to a developing device (such as the developing unit U3) for development. After development is completed, the wafer W is transported by the wafer transport device 33 to a heat treatment device 40 for post-bake processing.

[0054] Thereafter, the wafer W is transported by the wafer transport device 33 to the transfer device in the third block G3 and then transported by the wafer transport device 22 or 23 of the cassette station 2 to a predetermined cassette C on the cassette stage 21. Thus, a series of photolithography steps are completed.

[0055] Furthermore, the wafer processing system of the present invention is not limited to the structure and operation described above. For example, in the above embodiment, wafers W are transferred between the interface station 4 and the exposure apparatus. However, a direct connection to the exposure apparatus is not required. In this case, for example, wafer W is transferred from the cassette station 2 to the processing station 3, undergoes necessary processing, and is then transferred back to the cassette station 2 for external transport. Furthermore, non-essential devices among the devices listed as processing apparatuses may not be provided, or processing in such devices may not be performed.

[0056] <Developing unit>

[0057] Figure 3 1 is a schematic diagram showing the functional structure of the developing unit U3 and the control device 100. The developing unit U3 performs a developing process, which includes moving a nozzle capable of discharging a developing liquid along the surface of the wafer W (hereinafter referred to as "surface Wa") and supplying the developing liquid from the nozzle to the surface Wa. Figure 3 As shown, the developing unit U3 includes, for example, a rotation holding portion 50 and a developer supply portion 60 .

[0058] The rotating holding unit 50 holds and rotates the wafer W. The rotating holding unit 50 includes, for example, a holding unit 52 and a rotational drive unit 54. The holding unit 52 supports the back surface of the wafer W with its surface Wa (upper surface, front face) facing upward, holding the wafer W through vacuum suction or the like. The rotational drive unit 54 rotates the holding unit 52 about a vertical rotation axis Ax using a power source such as a Liat motor. Thus, the wafer W, held by the holding unit 52, rotates about the rotation axis Ax. The holding unit 52 can also hold the wafer W so that the center of the wafer W is substantially aligned with the rotation axis Ax.

[0059] The developer supply unit 60 supplies developer to the surface Wa of the wafer W held by the holding unit 52. The developer is a processing liquid used to remove the portion of the resist film (coating) to be removed after exposure. The portion of the resist film to be removed is the portion that can be dissolved in the developer after the exposure process. In the case where the developer is a positive type, the portion exposed during the exposure process can be dissolved in the developer. In the case where the developer is a negative type, the portion not exposed during the exposure process can be dissolved in the developer. As a specific example of a positive type developer, an alkaline solution can be cited. As a specific example of a negative type developer, an organic solvent can be cited. The developer supply unit 60 includes, for example, a nozzle 61, a supply pipe 67, a container 62, a pump 63, a valve 64, and a nozzle drive unit 66.

[0060] The nozzle 61 discharges the developer onto the surface Wa of the wafer W. The nozzle 61 is arranged to be movable along the surface of the wafer W. When viewed from vertically above, the shape of the nozzle 61 can be circular or rectangular. A discharge port for discharging the developer is provided on the lower surface of the nozzle 61 (the end surface facing the surface Wa of the wafer W).

[0061] The nozzle 61 is connected to a container 62 via a supply pipe 67. The container 62 contains a developer. A pump 63 and a valve 64 are provided in the supply pipe 67. The pump 63 is, for example, a bellows pump, which pressure-feeds the developer from the container 62 to the nozzle 61. The valve 64 is, for example, a pneumatically operated valve, which adjusts the opening of the flow path in the supply pipe 67. By controlling the valve 64, the nozzle 61 can be switched between a state in which the developer is discharged and a state in which the developer is not discharged.

[0062] The nozzle driver 66 adjusts the position of the nozzle 61. The nozzle driver 66 moves the nozzle 61 along the surface Wa, with the nozzle outlet facing downward. The nozzle driver 66 may include a mechanism for moving the nozzle 61 along the surface Wa of the wafer W using a power source such as a motor, and a mechanism for raising and lowering the nozzle 61 using a power source such as a motor. Alternatively, the nozzle driver 66 may move the nozzle 61 along a path passing through the rotation axis Ax of the wafer W (i.e., in the radial direction of the wafer W) while moving along the surface Wa of the wafer W. Alternatively, the nozzle driver 66 may move the nozzle 61 along a linear path.

[0063] The control device 100 includes, for example, a development control unit 102 and a condition storage unit 104 as functional components (hereinafter referred to as "functional blocks"). Processes executed by these functional blocks correspond to processes executed by the control device 100.

[0064] The development control unit 102 controls the development unit U3 to perform a development process on the resist film (film) formed on the surface Wa of the wafer W. During the development process, the development control unit 102 controls the developer supply unit 60 so that the developer is supplied from the nozzle 61 to the surface Wa while the nozzle 61 is moved along the surface Wa. The development control unit 102 may move the nozzle 61 using the nozzle drive unit 66 when the developer is ejected from the nozzle 61 so that the lower surface of the nozzle 61 does not contact the developer already supplied to the surface Wa. Alternatively, the development control unit 102 may move the nozzle 61 using the nozzle drive unit 66 when the developer is ejected from the nozzle 61 so that the lower surface of the nozzle 61 is in contact with the developer already supplied to the surface Wa.

[0065] In one example, the development control unit 102 causes the nozzle 61 to discharge the developer by causing the nozzle driver 66 to move the nozzle 61 in the radial direction of the wafer W from the outer edge of the wafer W toward the center of the wafer W. Alternatively, the development control unit 102 causes the nozzle 61 to discharge the developer by causing the nozzle driver 66 to move the nozzle 61 in the radial direction of the wafer W from the center of the wafer W toward the outer edge of the wafer W. Alternatively, the development control unit 102 causes the nozzle driver 66 to perform a plurality of movement operations of the nozzle 61, including movement toward the center and movement toward the outer edge, when causing the nozzle 61 to discharge the developer.

[0066] Alternatively, the development control unit 102 controls the rotation holding unit 50 to rotate the wafer W about the rotation axis Ax while moving the nozzle 61 to discharge the developer. The development control unit 102 performs a development process on the wafer W using the development unit U3 under predetermined conditions (hereinafter referred to as "control conditions").

[0067] The condition storage unit 104 stores the aforementioned control conditions. The control conditions stored in the condition storage unit 104 include, for example, the movement speed and acceleration of the nozzle 61 when discharging the developer from the nozzle 61, and the rotation speed and rotational acceleration of the wafer W when discharging the developer from the nozzle 61. The control conditions stored in the condition storage unit 104 may also include the movement start and end positions of the nozzle 61 when discharging the developer while moving. The control conditions stored in the condition storage unit 104 may also include the total amount of developer supplied during the operation of discharging the developer while moving the nozzle 61. The condition storage unit 104 may also store reference values ​​for the control conditions.

[0068] <Setting up auxiliary devices>

[0069] Figure 4An example of a setting assisting device 200 is schematically shown. The setting assisting device 200 (condition setting assisting device) is a device that assists in setting control conditions when performing a development process, wherein the development process includes a process of supplying a developer from the nozzle 61 to the surface Wa of the wafer W while moving the nozzle 61 along the surface Wa of the wafer W. The line width distribution of the resist pattern formed on the surface Wa of the wafer W after the development process varies depending on the set values ​​of the control conditions. The so-called line width distribution is a collection of line widths at each of a plurality of measurement positions arbitrarily set on the surface Wa of the wafer W. The line width distribution can also be a distribution (profile) that represents the variation of the line width of the surface Wa.

[0070] Even when developing is performed with the control conditions set to reference values, the line width distribution of the resist pattern formed on the surface Wa after the development process may not be the desired distribution due to various factors, such as individual differences in the apparatus or the environment. In such cases, an operator, such as an operator of the wafer processing system 1, can use the setting support device 200 to set (adjust) the control conditions. Setting the control conditions can include changing the set value of the control condition from the reference value and maintaining the set value of the control condition at the reference value.

[0071] The configuration support device 200 is composed of one or more computers (eg, one computer). The computer constituting the configuration support device 200 may be a personal computer, a tablet computer (tablet terminal), a smartphone, a workstation, a server computer, or a general-purpose computer.

[0072] The configuration support device 200 includes, for example, a computer main body 202, an input device 204, and a monitor 206. The computer main body 202 is a device (the main body of the computer) that performs the main functions of the computer constituting the configuration support device 200. The input device 204 is a device for inputting information into the computer main body 202. The input device 204 may be any device as long as it can input desired information into the computer main body 202. Specific examples include operation interfaces such as a keyboard, a mouse, and an operation controller.

[0073] Monitor 206 is a device for displaying information output from computer 202. Monitor 206 can be any device capable of displaying graphics, and a specific example is a liquid crystal panel. Input device 204 and monitor 206 can be integrated into a touch panel. Computer 202, input device 204, and monitor 206 can be integrated into a single device, similar to a tablet computer.

[0074] The following describes the outline of the calculations performed by the computer main body 202 of the setting support device 200. The setting support device 200 calculates the amount of developer supplied to each of the plurality of measurement positions on the surface Wa, assuming that the development process is performed under certain control conditions. The plurality of measurement positions (hereinafter referred to as "plurality of measurement positions P") can be, for example, Figure 5 As shown in FIG, the plurality of measurement positions P (a plurality of positions) may be set to be arranged in a matrix in two directions perpendicular to the surface Wa. Figure 5 In FIG, two directions perpendicular to the surface Wa are represented by the "X axis" and the "Y axis." One of the plurality of measurement positions P may be set to overlap with the center of the wafer W (hereinafter referred to as the "center CP").

[0075] The coordinates of each of the multiple measurement positions P can be represented by the distance from the center CP of each X-axis and Y-axis, where the X-axis and Y-axis are perpendicular to each other along the surface Wa. The multiple measurement positions P can be pre-set by the provider of the setting assistance device 200 or specified by an operator who is a user of the setting assistance device 200. The setting assistance device 200 calculates the amount of developer supplied to each of the multiple (all) measurement positions P set on the surface Wa. The calculated value of the developer supply amount for each measurement position P can also be a theoretical value, a calculated value, or a predicted value.

[0076] The computer main body 202 of the setting support device 200 includes, as functional blocks, a processing information acquisition unit 212, a calculation condition acquisition unit 214, a supply amount calculation unit 216, and a result output unit 218. The processing executed by these functional blocks corresponds to the processing executed by the computer main body 202 (setting support device 200).

[0077] The processing information acquisition unit 212 acquires information indicating control conditions (hereinafter referred to as "processing information"), which serve as a prerequisite for calculating the developer supply amount. The calculation condition acquisition unit 214 acquires calculation conditions for calculating the developer supply amount. The supply amount calculation unit 216 calculates the developer supply amount at each measurement position P on the surface Wa of the wafer W by repeatedly performing predetermined calculations based on the calculation conditions acquired by the calculation condition acquisition unit 214.

[0078] The supply amount calculation unit 216 repeatedly performs the following first and second steps, assuming that the nozzle 61 moves in stages at arbitrary time intervals, to calculate the supply amount of the developer to each of the plurality of measurement positions P on the surface Wa of the wafer W. As described above, during the development process, the developer is discharged from the nozzle 61 while the nozzle 61 moves along the surface Wa. The supply amount calculation unit 216 performs the first and second steps assuming that the nozzle 61, which is performing the development process, stops at each time (moment) determined at an arbitrary time interval and that the nozzle 61 discharges the developer from the stopped position.

[0079] In the first step, the supply amount calculation unit 216 calculates the movement position of the nozzle 61 based on the movement of the nozzle 61 according to the processing information. For example, in the first step, the supply amount calculation unit 216 calculates the movement position of the nozzle 61 in the radial direction of the wafer W based on the movement speed and acceleration of the nozzle 61 indicated by the processing information. In the first step, the supply amount calculation unit 216 may also calculate the movement position of the nozzle 61 in the circumferential direction of the wafer W based on the rotational speed and rotational acceleration of the wafer W indicated by the processing information, in addition to calculating the movement position of the nozzle 61 in the radial direction of the wafer W. The movement position of the nozzle 61 calculated in the first step is the position of the nozzle 61 on the surface Wa of the wafer W (the relative position of the nozzle 61 with respect to the surface Wa of the wafer W).

[0080] In the aforementioned second step, the supply amount calculation unit 216 adds the developer supply amount corresponding to the time interval to one or more target positions P among the multiple measurement positions corresponding to the calculation result of the nozzle 61's movement position in the first step. For example, in the aforementioned second step, the supply amount calculation unit 216 identifies one or more measurement positions P among the multiple measurement positions P that overlap with the nozzle 61 moved to the movement position calculated in the first step as the one or more target positions. The measurement positions P overlapping with the nozzle 61 are measurement positions within the outer edge of the lower surface, i.e., the end surface of the nozzle 61 where the discharge port is located, when viewed from above (vertically above). Details of the method for calculating the supply amount at each measurement position P will be described later.

[0081] The result output unit 218 outputs the calculation result of the developer supply amount for each measurement position P calculated by the supply amount calculation unit 216. The result output unit 218 displays the calculation result of the developer supply amount for each measurement position P on the monitor 206, for example. This allows the user of the setting support device 200 to understand the distribution of the calculated developer supply amount on the surface Wa when the development process is performed under certain control conditions.

[0082] Figure 62 shows a process flow executed by the computer main body 202 of the setting support device 200 as an example of a condition setting support method of the setting support device 200. The following example illustrates a case where, while the developer is being discharged from the nozzle 61 during a development process, the nozzle 61 is moved in the radial direction of the wafer W from the center to the outer edge of the wafer W. Based on this movement, the amount of developer supplied to each of a plurality of measurement positions P is calculated.

[0083] exist Figure 6 In the illustrated processing flow, the computer main body 202 first executes step S01. In step S01, for example, the processing information acquisition unit 212 acquires the processing information described above. The processing information acquisition unit 212 may also acquire processing information based on user input using the input device 204. For example, when the user of the setting support device 200 wishes to know the amount of developer supplied at each measurement position P when the control condition is set to a reference value, the user inputs the control condition set to the reference value as processing information (reference processing information) using the input device 204. Instead of user input, the processing information acquisition unit 212 may also acquire at least a portion of the processing information from a sensor provided in the developing unit U3 (e.g., a sensor within the motor within the nozzle drive unit 66).

[0084] Next, the computer main body 202 executes step S02. In step S02, for example, the calculation condition acquisition unit 214 acquires the calculation conditions for calculating the developer supply amount at each measurement position P. The calculation condition acquisition unit 214 may also acquire the calculation conditions based on user input via the input device 204. An example of the calculation conditions may be a condition that specifies the time interval for repeating the above-described first and second steps. Alternatively, the above-described first and second steps may be repeated at a time interval specified by the calculation conditions.

[0085] Next, the computer main body 202 executes step S03. In step S03, for example, the supply amount calculation unit 216 sets the time t indicating the calculation timing of the first step and the second step to an initial value (specifically, 0).

[0086] Next, the computer main body 202 executes step S04. In step S04, for example, the supply amount calculation unit 216 calculates the position of the nozzle 61 corresponding to time t. Step S04 corresponds to the first step described above. The supply amount calculation unit 216 may also calculate the position (movement position) of the nozzle 61 based on the current value of time t and the movement of the nozzle 61 determined by the processing information acquired in step S01. In step S04, executed immediately following step S03, the movement start position of the nozzle 61 during the target movement of the development process is calculated as the position of the nozzle 61. Figure 7 (a) illustrates the nozzle 61 in a state where it is arranged at the movement start position.

[0087] Next, the computer main body 202 executes step S05. In step S05, for example, the supply amount calculation unit 216 determines one or more target positions among the plurality of measurement positions P that overlap with the nozzle 61 that is assumed to be stopped at the movement position calculated in the immediately preceding step S04. Figure 7 In the example shown in (a), the measurement position P0 located at the center CP of the wafer W is determined as the target position among the plurality of measurement positions P. Steps S04 and S05 correspond to the second step described above.

[0088] Next, the computer main body 202 executes step S06. In step S06, for example, the supply amount calculation unit 216 adds the developer supply amount corresponding to the time interval specified by the calculation conditions acquired in step S02 to the one or more target positions identified in step S05. The supply amount calculation unit 216 does not add the developer supply amount corresponding to the time interval to measurement positions P among the multiple measurement positions P that were not identified as target positions. The developer supply amount corresponding to the time interval can be calculated, for example, by multiplying the total amount of developer supplied in the target operation for calculating the supply amount for each measurement position P by the ratio of the time interval to the execution time of the target operation.

[0089] Next, the computer main body 202 executes steps S07 and S08. In step S07, for example, the supply amount calculation unit 216 adds "Δt" indicating the time interval to time t. In step S08, for example, the supply amount calculation unit 216 determines whether the termination condition is satisfied. The supply amount calculation unit 216 determines that the termination condition is satisfied when, for example, the current value of time t reaches the execution time of the target operation for calculating the supply amount at each measurement position P. Alternatively, the supply amount calculation unit 216 may determine that the termination condition is satisfied when the movement position of the nozzle 61 in step S04 reaches the movement end position of the nozzle 61 in the target operation for the development process.

[0090] If, in step S08, it is determined that the termination condition is not satisfied (step S08: No), the processing executed by the computer main body 202 returns to step S04, and the computer main body 202 repeats the series of processing of steps S04 to S08. In step S04 for the second and subsequent times, the value of time t changes, and accordingly, the movement position of the nozzle 61 (the position relative to the surface Wa of the wafer W) changes according to the value of time t.

[0091] like Figure 7As shown in (b), in step S04 for the second and subsequent times, the movement position of nozzle 61 calculated by supply amount calculation unit 216 has moved a distance x corresponding to the value of time t in the radial direction (e.g., the X-axis direction) of wafer W. Distance x can be calculated based on the movement speed and acceleration of nozzle 61 indicated by the processing information and the value of time t. In step S04, the movement position of nozzle 61 may also be the movement position of the center of nozzle 61 when viewed from above.

[0092] The relative position of the nozzle 61 with respect to the surface Wa of the wafer W changes not only due to the movement of the nozzle 61 in the radial direction but also due to the rotation of the wafer W. In actual development processing, the wafer W rotates, but in this processing flow, the wafer W is fixed and the calculation of the movement position of the nozzle 61 is performed assuming that the nozzle 61 moves in the circumferential direction of the wafer W. The movement position of the nozzle 61 calculated by the supply amount calculation unit 216 is as follows: Figure 7 As shown in (c), the wafer W moves in the circumferential direction by an angle θ corresponding to the value of time t. The angle θ can be obtained based on the rotation speed and rotation acceleration of the wafer W indicated by the processing information and the value of time t.

[0093] As described above, in step S04 (first step), the movement position of the nozzle 61 may be calculated by assuming that the nozzle 61 moves in both the radial and circumferential directions of the wafer W. If the nozzle 61 is circular, only the movement position of the center of the nozzle 61 may be calculated. If the nozzle 61 is a quadrilateral, not only the movement position of the center of the nozzle 61 but also the movement positions of each of the four corners of the nozzle 61 may be calculated.

[0094] Figure 7 (d) shows the nozzle 61 in a state where it has moved a distance x in the radial direction of the wafer W and an angle θ in the circumferential direction of the wafer W. Figure 7 In the example shown in (d), the supply amount calculation unit 216 specifies measurement position P1 and measurement position P2 among the plurality of measurement positions P as one or more target positions overlapping with the nozzle 61 in step S05. The supply amount calculation unit 216 adds the developer supply amount corresponding to the time interval to measurement position P1 and measurement position P2. Alternatively, when two or more target positions are specified, the supply amount calculation unit 216 adds the developer supply amount corresponding to the time interval to each of the two or more target positions.

[0095] By repeating the series of steps S04 to S07, the developer supply amount calculated each time is added (cumulatively) to each measurement position P when it is determined to be a target position (when it is determined to overlap with the nozzle 61). When the supply amount is added to a certain measurement position P, the supply amount calculation unit 216 stores the added value for that measurement position P, and accumulates the developer supply amount for each measurement position P. Therefore, at the time the series of steps S04 to S07 is completed, the developer supply amount (cumulative value) can be obtained for each of the multiple measurement positions P.

[0096] To facilitate understanding of the processing flow, consider a case where the target operation in the development process (including the movement and discharge of the nozzle 61 in one direction, and calculation of the supply amount at each measurement position P) is performed over a 10-second period. Furthermore, consider a case where the calculation conditions specify that the execution time of the target operation, i.e., the 10-second period, is divided into 0.1-second units for calculation.

[0097] The supply amount calculation unit 216 first calculates the movement position of the nozzle 61 at time 0 seconds. Once one or more target positions are determined, the supply amount corresponding to 0.1 seconds (time interval) is added to each of the one or more target positions. The supply amount corresponding to 0.1 seconds can be calculated by multiplying the total amount of developer supplied during the 10-second target movement by 1 / 100. Next, the supply amount calculation unit 216 calculates the movement position of the nozzle 61 at time 0.1 seconds. Once one or more target positions are determined, the supply amount corresponding to 0.1 seconds is added to each of the one or more target positions.

[0098] Next, the supply amount calculator 216 calculates the movement position of the nozzle 61 at 0.2 seconds. Once one or more target positions are identified, the supply amount corresponding to 0.1 seconds is added to each of the one or more target positions. The supply amount calculator 216 then repeats this calculation, adding 0.1 seconds to the time until 10 seconds are reached. This calculation includes calculating the movement position of the nozzle 61, identifying one or more target positions, and adding the supply amount corresponding to 0.1 seconds. This allows calculation of the developer supply amount at each measurement position P, assuming that the nozzle 61 is moving and discharging developer from the nozzle 61 for 10 seconds (assuming this is the case).

[0099] If, in step S08, the termination condition is determined to be satisfied (step S08: YES), the processing executed by the computer main body 202 proceeds to step S09. In step S09, for example, the result output unit 218 causes the monitor 206 to display the cumulative value of the developer supply amount at each measurement position P. The result output unit 218 may display the cumulative value of the developer supply amount at each measurement position P numerically or in a graph format on the monitor 206. The processing flow ends at this point.

[0100] If the user wishes to know not only the control condition set as the reference value (hereinafter referred to as the "reference condition") but also the developer supply amount at each measurement position P under other conditions, the user can change the processing information and cause the setting support device 200 to execute the processing flow again. For example, the setting support device 200 may acquire reference processing information indicating the reference condition in step S01 and execute the processing flow, and then acquire setting processing information indicating setting conditions that have changed at least a portion of the reference condition in step S01 and execute the processing flow.

[0101] The supply amount calculation unit 216 may calculate the developer supply amount for each measurement position P for both the reference processing information and the setting processing information. Furthermore, the result output unit 218 may cause the monitor 206 to display the calculated developer supply amount for each measurement position P for both the reference processing information and the setting processing information. The setting support device 200 may calculate the developer supply amount for each measurement position P for each of a plurality of setting processing information corresponding to a plurality of setting conditions, at least some of which differ from each other.

[0102] Next, use Figure 8 (a) Figure 8 (b) Figure 8 (c) and Figure 8 (d) of step S05 will now be described, with reference to an example of a method for determining the target position in step S05. As described above, in step S05, the target position is determined to be the measurement position P among the multiple measurement positions P that overlaps with the nozzle 61 at the movement position at a certain time t. If the supply amount calculation unit 216 determines that the nozzle 61 is circular, in step S05 (step 1), for each measurement position P, the supply amount calculation unit 216 may determine whether the measurement position P overlaps with the nozzle 61 based on whether the distance between the center of the nozzle 61 and the measurement position P is less than or equal to the radius r of the nozzle 61.

[0103] Focus on any one of the plurality of measurement positions P. Alternatively, the supply amount calculation unit 216 may be configured as follows: Figure 8As shown in (a), when the distance between the center O of the nozzle 61 and the measurement position P (the position to be determined) is greater than the radius r of the nozzle 61, it is determined that the measurement position P and the nozzle 61 do not overlap. The supply amount calculation unit 216 can also be as follows Figure 8 As shown in (b), when the distance between the center O of the nozzle 61 and the measurement position P is equal to or smaller than the radius r of the nozzle 61 , it is determined that the measurement position P and the nozzle 61 overlap.

[0104] When the supply amount calculation unit 216 determines that the shape of the nozzle 61 is a quadrilateral, in step S05 (step 2), for each measurement position P, it is determined whether it overlaps with the nozzle 61 based on the sign of the result obtained by calculating the vector product of all combinations of a pair of adjacent angles of the nozzle 61, wherein the vector product is the vector product of the vector formed by the pair of angles and the vector formed by one of the angles and the measurement position P (the position to be determined). Here, as Figure 8 As shown in (c) and (d) of FIG, the four corners of the rectangular nozzle 61 are designated "A," "B," "C," and "D," respectively. Furthermore, the vector from a certain point G to a point H is designated "GH," and the cross product of the vectors is represented by "×." The supply amount calculation unit 216 calculates AB×AP, BC×BP, CD×CP, and DA×DP.

[0105] "AB", "BC", "CD" and "DA" are vectors formed by a pair of adjacent angles of the nozzle 61. "AP", "BP", "CP" and "DP" are vectors formed by one of the above-mentioned angles and the measurement position P. The supply amount calculation unit 216 can also calculate the supply amount when the signs of the vector products of the four vectors are not all the same (all positive or all negative) (by Figure 8 In the case of the example (c) of FIG. 1 ), it is determined that the measurement position P does not overlap with the nozzle 61. The supply amount calculation unit 216 may also determine that the measurement position P does not overlap with the nozzle 61 when the signs of the vector products of the four vectors are all the same (all positive or negative) (by Figure 8 In the case shown in (d), it is determined that the measurement position P overlaps with the nozzle 61.

[0106] The processing information acquired by the processing information acquisition unit 212 or the calculation conditions acquired by the calculation condition acquisition unit 214 may also include information indicating the shape of the nozzle 61 when viewed from above. If the shape of the nozzle 61 (the shape of the end surface of the nozzle 61 where the discharge port is provided) when viewed from above is circular, information indicating the radius r of the nozzle 61 may also be included in the processing information or calculation conditions. If the shape of the nozzle 61 (the shape of the end surface of the nozzle 61 where the discharge port is provided) when viewed from above is a quadrilateral, information indicating the positional relationship between the center of the nozzle 61 and each of the four corners of the nozzle 61 may also be included in the processing information or calculation conditions.

[0107] Figure 9 The hardware structure of the configuration support device 200 is schematically shown. The computer main body 202 of the configuration support device 200 includes, for example, a circuit 250. Circuit 250 includes a processor 252, a memory 254, a storage 256, input / output ports 258, and a timer 259. The storage 256 is composed of one or more nonvolatile storage devices such as flash memory or a hard disk. The storage 256 stores programs for the various functional blocks of the computer main body 202 described above.

[0108] The memory 254 is composed of, for example, one or more volatile storage devices such as a random access memory. The memory 254 temporarily stores programs downloaded from the memory 256. The processor 252 is composed of one or more computing devices such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 252 constructs the various functional blocks of the setting support device 200 by executing the programs downloaded to the memory 254. The calculation results of the processor 252 are temporarily stored in the memory 254. The input / output port 258 inputs and outputs information to and from the input device 204, the monitor 206, etc. in response to requests from the processor 252. The timer 259 measures elapsed time by, for example, counting reference pulses at a certain period.

[0109] The hardware structure of the configuration support device 200 is not necessarily limited to configuring each functional block using a program. For example, each functional block of the configuration support device 200 may be configured using a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating these circuits. The configuration support device 200 may also be configured using multiple computers connected to each other for communication.

[0110] Next, refer to Figure 10 (a) and (b) of FIG. 1 describe an example of a method of utilizing the result of calculation of the developer supply amount calculated for each measurement position P by the setting support device 200 . Figure 10 (a) illustrates the start time of the operation of discharging the developer while moving the nozzle 61 during the development process. For example, under the control conditions (reference conditions) set to the reference value, the discharge operation starts when the nozzle 61 is positioned so that the center of the nozzle 61 is aligned with the center CP of the wafer W (the position indicated by "0").

[0111] In the control condition, the supply amount of the developer at the measurement position P corresponding to the center CP is different by shifting the operation start position of the nozzle 61 from the center CP along the movement line of the nozzle 61. The supply amount of the developer at the center CP is calculated by shifting the operation start position of the nozzle 61 from the center CP by "+10mm", "+5mm", "0mm", "-5mm", and "-10mm". Figure 10 As shown in (b). Let the direction of the nozzle 61 in the ejection action be "+" (positive), and "0 mm" means that the action start position of the nozzle 61 is set at the center CP. Figure 10 In the graph of (b), the horizontal axis represents the calculation result of the supply amount of the developer at the center CP.

[0112] When the center CP is offset by -5 mm or -10 mm, the overlap time between the center CP and the nozzle 61 is longer than when the center CP is offset by 0 mm. Conversely, when the center CP is offset by +5 mm or +10 mm, the overlap time between the center CP and the nozzle 61 is shorter than when the center CP is offset by 0 mm. Therefore, the further the nozzle 61's operation start position is from its operation end position, the greater the amount of developer supplied to the center CP.

[0113] exist Figure 10 In the graph of (b), the vertical axis represents the average of the measured values ​​of the line width at a distance from the center CP of 0 mm to 13 mm. Figure 10 In the graph shown in (b), the line width decreases as the developer supply increases. Furthermore, a correlation can be confirmed between the calculated developer supply amount to the center CP and the line width. As described above, when a portion of the control conditions is changed, the calculated developer supply amount at each measurement position P changes, and the line width also fluctuates in response to this change.

[0114] In one example, the user first determines the condition of the setting object in the control condition (for example, the starting position of the nozzle 61's movement is determined as the setting object). The setting object condition can be the moving speed of the nozzle 61 or the ending position of the nozzle 61's movement. Then, the user changes the condition of the setting object using the setting assistance device 200 to grasp the supply amount of the developer at each measurement position P. In parallel, the user grasps the measurement results of the line width distribution of the surface Wa of the wafer W when the setting object condition is changed. By grasping the measurement results of the developer supply amount and the line width distribution at each measurement position P when the setting object condition is changed, the user can set (adjust) the setting object condition so that the line width distribution approaches the target distribution while suppressing the increase in the developer supply amount.

[0115] [Modification]

[0116] Figure 6 The series of processes shown is an example and can be modified as appropriate. In the above series of processes, the configuration support device 200 may execute one step and the next step in parallel, or may execute the steps in a different order than the above example. The configuration support device 200 may omit any step, or may execute a process different from the above example in any step.

[0117] The line width distribution of the surface Wa of the wafer W often shows the same tendency on the same circumference when the center CP of the wafer W is used as a reference. Therefore, if the developer supply amount at each measurement position P is calculated for each measurement position P located along the radial line passing through the center CP, it is sufficient to find the relationship with the line width distribution. Figure 11 As shown in FIG. 1 , a plurality of measurement positions P (all measurement positions P) as targets for calculating the supply amount of the developer are set so as to be arranged along the radial direction of the wafer W.

[0118] In step S04 (first step), the supply amount calculator 216 may also calculate the movement position of the nozzle 61, assuming that the nozzle 61 moves only in the radial direction of the wafer W. For example, in step S04, the supply amount calculator 216 calculates the movement amount of the nozzle 61 from the center CP corresponding to the calculation time t based on the movement speed and acceleration of the nozzle 61 indicated by the processing information acquired in step S01. Furthermore, in step S05, the supply amount calculator 216 may determine as the target position one or more measurement positions P among a plurality of measurement positions P arranged in the radial direction of the wafer W that are determined to overlap with the nozzle 61 based on the calculation results of the movement amount of the nozzle 61 from the center CP.

[0119] In step S06, the supply amount calculation unit 216 may correct the supply amount based on the distance between the target position to which the supply amount is to be added and the center CP, and then apply the corrected supply amount to the target position. During actual development processing, the wafer W rotates. Therefore, when the nozzle 61 is assumed to be stopped at a certain distance from the center CP, the multiple measurement positions P arranged radially on the wafer W overlap with the nozzle 61 for different periods of time. For example, consider measurement position P located at the center CP and measurement position P4 spaced apart from the center CP. If the nozzle 61 is assumed to overlap with the center CP for the entire period during which it is determined that the nozzle 61 overlaps with the center CP, there is no problem in applying the supply amount to measurement position P located at the center CP. On the other hand, if the nozzle 61 moves radially and is assumed to overlap with measurement position P4 for the entire period during which it is determined that the nozzle 61 overlaps with the center CP, the wafer W is actually rotating, and an excessive amount of supply may be applied to measurement position P4.

[0120] Based on the above, the supply amount calculation unit 216 may also correct the supply amount to be added for each measurement position P based on the distance between the measurement position P and the center CP when adding the supply amount. The supply amount calculation unit 216 may also correct the supply amount to be added for each measurement position P by dividing the pre-corrected added amount by the distance between the measurement position P and the center CP, or the length of the circle around the center CP passing through the measurement position P. Alternatively, the supply amount calculation unit 216 may correct the supply amount to be added for each measurement position P by dividing the pre-corrected added amount by the area formed by the movement trajectory of the nozzle 61 when the nozzle 61 is moved on the circumference so as to pass through the measurement position P.

[0121] Figure 12 (a) shows the measurement result of the line width distribution along the radial direction of the wafer W (the line from 0 mm to 150 mm). Figure 10 Similarly, the graph shown in (b) can obtain the measurement results of the line width distribution when the development process is performed with the operation start position of the nozzle 61 shifted from the center CP by "+10mm", "+5mm", "0mm", "-5mm" and "-10mm". Figure 12 (b) shows the calculation result of the supply amount of the developer supplied to the plurality of measurement positions P arranged in the radial direction of the wafer W. Figure 12 Similarly, in the graph (b) of FIG. 1 , the nozzle 61 operation start position, which is one of the control conditions, is shifted from the center CP by “+10 mm”, “+5 mm”, “0 mm”, “-5 mm”, and “-10 mm” to calculate the developer supply amount at each measurement position P. Figure 12 In (b), a portion of the graph is enlarged within the range of the distance r from the center CP of 0 mm to 15 mm.

[0122] according to Figure 12 As can be seen from the graphs (a) and (b) of FIG. 1 , when the nozzle 61's operation start position is shifted, the developer supply amount near the center CP of the wafer W changes, and accordingly, the line width near the center CP of the wafer W also changes. Furthermore, a comparison of these graphs shows that the calculated developer supply amount and the measured line width can be correlated.

[0123] like Figure 4As shown, the computer main body 202 of the setting support device 200 may also include a line width data acquisition unit 222 as a functional block. The line width data acquisition unit 222 may also acquire data representing the measurement results of the line width distribution of the surface Wa of the wafer W from the line width measurement device 49. Alternatively, the line width data acquisition unit 222 may acquire data representing the measurement results of the line width distribution of the surface Wa of the wafer W based on user input via the input device 204. The line width data acquisition unit 222 may also acquire data representing the measurement results of the line width distribution of the surface Wa of the wafer W from a line width measurement device provided outside the wafer system 1.

[0124] As described above, there are cases where the setting support device 200 calculates the developer supply amount for each measurement position P for both the reference processing information (reference conditions) and the set processing information (set conditions that are partially modified from the reference conditions). In this case, the line width measurement device 49 may measure a line width distribution representing the line width at each measurement position P for both the reference processing information and the set processing information. The line width data acquisition unit 222 may also acquire the line width distribution measurement results from the line width measurement device 49 for both the reference processing information and the set processing information.

[0125] The result output unit 218 may also display on the monitor 206 the measurement result of the line width distribution acquired by the line width data acquisition unit 222 and the calculation result of the supply amount of the developer at each measurement position P for the reference processing information and the setting processing information. Figure 12 There are two graphs as shown in (a) and (b).

[0126] Alternatively, when a user desires to adjust one or more parameters of at least a portion of the predetermined control conditions, the configuration support device 200 may autonomously calculate recommended values ​​for the one or more parameters. The computer main body 202 of the configuration support device 200 may include a data accumulation unit 224 and a parameter calculation unit 226 as functional blocks.

[0127] The data accumulation unit 224 acquires and accumulates data each time the supply amount calculation unit 216 performs calculations. The data accumulation unit 224 accumulates the set values ​​of the control conditions (representing the set values ​​of multiple parameters representing the control conditions) that constitute the development process conditions, the calculation results of the developer supply amount at each measurement position P, and the measurement results representing the line width distribution at each measurement position P, thereby preparing accumulated data. These three types of information are linked to each other in the accumulated data. The data accumulation unit 224 may also accumulate information identifying the type of processing liquid used for the development process.

[0128] The parameter calculation unit 226 obtains a target line width distribution based on user input. Based on the accumulated data accumulated by the data accumulation unit 224 and the target line width distribution, the parameter calculation unit 226 calculates a supply amount distribution representing the developer supply amount at each measurement position P that can achieve the target line width distribution. Furthermore, the parameter calculation unit 226 calculates recommended values ​​for one or more parameters that can achieve the calculated supply amount distribution based on the accumulated data. When calculating recommended values ​​for one or more parameters, a uniform line width distribution can also be set as the target line width distribution.

[0129] The one or more parameters for which recommended values ​​are calculated may be specified by the user or independently selected by the parameter calculation unit 226. Alternatively, the user may input information indicating the type of developer consistent with the target line width distribution. In this case, the parameter calculation unit 226 may calculate recommended values ​​for the one or more parameters using data for the same type of developer within the accumulated data accumulated by the data accumulation unit 224. The result output unit 218 may also display the recommended values ​​for the one or more parameters calculated by the parameter calculation unit 226 on the monitor 206.

[0130] Instead of performing calculations based on accumulated data, a relationship may be constructed between one or more parameters to be adjusted in the control conditions and the developer supply amount and line width distribution at each measurement position P, and based on this relationship, recommended values ​​for the one or more parameters may be calculated. The computer main body 202 of the setting support device 200 may include a relationship constructing unit 228 as a functional block.

[0131] The relational expression constructing unit 228 first calculates the development process and the developer supply amount by varying the set values ​​of one or more parameters, thereby preparing (acquiring) multiple data sets. Each of the multiple data sets prepared by the relational expression constructing unit 228 includes sampled values ​​of one or more parameters, the calculated developer supply amount at each measurement position P, and the measured line width distribution, which indicates the variation in line width on the surface Wa of the wafer W after the development process. These three types of information are associated with each other in each data set. The developer supply amount at each measurement position P in each data set is calculated after setting one or more parameters to the sampled values. The measured line width distribution in each data set is obtained by measuring the line width distribution after developing with one or more parameters set to the sampled values.

[0132] Based on the prepared plurality of data sets, the relational expression constructing unit 228 generates, for each of the plurality of measurement positions P (at each measurement position P), a first relational expression representing the relationship between one or more parameters and the developer supply amount, and a second relational expression representing the relationship between one or more parameters and the line width. The first and second relational expressions may be first-order regression equations. The parameter calculating unit 226 obtains set values ​​for the range of variation of one or more parameters. The parameter calculating unit 226 may also obtain set values ​​for the range of variation based on user input via the input device 204. This range of variation refers to the range within which the value of one or more parameters is varied when predicting the line width distribution using the first and second relational expressions.

[0133] The parameter calculation unit 226 obtains setting conditions indicating the conditions for the developer supply amount. The parameter calculation unit 226 obtains these setting conditions based on user input via the input device 204. These setting conditions may be, for example, the upper limit of the total developer supply amount. The parameter calculation unit 226 incorporates these setting conditions when calculating recommended values ​​for one or more parameters.

[0134] The parameter calculation unit 226 calculates recommended values ​​for one or more parameters that bring the linewidth distribution closer to the target distribution based on the first and second relationship equations, the aforementioned set conditions, and the aforementioned range of variation. For example, the parameter calculation unit 226 first uses the second relationship equation to calculate a predicted linewidth distribution when the value of the one or more parameters is varied within the aforementioned range of variation. The parameter calculation unit 226 then compares the calculated predicted linewidth distribution with the target linewidth distribution, serving as the target linewidth distribution, and calculates candidate values ​​for the one or more parameters that will produce a linewidth distribution closer to the target linewidth distribution. The parameter calculation unit 226 then calculates the developer supply amount for each measurement position P using the candidate values ​​for the one or more parameters and the first relationship equation. The value of the developer supply amount calculated from the candidate values ​​for the one or more parameters that satisfies the aforementioned set conditions is selected as the recommended value. The result output unit 218 can cause the monitor 206 to display the recommended values ​​for the one or more parameters calculated by the parameter calculation unit 226.

[0135] When one development process includes two or more target operations (target operations of calculating the supply amount of the developer at each measurement position P), the setting support device 200 may perform the calculation for each target operation. Figure 6 Furthermore, the setting support device 200 may add the developer supply amount obtained by executing the processing flow for each target action at each of the plurality of measurement positions P. At least a portion of the methods described in other examples may be combined with one of the various examples described above.

[0136] [Summary of the Invention]

[0137] The present invention includes the following methods or structures [1] to

[20] .

[0138] [1] A condition setting assisting method, comprising: a step of acquiring processing information indicating a condition of a developing process, wherein the developing process comprises a process of supplying the developing solution to the surface (Wa) of the substrate (W) from the nozzle (61) while moving the nozzle (61) capable of discharging the developing solution along the surface (Wa) of the substrate (W); a step of calculating the supply amount of the developing solution supplied to each of a plurality of positions (P) on the surface (Wa) of the substrate (W) by assuming that the nozzle (61) moves in stages at arbitrary time intervals and repeatedly performing the first and second steps; and a step of outputting the calculation results of the supply amounts of the developing solution supplied to each of the plurality of positions (P), wherein in the first step, the moving position of the nozzle (61) is calculated according to the action of the nozzle (61) based on the processing information, and in the second step, the amount of the developing solution corresponding to the time interval is added to one or more object positions among the plurality of positions (P) corresponding to the calculation results of the moving position of the nozzle (61) in the first step.

[0139] In this condition setting assistance method, the amount of developer supplied to each of a plurality of locations (P) on a surface (Wa) is calculated and the calculation results are output. Therefore, a user, for example, who wishes to set development processing conditions can determine the appropriate amount of developer to supply for each location (P) on the surface (Wa). As described above, the condition setting assistance method can determine the distribution of the developer supply amount within the substrate surface during development processing.

[0140] [2] An auxiliary method is set according to the conditions described in [1] above, wherein in the above step 1, the radial movement position of the nozzle (61) on the substrate (W) is calculated based on the movement speed and acceleration of the nozzle (61) represented by the processing information.

[0141] In this case, the position of the nozzle (61) relative to the surface (Wa) during the development process can be calculated with high accuracy in accordance with the conditions of the development process.

[0142] [3] An auxiliary method is set according to the conditions described in [1] or [2] above, wherein, in the above step 2, one or more positions among a plurality of positions (P) that overlap with the nozzle (61) in the state of moving to the moving position calculated in the above step 1 are determined as one or more object positions.

[0143] In this case, the amount of the developer supplied from the nozzle (61) during the development process can be calculated with high accuracy for each position (P) of the surface (Wa).

[0144] [4] An auxiliary method is set according to the conditions described in [3] above, wherein, when it is judged that the shape of the nozzle (61) is circular, in the above step 2, for each of the multiple positions (P), whether it overlaps with the nozzle (61) is determined based on whether the distance between the center of the nozzle (61) and the position as the judgment object is less than the radius (r) of the nozzle (61).

[0145] In this case, the target position to which the amount of developer corresponding to the time interval is to be added can be easily determined from among the plurality of positions (P).

[0146] [5] An auxiliary method is set according to the conditions described in [3] above, wherein, when it is judged that the shape of the nozzle (61) is a quadrilateral, in the above second step, for each position in the plurality of positions (P), whether or not the position overlaps with the nozzle (61) is determined based on the sign of the result obtained by calculating the vector product of all combinations of a pair of adjacent angles of the nozzle (61), wherein the above vector product is the vector product of the vector formed by the pair of angles and the vector formed by one of the pair of angles and the position as the judgment object.

[0147] In this case, the target position to which the amount of developer corresponding to the time interval is to be added can be easily determined from a plurality of positions (P). For example, even when the nozzle (61) is assumed to move along the circumference of the substrate (W) and the first and second steps are repeated, it can be easily determined whether each position (P) is the target position.

[0148] [6] An auxiliary method is set according to the conditions described in any one of [1] to [4] above, wherein, during the development process, the nozzle (61) is moved radially of the substrate (W) while the substrate (W) is rotated, and the developer is ejected from the nozzle (61), and a plurality of positions (P) are set to be arranged radially of the substrate (W). In the above first step, the moving position of the nozzle (61) is calculated by assuming that the nozzle (61) moves only in the radial direction of the substrate (W).

[0149] In the above-mentioned condition setting auxiliary method, it is assumed that the nozzle (61) stops at a time interval each time, and the developer supply amount is added to each position (P). Therefore, in order to improve the accuracy of the calculation, it is necessary to shorten the time interval (calculation step), but the calculation time may increase. In the above-mentioned method, the developer supply amount at each of a plurality of positions (P) arranged in a row on the surface (W) can be calculated, so that both calculation accuracy and shortening of technical time can be achieved.

[0150] [7] An auxiliary method for setting the conditions according to any one of the above-mentioned [1] to [5] is provided, wherein, during the development process, the nozzle (61) is moved in the radial direction of the substrate (W) while the substrate (W) is rotated, and a plurality of positions (P) are set to be dispersed on the surface (Wa) of the substrate (W). In the above-mentioned first step, the moving position of the nozzle (61) is calculated by assuming that the nozzle (61) moves in the radial direction of the substrate (W) and in the circumferential direction of the substrate (W).

[0151] In this case, it is also possible to grasp the tendency of the change in the supply amount in the circumferential direction of the substrate (W) on the surface (Wa) of the substrate (W).

[0152] [8] An auxiliary method for setting conditions according to any one of the above-mentioned [1] to [7], wherein the step of outputting the calculation results of the supply amounts of the developer supplied to a plurality of positions (P) includes the step of causing a monitor (206) to display the calculation results of the supply amounts of the developer supplied to a plurality of positions (P).

[0153] In this case, an operator or the like who sets (adjusts) the conditions for the development process can easily grasp the distribution of the supply amount of the developer within the substrate surface.

[0154] [9] A condition setting assistance method according to any one of the above-mentioned [1] to [8], wherein, in the step of acquiring processing information, as the above-mentioned processing information, reference processing information indicating a reference condition serving as a reference for a condition of a developing process and setting processing information indicating a setting condition in which at least a portion of the reference condition is changed are acquired. In the above-mentioned condition setting assistance method, the step of calculating the supply amounts of the developer supplied to the plurality of positions (P) for the reference processing information and the setting processing information, and outputting the calculation results of the supply amounts of the developer supplied to the plurality of positions (P) includes the step of causing a monitor (206) to display the calculation results of the supply amounts of the developer supplied to the plurality of positions (P) for the reference processing information and the setting processing information, respectively.

[0155] In this case, an operator who sets (adjusts) the conditions for the development process can understand the distribution of the supply amount within the substrate surface under the reference conditions and the distribution of the supply amount within the substrate surface under conditions changed from the reference conditions.

[0156]

[10] According to the condition setting auxiliary method described in [9] above, it also includes the steps of measuring the line width distribution representing the line width at each position of the multiple positions (P) for the reference processing information and the setting processing information, and the step of outputting the calculation results of the supply amount of the developer supplied to the multiple positions (P) respectively includes: for the reference processing information and the setting processing information, respectively causing the monitor (206) to display the measurement results of the line width distribution and the calculation results of the supply amount of the developer supplied to the multiple positions (P).

[0157] In this case, an operator who sets (adjusts) the conditions for the development process can understand the relationship between the distribution of the supply amount in the substrate surface and the line width distribution in the substrate surface (for example, whether there is a correlation).

[0158]

[11] A condition setting assisting method according to any one of the above-mentioned [1] to

[10] , further comprising: a step of preparing accumulated data by accumulating the set values ​​of the developing process conditions, the calculation results of the supply amounts of the developer supplied to the plurality of positions (P), and the measurement results of the line width distribution representing the line width at each of the plurality of positions (P); a step of calculating a supply amount distribution representing the supply amount of the developer supplied to the plurality of positions (P) that can obtain the target line width distribution based on the above-mentioned accumulated data and the target line width distribution representing the target line width distribution; and a step of calculating recommended values ​​of one or more parameters representing at least a part of the developing process conditions that can obtain the calculated supply amount distribution based on the above-mentioned accumulated data.

[0159] In this case, an operator who sets (adjusts) the development processing conditions can set the development processing conditions by referring to the calculation results of the recommended values ​​of one or more parameters representing at least a part of the development processing conditions.

[0160]

[12] A condition setting assisting method according to any one of the above-mentioned [1] to

[10] , further comprising: a step of preparing a plurality of data sets, wherein each of the plurality of data sets includes: sampled values ​​of one or more parameters representing at least a portion of the conditions for the development process; calculation results of the supply amounts of the developer supplied to the plurality of positions (P); and measurement results of the line width distribution representing the variation in the line width of the surface (Wa) of the substrate (W) after the development process; a step of generating, for each of the plurality of positions (P), a first relational expression representing the relationship between one or more parameters and the supply amount of the developer, and a second relational expression representing the relationship between one or more parameters and the line width based on the plurality of data sets; a step of obtaining set values ​​of the variation range of one or more parameters; a step of obtaining setting conditions representing the conditions for the supply amount of the developer; and a step of calculating recommended values ​​of one or more parameters so that the line width distribution approaches the target distribution based on the first relational expression, the second relational expression, the setting conditions, and the variation range.

[0161] In this case, an operator or the like who needs to set (adjust) the development processing conditions can set the development processing conditions by referring to the calculation results of the recommended values ​​of one or more parameters representing at least a part of the development processing conditions.

[0162]

[13] A computer-readable storage medium storing a program for causing a device to execute the condition setting support method described in any one of [1] to

[12] above.

[0163]

[14] A condition setting auxiliary device (200), comprising: a processing information acquisition unit (212) for acquiring processing information indicating the conditions of a development process in which a nozzle capable of discharging a developer moves along a surface (Wa) of a substrate while supplying the developer from a nozzle (61) to the surface (Wa) of the substrate (W); and a supply amount calculation unit (216) for calculating the amount of developer to be supplied to a plurality of positions on the surface (Wa) of the substrate (W) by assuming that the nozzle (61) moves in stages at arbitrary time intervals and repeatedly performing the first and second steps. The supply amount of the developer supplied; and a result output unit (218) which outputs the calculation results of the supply amount of the developer supplied to the plurality of positions (P), wherein the supply amount calculation unit (216) calculates the moving position of the nozzle (61) according to the action of the nozzle (61) based on the processing information in the above-mentioned first step, and the supply amount calculation unit (216) adds the amount of the developer corresponding to the time interval to one or more object positions among the plurality of positions (P) corresponding to the calculation results of the moving position of the nozzle (61) in the above-mentioned first step in the above-mentioned second step.

[0164] In the condition setting assisting device (200), the distribution of the amount of developer supplied to the substrate surface during the development process can be grasped.

[0165]

[15] An auxiliary device (200) is set according to the conditions described in

[14] above, wherein the supply quantity calculation unit (216) calculates the radial movement position of the nozzle (61) on the substrate (W) based on the movement speed and acceleration of the nozzle (61) represented by the processing information in the above-mentioned first step.

[0166] In this case, the position of the nozzle (61) relative to the surface (Wa) during the development process can be calculated with high accuracy in accordance with the conditions of the development process.

[0167]

[16] An auxiliary device (200) is set according to the conditions described in

[14] or

[15] above, wherein the supply quantity calculation unit (216) determines, in the above-mentioned second step, one or more positions among a plurality of positions (P) that overlap with the nozzle (61) in the state of moving to the moving position calculated in the above-mentioned first step as one or more object positions.

[0168] In this case, the amount of the developing liquid supplied from the nozzle (61) during the developing process can be calculated with high accuracy for each position (P) of the surface (Wa).

[0169]

[17] An auxiliary device (200) is set according to the conditions described in

[16] above, wherein, when the supply amount calculation unit (216) determines that the shape of the nozzle (61) is circular, in the above-mentioned second step, for each of the multiple positions (P), whether it overlaps with the nozzle (61) is determined based on whether the distance between the center of the nozzle (61) and the position as the judgment object is less than the radius of the nozzle (61).

[0170] In this case, the target position to which the amount of developer corresponding to the time interval is to be added can be easily determined from among the plurality of positions (P).

[0171]

[18] An auxiliary device (200) is set according to the conditions described in

[16] above, wherein, when the supply amount calculation unit (216) determines that the shape of the nozzle (61) is a quadrilateral, in the above-mentioned second step, for each position in the plurality of positions (P), whether it overlaps with the nozzle (61) is determined based on the sign of the result obtained by calculating the vector product of all combinations of a pair of adjacent angles of the nozzle (61), wherein the above-mentioned vector product is the vector product of the vector formed by the above-mentioned pair of angles and the vector formed by one of the above-mentioned pair of angles and the position as the judgment object.

[0172] In this case, the target position to which the amount of developer corresponding to the time interval is to be added can be easily determined from among the plurality of positions (P).

[0173]

[19] An auxiliary device (200) is set according to the conditions described in any one of

[14] to

[17] above, wherein, during the development process, the nozzle (61) is moved radially of the substrate (W) while the substrate (W) is rotated, and the developer is ejected from the nozzle (61), and a plurality of positions (P) are set to be arranged radially of the substrate (W), and the supply amount calculation unit (216) calculates the moving position of the nozzle (61) in the above first step, assuming that the nozzle (61) moves only radially of the substrate (W).

[0174] In this case, both calculation accuracy and shortening of calculation time can be achieved.

[0175]

[20] An auxiliary device (200) is set according to the conditions described in any one of

[14] to

[18] above, wherein, during the development process, the nozzle (61) is moved in the radial direction of the substrate (W) while the substrate (W) is rotated, and the developer is ejected from the nozzle (61), and a plurality of positions (P) are set to be dispersed on the surface (Wa) of the substrate (W). In the above-mentioned first step, the supply amount calculation unit (216) calculates the moving position of the nozzle (61) by assuming that the nozzle (61) moves in the radial direction of the substrate (W) and the circumferential direction of the substrate (W).

[0176] In this case, it is also possible to grasp the tendency of the change in the supply amount in the circumferential direction of the substrate (W) on the surface (Wa) of the substrate (W).

Claims

1. A condition setting auxiliary method, characterized in that: include: a step of acquiring processing information indicating conditions of a development process, wherein the development process includes supplying the developing solution from a nozzle capable of discharging the developing solution to the surface of the substrate while moving the nozzle along the surface of the substrate; a step of calculating the supply amount of the developer to be supplied to each of a plurality of positions on the surface of the substrate by assuming that the nozzle moves in stages at arbitrary time intervals and repeating the first and second steps; and outputting calculation results of the amounts of the developer supplied to the plurality of positions, respectively; In the first step, the movement position of the nozzle is calculated based on the movement of the nozzle based on the processing information. In the second step, an amount of the developer corresponding to the time interval is added to one or more target positions among the plurality of positions corresponding to the calculation result of the movement position of the nozzle in the first step.

2. The condition setting auxiliary method according to claim 1, characterized in that: In the first step, the movement position of the nozzle in the radial direction of the substrate is calculated based on the movement speed and acceleration of the nozzle indicated by the processing information.

3. The condition setting auxiliary method according to claim 1, characterized in that: In the second step, one or more positions among the plurality of positions that overlap with the nozzle moved to the movement position calculated in the first step are determined as the one or more target positions.

4. The condition setting auxiliary method according to claim 3, characterized in that: When it is determined that the shape of the nozzle is circular, in the second step, for each of the multiple positions, whether it overlaps with the nozzle is determined based on whether the distance between the center of the nozzle and the position to be determined is less than the radius of the nozzle.

5. The condition setting auxiliary method according to claim 3, characterized in that: When it is determined that the shape of the nozzle is a quadrilateral, in the second step, for each of the multiple positions, whether the position overlaps with the nozzle is determined based on the sign of the result obtained by calculating the vector product of all combinations of a pair of adjacent angles of the nozzle, wherein the vector product is the vector product of the vector formed by the pair of angles and the vector formed by one of the pair of angles and the position as the judgment object.

6. The condition setting assisting method according to any one of claims 1 to 4, characterized in that: In the development process, the developer is ejected from the nozzle while the nozzle is moved in the radial direction of the substrate while the substrate is rotated. The plurality of positions are set to be arranged along the radial direction of the substrate, In the first step, the movement position of the nozzle is calculated assuming that the nozzle moves only in the radial direction of the substrate.

7. The condition setting assisting method according to any one of claims 1 to 5, characterized in that: In the development process, the developer is ejected from the nozzle while the nozzle is moved in the radial direction of the substrate while the substrate is rotated. The plurality of positions are set to be dispersed on the surface of the substrate, In the first step, the movement position of the nozzle is calculated assuming that the nozzle moves in both the radial direction of the substrate and the circumferential direction of the substrate.

8. The condition setting assisting method according to any one of claims 1 to 5, characterized in that: The step of outputting the calculation results of the amounts of the developer supplied to the plurality of positions includes the step of causing a monitor to display the calculation results of the amounts of the developer supplied to the plurality of positions.

9. The condition setting assisting method according to any one of claims 1 to 5, characterized in that: In the step of acquiring the processing information, as the processing information, reference processing information indicating reference conditions serving as a reference for the conditions of the development process is acquired; and setting processing information indicating setting conditions in which at least a portion of the reference conditions is changed, In the condition setting support method, the supply amounts of the developer to be supplied to the plurality of positions are calculated for the reference processing information and the setting processing information, respectively. The step of outputting the calculation results of the developer supply amounts supplied to the plurality of positions includes the step of displaying the calculation results of the developer supply amounts supplied to the plurality of positions on a monitor for each of the reference processing information and the set processing information.

10. The condition setting auxiliary method according to claim 9, characterized in that: The method further includes measuring, for each of the reference processing information and the set processing information, a line width distribution indicating a line width at each of the plurality of positions. The step of outputting the calculation results of the supply amounts of the developer supplied to the plurality of positions includes the step of causing the monitor to display the measurement results of the line width distribution and the calculation results of the supply amounts of the developer supplied to the plurality of positions, respectively, for the reference processing information and the setting processing information.

11. The condition setting assisting method according to any one of claims 1 to 5, characterized in that: Also includes: a step of preparing accumulated data by accumulating set values ​​of the development process conditions, calculation results of the amounts of the developer supplied to the plurality of positions, and measurement results indicating line width distribution at each of the plurality of positions; a step of calculating, based on the accumulated data and a target line width distribution indicating a target of the line width distribution, a supply amount distribution indicating the supply amount of the developer to each of the plurality of positions so as to obtain the target line width distribution; and A step of calculating, based on the accumulated data, recommended values ​​of one or more parameters indicating at least a part of the conditions of the developing process so as to obtain the calculated supply amount distribution.

12. The condition setting assisting method according to any one of claims 1 to 5, characterized in that: Also includes: The step of preparing a plurality of data sets, wherein each of the plurality of data sets includes: sample values ​​of one or more parameters representing at least a portion of the conditions of the development process; calculation results of the supply amounts of the developer supplied to the plurality of positions; and measurement results of a line width distribution representing variations in line width on the surface of the substrate after the development process; A step of generating, for each of the plurality of positions, a first relational expression representing a relationship between the one or more parameters and the developer supply amount, and a second relational expression representing a relationship between the one or more parameters and the line width based on the plurality of data sets; A step of obtaining set values ​​of the variation range of the one or more parameters; a step of acquiring a setting condition indicating a condition of a supply amount of the developer; and A step of calculating recommended values ​​of the one or more parameters for bringing the line width distribution close to a target distribution based on the first relational expression, the second relational expression, the setting conditions, and the variation range.

13. A computer-readable storage medium, characterized in that: A program for causing a device to execute the condition setting support method according to any one of claims 1 to 5 is stored.

14. A condition setting auxiliary device, characterized in that: include: a process information acquisition unit configured to acquire process information indicating conditions for a development process, the development process including supplying a developer from a nozzle capable of discharging the developer to the surface of the substrate while moving the nozzle along the surface of the substrate; a supply amount calculation unit for calculating the supply amount of the developer to be supplied to each of a plurality of positions on the surface of the substrate by assuming that the nozzle moves in stages at arbitrary time intervals and repeating the first and second steps; and a result output unit that outputs a calculation result of the supply amount of the developer supplied to each of the plurality of positions; In the first step, the supply amount calculation unit calculates the movement position of the nozzle based on the movement of the nozzle based on the processing information. In the second step, the supply amount calculation unit adds the amount of the developer corresponding to the time interval to one or more target positions among the plurality of positions corresponding to the calculation result of the movement position of the nozzle in the first step.

15. The condition setting auxiliary device according to claim 14, characterized in that: In the first step, the supply amount calculation unit calculates a movement position of the nozzle in the radial direction of the substrate based on the movement speed and acceleration of the nozzle indicated by the processing information.

16. The condition setting auxiliary device according to claim 14, characterized in that: In the second step, the supply amount calculation unit specifies one or more positions among the plurality of positions that overlap with the nozzle moved to the movement position calculated in the first step as the one or more target positions.

17. The condition setting assisting device according to claim 16, wherein: When the supply amount calculation unit determines that the shape of the nozzle is circular, in the second step, for each of the multiple positions, it is determined whether the position overlaps with the nozzle based on whether the distance between the center of the nozzle and the position as the judgment object is less than the radius of the nozzle.

18. The condition setting assisting device according to claim 16, wherein: When the supply amount calculation unit determines that the shape of the nozzle is a quadrilateral, in the second step, for each of the multiple positions, it determines whether there is overlap with the nozzle based on the sign of the result obtained by calculating the vector product of all combinations of a pair of adjacent angles of the nozzle, wherein the vector product is the vector product of the vector formed by the pair of angles and the vector formed by one of the pair of angles and the position as the judgment object.

19. The condition setting assisting device according to any one of claims 14 to 17, characterized in that: In the development process, the developer is ejected from the nozzle while the nozzle is moved in the radial direction of the substrate while the substrate is rotated. The plurality of positions are set to be arranged along the radial direction of the substrate, In the first step, the supply amount calculation unit calculates the movement position of the nozzle assuming that the nozzle moves only in the radial direction of the substrate.

20. The condition setting assisting device according to any one of claims 14 to 18, characterized in that: In the development process, the developer is ejected from the nozzle while the nozzle is moved in the radial direction of the substrate while the substrate is rotated. The plurality of positions are set to be dispersed on the surface of the substrate, In the first step, the supply amount calculation unit calculates the movement position of the nozzle assuming that the nozzle moves in both the radial direction of the substrate and the circumferential direction of the substrate.

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