Efficient heat dissipation module device for computer mainboard

Abstract

The invention discloses an efficient heat dissipation module device for a computer mainboard, and relates to the technical field of mainboard heat dissipation, the efficient heat dissipation module device comprises a heat dissipation seat assembly and a heat absorption pipe assembly, the heat absorption pipe assembly is arranged in the middle of the interior of the heat dissipation seat assembly, and stable column assemblies are vertically installed on the left side and the right side of the heat dissipation seat assembly; and the upper end of the stabilizing column assembly is connected with an air cooling assembly. According to the efficient heat dissipation module device for the computer mainboard, heat on the surface of the mainboard can be effectively conducted through structural cooperation between the heat dissipation base assembly and the heat absorption pipe assembly, the effect of rapid heat dissipation is achieved by means of the structural characteristics of the heat dissipation base assembly and the heat absorption pipe assembly, and meanwhile the heat dissipation efficiency is improved by means of the structural arrangement of the stable column assembly. The whole air cooling assembly can be horizontally erected at the top of the heat dissipation seat assembly, and heat conducted to the surfaces of the heat dissipation seat assembly and the heat absorption pipe assembly can be rapidly dissipated by means of structural arrangement operation of the air cooling assembly, so that the heat dissipation effect of the whole structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of mainboard heat dissipation, and in particular to a high-efficiency heat dissipation module device for a computer mainboard. Background Art

[0002] A computer motherboard is the core component of a computer hardware system, hosting and connecting various hardware components, providing data transmission and power distribution. Typically a rectangular circuit board, the motherboard integrates the chipset, slots, and interfaces. It plays a central role in the system, connecting key hardware components such as the CPU, memory, and graphics card via a bus.

[0003] Conventional heat dissipation modules use heat dissipation fins and fans to dissipate heat, which has a relatively limited heat dissipation effect. When the motherboard is under high load, the heat dissipation effect is relatively poor, making it difficult to effectively reduce the main load. Summary of the Invention

[0004] The object of the present invention is to provide a computer motherboard high-efficiency heat dissipation module device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a computer motherboard high-efficiency heat dissipation module device, comprising a heat sink assembly and a heat absorption pipe assembly, wherein a heat absorption pipe assembly is arranged in the middle of the interior of the heat sink assembly, and stabilizing column assemblies are vertically installed on the left and right sides of the heat sink assembly, and an air cooling assembly is connected to the upper end of the stabilizing column assembly, and the heat absorption pipe assembly comprises a water-cooled heat pipe, an electric control valve and a quick connector, water-cooled heat pipes are installed at both ends of the water-cooled heat pipe, and a quick connector is horizontally installed at the end of the electric control valve away from the water-cooled heat pipe.

[0006] Furthermore, the heat absorption tube assembly includes a heat absorption plate, heat dissipation fins, thermal grease, a fixing seat and a fixing bolt. The top surface of the heat absorption plate is provided with heat dissipation fins, and the bottom surface of the heat absorption plate is covered with thermal grease. In addition, fixing seats are provided on the left and right sides of the heat absorption plate, and fixing bolts are vertically installed at the four diagonal corners of the heat absorption plate.

[0007] Furthermore, a hole structure matching the surface structure of the water-cooled heat pipe is provided in the middle of the heat dissipation fin, and the heat dissipation fin and the heat absorption plate are arranged as an integral structure, and the heat absorption plate and the fixing seat are welded.

[0008] Furthermore, the thermal grease is installed on the bottom surface of the heat absorbing plate in an embedded structure, and the fixing bolt and the heat absorbing plate are threadedly connected.

[0009] Furthermore, the stabilizing column assembly includes a buffer column, a fixing pile and a support seat. The top of the buffer column is provided with a fixing pile, and the end of the buffer column away from the fixing pile is provided with a support seat.

[0010] Furthermore, the buffer column and the fixing pile are arranged as an integral structure, and the fixing pile and the fixing seat are threadedly connected.

[0011] Furthermore, the air cooling component includes a support frame, a cooling fan, a protective net, a stabilizing frame and a damping sleeve. The cooling fan is symmetrically installed on the left and right sides of the middle of the air cooling component, and protective nets are installed on the upper and lower sides of the cooling fan. Stabilizing frames are symmetrically arranged horizontally on the left and right sides of the support frame, and a damping sleeve is provided on the end of the stabilizing frame away from the support frame.

[0012] Furthermore, the buffer column vertically passes through the middle of the damping sleeve, and the damping sleeve, the stabilizing frame and the supporting frame are arranged as an integrated structure. The heat absorption tube assembly passes through the middle of the heat sink assembly, and the air cooling assembly and the heat sink assembly are parallel to each other.

[0013] Furthermore, the operation method is as follows: the heat sink assembly with the heat absorption tube assembly is connected and fixed to the motherboard through the fixing bolts at the four diagonal positions of the heat absorption plate, and the water-cooled heat pipe is connected to the external water cooling device using the quick connectors on one side of the electric control valve at both ends to form a coolant circulation path, and the buffer columns of the four sets of stabilizing column assemblies are passed through the damping sleeve at one end of the stabilizing frame, and are vertically screwed into the fixing seats on both sides of the heat absorption plate through the fixing piles at the bottom of the buffer columns to complete the connection between the stabilizing column assembly and the heat sink assembly. At the same time, the air cooling assembly is horizontally mounted directly above the heat sink assembly, and the heat of the motherboard is transferred to the heat dissipation fins on the top of the heat absorption plate through thermal grease, and the coolant in the water-cooled heat pipe cooperates with the heat dissipation fins to absorb and conduct heat. The cooling fans at both ends of the support frame operate synchronously to accelerate air flow and dissipate the heat on the surface of the heat sink assembly and the heat absorption tube assembly to achieve efficient heat dissipation, stretch and adjust the buffer column, and fix the stabilizing column assembly to the side wall of the chassis through the fixing piles and bolts.

[0014] The present invention provides a computer motherboard high-efficiency heat dissipation module device, which has the following beneficial effects:

[0015] 1. The present invention installs a heat absorption pipe assembly inside the heat sink assembly, wherein when the heat on the surface of the mainboard cooperates with the heat absorption plate installed with thermal grease, the heat will be quickly transferred to the surface of the heat sink fins. At the same time, the quick connector at one end of the electric control valve can be used to structurally connect the entire heat absorption pipe assembly with the external water-cooling circulation device, and the coolant is transported to the inside of the water-cooling heat sink, so as to utilize the circulating coolant to assist the heat sink fins to quickly conduct heat. The above-mentioned structure can ensure the heat dissipation effect of the device as much as possible, and the mutual connection between the structures also has good structural stability. The fixing bolts at the four diagonal corners of the heat absorption plate can be used to connect and fix the heat sink assembly installed with the heat absorption pipe assembly to the mainboard, thereby ensuring the effectiveness of heat conduction.

[0016] 2. The present invention uses two sets of stabilizing column assemblies on both sides of the heat sink assembly to horizontally mount the air cooling assembly on the top of the heat sink assembly. When the heat sink assembly equipped with the heat absorption tube assembly is conducting heat conduction and dissipating, the cooling fan located inside the support frame will operate synchronously, and the flowing air generated by it will be quickly blown to the surface of the heat sink assembly and the heat absorption tube assembly, and dissipate the heat on the surface, thereby further improving the speed of heat dissipation. The above-mentioned structural setting can further improve the heat dissipation efficiency of the entire device, thereby maximizing the stability of the motherboard operation. In addition, according to the needs of use, the support base at one end of the buffer column can be connected and combined with the inside of the chassis. With this structural setting, it can further provide good structural support and fixation for the motherboard, while providing a certain degree of structural shock absorption and buffering effect, thereby avoiding unnecessary structural impact of external forces on the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a computer motherboard high-efficiency heat dissipation module device according to the present invention from a side view of the main body;

[0018] Figure 2 This is a schematic structural diagram of a heat sink assembly of a computer motherboard high-efficiency heat dissipation module device according to the present invention;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of a heat absorbing pipe assembly of a computer motherboard high-efficiency heat dissipation module device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of a stabilizing column assembly of a computer motherboard high-efficiency heat dissipation module device according to the present invention;

[0021] Figure 5 The present invention is a schematic diagram of the three-dimensional structure of an air cooling component of a computer motherboard high-efficiency heat dissipation module device.

[0022] In the figure: 1. Heat sink assembly; 101. Heat absorbing plate; 102. Heat dissipating fins; 103. Thermal grease; 104. Fixing seat; 105. Fixing bolt; 2. Heat absorbing tube assembly; 201. Water-cooled heat pipe; 202. Electric control valve; 203. Quick connector; 3. Stabilizing column assembly; 301. Buffer column; 302. Fixing pile; 303. Support seat; 4. Air cooling assembly; 401. Support frame; 402. Cooling fan; 403. Protective net; 404. Stabilizing frame; 405. Damping sleeve. DETAILED DESCRIPTION

[0023] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0024] like Figures 1 to 5 As shown, a computer motherboard high-efficiency heat dissipation module device includes a heat sink assembly 1 and a heat absorption pipe assembly 2. The heat absorption pipe assembly 2 is arranged in the middle of the heat sink assembly 1, and the left and right sides of the heat sink assembly 1 are vertically installed with a stabilizing column assembly 3, and the upper end of the stabilizing column assembly 3 is connected to the air cooling assembly 4. The heat absorption pipe assembly 2 includes a water-cooled heat pipe 201, an electric control valve 202 and a quick connector 203. Water-cooled heat pipes 201 are installed at both ends. 1, and the electric control valve 202 is horizontally installed with a quick connector 203 at one end away from the water-cooled heat pipe 201, the heat absorption pipe assembly 2 includes a heat absorption plate 101, heat dissipation fins 102, thermal grease 103, a fixing seat 104 and a fixing bolt 105, the top surface of the heat absorption plate 101 is provided with heat dissipation fins 102, and the bottom surface of the heat absorption plate 101 is covered with thermal grease 103, and the left and right sides of the heat absorption plate 101 are provided with fixing seats 104, and the heat absorption plate 1 01 are vertically installed with fixing bolts 105 at the four diagonal corners, and a hole structure that matches the surface structure of the water-cooled heat pipe 201 is opened in the middle of the heat dissipation fin 102, and the heat dissipation fin 102 and the heat absorbing plate 101 are integrated into a structure, and the heat absorbing plate 101 and the fixing seat 104 are welded. The thermal grease 103 is installed on the bottom surface of the heat absorbing plate 101 with an embedded structure, and the fixing bolt 105 and the heat absorbing plate 101 are threadedly connected. When the heat on the surface of the mainboard cooperates with the heat absorbing plate 101 installed with the thermal grease 103, the heat will be quickly transferred to the surface of the heat dissipation fin 102. At the same time, the quick connector 203 at one end of the electric control valve 202 can be used to structurally connect the entire heat absorbing pipe assembly 2 with the external water-cooled circulation device, and the coolant can be transported to the inside of the water-cooled heat pipe 201, so as to use the circulating coolant to assist the heat dissipation fin 102 to quickly conduct heat.

[0025] like Figures 1 to 5As shown, the stabilizing column assembly 3 includes a buffer column 301, a fixing pile 302 and a support seat 303. The top of the buffer column 301 is provided with a fixing pile 302, and the end of the buffer column 301 away from the fixing pile 302 is provided with a support seat 303. The buffer column 301 and the fixing pile 302 are arranged in an integrated structure, and the fixing pile 302 and the fixing seat 104 are threadedly connected. The air-cooling assembly 4 includes a support frame 401, a cooling fan 402, a protective net 403, a stabilizing frame 404 and a damping sleeve 405. The cooling fan 402 is symmetrically installed on the left and right sides of the air-cooling assembly 4, and the protective net 403 is installed on the upper and lower sides of the cooling fan 402, and the left and right sides of the support frame 401 are symmetrically arranged horizontally. The support frame 401 is provided with a damping sleeve 405 at one end of the stabilizing frame 404 away from the supporting frame 401, and the buffer column 301 vertically passes through the middle of the damping sleeve 405, and the damping sleeve 405, the stabilizing frame 404 and the supporting frame 401 are integrated into a structure, the heat absorption pipe assembly 2 passes through the middle of the interior of the heat sink assembly 1, and the air cooling assembly 4 and the heat sink assembly 1 are parallel to each other. When the heat sink assembly 1 equipped with the heat absorption pipe assembly 2 is conducting heat dissipation, the cooling fan 402 located inside the supporting frame 401 will operate synchronously, and the flowing air generated by it will be quickly blown to the surface of the heat sink assembly 1 and the heat absorption pipe assembly 2, and dissipate the heat on their surface, so as to further increase the speed of heat dissipation.

[0026] In summary, if Figures 1 to 5 As shown, when using the computer motherboard high-efficiency heat dissipation module device, first, the heat sink assembly 1 equipped with the heat absorption pipe assembly 2 is connected and fixed to the motherboard using the fixing bolts 105 at the four diagonal positions of the heat absorption plate 101. At the same time, the water-cooling heat dissipation pipe 201 is connected to the external water cooling device using the quick connectors 203 on one side of the electric control valve 202 at both ends, so that the coolant is circulated and transported to the interior of the water-cooling heat dissipation pipe 201.

[0027] Then, the four sets of stabilizing column assemblies 3 are inserted into the damping sleeve 405 at one end of the stabilizing frame 404, and the buffer column 301 is vertically screwed into the fixing base 104 on both sides of the heat absorbing plate 101 using the fixing piles 302 at the bottom. In this way, the stabilizing column assemblies 3 are connected and assembled, and the entire air cooling assembly 4 can be horizontally erected directly above the heat sink assembly 1;

[0028] When the heat from the host is quickly transferred to the surface of the heat sink fins 102 on the top of the heat absorption plate 101 through the thermal grease 103, the water-cooled heat pipe 201 with coolant flowing inside will cooperate with the heat sink fins 102 to absorb the heat and transfer and dissipate it, thereby achieving good heat dissipation. At the same time, the cooling fans 402 located at both ends of the support frame 401 will operate synchronously. When the cooling fans 402 are in operation, the heat on the surfaces of the heat sink assembly 1 and the heat absorption pipe assembly 2 will be quickly dissipated, thereby further improving the heat dissipation efficiency of the entire device and avoiding heat accumulation, thereby affecting the heat dissipation effect of the motherboard.

[0029] If necessary, the buffer column 301 can be appropriately stretched according to the internal structure of the chassis, and the fixed pile 302 connected at one end can be fixed to the side wall surface of the chassis with the use of bolts. This structural setting can provide sufficient stability for the entire device structure, and with the assistance of the structure of the buffer column 301, it has good structural buffering protection and reduces damage to the motherboard.

[0030] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A computer motherboard high-efficiency heat dissipation module device, comprising a heat sink assembly (1) and a heat absorption pipe assembly (2), characterized in that: A heat absorbing pipe assembly (2) is arranged in the middle of the interior of the heat dissipation seat assembly (1), and stabilizing column assemblies (3) are vertically installed on both the left and right sides of the heat dissipation seat assembly (1), and the upper end of the stabilizing column assembly (3) is connected to an air cooling assembly (4), and the heat absorbing pipe assembly (2) comprises a water-cooled heat dissipation pipe (201), an electric control valve (202) and a quick connector (203), and both ends of the water-cooled heat dissipation pipe (201) are installed with water-cooled heat dissipation pipes (201), and a quick connector (203) is horizontally installed at one end of the electric control valve (202) away from the water-cooled heat dissipation pipe (201).

2. A computer motherboard high-efficiency heat dissipation module device according to claim 1, characterized in that: The heat absorbing tube assembly (2) comprises a heat absorbing plate (101), heat dissipating fins (102), thermal grease (103), a fixing seat (104) and a fixing bolt (105); the top surface of the heat absorbing plate (101) is provided with heat dissipating fins (102), and the bottom surface of the heat absorbing plate (101) is covered with thermal grease (103); the left and right sides of the heat absorbing plate (101) are both provided with fixing seats (104), and the four diagonal positions of the heat absorbing plate (101) are vertically installed with fixing bolts (105).

3. A computer motherboard high-efficiency heat dissipation module device according to claim 2, characterized in that: The middle portion of the heat dissipation fin (102) is provided with a hole structure that matches the surface structure of the water-cooled heat dissipation pipe (201), the heat dissipation fin (102) and the heat absorption plate (101) are arranged as an integral structure, and the heat absorption plate (101) and the fixing seat (104) are welded together.

4. A computer motherboard high-efficiency heat dissipation module device according to claim 3, characterized in that: The thermal conductive silicone grease (103) is installed on the bottom surface of the heat absorbing plate (101) in an embedded structure, and the fixing bolt (105) and the heat absorbing plate (101) are threadedly connected.

5. A computer motherboard high-efficiency heat dissipation module device according to claim 4, characterized in that: The stabilizing column assembly (3) comprises a buffer column (301), a fixing pile (302) and a support seat (303); the fixing pile (302) is provided on the top of the buffer column (301), and the support seat (303) is provided at one end of the buffer column (301) away from the fixing pile (302).

6. A computer motherboard high-efficiency heat dissipation module device according to claim 5, characterized in that: The buffer column (301) and the fixing pile (302) are arranged in an integrated structure, and the fixing pile (302) and the fixing seat (104) are threadedly connected.

7. A computer motherboard high-efficiency heat dissipation module device according to claim 6, characterized in that: The air-cooling assembly (4) comprises a support frame (401), a heat dissipation fan (402), a protective net (403), a stabilizing frame (404) and a damping sleeve (405); the heat dissipation fan (402) is symmetrically installed in the middle of the air-cooling assembly (4), and the protective net (403) is installed on both the upper and lower sides of the heat dissipation fan (402); the stabilizing frame (404) is symmetrically arranged horizontally on both the left and right sides of the support frame (401), and the damping sleeve (405) is arranged at one end of the stabilizing frame (404) away from the support frame (401).

8. A computer motherboard high-efficiency heat dissipation module device according to claim 7, characterized in that: The buffer column (301) vertically penetrates the middle of the damping sleeve (405), and the damping sleeve (405), the stabilizing frame (404) and the supporting frame (401) are arranged in an integrated structure.

9. A computer motherboard high-efficiency heat dissipation module device according to claim 8, characterized in that: The heat absorption pipe assembly (2) passes through the middle of the heat sink assembly (1), and the air cooling assembly (4) and the heat sink assembly (1) are parallel to each other.

10. A computer motherboard high-efficiency heat dissipation module device according to claim 9, characterized in that: The operation method is as follows: the heat sink assembly (1) equipped with the heat absorption pipe assembly (2) is connected and fixed to the main board through the fixing bolts (105) at the four diagonal positions of the heat absorption plate (101); the water-cooled heat dissipation pipe (201) is connected to the external water cooling device by using the quick connectors (203) on one side of the electric control valve (202) at both ends to form a cooling liquid circulation path; the buffer column (301) of the four groups of stabilizing column assemblies (3) is passed through the damping sleeve (405) at one end of the stabilizing frame (404); and the buffer column is vertically screwed into the fixing seat (104) on both sides of the heat absorption plate (101) through the fixing pile (302) at the bottom of the buffer column, thereby completing the stabilizing column assembly (3) and the heat sink assembly. The components (1) are connected, and the air cooling component (4) is horizontally mounted just above the heat sink component (1). The heat of the mainboard is transferred to the heat fins (102) on the top of the heat absorbing plate (101) through the thermal grease (103). The coolant in the water cooling heat pipe (201) cooperates with the heat absorbing fins to absorb and conduct heat. The heat dissipation fans (402) at both ends of the support frame (401) operate synchronously to accelerate the air flow and blow away the heat on the surface of the heat sink component (1) and the heat absorbing pipe component (2), thereby achieving efficient heat dissipation. The buffer column (301) is stretched and adjusted, and the stabilizing column component (3) is fixed to the side wall of the chassis through the fixing pile (302) and the bolt.

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