Locally enhanced server chip phase change liquid cooling method

Abstract

The invention discloses a locally enhanced server chip phase change liquid cooling method, which comprises the following steps of: soaking a horizontally arranged chip board in two-phase cooling liquid, cooling the chip board by virtue of gasification of the two-phase cooling liquid, rising the gasified two-phase cooling liquid to the upper end of a two-phase cooling liquid cavity, then exchanging heat with a cooling device, liquefying, and falling to the lower part, the method is characterized in that the two-phase cooling liquid is guided to flow upwards in the upper space position of the high-heating area of the chip board, so that bubbles generated on the surface of the high-heating area can be accelerated to reach the upper end of the two-phase cooling liquid cavity for liquefaction. According to the invention, the high heating area of the chip can be better cooled, so that the overall cooling effect is balanced, and the overall performance of the server is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of data center server cooling, and in particular to a locally enhanced server chip phase change liquid cooling method. Background Art

[0002] As the performance of modern electronic devices continues to improve, especially in the field of high-power chips, chip power consumption and heat generation are also increasing. These high-power chips are widely used in computer servers, data centers, artificial intelligence, 5G communications, and high-performance computing. Traditional air cooling technology has significant shortcomings in cooling high-power chips due to its efficiency limitations. Especially as processor power density and heat dissipation requirements continue to increase, traditional cooling methods are unable to meet the increasingly stringent heat dissipation requirements.

[0003] Liquid cooling, as a relatively effective cooling method, has been widely used in recent years. With advancements in cooling technology, liquid cooling systems have also evolved from single-phase to two-phase liquid cooling. Single-phase liquid cooling relies primarily on the thermal conductivity of the liquid to remove heat from the chip surface. While this improves cooling performance compared to air cooling, its efficiency remains limited when dealing with ultra-high power density chips. In contrast, two-phase liquid cooling, through the evaporation and condensation processes of the liquid, offers higher heat transfer efficiency, making it particularly suitable for cooling high-power chips.

[0004] Two-phase liquid cooling, also known as immersion two-phase liquid cooling technology, generally involves immersing the entire circuit chip board in a phase change material liquid chamber. The evaporation-condensation process of the phase change material liquid is used to effectively remove the heat from the chip. The phase change material liquid evaporates into gas and rises to the top of the liquid chamber. It exchanges heat with the cooling device installed at the top, re-liquefies and drips back down. The cooling device then exchanges heat to the outside through the heat exchange system. This cooling method not only achieves more efficient heat exchange, but also, due to the thermal conductivity and surface tension of the liquid, can significantly reduce the temperature fluctuations of the system, thereby improving the stability and service life of the components. In addition, two-phase immersion liquid cooling also has lower noise and energy consumption, and can effectively reduce the noise pollution caused by high-speed fans and high-power blowers in air cooling systems.

[0005] However, despite the significant advantages of two-phase immersion liquid cooling technology, it still faces many challenges and much room for engineering optimization in practical applications.

[0006] The first is that different areas on the chip board generate different amounts of heat due to their different functions, but the cooling method is the same as that of other areas, resulting in a mismatch between the cooling effect and the heat generated. For example, the high-power computing area on the chip board tends to generate a lot of heat, while low-power components such as memory and hard drives generate less heat. In this case, if the computing area is not cooled in a timely manner, computing efficiency will be greatly reduced.

[0007] Secondly, high-heat areas on the chip board accelerate the vaporization rate. As the coolant vaporizes, it easily forms a layer of bubbles on the surface. If the bubbles aren't removed promptly and effectively, they can even form a localized "air film." Because gas has poor thermal conductivity, these bubbles adhering to the surface of the high-heat area form an insulating layer, reducing the heat exchange efficiency between the phase-change liquid and the chip surface. This vicious cycle leads to even more severe heating in the high-heat area, affecting the stability of the entire server system.

[0008] Therefore, how to obtain a two-phase immersion liquid cooling method for servers with better cooling effect and targeted treatment of uneven heating to improve the overall computing power of the server has become a problem that needs to be further considered and solved by technical personnel in this field. Summary of the Invention

[0009] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: how to provide a locally enhanced server chip phase change liquid cooling method that can better treat the high-heating areas of the chip to balance the cooling effect and improve the performance of the entire server.

[0010] In order to solve the above technical problems, the present invention adopts the following technical solutions: A locally enhanced server chip phase change liquid cooling method immerses a horizontally arranged chip board in a two-phase coolant and cools the chip board by vaporizing the two-phase coolant. The vaporized two-phase coolant rises to the upper end of the two-phase coolant chamber, exchanges heat with the cooling device, liquefies, and falls back downward. The method is characterized in that the two-phase coolant is guided to flow upward in the upper space of the high-heating area of ​​the chip board, so that bubbles generated on the surface of the high-heating area can reach the upper end of the two-phase coolant chamber faster for liquefaction.

[0011] In this way, this solution can drain the upper space of the high-heating area of ​​the chip board upward separately, so that the generated bubbles can reach the upper end of the two-phase coolant chamber faster for liquefaction, and the surrounding liquid flows from below to replenish it. This not only makes the cooling effect of the high-heating area better, but also the other areas will also better improve the heat dissipation efficiency and heat dissipation uniformity due to the enhanced fluidity of the coolant.

[0012] Furthermore, the high-heating area is the area where the CPU is located, so as to better achieve targeted heat dissipation and cooling of the computing area and ensure the stability of the server computing performance.

[0013] Furthermore, when the surface temperature of the high-heat-generating area exceeds the vaporization temperature of the two-phase coolant and reaches a preset temperature, the bubbles generated on the surface are driven off the surface and into the two-phase coolant. This can further improve the heat dissipation and cooling effect of the high-heat-generating area.

[0014] Furthermore, the present method is implemented by a server chip phase change liquid cooling system, which includes a cooling chamber, a horizontally arranged chip board at the lower part of the cooling chamber, a phase change coolant soaked in the middle part, a cooling plate at the upper end, a cooling device arranged in the cooling plate, wherein a guide cover is arranged upward corresponding to the high heating area of ​​the chip board, and an upward fan blade device is arranged in the guide cover.

[0015] In this way, the fan device can guide the phase-change coolant in the high-heating areas of the chip board upward along the shroud, thereby more quickly moving the vaporized bubbles in these areas upward, improving the phase-change heat transfer efficiency in these areas. Simultaneously, coolant flows from all four directions below the shroud to replenish the high-heating areas, further enhancing the heat transfer effect on the chip board.

[0016] Furthermore, a temperature difference power generation chip is provided on the lower surface of the cooling plate corresponding to the upper end port of the air guide cover, and the positive and negative output ends of the temperature difference power generation chip are connected to the fan blade device as a power source.

[0017] The high-heat bubbles generated in the high-heating area rise to the thermoelectric generator, raising the temperature of its lower surface and creating a large temperature difference between the upper surface and the lower surface. The generated electricity is used to drive the fan mechanism. The higher the heat generated in the high-heating area of ​​the chip board, the faster the bubble rises, and the higher the temperature at the bottom of the thermoelectric generator. The greater the temperature difference, the greater the power generation, which in turn speeds up the fan mechanism, accelerating the bubble rise and improving the heat transfer efficiency in the high-heating area. This achieves an adaptive heat exchange and cooling effect.

[0018] Furthermore, a lower convex portion is provided on the lower surface of the cooling plate corresponding to the upper end port of the air guide cover, and the lower convex portion is made of heat-conducting material. The thermoelectric power generation chip is installed on the lower surface of the lower convex portion. The lower surface of the lower convex portion also has a circle of downward flanges around it to form a groove structure inside.

[0019] In this way, the lower surface of the lower convex portion can be immersed in the phase change coolant, and the bubbles rising upward through the guide cover are concentrated into the sink, heating the lower surface of the thermoelectric power generation chip and re-liquefying it, thereby preventing the bubbles in the guide cover from entering the gas phase layer at the upper end of the phase change coolant and diffusing, resulting in unconcentrated heating of the lower surface of the thermoelectric power generation chip.

[0020] Furthermore, the vertical cross-section of the air deflector is in the shape of a frustum that is larger at the bottom and smaller at the top.

[0021] This makes it easier for the bubbles generated in the high-heating area to concentrate into the groove on the lower surface of the lower convex part to better heat the thermoelectric power generation chip.

[0022] Furthermore, the air guide cover is a mesh cover structure.

[0023] Furthermore, the upper surface of the high-heat-generating area of ​​the chip board has a heat-dissipating protrusion arranged upward, and the heat-dissipating protrusion is made of a porous heat-conducting material.

[0024] In this way, the contact area between the high-heat-generating area of ​​the chip board and the phase-change coolant can be better increased, thereby improving the heat exchange efficiency.

[0025] Furthermore, the internal aperture of the heat dissipation protrusion gradually increases from bottom to top.

[0026] In this way, the bubbles in the heat dissipation protrusion can gradually grow from bottom to top and separate from the heat dissipation protrusion and rise upward.

[0027] Furthermore, the upper surface of the heat dissipation protrusion is arranged with multiple rows of vertical grooves, and each vertical groove is provided with a memory alloy metal strip. One end of the memory alloy metal strip is fixed in the vertical groove, and the other end can bend upward into the top of the heat dissipation protrusion when the deformation temperature is reached. The deformation temperature of the memory alloy metal strip is greater than the vaporization phase change temperature of the phase change coolant in the range of 1-10°C.

[0028] In this way, when the high-heat area is severely heated and the heat dissipation protrusion heats up significantly and reaches the deformation temperature of the memory alloy, the memory alloy is deformed by the heat, and the other end extends upward, driving the bubbles in the vertical groove and the internal pores of the heat dissipation protrusion and bringing them upward into the phase-change coolant. After the upper end of the memory alloy enters the phase-change coolant, the temperature drops, and it returns to its original state and falls back into the vertical groove. In this way, once the high-heat area is overheated, the memory alloy can automatically repeat the action, better guide the bubbles generated in the high-heat area upward and drive them into the coolant, thereby better improving the heat exchange efficiency of the high-heat area. Moreover, the higher the temperature, the faster the heat exchange, and the faster the memory alloy moves, thus achieving adaptive control.

[0029] In summary, the present invention can better perform cooling treatment on the high-heat-generating areas of the chip to balance the overall cooling effect and improve the performance of the entire server. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the structure of the server chip phase change liquid cooling system used in an embodiment of the present invention.

[0031] Figure 2 for Figure 1 Schematic diagram of the structure after enlarging the separate heat dissipation protrusion part.

[0032] Figure 3 for Figure 2 The side view of the memory alloy metal strip is in a deformed state.

[0033] Figure 4 for Figure 2 Top view in . DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Optimal embodiment: A locally enhanced server chip phase change liquid cooling method, wherein a horizontally arranged chip board is immersed in a two-phase coolant, and the chip board is cooled by the vaporization of the two-phase coolant. The vaporized two-phase coolant rises to the upper end of the two-phase coolant chamber, exchanges heat with the cooling device, and liquefies and falls back to the bottom. The method is characterized in that the two-phase coolant is guided to flow upward in the upper space position of the high-heating area of ​​the chip board, so that the bubbles generated on the surface of the high-heating area can be accelerated to reach the upper end of the two-phase coolant chamber for liquefaction.

[0036] In this way, this solution can drain the upper space of the high-heating area of ​​the chip board upward separately, so that the generated bubbles can reach the upper end of the two-phase coolant chamber faster for liquefaction, and the surrounding liquid flows from below to replenish it. This not only makes the cooling effect of the high-heating area better, but also the other areas will also better improve the heat dissipation efficiency and heat dissipation uniformity due to the enhanced fluidity of the coolant.

[0037] During implementation, the high-heat area is the area where the CPU is located. This can better achieve targeted heat dissipation and cooling of the computing area and ensure the stability of the server's computing performance.

[0038] During implementation, when the surface temperature of the high-heat-generating area exceeds the vaporization temperature of the two-phase coolant and reaches a preset temperature, the bubbles generated on the surface are driven off the surface and into the two-phase coolant. This can further improve the heat dissipation and cooling effect of the high-heat-generating area.

[0039] During implementation, this method relies on a server chip phase change liquid cooling system, the server chip phase change liquid cooling system, see Figure 1-4As shown, it includes a cooling chamber 1, a horizontally arranged chip board 2 is provided at the lower part of the cooling chamber 1, a phase change coolant 3 is immersed in the middle part, a cooling plate 4 is provided at the upper end, a cooling device 5 is provided in the cooling plate 4, and a guide cover 6 is provided upward corresponding to the high heating area of ​​the chip board, and an upward fan blade device 7 is provided in the guide cover 6.

[0040] In this way, the fan blade device can guide the phase change coolant in the high-heating area of ​​the chip board upward along the guide cover, so it can drive the vaporized bubbles in the high-heating area upward more quickly, improving the phase change heat transfer efficiency in the high-heating area. At the same time, the coolant flows from the four directions below the guide cover to the high-heating area to replenish it, which can also better improve the heat exchange effect on the chip board. During implementation, the cooling device 5 is connected to the heat exchange circulation system, and the heat exchange circulation system has a heat dissipation device located outside the server room.

[0041] Among them, a thermoelectric power generation chip 8 is provided on the lower surface of the cooling plate 4 corresponding to the upper end port of the air guide cover, and the positive and negative output ends of the thermoelectric power generation chip 8 are connected to the fan blade device 7 as a power source.

[0042] The high-heat bubbles generated in the high-heating area rise to the thermoelectric generator, raising the temperature of its lower surface and creating a large temperature difference between the upper surface and the lower surface. The generated electricity is used to drive the fan mechanism. The higher the heat generated in the high-heating area of ​​the chip board, the faster the bubble rises, and the higher the temperature at the bottom of the thermoelectric generator. The greater the temperature difference, the greater the power generation, which in turn speeds up the fan mechanism, accelerating the bubble rise and improving the heat transfer efficiency in the high-heating area. This achieves an adaptive heat exchange and cooling effect.

[0043] Among them, the lower surface of the cooling plate 4 is provided with a lower protrusion 9 corresponding to the upper end port of the air deflector, and the lower protrusion 9 is made of heat-conducting material. The thermoelectric power generation chip 8 is installed on the lower surface of the lower protrusion. The lower surface of the lower protrusion is also surrounded by a circle of downward flanges 10 to form a groove structure inside it.

[0044] In this way, the lower surface of the lower convex portion can be immersed in the phase change coolant, and the bubbles rising upward through the guide cover are concentrated into the sink, heating the lower surface of the thermoelectric power generation chip and re-liquefying it, thereby preventing the bubbles in the guide cover from entering the gas phase layer at the upper end of the phase change coolant and diffusing, resulting in unconcentrated heating of the lower surface of the thermoelectric power generation chip.

[0045] The vertical cross-section of the air deflector 6 is generally in the shape of a frustum that is larger at the bottom and smaller at the top.

[0046] This makes it easier for the bubbles generated in the high-heating area to concentrate into the groove on the lower surface of the lower convex part to better heat the thermoelectric power generation chip.

[0047] Wherein, the air guide cover 6 is a mesh cover structure.

[0048] The upper surface of the high-heat-generating area of ​​the chip board 2 has a heat-dissipating protrusion 11 arranged upward, and the heat-dissipating protrusion 11 is made of a porous heat-conducting material.

[0049] In this way, the contact area between the high-heat-generating area of ​​the chip board and the phase-change coolant can be better increased, thereby improving the heat exchange efficiency.

[0050] The internal aperture of the heat dissipation protrusion 11 gradually increases from bottom to top.

[0051] In this way, the bubbles in the heat dissipation protrusion can gradually grow from bottom to top and separate from the heat dissipation protrusion and rise upward.

[0052] Among them, the upper surface of the heat dissipation protrusion 11 is arranged with multiple rows of vertical grooves 12, and each vertical groove 12 is respectively provided with a memory alloy metal strip 13. One end of the memory alloy metal strip 13 is fixed in the vertical groove, and the other end can bend upward into the top of the heat dissipation protrusion when the deformation temperature is reached. The deformation temperature of the memory alloy metal strip is greater than the vaporization phase change temperature of the phase change coolant in the range of 1-10°C.

[0053] In this way, when the high-heat area is severely heated and the heat dissipation protrusion heats up significantly and reaches the deformation temperature of the memory alloy, the memory alloy is deformed by the heat, and the other end extends upward, driving the bubbles in the vertical groove and the internal pores of the heat dissipation protrusion and bringing them upward into the phase-change coolant. After the upper end of the memory alloy enters the phase-change coolant, the temperature drops, and it returns to its original state and falls back into the vertical groove. In this way, once the high-heat area is overheated, the memory alloy can automatically repeat the action, better guide the bubbles generated in the high-heat area upward and drive them into the coolant, thereby better improving the heat exchange efficiency of the high-heat area. Moreover, the higher the temperature, the faster the heat exchange, and the faster the memory alloy moves, thus achieving adaptive control.

Claims

1. A locally enhanced phase-change liquid cooling method for server chips, wherein a horizontally arranged chip board is immersed in a two-phase coolant, and the chip board is cooled by vaporization of the two-phase coolant. The vaporized two-phase coolant rises to the upper end of the two-phase coolant chamber, exchanges heat with a cooling device, liquefies, and falls back to the bottom. The method is characterized by: The two-phase coolant is guided to flow upward in the upper space of the high-heating area of ​​the chip board, so that the bubbles generated on the surface of the high-heating area can quickly reach the upper end of the two-phase coolant chamber for liquefaction.

2. The locally enhanced server chip phase change liquid cooling method according to claim 1, characterized in that: The high-heat area is the area where the CPU is located.

3. The locally enhanced server chip phase change liquid cooling method according to claim 1, characterized in that: When the surface temperature of the high-heat-generating area exceeds the vaporization temperature of the two-phase coolant and reaches a preset temperature, the bubbles generated on the surface are driven away from the surface and enter the two-phase coolant liquid.

4. The locally enhanced server chip phase change liquid cooling method according to claim 1, characterized in that: This method is implemented by a server chip phase change liquid cooling system, which includes a cooling chamber, a horizontally arranged chip board at the lower part of the cooling chamber, a phase change coolant soaked in the middle part, a cooling plate at the upper end, a cooling device arranged in the cooling plate, and an air guide cover arranged upward corresponding to the high-heating area of ​​the chip board, and an upward fan blade device arranged in the air guide cover.

5. The locally enhanced server chip phase change liquid cooling method according to claim 4, characterized in that: A temperature difference power generation chip is provided on the lower surface of the cooling plate corresponding to the upper end port of the air guide cover, and the positive and negative output ends of the temperature difference power generation chip are connected to the fan blade device as a power source.

6. The locally enhanced server chip phase change liquid cooling method according to claim 5, characterized in that: The lower surface of the cooling plate is provided with a lower convex portion corresponding to the upper end port of the air guide cover, and the lower convex portion is made of heat-conducting material. The thermoelectric power generation chip is installed on the lower surface of the lower convex portion. The lower surface of the lower convex portion is also surrounded by a circle of downward flanges to form a groove structure inside.

7. The locally enhanced server chip phase change liquid cooling method according to claim 4, characterized in that: The vertical cross-section of the air deflector is in the shape of a truncated cone with a larger bottom and a smaller top.

8. The locally enhanced server chip phase change liquid cooling method according to claim 4, characterized in that: The upper surface of the high-heat-generating area of ​​the chip board is provided with a heat-dissipating protrusion arranged upward, and the heat-dissipating protrusion is made of a porous heat-conducting material.

9. The locally enhanced server chip phase change liquid cooling method according to claim 8, characterized in that: The internal aperture of the heat dissipation protrusion gradually increases from bottom to top.

10. The locally enhanced server chip phase change liquid cooling method according to claim 8, characterized in that: The upper surface of the heat dissipation protrusion is arranged with multiple rows of vertical grooves, and each vertical groove is respectively provided with a memory alloy metal strip. One end of the memory alloy metal strip is fixed in the vertical groove, and the other end can bend upward and enter the top of the heat dissipation protrusion when the deformation temperature is reached. The deformation temperature of the memory alloy metal strip is greater than the vaporization phase change temperature of the phase change coolant in the range of 1-10°C.

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