Hollow wafer detection platform

Abstract

A hollow wafer detection platform provided by the present invention comprises a detection box, a detection table and a detector, the detection box is a hollow box body, the detection table is arranged in the detection box, the detection table is used for loading a wafer, the detection table is provided with a rotating mechanism for driving the wafer to rotate, and the detection box is also internally provided with a transplanting mechanism for driving the detection table to move. The top of the detection box is provided with an upper detection port, the bottom of the detection box is provided with a lower detection port, the detector is a spectrum detector and comprises two groups of light paths, one group of light paths enters from the upper detection port, is reflected back to the upper detection port through the surface of the wafer and is used for detecting the epitaxial film thickness of the wafer, and the other group of light paths enters from the upper detection port, penetrates through the wafer and then goes out of the detection box from the lower detection port. The method is used for detecting the element concentration of wafers. According to the invention, epitaxial film thickness detection and element concentration detection can be completed at the same time through one-time detection, the equipment and wafer detection process is simplified, the equipment cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a hollow wafer detection platform. Background Art

[0002] During the semiconductor wafer manufacturing process, epitaxial film thickness and element concentration must be tested to ensure wafer quality. Existing technologies typically use separate equipment to test epitaxial film thickness and element concentration, increasing equipment costs and requiring multiple steps of material removal and positioning. This is cumbersome, time-consuming, and inefficient, impacting overall production efficiency. Summary of the Invention

[0003] The present invention aims to provide a hollow wafer inspection platform to overcome the deficiencies in the prior art.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: a hollow wafer detection platform, including a detection box, a detection table, and a detector. The detection box is a hollow box body with a detection table inside. The detection table is used to load wafers. The detection table is provided with a rotating mechanism for driving the wafer to rotate. The detection box is also provided with a transplanting mechanism for driving the detection table to move, and an upper detection port is provided on the top of the detection box and a lower detection port is provided on the bottom. The upper detection port and the lower detection port are located on the central axis of the wafer on the detection table; the detector is a spectroscopic detector, including two groups of light paths, one of which is emitted from the upper detection port and reflected back to the upper detection port through the wafer surface, which is used to detect the epitaxial film thickness of the wafer; the other group of light paths is emitted from the upper detection port, passes through the wafer, and then exits the detection box from the lower detection port, which is used to detect the element concentration of the wafer.

[0005] Furthermore, the above-mentioned hollow wafer detection platform, the detection box is also provided with a loading port for loading and unloading wafers on one side, the loading port is provided with a switching mechanism, the switching mechanism includes a switching door and a switch assembly, the switching door can open or close the loading port through the switch assembly; the switch assembly includes a switch cylinder and a door frame, a door frame is provided on the outside of the loading port, a switch door slidably connected to the door frame is inserted in the door frame, the switch cylinder is installed on one side of the detection box through a cylinder mounting base, and its output end is connected to the bottom of the switch door, and the cylinder mounting base is fixed to the bottom of the detection box.

[0006] Furthermore, the aforementioned hollow wafer inspection platform comprises a rotating mechanism including a rotating wheel, a driving wheel, and a servo motor. The rotating wheel is located in the middle of the inspection platform and is rotatably connected to the inspection platform via a bearing. The servo motor is mounted above the inspection platform, and its output shaft is provided with a driving wheel located below the inspection platform. The toothed ring of the rotating wheel is located below the inspection platform, and a transmission belt is wound around the toothed ring and the driving wheel. Preferably, the rotating mechanism further comprises a tensioning wheel and a tensioning wheel. The tensioning wheels are located on either side of the transmission belt, and the tensioning shaft of the tensioning wheel is fixedly connected to the inspection platform, while the tensioning shaft of the tensioning wheel is movably connected to the inspection platform via an adjusting member.

[0007] Furthermore, in the above-mentioned hollow wafer detection platform, the inner hole diameter of the rotating wheel is larger than the outer diameter of the wafer.

[0008] Furthermore, the above-mentioned hollow wafer inspection platform is also provided with a positioning mechanism for positioning the wafer on the inspection platform, and the positioning mechanism includes two fixed positioning blocks and one movable positioning block. The two fixed positioning blocks and one movable positioning block are arranged on the top surface of the rotating wheel and are evenly distributed along the circumference of the rotating wheel. The fixed positioning block is used to support the wafer, and the movable positioning block is connected to the clamping assembly to tighten the side of the wafer. The movable positioning block cooperates with the fixed positioning block to position the wafer so that the center of the wafer coincides with the center of the rotating wheel.

[0009] Furthermore, the above-mentioned hollow wafer detection platform, the fixed positioning block includes a mounting part and a supporting part. The mounting part is arranged above the rotating wheel and is connected to the rotating wheel through fasteners. The supporting part is arranged in the middle part of the inner side of the mounting part, and is a small boss extending from the inner side of the mounting part toward the center of the rotating wheel, and the top surface of the supporting part is lower than the top surface of the mounting part; a protruding arc-shaped boss is provided on each side of the inner side of the movable positioning block, and the arc-shaped boss cooperates with the outer peripheral side of the wafer.

[0010] Furthermore, the above-mentioned hollow wafer detection platform, the clamping assembly includes a clamping cylinder, an insert block, a connecting seat, a slide rail seat 1, and a slide rail 1. The clamping cylinder is fixed above the detection platform, and an insert block is provided at its output end. The connecting seat is fixed above the movable fixed block, and a U-shaped slot is provided at the bottom of one end close to the clamping cylinder. The insert block is movably connected to the U-shaped slot. The slide rail seat 1 is fixed above the rotating wheel, and a slide rail 1 is provided thereon. The movable fixed block is provided above the slide rail 1 and is slidably connected to the slide rail 1 through a slider. A tension spring is also provided on one side of the slide rail 1, and one end of the tension spring is connected to the slide rail seat 1, and the other end is connected to the movable fixed block.

[0011] Furthermore, the above-mentioned hollow wafer inspection platform is provided with support blocks on both sides of the movable positioning block, and a protruding support part 2 is provided in the middle of the inner side of the support block. The support part 2 is also a small boss extending toward the center of the rotating wheel, and the top surface of the support part 2 is flush with the top surface of the support block body.

[0012] Furthermore, the above-mentioned hollow wafer inspection platform, the transplanting mechanism includes two slide rails, two servo motors, and a synchronous belt transmission assembly. Two slide rails are provided on both sides of the inspection platform for sliding connection therewith, the two slide rails are fixed on two slide rail seats, the two servo motors are provided at the bottom of the inspection box, the two servo units are connected to the synchronous belt transmission assembly located inside the inspection box, and the synchronous belt of the synchronous belt transmission assembly is provided with a belt connecting seat connected to the bottom surface of the inspection platform.

[0013] Furthermore, the above-mentioned hollow wafer inspection platform, the inspection box is also provided with an adjustment mechanism for adjusting the position of the inspection platform, the adjustment mechanism is used to adjust the position of the inspection platform, including an X-direction adjustment component and a Y-direction adjustment component, the X-direction adjustment component is arranged below the transplanting mechanism, the Y-direction adjustment component is arranged on the inspection box, and the X-direction adjustment component is arranged on it, and the X-direction adjustment component is arranged below the transplanting mechanism and connected to the transplanting mechanism.

[0014] Furthermore, the aforementioned hollow wafer inspection platform includes an X-axis adjustment assembly comprising a slide rail 3 and a slide rail seat 3. Two slide rail seats 3 are provided, one on each side of the inspection platform and arranged along the movement direction of the transfer mechanism. A slide rail 3 is provided at each end of the slide rail seat 3, and an adjustment screw 1 is threadedly connected to the middle portion of the slide rail seat 3. The inner end of the adjustment screw 1 is connected to the slide rail seat 2 of the transfer mechanism. Preferably, an adjustment window is provided on the side wall of the inspection box, corresponding to the adjustment screw 1, and the adjustment window is provided with a removable sealing plate.

[0015] Furthermore, the above-mentioned hollow wafer detection platform, the Y-axis adjustment component includes a slide rail four, which is fixed to the side wall of the detection box. There are four slide rails four, which are respectively arranged at the two ends of two slide rail seats three. The slide rail seat three is slidably connected to the slide rail four through a slider, and an adjustment screw two is provided at the middle position of the bottom of the slide rail seat three, and the adjustment screw two is threadedly connected to the bottom plate of the detection box.

[0016] Compared with existing technologies, the present invention has the following beneficial effects: it simplifies measurement steps, reduces measurement time, and improves production efficiency; it can simultaneously complete epitaxial film thickness detection and element concentration detection in a single test, simplifying the equipment and wafer detection process, reducing equipment costs, and reducing the number of positioning times, making operation simpler and more convenient, further improving production efficiency. In addition, the present invention uses a hollow, relatively closed detection box to detect wafers, which not only ensures cleanliness during detection, but also makes the hollow box more conducive to element concentration detection and ensures detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 Schematic diagram of the external structure of the hollow wafer inspection platform of the present invention;

[0019] Figure 2 Schematic diagram of the internal structure of the hollow wafer inspection platform of the present invention;

[0020] Figure 3 It is a partial internal schematic diagram of the hollow wafer inspection platform of the present invention;

[0021] Figure 4 for Figure 3 A top view of

[0022] Figure 5 Schematic diagram of the inspection platform of the hollow wafer inspection platform of the present invention;

[0023] Figure 6 for Figure 6 Bottom view of

[0024] In the figure: 1, detection box; 11, upper detection port; 12, lower detection port; 13, loading port; 14, adjustment window;

[0025] 2. Test bench; 21. Calibration sheet; 22. Calibration cylinder;

[0026] 3. Rotating mechanism; 31. Rotating wheel; 32. Driving wheel; 33. Servo motor 1; 34. Bearing; 35. Transmission belt; 36. Tensioner pulley 1; 37. Tensioner pulley 2;

[0027] 4. Transplanting mechanism; 41. Slide rail 2; 42. Servo motor 2; 43. Synchronous belt drive assembly; 44. Slide rail seat 2; 45. Belt connecting seat;

[0028] 5. Switch mechanism; 51. Switch door; 52. Switch cylinder; 53. Door frame; 54. Cylinder mounting base;

[0029] 6. Positioning mechanism; 61. Fixed positioning block; 611. Mounting portion; 612. Support portion 1; 62. Movable positioning block, clamping assembly; 63. Clamping cylinder; 64. Insert block; 65. Connecting seat; 66. Slide rail seat 1; 67. Slide rail 1; 68. Tension spring; 69. Support block; 691. Support portion 2;

[0030] 7. Adjustment mechanism; 71. X-axis adjustment assembly; 711. Slide rail three; 712. Slide rail seat three; 713. Adjustment screw one; 714. Closing plate; 72. Y-axis adjustment assembly; 721. Slide rail four; 722. Adjustment screw two. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Example 1

[0033] like Figure 1-6 As shown, a hollow wafer inspection platform includes an inspection box 1, an inspection table 2, and a detector. The inspection box 1 is a hollow box body, which is relatively closed. The inspection table 2 is provided inside the box. The inspection table 2 is used to load wafers. A rotating mechanism 3 for driving the wafer rotation is provided on the inspection table 2. A transplanting mechanism 4 for driving the inspection table to move is also provided inside the inspection box 1. An upper inspection port 11 is provided on the top of the inspection box 1, and a lower inspection port 12 is provided on the bottom. The upper inspection port 11 and the lower inspection port 12 are located on the central axis of the wafer on the inspection table 2.

[0034] An upper optical box is located above the upper inspection port, and a lower optical box is located below the lower inspection port. The detector (not shown) is a spectrometer, comprising two optical paths. One optical path enters from the upper inspection port 11, reflects off the wafer surface, and returns to the upper inspection port, where it is received by a receiver in the upper optical box. This path uses reflection detection to measure the wafer's epitaxial film thickness. The other optical path enters from the upper inspection port 11, transmits through the wafer, and exits the inspection box 1 through the lower inspection port 12. This light is received by a receiver in the lower optical box, where it uses transmission detection to measure the wafer's elemental concentration. The spectral information received by the receiver can be used to measure the epitaxial film thickness and elemental concentration, respectively.

[0035] During detection, multiple measurement points are set on the wafer, and the multiple measurement points are distributed along the circumference of multiple concentric circles. The concentric circles are concentric with the wafer, and the point where the outermost concentric circle intersects with the moving direction of the transfer mechanism is set as the initial detection position, or the center of the wafer is used as the initial detection position. During detection, the detection table is moved to the initial detection position, the two sets of optical paths of the detector are aligned with the upper detection port 11, and then the detector is started, the rotating mechanism 3 and the transfer mechanism 4 are also started in sequence, the detection table 2 rotates and moves, and the moving stroke is the radius of the wafer. The detection of multiple concentric circles is completed in sequence, thereby completing the detection of the entire wafer, simplifying the measurement operation steps, reducing the measurement time, and improving production efficiency. The present invention can simultaneously complete the epitaxial film thickness detection and element concentration detection in one detection, simplifying the equipment and wafer detection process, reducing equipment costs, reducing the number of positioning times, and making the operation more convenient and simple, further improving production efficiency. The present invention adopts a hollow and relatively closed detection box to detect wafers. During detection, the box body is filled with nitrogen, which not only ensures the cleanliness of the detection, but also the hollow box body is more conducive to the detection of element concentration, ensuring the detection accuracy.

[0036] like Figure 5-6 As shown, the rotating mechanism 3 includes a rotating wheel 31, a driving wheel 32, and a servo motor 33. The rotating wheel 31 is located in the middle of the test platform 2 and is rotatably connected to the test platform 2 via a bearing 34. The servo motor 33 is mounted above the test platform 2. Its output shaft is equipped with the driving wheel 32, which is located below the test platform 2. The toothed ring of the rotating wheel 31 is located below the test platform 2, and a transmission belt 35 is wound around the toothed ring and the driving wheel 32. The number of teeth on the rotating wheel 31 is greater than that on the driving wheel 32, reducing the transmission speed. In addition, to reduce obstruction of the wafer from above and below, the inner diameter of the rotating wheel 31 is larger than the outer diameter of the wafer.

[0037] like Figure 6 As shown, the rotating mechanism 3 also includes a tensioning pulley 1 36 and a tensioning pulley 2 37. The tensioning pulley 1 37 and the tensioning pulley 2 38 are respectively arranged on both sides of the transmission belt 35, and the tensioning shaft of the tensioning pulley 1 36 is fixedly connected to the detection platform 2, and the tensioning shaft of the tensioning pulley 2 37 is movably connected to the detection platform through an adjusting member, thereby adjusting the tension of the transmission belt.

[0038] like Figure 2 、 5 -6, the detection table 2 is also provided with a positioning mechanism 6 for positioning the wafer, and the positioning mechanism 6 includes two fixed positioning blocks 61 and one movable positioning block 62. The two fixed positioning blocks 61 and one movable positioning block 62 are arranged on the top surface of the rotating wheel 31 and are evenly distributed along the circumference of the rotating wheel 31. The fixed positioning block 61 is used to support the wafer, and the movable positioning block 62 is connected to the clamping assembly to tighten the side of the wafer. The movable positioning block 62 cooperates with the fixed positioning block 61 to position the wafer so that the center of the wafer coincides with the center of the rotating wheel 31.

[0039] The fixed positioning block 61 includes a mounting portion 611 and a support portion 612. The mounting portion 611 is arranged above the rotating wheel 31 and is connected to the rotating wheel 31 through fasteners. The support portion 612 is arranged in the middle of the inner side of the mounting portion 611. It is a small boss extending from the inner side of the mounting portion 611 toward the center of the rotating wheel 31, and the top surface of the support portion 612 is lower than the top surface of the mounting portion 611. A protruding arc-shaped boss is provided on each side of the inner side of the movable positioning block 62, and the arc-shaped boss cooperates with the outer peripheral side of the wafer.

[0040] Among them, the clamping assembly includes a clamping cylinder 63, an insert block 64, a connecting seat 65, a slide rail seat 66, and a slide rail 67. The clamping cylinder 63 is fixed above the detection table 2, and an insert block 63 is provided at its output end. The connecting seat 65 is fixed above the movable fixed block 62, and a U-shaped slot is provided at the bottom of the end close to the clamping cylinder 63. The insert block 64 is movably connected to the U-shaped slot, and the slot width of the U-shaped slot is greater than the thickness of the insert block. The slide rail seat 66 is fixed above the rotating wheel 31, and a slide rail 67 is provided thereon. The movable fixed block 62 is provided above the slide rail 67 and is slidably connected to the slide rail 67 through a slider. A tension spring 68 is also provided on one side of the slide rail 67, and one end of the tension spring 68 is connected to the slide rail seat 66, and the other end is connected to the movable fixed block 62.

[0041] To prevent the wafer from tilting toward the movable positioning block 62 before positioning, support blocks 69 are provided on both sides of the movable positioning block 62. A second protruding support portion 691 is provided in the middle of the inner side of the support block 69. The second support portion 691 is also a small boss extending toward the center of the rotating wheel 31, and the top surface of the second support portion 691 is flush with the top surface of the main body of the support block 69. The provision of support blocks 69 prevents damage to the wafer when the movable positioning block 62 is clamped.

[0042] During positioning, the wafer is placed above support part 1 612 and support part 2 691, and then the clamping cylinder 53 is extended, the insert block 64 is in a non-contact state with the U-shaped slot, the insert block 64 is disengaged from the connecting seat 65, and the movable positioning block 62 is pressed on the side of the wafer under the action of the tension spring, and the side of the wafer is pressed against the inner side of the mounting part 611 of the fixed positioning block 61, and the wafer is centrally positioned. At this time, the wafer can rotate with the rotating wheel 31; on the contrary, when unloading is required, the insert block 64 is located in the U-shaped slot, the clamping cylinder 63 is retracted, the insert block 64 contacts one side of the U-shaped slot and pulls the connecting seat 65 to move outward, releasing the positioning of the wafer and allowing unloading.

[0043] Example 2

[0044] Based on the structure of Example 1, Figure 1 、 2As shown, one side of the detection box 1 is also provided with a loading port 13 for loading and unloading wafers. The loading port 13 is provided with a switch mechanism 5. The switch mechanism 5 includes a switch door 51 and a switch assembly. The switch door 51 can open or close the loading port 13 through the switch assembly. The switch assembly includes a switch cylinder 52 and a door frame 53. The door frame 53 is provided on the outside of the loading port 13. The switch door 51 is inserted into the door frame 53 and is slidably connected to it. The switch cylinder 52 is installed on one side of the detection box 1 through a cylinder mounting base 54. Its output end is connected to the bottom of the switch door 51. The cylinder mounting base 54 is fixed to the bottom of the detection box 1. When loading and unloading, the switch cylinder 52 drives the switch door downward to open the loading port 13. The loading robot (not shown in the figure) enters the detection box from the loading port to load and unload wafers. Conversely, when testing, the switch door 51 is closed, sealing the loading port 13.

[0045] like Figure 2-4 As shown, the transfer mechanism 4 includes a second slide rail 41, a second servo motor 42, and a synchronous belt drive assembly 43. The two sides of the test platform 2 are provided with a second slide rail 41 that is slidably connected thereto. The second slide rail 41 is fixed on a second slide rail seat 44. The second servo motor 42 is located at the bottom of the test box 1. The second servo motor 42 is connected to the synchronous belt drive assembly 43 located inside the test box 1. The synchronous belt of the synchronous belt drive assembly 43 is provided with a belt connection seat 45 that is connected to the bottom surface of the test platform 2. The transfer mechanism drives the test platform 2 to move along the Z direction.

[0046] like Figure 2-4 As shown, the detection box 1 is also provided with an adjustment mechanism 7 for adjusting the position of the detection platform 2. The adjustment mechanism 7 is used to adjust the position of the detection platform 2, and includes an X-direction adjustment component 71 and a Y-direction adjustment component 72. The Y-direction adjustment component 72 is provided on the detection box, on which the X-direction adjustment component 71 is provided. The X-direction adjustment component 71 is provided below the transplanting mechanism 4 and is connected to the transplanting mechanism 4.

[0047] In this embodiment, the X-axis adjustment assembly 71 and the Y-axis adjustment assembly 72 are both manually adjustable assemblies. Specifically, the X-axis adjustment assembly 71 includes a slide rail 3 711 and a slide rail seat 3 712. Two slide rail seats 3 712 are provided, one on each side of the test platform 2 and arranged along the moving direction of the transfer mechanism 4. Each end of the slide rail seat 3 712 is provided with a slide rail 3 711, which is perpendicular to the slide rail 2 41. The middle portion of the slide rail seat 3 712 is provided with an adjustment screw 1 713 threadedly connected thereto. The inner end of the adjustment screw 1 713 is connected to the slide rail seat 2 44 of the transfer mechanism 4. In addition, an adjustment window 14 corresponding to the adjustment screw 1 713 is provided on the side wall of the test box 1. The adjustment window 14 is provided with a detachable sealing plate 714, which ensures the closure of the test box and facilitates adjustment.

[0048] The Y-axis adjustment assembly 72 includes a fourth slide rail 721, which is fixed to the side wall of the detection box 1. Four slide rails 721 are provided, located at both ends of two third slide rail seats 712. The third slide rail seats 712 are slidably connected to the fourth slide rail 721 via sliders. An adjustment screw 722 is also provided at the center of the bottom of the third slide rail seat 712. The adjustment screw 722 is threadedly connected to the bottom plate of the detection box. After the adjustment screw 722 is adjusted, it is fixed by screws located at the four corners of the bottom of the detection box 1.

[0049] Correspondingly, such as Figure 2 、 5 As shown in Figure 6, a calibration plate 21 is provided on one side of the inspection platform 2. The calibration plate 21 is provided with a calibration hole. To prevent the calibration plate 21 from colliding with the loading robot, a calibration cylinder 22 is provided below the calibration plate 21. During loading and unloading, the calibration cylinder 22 drives the calibration plate 21 downward, so that the calibration plate 21 does not exceed the top surface of the inspection platform 2. Conversely, during calibration, the calibration plate 21 rises.

[0050] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0051] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A hollow wafer inspection platform, characterized by: The utility model comprises a detection box, a detection platform and a detector. The detection box is a hollow box body with a detection platform inside. The detection platform is used to load wafers. The detection platform is provided with a rotating mechanism for driving the wafer to rotate. The detection box is also provided with a transplanting mechanism for driving the detection platform to move. The detection box is provided with an upper detection port on the top and a lower detection port on the bottom. The upper and lower detection ports are located on the central axis of the wafer on the detection platform. The detector is a spectrum detector, which includes two groups of light paths. One group of light paths is emitted from the upper detection port and reflected back to the upper detection port through the wafer surface, and is used to detect the epitaxial film thickness of the wafer. The other group of light paths is emitted from the upper detection port, passes through the wafer, and then exits the detection box from the lower detection port, and is used to detect the element concentration of the wafer.

2. The hollow wafer inspection platform according to claim 1, characterized in that: A loading port for loading and unloading wafers is also provided on one side of the detection box, and the loading port is provided with a switching mechanism, which includes a switch door and a switch assembly. The switch door can open or close the loading port through the switch assembly; the switch assembly includes a switch cylinder and a door frame. A door frame is provided on the outside of the loading port, and a switch door is inserted into the door frame for sliding connection therewith. The switch cylinder is installed on one side of the detection box through a cylinder mounting seat, and its output end is connected to the bottom of the switch door. The cylinder mounting seat is fixed to the bottom of the detection box.

3. The hollow wafer inspection platform according to claim 1, characterized in that: The rotating mechanism includes a rotating wheel, a driving wheel, and a servo motor. The rotating wheel is located in the middle of the detection platform and is rotatably connected to the detection platform through a bearing. The servo motor is installed above the detection platform, and its output shaft is provided with a driving wheel located below the detection platform. The gear ring of the rotating wheel is located below the detection platform, and a transmission belt is wound around the gear ring and the outside of the driving wheel.

4. The hollow wafer inspection platform according to claim 3, characterized in that: The inner hole diameter of the rotating wheel is larger than the outer diameter of the wafer.

5. The hollow wafer inspection platform according to claim 1 or 4, characterized in that: The inspection table is also provided with a positioning mechanism for positioning the wafer, and the positioning mechanism includes two fixed positioning blocks and one movable positioning block. The two fixed positioning blocks and one movable positioning block are arranged on the top surface of the rotating wheel and are evenly distributed along the circumference of the rotating wheel. The fixed positioning block is used to support the wafer, and the movable positioning block is connected to the clamping assembly to tighten the side of the wafer. The movable positioning block cooperates with the fixed positioning block to position the wafer so that the center of the wafer coincides with the center of the rotating wheel.

6. The hollow wafer inspection platform according to claim 5, characterized in that: The fixed positioning block includes a mounting portion and a supporting portion. The mounting portion is arranged above the rotating wheel and is connected to the rotating wheel through fasteners. The supporting portion is arranged in the middle of the inner side of the mounting portion and is a small boss extending from the inner side of the mounting portion toward the center of the rotating wheel, and the top surface of the supporting portion is lower than the top surface of the mounting portion. A protruding arc-shaped boss is provided on each side of the inner side of the movable positioning block, and the arc-shaped boss cooperates with the outer peripheral side of the wafer.

7. The hollow wafer inspection platform according to claim 5, characterized in that: The clamping assembly includes a clamping cylinder, an insert block, a connecting seat, a slide rail seat 1, and a slide rail 1. The clamping cylinder is fixed above the detection table, and an insert block is provided at its output end. The connecting seat is fixed above the movable fixed block, and a U-shaped slot is provided at the bottom of one end thereof close to the clamping cylinder. The insert block is movably connected to the U-shaped slot. The slide rail seat 1 is fixed above the rotating wheel, and a slide rail 1 is provided thereon. The movable fixed block is provided above the slide rail 1 and is slidably connected to the slide rail 1 through a slider. A tension spring is also provided on one side of the slide rail 1, and one end of the tension spring is connected to the slide rail seat 1, and the other end is connected to the movable fixed block.

8. The hollow wafer inspection platform according to claim 7, characterized in that: Support blocks are also provided on both sides of the movable positioning block. A protruding support part 2 is provided in the middle of the inner side of the support block. The support part 2 is also a small boss extending toward the center of the rotating wheel, and the top surface of the support part 2 is flush with the top surface of the support block body.

9. The hollow wafer inspection platform according to claim 1, characterized in that: The transplanting mechanism includes two slide rails, two servo motors, and a synchronous belt transmission assembly. Two slide rails are provided on both sides of the testing platform for sliding connection therewith. The two slide rails are fixed on two slide rail seats. The two servo motors are located at the bottom of the testing box. The two servo motors are connected to the synchronous belt transmission assembly located inside the testing box. The synchronous belt of the synchronous belt transmission assembly is provided with a belt connecting seat connected to the bottom surface of the testing platform.

10. The hollow wafer inspection platform according to claim 1, characterized in that: The detection box is also provided with an adjustment mechanism for adjusting the position of the detection platform. The adjustment mechanism is used to adjust the position of the detection platform, including an X-direction adjustment component and a Y-direction adjustment component. The X-direction adjustment component is arranged below the transplanting mechanism, and the Y-direction adjustment component is arranged on the detection box, on which the X-direction adjustment component is arranged. The X-direction adjustment component is arranged below the transplanting mechanism and connected to the transplanting mechanism.

11. The hollow wafer inspection platform according to claim 10, characterized in that: The X-direction adjustment assembly includes a slide rail three and a slide rail seat three. There are two slide rail seats three, which are arranged on both sides of the detection platform and along the moving direction of the transplanting mechanism. A slide rail three is provided at each end of the slide rail seat three, and an adjustment screw one is provided in the middle of the slide rail seat three, which is threadedly connected to it. The inner end of the adjustment screw one is connected to the slide rail seat two of the transplanting mechanism.

12. The hollow wafer inspection platform according to claim 11, characterized in that: The Y-axis adjustment component includes a slide rail four, which is fixed to the side wall of the detection box. There are four slide rails four, which are respectively arranged at the two ends of two slide rail seats three. The slide rail seat three is slidably connected to the slide rail four through a slider. An adjustment screw two is provided in the middle position of the bottom of the slide rail seat three, and the adjustment screw two is threadedly connected to the bottom plate of the detection box.

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