Printed circuit board and preparation method thereof

Abstract

The invention provides a printed circuit board and a preparation method thereof, and relates to the field of electronic components. The preparation method comprises the following steps: forming a core plate, wherein the core plate is arranged on a first surface of a conductive substrate; an accommodating hole is formed, and the accommodating hole penetrates through the conductive substrate and the core plate; forming an initial insulating layer, wherein the initial insulating layer is located on the inner wall of the accommodating hole; an initial conductive layer is formed, the initial conductive layer covers the first surface and the second surface of the conductive substrate, and the initial conductive layer covers the initial insulating layer on the first surface of the conductive substrate; and removing part of the initial insulating layer and part of the initial conducting layer to form an insulating layer and a conducting layer. The problems that short circuit is prone to occurring between the conductive layer and the inner wall of the containing hole, and the reject ratio of the printed circuit board is high can be solved.

Description

Technical Field

[0001] The present application relates to the field of electronic components, and in particular to a printed circuit board and a method for manufacturing the same. Background Art

[0002] Printed circuit boards are an important electronic component that can replace complex wiring. The application of printed circuit boards reduces the size of the entire machine, reduces equipment costs, and improves the quality and reliability of electronic equipment.

[0003] A printed circuit board (PCB) consists of a conductive substrate and a core board. The core board is mounted on the conductive substrate and electrically connected to the substrate via a conductive layer. The conductive substrate may also have receiving holes for accommodating components, thereby electrically connecting the components to the core board. However, the conductive layer and the inner wall of the receiving hole are prone to short circuits, resulting in a high defect rate for PCBs. Summary of the Invention

[0004] The embodiments of the present application provide a printed circuit board and a method for preparing the same, which are used to solve the problem of a high defect rate of the printed circuit board, such as a short circuit between the conductive layer and the inner wall of the receiving hole.

[0005] The method for preparing a printed circuit board provided in the embodiment of the present application includes:

[0006] forming a core plate, wherein the core plate is disposed on the first surface of the conductive substrate;

[0007] forming a receiving hole, the receiving hole penetrating the conductive substrate and the core plate;

[0008] forming an initial insulating layer, wherein the initial insulating layer is located on the inner wall of the receiving hole;

[0009] forming an initial conductive layer, wherein the initial conductive layer covers the first surface and the second surface of the conductive substrate, and the initial conductive layer covers the initial insulating layer on the first surface of the conductive substrate;

[0010] A portion of the initial insulating layer and a portion of the initial conductive layer are removed to form an insulating layer and a conductive layer.

[0011] By adopting the above technical solution, by first forming the receiving hole penetrating the conductive substrate and the core plate, and then forming the initial insulating layer and the initial conductive layer, the initial conductive layer can cover the initial insulating layer, thereby providing a certain degree of isolation for the initial conductive layer through the initial insulating layer, thereby reducing the possibility of the initial conductive layer contacting the inner wall of the receiving hole;

[0012] Subsequently, part of the initial insulating layer and part of the initial conductive layer are removed to form an insulating layer and a conductive layer. The insulating layer is adhered to the inner wall of the receiving hole, so that components can be installed on the inner side of the insulating layer, reducing the possibility of contact between the conductive layer and the inner wall of the receiving hole, and reducing the defective rate of the printed circuit board.

[0013] In some possible implementations, removing part of the initial insulating layer and part of the initial conductive layer includes:

[0014] drilling to remove a portion of the initial insulating layer and a portion of the initial conductive layer to form the insulating layer;

[0015] A portion of the initial conductive layer is removed by etching, and the remaining portion of the initial conductive layer forms the conductive layer.

[0016] In some possible implementations, etching and removing a portion of the initial conductive layer includes:

[0017] Etching the initial conductive layer on the first surface of the conductive substrate and at least covering the insulating layer to form a first opening; the first opening is located on the first surface of the conductive substrate, the first opening is corresponding to the receiving hole, and the first opening ring is located outside the receiving hole;

[0018] The portion of the initial conductive layer covering the insulating layer on the second surface of the conductive substrate is etched to form a second opening, wherein the second opening is located on the second surface of the conductive substrate and is arranged on the inner side of the accommodating hole, and at least a portion of the conductive layer covers the insulating layer.

[0019] In some possible implementations, the receiving hole is configured as a circular receiving hole;

[0020] The first opening is configured as a circular first opening, and a difference between a diameter of the circular first opening and a diameter of the circular receiving hole is greater than or equal to 50 microns and less than or equal to 150 microns;

[0021] And / or, the second opening is configured as a circular second opening, and the difference between the diameter of the circular receiving hole and the diameter of the circular second opening is greater than or equal to 50 microns and less than or equal to 150 microns.

[0022] In some possible implementations, after forming the core plate, the method further includes:

[0023] forming a communication hole, the communication hole penetrating the conductive substrate and the core plate;

[0024] Grinding the inner wall of the communicating hole to remove burrs on the inner wall of the communicating hole;

[0025] The initial conductive layer is formed, and at least a portion of the initial conductive layer is formed on the inner wall of the communication hole to form a conductive layer.

[0026] In some possible implementations, forming the core plate includes:

[0027] forming a mounting groove, wherein the mounting groove is located on the first surface of the conductive substrate;

[0028] Fixing the core plate in the mounting groove, wherein the surface of the core plate facing away from the bottom of the mounting groove is flush with the first surface of the conductive substrate;

[0029] After forming the insulating layer and the conductive layer, it also includes:

[0030] forming a marking portion, the marking portion being located on a surface of the core plate facing away from the bottom of the installation groove, and the marking portion being arranged in a ring on the inner side of the installation groove;

[0031] A separation layer is formed, and the separation layer is located in the first opening; a first portion of the separation layer covers the core board, and a second portion of the separation layer covers the insulating layer.

[0032] The printed circuit board provided in the embodiment of the present application includes a conductive substrate and a core board;

[0033] The first surface and the second surface of the conductive substrate are both provided with a conductive layer, the first surface of the conductive substrate is connected to the core board, and the conductive substrate is electrically connected to the core board through the conductive layer;

[0034] The printed circuit board has a receiving hole, which passes through the conductive substrate and the core board, and an inner wall of the receiving hole is provided with an insulating layer.

[0035] In some possible implementations, the conductive layer is provided with a first opening on the first surface of the conductive substrate, the first opening is provided corresponding to the receiving hole, and the first opening ring is provided outside the receiving hole;

[0036] On the second surface of the conductive substrate, the conductive layer is provided with a second opening, the second opening is correspondingly provided in the accommodating hole, the second opening is provided inside the accommodating hole, and at least a portion of the conductive layer covers the insulating layer.

[0037] In some possible implementations, the receiving hole is configured as a circular receiving hole;

[0038] The first opening is configured as a circular first opening, and a difference between a diameter of the circular first opening and a diameter of the circular receiving hole is greater than or equal to 50 microns and less than or equal to 150 microns;

[0039] And / or, the second opening is configured as a circular second opening, and the difference between the diameter of the circular receiving hole and the diameter of the circular second opening is greater than or equal to 50 microns and less than or equal to 150 microns.

[0040] In some possible implementations, the first surface of the conductive substrate is provided with a mounting groove, and the mounting groove accommodates the core board;

[0041] The surface of the core plate facing away from the bottom of the mounting groove is flush with the first surface of the conductive substrate; on the first surface of the conductive substrate, the conductive layer covers the core plate and the conductive substrate;

[0042] The core plate is provided with a marking portion, the marking portion is located on the surface of the core plate away from the bottom of the installation groove, and the marking portion is arranged in a ring on the inner side of the installation groove;

[0043] And / or, the printed circuit board has a communication hole, the communication hole passes through the conductive substrate and the core board, and the inner wall of the communication hole is provided with a conductive layer;

[0044] And / or, the core board is provided with a separation layer, and the separation layer is located in the first opening; a first portion of the separation layer covers the core board, and a second portion of the separation layer covers the insulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0046] Figure 1 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of a process for preparing a printed circuit board according to an embodiment of the present application;

[0048] Figure 3 A schematic structural diagram of a conductive substrate with a mounting groove provided in an embodiment of the present application;

[0049] Figure 4 A schematic diagram of a structure for fixing a core plate to a conductive substrate provided in an embodiment of the present application;

[0050] Figure 5 A schematic diagram of the structure for forming a receiving hole and a communicating hole provided in an embodiment of the present application;

[0051] Figure 6 A schematic diagram of the structure of forming an initial insulating layer provided in an embodiment of the present application;

[0052] Figure 7 A schematic diagram of the structure of forming an initial conductive layer provided in an embodiment of the present application;

[0053] Figure 8 A schematic diagram of the structure of forming an insulating layer provided in an embodiment of the present application;

[0054] Figure 9 A schematic diagram of the structure for forming a first opening and a second opening provided in an embodiment of the present application.

[0055] Description of reference numerals:

[0056] 100. Conductive substrate;

[0057] 110, mounting groove; 120, conductive layer; 120a, initial conductive layer; 121, first opening; 122, second opening;

[0058] 200, core board;

[0059] 210, separation layer; 220, marking portion;

[0060] 300, receiving hole;

[0061] 310, insulating layer; 310a, initial insulating layer;

[0062] 400, communicating hole;

[0063] 410. Conductive layer.

[0064] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0065] As described in the background, a printed circuit board includes a conductive substrate and a core board, wherein the core board is disposed on the conductive substrate and electrically connected to the conductive substrate via a conductive layer. The conductive substrate may also be provided with a receiving hole for accommodating components so that the components are electrically connected to the core board. An insulating layer is typically provided within the receiving hole, and the inner side of the insulating layer is connected to the components, thereby separating the components from the conductive substrate through the insulating layer, reducing the possibility of a short circuit between the components and the conductive substrate.

[0066] The manufacturing process for printed circuit boards typically involves forming a conductive layer on a conductive substrate, which covers the substrate and core board. A receiving hole is then formed on the conductive substrate, penetrating the conductive layer, substrate, and core board. An insulating layer is then formed on the inner wall of the receiving hole. However, during the hole formation process, the conductive layer is prone to flashes or burrs, which can cause short circuits between the conductive layer and the inner wall of the hole, resulting in a high defect rate for the printed circuit boards.

[0067] To solve the above technical problems, embodiments of the present application provide a printed circuit board and a method for manufacturing the same. In the printed circuit board manufacturing method, a receiving hole is first formed through the conductive substrate and the core board, and then an initial insulating layer and an initial conductive layer are formed, so that the initial conductive layer can cover the initial insulating layer. The initial insulating layer thus provides a certain degree of insulation for the initial conductive layer, thereby reducing the possibility of the initial conductive layer contacting the inner wall of the receiving hole.

[0068] Subsequently, part of the initial insulating layer and part of the initial conductive layer are removed to form an insulating layer and a conductive layer. The insulating layer is adhered to the inner wall of the receiving hole, so that components can be installed on the inner side of the insulating layer, reducing the possibility of contact between the conductive layer and the inner wall of the receiving hole, and reducing the defective rate of the printed circuit board.

[0069] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0070] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0071] Reference Figure 1 The printed circuit board provided in the embodiment of the present application includes a conductive substrate 100 and a core board 200. A conductive layer 120 may be provided on both the first and second surfaces of the conductive substrate 100. The first surface of the conductive substrate 100 is connected to the core board 200, and the conductive substrate 100 is electrically connected to the core board 200 via the conductive layer 120.

[0072] The printed circuit board can also have a receiving hole 300, which passes through the conductive substrate 100 and the core board 200. The inner wall of the receiving hole 300 is provided with an insulating layer 310. The inner side of the insulating layer 310 is connected to the components. The components can be used to electrically connect the core board 200, thereby separating the components and the conductive substrate 100 through the insulating layer 310.

[0073] In some possible embodiments, the first surface of the conductive substrate 100 may be provided with an installation groove 110, which can at least be used to accommodate the core board 200 to make the connection between the core board 200 and the conductive substrate 100 more stable and reduce the possibility of the core board 200 detaching from the conductive substrate 100.

[0074] For example, the surface of the core plate 200 facing away from the bottom of the mounting groove 110 can be flush with the first surface of the conductive substrate 100. On the first surface of the conductive substrate 100, the conductive layer 120 covers the core plate 200 and the conductive substrate 100, so that the conductive substrate 100 can be electrically connected to the core plate 200 through the conductive layer 120, making the formation process of the conductive layer 120 more convenient.

[0075] On the conductive substrate 100, the number of core plates 200 can be set to one or more. For example, the number of core plates 200 can be set to multiple, and multiple core plates 200 can be arranged at intervals. The core plate 200 can be set as a single-layer core plate 200. Alternatively, the core plate 200 can be set as a multi-layer core plate 200, which is not further limited in this embodiment of the present application.

[0076] The core board 200 may be provided with a marking portion 220. The marking portion 220 may be located on the surface of the core board 200 facing away from the bottom of the mounting groove 110. The marking portion 220 is disposed around the inner side of the mounting groove 110 so that the type of the core board 200 can be identified by the marking portion 220. The marking portion 220 may be configured as solder resist ink, etc., and the surface of the marking portion 220 facing away from the core board 200 may be flush with the conductive layer 120.

[0077] Reference Figure 1 In some possible implementations, the receiving hole 300 may be a circular receiving hole 300. The circular receiving hole 300 may be formed in the core plate 200 and the conductive substrate 100 by drilling or other methods, so that the circular receiving hole 300 passes through the core plate 200 and the conductive substrate 100 in sequence, making the formation process of the receiving hole 300 more convenient.

[0078] For example, the material of the insulating layer 310 can be set to an insulating material such as resin. The thickness of the insulating layer 310 can be determined based on the diameter of the circular receiving hole 300 and the size of the component. For example, the thickness of the insulating layer 310 can be greater than or equal to one-fifth of the diameter of the circular receiving hole 300 and less than or equal to one-third of the diameter of the circular receiving hole 300 to ensure the installation of components inside the insulating layer 310.

[0079] In some possible implementations, the conductive layer 120 may be provided with a first opening 121 on the first surface of the conductive substrate 100 . The first opening 121 may be provided corresponding to the receiving hole 300 , and the first opening 121 may be provided around the outside of the receiving hole 300 .

[0080] The receiving hole 300 is configured as a circular receiving hole 300, and the first opening 121 can be configured as a circular first opening 121. The diameter of the circular first opening 121 can be larger than the diameter of the circular receiving hole 300. For example, the difference between the diameter of the circular first opening 121 and the diameter of the circular receiving hole 300 is greater than or equal to 50 microns and less than or equal to 150 microns.

[0081] For example, the difference between the diameter of the circular first opening 121 and the diameter of the circular receiving hole 300 can be set within any difference range of 50 μm-70 μm, 70 μm-90 μm, 90 μm-110 μm, 110 μm-130 μm, and 130 μm-150 μm.

[0082] The core board 200 may be provided with a separator layer 210. The separator layer 210 may be located within the first opening 121. A first portion of the separator layer 210 covers the core board 200, while a second portion of the separator layer 210 covers the insulating layer 310. This separator layer 210 thereby blocks the conductive layer 120 from the inner wall of the circular receiving hole 300, reducing the likelihood of electrical conduction between the conductive layer 120 and the inner wall of the circular receiving hole 300. The separator layer 210 may be configured as solder resist ink, for example, and the surface of the separator layer 210 facing away from the core board 200 may be flush with the conductive layer 120.

[0083] For example, on the second surface of the conductive substrate 100 , the conductive layer 120 may be provided with a second opening 122 . The second opening 122 may be provided corresponding to the receiving hole 300 , and the second opening 122 is provided inside the receiving hole 300 , and at least a portion of the conductive layer 120 is covered by the insulating layer 310 .

[0084] The receiving hole 300 is configured as a circular receiving hole 300, and the second opening 122 can be configured as a circular second opening 122. The diameter of the circular second opening 122 can be smaller than the diameter of the circular receiving hole 300. For example, the difference between the diameter of the circular receiving hole 300 and the diameter of the circular second opening 122 can be greater than or equal to 50 microns and less than or equal to 150 microns.

[0085] For example, the difference between the diameter of the circular receiving hole 300 and the diameter of the circular second opening 122 can be set within any difference range of 50 μm-70 μm, 70 μm-90 μm, 90 μm-110 μm, 110 μm-130 μm, and 130 μm-150 μm.

[0086] It should be noted that the diameter of the circular first opening 121 can be larger than the diameter of the circular accommodating hole 300, and the distance between the conductive layer 120 located on the first surface of the conductive substrate 100 and the inner wall of the circular accommodating hole 300 is larger, thereby reducing the possibility of the conductive layer 120 located on the first surface of the conductive substrate 100 contacting the inner wall of the circular accommodating hole 300, and reducing the possibility of short circuits and other phenomena between the conductive layer 120 and the circular accommodating hole 300.

[0087] The diameter of the circular second opening 122 can be smaller than the diameter of the circular accommodating hole 300, and the conductive layer 120 located on the second surface of the conductive substrate 100 at least partially covers the insulating layer 310, so that the conductive layer 120 located on the second surface of the conductive substrate 100 can cover the conductive substrate 100 and the insulating layer 310, thereby enhancing the connection strength between the conductive substrate 100 and the insulating layer 310 through the conductive layer 120, thereby improving the stability of the printed circuit board.

[0088] Reference Figure 1 In some possible implementations, the printed circuit board may further include a connecting hole 400 . The connecting hole 400 passes through the conductive substrate 100 and the core board 200 . A conductive layer 410 is provided on the inner wall of the connecting hole 400 to achieve electrical connection between the core board 200 and the conductive substrate 100 through the connecting hole 400 and the conductive layer 410 .

[0089] Exemplarily, the conductive layer 410 can be set with the same material as the conductive layer 120. For example, an initial material layer can be formed on the conductive substrate 100 by deposition or electroplating, and part of the initial material can be removed by etching, so that the remaining initial material layer located on the first surface and the second surface of the conductive substrate 100 forms the conductive layer 120, and the remaining initial material layer located in the connecting hole 400 forms the conductive layer 410, so that the formation process of the conductive layer 120 and the conductive layer 410 is more convenient.

[0090] In summary, in the process of preparing the above-mentioned printed circuit board, by first forming the receiving hole 300 penetrating the conductive substrate 100 and the core board 200, and then forming the initial insulating layer 310a and the initial conductive layer 120a, the initial conductive layer 120a can cover the initial insulating layer 310a, thereby providing a certain degree of insulation for the initial conductive layer 120a through the initial insulating layer 310a, thereby reducing the possibility of the initial conductive layer 120a contacting the inner wall of the receiving hole 300;

[0091] Subsequently, part of the initial insulating layer 310a and part of the initial conductive layer 120a are removed to form an insulating layer 310 and a conductive layer 120. The insulating layer 310 is adhered to the inner wall of the receiving hole 300, so that components can be installed on the inner side of the insulating layer 310, reducing the possibility of contact between the conductive layer 120 and the inner wall of the receiving hole 300, thereby reducing the defective rate of the printed circuit board.

[0092] Reference Figure 2-Figure 9 The method for preparing a printed circuit board provided in an embodiment of the present application includes forming a core board 200, which is arranged on the first surface of a conductive substrate 100; forming a receiving hole 300, which passes through the conductive substrate 100 and the core board 200; forming an initial insulating layer 310a, which is located on the inner wall of the receiving hole 300; forming an initial conductive layer 120a, which covers the first and second surfaces of the conductive substrate 100, and on the first surface of the conductive substrate 100, the initial conductive layer 120a covers the initial insulating layer 310a; removing part of the initial insulating layer 310a and part of the initial conductive layer 120a to form an insulating layer 310 and a conductive layer 120. The preparation method specifically includes the following steps:

[0093] S101, forming a core board, wherein the core board is disposed on a first surface of a conductive substrate;

[0094] In some possible implementations, the components of the core plate 200 may be sequentially connected on the first surface of the conductive substrate 100 to form the core plate 200. Alternatively, a prefabricated core plate 200 may be mounted on the first surface of the conductive substrate 100 to facilitate the connection process between the core plate 200 and the conductive substrate 100.

[0095] Reference Figure 2 and Figure 3 Exemplarily, forming the core board 200 may include forming a mounting groove 110 , wherein the mounting groove 110 is located on the first surface of the conductive substrate 100 .

[0096] For example, at least a portion of the conductive substrate 100 may be removed by milling or the like to form the mounting groove 110 on the first surface of the conductive substrate 100. The shape of the mounting groove 110 may be determined according to the shape and position of the core plate 200.

[0097] Reference Figure 3 and Figure 4 After the mounting groove 110 is formed on the first surface of the conductive substrate 100, the core board 200 can be fixed in the mounting groove 110, and the surface of the core board 200 facing away from the bottom of the mounting groove 110 is flush with the first surface of the conductive substrate 100.

[0098] For example, the size of the mounting groove 110 can be smaller than or equal to the size of the core plate 200, that is, an interference fit can be set between the mounting groove 110 and the core plate 200. The core plate 200 can then be fixed in the mounting groove 110 by pressing or other means, so that the surface of the core plate 200 facing away from the bottom of the mounting groove 110 is flush with the first surface of the conductive substrate 100, thereby achieving a connection between the core plate 200 and the mounting groove 110.

[0099] Alternatively, adhesive or other structures may be applied to the bottom surface of the installation groove 110, and then the core board 200 may be placed on the bottom surface of the installation groove 110, so that the core board 200 can be relatively fixed to the bottom surface of the installation groove 110 through the adhesive.

[0100] S102, forming a receiving hole, the receiving hole penetrating the conductive substrate and the core board;

[0101] Reference Figure 4 and Figure 5 In some possible implementations, the receiving hole 300 may be a circular receiving hole 300. The circular receiving hole 300 may be formed in the conductive substrate 100 and the core plate 200 by drilling or the like, so that the circular receiving hole 300 can penetrate the conductive substrate 100 and the core plate 200.

[0102] It should be noted that after forming the core plate 200, the preparation method may further include forming a connecting hole 400, which passes through the conductive substrate 100 and the core plate 200. It is easy to understand that the forming process of the connecting hole 400 can be completed simultaneously with the forming process of the receiving hole 300.

[0103] After forming the connecting hole 400, the inner wall of the connecting hole 400 can also be polished to remove burrs on the inner wall of the connecting hole 400, thereby making the inner wall of the connecting hole 400 smoother, making the subsequent formation of the conductive layer 410 more uniform, and reducing the possibility of structures such as burrs or flashes affecting the normal use of the printed circuit board.

[0104] S103, forming an initial insulating layer, where the initial insulating layer is located on the inner wall of the receiving hole;

[0105] For example, refer to Figure 5 and Figure 6 The receiving hole 300 can be filled with an insulating material such as resin by plugging or other methods, and then cured to form the initial insulating layer 310a. The initial insulating layer 310a can abut against the inner wall of the receiving hole 300, thereby providing a foundation for the subsequent formation of the insulating layer 310.

[0106] S104, forming an initial conductive layer, where the initial conductive layer covers the first surface and the second surface of the conductive substrate, and on the first surface of the conductive substrate, the initial conductive layer covers the initial insulating layer;

[0107] In some possible implementations, reference Figure 6 and Figure 7 After the initial insulating layer 310 a is formed, an initial conductive layer 120 a may be formed on the conductive substrate 100 by deposition or electroplating. The initial conductive layer 120 a at least covers the first surface and the second surface of the conductive substrate 100 .

[0108] On the first surface of the conductive substrate 100, the preliminary conductive layer 120a may cover a first end of the preliminary insulating layer 310a. On the second surface of the conductive substrate 100, the preliminary conductive layer 120a may cover a second end of the preliminary insulating layer 310a.

[0109] For example, when forming the communication hole 400 , at least a portion of the initial conductive layer 120 a may also be formed on the inner wall of the communication hole 400 to form the conductive layer 410 , thereby making the formation process of the conductive layer 410 more convenient.

[0110] S105 , removing part of the initial insulating layer and part of the initial conductive layer to form an insulating layer and a conductive layer.

[0111] In some possible implementations, reference Figure 7 and Figure 8 Removing a portion of the initial insulating layer 310a and a portion of the initial conductive layer 120a may include: drilling to remove a portion of the initial insulating layer 310a and a portion of the initial conductive layer 120a to form the insulating layer 310. For example, a hole may be drilled along the thickness direction of the conductive substrate 100 to remove a portion of the initial insulating layer 310a and a portion of the initial conductive layer 120a, so that the remaining portion of the initial insulating layer 310a forms the insulating layer 310.

[0112] Reference Figure 8 and Figure 9 After drilling to remove a portion of the initial insulating layer 310a and a portion of the initial conductive layer 120a, a portion of the initial conductive layer 120a may be further etched to remove the remaining portion of the initial conductive layer 120a to form the conductive layer 120. The etching to remove a portion of the initial conductive layer 120a may include:

[0113] The initial conductive layer 120a located on the first surface of the conductive substrate 100 and at least covering the insulating layer 310 is etched to form a first opening 121; the first opening 121 is located on the first surface of the conductive substrate 100, and the first opening 121 is correspondingly arranged at the accommodating hole 300, and the first opening 121 is arranged around the outside of the accommodating hole 300.

[0114] Part of the initial conductive layer 120a covering the insulating layer 310 on the second surface of the conductive substrate 100 is etched to form a second opening 122. The second opening 122 is located on the second surface of the conductive substrate 100. The second opening 122 is arranged on the inner side of the accommodating hole 300, and at least part of the conductive layer 120 covers the insulating layer 310.

[0115] The first opening 121 may be a circular first opening 121. The diameter of the circular first opening 121 may be greater than the diameter of the circular receiving hole 300. For example, the difference between the diameters of the circular first opening 121 and the circular receiving hole 300 is greater than or equal to 50 microns and less than or equal to 150 microns.

[0116] For example, the difference between the diameter of the circular first opening 121 and the diameter of the circular receiving hole 300 can be set within any difference range of 50 μm-70 μm, 70 μm-90 μm, 90 μm-110 μm, 110 μm-130 μm, and 130 μm-150 μm.

[0117] The second opening 122 may be a circular second opening 122. The diameter of the circular second opening 122 may be smaller than the diameter of the circular receiving hole 300. For example, the difference between the diameters of the circular receiving hole 300 and the circular second opening 122 may be greater than or equal to 50 microns and less than or equal to 150 microns.

[0118] For example, the difference between the diameter of the circular receiving hole 300 and the diameter of the circular second opening 122 can be set within any difference range of 50 μm-70 μm, 70 μm-90 μm, 90 μm-110 μm, 110 μm-130 μm, and 130 μm-150 μm.

[0119] For example, refer to Figure 9 and Figure 1 After forming the insulating layer 310 and the conductive layer 120 , the method further includes forming a marking portion 220 , the marking portion 220 being located on a surface of the core board 200 away from the bottom of the mounting groove 110 , and the marking portion 220 being arranged on the inner side of the mounting groove 110 .

[0120] A separation layer 210 is formed and is located in the first opening 121 . A first portion of the separation layer 210 covers the core board 200 , and a second portion of the separation layer 210 covers the insulation layer 310 .

[0121] The marking portion 220 and the separation layer 210 can be set as solder resist ink or the like, and the surfaces of the marking portion 220 and the separation layer 210 facing away from the core board 200 can be flush with the conductive layer 120. The marking portion 220 and the separation layer 210 can be formed on the first surface of the conductive substrate 100 at one time, or the marking portion 220 and the separation layer 210 can be formed on the first surface of the conductive substrate 100 multiple times, and this embodiment of the present application does not impose any further restrictions on this.

[0122] In summary, in the method for preparing a printed circuit board, the receiving hole 300 is first formed through the conductive substrate 100 and the core board 200, and then the initial insulating layer 310a and the initial conductive layer 120a are formed. The initial conductive layer 120a can cover the initial insulating layer 310a, thereby providing a certain degree of insulation for the initial conductive layer 120a through the initial insulating layer 310a, thereby reducing the possibility of the initial conductive layer 120a contacting the inner wall of the receiving hole 300.

[0123] Subsequently, part of the initial insulating layer 310a and part of the initial conductive layer 120a are removed to form an insulating layer 310 and a conductive layer 120. The insulating layer 310 is adhered to the inner wall of the receiving hole 300, so that components can be installed on the inner side of the insulating layer 310, reducing the possibility of contact between the conductive layer 120 and the inner wall of the receiving hole 300, thereby reducing the defective rate of the printed circuit board.

[0124] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0125] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0126] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed," etc. should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integration; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances. Furthermore, the terms "first," "second," etc., etc., are used for descriptive purposes only and should not be construed to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a printed circuit board, characterized in that: include: forming a core plate, wherein the core plate is disposed on the first surface of the conductive substrate; forming a receiving hole, the receiving hole penetrating the conductive substrate and the core plate; forming an initial insulating layer, wherein the initial insulating layer is located on the inner wall of the receiving hole; forming an initial conductive layer, wherein the initial conductive layer covers the first surface and the second surface of the conductive substrate, and the initial conductive layer covers the initial insulating layer on the first surface of the conductive substrate; A portion of the initial insulating layer and a portion of the initial conductive layer are removed to form an insulating layer and a conductive layer.

2. The method for preparing a printed circuit board according to claim 1, wherein: Removing a portion of the initial insulating layer and a portion of the initial conductive layer, comprising: drilling to remove a portion of the initial insulating layer and a portion of the initial conductive layer to form the insulating layer; A portion of the initial conductive layer is removed by etching, and the remaining portion of the initial conductive layer forms the conductive layer.

3. The method for preparing a printed circuit board according to claim 2, wherein: Etching and removing a portion of the initial conductive layer, comprising: Etching the initial conductive layer on the first surface of the conductive substrate and at least covering the insulating layer to form a first opening; the first opening is located on the first surface of the conductive substrate, the first opening is corresponding to the receiving hole, and the first opening ring is located outside the receiving hole; The portion of the initial conductive layer covering the insulating layer on the second surface of the conductive substrate is etched to form a second opening, wherein the second opening is located on the second surface of the conductive substrate and is arranged on the inner side of the accommodating hole, and at least a portion of the conductive layer covers the insulating layer.

4. The method for preparing a printed circuit board according to claim 3, wherein: The receiving hole is configured as a circular receiving hole; The first opening is configured as a circular first opening, and a difference between a diameter of the circular first opening and a diameter of the circular receiving hole is greater than or equal to 50 microns and less than or equal to 150 microns; And / or, the second opening is configured as a circular second opening, and the difference between the diameter of the circular receiving hole and the diameter of the circular second opening is greater than or equal to 50 microns and less than or equal to 150 microns.

5. The method for preparing a printed circuit board according to claim 3, wherein: After forming the core board, it also includes: forming a communication hole, the communication hole penetrating the conductive substrate and the core plate; Grinding the inner wall of the communicating hole to remove burrs on the inner wall of the communicating hole; The initial conductive layer is formed, and at least a portion of the initial conductive layer is formed on the inner wall of the communication hole to form a conductive layer.

6. The method for preparing a printed circuit board according to any one of claims 1 to 5, characterized in that: Forming the core plate includes: forming a mounting groove, wherein the mounting groove is located on the first surface of the conductive substrate; Fixing the core plate in the mounting groove, wherein the surface of the core plate facing away from the bottom of the mounting groove is flush with the first surface of the conductive substrate; After forming the insulating layer and the conductive layer, it also includes: forming a marking portion, the marking portion being located on a surface of the core plate facing away from the bottom of the installation groove, and the marking portion being arranged in a ring on the inner side of the installation groove; A separation layer is formed, and the separation layer is located in the first opening; a first portion of the separation layer covers the core board, and a second portion of the separation layer covers the insulating layer.

7. A printed circuit board, characterized in that: including a conductive substrate and a core board; The first surface and the second surface of the conductive substrate are both provided with a conductive layer, the first surface of the conductive substrate is connected to the core board, and the conductive substrate is electrically connected to the core board through the conductive layer; The printed circuit board has a receiving hole, which passes through the conductive substrate and the core board, and an inner wall of the receiving hole is provided with an insulating layer.

8. The printed circuit board according to claim 7, wherein: The conductive layer is provided with a first opening on the first surface of the conductive substrate, the first opening is provided corresponding to the receiving hole, and the first opening ring is provided outside the receiving hole; On the second surface of the conductive substrate, the conductive layer is provided with a second opening, the second opening is provided corresponding to the accommodating hole, the second opening is provided inside the accommodating hole, and at least a portion of the conductive layer covers the insulating layer.

9. The printed circuit board according to claim 8, characterized in that The receiving hole is configured as a circular receiving hole; The first opening is configured as a circular first opening, and a difference between a diameter of the circular first opening and a diameter of the circular receiving hole is greater than or equal to 50 microns and less than or equal to 150 microns; And / or, the second opening is configured as a circular second opening, and the difference between the diameter of the circular receiving hole and the diameter of the circular second opening is greater than or equal to 50 microns and less than or equal to 150 microns.

10. The printed circuit board according to claim 9, characterized in that The first surface of the conductive substrate is provided with a mounting groove, and the mounting groove accommodates the core board; The surface of the core plate facing away from the bottom of the mounting groove is flush with the first surface of the conductive substrate; on the first surface of the conductive substrate, the conductive layer covers the core plate and the conductive substrate; The core plate is provided with a marking portion, the marking portion is located on the surface of the core plate away from the bottom of the installation groove, and the marking portion is arranged in a ring on the inner side of the installation groove; And / or, the printed circuit board has a communication hole, the communication hole passes through the conductive substrate and the core board, and the inner wall of the communication hole is provided with a conductive layer; And / or, the core board is provided with a separation layer, and the separation layer is located in the first opening; a first portion of the separation layer covers the core board, and a second portion of the separation layer covers the insulation layer.

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