Tumbling method and tumbling apparatus

Abstract

The application discloses a rolling grinding method and a rolling grinding device. The rolling grinding method comprises the following steps: acquiring the position of a crystal direction axis of a crystal bar, and determining a first included angle between the crystal direction axis and a growth axis of the crystal bar based on the pre-stored position of the growth axis of the crystal bar; acquiring a three-dimensional model of the crystal bar; driving a grinding piece to move based on the three-dimensional model and the first included angle, so that the grinding piece can roll grind the crystal bar along a preset path, and the minimum distance between each point on the preset path and the crystal direction axis is consistent. The rolling grinding device can execute the rolling grinding method. Through the above arrangement, the yield of the crystal bar slices can be improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a rolling grinding method and a rolling grinding device. Background Art

[0002] Wafers are the core basic material for semiconductor manufacturing and are generally obtained by cutting crystal rods. Crystal growth is a common method for obtaining crystal rods. During the crystal rod growth process, the crystal rods are usually cylindrical with irregular diameters, so they need to be rolled using a roller grinder to make the diameter of the crystal rod uniform to a standard diameter. However, during the crystal rod growth process, the actual growth direction of the crystal rod cannot grow completely according to the preset direction, resulting in a certain angle deviation between the extension direction of the crystal axis and the preset direction.

[0003] Traditional barrel grinding machines use axis positioning. If the barrel grinding machine uses the clamped axis as a reference for barrel grinding, the axis of the finished ingot (which extends along the preset direction) will deviate from the crystal orientation axis. In this case, if the ingot is sliced ​​perpendicular to the preset direction of ingot growth, the yield of the sliced ​​wafers will be low. Summary of the Invention

[0004] In order to address the deficiencies of the prior art, the present application aims to provide a rolling method and a rolling equipment, which can improve the yield of crystal rod slices.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A tumbling method for tumbling a crystal rod, comprising:

[0007] The position of the crystal axis of the crystal ingot is obtained, and based on the pre-stored position of the growth axis of the crystal ingot, a first angle between the crystal axis and the growth axis is determined; a three-dimensional model of the crystal ingot is obtained; and based on the three-dimensional model and the first angle, the grinding member is driven to move so that the grinding member can roll the crystal ingot along a preset path, and the minimum distance between each point on the preset path and the crystal axis is consistent.

[0008] Furthermore, the point where the grinding member contacts the unprocessed crystal ingot is defined as the grinding point; the minimum distance between the grinding point and the end face of the crystal ingot closer to the grinding point is defined as the processed length; and the distance between the axis connecting the growth axis and the crystal direction axis at the processed length is defined as the offset distance; and based on the three-dimensional model and the first angle, the grinding member is driven to move, including:

[0009] Based on the three-dimensional model, the total length and the first radius of the crystal rod are determined, and the second radius obtained by fitting the crystal rod and the crystal direction axis is determined; based on the total length of the crystal rod, the first angle and the processed length, the offset distance is determined; the second angle between the first radius passing through the grinding point and the axis line is obtained; based on the first radius, the second radius, the offset distance and the second angle, the movement distance of the grinding part is determined; and the grinding part is driven to move based on the movement distance.

[0010] Furthermore, the crystal orientation axis and the growth axis intersect at a midpoint of the crystal rod along its length; and determining the offset distance includes:

[0011] The offset distance is determined based on half of the total length of the ingot, the processed length, the first included angle, and a trigonometric formula.

[0012] Furthermore, a point on the preset path corresponding to the grinding point is defined as a preset point, and a second radius that intersects the first radius passing through the grinding point at the preset point is defined as a preset radius; and determining the moving distance of the grinding member includes:

[0013] Based on the second radius, the second angle, the offset distance and the trigonometric function formula, the third angle between the axis line and the preset radius is determined; based on the second radius, the second angle, the third angle and the trigonometric function formula, the distance between the preset point and the growth axis is determined; based on the first radius and the difference between the distance between the preset point and the growth axis, the moving distance is determined.

[0014] Further, the grinding element moves a distance in a direction perpendicular to the growth axis.

[0015] Furthermore, the grinding member has a degree of rotational freedom, and the rotation axis of the grinding member is perpendicular to the axis of the growth axis; the grinding member is a disc structure, and when the grinding member is in an initial position, a plane perpendicular to the axis of the grinding member is defined as a reference plane, an angle formed by the intersection of the shortest line between the grinding point and the rotation axis and the reference plane is defined as an initial angle, and a minimum distance between the grinding point and the reference plane is defined as an initial distance; driving the grinding member to move based on the moving distance includes:

[0016] The length, initial angle and initial distance of the shortest line are obtained; based on the sum of the initial distance and the moving distance, the length of the shortest line and the trigonometric function formula, the working angle between the shortest line and the reference plane is determined; based on the difference between the working angle and the initial angle, the rotation angle of the grinding part is determined; based on the rotation angle, the grinding part is driven to rotate.

[0017] Furthermore, obtaining the length of the shortest line and the initial angle includes: obtaining the radius of the grinding part; determining the length of the shortest line based on the radius of the grinding part, the initial distance and the Pythagorean theorem; and determining the initial angle based on the radius of the grinding part, the initial distance and a trigonometric function formula.

[0018] To achieve the above objectives, this application adopts the following technical solutions:

[0019] A rolling and grinding device is used for rolling and grinding a crystal rod. The rolling and grinding device includes a grinding mechanism, a crystal orientation detection module, a contour scanning module and a control module. The grinding mechanism is used for rolling and grinding the crystal rod. The grinding mechanism includes a grinding piece with a movable degree of freedom or a rotational degree of freedom. The crystal orientation detection module can obtain the position of the crystal orientation axis of the crystal rod. The contour scanning module can obtain a three-dimensional model of the crystal rod. The control module is electrically connected to the crystal orientation detection module, and the control module is also electrically connected to the contour scanning module. The control module can determine a first angle between the crystal orientation axis and the growth axis based on the position of the crystal orientation axis obtained by the crystal orientation detection module and the position of the pre-stored growth axis of the crystal rod. The control module can also drive the grinding piece to move based on the three-dimensional model and the first angle, so that the grinding piece can roll and grind the crystal rod along a preset path, and the minimum distance between each point on the preset path and the crystal orientation axis is consistent.

[0020] Furthermore, the grinding mechanism also includes a linear drive member, which is connected to the grinding member and electrically connected to the control module, and the linear drive member drives the grinding member to move in a direction perpendicular to the growth axis.

[0021] Furthermore, the grinding mechanism includes a rotating drive member connected to the grinding member, the rotating drive member is electrically connected to the control module, and the rotating drive member drives the grinding member to rotate.

[0022] The above-mentioned rolling method sets a preset path for rolling the crystal rod based on the first angle and the three-dimensional model of the crystal rod. The minimum distance between each point on the preset path and the crystal axis is consistent, so that the grinding piece can roll the crystal rod along the preset route, so that the crystal rod after rolling can be sliced ​​in a direction perpendicular to the crystal axis, which is conducive to improving the yield of crystal rod slicing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural block diagram of the rolling grinding equipment according to an embodiment of the present application.

[0024] Figure 2 This is a flow chart of the barrel grinding method according to an embodiment of the present application.

[0025] Figure 3 This is a first cross-sectional view of the crystal rod according to an embodiment of the present application.

[0026] Figure 4 This is an angle-marked diagram of a second cross section of a crystal rod according to an embodiment of the present application.

[0027] Figure 5 This is a dimension-marked diagram of the second cross section of the crystal rod according to an embodiment of the present application.

[0028] Figure 6This is a specific flow chart of step S3 of an embodiment of the present application.

[0029] Figure 7 This is a specific flow chart of step S32 of an embodiment of the present application.

[0030] Figure 8 This is a specific flow chart of step S34 of an embodiment of the present application.

[0031] Figure 9 This is a schematic diagram of the rolling grinding equipment according to an embodiment of the present application for rolling a crystal rod.

[0032] Figure 10 This is a specific flow chart of step S35 of an embodiment of the present application.

[0033] Figure 11 This is a specific flow chart of step S351 of an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation of the present application will be clearly and completely described below in conjunction with the drawings in the implementation of the present application.

[0035] It should be noted that the words “first”, “second” and similar terms used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as “a” or “an” do not indicate a quantity limitation, but rather indicate the presence of at least one. “Multiple” means at least two. Unless otherwise indicated, words such as “include” or “comprise” mean that the elements or objects appearing before “include” or “comprises” include the elements or objects listed after “include” or “comprises” and their equivalents, and do not exclude other elements or objects. Words such as “connected” or “connected” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0036] As used in this specification and the appended claims, the singular forms "a," "an," "said," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0037] The method provided in this embodiment can be performed in a tumbling apparatus 200 or a similar device. Figure 1 2 is a structural block diagram of a rolling grinding device 200 for performing a rolling grinding method according to this embodiment.

[0038] like Figure 1As shown, the rolling and grinding equipment 200 is used to roll and grind the crystal rod 100, which includes a base assembly 21, a transmission assembly 22, a waterproof assembly 23, a head and tail stock assembly 24, a grinding mechanism 25, a crystal direction detection module 26, a contour scanning module 27 and a control module 28.

[0039] The chassis assembly 21 is the main structure of the roller grinding equipment 200 and is used to support the transmission assembly 22, the waterproof assembly 23, the head and tail stock assembly 24, the grinding mechanism 25, the crystal direction detection module 26, the contour scanning module 27 and the control module 28.

[0040] The transport assembly 22 is disposed on at least one side of the base assembly 21 and is used to load or unload the crystal ingot 100. The transport assembly 22 can be a robot or a conveyor belt. For example, the robot can grab a grown crystal ingot 100 and transport it to the tumbling apparatus 200. It can also grab a ground crystal ingot 100 and remove it from the tumbling apparatus 200.

[0041] The waterproof component 23 is installed on the base frame component 21 and is arranged around the above components. It is used to provide a waterproof effect for the rolling grinding device 200 to prevent liquid from splashing to the outside of the rolling grinding device 200 during the processing.

[0042] The head and tail stock assembly 24 is used to clamp the two ends of the crystal ingot 100 and control the rotation of the crystal ingot 100 when the grinding mechanism 25 grinds the crystal ingot 100. Specifically, the head and tail stock assembly 24 includes a head stock component and a tail stock component, which respectively clamp the two ends of the crystal ingot 100 so that the growth axis 11 of the clamped crystal ingot 100 coincides with the rotation axis of the head and tail stock assembly 24. The crystal ingot 100 fixed to the head and tail stock assembly 24 rotates along the axis of the head and tail stock assembly 24. Therefore, the axis of rotation of the crystal ingot 100 is the rotation axis of the head and tail stock assembly 24, and therefore, the axis of rotation of the crystal ingot 100 is the growth axis 11 of the crystal ingot 100.

[0043] The grinding mechanism 25 is used for barrel grinding of the crystal ingot 100 .

[0044] The grinding mechanism 25 includes a grinding element 251 with a degree of freedom of movement or rotation. This arrangement allows the grinding mechanism 25 to be moved or its grinding angle adjusted, thereby enabling the grinding mechanism 25 to grind different positions of the crystal ingot 100 in multiple directions. It also allows the grinding mechanism 25 to grind the crystal ingot 100 along a preset path, thereby enabling the tumbled crystal ingot 100 to be sliced ​​perpendicular to the crystal axis 12.

[0045] In the present application, the grinding mechanism 25 may be a roller grinder, which includes a grinding wheel and a control device. The control device can control the grinding wheel to perform roller grinding on the surface of the crystal ingot 100, thereby improving the precision of the crystal ingot 100 after grinding, thereby facilitating subsequent slicing of the crystal ingot 100.

[0046] The crystal direction detection module 26 is used to obtain the position of the crystal direction axis 12 of the crystal ingot 100 , thereby improving the accuracy of the preset path of the grinding mechanism 25 grinding the crystal ingot 100 , and further improving the accuracy of the grinding mechanism 25 grinding the crystal ingot 100 .

[0047] Exemplarily, the crystal orientation detection module 26 may be an X-ray Diffraction Topography (XRT), a non-destructive imaging device used to detect crystal defects and stress distribution within single crystal materials. The crystal orientation detection module 26 can image the crystal ingot 100, thereby determining the position of the crystal orientation axis 12 of the crystal ingot 100. The present application does not limit the specific components of the crystal orientation detection module 26; it only needs to be able to determine the position of the crystal orientation axis 12 of the crystal ingot 100.

[0048] For example, in the present application, the crystal orientation detection module 26 uses GBT1555-2023 "Method for Determining Crystal Orientation of Semiconductor Single Crystals" to locate the crystal orientation axis 12 of the crystal rod 100 during the detection of the crystal rod 100, thereby improving the accuracy of obtaining the position of the above-mentioned crystal orientation axis 12, which is conducive to the subsequent rolling processing of the crystal rod 100.

[0049] It should be noted that the present application does not limit the method for obtaining the position of the crystal direction axis 12 , and it is only necessary that the position of the crystal direction axis 12 of the crystal ingot 100 can be accurately obtained.

[0050] The contour scanning module 27 is used to acquire a three-dimensional model of the crystal ingot 100. Exemplarily, the contour scanning module 27 includes a binocular camera and a drive device. The binocular camera has degrees of freedom, including left-right, up-down, and opening and closing. Specifically, the drive device can control the binocular camera to move left-right and up-down, and can also control the binocular camera to separate and close, thereby enabling the binocular camera to scan the crystal ingot 100 and acquire a three-dimensional model of the crystal ingot 100.

[0051] When the contour scanning module 27 acquires a three-dimensional model of the crystal ingot 100, the drive device drives the binocular camera to capture images of different positions on the crystal ingot 100, thereby capturing multiple frames of left and right images of the crystal ingot 100. After aligning the left and right images of each frame using epipolar correction, the view difference between the left and right images is calculated through deep learning to obtain the parallax value of each pixel in each frame. This parallax value is then converted into depth information based on the intrinsic parameters of the binocular camera and the baseline distance. The coordinates of each pixel in each left and right image are then combined with the depth information to obtain a single-frame point cloud contained in each left and right image. The single-frame point clouds within each image frame are then spliced ​​together to obtain a global point cloud. Finally, the global point cloud is fused to generate a three-dimensional model of the crystal ingot 100. This arrangement improves the accuracy of acquiring the shape and size of the crystal ingot 100, thereby improving the accuracy of setting the preset path for grinding the crystal ingot 100 by the grinding mechanism 25, thereby improving the accuracy of the barrel grinding process performed by the grinding mechanism 25 on the crystal ingot 100.

[0052] The control module 28 is connected to the grinding mechanism 25 , the crystal orientation detection module 26 , and the contour scanning module 27 , and is used to control the operations of the grinding mechanism 25 , the crystal orientation detection module 26 , and the contour scanning module 27 .

[0053] As an embodiment, the control module 28 is electrically connected to the crystal orientation detection module 26, and the control module 28 is also electrically connected to the profile scanning module 27. The control module 28 can determine a first angle between the crystal orientation axis 12 and the growth axis 11 based on the position of the crystal orientation axis 12 obtained by the crystal orientation detection module 26 and the pre-stored position of the growth axis 11 of the crystal ingot 100.

[0054] In the above configuration, a growth direction is set for the crystal ingot 100 during its growth process, that is, the crystal ingot 100 is set to grow along the position of the growth axis 11 of the crystal ingot 100. Because the growth process of the crystal ingot 100 is affected by equipment precision and external factors, there is a deviation between the actual crystal axis 12 of the crystal ingot 100 and the direction of the growth axis 11, resulting in an angle between the crystal axis 12 and the growth axis 11. This angle is the first angle between the crystal axis 12 and the growth axis 11. In the present application, obtaining the first angle facilitates the subsequent planning of the preset path for the grinding mechanism 25 during the rolling process of the crystal ingot 100.

[0055] Specifically, the control module 28 can also drive the grinding member 251 to move based on the three-dimensional model and the first angle, so that the grinding member 251 can roll the crystal ingot 100 along a preset path, and each point on the preset path is consistent with the minimum distance from the crystal axis 12. Through the above settings, the ground crystal ingot 100 is sliced ​​along a direction perpendicular to the crystal axis 12, and the cross-section of the generated wafer is circular, and the height difference between the center and the edge of the wafer is consistent, that is, the warpage of the wafer can meet the manufacturing requirements of the wafer, so that the produced wafers meet the manufacturing requirements, thereby facilitating an improvement in the yield rate of the crystal ingot 100 slices.

[0056] Exemplarily, as an implementation, the grinding mechanism 25 further includes a linear drive connected to the grinding member 251, which is electrically connected to the control module 28. The linear drive drives the grinding member 251 to move in a direction perpendicular to the growth axis 11. With this arrangement, when the grinding member 251 tumbles the crystal ingot 100, it is only necessary to control the linear drive to adjust the linear distance between the grinding member 251 and the growth axis 11 of the crystal ingot 100. This allows the grinding member 251 to advance in a direction perpendicular to the growth axis 11 and tumble the crystal ingot 100.

[0057] As another implementation, the grinding mechanism 25 includes a rotary drive member connected to the grinding member 251, which is electrically connected to the control module 28. The rotary drive member drives the grinding member 251 to rotate. With this arrangement, the control module 28 can control the rotary drive member, thereby controlling the grinding member 251 to rotate, thereby changing the distance between the grinding member 251 and the crystal ingot 100, and causing the grinding member 251 to perform a barrel grinding process on the surface of the crystal ingot 100.

[0058] In this application, the specific working process of the roller grinding device 200 is as follows:

[0059] The transmission component 22 transports the crystal ingot 100 to be barreled to between the headstock component and the tailstock component of the head-tail stock component 24, and then clamps the two ends of the crystal ingot 100 to be barreled by the headstock component and the tailstock component. After fixing the crystal ingot 100 to be barreled, the grinding mechanism 25 performs rough processing on the above-mentioned crystal ingot 100 to remove defects on the surface of the crystal ingot 100. The crystal direction axis 12 of the crystal ingot 100 to be barreled is then obtained by the crystal direction detection module 26, and the three-dimensional model of the crystal ingot 100 to be barreled is obtained by the contour scanning module 27. Based on the acquisition results of the crystal direction detection module 26 and the contour scanning module 27 and the pre-stored position of the growth axis 11 of the crystal ingot 100 to be barreled, the control module 28 can obtain the first angle between the crystal direction axis 12 and the growth axis 11. Then, the control module 28 can calculate a preset path for the grinding member 251 to roll the crystal ingot 100 according to the three-dimensional model and the first angle, and control the grinding member 251 to perform a second rough processing on the crystal ingot 100 to be rolled along the preset path to remove excess crystals on the surface of the crystal ingot 100.

[0060] After the second roughing operation is completed, the grinding element 251 is again controlled to perform fine processing on the crystal ingot 100, so that the diameter of the crystal ingot 100 is processed to the set value. After the grinding element 251 completes the barreling of the crystal ingot 100, the control module 28 stops the operation of the grinding mechanism 25 and activates the crystal orientation detection module 26 to perform a second inspection on the processed crystal ingot 100 to determine whether the shortest distance between different positions on the surface of the processed crystal ingot 100 and the crystal orientation axis 12 is substantially consistent. If the shortest distance between different positions on the surface of the processed crystal ingot 100 and the crystal orientation axis 12 is substantially consistent, a V-groove is provided on the processed crystal ingot 100 and the crystal ingot 100 is removed from the barreling device 200 via the transmission assembly 22. The barreling device 200 then repeats the above steps for subsequent crystal ingots 100 to be barreled, thereby processing multiple crystal ingots 100 to be barreled, and ensuring that the wafers obtained by slicing the crystal ingot 100 perpendicular to the crystal orientation axis 12 can meet the requirements of wafer manufacturing.

[0061] Figure 1 The structure of the roller grinding device 200 shown is only for illustration and does not limit the structure of the above roller grinding device 200. For example, the roller grinding device 200 may also include Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0062] This embodiment provides a tumbling method, Figure 2 1 is a flow chart of a barrel grinding method according to an embodiment of the present application, wherein the barrel grinding method is used to perform barrel grinding on a crystal rod 100 .

[0063] like Figure 2 and Figure 3As shown, the tumbling method of the present application includes the following steps:

[0064] S1 obtains the position of the crystal direction axis 12 of the crystal ingot 100, and determines a first angle between the crystal direction axis 12 and the growth axis 11 based on the pre-stored position of the growth axis 11 of the crystal ingot 100 In this application, the growth axis 11 of the pre-stored crystal rod 100 is the rotation axis of the crystal rod 100 driven by the head and tail seat assembly 24 when the crystal rod 100 is clamped by the head and tail seat assembly 24. This is beneficial for subsequently setting a preset path to perform rolling processing on the crystal ingot 100 .

[0065] S2: Obtain a three-dimensional model of the crystal ingot 100. This setup allows you to determine the size and shape of the crystal ingot 100 to be tumbled, facilitating subsequent tumbling of the crystal ingot 100. In this application, multiple binocular cameras can be configured to capture images of the crystal ingot 100, thereby improving the efficiency of obtaining a three-dimensional model of the crystal ingot 100. The specific steps for obtaining a three-dimensional model of the crystal ingot 100 have been described above and will not be repeated here.

[0066] S3 is based on the three-dimensional model and the first angle , driving the grinding member 251 to move so that the grinding member 251 can roll grind the crystal rod 100 along a preset path, and the minimum distance between each point on the preset path and the crystal direction axis 12 is consistent.

[0067] like Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, the point where the grinding piece 251 contacts the unprocessed crystal rod 100 is defined as the grinding point 101, and the minimum distance between the grinding point 101 and the end face of the crystal rod 100 closer to the grinding point 101 is defined as the processed length. , will be processed in length The distance between the axis line 110 of the growth axis 11 and the crystal direction axis 12 is defined as the offset distance In this application, the plane perpendicular to the crystal axis 12 and passing through the grinding point 101 is set as the preset plane 102. The growth axis 11 and the crystal axis 12 are intercepted by the preset plane 102. The growth axis 11 intersects with the preset plane 102 at point a, and the crystal axis 12 intersects with the preset plane 102 at point b. The offset distance That is, the horizontal distance between a and b on the preset plane 102.

[0068] In step S3, based on the three-dimensional model and the first angle , driving the grinding member 251 to move, specifically including:

[0069] S31: Determine the total length of the crystal ingot 100 based on the three-dimensional model. and the first radius , and determine the second radius obtained by fitting the crystal rod 100 with the crystal direction axis 12 . First radius The second radius is the radius of the crystal rod 100 before rolling, that is, the distance between the growth axis 11 and the surface of the crystal rod 100 before rolling. The total length is the radius of the crystal rod 100 after rolling, that is, the distance between the crystal axis 12 and the surface of the crystal rod 100 after rolling. , first radius and the second radius , to facilitate the subsequent calculation of the offset distance .

[0070] S32 is based on the total length of the crystal ingot 100 , the first angle And processed length , determine the offset distance In the above settings, by determining the offset distance , which can be helpful for determining the feeding distance required for the grinding piece 251 to perform the rolling grinding on the crystal rod 100. .

[0071] For example, since the crystal ingot 100 actually has countless crystal axes 12, in this application, the midpoint of the length direction of the unprocessed crystal ingot 100 is used as the midpoint position of the crystal axis 12 and the growth axis 11 along the extension direction of the crystal ingot 100, so as to calculate the offset distance .

[0072] like Figure 3 、 Figure 4 、 Figure 6 and Figure 7 As shown, step S32 determines the offset distance The steps include:

[0073] S321 is based on the total length of the crystal ingot 100 Half of the processed length , the first angle and trigonometric formulas to determine the offset distance Calculate the offset distance The formula is as follows:

[0074] (Formula 1)

[0075] That is, the offset distance can be calculated by formula 1 .

[0076] It should be noted that this application calculates the offset distance There is no restriction on the method, as long as the offset distance can be obtained The specific value of .

[0077] like Figure 6 As shown, step S3 also includes:

[0078] S33 Obtaining the first radius passing through the grinding point 101 The second angle between the axis line 110 In the above settings, by obtaining the second angle This can be helpful for determining the moving distance of the grinding element 251 in the future. .

[0079] S34 based on the first radius , second radius , offset distance and the second angle , determine the moving distance of the grinding member 251 In the above setting, the moving distance of the grinding member 251 is calculated. The control module 28 can facilitate driving the grinding member 251 to move via the linear drive member, thereby achieving rolling grinding of the crystal ingot 100 .

[0080] For example, the point on the preset path corresponding to the grinding point 101 is defined as the preset point 103, and the second radius that intersects the first radius passing through the grinding point 101 at the preset point 103 is defined. is the preset radius.

[0081] like Figure 5 、 Figure 6 and Figure 8 As shown, step S34 determines the moving distance of the grinding member 251, including:

[0082] S341 based on the second radius , the second angle , offset distance and trigonometric formula to determine the third angle between the axis line 110 and the preset radius In the above setting, the third angle That is, the angle between the axis line 101 and the preset radius. Since the preset radius, the axis line 101 and the line segment between the preset point 103 and the growth axis 11 can form a triangle. The interior angle of the above triangle includes the second angle , the third angle and the fourth angle The fourth angle The calculation formula is as follows:

[0083] (Formula 2)

[0084] That is, the fourth angle can be calculated by formula 2 Calculate the fourth angle After calculating the angle, the third angle can be calculated based on the sum of the interior angles of the triangle The third angle The calculation formula is as follows:

[0085] (Formula 3)

[0086] That is, the third angle can be calculated by formula 3 angle.

[0087] S342 based on the second radius , the second angle , the third angle Using trigonometric formulas, determine the distance between the preset point 103 and the growth axis 11 .

[0088] Based on Formula 3, the second radius and the second angle The distance between the preset point 103 and the growth axis 11 can be calculated , calculate the distance between the preset point 103 and the growth axis 11 The formula is as follows:

[0089] (Formula 4)

[0090] Among them, Formula 4 can calculate the distance between the preset point 103 and the growth axis 11 through trigonometric functions: .

[0091] S343 based on the first radius The difference between the preset point 103 and the growth axis 11 determines the moving distance .

[0092] In the above setting, the moving distance of the grinding member 251 is calculated The specific formula is as follows:

[0093] (Formula 5)

[0094] That is, the moving distance of the grinding member 251 can be calculated by formula 5: .

[0095] In this application, by combining Formula 1 to Formula 5, the moving distance of the grinding member 251 in this application can be known as The calculation formula is as follows:

[0096] (Formula 6)

[0097] That is, the moving distance of the grinding member 251 can be calculated by formula 6: .

[0098] It should be noted that this application calculates the moving distance of the grinding member 251. There is no restriction on the method, as long as the specific value of the moving distance can be obtained.

[0099] like Figure 6 As shown, step S3 also includes:

[0100] S35 drives the grinding member 251 based on the moving distance. Through the above setting, the feeding distance of the grinding member 251 during the rolling of the crystal ingot 100 can be accurately controlled, thereby improving the quality of the crystal ingot 100 after rolling, and facilitating the improvement of the yield rate of subsequent crystal ingot 100 slices.

[0101] As an implementation method, in step S35, the grinding member 251 moves a distance perpendicular to the growth axis 11. With this arrangement, the grinding member 251 can be fed according to the calculated distance when tumbling the crystal ingot 100, so that the radius of the crystal ingot 100 after tumbling is the second radius, thereby facilitating the elimination of crystal orientation deviation within the crystal ingot 100 and facilitating subsequent slicing of the crystal ingot 100.

[0102] like Figure 9 As shown, as another implementation, in step S35, the grinding member 251 has a degree of rotational freedom, and the rotation axis 104 of the grinding member 251 is perpendicular to the axis of the growth axis 11, and the rotation axis 104 is also perpendicular to at least one radius of the untumbled crystal ingot 100. The grinding member 251 is a disc structure. When the grinding member 251 is in the initial position, a plane perpendicular to the axis of the grinding member 251 is defined as the reference plane 105, and the angle between the shortest line connecting the grinding point 101 and the rotation axis 104 and the reference plane 105 is defined as the initial angle. The minimum distance between the grinding point 101 and the reference surface 105 is defined as the initial distance .

[0103] like Figure 10 As shown, in step S35, the grinding member 251 is driven to move based on the moving distance, specifically including:

[0104] S351 Get the length of the shortest connection , initial angle and initial distance The above setting facilitates the subsequent calculation of the working angle between the shortest connecting line and the reference plane 105 .

[0105] like Figure 11As shown, step S351 obtains the length of the shortest line , initial angle The steps include:

[0106] S351a obtains the radius of the grinding member 251. In the above setting, the radius of the grinding member 251 As a known parameter, the specific value can be determined by obtaining relevant parameters of the grinding mechanism 25.

[0107] S351b is based on the radius of the grinding element 251 , initial distance and the Pythagorean theorem to determine the length of the shortest line . Calculate the length of the shortest line The formula is as follows:

[0108] (Formula 7)

[0109] That is, the length of the shortest connection can be calculated by formula 7 .

[0110] S351c determines the initial angle based on the radius of the grinding member 251, the initial distance and the trigonometric formula. In the above setting, the grinding member 251 is in a horizontal position, and the initial angle is The angle between the shortest connecting line and the radius of the grinding member 251 is calculated as the initial angle The specific formula is as follows:

[0111] (Formula 8)

[0112] That is, the initial angle can be calculated using Formula 8.

[0113] S352 determines the working angle between the shortest line and the reference plane 105 based on the sum of the initial distance and the moving distance, the length of the shortest line, and the trigonometric function formula. In the above setting, the working angle That is, the angle between the shortest connecting line and the horizontal line where the radius of the grinding member 251 is located when it is in the initial position. The specific formula for calculating the working angle is as follows:

[0114] (Formula 9)

[0115] That is, the working angle can be calculated by formula 9 .

[0116] S353 determines the rotation angle of the grinding member 251 based on the difference between the working angle and the initial angle. In the above setting, the formula for calculating the rotation angle is as follows:

[0117] (Formula 10)

[0118] That is, the above rotation angle can be calculated by formula 10 .

[0119] In this application, by combining formulas 7 to 10, the rotation angle of the grinding member 251 in this application can be known. The calculation formula is as follows:

[0120] (Formula 11)

[0121] That is, the above rotation angle can be calculated by formula 11 .

[0122] S354 drives the grinding member 251 to rotate based on the rotation angle. The grinding member 251 is controlled to rotate counterclockwise or clockwise when rolling the crystal ingot 100 , thereby increasing the rolling area of ​​the grinding member 251 at the same position of the crystal ingot 100 , thereby improving the efficiency of the grinding member 251 in rolling the crystal ingot 100 .

[0123] In summary, the barrel grinding method of the present application determines a first angle between the crystal axis 12 and the growth axis 11 of the crystal ingot 100. Based on the first angle and a three-dimensional model of the crystal ingot 100, a preset path for barrel grinding of the crystal ingot 100 is determined, wherein each point on the preset path has a consistent minimum distance from the crystal axis 12. The grinding element 251 is then controlled to barrel grind the crystal ingot 100 along the preset path, thereby eliminating the first angle of the barreled crystal ingot 100. This allows the barreled crystal ingot 100 to be sliced ​​perpendicular to the crystal axis 12, thereby improving the yield of the sliced ​​crystal ingot 100.

[0124] It should be noted that the rolling method and rolling equipment 200 provided in this application are both used to process crystal rods 100 with a length of less than 500 mm, so as to improve the efficiency and quality of rolling processing of the crystal rods 100, thereby improving the yield of slicing the crystal rods 100.

[0125] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims appended to this application.

Claims

1. A barrel grinding method for barrel grinding a crystal rod, characterized in that: The tumbling method comprises: Acquiring a position of a crystal direction axis of the crystal ingot, and determining a first angle between the crystal direction axis and the growth axis based on a pre-stored position of the growth axis of the crystal ingot; Obtaining a three-dimensional model of the crystal rod; Based on the three-dimensional model and the first angle, the grinding member is driven to move so that the grinding member can roll the crystal rod along a preset path, and the minimum distance between each point on the preset path and the crystal direction axis is consistent.

2. The barrel grinding method according to claim 1, wherein: The point where the grinding member contacts the unprocessed crystal ingot is defined as the grinding point; the minimum distance between the grinding point and the end face of the crystal ingot closer to the grinding point is defined as the processed length; and the distance between the axis connecting the growth axis and the crystal direction axis at the processed length is defined as the offset distance; The step of driving the grinding element to move based on the three-dimensional model and the first angle includes: Determining a total length and a first radius of the crystal ingot based on the three-dimensional model, and determining a second radius obtained by fitting the crystal ingot to the crystal direction axis; determining the offset distance based on the total length of the crystal ingot, the first angle, and the processed length; Obtaining a second angle between the first radius passing through the grinding point and the axis connecting line; determining a moving distance of the grinding member based on the first radius, the second radius, the offset distance, and the second angle; The grinding element is driven to move based on the moving distance.

3. The barrel grinding method according to claim 2, wherein: The crystal direction axis intersects the growth axis at the midpoint of the crystal rod along its length direction; The determining of the offset distance includes: The offset distance is determined based on half of the total length of the crystal ingot, the processed length, the first angle, and a trigonometric function formula.

4. The barrel grinding method according to claim 2, wherein: defining a point on the preset path corresponding to the grinding point as a preset point, and defining a second radius that intersects the first radius passing through the grinding point at the preset point as a preset radius; Determining the moving distance of the grinding member includes: Determining a third angle between the axis line and the preset radius based on the second radius, the second angle, the offset distance, and a trigonometric function formula; Determining a distance between the preset point and the growth axis based on the second radius, the second angle, the third angle, and a trigonometric function formula; The moving distance is determined based on the first radius and the difference between the preset point and the growth axis.

5. The tumbling method according to any one of claims 2 to 4, characterized in that: The grinding element moves the moving distance in a direction perpendicular to the growth axis.

6. The tumbling method according to any one of claims 2 to 4, characterized in that: The grinding member has a degree of rotational freedom, and the rotation axis of the grinding member is perpendicular to the axis of the growth axis; the grinding member is in a disc structure, and when the grinding member is in an initial position, a plane perpendicular to the axis of the grinding member is defined as a reference plane, an angle formed by the intersection of the shortest line connecting the grinding point and the rotation axis with the reference plane is defined as an initial angle, and a minimum distance between the grinding point and the reference plane is defined as an initial distance; The step of driving the grinding element to move based on the moving distance includes: Obtaining the length of the shortest line, the initial angle, and the initial distance; Determining a working angle between the shortest line and the reference plane based on the sum of the initial distance and the moving distance, the length of the shortest line, and a trigonometric function formula; determining a rotation angle of the grinding member based on a difference between the working angle and the initial angle; Based on the rotation angle, the grinding element is driven to rotate.

7. The barrel grinding method according to claim 6, characterized in that: The obtaining of the length of the shortest line and the initial angle includes: obtaining the radius of the grinding member; Determining the length of the shortest line based on the radius of the grinding workpiece, the initial distance, and the Pythagorean theorem; The initial angle is determined based on the radius of the grinding piece, the initial distance, and a trigonometric function formula.

8. A barrel grinding device for barrel grinding a crystal rod, characterized in that: include: A grinding mechanism for tumbling a crystal ingot, the grinding mechanism comprising a grinding element having a degree of freedom of movement or rotation; A crystal orientation detection module, which is capable of obtaining the position of the crystal orientation axis of the crystal rod; A contour scanning module capable of acquiring a three-dimensional model of the crystal ingot; A control module is provided, wherein the control module is electrically connected to the crystal direction detection module and is also electrically connected to the contour scanning module. The control module can determine a first angle between the crystal direction axis and the growth axis based on the position of the crystal direction axis obtained by the crystal direction detection module and the position of the growth axis of the pre-stored crystal rod; the control module can also drive the grinding member to move based on the three-dimensional model and the first angle, so that the grinding member can roll the crystal rod along a preset path, and each point on the preset path is consistent with the minimum distance from the crystal direction axis.

9. The tumbling equipment according to claim 8, characterized in that The grinding mechanism further includes a linear drive component, which is connected to the grinding component and electrically connected to the control module. The linear drive component drives the grinding component to move in a direction perpendicular to the growth axis.

10. The roller grinding device according to claim 8, characterized in that The grinding mechanism includes a rotating driving member connected to the grinding member, the rotating driving member is electrically connected to the control module, and the rotating driving member drives the grinding member to rotate.

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