Block coil

Abstract

An electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core on or above the substrate or the lead frame; a bulk coil includes: a resin body located on or above a substrate or a lead frame and extending on a magnetic core; a first terminal on or embedded in the resin body in the first layer, and connected to the primary conductive pattern; and a second terminal on or embedded in the resin body in a second layer different from the first layer, and connected to the secondary conductive pattern; and an electronic component on the substrate or the lead frame.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Patent Application No. 63 / 567,057, filed on March 19, 2024. The entire contents of that application are incorporated herein by reference. Technical Field

[0003] The present invention relates to a block coil. More particularly, the present invention relates to a block coil that can be attached to a substrate or lead frame and can be used in a magnetic assembly or an electronic module. Background Art

[0004] It is known to use windings comprising terminals extending over the core.Since there is no structure to support the terminals, there is a risk that the terminals will short-circuit or fall sideways. Summary of the Invention

[0005] To overcome the above-mentioned problems, exemplary embodiments of the present invention provide a block coil including a resin body and terminals on or within the resin body, thereby eliminating or significantly reducing the risk of the block coil causing a short circuit and the risk of the terminals falling off. The magnetic core may include one or more gaps. The one or more gaps increase the power handling capability of the magnetic core by delaying core saturation. The terminals may be arranged in different layers within the resin body.

[0006] According to an example embodiment of the present invention, an electronic module includes: a substrate or a lead frame, which includes a primary conductive pattern and a secondary conductive pattern; a magnetic core, which is located on the substrate or the lead frame or above the substrate or the lead frame; a block coil, which includes: a resin body, which is located on the substrate or the lead frame or above the substrate or the lead frame and extends on the magnetic core; a first terminal, which is on the resin body in a first layer or embedded in the resin body in the first layer and connected to the primary conductive pattern; and a second terminal, which is on the resin body in a second layer different from the first layer or embedded in the resin body in the second layer and connected to the secondary conductive pattern; and an electronic component, which is located on the substrate or the lead frame.

[0007] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be on the exterior of the resin body or embedded in the exterior of the resin body, and the second terminal group may be on the interior of the resin body or embedded in the interior of the resin body.

[0008] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate.

[0009] The electronic module may also include an insulating material covering a substrate or lead frame, a magnetic core, and a bulk coil. The electronic components may include an integrated circuit (IC) and / or a capacitor.

[0010] According to an example embodiment of the present invention, an electronic module includes: a substrate or a lead frame, which includes a conductive pattern; a magnetic core located on or above the substrate or lead frame; a block coil including: a resin body located on or above the substrate or lead frame and extending above the magnetic core, including a first terminal on or embedded in a groove of the resin body and connected to the conductive pattern, and a second terminal included on or embedded in the outside of the resin body, so that the top of the second terminal is farther away from the substrate than the top of the first terminal; an electronic component located on the substrate or lead frame; and an insulating material covering the substrate or lead frame, the magnetic core and the block coil.

[0011] The conductive pattern may be a primary conductive pattern, and the first terminal may be connected only to the primary conductive pattern. The conductive pattern may be a secondary conductive pattern, and the first terminal may be connected only to the secondary conductive pattern.

[0012] The block coil may include a first terminal group and a second terminal group; the first terminal may be included in the first terminal group; and the second terminal may be included in the second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern, the first terminal group may be on a corresponding groove in the resin body or embedded in a corresponding groove in the resin body; and the second terminal group may be on the outside of the resin body or embedded in the outside of the resin body. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding primary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern.

[0013] The substrate or lead frame may include a first layer and a second layer. The electronic module may further include a primary conductive pattern in the first layer and a secondary conductive pattern in the second layer, wherein a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate.

[0014] The electronic components may include integrated circuits (ICs) and / or capacitors.

[0015] According to an example embodiment of the present invention, a magnetic component includes: a substrate or a lead frame, which includes a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including: a resin body located on or above the substrate or the lead frame and extending on the magnetic core, a first terminal on or embedded in the resin body in a first layer and connected to the primary conductive pattern, and a second terminal on or embedded in the resin body in a second layer different from the first layer and connected to the secondary conductive pattern; and an insulating material covering the substrate or the lead frame, the magnetic core and the block coil.

[0016] The magnetic core may be located on a substrate or lead frame. The magnetic core may be located above the substrate or lead frame and may be attached to the inner upper surface of the block coil. The magnetic assembly may also include a coating covering the magnetic core.

[0017] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be on the exterior of the resin body or embedded in the exterior of the resin body, and the second terminal group may be on the interior of the resin body or embedded in the interior of the resin body.

[0018] The substrate or lead frame may include a first layer and a second layer; the primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate or lead frame. The magnetic assembly may further include an additional primary conductive pattern in a third layer of the substrate or lead frame and an additional secondary conductive pattern in a fourth layer of the substrate or lead frame, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate or lead frame.

[0019] According to an example embodiment of the present invention, a magnetic component includes a substrate or a lead frame, which includes a first layer and a conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including: a resin body located on or above the substrate or the lead frame and extending above the magnetic core, including a first terminal on or embedded in a groove in the resin body and connected to the conductive pattern, and a second terminal included on or embedded in the outside of the resin body, so that the top of the second terminal is farther away from the substrate than the top of the first terminal; and an insulating material covering the substrate or the lead frame, the magnetic core and the block coil.

[0020] The magnetic core may be located on a substrate or lead frame. The magnetic core may be located above the substrate or lead frame and may be attached to the inner upper surface of the block coil. The magnetic assembly may also include a coating covering the magnetic core.

[0021] The magnetic component may further include a primary conductive pattern and a secondary conductive pattern, wherein the first terminal may be connected only to the primary conductive pattern, and wherein the second terminal may be connected only to the secondary conductive pattern. The block coil may include a first terminal group and a second terminal group; the first terminal may be included in the first terminal group; the second terminal may be included in the second terminal group; each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The magnetic component may further include a primary conductive pattern in a first layer of a substrate or lead frame and a secondary conductive pattern in a second layer of the substrate or lead frame, wherein, from a side view of the substrate or lead frame, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap. The magnetic component may further include an additional primary conductive pattern in a third layer of the substrate or lead frame and an additional secondary conductive pattern in a fourth layer of the substrate or lead frame, wherein, from a side view of the substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap.

[0022] According to an exemplary embodiment of the present invention, an electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or lead frame; a block coil including: a resin body located on or above the substrate or lead frame and extending over the magnetic core; first terminals defining a first terminal group and located on or embedded in the resin body in a first layer; and second terminals defining a second terminal group and located on or embedded in the resin body in a second layer different from the first layer; an IC located on the substrate or lead frame; and a capacitor located on the substrate or lead frame. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any secondary conductive pattern.

[0023] Each first terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group may be connected to a corresponding secondary conductive pattern.

[0024] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and portions of the primary conductive pattern may vertically overlap corresponding portions of the secondary conductive pattern when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein portions of the additional primary conductive pattern may vertically overlap corresponding portions of the additional secondary conductive pattern when viewed from a side view of the substrate.

[0025] The electronic module may further include an insulating material covering the substrate or lead frame, the magnetic core, and the block coil. The electronic module may include a substrate, which may include vias. The magnetic core may be located on or above a first surface of the substrate or lead frame, and the capacitor may be located on a second surface of the substrate or lead frame opposite the first surface. The electronic module may further include a coating covering the magnetic core.

[0026] According to an exemplary embodiment of the present invention, an electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or lead frame; a block coil including: a resin body located on or above the substrate or lead frame and extending over the magnetic core; first terminals defining a first terminal group and located on or embedded in the resin body in a first layer; and second terminals defining a second terminal group and located on or embedded in the resin body in a second layer different from the first layer; an IC located on the substrate or lead frame; and a capacitor located on the substrate or lead frame. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any secondary conductive pattern.

[0027] Each first terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group may be connected to a corresponding secondary conductive pattern.

[0028] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and portions of the primary conductive pattern may vertically overlap corresponding portions of the secondary conductive pattern when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein portions of the additional primary conductive pattern may vertically overlap corresponding portions of the additional secondary conductive pattern when viewed from a side view of the substrate.

[0029] The electronic module may further include an insulating material covering the substrate or lead frame, the magnetic core, and the block coil. The electronic module may include a substrate, which may include vias. The magnetic core may be located on or above a first surface of the substrate or lead frame, and the capacitor may be located on a second surface of the substrate or lead frame opposite the first surface. The electronic module may further include a coating covering the magnetic core.

[0030] The above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a top perspective view of the block coil mounted on the substrate of the magnetic assembly.

[0032] Figure 2 Is installed in Figure 1 Top view of the magnetic assembly block coil on the PCB.

[0033] Figure 3 Installed in the electronics module Figure 1 A top perspective view of the magnetic assembly block coil on the PCB.

[0034] Figure 4 yes Figure 3 A top perspective view of the electronics module, with insulation covering the coil block.

[0035] Figure 5 yes Figure 3 Top view of an electronic module.

[0036] Figure 6 yes Figure 1 A top perspective view of a block coil.

[0037] Figure 7 yes Figure 1 Bottom perspective view of the block coil.

[0038] Figure 8 is a top perspective view of a block coil with terminals of different widths.

[0039] Figure 9 Shows that it can be Figure 3 Top view of the different layers of a PCB used together with an electronic module.

[0040] Figure 10 yes Figure 4 A partial cross-sectional view of an electronics module showing a block-shaped coil covered by insulating material.

[0041] Figure 11-Figure 15 It shows the manufacturing Figure 3 A perspective view of an approach to an electronic module.

[0042] Figure 16 This is a cross-sectional view of a block coil mounted on a single-layer substrate of an electronic component.

[0043] Figure 17 yes Figure 16 Top view of the top layer of the substrate.

[0044] Figure 18 is a cross-sectional view of a magnetic assembly showing various distances.

[0045] Figure 19 is a top perspective view of the block coil mounted to the lead frame of the magnetic assembly.

[0046] Figure 20 Is installed to Figure 19 Side cross-sectional view of the block coil on the lead frame of the magnetic assembly.

[0047] Figure 21 Is installed to Figure 19 Bottom perspective view of the block coil on the leadframe of the magnetic assembly.

[0048] Figure 22 yes Figure 20 Top perspective view of the partially assembled magnetic assembly.

[0049] Figure 23 yes Figure 20 A top perspective view of the magnetic assembly, with insulation covering the coil block.

[0050] Figure 24 An EE or EI core is shown that can be used with three block coils.

[0051] Figure 25 A rod core is shown that can be used with a single block coil.

[0052] Figures 26-31 Shows that it can be used for Figure 1 Magnetic components and Figure 3 Example substrate for an electronic module.

[0053] Figure 32 A top view of an electronic module with a gap in the magnetic core.

[0054] Figure 33 A gapped EE or EI core is shown that can be used with three block coils.

[0055] Figure 34 is a bottom perspective view of the magnetic core and the block coil including terminals on both the outside and the inside of the block coil.

[0056] Figure 35 yes Figure 34 Bottom perspective view of the core and block coil.

[0057] Figure 36 and Figure 37 yes Figure 34 Exploded view of the block coil.

[0058] Figure 38 and Figure 39 yes Figure 34 Bottom and top views of the block coil.

[0059] Figure 40 and Figure 41 yes Figure 34 Side view of the block coil.

[0060] Figure 42 is a top perspective view of another block coil including terminals on both the outside and the inside of the block coil.

[0061] Figure 43 yes Figure 42 Bottom perspective view of the block coil.

[0062] Figure 44 is a top perspective view of a block coil including terminals arranged at different heights on the exterior of the block coil.

[0063] Figure 45 yes Figure 44 Top view of a block coil.

[0064] Figure 46 and Figure 47 yes Figure 44 Side view of the block coil. DETAILED DESCRIPTION

[0065] Figure 1 and Figure 2 A magnetic assembly 100 is shown, which includes a substrate 20 , a magnetic core 30 and two block coils 10 . Figure 3-5 An electronic module 200 is shown, which includes Figure 1 The magnetic component 100 and the additional electronic component 50. Figure 1-Figure 5 Two massive coils 10 are shown in FIG. 1 , but any number of massive coils 10 , including a single massive coil 10 , may be used.

[0066] The magnetic assembly 100 may include one or more windings wound around the magnetic core 30. For example, the magnetic assembly 100 may include a primary winding and a secondary winding, both extending around the magnetic core 30. Each winding may include one or more terminals 11 in one or more block coils 10 and may include one or more traces or conductive patterns 23 on or in the substrate 20. Figure 32 As shown, the magnetic core 30 may include a gap 37 .

[0067] Substrate 20 may be any suitable substrate, including, for example, a printed circuit board (PCB). Substrate 20 may comprise a single layer or multiple layers and may include traces or conductive patterns 23 on the outer surfaces (i.e., the top and bottom surfaces) of substrate 20 and / or within substrate 20 (i.e., on an inner layer of substrate 20). If substrate 20 comprises a single layer, traces or conductive patterns 23 for both the primary and secondary windings may be located on the same layer (e.g., the top surface of substrate 20). If substrate 20 comprises multiple layers, traces or conductive patterns 23 for the primary and secondary windings may be located on the same layer or on different layers. Figure 9 Four possible layers of substrate 20 are shown. Although Figure 9 Four layers are shown in FIG, but any number of layers, including one, may be used.

[0068] like Figure 3 (exist Figure 3 , the insulating material 40 is shown as transparent) and Figure 4 (exist Figure 4 As shown in FIG. 2 , the insulating material 40 is opaque, the insulating material 40 may be applied to the electronic module 200 to cover the substrate 20, the magnetic core 30, the two block coils 10, and any additional electronic components 50. Any suitable insulating material 40 may be used, including, for example, a molding compound or epoxy resin. The insulating material 40 may be applied in any suitable manner. The insulating material 40 may improve and help maintain isolation between the primary and secondary circuits of the magnetic assembly 100. The insulating material 40 may also be applied to Figure 1 The magnetic component 100.

[0069] exist Figure 1 and Figure 2 In the embodiment, no additional electronic components 50 are shown on the substrate 20, but as shown in FIG. Figure 3 and Figure 5 As shown in the electronic module 200, the substrate 20 may include additional electronic components 50. The electronic components 50 may be active components, such as transistors, integrated circuits (ICs), etc., or may be passive components, such as resistors, capacitors, inductors, etc. The electronic components 50 may be connected to the same surface as the magnetic core 30 (e.g., Figure 3 and Figure 5 ), and / or may be connected to a surface (not shown) opposite the magnetic core 30. For example, positioning the capacitor on the surface of the substrate 20 opposite the magnetic core 30 may contribute to (i) miniaturization of the electronic module 200 and (ii) preventing or significantly reducing short circuits.

[0070] The electronic module 200 may be, for example, a power converter, an isolator, or a transformer, and the electronic assembly 50 may be a component of the power converter, isolator, or transformer. The electronic module 200 may be any suitable power converter, including, for example, a DC-DC converter or an AC-DC converter. For example, if the electronic module 200 is an isolated DC-DC converter, then, for example, Figure 3 and Figure 5 As shown, electronic components 50 of primary circuit 21 on a first side of the isolation barrier may be located at one end of the substrate, and electronic components 50 of secondary circuit 22 on a second side of the isolation barrier may be located at the other end of substrate 20 .

[0071] Figure 16 Shown with Figure 1 and Figure 2 Similar magnetic assembly 100, but Figure 16 The substrate 20 in the embodiment includes a single-layer substrate.

[0072] exist Figure 9 , the first layer of the substrate 20 shows the top surface of the electronic module 200, on which the magnetic core 30 can be located and the block coil 10 and the electronic component 50 can be attached. The first layer may include traces or conductive patterns 23 connecting the electronic component 50. The traces 23 of the primary winding (i.e., primary traces or primary conductive patterns) and the traces 23 of the secondary winding (i.e., secondary traces or secondary conductive patterns) can be as shown. Figure 9 The primary traces 23 and the secondary traces 23 may be located on different layers of the substrate 20, or may be located on the same layer of the substrate 20. For example, the primary traces 23 may be located on the third layer of the substrate 20, and the secondary traces 23 may be located on the first layer. The primary traces 23 and the secondary traces 23 may be separated by one or more layers. Figure 9 In FIG, the primary trace 23 and the secondary trace 23 are separated by the second layer of the substrate 20. Figure 10 In the cross-sectional view of , the primary trace 23 and the secondary trace 23 are separated by three layers of film, with a total spacing of 0.15 mm. Figure 9 The shaded area in FIG is a keep-out area, but other keep-out area arrangements are also possible. For example, the area on the first layer between the legs 12 of the terminal 11 of the block coil 10 can also be a keep-out area, such as Figure 10 As shown, a keepout region with a minimum width of 0.4 mm is included between block-shaped coils 10. The outer layer of substrate 20 may include input / output (I / O) terminals P1, P2, P3, and P4, which may be used to connect electronic module 200 to a host substrate (not shown). I / O terminals P1 and P2 may be connected to an input voltage, while I / O terminals P3 and P4 may provide an output voltage.

[0073] like Figure 9 As shown, one or more terminals 11 of each block coil 10 can be connected to a trace 23. For example, in one of the block coils 10, a single secondary trace 23 can connect the leg of one secondary terminal 11 to the leg of another secondary terminal 11 to define a single turn of the secondary winding, or in one of the block coils 10, a primary trace 23 can connect the legs 12 of three primary terminals 11 to the legs 12 of three other primary terminals 11 to define a single turn of the primary winding. In other words, a single turn of the winding can include one or more terminals 11 connected by a single trace 23. Figure 17 2 shows a possible circuit arrangement of an electronic module 200 comprising (a) a single layer substrate 20 or (b) a multi-layer substrate 20 with the electronic components 50 and all traces 23 on the top surface of the substrate 20. Figure 9As shown, one or more terminals 11 of each block coil 10 can be connected to a trace 23. Traces 23 on substrate 20 can determine how many terminals 11 are included in a single turn and how many turns are in the primary or secondary winding. Therefore, the same block coil 10 can be used for different applications, which can save design costs because a different block coil 10 does not have to be made for each application.

[0074] The core 30 may have any suitable shape, including Figure 1-Figure 3 and Figure 5 , or other suitable shapes, such as Figure 24 The EI or EE core 31 shown in Figure 25 The straight or rod-shaped core 32 shown in , the elliptical core, the non-circular core, the irregular shaped core (not shown), etc. The cores 30, 31, 32 may include any suitable magnetic material, including, for example, ferrite. The cores 30, 31, 32 may be coated or uncoated. Coating the cores 30, 31, 32 may improve isolation. The coating may be any suitable material, including, for example, epoxy, polyimide, etc. The cores 30, 31, 32 may be attached to the substrate 20 or the block coil 10. If the cores 30, 31, 32 are attached to the block coil 10, the cores 30, 31, 32 may be attached to the inner upper surface of the block coil 10. As Figure 32 As shown, the core 30 may include a gap 37, such as Figure 33 As shown, the core 31 may include two gaps 38. Although Figure 32 A gap 37 is shown, and Figure 33 Two gaps 38 are shown, but any number of gaps may be used. The cores 30, 31 may be manufactured with the gaps 37, 38, or the gaps 37, 38 may be manufactured in the cores 30, 31 after the cores 30, 31 are manufactured, for example by cutting or sawing.

[0075] In some applications, including, for example, in DC-DC or AC-DC converters, one or more gaps 37 , 38 may be used to control the inductance of the magnetic cores 30 , 31 . Figure 32 and Figure 33 The gaps 37, 38 shown in FIG. 3 are air gaps that improve the power handling capability of the cores 30, 31 by delaying core saturation, which causes the cores 30, 31 to lose their magnetic properties.

[0076] The location of gaps 37, 38 relative to the windings (including terminals 11 in block coil 10) can affect the performance of the converter. If gaps 37, 38 are close to the windings (including terminals 11 in block coil 10), a phenomenon known as "edge effect" can cause eddy currents to be generated in the windings (including terminals 11 in block coil 10), resulting in power losses. Therefore, if Figure 32 and Figure 33 As shown, since the gaps 37, 38 can be spaced apart from the windings, the influence of fringe fields is limited, thereby reducing power losses. Since the positions of the gaps 37, 38 can be precisely controlled, power losses can be continuously reduced.

[0077] Figure 6 and Figure 7 The block coil 10 is shown. The block coil 10 may include a resin body 17 and a terminal 11. The resin body 17 may include two legs 13 connected by a bridge 14 to define a cavity or groove 16 that receives a portion of the magnetic core 30. The resin body 17 may have a U-shape, such as Figure 6 and Figure 7 As shown, or may have any suitable shape such that the resin body 17 extends over or bridges the magnetic core 30. The resin body 17 may extend on three sides of the cross-section of the magnetic core 30. The resin body 17 may include slots 15 in which the terminals 11 may be located or embedded, and may define a flat pick-up surface that a pick and place machine can use to accurately place the block coil 10 on the substrate 20 in one movement. That is, one movement can produce multiple turns of winding. In addition, the block coil 10 provides a structure that protects the terminals 11 and prevents or greatly reduces the possibility of any short circuits. Because the resin body 17 allows different arrangements of the terminals 11 to be used with the same resin body 17, the same resin body 17 can be used in different applications, which can save design costs because a different resin body 17 does not have to be made for each application. For example, if the resin body 17 is made by a molding process, the same mold can be used for different applications, saving design costs. Figure 6 and 7 In the embodiment, the slots 15 in the resin body 17 are visible, but in the finished product, for example, if a resin mold that fills the gaps in the slots 15 is used, the slots 15 may not be visible.

[0078] Resin body 17 may be made of any suitable insulating material, including, for example, liquid crystal polymer (LCP) resin, and may be made in any suitable manner. Terminals 11 may be made of any suitable conductive material, including, for example, copper or a copper alloy.

[0079] Figure 6 Twelve terminals 11 and four empty slots 15 are shown. Any number of terminals 11 may be used, including, for example, 14, 16, 18, 20, or more than 20 terminals. The terminals 11 may have Figure 6 and Figure 7The U-shape shown, or may have any suitable shape, such that the terminal 11 extends over or bridges the magnetic core 30. The terminal 11 may extend on three sides of a cross section of the magnetic core 30. The terminal 11 may include a foot 12 that may be surface mounted to the substrate 20. Alternatively, the terminal 11 may be connected to the substrate 20 in any suitable manner. The foot 12 of the terminal 11 may be attached to the substrate 20 such that the block coil 10 including the resin body 17 is located on or above the substrate 20. The terminal 11 may be located or embedded in a slot 15 in the block coil 10. As shown Figure 6 As shown, not all slots 15 necessarily have corresponding terminals 11. Figure 6 In the embodiment, four slots 15 do not have corresponding terminals 11, but any number of slots 15 may be empty. Figure 6 Sixteen slots 15 are shown, but any number of slots 15 may be used.

[0080] The terminals 11 in the block coil 10 and the traces 23 on or in the substrate 20 may be included in the windings of the magnetic assembly 100. If the windings include a primary winding and a secondary winding, some of the terminals 11 may be included in the primary winding and connected to the primary traces 23, and some of the terminals 11 may be included in the secondary winding and connected to the secondary traces 23. Alternatively, all of the terminals 11 in the block coil 10 may be included in the primary winding and connected to the primary traces 23, or may be included in the secondary winding and connected to the secondary traces 23. If all of the terminals 11 in one block coil 10 are included in the primary winding, all of the terminals 11 in the other block coil 10 may be included in the secondary winding, and vice versa. If all of the terminals 11 in one block coil 10 are included in the primary winding, the other block coil may include terminals 11 in both the primary winding and the secondary winding, and vice versa.

[0081] The terminals 11 in the block coil 10 can be included in groups. Which terminal group each terminal 11 belongs to is determined by the traces 23 on the substrate 20. For example, for one substrate 20, all terminals 11 may belong to the first terminal group, while for another substrate 20, adjacent terminals 11 may be in two different terminal groups, either the first terminal group or the second terminal group. For example, Figure 6 Two terminal groups are shown, namely a first terminal group and a second terminal group. Figure 6In the embodiment, the first terminal group includes four first terminals 11 on each end of the block coil 10, and the second terminal group includes four second terminals 11 located in the middle of the block coil 10 between the first terminals 11 of the first terminal group. Other arrangements are also possible. For example, the first and second terminals 11 can be arranged alternately along the length of the block coil 10, so that each terminal 11 of one terminal group can be located between two terminals 11 of the other terminal group. Alternatively, the terminal groups do not have to be separated. That is, the terminals 11 of the first terminal group can be located at one end of the block coil 10 (for example, there are seven first terminals 11 on one end), and the terminals 11 of the second terminal group can be located at the other end of the block coil 10 (for example, there are seven second terminals 11 on the other end, with two slots 15 in the middle without any terminals 11). The terminals 11 can also be arranged in a bifilar arrangement, in which the two windings are arranged adjacent to each other. For example, adjacent terminals 11 can be connected to the first primary winding or the second primary winding.

[0082] Each terminal 11 in the first terminal group or the second terminal group can be closer to the adjacent terminal 11 of the same group than the terminal 11 of the other group. That is, each first terminal 11 can be closer to another first terminal 11 than any second terminal 11, and each second terminal 11 can be closer to another second terminal 11 than any first terminal 11. The slots 15 between adjacent terminal groups can be empty (that is, the number of terminals 11 can be reduced or decreased) to help improve the isolation between the first terminal group and the second terminal group. More empty slots 15 between adjacent terminal groups can increase the isolation between the terminal groups. Adjacent terminal groups can be spaced apart from each other. As an alternative to including empty slots 15, adjacent terminal groups can be spaced apart from each other farther than adjacent terminals 11 in a terminal group. For example, the spacing between adjacent terminal groups can be twice the spacing between adjacent terminals 11 in a terminal group, and there are no empty slots 15 between adjacent terminal groups.

[0083] Figure 8 Two block-shaped coils 10 are shown, whose terminals 11 have different widths. Figure 8 As shown, the terminals 11 of each block-shaped coil 10 may have the same width. Alternatively, terminals 11 of different widths may be included in the same block-shaped coil 10 .

[0084] like Figures 34-47 As shown, other arrangements are also possible, which include terminals 11 at different layers on the same block coil 10. That is, when the block coil 10 is mounted on a substrate, different terminals 11 can be arranged so that the tops of different terminals 11 are at different distances from the substrate. Figures 34-43 In FIG. 1 , the terminals 11 are located both outside and inside the resin body 17. Figures 34-43 As shown, when viewed from a top view, the terminals 11 on the outside may overlap with the terminals 11 on the inside. Figures 44-47 In the embodiment, the terminals 11 are arranged on the outside of the resin body 17, but some of the terminals 11 are arranged in the grooves 19 in the resin body 17 so that the tops of the terminals 11 are closer to the substrate than the tops of the terminals 11 not in the grooves 19. Figures 34-47 As shown, the terminals 11 can be arranged in two layers. However, the terminals 11 can also be arranged in more layers.

[0085] exist Figure 6 and Figure 7 In the embodiment of the present invention, the coupling factor can be increased by overlapping the traces in the substrate and by means of empty slots 15 in the block coil 10. The coupling can be increased by interleaving the terminals 11 of the primary and secondary windings. If the primary and secondary windings are on the same block coil 10, the gaps between the terminals 11 allow for increased isolation. Figure 6 and Figure 7 In the block coil 10, fewer terminals 11 can be used due to the empty terminals, the coupling factor is limited by the overlapping area of ​​the terminals 11 in the block coil 10, and the current capacity is determined by the number of turns, which is determined by the number of empty slots 15 and the area of ​​the outside.

[0086] Figures 34-47 The terminals 11 of different layers in the block coil 10 in the embodiment of the present invention may be included in the primary winding or the secondary winding. For example, the upper layer terminals 11 may be included in the primary winding, and the lower layer terminals 11 may be included in the secondary winding, and vice versa. The terminals 11 in the primary winding or the secondary winding may also be located in different layers. For example, the terminals 11 in the primary winding may be located in both the upper layer and the lower layer, or the terminals 11 in the secondary winding may be located in both the upper layer and the lower layer. In some applications, additional windings may be required, in which case the terminals 11 of the additional windings may be included in another layer of terminals 11, or may be included in the same layer of terminals 11 included in the primary winding and / or the secondary winding.

[0087] like Figures 34-41 As shown, the block coil 10 can use each slot 15 for a terminal 11 and does not have to include any empty slots 15. Similarly, in Figures 42-47 In the embodiment, because the terminals 11 in one layer are spaced apart from the terminals 11 in another layer, the terminals 11 in the same layer do not need to be spaced apart. The distance between the terminals 11 in different layers can be set to any suitable distance, including, for example, the requirements of the UL standard. The distance between the terminals 11 in different layers can be set to provide sufficient isolation between the terminals 11 in different layers and, if the terminals 11 are included in the primary and secondary windings, to provide improved coupling between the primary and secondary windings. For example, the distance between the terminals 11 in different layers can be set to be equal to, but not greater than, the UL standard required for isolation, which provides the required minimum isolation and increased coupling.

[0088] exist Figures 34 to 47 In the embodiment, since there is an overlapping area between the terminals 11 of the primary winding and the secondary winding, the block coil 10 can achieve higher coupling compared with an arrangement in which the terminals 11 of the primary winding and the secondary winding are only on the same layer.

[0089] like Figures 34-41 As shown, some terminals 11 may be wider than other terminals 11. Figures 34-41 In the embodiment, the terminals 11 on the outside of the block coil 10 are wider than the terminals 11 on the inside of the block coil 10. However, other arrangements are possible. For example, the terminals 11 on the inside of the block coil 10 can be wider than the terminals 11 on the outside of the block coil 10. Although Figures 34-41 The terminals 11 on the outside of the block coil 10 are shown to have the same width, and the terminals on the inside of the block coil 10 are shown to have the same width, but the terminals 11 on the outside or inside of the block coil 10 may have different widths in the same layer. Figures 42-47 The terminals 11 are shown to have the same width, but Figures 42-47 The block coil 10 in the embodiment may include terminals 11 having different widths. Wider terminals 11 may have higher current capabilities.

[0090] exist Figure 42 and Figure 43 In the block coil 10, the resin body 17 may be a molded body that can be used to isolate the terminals 11 of the primary winding from the terminals 11 of the secondary winding, which saves space available for the terminals 11 on the block coil 10. By not using any empty slots 15, more space can be used for the terminals 11 in the same footprint as a block coil 10 with empty slots 15. The terminals 11 of the primary / secondary winding can be positioned directly above the terminals 11 of the secondary / primary winding, which can improve coupling between the primary and secondary windings.

[0091] Instead of using empty slots 15 to provide the required isolation distance, terminals 11 may be arranged to provide the required isolation distance in inner and outer layers of terminals 11. The inner and outer layers of terminals 11 may be sufficiently spaced apart from each other to provide the required isolation.

[0092] The arrangement of the inner and outer layers of the terminals 11 may provide improved coupling between the primary winding and the secondary winding compared to an arrangement in which the terminals 11 of the primary winding and the secondary winding are only in the same layer.

[0093] exist Figures 34-41, the block coil 10 includes a resin body 17 and an insert 17a. Both the resin body 17 and the insert 17a may include a terminal 11. When the insert 17a is inserted into the resin body 17, the terminal 11 on the resin body 17 is located on the outside of the resin body 17 in the outer layer of the terminal 11, and the terminal 11 on the insert 17a is located on the inside of the resin body 17 in the inner layer of the terminal 11. The insert 17a can be accommodated by the opening defined by the legs 13 of the resin body 14 and the bridge 14. The resin body 17 and the insert 17a can fix the distance between the inner and outer layers of the terminal 11. Although Figures 34-41 Only one insert 17a is shown, but additional inserts 17a can be used to add additional layers of terminals 11. When the block coil 10 is mounted on a substrate, each additional insert will create a layer of terminals 11 with the top of the terminals 11 closer to the substrate. Figures 34-41 In the embodiment, the various layers of the terminal 11 are manufactured in different steps and then assembled together. However, the different layers of the terminal 11 may be manufactured in the same step. When the block coil 10 is mounted on the substrate, the insert 17a may be inserted into the resin body 17 and then mounted on the substrate. Alternatively, the insert 17a may be mounted on the substrate, and then the resin body 17 may be mounted on the substrate above the insert 17a. The block coil 10 may be mounted on the substrate using a surface mount assembly (SMA) process or any other suitable process.

[0094] The terminals 11 on the resin body 17 may be included in the primary winding or the secondary winding, and the terminals 11 on the insert 17a may be included in the secondary winding or the primary winding.Other arrangements as described above are also possible.

[0095] The primary and secondary windings may overlap in different layers of the substrate.

[0096] Figure 42 and Figure 43 The block-shaped coil 10 including a molded body as the resin body 17 is shown. Figure 42 and Figure 43 As shown, the legs 13 and bridge 14 of the resin body 17 can be connected so that the resin body 17 defines a curved U-shape. However, the resin body 17 can also define other shapes. The terminals 11 on the outside of the resin body 17 can be included in the primary winding or the secondary winding, and the terminals 11 on the inside of the resin body 17 can be included in the secondary winding or the primary winding. Other arrangements as described above are also possible.

[0097] Figures 44-47 The block coil 10 is shown in which the resin body 17 includes a groove 19. The groove 19 extends through the legs 13 and the bridge 14. The terminals 11 can be located on the outside of the resin body 17 and within the groove 19. Although Figures 44-47In the embodiment, each groove has the same or substantially the same depth within manufacturing and / or measurement tolerances, but grooves 19 may have different depths. Terminals 11 on the exterior of resin body 17 may be included in the primary winding or the secondary winding, and terminals 11 in grooves 19 of resin body 17 may be included in the secondary winding or the primary winding. Other arrangements as described above are also possible.

[0098] Figure 10 A cross section of two block coils 10 connected to a multi-layer substrate 20 is shown. Figure 10 Various minimum distances are shown to ensure adequate isolation. For example, the wall thickness of the resin body 17 should be at least 0.4 mm so that the terminal 11 is at least 0.4 mm away from the cavity or groove 16 in the block coil 10. If the core 30 is coated, the wall thickness of 0.4 mm can be reduced to, for example, 0.2 mm. The isolation distance will depend on the application. The minimum distance between the core 30 and the wall of the resin body 17 can be 0.0 mm so that there is no distance between the core 30 and the wall of the resin body 17. On the surface of the substrate 20, the minimum distance between the traces or conductive patterns 23 of the primary and secondary circuits should be at least 0.4 mm.

[0099] like Figure 10 As shown, the substrate 20 may include laser vias that may be created by a laser, do not necessarily extend all the way through the substrate 20, and may include buried vias that extend between inner layers of the substrate 20 but do not extend to the outer surface of the substrate 20. Each of the multiple layers of the substrate 20 may be within a manufacturing and / or measurement tolerance of 0.05 mm or approximately 0.05 mm. Figure 10 As shown, the primary trace 23 and the secondary trace 23 can be separated by three inner layers so that the total distance between the primary trace 23 and the secondary trace 23 is at least 0.15 mm to ensure sufficient isolation. Although the minimum distance between the primary circuit and the secondary circuit is required to be 0.4 mm on the surface of the substrate 20, the minimum distance between the primary circuit and the secondary circuit within the substrate 20 depends on the isolation requirements of each product. Other distances are also possible. For example, Figure 18 In the embodiment, distance 1 is the wall thickness of the block coil 10 and may be about 0.01 mm to about 2.0 mm within a manufacturing and / or measurement tolerance range; distance 2 is the distance between the trace 23 on the top layer of the substrate 20 and the magnetic core 30 and may be about 0.01 mm to about 2.0 mm within a manufacturing and / or measurement tolerance range; and distance 3 is the minimum distance between the block coils 10 (i.e., Figure 18 The distance between the legs 12 of the middle terminal 11) and can be about 0.01 mm to about 2.0 mm within a manufacturing and / or measurement tolerance range.

[0100] Figures 26-31Different possible substrates 20 that may be used in the magnetic assembly 100 or in the electronic module 200 are shown. Figures 26-30 Different possible multilayer substrates 20 are shown, and Figure 31 A single layer substrate 20 is shown. Figures 26-30 As shown, substrate 20 may include multiple layers, including a top mask 24, one or more prepreg layers 27, a core layer 28, one or more prepreg layers 27, and a bottom mask 24. Core layer 28 may also include a core prepreg layer 28a. Core layer 28 may include any suitable material, including, for example, FR-4. Traces 23 may be included on the top and bottom surfaces of substrate 20 and may be included in an inner layer of substrate 20. Traces 23 on different layers may be connected via vias. A via may include a hole in substrate 20 that is plated with a conductive material (including, for example, a metal or metal alloy) and filled with any suitable material (including, for example, a resin). Alternatively, the via may be filled solely with a conductive material. The via may be made in any suitable manner, including, for example, mechanical drilling or laser drilling. Any suitable vias may be used, including buried vias where neither side of the via is exposed on the top or bottom surface of the substrate 20, blind vias where one side of the via is exposed on the top or bottom surface of the substrate 20, and through holes where both sides of the via are exposed on the top or bottom surface of the substrate 20. The traces 23 may comprise copper or other suitable conductive materials. Similarly, as Figure 31 As shown, substrate 20 may include a single layer, including top mask 24 , core layer 28 , and bottom mask 24 . Figure 31 Traces 23 in FIG. 2 may be located on either the top or bottom surface of substrate 20 .

[0101] Figure 26 A multilayer substrate 20 is shown, comprising a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, on the top surface of the core prepreg layer 28a, and on the bottom surface of the core layer 28.

[0102] Figure 27 A multilayer substrate 20 is shown, comprising a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, on the top surface of the core prepreg layer 28a, and on the bottom surface of the core layer 28.

[0103] Figure 28 A multilayer substrate 20 is shown including a top mask 24, a prepreg layer 27, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of substrate 20 and the top and bottom surfaces of core layer 28.

[0104] Figure 29 A multilayer substrate 20 is shown including a top mask 24, prepreg layers 27, a core layer 28, prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of substrate 20 and core layer 28.

[0105] Figure 30 A multilayer substrate 20 is shown comprising a top mask 24, two prepreg layers 27, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of substrate 20 and core layer 28.

[0106] Figures 26-30 The multi-layer substrate in the makes it easier to position the primary and secondary traces or conductive patterns 23 and provide insulation between the primary and secondary traces or conductive patterns 23. If multiple block coils 10 are used, then Figures 26-30 The multi-layer substrate in can more easily provide isolation between the primary traces and the secondary traces or conductive patterns 23.

[0107] Figure 31 The bottom of FIG. 4 shows a single layer substrate 20 including a top mask 24 , a core layer 28 , and a bottom mask 24 . Traces 23 are located on the top and bottom surfaces of the substrate 20 . Figure 31 The top of FIG shows a magnetic assembly 100 that includes two block coils 10 mounted on a single-layer substrate 20 and includes a magnetic core 30. Traces 23 are on the top surface of the single-layer substrate 50. The single-layer substrate 20 allows for the use of smaller magnetic assemblies 100 or electronic modules 200. For example, one of the block coils 10 may include a primary terminal 11, and the other block coil 10 may include a secondary terminal 11, so that a primary trace 23 connected to the primary terminal 11 and a secondary trace 23 connected to the secondary terminal can be located on the same surface of the substrate 10.

[0108] like Figure 10 As shown, portions of the secondary trace 23 and the primary trace 23 can vertically overlap, which can improve coupling between the primary and secondary windings. The greater the overlap between the primary and secondary windings, the greater the coupling between the primary and secondary windings. If the primary trace 23 or the secondary trace 23 is located on adjacent layers, resistance can be reduced. That is, if primary traces 23 on different layers are separated by only a single layer, resistance in the primary winding can be reduced, and if secondary traces 23 on different layers are separated by only a single layer, resistance in the secondary winding can be reduced.

[0109] Figure 11-Figure 15 A method of manufacturing an electronic module 200 is shown, in which a block coil 10 is mounted on a substrate 20 . Figure 11There is shown providing a substrate 20 and subsequently applying solder paste 25. The substrate 20 may be one of the substrates 20 described above, and may be a multi-layer or single-layer substrate. Figure 12 Glue or adhesive 26 is shown being dispensed onto substrate 20. Glue or adhesive 26 may be dispensed as part of a surface mount technology (SMT) process, or separate from the SMT process. Figure 13 The placement of the magnetic core 30 and the electronic components 50 are shown. Figure 14 The placement of two block coils 10 extending over or bridging the core 30 is shown. Figure 15 Insulation material 40 covering substrate 20 , electronic components 50 , magnetic core 30 , and block coil 10 is shown. Figure 15 The insulating material 40 is shown covering the entire substrate 20, but the insulating material 40 may cover only a portion of the substrate 40 and / or only one or some of the electronic components 50, the magnetic core 30, and the block coil 10. Typically, a mother substrate may be used, wherein the array of electronic modules 200 is included in the mother substrate. The mother substrate is then cut or singulated to form individual electronic modules 200. Alternatively, the individual electronic modules 200 may be manufactured without using a mother substrate.

[0110] Figures 19-23 Shown with Figure 1 The magnetic assembly 100 is similar to the magnetic assembly 100. For the sake of brevity, the description of similar components will not be repeated. The magnetic assembly 100 may include Figure 1 The magnetic assembly 100 includes a block coil 10 and a magnetic core 30 .

[0111] Figures 19-23 The magnetic assembly 100 and Figure 1 The difference of the magnetic assembly 100 is that Figures 19-23 The block coil 10 of the magnetic assembly 100 is connected to the lead frame 60 instead of the substrate 20 . Figures 19-23 The magnetic assembly 100 includes an insulating material 40 similar to that used in Figure 4 The insulating material 40 of the electronic module 200. Figures 19-21 Insulating material 40 is shown as transparent, but in Figure 23 Insulating material 40 is shown as opaque. For clarity, Figure 22 One of the block-shaped coils 10 and the insulating material 40 are not shown.

[0112] Although not shown, additional electronic components may be included to form the electronic module 200 , such that the magnetic assembly 100 may be part of a DC-DC converter, for example.

[0113] The lead frame 60 may include mounting terminals 62 and a conductive pattern 61. The mounting terminals 62 may be used to connect the lead frame 60 and the magnetic assembly 100 or electronic module 200 to a host substrate (not shown). The conductive pattern 61 is similar to the traces 23 included on or in the substrate 20, and as described above, the conductive pattern 61 may connect one or more terminals 11 to define a single-turn winding. The conductive pattern 61 may determine which winding a terminal 11 is connected to. For example, the conductive pattern 61 may be connected to a terminal 11 so that one block coil 10 includes two primary turns, and another block coil includes four secondary turns. Figures 19-23 The terminals 11 in the block coil 10 in the magnetic assembly 100 can be divided into different terminal groups, as described above for Figure 1 The block coil 10 in the magnetic assembly 100 is described.

[0114] It should be understood that the above description is merely illustrative of the present invention. Various substitutions and modifications may be devised by those skilled in the art without departing from the present invention. Therefore, the present invention is intended to encompass all such substitutions, modifications, and variations that fall within the scope of the appended claims.

Claims

1. An electronic module comprising: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; Block coil, including: a resin body, the resin body being located on or above the substrate or the lead frame and extending over the magnetic core; a first terminal on or embedded in the resin body in the first layer and connected to the primary conductive pattern; and a second terminal on or embedded in the resin body in a second layer different from the first layer and connected to the secondary conductive pattern; and An electronic component is located on the substrate or the lead frame.

2. The electronic module according to claim 1, wherein The block coil includes an additional first terminal and an additional second terminal; The first terminal and the additional first terminal define a first terminal group; and The second terminal and the additional second terminal define a second terminal group.

3. The electronic module according to claim 2, wherein Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

4. The electronic module according to claim 2, wherein the first terminal group is on the exterior of the resin body or embedded in the exterior of the resin body; and The second terminal group is on or embedded in the interior of the resin body.

5. The electronic module according to claim 1, wherein: The substrate or the lead frame includes a first layer and a second layer.

6. The electronic module according to claim 5, wherein The primary conductive pattern is in the first layer; The secondary conductive pattern is in the second layer; and A portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap when viewed from a side view of the substrate.

7. The electronic module according to claim 6, further comprising: an additional primary conductive pattern in a third layer of the substrate; as well as an additional secondary conductive pattern in a fourth layer of the substrate; wherein, A portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap as viewed from a side view of the substrate.

8. The electronic module according to any one of claims 1 to 7, further comprising: An insulating material covers the substrate or the lead frame, the magnetic core, and the block coil.

9. The electronic module according to any one of claims 1 to 7, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

10. An electronic module comprising: a substrate or lead frame including a conductive pattern; a magnetic core located on or above the substrate or the lead frame; Block coil, including: a resin body, the resin body being located on or above the substrate or the lead frame and extending over the magnetic core; a first terminal on or embedded in the groove of the resin body and connected to the conductive pattern; and a second terminal on an exterior of the resin body or embedded in an exterior of the resin body such that a top portion of the second terminal is farther from the substrate than a top portion of the first terminal; an electronic component located on the substrate or the lead frame; and An insulating material covers the substrate or the lead frame, the magnetic core and the block coil.

11. The electronic module according to claim 10, wherein The conductive pattern is a primary conductive pattern; and The first terminal is connected only to the primary conductive pattern.

12. The electronic module according to claim 10, wherein The conductive pattern is a secondary conductive pattern; and The first terminal is connected only to the secondary conductive pattern.

13. The electronic module according to claim 10, wherein The block coil includes a first terminal group and a second terminal group; The first terminal is included in the first terminal group; and The second terminal is included in the second terminal group.

14. The electronic module according to claim 13, wherein Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern; The first terminal group is on or embedded in a corresponding groove in the resin body; and The second terminal group is on the exterior of the resin body or embedded in the exterior of the resin body.

15. The electronic module according to claim 13, wherein: Each terminal in the first terminal group and each terminal in the second terminal group is connected to a corresponding primary conductive pattern.

16. The electronic module according to claim 13, wherein: Each terminal in the first terminal group and each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

17. The electronic module according to any one of claims 10 to 16, wherein: The substrate or the lead frame includes a first layer and a second layer.

18. The electronic module according to claim 17, further comprising: a primary conductive pattern in the first layer; as well as a secondary conductive pattern in the second layer; wherein, A portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap when viewed from a side view of the substrate.

19. The electronic module according to claim 18, further comprising: an additional primary conductive pattern in a third layer of the substrate; as well as an additional secondary conductive pattern in a fourth layer of the substrate; wherein, A portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap as viewed from a side view of the substrate.

20. The electronic module according to any one of claims 10 to 16, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

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