Heat dissipation structure and laser

Abstract

The invention belongs to the technical field of heat dissipation of lasers, and discloses a heat dissipation structure and a laser. The heat dissipation structure comprises a heat dissipation plate and a heat conduction part. The plurality of heat dissipation plates are encircled to form a plurality of mounting spaces for accommodating electrical elements, the inner walls of the heat dissipation plates are used for mounting the electrical elements, and heat insulation bodies are arranged between the adjacent heat dissipation plates corresponding to different electrical elements of which the working temperature difference is greater than a first preset temperature; heat conductors are arranged between the adjacent heat dissipation plates corresponding to the different electrical elements with the working temperature difference smaller than the second preset temperature; the outer wall of at least part of the heat dissipation plate is provided with a heat conduction part, and the heat conduction part is used for transmitting heat generated by the electrical element to the external environment through convection heat dissipation. According to the invention, convection heat dissipation can be realized, and the influence of noise and vibration is avoided; the structure compactness is improved, and waste of system resource configuration and unnecessary energy consumption are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of lasers, and in particular to a heat dissipation structure and a laser. Background Art

[0002] Fiber lasers typically undergo a series of complex physical conversion processes when converting electrical energy into light energy. Since the conversion efficiency between electrical energy and light energy cannot reach 100%, a large amount of waste heat is generated during the operation of the laser.

[0003] If this waste heat is not promptly and effectively handled, the accumulation of heat will affect the structural stability and safety of the laser, and may even cause equipment failure or performance degradation. Therefore, the design and implementation of laser heat dissipation technology is crucial to its normal operation.

[0004] In small lasers, the most commonly used heat dissipation method is currently forced air cooling. This method usually relies on fans to accelerate heat dissipation. However, the fans generate a lot of noise during operation, which in turn affects the user experience and working environment of the laser. In addition, most existing laser cooling systems are designed to place all heat-generating components on the same heat sink. Due to the different heat generation and rated operating temperatures of different components, the design often takes into account the minimum operating temperature requirements of the components to ensure that all components can operate within a safe temperature range. This often leads to overly large heat sink designs, and even requires the use of higher-power fans, resulting in waste of system resources and unnecessary energy consumption. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat dissipation structure and a fiber laser, which adopt natural convection to dissipate heat, avoid the influence of noise and vibration, and improve the reliability of the overall structure; on the other hand, it can also carry out targeted heat dissipation for electrical components of different types (different safe operating temperature ranges), improve the compactness of the structure, and reduce the waste of system resource allocation and unnecessary energy consumption.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A heat dissipation structure, comprising:

[0008] A heat sink, wherein a plurality of heat sinks are enclosed to form an installation space for accommodating a plurality of electrical components, the inner walls of the heat sinks being used to install the electrical components, the heat insulator being provided between adjacent heat sinks corresponding to different electrical components having an operating temperature difference greater than a first preset temperature; and the heat conductor being provided between adjacent heat sinks corresponding to different electrical components having an operating temperature difference less than a second preset temperature, the heat insulator being used to prevent heat transfer between two adjacent heat sinks, and the heat conductor being used to enable heat transfer between two adjacent heat sinks;

[0009] A heat conducting portion is provided on at least a portion of the outer wall of the heat dissipation plate, and is used to transfer the heat generated by the electrical component to the external environment through convection heat dissipation.

[0010] As an optional solution for the heat dissipation structure, the surface of the electrical component is attached to the wall surface of the heat dissipation plate facing the installation space.

[0011] As an optional solution of the heat dissipation structure, the heat conducting portion includes a plurality of heat conducting fins extending outward from the outer wall of the heat dissipation plate, and the plurality of heat conducting fins are sequentially spaced apart.

[0012] As an optional solution of the heat dissipation structure, a cover plate is provided on a side of the heat conducting portion away from the heat dissipation plate, so as to form a convection channel between adjacent heat conducting plates.

[0013] As an optional solution of the heat dissipation structure, the heat conducting portion includes a plurality of needle-shaped bodies arranged on the outer wall of the heat dissipation plate.

[0014] As an optional solution for the heat dissipation structure, the heat conductor is a layered body formed by applying a heat-conducting medium between adjacent heat dissipation plates; and / or the heat insulator is a layered body formed by applying a heat-insulating medium between adjacent heat dissipation plates.

[0015] As an optional scheme for the heat dissipation structure, six groups of heat dissipation plates are combined to form a closed cube shape, and the electrical components include one or more of a PCB board, a chip and an optical fiber body. The optical fiber body and the PCB board are respectively arranged on two relatively arranged heat dissipation plates, and the chip is arranged on one or more of the remaining heat dissipation plates.

[0016] As an optional solution for the heat dissipation structure, the PCB board is bonded to the heat dissipation plate by means of thermally conductive adhesive.

[0017] As an optional solution of the heat dissipation structure, the heat conducting portion is located on the outer wall of the heat dissipation plate on the side.

[0018] A laser comprises a plurality of electrical components and the heat dissipation structure described in any one of the above solutions.

[0019] Beneficial effects:

[0020] In the first aspect of the present invention, electrical components are directly mounted on the inner wall of the heat sink within the installation space. This not only utilizes the heat conduction effect of the heat sink, but also protects the electrical components as a whole, preventing exposure and improving their operational safety and stability. Furthermore, this heat dissipation structure can typically accommodate a variety of electrical components, each of which may have different safe operating temperature ranges. Therefore, a thermal insulator or thermal conductor is adaptively positioned between adjacent heat sinks. The thermal insulator is used to prevent heat transfer between two adjacent heat sinks, while the thermal conductor is used to enable heat transfer between two adjacent heat sinks. When the operating temperature difference between the electrical components on adjacent heat sinks is greater than a first preset temperature, a heat insulator is provided between the two heat sinks, i.e., the safe operating temperatures of the two adjacent groups of electrical components differ significantly. The provision of the heat insulator prevents the two adjacent heat sinks from exchanging heat, thereby achieving independent heat dissipation of the two adjacent groups of electrical components, preventing the electrical components with less heat generation from matching the heat sink required by the electrical components with greater heat generation. Therefore, the structure or size of the heat sinks can be specifically set according to the different heat generation levels of the electrical components, thereby improving the compactness of the structure and reducing the waste of system resource allocation and unnecessary energy consumption. Furthermore, when the operating temperature difference between the electrical components on adjacent heat sinks is less than a second preset temperature, i.e., the safe operating temperatures of the two adjacent groups of electrical components differ significantly, a heat conductor can be provided between the two adjacent heat sinks, thereby accelerating the flow of heat and improving heat dissipation efficiency. Furthermore, a heat conducting portion is provided on the outer wall of the heat sink, which is in direct contact with the external environment to achieve convection heat dissipation, accelerate heat conduction of the heat sink, achieve rapid cooling of the electrical components, avoid the noise and vibration caused by forced air cooling in the prior art, and improve the reliability of the overall structure.

[0021] In the second aspect of the present invention, the laser based on the above heat dissipation structure can not only achieve heat dissipation for electrical components, but also, through the enclosed structural setting, the electrical components are arranged inside the installation space, and the heat conduction part is arranged outside the installation space, effectively realizing the improvement of heat dissipation effect by natural convection, thereby avoiding the influence of noise and vibration and improving the reliability of the laser; on the other hand, the enclosed structural design also concentrates the arrangement of the heat dissipation plates, improves the compactness of the laser, makes the laser further miniaturized, and reduces the waste of system resource allocation and unnecessary energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the heat dissipation structure provided by an embodiment of the present invention;

[0023] Figure 2This is a first structural diagram of a heat dissipation structure with hidden features provided by an embodiment of the present invention;

[0024] Figure 3 is a second structural schematic diagram of a heat dissipation structure with hidden features provided by an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the matching structure of the optical fiber body and the heat dissipation plate provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of a first structure of a chip and a heat sink provided by an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of a single chip and a single heat sink provided by an embodiment of the present invention;

[0028] Figure 7 This is a partial structural diagram of the chip and heat sink provided by an embodiment of the present invention;

[0029] Figure 8 This is a second structural diagram of the chip and the heat sink provided by an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of the structure of the PCB board and the heat sink provided by an embodiment of the present invention;

[0031] Figure 10 It is a structural schematic diagram of the cooperation between the fixing member and the heat dissipation plate provided by an embodiment of the present invention.

[0032] In the picture:

[0033] 1. Heat sink; 11. Installation space; 12. Installation boss; 13. Housing;

[0034] 2. Heat conduction part;

[0035] 3. Electrical components; 31. PCB board; 32. Chip; 33. Optical fiber body;

[0036] 4. Thermal insulation;

[0037] 5. Heat conductor;

[0038] 6. Fixing parts. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0040] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0041] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meanings.

[0043] Please see the attached Figure 1 -Attached Figure 3 The first aspect of this embodiment relates to a heat dissipation structure, which includes a heat dissipation plate 1 and a heat conducting portion 2. A plurality of heat dissipation plates 1 are enclosed to form an installation space 11 for accommodating a plurality of electrical components 3. The inner wall of the heat dissipation plate 1 is used to install the electrical components 3. A heat insulator 4 or a heat conductor 5 can be set between adjacent heat dissipation plates 1 according to the working temperature of the electrical components 3 installed thereon. The heat insulator 4 is used to prevent two adjacent heat dissipation plates 1 from transferring heat. The heat conductor 5 is used to enable two adjacent heat dissipation plates 1 to transfer heat. The heat insulator 4 is set between adjacent heat dissipation plates 1 corresponding to different electrical components 3 whose working temperature difference is greater than a first preset temperature; the heat conductor 5 is set between adjacent heat dissipation plates 1 corresponding to different electrical components 3 whose working temperature difference is less than a second preset temperature; the outer wall of at least part of the heat dissipation plate 1 is provided with a heat conducting portion 2, which is used to transfer the heat generated by the electrical components 3 to the external environment through convection heat dissipation.

[0044] The heat sink 1 can be a square plate-shaped member based on copper or other metals, and a layer can be provided on the surface of the heat sink 1 to further enhance heat dissipation and corrosion resistance. The number of heat sinks 1 can be adjusted according to the number of electrical components 3. A plurality of heat sinks 1 are combined to form an installation space 11, and the electrical components 3 are directly provided on the inner wall of the heat sink 1 inside the installation space 11. This not only utilizes the heat conduction effect of the heat sink 1, but also protects the electrical components 3 as a whole, improves the airtightness of the electrical components 3, plays a role in dust prevention, extends the service life, and improves the working safety and stability of the electrical components 3. Furthermore, the heat dissipation structure can generally be used to specifically set up multiple types of electrical components 3. Different types of electrical components 3 may have different safe operating temperatures. In this embodiment, the operating temperature refers to the highest temperature at which the electrical components 3 can reach the optimal working state based on the heat dissipation structure. That is, once this temperature is exceeded, the electrical components 3 will be immediately affected by the thermal field, causing the working state of the electrical components 3 to decline. It can also be understood as the lowest temperature that destroys the optimal working state of the electrical components 3. A heat insulator 4 or a heat conductor 5 is adaptively arranged between adjacent heat sinks 1, wherein the heat insulator 4 is used to prevent heat transfer between two adjacent heat sinks 1, and the heat conductor 5 is used to enable heat transfer between two adjacent heat sinks 1. When the difference in the operating temperatures of the electrical components 3 on the adjacent heat sinks 1 is greater than a first preset temperature, a heat insulator 4 is arranged between the two heat sinks 1, i.e., the safe operating temperatures of the two groups of adjacent electrical components 3 differ greatly. By arranging the heat insulator 4, the two adjacent heat sinks 1 are prevented from performing heat exchange, thereby achieving the heat dissipation of the two groups of adjacent electrical components 3. This can avoid the electrical components 3 that generate less heat also needing to match the heat sink 1 required by the electrical components 3 that generate more heat. Therefore, the structure or size of the heat sink 1 can be specifically set according to the different heat generation levels of the electrical components 3, thereby improving the compactness of the structure and reducing the waste of system resource allocation and unnecessary energy consumption. Furthermore, when the operating temperature difference of the electrical components 3 on adjacent heat sinks 1 is less than the second preset temperature, that is, the difference between the two safe operating temperatures of two adjacent groups of electrical components 3 is small, a heat conductor 5 can be set between the two adjacent heat sinks 1 to accelerate the flow of heat and improve the heat dissipation efficiency.

[0045] It should be noted that the specific values ​​of the first preset temperature and the second preset temperature can be set and adjusted in a targeted manner according to the test results or the heat generation statistics of the electrical components 3. For example, the range of the first preset temperature and the second preset temperature can be 5°C-15°C, and the first preset temperature ≥ the second preset temperature, and the two can be close to or equal. In this embodiment, the first preset temperature is 15°C. When the operating temperature difference of the electrical components 3 on two adjacent heat sinks 1 is greater than 15°C, it is judged that the safe operating temperatures of the two groups of adjacent electrical components 3 are quite different. Therefore, when the two groups of adjacent electrical components 3 are working safely, the temperature field generated will form obvious relatively high temperature areas and relatively low temperature areas, so that the relatively high temperature areas and the relatively low temperature areas have a heat conduction effect, which in turn affects the heat dissipation of the electrical components 3 in the relatively low temperature areas, causing the corresponding electrical components 3 to deviate from the safe operating temperature, thereby affecting the performance. In this embodiment, a heat insulator 4 is provided on the above-mentioned two electrical components 3 to prevent the two adjacent heat sinks 1 from exchanging heat to block the heat conduction between the two, thereby avoiding the influence between the two electrical components 3. In this embodiment, the second preset temperature can be 5°C. When the electrical components 3 on two adjacent heat sinks 1 are working safely, since the difference in operating temperature is less than 5°C, it can be determined that the safe operating temperatures of the two groups of adjacent electrical components 3 are very close. Therefore, there will not be very obvious relatively high and low temperature zones in the temperature field of the two groups of adjacent electrical components 3. A heat conductor 5 can be set between the two adjacent heat sinks 1 to accelerate the flow of heat and improve the heat dissipation efficiency. Furthermore, a heat conducting portion 2 is provided on the outer wall of the heat sink 1. The heat conducting portion 2 is in direct contact with the external environment, usually air with a relatively low temperature, to achieve convection heat dissipation, accelerate the heat conduction of the heat sink 1, and achieve rapid cooling of the electrical components 3, avoiding the influence of noise and vibration caused by forced air cooling in the existing technology, thereby improving the reliability of the overall structure.

[0046] Optionally, the surface of the electrical component 3 is attached to the wall surface of the heat dissipation plate 1 facing the installation space 11 .

[0047] Specifically, the heating surface of the electrical component 3 can be directly attached to the heat sink 1, thereby achieving rapid heat transfer and directly conducting heat through the heat sink 1. The electrical component 3 can be tightly fitted to the heat sink 1 by means of a retaining structure such as a retaining groove provided on the heat sink 1, or can be bonded to the heat sink 1 by means of a thermally conductive adhesive.

[0048] By directly placing the electrical component 3 against the heat sink 1 , it is possible to avoid affecting the heat conduction efficiency by providing an intermediate heat conduction structure, while also improving the compactness of the structure.

[0049] Optionally, the heat conducting portion 2 includes a plurality of heat conducting fins extending outward from the outer wall of the heat dissipation plate 1 , and the plurality of heat conducting fins are sequentially arranged at intervals.

[0050] In one implementation of this embodiment, the heat conducting fins may have various structural forms, including but not limited to flat fin structures, curved fin structures, and bifurcated branch-shaped fin structures. The heat conducting fins may be spaced apart to increase the contact area with the external components and improve the convective heat dissipation efficiency.

[0051] Optionally, a cover plate (not shown in the figure) is provided on the side of the heat conducting portion 2 away from the heat dissipation plate 1 so as to form a convection channel between adjacent heat conducting plates.

[0052] In this embodiment, a vertical convection channel is formed by the outer wall of the heat sink 1, two adjacent heat conducting portions 2, and a portion of the cover. Due to the temperature difference, cool air continuously flows through the convection channel in the vertical direction, removing heat. This natural vertical air flow improves heat dissipation efficiency.

[0053] Optionally, the heat conducting portion 2 includes a plurality of needle-shaped bodies arranged on the outer wall of the heat dissipation plate 1 .

[0054] In another implementation of this embodiment, the heat conducting portion 2 is in the shape of needle ribs, that is, heat conducting needles are arrayed on the outer wall of the heat dissipation plate 1, and the circumferential outer wall contacted by the heat conducting needles is in contact with the external air, thereby realizing convection heat dissipation. By reasonably setting the density of the heat conducting needles, the heat dissipation effect can be conveniently adjusted to improve adaptability.

[0055] Optionally, the heat conductor 5 is a layered body formed by applying a heat-conducting medium between adjacent heat dissipation plates 1 , and the heat insulator 4 is a layered body formed by applying a heat-insulating medium between adjacent heat dissipation plates 1 .

[0056] In this embodiment, the heat conductor 5 can be coated with thermally conductive adhesive at the connecting surface between the heat sinks 1, thereby improving the thermal conductivity of the two adjacent heat sinks 1. The heat insulator 4 can be made of a thermal insulation film, which is directly bonded to the connecting surface between the heat sinks 1 during use to form a thermal insulation layer, thereby preventing heat conduction between the two adjacent heat sinks 1 and ensuring that the heat dissipation of each heat sink does not affect each other.

[0057] Please continue to attach Figure 1 -Attached Figure 3 In this embodiment, the heat dissipation structure is discussed in detail with respect to a closed cube formed by six groups of heat dissipation plates 1, and the electrical component 3 includes one or more of a PCB board 31, a chip 32 and an optical fiber body 33.

[0058] Specifically, six groups of heat sinks 1 and the cooperating heat conducting parts 2 can form a closed "U-shaped" structure, and the optical fiber body 33 is arranged in a ring and arranged on the heat sink 1 at the top position, the PCB board 31 is arranged on the heat sink 1 at the bottom position, and the three groups of chips 32 are arranged in sequence on the three heat sinks 1 on the side.

[0059] Please refer to the attached Figure 4 -Attached Figure 9 , the heat generation capacity of the chip 32, the optical fiber body 33 and the PCB board 31 increases in sequence, and the heat generation capacity of the chip 32 and the optical fiber body 33 are close, so the PCB board 31 placed on the heat sink 1 at the bottom position can affect the heat dissipation of the chip 32. In order to prevent the excess heat of the PCB board 31 from being transferred to the chip 32 through the heat sink 1, thereby affecting the working performance of the chip 32, a heat insulator 4 is added at the connection between the PCB board 31 and the heat sink 1 corresponding to the chip 32 to prevent heat transfer between the two. In addition, since the PCB board 31 has the strongest heat generation capacity, in order to improve the heat dissipation effect of the PCB board 31, in this embodiment, a joint extended heat dissipation structure for the PCB board 31 is formed between the heat sink 1 on the side where the chip 32 is not set and the heat sink 1 on which the PCB board 31 is installed, so as to improve the heat dissipation efficiency of the PCB board 31. At the same time, because the combined extended heat dissipation structure needs to contact not only the heat sink 1 of the chip 32 but also the heat sink 1 of the optical fiber body 33, a thermal insulator 4 is also provided at the location of the combined extended heat dissipation structure that contacts the heat sink 1 of the optical fiber body 33. Since the heat generation capacity of the chip 32 and the optical fiber body 33 is similar, thermal insulators 4 or thermal conductors 5 can be specifically provided on the heat sink 1 of the chip 32 and the heat sink 1 of the optical fiber body 33 as needed. The provision of thermal conductors 5 enables heat conduction between the chip 32 and the optical fiber body 33. Simultaneously, thermal conductors 5 are provided on the three sets of heat sinks 1 each containing chips 32, allowing heat to be conducted between them.

[0060] Optionally, the PCB board 31 is bonded to the heat dissipation plate 1 by means of thermally conductive adhesive.

[0061] In this embodiment, the PCB board 31 is directly bonded to the heat sink 1 by thermal conductive adhesive. The thermal conductive adhesive has a heat conductive effect, ensuring that the PCB board 31 can be quickly transferred to the heat sink 1 and further transferred to the external environment by convection heat dissipation through the heat conductive part 2.

[0062] Optionally, the heat conducting portion 2 is located on the outer wall of the side heat dissipation plate 1 .

[0063] In this embodiment, a heat conducting portion 2 is provided on four circumferentially arranged heat dissipation plates 1, and the heat conducting portion 2 adopts heat dissipation fins, thereby forming a "U-shaped" structure layout arrangement, so that all electrical components 3 are encapsulated inside the structure, isolated from the outside world, and have no direct contact, thereby improving space utilization and meeting the heat dissipation requirements of small lasers.

[0064] Please see the attached Figure 6 -Attached Figure 8 Optionally, the heat sink 1 equipped with the chip 32 is provided with a mounting boss 12 , and the chip 32 is disposed on the mounting boss 12 .

[0065] Specifically, mounting bosses 12 are integrally formed on the inner wall of heat sink 1. Made of the same material as heat sink 1, they ensure stable heat dissipation. They also serve to position chip 32, improving assembly efficiency and ensuring uniform colloid coating during encapsulation. Chip 32 is protected by a housing 13, which is secured to heat sink 1 using thermally conductive adhesive.

[0066] In this embodiment, by directly mounting the chip 32 on the mounting boss 12 before encapsulating the housing 13, the conventional fiber laser method of first encapsulating the pump source and then securing the encapsulated pump source to a cold plate for heat dissipation by welding or bonding can be avoided. This avoids the introduction of additional thermal resistance, improving heat transfer efficiency and heat dissipation.

[0067] Please see the attached Figure 10 Optionally, adjacent heat sinks 1 are connected via a plurality of fixing members 6 , and the fixing members 6 are connected to the inner walls of the heat sinks 1 .

[0068] Specifically, the fixing member 6 is a right-angle fixing plate. Two fixing members 6 are arranged between two adjacent groups of heat dissipation plates 1. The fixing member 6 can be detachably connected to the heat dissipation plate 1 through threaded fasteners, or can be fixed to the heat dissipation plate 1 through non-detachable methods such as welding.

[0069] In this embodiment, the fixing member 6 is provided to improve the stability of the overall heat dissipation structure, thereby preventing vibration factors from damaging the overall heat dissipation structure.

[0070] In this embodiment, the heat sink 1 is subjected to radiation-enhanced heat exchange through surface treatment, and the surface treatment methods include but are not limited to anodizing, spraying paint, electrophoresis treatment and other surface treatment processes to enhance the heat dissipation capacity of the radiator for external infrared radiation.

[0071] The second aspect of this embodiment also relates to a laser, which includes an electrical component 3 and the above heat dissipation structure.

[0072] The laser based on the above heat dissipation structure can not only achieve heat dissipation for the electrical component 3, but also, through the enclosed structural arrangement, the electrical component 3 is arranged inside the installation space 11, and the heat conducting portion 2 is arranged outside the installation space 11, effectively achieving improved heat dissipation through natural convection, thereby avoiding the influence of noise and vibration and improving the reliability of the laser. On the other hand, the enclosed structural design also centrally arranges the heat dissipation plate 1, improving the compactness of the laser, making the laser further miniaturized, and reducing the waste of system resource allocation and unnecessary energy consumption.

[0073] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: A heat dissipation plate (1), wherein a plurality of heat dissipation plates (1) are enclosed to form a plurality of installation spaces (11) for accommodating electrical components (3); an inner wall of the heat dissipation plate (1) is used to install the electrical components (3); a heat insulator (4) is provided between adjacent heat dissipation plates (1) corresponding to different electrical components (3) whose operating temperature difference is greater than a first preset temperature; and a heat conductor (5) is provided between adjacent heat dissipation plates (1) corresponding to different electrical components (3) whose operating temperature difference is less than a second preset temperature; the heat insulator (4) is used to prevent heat transfer between two adjacent heat dissipation plates (1); and the heat conductor (5) is used to enable heat transfer between two adjacent heat dissipation plates (1); A heat conducting portion (2), wherein at least a portion of the outer wall of the heat dissipation plate (1) is provided with the heat conducting portion (2), and the heat conducting portion (2) is used to transfer the heat generated by the electrical component (3) to the external environment through convection heat dissipation.

2. The heat dissipation structure according to claim 1, characterized in that: The surface of the electrical component (3) is attached to the wall surface of the heat dissipation plate (1) facing the installation space (11).

3. The heat dissipation structure according to claim 1, characterized in that: The heat conducting portion (2) comprises a plurality of heat conducting sheets formed by extending outward from the outer wall of the heat dissipation plate (1), and the plurality of heat conducting sheets are sequentially spaced apart.

4. The heat dissipation structure according to claim 3, characterized in that: A cover plate is provided on the side of the heat conducting portion (2) away from the heat dissipation plate (1) so as to form a convection channel between adjacent heat conducting plates.

5. The heat dissipation structure according to claim 1, characterized in that: The heat conducting portion (2) comprises a plurality of needle-shaped bodies arranged on the outer wall of the heat dissipation plate (1).

6. The heat dissipation structure according to claim 1, characterized in that: The heat conductor (5) is a layered body formed by applying a heat conducting medium between adjacent heat dissipation plates (1); and / or, The heat insulator (4) is a layered body formed by applying a heat insulating medium between adjacent heat dissipation plates (1).

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The six groups of heat dissipation plates (1) are combined to form a closed cubic shape. The electrical components (3) include one or more of a PCB (31), a chip (32), and an optical fiber body (33). The optical fiber body (33) and the PCB (31) are respectively arranged on two of the heat dissipation plates (1) that are arranged opposite to each other, and the chip (32) is arranged on one or more of the remaining heat dissipation plates (1).

8. The heat dissipation structure according to claim 7, characterized in that: The PCB board (31) is bonded to the heat dissipation plate (1) via heat-conducting adhesive.

9. The heat dissipation structure according to claim 7, characterized in that: The heat conducting portion (2) is located on the outer wall of the heat dissipation plate (1) on the side.

10. A laser, characterized in that: It comprises a plurality of electrical components (3) and a heat dissipation structure according to any one of claims 1 to 9.

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