Remodeling method and screen printing equipment

Abstract

The invention relates to the technical field of circuit board screen printing, and discloses a remodeling method and screen printing equipment, the remodeling method is used for circuit board screen printing, and the remodeling method comprises the steps of screen printing preparation, positioning and alignment. Silk-screen reconditioning: providing a silk-screen device, a circuit board and an image sensor, wherein the silk-screen device comprises a silk-screen table and a silk-screen net; positioning comprises first positioning and second positioning, in the first positioning, the circuit board is placed on a silk-screen printing table, coordinates of any two points on the circuit board are obtained and recorded through an image sensor, in the second positioning, coordinates of two points on a silk-screen printing net are obtained and recorded through the image sensor, and coordinates of any two points on the silk-screen printing table are obtained and recorded through the image sensor; the coordinates of the silk screen correspond to the coordinates of the circuit board; and aligning: enabling the coordinates of the two points of the circuit board to coincide with the coordinates of the two corresponding points of the silk screen respectively. According to the remodeling method, the alignment efficiency and precision of the circuit board and the silk screen can be improved, and the time consumed by alignment is shortened. The screen printing equipment with the remodeling method also has the advantages.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board silk screen printing, and in particular to a mold changing method and silk screen printing equipment. Background Art

[0002] During the production process of circuit boards, the circuit boards need to undergo processes such as silk screen printing of solder mask ink and character ink. At this time, the circuit boards and the silk screen need to be aligned to realize silk screen processing.

[0003] In the related art, since the circuit board and the silk screen are opaque structures, when aligning the circuit board and the silk screen, a transparent test print film is required as an alignment medium to align the circuit board and the silk screen with the transparent test print film respectively, so that the circuit board and the silk screen meet the alignment requirements. However, the existing method will consume a long time for alignment, resulting in low production efficiency. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a mold change method that can improve the alignment efficiency and accuracy of a circuit board and a screen printing screen and reduce the time consumed in the alignment.

[0005] The present invention also provides a screen printing device having the above-mentioned mold changing method.

[0006] According to the first aspect of the present invention, the mold conversion method is used for screen printing of circuit boards, and the mold conversion method includes the following steps: screen printing preparation: providing a screen printing device, a circuit board and an image sensor, and the screen printing device includes a screen printing table and a screen printing screen; positioning: including a first positioning and a second positioning, in the first positioning, the circuit board is placed on the screen printing table, and the coordinates of any two points on the circuit board are obtained and recorded by the image sensor, and in the second positioning, the coordinates of two points on the screen printing screen are obtained and recorded by the image sensor, and the coordinates of the screen printing screen correspond to the coordinates of the circuit board; alignment: making the coordinates of the two points on the circuit board coincide with the coordinates of the two points corresponding to the screen printing screen.

[0007] The mold change method according to an embodiment of the present invention has at least the following beneficial effects: the coordinates of corresponding points on the circuit board and the silk screen are sequentially acquired and recorded by an image sensor, and the position difference between the circuit board and the silk screen is obtained by using the coordinate values, so as to move the circuit board or the silk screen so that the coordinates of two points on the circuit board coincide with the coordinates of the two points corresponding to the silk screen, thereby achieving position alignment of the circuit board and the silk screen, thereby improving the alignment efficiency and accuracy of the circuit board and the silk screen, and reducing the time consumed by the alignment.

[0008] According to some embodiments of the present invention, in the positioning step, after obtaining and recording the coordinates of the circuit board, the silk screen is placed between the image sensor and the silk screen printing table along the first direction to obtain the coordinates of two points of the silk screen through the same image sensor.

[0009] According to some embodiments of the present invention, a silk screen pattern is provided on the side of the silk screen facing the circuit board, and the silk screen pattern corresponds to the circuit board. In the positioning step, after obtaining the coordinates of any two points on the circuit board, the coordinates of the silk screen pattern on the silk screen corresponding to the coordinate position of the circuit board are obtained.

[0010] According to some embodiments of the present invention, in the screen printing preparation step, a fixing member is further provided, the fixing member is connected to the screen printing table, and in the positioning step, the fixing member is connected to the circuit board and the screen printing table.

[0011] According to some embodiments of the present invention, the screen printing table is provided with a first through hole along a first direction, and the circuit board is provided with a second through hole. In the positioning step, the first through hole and the second through hole correspond to each other along the first direction, and the fixing member is provided at the first through hole and the second through hole.

[0012] According to some embodiments of the present invention, the screen printing table has a first side and a second side opposite to each other along the second direction, each of the first side and the second side has a plurality of the first through holes, the plurality of the first through holes are spaced apart along the second direction, and the first direction and the second direction intersect.

[0013] According to some embodiments of the present invention, in the silk screen preparation step, there are multiple circuit boards, and the multiple circuit boards are all provided with the same second through holes along the first direction. After the first circuit board completes the alignment step, the coordinates of the fixing part are obtained and recorded, and when the subsequent circuit boards perform the alignment step, the coordinates of the first through holes of the circuit boards and the fixing parts are made to correspond.

[0014] According to some embodiments of the present invention, the mold conversion method further includes a calculation step, which is provided between the positioning step and the alignment step, and the calculation step method includes: Make the coordinates of two points on the screen printing screen correspond to the coordinates of two points on the circuit board to form two sets of coordinates; Obtaining coordinate values ​​of the silk screen and the circuit board in the coordinate group in the same coordinate system; Calculate the difference between the point coordinates of the screen printing network and the point coordinates of the circuit board in the same coordinate system.

[0015] According to some embodiments of the present invention, in the alignment step, the silk screen printing device further includes a sliding member, which is connected to the silk screen printing table, and the silk screen printing table drives the circuit board to slide relative to the silk screen through the sliding member to overlap the coordinates of the circuit board and the silk screen.

[0016] According to the screen printing device of the second aspect embodiment of the present invention, the screen printing device includes a memory and a processor, the memory communicates with the processor, the memory stores a mold change program, and the processor executes the mold change program to implement the steps of the mold change method described in any of the above embodiments.

[0017] The silk screen printing device according to the embodiment of the present invention has at least the following beneficial effects: the memory is used to store the mold change program, so that when the circuit board needs to be changed and aligned, the mold change program can be executed by the processor to obtain the coordinates of the circuit board and the silk screen screen to align the circuit board and the silk screen screen.

[0018] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which: Figure 1 Schematic top view of a screen printing station and a circuit board in an embodiment of the present invention; Figure 2 A schematic top view of a screen printing station and a screen printing screen in an embodiment of the present invention; Figure 3 Schematic diagram of the process of the conversion method in an embodiment of the present invention; Figure 4 Schematic diagram of the calculation steps in an embodiment of the present invention.

[0020] Reference numerals: Screen printing station 100 ; first through hole 110 ; first side 120 ; second side 130 ; circuit board 200 ; second through hole 210 ; first point 220 ; second point 230 ; screen printing screen 300 ; third point 310 ; fourth point 320 ; fixing member 400 . DETAILED DESCRIPTION

[0021] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0022] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0023] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0026] The following describes the mold conversion method according to the first embodiment of the present invention and the screen printing device according to the second embodiment of the present invention with reference to the accompanying drawings. It should be noted that, for ease of description and understanding, in the embodiments of the present invention and the accompanying drawings, the up-down direction is indicated as the first direction, the left-right direction is indicated as the second direction, and the first and second directions intersect. In actual applications of the mold conversion method, the first and second directions may also be other directions.

[0027] The first embodiment of the present invention provides a method for changing the mold in the screen printing process of the circuit board 200. Figures 1 to 3 As shown, the conversion method includes the following steps.

[0028] S100, Screen Printing Preparation: Provide a screen printing device, a circuit board 200, and an image sensor. The screen printing device includes a screen printing table 100 and a screen printing screen 300. Specifically, when implementing the above-described conversion method, it is necessary to provide a screen printing device including the screen printing table 100 and screen printing screen 300, as well as the circuit board 200 to be printed and an image sensor. The image sensor is a high-resolution industrial camera, such as a CCD (charge-coupled device) camera or a CMOS (complementary metal oxide semiconductor) camera. The image sensor can accurately capture the position information of the marking points on the circuit board 200 and the screen printing screen 300.

[0029] S200, positioning: including the first positioning and the second positioning. In the first positioning, the circuit board 200 is placed on the screen printing table 100, and the coordinates of any two points on the circuit board 200 are obtained and recorded by the image sensor. In the second positioning, the coordinates of two points on the screen printing screen 300 are obtained and recorded by the image sensor. The coordinates of the screen printing screen 300 correspond to the coordinates of the circuit board 200.

[0030] Specifically, see Figure 1 and Figure 2 As shown, Figure 1 This is a top view of the connection between the screen printing station 100 and the circuit board 200. Figure 2 This is a top view after the silk screen 300 is installed. The positioning step S200 is performed in two steps: the first positioning step is to position the circuit board 200, and the second positioning step is to position the silk screen 300. In the first positioning step, the circuit board 200 is fixed to the silk screen printing table 100, and then the image sensor is used to capture two arbitrary points on the circuit board 200 and record their coordinates. For ease of understanding, the coordinates of the two reference points on the circuit board 200 are defined as the first point 220 (X1, Y1) and the second point 230 (X2, Y2). Among them, since the circuit board 200 and the silk screen 300 need to be aligned in the vertical direction, the position of the circuit board 200 and the silk screen 300 can be determined and aligned by the coordinates of two points. The two points selected are preferably the edges of the circuit board 200 or points clearly marked on the design to ensure the accuracy of subsequent operations. In other embodiments, the coordinates of any three, four, or other numerical features can also be obtained.

[0031] Subsequently, during the second positioning process, an image sensor is used to acquire and record the coordinates of two points on the screen printing screen 300. It should be noted that the screen printing screen 300 is a tool used to mark circuit components and conduct circuits on the circuit board 200. Each position on the screen printing screen 300 corresponds to a specific location on the circuit board 200, thereby ensuring the accuracy of the screen printing on the circuit board 200. Therefore, based on the position of any point on the circuit board 200, a corresponding position on the screen printing screen 300 can be found as a reference. The acquired coordinates of the two points on the screen printing screen 300 must correspond to the coordinates of the two reference points on the circuit board 200. For ease of understanding, the coordinates of the two reference points on the screen printing screen 300 are defined as the third point 310 (X3, Y3) and the fourth point 320 (X4, Y4). After the circuit board 200 and the screen printing screen 300 are aligned, the first point 220 ( X1 , Y1 ) corresponds to the third point 310 ( X3 , Y3 ), and the second point 230 ( X2 , Y2 ) corresponds to the fourth point 320 ( X4 , Y4 ).

[0032] S300, Alignment: Align the coordinates of two points on the PCB 200 with the corresponding coordinates of two points on the screen printing screen 300. Specifically, based on the coordinate data recorded in step S200 for the first point 220 (X1, Y1), the second point 230 (X2, Y2), the third point 310 (X3, Y3), and the fourth point 320 (X4, Y4), the positional deviation of the PCB 200 relative to the screen printing screen 300 is determined: namely, the difference between the first point 220 (X1, Y1) and the third point 310 (X3, Y3), and the difference between the second point 230 (X2, Y2) and the fourth point 320 (X4, Y4). The PCB 200 or screen printing screen 300 is then moved using a robot or other automated equipment until the coordinates of the two points on the PCB 200 completely align with the coordinates of the corresponding two points on the screen printing screen 300.

[0033] When the circuit board 200 is screen printed, the components and circuits to be marked on the circuit boards 200 of different processing models are different, and the sizes of the circuit boards 200 are also different. Therefore, when replacing circuit boards 200 of different models, it is necessary to realign the circuit board 200 and the silk screen 300. Since the circuit board 200 and the silk screen 300 are opaque structures, the circuit board 200 and the silk screen 300 cannot be directly aligned when they are stacked together in the up and down directions. In the related art, it is necessary to use a transparent test print film as an alignment intermediary to align the same position of the circuit board 200 and the silk screen 300 with the transparent test print film, thereby indirectly aligning the circuit board 200 and the silk screen 300 so that the circuit board 200 and the silk screen 300 meet the alignment requirements. However, this method will result in a longer time consumed for alignment, and the silk screen printing efficiency of the circuit board 200 is low.

[0034] Compared with the above-mentioned related technologies, the conversion method of the embodiment of the present invention uses an image sensor to sequentially obtain and record the coordinates of corresponding points on the circuit board 200 and the silk screen 300, and uses the coordinate values ​​to obtain the position difference between the circuit board 200 and the silk screen 300, thereby moving the circuit board 200 or the silk screen 300 so that the coordinates of two points on the circuit board 200 coincide with the coordinates of the two points corresponding to the silk screen 300, thereby achieving position alignment of the circuit board 200 and the silk screen 300, thereby improving the alignment efficiency and accuracy of the circuit board 200 and the silk screen 300 and reducing the time consumed by the alignment.

[0035] In some embodiments, see Figures 1 to 3 As shown, in the positioning step S200, after acquiring and recording the coordinates of the circuit board 200, the screen printing screen 300 is positioned vertically between the image sensor and the screen printing table 100, so that the coordinates of the screen printing screen 300 can be acquired by the same image sensor. Specifically, during the screen printing process, the screen printing screen 300 and the circuit board 200 are arranged facing each other, so that after the screen printing screen 300 moves relative to the circuit board 200, the markings (such as characters or circuits) to be marked can be imprinted on the circuit board 200. In this embodiment, the image sensor is positioned vertically above the circuit board 200. After acquiring the coordinates of the circuit board 200, the screen printing screen 300 is then positioned vertically between the circuit board 200 and the image sensor, so that the coordinates of the screen printing screen 300 can be acquired by the same image sensor. This prevents the image sensor from obstructing the movement of the screen printing screen 300 and facilitates the image sensor to capture the circuit board 200 and the screen printing screen 300 separately. It should be noted that the number of image sensors is not limited to one. The image sensor used for the circuit board 200 and the silk screen 300 can be the same image sensor, or a group of (at least two) image sensors. Using the same image sensor to capture images of the circuit board 200 and the silk screen 300 can reduce the accumulation of errors caused by replacing or adjusting the image sensor, thereby improving the accuracy and stability of coordinates acquired by the image sensor.

[0036] In some embodiments, see Figures 1 to 3 As shown, the side of the screen printing screen 300 facing the circuit board 200 is provided with a specific silk screen pattern. The screen printing screen 300 uses the silk screen pattern to mark characters, circuits, and other marks on the circuit board 200. The silk screen pattern corresponds to the circuit board 200, so that the screen printing screen 300 can accurately print on the circuit board 200 during the silk screen printing process.

[0037] Specifically, the silk-screen pattern of the silk-screen screen 300 needs to be aligned with a specific position on the circuit board 200 so that the silk-screen pattern of the silk-screen screen 300 can be accurately printed on the circuit board 200. Therefore, in the positioning step S200, based on the reference of obtaining the coordinates of two points on the circuit board 200, the silk-screen pattern at two reference points on the silk-screen screen 300 corresponding to the circuit board 200 is obtained by the image sensor. This ensures that after the circuit board 200 and the silk-screen screen 300 are moved, the coordinates of the two reference points on the circuit board 200 can coincide with the corresponding silk-screen pattern, thereby ensuring the accuracy of the silk-screen operation.

[0038] In some embodiments, see Figure 1 and Figure 2 As shown, in the screen printing preparation step S100, in addition to providing the screen printing device, the circuit board 200 and the image sensor, a fixing member 400 is also required. The fixing member 400 is used to ensure that the circuit board 200 can be firmly connected to the screen printing table 100, thereby avoiding errors caused by the movement of the circuit board 200 during the positioning step S200 and the alignment step S300. Figure 1 and Figure 2 This is a top view of the silk screen printing process.

[0039] Specifically, in the positioning step S200, the circuit board 200 is first placed on the screen printing table 100, and the circuit board 200 is fixed at a predetermined position using the fixing parts 400, such as setting fixing points at the four corners or edges of the circuit board 200, and fixing the circuit board 200 to the screen printing table 100 through the fixing parts 400, so that the screen printing table 100 and the circuit board 200 are integrated, thereby ensuring the stability of the circuit board 200 in the positioning step S200 and the alignment step S300, and also helping to improve the accuracy of the image sensor in obtaining the coordinates of the circuit board 200.

[0040] In some embodiments, the fixing member 400 can be a clamp, a magnetic member, a vacuum adsorption device or other forms of fastening devices. In an embodiment of the present invention, the fixing member 400 is a pin. The screen printing table 100 is provided with a first through hole 110 in the up-down direction, and the circuit board 200 is provided with a corresponding second through hole 210 in the up-down direction. In the positioning step S200, the first through hole 110 and the second through hole 210 are made to correspond to each other in the up-down direction, and then the fixing member 400 is used to pass through the first through hole 110 and the second through hole 210, thereby achieving the positioning and connection fixation between the circuit board 200 and the screen printing table 100.

[0041] Specifically, in actual operation, the circuit board 200 needs to be placed on the screen printing table 100, aligning the second through-hole 210 on the circuit board 200 with the first through-hole 110 on the screen printing table 100. Then, the fixing member 400 (pin) is inserted and fixed in the first through-hole 110 and the second through-hole 210 to prevent the circuit board 200 from moving. This not only simplifies the installation process of the circuit board 200, but also improves the positioning accuracy of the circuit board 200.

[0042] Further, in some embodiments, see Figure 1 and Figure 2 As shown, the screen printing table 100 has a first side 120 and a second side 130 arranged opposite to each other along the left and right directions. The first side 120 and the second side 130 are both provided with a plurality of first through holes 110. The first through holes 110 on the first side 120 and the second side 130 are arranged at intervals along the left and right directions.

[0043] In detail, the conversion method provided by the present invention is to solve the problem of alignment of different circuit boards 200 and screen printing screens 300. During the screen printing process, the screen printing station 100 needs to be connected to circuit boards 200 of various sizes, so that the circuit boards 200 are fixed on the screen printing station 100 to be aligned with the screen printing screen 300. A plurality of first through holes 110 are provided on the first side 120 and the second side 130 of the screen printing station 100, and the plurality of first through holes 110 are spaced apart in the left and right directions, so that when the screen printing station 100 processes circuit boards 200 of different sizes, it is possible to select a suitable combination of first through holes 110 for fixing according to the actual size and layout of the circuit boards 200, thereby expanding the applicability of the screen printing station 100 and improving the adaptability and flexibility of the screen printing device.

[0044] Further, see Figures 1 to 3 As shown, in some embodiments, considering the needs of mass production, in the silk screen preparation step S100, it is necessary to prepare multiple circuit boards 200, and the multiple circuit boards 200 are all provided with the same second through holes 210 along the vertical direction, that is, the second through holes 210 of the multiple circuit boards 200 are the same in size and position. This ensures that all circuit boards 200 can be accurately positioned and fixed using the same fixing member 400.

[0045] During operation, the first circuit board 200 is selected to perform a complete positioning step S200 and alignment step S300. First, the first circuit board 200 is placed on the screen printing table 100, and the second through hole 210 on the circuit board 200 is aligned with the first through hole 110 on the screen printing table 100, and then fixed with the fixing part 400. Next, the coordinates of any two points on the circuit board 200 and the coordinates of the screen printing table 100 are acquired and recorded by the image sensor. Then the circuit board 200 is moved relative to the screen printing table 100 to achieve coordinate alignment, and finally the position coordinates of the fixing part 400 relative to the screen printing table 100 are acquired. This step method provides reference data for the subsequent rapid positioning of the circuit board 200.

[0046] Specifically, when the circuit board 200 undergoes the silk screen printing process, more than one circuit board 200 needs to be aligned. After one of the multiple circuit boards 200 is aligned and completes the silk screen printing process, another circuit board 200 needs to be rotated to undergo the silk screen printing process. After completing the alignment step S300 of the first circuit board 200, the image sensor will save the position coordinates of the fixing part 400 on the silk screen table 100. For each subsequent circuit board 200, before performing the alignment step S300, it is only necessary to align the second through hole 210 of the circuit board 200 with the recorded coordinates of the fixing part 400, thereby simplifying the alignment process of the second circuit board 200 and each subsequent circuit board 200. Because the position of the fixing part 400 has been obtained and recorded, it is no longer necessary to recalculate or adjust the position of the circuit board 200 every time in the circuit boards 200 that undergo the silk screen printing process in the same batch.

[0047] In actual operation, the first circuit board 200 is placed on the screen printing table 100, with the second through-holes 210 aligned with the first through-holes 110, and secured with the fixture 400. After completing the alignment step S300 for the first circuit board 200, the position coordinates of the fixture 400 relative to the screen printing table 100 are recorded and the coordinate data of the fixture 400 is saved. When positioning subsequent circuit boards 200, the second through-holes 210 of the circuit board 200 are aligned with the fixture 400 and secured according to the saved coordinates of the fixture 400, thereby achieving alignment of the circuit boards 200 and improving screen printing efficiency of the circuit boards 200.

[0048] In some embodiments, see Figures 1 to 4 As shown, in order to achieve accurate alignment between the circuit board 200 and the screen printing screen 300, a calculation step S400 is introduced between the positioning step S200 and the alignment step S300. The method of the calculation step S400 includes: S401, making the coordinates of two points of the screen printing screen 300 correspond to the coordinates of two points of the circuit board 200, so as to form two sets of coordinates; S402, obtaining coordinate values ​​of the screen printing screen 300 and the circuit board 200 in the coordinate group in the same coordinate system; S403 , calculating the difference between the point coordinates of the screen printing screen 300 and the point coordinates of the circuit board 200 in the same coordinate system.

[0049] Specifically, as previously mentioned, the coordinates of the two reference points on the circuit board 200 are the first point 220 (X1, Y1) and the second point 230 (X2, Y2), respectively. The coordinates of the two reference points on the screen printing screen 300 are the third point 310 (X3, Y3) and the fourth point 320 (X4, Y4), respectively. In method S401, the coordinates of the two points on the screen printing screen 300 are matched with the coordinates of the two points on the circuit board 200 to form two coordinate groups. For example, if the first point 220 (X1, Y1) and the third point 310 (X3, Y3) correspond to each other, the first point 220 (X1, Y1) and the third point 310 (X3, Y3) are defined as the first coordinate group. If the second point 230 (X2, Y2) and the fourth point 320 (X4, Y4) correspond to each other, the second point 230 (X2, Y2) and the fourth point 320 (X4, Y4) are defined as the second coordinate group.

[0050] Next, coordinate values ​​within the same coordinate system are obtained for the coordinate groups. Specifically, the values ​​of X1 and X3, and Y1 and Y3 are obtained for the first coordinate group, and the values ​​of X2 and X4, and Y2 and Y4 are obtained for the second coordinate group. The differences between X1 and X3, Y1 and Y3, X2 and X4, and Y2 and Y4 are calculated and used as the basis for subsequent motion adjustments of the circuit board 200 and the screen printing screen 300, thereby achieving alignment of the circuit board 200 and the screen printing screen 300.

[0051] Further, in some embodiments, see Figures 1 to 4 As shown, in the alignment step S300, the screen printing device is equipped with a slider connected to the screen printing table 100, enabling the screen printing table 100 to move the circuit board 200 placed thereon in translation relative to the fixed screen printing screen 300. The slider enables the screen printing table 100 to provide precise linear movement in the left-right and front-back directions, thereby aligning the coordinates of the circuit board 200 and the screen printing screen 300. The provision of the slider improves the efficiency and accuracy of the movement of the circuit board 200.

[0052] In practice, once calculation step S400 is complete and the precise positional deviation of the circuit board 200 relative to the screen printing screen 300 is determined, the screen printing device's control system will use this data to instruct the slider to drive the screen printing table 100 to make corresponding adjustments. For example, if the calculation results indicate that the circuit board 200 needs to move rightward and upward to align with the screen printing screen 300, the screen printing device's control system will control the slider to perform these operations, thereby aligning the circuit board 200 and the screen printing screen 300.

[0053] The second embodiment of the present invention provides a screen printing device. Figures 1 to 4 As shown, the screen printing device includes a memory and a processor, wherein the processor communicates with the memory, which is a computer-readable storage medium. The memory stores a die conversion program, which is a computer program that executes the steps of the method described in any of the above embodiments. When screen printing is required on circuit board 200, the processor reads the contents of the memory and executes the die conversion program in the memory to implement the steps of the die conversion method described in any of the above embodiments.

[0054] The silk screen printing device of the embodiment of the present invention uses a memory to store a mold change program, so that when the circuit board 200 needs to be changed and aligned, the mold change program can be executed by the processor to obtain the coordinates of the circuit board 200 and the silk screen screen 300 to align the circuit board 200 and the silk screen screen 300, thereby improving the alignment efficiency and accuracy of the circuit board 200 and the silk screen screen 300, and promoting the speed of the silk screen printing process of the circuit board 200.

[0055] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A conversion method for screen printing of circuit boards, characterized in that: The conversion method comprises the following steps: Silk screen preparation: providing silk screen equipment, circuit boards and image sensors. The silk screen equipment includes a silk screen printing table and a silk screen printing screen. Positioning: including a first positioning and a second positioning. In the first positioning, the circuit board is placed on the screen printing table, and the coordinates of any two points on the circuit board are acquired and recorded by the image sensor. In the second positioning, the coordinates of two points on the screen printing net are acquired and recorded by the image sensor. The coordinates of the screen printing net correspond to the coordinates of the circuit board. Alignment: Make the coordinates of two points on the circuit board coincide with the coordinates of two points corresponding to the screen printing network.

2. The mold conversion method according to claim 1, characterized in that: In the positioning step, after obtaining and recording the coordinates of the circuit board, the screen printing screen is positioned between the image sensor and the screen printing table along a first direction, so as to obtain the coordinates of two points of the screen printing screen through the same image sensor.

3. The mold conversion method according to claim 1, characterized in that: A silk screen pattern is provided on the side of the silk screen facing the circuit board, and the silk screen pattern corresponds to the circuit board. In the positioning step, after obtaining the coordinates of any two points on the circuit board, the coordinates of the silk screen pattern corresponding to the coordinate position of the circuit board on the silk screen are obtained.

4. The mold conversion method according to claim 1, characterized in that: In the step of preparing for silk screen printing, a fixing member is further provided, and the fixing member is connected to the silk screen printing table. In the step of positioning, the fixing member is connected to the circuit board and the silk screen printing table.

5. The mold conversion method according to claim 4, characterized in that: Along the first direction, the screen printing table is provided with a first through hole, and the circuit board is provided with a second through hole. In the positioning step, the first through hole and the second through hole correspond to each other along the first direction, and the fixing member is provided in the first through hole and the second through hole.

6. The mold changing method according to claim 5, characterized in that: The screen printing platform has a first side and a second side opposite to each other along a second direction. The first side and the second side each have a plurality of first through holes. The plurality of first through holes are spaced apart along the second direction. The first direction and the second direction intersect.

7. The mold conversion method according to claim 5, characterized in that: In the silk screen preparation step, there are multiple circuit boards, and the multiple circuit boards are all provided with the same second through holes along the first direction. After the first circuit board completes the alignment step, the coordinates of the fixing part are obtained and recorded. When the subsequent circuit boards perform the alignment step, the coordinates of the first through holes of the circuit boards and the fixing parts are made to correspond.

8. The mold conversion method according to claim 1, characterized in that: The conversion method further includes a calculation step, which is provided between the positioning step and the alignment step. The calculation method includes: Make the coordinates of two points on the screen printing screen correspond to the coordinates of two points on the circuit board to form two sets of coordinates; Obtaining coordinate values ​​of the silk screen and the circuit board in the coordinate group in the same coordinate system; Calculate the difference between the point coordinates of the screen printing network and the point coordinates of the circuit board in the same coordinate system.

9. The mold conversion method according to claim 8, characterized in that: In the alignment step, the screen printing device further includes a sliding member connected to the screen printing table. The screen printing table drives the circuit board to slide relative to the screen printing screen through the sliding member to overlap the coordinates of the circuit board and the screen printing screen.

10. Screen printing equipment, characterized in that, include: A memory and a processor, wherein the memory communicates with the processor, a conversion program is stored in the memory, and the processor executes the conversion program to implement the steps of the conversion method according to any one of claims 1 to 9.

Images