Display panel and preparation method thereof

Abstract

The invention relates to a display panel. The display panel comprises a display area and a non-display area, the driving circuit layer is located on the substrate base plate; the first conductive bonding pads are located on the side, away from the driving circuit layer, of the substrate, the driving circuit layer is electrically connected with the first conductive bonding pads through connecting wires in the display area, and the first conductive bonding pads are sequentially and annularly arranged; an annular opening is formed in the surface of the first side of the substrate in the display area, the annular opening exposes the multiple first conductive pads, and the first conductive pads are used for being bonded with an external circuit board on the first side of the substrate. A high-resolution and narrow-frame display panel can be realized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] With the continuous development of display technology, display products have become an indispensable part of people's daily life, and people's requirements for the performance and appearance of display products are getting higher and higher. For example, high resolution, narrow bezel, high screen-to-body ratio and other performance have become the mainstream development direction of display products. Summary of the Invention

[0003] Based on this, it is necessary to provide a display panel and a manufacturing method thereof that can realize a high-resolution, narrow-frame display panel.

[0004] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0005] Display area and non-display area;

[0006] A base substrate and a driving circuit layer located on the base substrate;

[0007] a plurality of first conductive pads, the first conductive pads being located on a side of the base substrate away from the driving circuit layer, the driving circuit layer being electrically connected to the first conductive pads via connecting wires within the display area, the plurality of first conductive pads being sequentially arranged in a ring shape;

[0008] An annular opening is formed on the first side surface of the base substrate in the display area, and the annular opening exposes the plurality of first conductive pads, wherein the first conductive pads are used for bonding to an external circuit board on the first side of the base substrate.

[0009] In one embodiment, it further includes:

[0010] The circuit board is a flexible circuit board, and the flexible circuit board includes a plurality of second conductive pads;

[0011] On the first side of the base substrate, each of the first conductive pads is bonded to a corresponding one of the second conductive pads.

[0012] In one embodiment, the first conductive pad and the second conductive pad are bonded by nano silver glue.

[0013] In one embodiment, on the first side of the base substrate, the surface of the base substrate in the area enclosed by the annular opening is adhered to the surface of the flexible circuit board in the area other than the second conductive pad.

[0014] In one embodiment, the surface of the substrate and the surface of the flexible circuit board are bonded together by a pressure-sensitive adhesive.

[0015] In one embodiment, the pressure sensitive adhesive comprises an aerosol.

[0016] In one embodiment, the thickness of the pressure-sensitive adhesive is less than 30 μm.

[0017] In one embodiment, the thickness of the nano silver paste between the first conductive pad and the second conductive pad is 15 μm to 30 μm.

[0018] In one embodiment, it further includes:

[0019] a backplane film, located on a first side of the base substrate;

[0020] The backplane film in the display area includes an opening, and the opening of the backplane film penetrates the backplane film;

[0021] The orthographic projection of the annular opening, the orthographic projection of the base substrate in the area enclosed by the annular opening, and the orthographic projection of the flexible circuit board are all located within the orthographic projection of the opening of the backplane film.

[0022] In one embodiment, the base substrate includes a first organic layer, a first inorganic layer, a second inorganic layer, and a second organic layer stacked in sequence;

[0023] The connecting line is located between the first inorganic layer and the second inorganic layer;

[0024] The annular opening is located in the first organic layer, and the annular opening passes through the first organic layer.

[0025] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, for manufacturing the display panel as described in the first aspect above, wherein the display panel includes a display area and a non-display area, the method comprising:

[0026] Providing a base substrate, and forming a driving circuit layer and a plurality of first conductive pads on the base substrate, wherein the first conductive pads are located on a side of the base substrate away from the driving circuit layer, the driving circuit layer is electrically connected to the first conductive pads via connecting lines in the display area, and the plurality of first conductive pads are arranged in a ring shape, wherein a first side surface of the base substrate in the display area is provided with a ring-shaped opening, the ring-shaped opening exposing the plurality of first conductive pads;

[0027] providing a flexible circuit board, the flexible circuit board comprising a plurality of second conductive pads;

[0028] On the first side of the base substrate, a pressure-sensitive adhesive is applied to the surface of the base substrate in the area enclosed by the annular opening, and the surface of the base substrate in the area enclosed by the annular opening is bonded to the surface of the flexible circuit board in the area other than the second conductive pad by the pressure-sensitive adhesive;

[0029] Nano-silver glue is dispensed between the first conductive pad and the corresponding second conductive pad to bond the first conductive pad to the second conductive pad via the nano-silver glue.

[0030] The above-mentioned display panel and its preparation method include a plurality of first conductive pads, which are located on a side of the base substrate away from the driving circuit layer. The first conductive pads are electrically connected to the driving circuit layer through the connecting wires in the display area, and the plurality of first conductive pads are arranged in a ring in sequence. Based on this, a ring-shaped opening is provided on the surface of the first side of the base substrate in the display area, and the ring-shaped opening exposes the plurality of first conductive pads. The first conductive pads are used to bond with an external circuit board on the first side of the base substrate. In the embodiment of the present application, a plurality of first conductive pads arranged in a ring in sequence are arranged in the ring opening of the base substrate in the display area, so that the first conductive pads are transferred from the lower frame area in the non-display area to the display area while being arranged in a ring, which is effective. The setting space of the first conductive pad is increased, so that a larger number of first conductive pads can be set, and a larger number of first conductive pads can be connected to a larger number of signal lines, and a larger number of signal lines can provide signals for a larger number of pixels, thereby enabling the display panel to have a higher resolution and saving the area of ​​the lower frame area, so that the lower frame can be narrowed to achieve a narrow lower frame, which is conducive to achieving a high screen-to-body ratio; and, compared with the signal line extending to the lower frame area to achieve connection with the first conductive pad, the signal line routing is also easier; and, since the setting space of the first conductive pad is effectively increased, the area of ​​each first conductive pad can be set larger, which is conducive to reducing impedance and achieving highly reliable signal transmission, thereby improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 This is a schematic diagram of a top view of the back side of a display panel according to an embodiment;

[0033] Figure 2 A display panel according to an embodiment of the present invention is provided along Figure 1 One of the cross-sectional structural diagrams of the CC' line shown;

[0034] Figure 3 The driving circuit layer of an embodiment is along Figure 1 Schematic diagram of the cross-sectional structure of the CC' line shown;

[0035] Figure 4 Schematic diagram of the front top view structure of a display panel in the related art;

[0036] Figure 5 A display panel according to an embodiment of the present invention is provided along Figure 1 The second schematic diagram of the cross-sectional structure along line CC' is shown;

[0037] Figure 6 A display panel according to an embodiment of the present invention is provided along Figure 1 The third schematic diagram of the cross-sectional structure along the CC' line;

[0038] Figure 7 A display panel according to an embodiment of the present invention is provided along Figure 1 The fourth schematic diagram of the cross-sectional structure along the CC' line is shown;

[0039] Figure 8 The display panel manufacturing method of an embodiment involves the display panel along the Figure 1 One of the cross-sectional structural diagrams of the CC' line shown;

[0040] Figure 9 The display panel manufacturing method of an embodiment involves the display panel along the Figure 1 The second schematic diagram of the cross-sectional structure along the CC' line is shown.

[0041] Explanation of the accompanying drawings: AA-display area, NA-non-display area, 10-base substrate, 11-annular opening, 20-first conductive pad, 30-connecting line, 40-driving circuit layer, 50-circuit board, 51-second conductive pad, 60-nanosilver glue, 70-pressure-sensitive adhesive, 80-backplane film, 81-opening of the backplane film 80, 101-first organic layer, 102-first inorganic layer, 103-second inorganic layer, 104-second organic layer. DETAILED DESCRIPTION

[0042] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0044] It will be understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor without departing from the scope of this application. The first resistor and the second resistor are both resistors, but they are not the same resistor.

[0045] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0046] It is understood that “at least one” refers to one or more, “a plurality” refers to two or more, and “at least a portion of an element” refers to a portion or all of an element.

[0047] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0048] In an exemplary embodiment, in combination Figure 1 and Figure 2 , provides a display panel, the display panel is, for example but not limited to, an organic light emitting diode (OLED) display panel; the display panel includes a display area AA and a non-display area NA that is at least partially arranged around the display area AA. The specific position setting relationship between the non-display area NA and the display area AA is not limited in the embodiment of the present application; the display panel includes a base substrate 10 and a driving circuit layer 40 located on the base substrate 10.

[0049] The base substrate 10 is used to support and protect the entire display panel. The base substrate 10 is a flexible substrate. Exemplarily, the flexible substrate may include a silicon substrate (Si substrate), a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate diformic acid glycol ester (PEN) substrate, or a polyimide (PI) substrate. The base substrate 10 may be a single-layer structure or a multi-layer structure; for example, the base substrate 10 may include at least one flexible substrate and at least one buffer layer, wherein the flexible substrate and the buffer layer are alternately stacked.

[0050] Exemplarily, the driving circuit layer 40 may include multiple conductive traces and multiple pixel driving circuits arranged in an array. Each pixel driving circuit is electrically connected to at least one light-emitting element to control the lighting time and brightness of the light-emitting element. The light-emitting element is, for example, but not limited to, an OLED device. Specifically, the pixel driving circuit may be electrically connected to the anode of the OLED device. The pixel driving circuit may include a capacitor and multiple thin film transistors (TFTs). Figure 3 As just one example, the driving circuit layer 40 may include: an active layer ACT of a thin film transistor, located on a side of the buffer layer Buffer away from the base substrate 10; a gate insulating layer G1, located on a side of the active layer ACT away from the base substrate 10; a first electrode of the capacitor and a gate G of the thin film transistor, located on a side of the gate insulating layer GI away from the base substrate 10; an interlayer dielectric layer ILD, located on a side of the first electrode and gate G of the capacitor away from the gate insulating layer GI; a second electrode of the capacitor and a source S and a drain D of the thin film transistor, located on a side of the interlayer dielectric layer ILD away from the first electrode and gate G of the capacitor; a passivation layer PVX, located on a side of the second electrode and the source S and drain D of the capacitor away from the interlayer dielectric layer ILD; a conductive wiring layer, for example but not limited to, located on a side of the passivation layer PVX away from the base substrate 10, the conductive wiring layer can be used to set various types of signal lines, such as but not limited to data lines, power lines, etc.

[0051] The display panel may further include a light-emitting functional layer, which is located on a side of the drive circuit layer 40 away from the base substrate 10. The light-emitting functional layer is used to form a light-emitting element, such as, but not limited to, an OLED device. A planarization layer PLN may be provided between the drive circuit layer 40 and the light-emitting functional layer. The planarization layer PLN is used to planarize the drive circuit layer 40. A pixel definition layer PDL may also be provided between the planarization layer PLN and the light-emitting functional layer. The pixel definition layer PDL is used to define the opening size and shape of the OLED device.

[0052] For example, the light-emitting functional layer may include an anode layer, a light-emitting layer, and a cathode layer. The anode layer may include multiple anodes spaced apart from each other, wherein each OLED device includes one anode. The light-emitting layer may include a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer (OLED), an electron transport layer (ETL), an electron injection layer (EIL), and the like. In other examples, such as in a tandem OLED device, the light-emitting layer may further include a charge generation layer (CGL). The cathode layer may be provided over the entire surface.

[0053] The display panel also includes a plurality of first conductive pads 20, which are located on a side of the base substrate 10 away from the driving circuit layer 40. The driving circuit layer 40 is electrically connected to the first conductive pads 20 via a connecting line 30 within the display area AA. The plurality of first conductive pads 20 are arranged in a ring shape. Based on this, a ring-shaped opening 11 is provided on the surface of the first side of the base substrate 10 within the display area AA, exposing the plurality of first conductive pads 20. The first conductive pads 20 are used to bond to an external circuit board 50 on the first side of the base substrate 10.

[0054] For example, the signal line in the display area AA is connected to the first conductive pad 20 via the connecting line 30. The signal line receives the signal transmitted by the external circuit board 50 through the first conductive pad 20. The external circuit board 50 is, for example, but not limited to, a COF (Chip On Film) or an FPC (Flexible Printed Circuit). The "ring" can be a regular ring or an irregular ring; regular rings include circular rings, elliptical rings, rectangular rings, and other polygonal rings. Figure 1 A rectangular ring is shown as an example. The ring-shaped opening 11 can be formed on the surface of the first side of the substrate 10 using, but is not limited to, a laser grooving process. The first side of the substrate 10 can be understood as the side of the substrate 10 away from the driving circuit layer 40, or the back side of the substrate 10.

[0055] In this application embodiment, comparison Figure 1 and Figure 4In the annular opening 11 of the base substrate 10 in the display area AA, a plurality of first conductive pads 20 are arranged in an annular pattern in sequence, so that the first conductive pads 20 are transferred from the lower frame area in the non-display area NA to the display area AA while being arranged in an annular pattern. This effectively increases the setting space of the first conductive pads 20, so that a larger number of first conductive pads 20 can be set. A larger number of first conductive pads 20 can be connected to a larger number of signal lines, and a larger number of signal lines can provide signals for a larger number of pixels. This can enable the display panel to have a higher resolution and save the area of ​​the lower frame area at the same time, so that the lower frame can be narrowed to achieve a narrow lower frame, which is conducive to achieving a high screen-to-body ratio; and compared with the signal line extending to the lower frame area to achieve connection with the first conductive pads 20, signal line routing is also easier; and since the setting space of the first conductive pads 20 is effectively increased, the area of ​​each first conductive pad 20 can be set larger, which is conducive to reducing impedance, achieving highly reliable signal transmission, and thus improving the display effect.

[0056] In an exemplary embodiment, referring to Figure 5 The display panel also includes a circuit board 50, which is, for example but not limited to, a COF or an FPC. The circuit board 50 includes a plurality of second conductive pads 51. On the first side of the base substrate 10, each first conductive pad 20 is bonded to a corresponding second conductive pad 51.

[0057] For example, the circuit board 50 is used to transmit the signals required for display to the signal lines via the second conductive pads 51. In this embodiment of the present application, an annular opening 11 is provided on the back surface of the base substrate 10 within the display area AA. The first conductive pads 20 are transferred from the lower border region within the non-display area NA to be arranged in an annular shape within the annular opening 11. Thus, the circuit board 50 is bonded to the back surface of the base substrate 10 based on the first conductive pads 20, achieving a narrow lower border of the display panel.

[0058] Optionally, the first conductive pad 20 and the second conductive pad 51 are bonded together using nanosilver glue 60. IJP / EHD high-precision dispensing equipment can be used to dispense dots of nanosilver glue 60 between the first conductive pad 20 and the second conductive pad 51, thereby achieving reliable bonding between the first conductive pad 20 and the second conductive pad 51. The use of nanosilver glue 60 not only provides excellent conductivity but also reduces the relative offset between the first conductive pad 20 and the second conductive pad 51, with an offset accuracy of less than 5μm, reducing the risk of misalignment during bonding. The nanosilver glue 60 dots can be cured at either room temperature or high temperature. High-temperature curing can be performed at a temperature below 85°C to ensure good conductivity of the nanosilver glue 60 and adhesion between the first conductive pad 20 and the second conductive pad 51, preventing peeling.

[0059] Optionally, the thickness of the nano silver paste 60 between the first conductive pad 20 and the second conductive pad 51 is 15 μm to 30 μm, so as to ensure reliable bonding between the first conductive pad 20 and the second conductive pad 51 .

[0060] Optionally, the width of the nano silver paste 60 between the first conductive pad 20 and the second conductive pad 51 is 15 μm to 30 μm to ensure reliable bonding between the first conductive pad 20 and the second conductive pad 51 while avoiding conduction between two adjacent first conductive pads 20 .

[0061] In an exemplary embodiment, referring to Figure 5 On the first side of the base substrate 10, the surface of the base substrate 10 in the area enclosed by the annular opening 11 is adhered to the surface of the circuit board 50 in the non-second conductive pad area, so that the circuit board 50 is reliably fixed on the back side of the base substrate 10.

[0062] Optionally, the surface of the base substrate 10 and the surface of the circuit board 50 are adhered to each other via a pressure-sensitive adhesive 70 to ensure the firmness between the circuit board 50 and the base substrate 10 .

[0063] Optionally, the pressure-sensitive adhesive 70 includes at least one of aerosol, epoxy adhesive and glue.

[0064] Among them, the use of aerosol is conducive to heat dissipation, avoiding temperature concentration on the base substrate 10 during the bonding process or during the use of the display panel, ensuring that the temperature of the display panel is within a safe temperature range. The thickness of the aerosol can be less than 30μm, which can ensure both firmness and a thin thickness of the display panel. The use of epoxy glue can reduce the amount of slip between the base substrate 10 and the circuit board 50. The thickness of the epoxy glue can be less than or equal to 10um, which can ensure both sliding accuracy and firmness and a thin thickness of the display panel. The use of glue can reduce film printing caused by pressure. The thickness of the glue can be less than 30μm, which can ensure both the smoothness of the structure of the display panel and firmness and a thin thickness of the display panel.

[0065] In an exemplary embodiment, referring to Figure 6 The display panel also includes a backplane film 80, which is located on the first side of the base substrate 10. The backplane film 80 in the display area AA includes an opening 81, and the opening 81 of the backplane film 80 passes through the backplane film 80; wherein, the orthographic projection of the annular opening 11, the orthographic projection of the base substrate 10 in the area enclosed by the annular opening 11, and the orthographic projection of the circuit board 50 are all located within the orthographic projection of the opening 81 of the backplane film 80, so that after the circuit board 50 is bonded, the back of the display panel is relatively flat.

[0066] Among them, the backplane film 80 can play a protective and supporting role for the display panel. The backplane film 80 usually includes a main body and a protective film attached to the main body. The protective film plays a protective role for the main body. The protective film is removable. When the protective film is not needed, the protective film can be torn off. When the protective film is needed, it can be left attached to the main body. The backplane film 80 arranged on the back of the base substrate 10 can be the main body of the backplane film 80, or it can be the main body and the protective film. The opening 81 can be located in the main body, and the opening 81 can pass through the main body. Of course, the opening 81 can also pass through the protective film. Before tearing off the protective film, the main body can be pre-processed, for example, part of the main body can be cut in advance, so that the part of the main body that is cut in the process of tearing off the protective film is taken away by the protective film, thereby forming an opening 81 on the main body, thereby simplifying the process. Of course, it is also possible to tear off the protective film first, and then after the main body is attached to the back of the base substrate 10, the main body is cut to form an opening 81 that passes through the main body. Alternatively, after the backsheet film 80 is attached to the back of the base substrate 10 , the backsheet film 80 is cut to form an opening 81 that passes through the body and the protective film, and then the protective film is removed. The embodiment of the present application does not limit the arrangement of the backsheet film 80 .

[0067] In an exemplary embodiment, referring to Figure 7The base substrate 10 includes a first organic layer 101, a first inorganic layer 102, a second inorganic layer 103 and a second organic layer 104 stacked in sequence, the connecting line 30 is located between the first inorganic layer 102 and the second inorganic layer 103, the annular opening 11 is located in the first organic layer 101, and the annular opening 11 passes through the first organic layer 101.

[0068] For example, the materials of the first organic layer 101 and the second organic layer 104 can be polyimide (PI), thereby realizing a flexible display panel. The first inorganic layer 102 and the second inorganic layer 103 help prevent water and oxygen from invading the base substrate 10, thereby preventing water and oxygen from invading the display panel, thereby ensuring the reliability of the display panel.

[0069] In an exemplary embodiment, the present application further provides a method for preparing the display panel provided in any of the above embodiments, the method comprising the following steps:

[0070] S602, providing a base substrate, and forming a driving circuit layer and a plurality of first conductive pads on the base substrate, wherein the first conductive pads are located on a side of the base substrate away from the driving circuit layer, and the driving circuit layer is electrically connected to the first conductive pads via a connecting line in a display area, and the plurality of first conductive pads are arranged in a ring shape in sequence, wherein a first side surface of the base substrate in the display area is provided with a ring-shaped opening, and the ring-shaped opening exposes the plurality of first conductive pads.

[0071] For example, see Figure 1 and Figure 2 .

[0072] S604 , providing a flexible circuit board, where the flexible circuit board includes a plurality of second conductive pads.

[0073] S606, on the first side of the base substrate, apply pressure-sensitive adhesive on the surface of the base substrate in the area enclosed by the annular opening, and adhere the surface of the base substrate in the area enclosed by the annular opening to the surface of the non-second conductive pad area of ​​the flexible circuit board through the pressure-sensitive adhesive.

[0074] For example, see Figure 8 and Figure 9 .

[0075] S608 , dispensing nano silver glue between the first conductive pad and the corresponding second conductive pad to bond the first conductive pad to the second conductive pad via the nano silver glue.

[0076] For example, see Figure 5 .

[0077] The display panel manufacturing method and the display panel provided in the embodiments of the present application both belong to the same inventive concept, can solve the same technical problems, and thus achieve the same technical effects, and the repeated contents will not be repeated here.

[0078] In the description of this specification, reference to the terms "some embodiments" or "other embodiments" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0079] The technical features of the above-described embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. The above-described embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be based on the attached claims.

Claims

1. A display panel, characterized in that: include: Display area and non-display area; A base substrate and a driving circuit layer located on the base substrate; a plurality of first conductive pads, the first conductive pads being located on a side of the base substrate away from the driving circuit layer, the driving circuit layer being electrically connected to the first conductive pads via connecting wires within the display area, the plurality of first conductive pads being sequentially arranged in a ring shape; An annular opening is formed on the first side surface of the base substrate in the display area, and the annular opening exposes the plurality of first conductive pads, wherein the first conductive pads are used for bonding to an external circuit board on the first side of the base substrate.

2. The display panel according to claim 1, wherein: Also includes: The circuit board is a flexible circuit board, and the flexible circuit board includes a plurality of second conductive pads; on the first side of the base substrate, each of the first conductive pads is bonded to a corresponding second conductive pad.

3. The display panel according to claim 2, wherein: The first conductive pad and the second conductive pad are bonded by nano silver glue.

4. The display panel according to claim 2, wherein: On the first side of the base substrate, the surface of the base substrate in the area enclosed by the annular opening is adhered to the surface of the flexible circuit board in the area other than the second conductive pad.

5. The display panel according to claim 4, wherein: The surface of the base substrate and the surface of the flexible circuit board are adhered to each other through pressure-sensitive adhesive.

6. The display panel according to claim 5, wherein: The pressure sensitive adhesive includes an aerosol.

7. The display panel according to claim 5, wherein: The thickness of the pressure-sensitive adhesive is less than 30 μm.

8. The display panel according to claim 3, wherein: The thickness of the nano silver paste between the first conductive pad and the second conductive pad is 15 μm to 30 μm.

9. The display panel according to claim 2, wherein: Also includes: a backplane film, located on a first side of the base substrate; The backplane film in the display area includes an opening, and the opening of the backplane film penetrates the backplane film; The orthographic projection of the annular opening, the orthographic projection of the base substrate in the area enclosed by the annular opening, and the orthographic projection of the flexible circuit board are all located within the orthographic projection of the opening of the backplane film.

10. The display panel according to any one of claims 1 to 9, characterized in that: The base substrate comprises a first organic layer, a first inorganic layer, a second inorganic layer and a second organic layer stacked in sequence; The connecting line is located between the first inorganic layer and the second inorganic layer; the annular opening is located in the first organic layer, and the annular opening passes through the first organic layer.

11. A method for preparing a display panel according to any one of claims 1 to 10, characterized in that: The display panel includes a display area and a non-display area, and the method includes: Providing a base substrate, and forming a driving circuit layer and a plurality of first conductive pads on the base substrate, wherein the first conductive pads are located on a side of the base substrate away from the driving circuit layer, the driving circuit layer is electrically connected to the first conductive pads via connecting lines in the display area, and the plurality of first conductive pads are arranged in a ring shape, wherein a first side surface of the base substrate in the display area is provided with a ring-shaped opening, the ring-shaped opening exposing the plurality of first conductive pads; providing a flexible circuit board, the flexible circuit board comprising a plurality of second conductive pads; On the first side of the base substrate, a pressure-sensitive adhesive is applied to the surface of the base substrate in the area enclosed by the annular opening, and the surface of the base substrate in the area enclosed by the annular opening is bonded to the surface of the flexible circuit board in the area other than the second conductive pad by the pressure-sensitive adhesive; Nano-silver glue is dispensed between the first conductive pad and the corresponding second conductive pad to bond the first conductive pad to the second conductive pad via the nano-silver glue.

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