Bonded member manufacturing device and bonded member manufacturing method

Abstract

The bonded member manufacturing apparatus includes: a first holder and a second holder; a distance adjusting device; a resin supply device for supplying liquid resin; a measurer that measures a value related to the thickness of the first member and the second member; and a control device that adjusts the amount of resin supplied to the first joining surface and / or the second joining surface. The control device controls the resin supply device. The liquid resin is supplied to at least one of the first joining surface and the second joining surface in an amount equivalent to the resin thickness obtained by subtracting the thickness of the first member and the thickness of the second member measured by the measurer from the total thickness, which is the thickness of the bonded members set in advance.

Description

Technical Field

[0001] The present disclosure relates to a device for manufacturing a bonded component and a method for manufacturing a bonded component, and in particular to a device for manufacturing a bonded component and a method for manufacturing a bonded component that can maintain a constant total thickness after bonding. Background Art

[0002] For example, in the manufacture of liquid crystal displays or wearable devices, two components (e.g., a liquid crystal substrate and a protective glass) are bonded together via a resin such as an adhesive. When bonding the two components together, an appropriate amount of adhesive (resin) is applied to the bonding components so that the adhesive (resin) sandwiched between the two components has a predetermined thickness (see, for example, Japanese Patent No. 6105109 (paragraph 0020, etc.)).

[0003] In recent years, in addition to requiring the adhesive (resin) sandwiched between two bonded components to have a predetermined thickness, there has also been a growing demand for the entire bonded component to have a predetermined thickness (constant total thickness). However, individual differences between the two bonded components sometimes occur during manufacturing. If adhesive (resin) is applied to the bonded components to a predetermined thickness despite these individual differences, the problem of inconsistent total thickness arises. Summary of the Invention

[0004] In view of the above problems, the present invention provides a bonded component manufacturing apparatus and a bonded component manufacturing method that can achieve a predetermined thickness of the manufactured bonded component even when the bonded components have individual differences.

[0005] The first embodiment of the present invention relates to a device for manufacturing a bonded component, which is a device for manufacturing a bonded component in which a first bonding surface of a first component and a second bonding surface of a second component are bonded via a resin, and comprises: a first holding member for holding the first component; a second holding member for holding the second component; a distance adjusting device for changing the distance between the first holding member and the second holding member; a resin supply device for supplying liquid resin to at least one of the first bonding surface and the second bonding surface; a measuring instrument for measuring a value related to the thickness of the first component and a value related to the thickness of the second component; and a control device for adjusting the amount of liquid resin supplied from the resin supply device to at least one of the first bonding surface and the second bonding surface, the control device controlling the resin supply device to supply at least one of the first bonding surface and the second bonding surface with an amount of liquid resin equivalent to the thickness of the resin obtained by subtracting the thickness of the first component and the thickness of the second component measured by the measuring instrument from the total thickness of the predetermined thickness of the bonded component.

[0006] With this structure, the amount of liquid resin supplied is adjusted so that the total thickness of the bonded component becomes a predetermined value. Therefore, the total thickness of the bonded component can be made the predetermined value regardless of the thickness of the first component and the second component.

[0007] In addition, as a second embodiment of the present disclosure, in the bonded component manufacturing device according to the first embodiment of the present disclosure, when the bonded component having the first component having a first reference thickness, the second component having a second reference thickness, and the resin having a third reference thickness is set as the bonded component in a standard state, and the total thickness of the bonded component in the standard state is set as the reference thickness, the control device may pre-store the reference thickness and the amount of the resin in the bonded component in the standard state, and calculate, based on a value related to the thickness of the first component and a value related to the thickness of the second component measured by the measuring instrument, an increase or decrease in the amount of the liquid resin supplied to at least one of the first and second bonding surfaces relative to the amount of the resin in the bonded component in the standard state according to a difference between the thickness of the first component and the first reference thickness and a difference between the thickness of the second component and the second reference thickness, and control the resin supply device to supply the liquid resin by an amount that is increased or decreased by the calculated increase or decrease relative to the amount of the resin in the bonded component in the standard state.

[0008] According to this structure, since the liquid resin is supplied by calculating the increase or decrease in the amount of the resin in the resin having the third reference thickness, the amount of the supplied liquid resin can be easily adjusted.

[0009] In addition, as the bonded component manufacturing device involved in the third embodiment of the present disclosure, in the bonded component manufacturing device involved in the first embodiment or the second embodiment of the present disclosure, the control device pre-stores the relationship between the change in the thickness of the resin when it becomes the bonded component relative to the third reference thickness and the increase or decrease, and the calculation of the increase or decrease is to calculate the change in the thickness of the resin used for the bonded component as the reference thickness relative to the third reference thickness, and the increase or decrease corresponding to the calculated change is performed by referring to the pre-stored relationship.

[0010] With this configuration, the appropriate resin thickness is calculated based on the difference between the first member and the first reference thickness and the difference between the second member and the second reference thickness, thereby calculating the increase or decrease in the amount of supplied resin and reducing the load when calculating the increase or decrease.

[0011] In addition, as the fourth embodiment of the present disclosure, in the apparatus for manufacturing a bonded component involved in any one of the first to third embodiments of the present disclosure, a moving device can be provided for relatively moving the position of the resin supply device relative to at least one of the first and second bonding surfaces, and the control device adjusts the amount of the liquid resin supplied to at least one of the first and second bonding surfaces by adjusting at least one of the discharge flow rate of the liquid resin from the resin supply device and the moving speed of the moving device.

[0012] According to this structure, the amount of resin supplied to the first joint surface and / or the second joint surface can be finely adjusted according to the situation.

[0013] In addition, as the bonded component manufacturing device involved in the fifth embodiment of the present disclosure, in the bonded component manufacturing device involved in the fourth embodiment of the present disclosure, the control device can also adjust the amount of liquid resin supplied to at least one of the first bonding surface and the second bonding surface by adjusting the discharge flow rate of the liquid resin from the resin supply device when the moving speed of the moving device is set to a certain state.

[0014] According to this structure, when the resin is supplied to the first joint surface and / or the second joint surface along an irregular trajectory, it is easy to adjust the supply amount of the resin.

[0015] In addition, the sixth embodiment of the present disclosure is a method for manufacturing a bonded component, which is a method for manufacturing the bonded component using the bonded component manufacturing device according to any one of the first to fifth embodiments of the present disclosure, and comprises: a process for determining the difference between the thickness of the first component and the first reference thickness; a process for determining the difference between the thickness of the second component and the second reference thickness; a process for supplying liquid resin to at least one of the first bonding surface and the second bonding surface by the resin supply device; and a process for making the first bonding surface and the second bonding surface face each other, making the distance between the first component held by the first retaining member and the second component held by the second retaining member close by the distance adjustment device, and bonding the first component and the second component via the resin, wherein in the process of supplying the resin, the resin supply device is controlled by the control device to supply liquid resin so that the amount of the resin possessed by the bonded component in the standard state is increased or decreased by the increase or decrease amount calculated by the control device.

[0016] According to this structure, even when the thickness of the first member and / or the second member is different from the reference thickness, a bonded member having a constant thickness can be manufactured.

[0017] Effects of the Invention

[0018] According to the present disclosure, the amount of supplied liquid resin is adjusted so that the total thickness of the bonded component becomes a predetermined value. Therefore, the total thickness of the bonded component can be made the predetermined value regardless of the thicknesses of the first and second components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of a bonded component manufacturing apparatus according to one embodiment.

[0020] Figure 2 This is a side view of a bonded component manufactured by the bonded component manufacturing apparatus according to one embodiment.

[0021] Figure 3 This is a flowchart showing a method for manufacturing a bonded component according to one embodiment. DETAILED DESCRIPTION

[0022] This application is based on Japanese Patent Application No. 2023-021911 filed in Japan on February 15, 2023, the contents of which form a part of the present application.

[0023] In addition, the present invention can also be further fully understood by the following detailed description. Through the following detailed description, the further application range of the present invention will become clear. However, the detailed description and specific examples are preferred embodiments of the present invention and are recorded only for illustrative purposes. From this detailed description, various changes and modifications will be apparent to those skilled in the art within the spirit and scope of the present invention.

[0024] The applicant does not intend to dedicate any of the described embodiments to the public, and disclosed variations and alternatives that may not literally be included in the text of the claims are also considered part of the invention under the doctrine of equivalents.

[0025] Hereinafter, the embodiment will be described with reference to the accompanying drawings. In the drawings, the same or similar reference numerals are given to the same or corresponding components, and redundant description will be omitted.

[0026] First, refer to Figure 1 A bonded component manufacturing apparatus 1 according to an embodiment will be described. Figure 1 This is a schematic diagram of the structure of a bonded component manufacturing apparatus 1. The bonded component manufacturing apparatus 1 manufactures a bonded component by bonding a first component (hereinafter referred to as "first component 81") and a second component (hereinafter referred to as "second component 82") together via a resin 83. Before describing the bonded component manufacturing apparatus 1, the bonded components manufactured by the bonded component manufacturing apparatus 1 will be described.

[0027] Figure 2This is a side view of a bonded component 80 manufactured by the bonded component manufacturing apparatus 1. The bonded component 80 is a component in which a first component 81 and a second component 82 are bonded together via a resin 83. The first component 81 and the second component 82 may be, for example, substrates or lenses of a liquid crystal display. A liquid crystal module may be used as the first component 81. The liquid crystal module serving as the first component 81 may be formed into a rectangular flat plate. One flat surface of the first component 81 serves as a first bonding surface (hereinafter referred to as "first bonding surface 91") that is bonded to the second component 82 via the resin 83. In this embodiment, the first bonding surface 91 of the first component 81 and its opposite back surface are both formed flat. A protective glass for protecting liquid crystals may also be used as the second component 82. The protective glass serving as the second component 82 may also be formed into a rectangular flat plate. One flat surface of the second component 82 serves as a second bonding surface (hereinafter referred to as "second bonding surface 92") that is bonded to the first component 81 via the resin 83. In this embodiment, the second bonding surface 92 of the second component 82 and its opposite back surface are both formed flat. The resin 83 can function as an adhesive. In the present embodiment, the resin 83 is in a liquid state of a prescribed viscosity with fluidity when applied to the first component 81 and / or the second component 82, and has the property of solidifying when the first component 81 and the second component 82 are bonded together and a thickening measure is implemented. The resin 83 can have the property of flowing when an external force is applied and being still when the external force is removed, and the prescribed viscosity can be, for example, 100 to 5000 mPa·s. As thickening measures, ultraviolet irradiation, heating, waiting time, etc. can be cited according to the properties of the resin 83. In the state where the components 80 are bonded, the resin 83 bonds the first component 81 and the second component 82, and acts as an intermediate layer that maintains the distance between the first component 81 and the second component 82 at an appropriate distance.

[0028] In the bonded component 80, the thicknesses of the first component 81, second component 82, and resin 83 are referred to as the first thickness T1, second thickness T2, and third thickness T3, respectively. The overall thickness of the bonded component 80 is referred to as the total thickness T. The first thickness T1 and second thickness T2 are determined during the manufacturing process of the first component 81, second component 82, respectively. The third thickness T3 is generally determined by the amount of resin 83 supplied before bonding the first component 81, second component 82. The total thickness T is the sum of the first thickness T1, second thickness T2, and third thickness T3, and is determined by determining the first thickness T1, second thickness T2, and third thickness T3. The first thickness T1, second thickness T2, and third thickness T3 each have design values ​​(ideal values ​​for the bonded component 80). The design values ​​of the first thickness T1, second thickness T2, and third thickness T3 are referred to as the first reference thickness (hereinafter referred to as "first reference thickness TB1"), the second reference thickness (hereinafter referred to as "second reference thickness TB2"), and the third reference thickness (hereinafter referred to as "third reference thickness TB3"), respectively. The state of the bonded component 80, in which the first component 81, the second component 82, and the resin 83 have a first reference thickness TB1, a second reference thickness TB2, and a third reference thickness TB3, respectively, is referred to as the "standard state." Furthermore, the total thickness T of the bonded component 80 in the standard state is referred to as the "reference thickness TB." When manufacturing the bonded component 80, it is preferable to bond the first component 81 having a first reference thickness TB1 and the second component having a second reference thickness TB2. If the first thickness T1 and the second thickness T2 are always the first reference thickness TB1 and the second reference thickness TB2, respectively, then the total thickness T can be kept constant by maintaining a constant amount of resin 83 supplied. However, due to manufacturing errors and other factors, the first component 81 and / or the second component 82 may not maintain the first reference thickness TB1 or the second reference thickness TB2, respectively. In such circumstances, if a constant total thickness T (typically, reference thickness TB) is required, supplying an amount of resin 83 equivalent to the third reference thickness TB3 to the first component 81 and / or the second component 82 may result in a non-consistent total thickness T. Bonded component manufacturing device 1 (see Figure 1 ) Even when the first member 81 and / or the second member 82 do not have the first reference thickness TB1 and the second reference thickness TB2, respectively, the total thickness T can be made constant.

[0029] return Figure 1, the following describes the apparatus for manufacturing the bonded components 1. The apparatus for manufacturing the bonded components 1 includes a loading platform 11, a moving device 15, a measuring device 21, a resin supply device 25, a bonding device 30, and a control device 50. The loading platform 11 is a platform for loading the first component 81 and / or the second component 82 to measure the thickness and / or apply the resin 83. The loading platform 11 is typically formed in the shape of a plate having a surface that includes the size of the larger of the first component 81 and the second component 82 when viewed from above. The surface of the loading platform 11 on which the first component 81 and the second component 82 are loaded is the loading surface 12. The loading surface 12 is formed into a shape suitable for the first component 81 and the second component 82 to be loaded, and is formed as a plane in the present embodiment. The loading platform 11 is typically configured so that the loading surface 12 faces upward and is horizontal.

[0030] The moving device 15 is a device that moves the loading platform 11. The moving device 15 has a feeding device 16 and an adjusting device 17. The feeding device 16 causes the loading platform 11 to move back and forth linearly horizontally along the direction of approaching and leaving relative to the bonding device 30 (hereinafter referred to as the "conveying direction C"). The feeding device 16 has a track (not shown) extending along the conveying direction C and a movable component (not shown) that can move along the conveying direction C on the track inside the frame, and the adjusting device 17 is installed on the movable component. The adjusting device 17 causes the loading platform 11 to move back and forth horizontally along a direction orthogonal to the conveying direction C. The distance that the adjusting device 17 moves the loading platform 11 is typically a distance equivalent to the width of the first component 81 or the second component 82. The adjusting device 17 has a driving mechanism (not shown) inside, and the loading platform 11 is installed on the driving mechanism. A ball screw actuator can also be applied as the feeding device 16 and the adjusting device 17.

[0031] In this embodiment, the measuring device 21 is a machine that measures the thickness of the first component 81 and the second component 82 placed on the loading platform 11. The measuring device 21 typically uses a non-contact optical thickness gauge using laser or light, but an ultrasonic thickness gauge or other thickness measuring machine can also be used. The measuring device 21 is set vertically above the track of the first component 81 or the second component 82 placed on the loading platform 11 moving along the conveying direction C. The measuring device 21 is typically fixed to the frame (not shown) of the bonded component manufacturing device 1. The measuring device 21 moves relative to the loading platform 11 through the operation of the moving device 15, and can measure the thickness of multiple points of the first component 81 or the second component 82 placed on the loading platform 11. In addition, the measuring device 21 can be provided with multiple measuring devices for measuring the thickness of one point, or a measuring device that can measure multiple points can be used. For example, if the measuring device 21 for measuring the thickness of one point is arranged in a direction horizontally perpendicular to the conveying direction C, the thickness of points in a wide range of the first component 81 or the second component 82 can be measured simply by moving the stage 11 in the conveying direction C.

[0032] The resin supply device 25 is a device that supplies liquid resin 83 to the first component 81 and / or the second component 82 placed on the loading platform 11. The liquid state here means that it has fluidity when an external force is applied or when no external force is applied. The resin supply device 25 includes a nozzle 26, a resin supply device 27, and a resin flow path 28. The nozzle 26 discharges the liquid resin 83 toward the first component 81 or the second component 82. In this embodiment, the nozzle 26 uses a die head for die coating. The nozzle 26 has a slit-shaped discharge port for discharging the liquid resin 83 formed on the surface opposite to the loading platform 11. The nozzle 26 is typically arranged vertically above the track of the first component 81 or the second component 82, with the slit-shaped discharge port extending horizontally in a direction perpendicular to the conveying direction C. The first component 81 or the second component 82 is placed on the loading platform 11 that moves along the conveying direction C. The nozzle 26 is typically fixed to the frame (not shown) of the bonded component manufacturing device 1 between the measuring device 21 and the bonding device 30. The nozzle 26 is moved relative to the mounting table 11 by the movement of the moving device 15, and can supply liquid resin 83 over a large range of the first component 81 or the second component 82 mounted on the mounting table 11. The resin supplier 27 has a resin tank (not shown) for storing liquid resin 83. The resin supplier 27 also has a pressure feeder (not shown) for pressurizing the stored liquid resin 83 to the nozzle 26. A pump can be used as the pressure feeder. The pressure feeder of the resin supplier 27 is configured to change the discharge flow rate of the resin 83 by changing the discharge pressure of the resin 83. In addition, the discharge pressure of the resin 83 can also be a structure that changes according to oil pressure or air pressure instead of a pump. The resin supplier 27 is connected to the nozzle 26 via the resin flow path 28, and is configured to be able to supply liquid resin 83 to the nozzle 26 via the resin flow path 28.

[0033] The bonding device 30 is a device for bonding the first component 81 and the second component 82. The bonding device 30 includes a base plate 31, a lifting pin 32, a pressure plate 33 and a lifting device 35. The base plate 31 holds the first component 81 in this embodiment, and is equivalent to a first retaining member. The base plate 31 is typically formed in the shape of a thick plate, and has a surface of a size including the first bonding surface 91 of the first component 81 when viewed from above. In this embodiment, the surface of the base plate 31 that contacts the first component 81 is formed to be flat, and is provided with a plurality of vents (not shown) for adsorbing and holding the first component 81. The vents (not shown) formed on the surface of the base plate 31 are connected to a vacuum pump (not shown) via a pipe (not shown). By operating the vacuum pump, the vents become negative pressure, thereby being able to adsorb and hold the first component 81.

[0034] In this embodiment, the lift pins 32 hold the second component 82 and serve as the second retaining member. The lift pins 32 are composed of a plurality of tubular components. The lift pins 32 are positioned vertically above the base plate 31, with each tubular component extending in the vertical direction. Both ends of each tubular component of the lift pins 32 are open, and the upper ends are connected to a vacuum pump (not shown) via piping (not shown). By operating the vacuum pump while the lower ends of each tubular component contact the surface of the second component 82, the lift pins 32 create a negative pressure inside each tubular component, thereby enabling suction and retention of the second component 82.

[0035] The pressing plate 33 presses the second component 82 against the first component 81. The pressing plate 33 is typically formed in a plate shape and has a surface of a size that includes the second joint surface 92 of the second component 82 when viewed from above. In the present embodiment, the surface of the pressing plate 33 that contacts the second component 82 is formed to be flat, and a through hole for the lifting pin 32 to pass through is formed. In the present embodiment, the pressing plate 33 is configured so that the surface that contacts the second component 82 is parallel to the surface of the base plate 31. In this state, the cylindrical components of the lifting pin 32 extend perpendicularly to the surface of the pressing plate 33. The pressing plate 33 is configured to be able to reciprocate along the direction in which the cylindrical components of the lifting pin 32 extend by a driving mechanism (not shown).

[0036] The lifting device 35 moves the base plate 31 up and down. The lifting device 35 is provided at the lower part of the base plate 31. The lifting device 35 can be moved up and down by operating a lifting mechanism (not shown) having a built-in electric motor. The lifting device 35 is moved up and down by the operation of the lifting mechanism, and can move the connected base plate 31 up and down, thereby changing the distance between the base plate 31 and the lifting pin 32. In this way, the lifting device 35 is equivalent to a distance adjustment device. As the lifting device 35, a lifting table, an electric jack, etc. can also be used. The bonding device 30 with each component configured as described above is configured to receive the first component 81 and the second component 82 in sequence from the approaching loading platform 11 by a robot (not shown), and bond the first component 81 and the second component 82 via the resin 83. In addition, the bonding device 30 may also have a chamber that accommodates at least the lower part of each tubular component of the base plate 31 and the lifting pin 32, the pressure plate 33 and at least the upper part of the lifting device 35. The bonding apparatus 30 may be configured such that, when a chamber is provided, the chamber is opened when receiving the first component 81 and the second component 82 and is airtightly closed when bonding the first component 81 and the second component 82 together.

[0037] The control device 50 is a device that controls the operation of the bonded component manufacturing apparatus 1. The control device 50 includes an operation control unit 51, a receiving unit 52, a storage unit 53, and a computing unit 54. In this embodiment, these components are distinguished by their functions for ease of explanation. However, they may typically be integrated within the control device 50, or one or more of these components may be physically separate. The control device 50 may include at least one physical structure consisting of a processor, memory (RAM and / or ROM), and storage.

[0038] The operation control unit 51 is a part that controls the operation of each device and machine that constitutes the bonded component manufacturing device 1. The operation control unit 51 is connected to the moving device 15 through a control signal line (wired or wireless, the same below), and by sending instructions using a control signal, the mounting table 11 can be moved at an arbitrary speed in the conveying direction C and the direction horizontally perpendicular to the conveying direction C. In addition, the operation control unit 51 is connected to the measuring device 21 through a control signal line, and by sending instructions using a control signal, the measuring device 21 can be controlled to start measuring the thickness. In addition, the operation control unit 51 is connected to the resin supply device 25 through a control signal line, and by sending instructions using a control signal, whether the liquid resin 83 is discharged from the nozzle 26 and the discharge flow rate can be controlled. In addition, the operation control unit 51 is connected to the bonding device 30 through a control signal line, and by sending instructions using a control signal, it can control whether the base plate 31 and the lifting pin 32 are adsorbed and the up and down movement of the pressing plate 33 and the lifting device 35. The operation control unit 51 can have a program for properly operating the above-mentioned machines, and can also use a processor to execute the program.

[0039] The receiving unit 52 receives the value measured by the measuring instrument 21 as a signal. The receiving unit 52 is connected to the measuring instrument 21 via a control signal line and is configured to receive the measurement value signal from the measuring instrument 21. Alternatively, the measurement value signal received by the receiving unit 52 may be received via the operation control unit 51 using a control signal line connecting the measuring instrument 21 and the operation control unit 51. In this case, there is no need to provide a control signal line connecting the measuring instrument 21 and the receiving unit 52.

[0040] The storage unit 53 is a portion that pre-stores data required for operating the bonded component manufacturing apparatus 1. The storage unit 53 stores a first reference thickness TB1, a second reference thickness TB2, a third reference thickness TB3, and a reference thickness TB, depending on the size and type of the bonded component 80 to be manufactured. Furthermore, the storage unit 53 stores the amount (g) of resin 83 at the third reference thickness TB3, depending on the size and type of the bonded component 80 to be manufactured. Furthermore, the storage unit 53 stores the relationship between the difference between the third thickness T3 (the thickness of the resin 83) and the third reference thickness TB3, and the corresponding increase or decrease (g) in the amount of resin 83 at the third reference thickness TB3, depending on the size and type of the bonded component 80 to be manufactured. As a specific example of this relationship, the amount of resin 83 at the third thickness T3 increases (decreases) by 8 mg for every 5 μm increase (decrease) in the third thickness T3 relative to the third reference thickness TB3, increasing or decreasing in a stepwise manner. The storage unit 53 can be primarily composed of a memory, or it can also include an internal memory.

[0041] The calculation unit 54 is configured to calculate a third thickness T3 of the resin 83 required to bring the total thickness T to a reference thickness TB based on the first thickness T1 of the first component 81 and the second thickness T2 of the second component 82 measured by the measuring device 21. The calculation performed by the calculation unit 54 can be executed by a processor. The calculation unit 54 is configured to receive the thickness value received by the receiving unit 52 from the measuring device 21. Furthermore, the calculation unit 54 is configured to determine the amount of resin 83 to be increased or decreased corresponding to the calculated third thickness T3 by referring to a relationship stored in the storage unit 53. Furthermore, the calculation unit 54 is configured to increase or decrease the determined amount of resin 83 relative to the amount of resin 83 at the third reference thickness TB3 and transmit the resulting amount of resin 83 to the operation control unit 51. The operation control unit 51 sends commands via control signals to control the operation of the nozzle 26, causing the nozzle 26 to discharge the amount of resin 83 specified by the calculation unit 54.

[0042] Next, refer to Figure 3 A method for manufacturing the bonded member 80 will be described. Figure 3 Flowchart showing the manufacturing process of the bonded component 80. The manufacturing method of the bonded component 80 described below is performed using the bonded component manufacturing apparatus 1 described so far. The following description of the manufacturing method of the bonded component 80 using the bonded component manufacturing apparatus 1 also serves as an explanation of the function of the bonded component manufacturing apparatus 1. In the following description, when referring to the structure of the bonded component manufacturing apparatus 1 and the bonded component 80 and its components, reference is made to the following description as appropriate. Figure 1 and Figure 2In addition, the operations of the various devices and machines constituting the bonded component manufacturing apparatus 1 in the following method for manufacturing the bonded component 80 are typically performed based on instructions from the control device 50. The method for manufacturing the bonded component 80 according to this embodiment can be provided in the form of a program for causing a processor of the control device 50 that controls the various components of the bonded component manufacturing apparatus 1 to execute prescribed operations, or in the form of a non-transitory computer-readable medium storing the program.

[0043] While the bonded component manufacturing apparatus 1 is stopped, the mounting table 11 is typically in the component mounting position (in this embodiment, a position away from the bonding apparatus 30). However, the mounting table 11 may be moved to the component mounting position when the bonded component manufacturing apparatus 1 is started. In this embodiment, after the production of the bonded component 80 begins, the second component 82 is first placed on the mounting table 11 (S1). At this time, the second component 82 is typically placed on the mounting table 11 with the second bonding surface 92 facing upward (with the surface opposite the second bonding surface 92 in contact with the mounting surface 12). However, the second component 82 may also be placed on the mounting table 11 with the second bonding surface 92 in contact with the mounting surface 12.

[0044] When the second component 82 is placed on the mounting table 11, the difference (= T2 - TB2) between the second thickness T2 of the second component 82 and the second reference thickness TB2 is determined (S2). Hereinafter, the difference (T2 - TB2) between the second thickness T2 and the second reference thickness TB2 is referred to as the "second difference." To determine the second difference, the thickness of the second component 82 is first measured. The thickness of the second component 82 is measured by the moving device 15, which is operated under the instruction of the operation control unit 51, moving the mounting table 11 below the measuring device 21, and the measuring device 21 detects the thickness of the second component 82. The thickness of the second component 82 is typically measured at multiple points on the second component 82. The thickness of the second component 82 measured by the measuring device 21 is transmitted to the receiving unit 52 of the control device 50 and then transmitted to the computing unit 54. Since the thickness of the second component 82 is typically uniform, the thickness values ​​at multiple measurement points are the same. However, if the thickness at multiple measurement points differs, in this embodiment, the average of the measured thicknesses is used as the second thickness T2 of the second component 82. Alternatively, instead of measuring the thickness at multiple points on the second member 82, the thickness at a single, predetermined reference position on the second member 82 may be measured and treated as the second thickness T2. After obtaining the value of the second thickness T2, the calculation unit 54 refers to the second reference thickness TB2 stored in the storage unit 53 to calculate the second difference (T2-TB2).

[0045] After the second difference is determined, the second component 82 is held by the lifting pins 32 (S3). At this time, typically after the stage 11 is moved by the moving device 15 to a position as close as possible to the bonding device 30, the second component 82 placed on the stage 11 is transferred to the lifting pins 32 by a robot (not shown). The robot (not shown) transfers the second component 82 to the lifting pins 32 in such a manner that the surface on the opposite side of the second bonding surface 92 contacts the lower end of the lifting pins 32. In the bonding device 30, after the second component 82 contacts the lower end of the lifting pins 32, the operation control unit 51 operates the vacuum pump (not shown), whereby the second component 82 is held by the lifting pins 32. After the second component 82 is transferred from the stage 11 to the lifting pins 32, the operation control unit 51 operates the moving device 15, whereby the stage 11 moves to the component loading position.

[0046] Next, the first component 81 is placed on the mounting table 11 (S4). At this time, the first component 81 is placed on the mounting table 11 with the first bonding surface 91 facing upward (the surface opposite the first bonding surface 91 contacts the mounting surface 12). After the first component 81 is placed on the mounting table 11, the difference between the first thickness T1, which represents the thickness of the first component 81, and the first reference thickness TB1 (= T1 - TB1) is determined (S5). Hereinafter, the difference (T1 - TB1) between the first thickness T1 and the first reference thickness TB1 is referred to as the "first difference." To determine the first difference, the thickness of the first component 81 is first measured. The thickness of the first component 81 is measured using the measuring instrument 21 in the same manner as the thickness measurement of the second component 82, at multiple points on the first component 81 or at a single predetermined reference position on the first component 81. The thickness of the first component 81 measured by the measuring instrument 21 is transmitted to the receiving unit 52 of the control device 50 and then transferred to the computing unit 54. The calculation unit 54 obtains the first thickness T1 based on the thickness of the first component 81 received from the receiving unit 52 in the same manner as the calculation of the second difference (T2-TB2), and further calculates the first difference (T1-TB1) by referring to the first reference thickness TB1 stored in the storage unit 53.

[0047] After the first difference is determined, liquid resin 83 is applied to the first bonding surface 91 (S6). Applying liquid resin 83 to the first bonding surface 91 is a way of supplying liquid resin 83 to the first bonding surface 91. In order to apply liquid resin 83 to the first bonding surface 91, according to the instruction of the operation control unit 51, when the first component 81 placed on the mounting table 11 moved by the operation of the moving device 15 passes under the nozzle 26, liquid resin 83 is discharged from the discharge port of the nozzle 26. At this time, in order to make the total thickness T of the manufactured bonded component 80 the reference thickness TB, the calculation unit 54 predetermines the amount of liquid resin 83 supplied to the first component 81. In this embodiment, the amount of liquid resin 83 supplied to the first component 81 is determined according to the following procedures.

[0048] First, the second difference and the first difference determined in the above steps (S2, S5) are summed. The sum thus obtained is the "reduction" of the third thickness T3 of the bonded part 80 relative to the third reference thickness TB3. This definition is because, in order to make the total thickness T equal to the reference thickness TB, when the sum of the second difference and the first difference is positive, the third thickness T3 needs to be reduced from the third reference thickness TB3 by only this amount. On the other hand, when the sum of the second difference and the first difference is negative, the "reduction" is negative, which essentially means the increase of the third thickness T3 relative to the third reference thickness TB3. This matches the fact that when the sum of the second difference and the first difference is negative, the third thickness T3 needs to be increased from the third reference thickness TB3 by only this amount. After calculating the sum of the second difference and the first difference to determine the reduction in third thickness T3 relative to the third reference thickness TB3, in this embodiment, the increase or decrease in the amount of resin 83 to be supplied is calculated based on the relationship between the reduction in third thickness T3 and the increase or decrease in the amount of resin 83 stored in the storage unit 53. The reduction in third thickness T3 is generally referred to as positive or negative, but corresponds to the difference between third thickness T3 and the third reference thickness TB3. If the reduction in third thickness T3 (the difference between third thickness T3 and third reference thickness TB3) is positive, the amount of resin 83 supplied is reduced. On the other hand, if the reduction in third thickness T3 is negative, the amount of resin 83 supplied is increased. The amount of resin 83 obtained by adjusting the thus calculated increase or decrease in resin 83 relative to the amount of resin 83 at the third reference thickness TB3 becomes the predetermined amount of liquid resin 83 to be supplied to the first component 81. In this embodiment, the moving speed of the mounting table 11 relative to the nozzle 26 is kept constant, and the flow rate of the liquid resin 83 discharged from the nozzle 26 is adjusted, thereby adjusting the amount of the liquid resin 83 supplied to the first component 81 .

[0049] The determination of the amount of liquid resin 83 supplied to the first component 81 will be described using a specific example. The specific numerical values ​​mentioned in the description of the specific example are for ease of understanding and are, of course, not limited to the numerical values ​​described. If the second thickness T2 measured by the measuring instrument 21 is 1.021 mm and the second reference thickness TB2 stored in the storage unit 53 is 1.000 mm, the second difference (T2 - TB2) is 1.021 mm - 1.000 mm = 0.021 mm. If the first thickness T1 measured by the measuring instrument 21 is 0.992 mm and the first reference thickness TB1 stored in the storage unit 53 is 1.000 mm, the first difference (T1 - TB1) is 0.992 mm - 1.000 mm = -0.008 mm. Therefore, the sum of the second difference and the first difference is 0.021 mm + (-0.008 mm) = 0.013 mm. This 0.013 mm (=13 μm) corresponds to the reduction in the third thickness T3 relative to the third reference thickness TB3. If the relationship between the difference between the third thickness T3 and the third reference thickness TB3 and the increase or decrease in the amount of resin 83, as stored in the storage unit 53, is such that for every 5 μm increase or decrease in the third thickness T3, an increase or decrease of 8 mg of resin 83 occurs, then in this example, the reduction in resin 83 is 8 mg x 3 = 24 mg. Furthermore, 8 mg is tripled to 13 μm / 5 μm = 2.6. Furthermore, if the amount of resin 83 at the third reference thickness TB3 stored in the storage unit 53 is 356.7 mg, the amount of resin 83 supplied after the increase or decrease adjustment is 356.7 mg - 24 mg = 332.7 mg. Thus, in the specific example shown here, the predetermined amount of liquid resin 83 to be supplied to the first component 81 is 332.7 mg. Regarding the movement speed of the mounting table 11 relative to the nozzle 26, if it takes 12.3 seconds to supply the liquid resin 83 to the necessary portion of the first component 81, the supply flow rate of the liquid resin 83 from the nozzle 26 is 332.7 mg / 12.3 s ≈ 27 mg / s. For reference, the supply flow rate of the resin 83 at the third reference thickness TB3 is 356.7 mg / 12.3 s = 29 mg / s. Therefore, in the case of this specific example, in the step (S6) of applying the liquid resin 83, by changing the set value of the supply flow rate of the liquid resin 83 from the nozzle 26 from 29 mg / s to 27 mg / s, a bonded component 80 having a total thickness T equal to the reference thickness TB can be obtained.

[0050] After the liquid resin 83 is applied to the first bonding surface 91 (S6), the first component 81 is adsorbed and held by the base plate 31 (S7). At this time, typically after the carrier 11 is moved by the moving device 15 to a position as close as possible to the bonding device 30, the first component 81 placed on the carrier 11 is transferred to the base plate 31 by a robot (not shown). The robot (not shown) transfers the first component 81 to the base plate 31 while maintaining the first bonding surface 91 coated with the liquid resin 83 facing upward. In the bonding device 30, after the first component 81 contacts the upper surface of the base plate 31, the operation control unit 51 operates the vacuum pump (not shown), whereby the first component 81 is adsorbed and held by the base plate 31. By adsorbing and holding the first component 81 on the base plate 31, the second bonding surface 92 of the second component 82 adsorbed and held by the lifting pins 32 arranged vertically above the base plate 31 is opposite to the first bonding surface 91 of the first component 81.

[0051] After the second bonding surface 92 and the first bonding surface 91 are aligned, the operation control unit 51 operates the lifting device 35 to raise the base plate 31 (S8). As a result, the first component 81, which is held by suction on the base plate 31, and the second component 82, which is held by suction on the lifting pins 32, approach each other. In this embodiment, the base plate 31 is raised until the liquid resin 83 supplied to the first component 81 contacts the second bonding surface 92. After the base plate 31 is raised, the operation control unit 51 stops the operation of the vacuum pump (not shown) of the lifting pins 32, releases the suction and retention of the second component 82 by the lifting pins 32, and operates the drive mechanism (not shown) to lower the pressing plate 33 (S9). As a result, the second component 82 is pressed against the first component 81, and the first component 81 and the second component 82 are bonded together. At this time, the resin 83 sandwiched between the first component 81 and the second component 82 can be thickened to solidify the resin 83. By bonding the first member 81 and the second member 82 together, a bonded member 80 is obtained in which the first member 81 , the second member 82 , and the resin 83 are integrated.

[0052] After the first component 81 and the second component 82 are bonded, the control unit 51 stops the drive mechanism (not shown) of the platen 33 and lowers the base plate 31 (S10). This causes the bonded component 80 to separate from the lift pins 32 and rest on the upper surface of the base plate 31. After the bonded component 80 separates from the lift pins 32, the bonded component 80 is removed from the base plate 31 (S11). This yields one bonded component 80. The above process can be repeated to produce the next bonded component 80.

[0053] As described above, according to the bonded component manufacturing apparatus 1 of this embodiment, the sum of the first difference and the second difference is used as the reduction in the third thickness T3 relative to the third reference thickness TB3, and the amount of resin 83 is adjusted by adjusting the amount of resin 83 at the third reference thickness TB3 by this reduction. Therefore, even if the first thickness T1 differs from the first reference thickness TB1 and / or the second thickness T2 differs from the second reference thickness TB2, the total thickness T of the bonded component 80 can be made equal to the reference thickness TB.

[0054] In the above description, the mounting table 11 and the measuring instrument 21 are used for both the first component 81 and the second component 82. The first and second components 81, 82 are sequentially mounted on the mounting table 11, and the thicknesses of the first and second components 81, 82 are measured sequentially by the measuring instrument 21. However, the mounting table 11 may include a first mounting table for the first component 81 and a second mounting table for the second component 82, and the measuring instrument 21 may include a first measuring instrument for the first component 81 and a second measuring instrument for the second component 82. This allows the thicknesses of the first and second components 81, 82 to be measured simultaneously, shortening the time required to manufacture the bonded component 80. On the other hand, if the mounting table 11 and the measuring instrument 21 are used as a set for both the first and second components 81, 82, there is no need for a second set of the mounting table 11 and measuring instrument 21, thus minimizing the space required and achieving a more compact device.

[0055] In the above description, by fixing the gauge 21 and the nozzle 26 and moving the mounting table 11 on which the first component 81 or the second component 82 is mounted, it is possible to measure the thickness of the first component 81 or the second component 82 at multiple locations and apply the resin 83. However, the mounting table 11 may be fixed while the gauge 21 and the nozzle 26 are moved, or the mounting table 11, the gauge 21, and the nozzle 26 may be moved relative to each other.

[0056] In the above description, the stage 11 used when measuring the thickness of the first component 81 and the second component 82 and applying the resin 83, and the bonding device 30 used when bonding the first component 81 and the second component 82 are separate structures. However, the first component 81 and the second component 82 can be respectively held on the first holder and the second holder, and the thickness of the first component 81 and the second component 82 can be measured and the liquid resin 83 can be applied, and the bonding can be performed by flipping the first holder or the second holder. In this way, there is no need to provide a device (such as a robot) for transferring the first component 81 and the second component 82 from the stage 11 to the bonding device 30. On the other hand, if the stage 11 and the bonding device 30 used when measuring the thickness and applying the resin 83 are set as separate structures, it is not necessary to provide a structure for flipping the first holder and / or the second holder, which can suppress the complexity of the device structure.

[0057] In the above description, the measuring instrument 21 measures the thickness of the first component 81 and the thickness of the second component 82, and the calculation unit 54 determines the first and second differences based on these measured thicknesses and the first and second reference thicknesses TB1 and TB2 stored in the storage unit 53. However, if the thicknesses of the first and second components 81 and 82 are the same, the measuring instrument 21 can also directly measure the first and second differences. In this case, the distance from the surface of the first component 81 of the first reference thickness TB1 and the distance from the surface of the second component 82 of the second reference thickness TB2 are set as reference distances (±0 mm) in the fixed measuring instrument 21. Furthermore, if the measuring instrument 21 measures the distance from the surface of the first component 81 (second component 82) and detects a positive value if the distance is longer than the reference distance and a negative value if the distance is shorter than the reference distance, the value measured by the measuring instrument 21 can be directly used as the first and second differences.

[0058] In the above description, the amount of liquid resin 83 supplied to the first component 81 or the second component 82 is varied in steps, but it can also be varied continuously (in direct proportion). When the amount of liquid resin 83 is varied continuously, the calculation unit 54 calculates the sum of the second difference and the first difference, determines the difference between the third thickness T3 and the third reference thickness TB3, and then retrieves information from the storage unit 53 regarding the amount of resin 83 corresponding to this thickness difference. The thus-derived amount of resin 83 is adjusted in direct proportion to the amount of resin 83 at the third reference thickness TB3, and this information is used as the amount of liquid resin 83 supplied to the first component 81 or the second component 82. The flow rate of liquid resin 83 supplied from the nozzle 26 can then be adjusted based on the determined amount of liquid resin 83 supplied to the first component 81 or the second component 82. In this way, when the amount of liquid resin 83 is varied continuously, the amount of resin 83 can be adjusted with greater precision. However, when fine adjustment is not important so far, a step-like change that reduces the computational load is preferable.

[0059] In the above description, the discharge flow rate of the liquid resin 83 from the nozzle 26 is changed when the amount of the supplied resin 83 is increased or decreased. However, the discharge flow rate of the liquid resin 83 from the nozzle 26 may be changed without changing the discharge flow rate of the liquid resin 83 from the nozzle 26, but the relative movement speed of the nozzle 26 with respect to the mounting table 11 may be changed. Alternatively, both the discharge flow rate of the liquid resin 83 from the nozzle 26 and the relative movement speed of the nozzle 26 with respect to the mounting table 11 may be changed simultaneously.

[0060] In the above description, after determining the first and second differences, the increase or decrease in the third thickness T3 relative to the third reference thickness TB3 is determined. Based on this determined increase or decrease in the thickness of the resin 83, the increase or decrease in the amount of resin 83 to be supplied is calculated, and this increase or decrease is adjusted as the amount of liquid resin 83 to be supplied. However, it is also possible to subtract the measured thicknesses of the first component 81 and the second component 82 from the reference thickness TB to determine the thickness of the resin 83 when the bonded component 80 has a total thickness T equal to the reference thickness TB, and calculate the amount of resin 83 required to achieve this thickness.

[0061] In the above description, as an example, the main Figures 1 to 3 The embodiments of the present disclosure describe an apparatus for manufacturing bonded parts and a method for manufacturing solder bonded parts. However, the structure, construction, quantity, arrangement, shape, material, etc. of each part are not limited to the above-mentioned specific examples. Anything appropriately selected and adopted by a person skilled in the art is also included in the scope of the present invention as long as it contains the gist of the present invention.

[0062] All documents, including publications, patent applications, and patents, cited in this specification are hereby specifically indicated to be incorporated by reference individually and are incorporated by reference in their entirety to the same extent as if fully described herein.

[0063] The use of nouns and similar indicators used in conjunction with the description of the present invention (particularly in conjunction with the claims) is interpreted as relating to both the singular and the plural, unless otherwise specified in this specification or clearly contradicted by the context. Unless otherwise specified, the phrases "having", "having", "including" and "comprising" are interpreted as open-ended terms (i.e., "including but not limited to"). The specific enumeration of the numerical ranges in this specification is only for the purpose of serving as a shorthand for referring to each value within the range, unless otherwise specified in this specification, each value is incorporated into the specification in the manner of being listed separately in this specification. All methods described in this specification can be carried out in any appropriate order, unless otherwise specified in this specification or clearly contradicted by the context. Any examples or exemplary wordings used in this specification (such as "etc.") are only for the purpose of better illustrating the present invention, rather than limiting the scope of the present invention, unless otherwise specified. Any wording in this specification should not be interpreted as representing an element not recorded in the claims as being essential to the implementation of the present invention.

[0064] In this specification, preferred embodiments of the present invention are described, including the best mode known to the inventors for implementing the present invention. For those skilled in the art, upon reading the above description, variations of these preferred embodiments will become apparent. The inventors anticipate that skilled persons will appropriately apply such variations and anticipate implementing the present invention in methods other than those specifically described in this specification. Therefore, the present invention includes modifications and equivalents of all the contents described in the claims herein, as permitted by applicable law. Furthermore, unless otherwise specifically noted in this specification or clearly contradicted by the context, any combination of the above elements in all variations is included in the present invention.

Claims

1. A bonded component manufacturing apparatus, comprising: a first holding member for holding the first component; a second holding member for holding the second component; a distance adjustment device for changing the distance between the first retaining member and the second retaining member; a resin supply device for supplying the liquid resin to at least one of the first joint surface and the second joint surface; a measurer that measures a value related to the thickness of the first member and measures a value related to the thickness of the second member; and a control device for adjusting the amount of the liquid resin supplied by the resin supply device to at least one of the first joint surface and the second joint surface; The control device controls the resin supply device to supply the liquid resin in an amount corresponding to the thickness of the resin to at least one of the first bonding surface and the second bonding surface, and the thickness of the resin is a thickness obtained by subtracting the thickness of the first part and the thickness of the second part measured by the measuring instrument from the total thickness of the predetermined thickness of the bonded parts.

2. The apparatus for manufacturing a bonded component according to claim 1, wherein: When the bonded component having the first component having a first reference thickness, the second component having a second reference thickness, and the resin having a third reference thickness is set as the bonded component in a standard state, and the total thickness of the bonded component in the standard state is set as the reference thickness, The control device pre-stores the reference thickness and the amount of the resin of the bonded component in the standard state, and based on the value related to the thickness of the first component and the value related to the thickness of the second component measured by the measuring instrument, calculates the increase or decrease in the amount of the liquid resin supplied to at least one of the first bonding surface and the second bonding surface relative to the amount of the resin possessed by the bonded component in the standard state according to the difference between the thickness of the first component and the first reference thickness and the difference between the thickness of the second component and the second reference thickness, and controls the resin supply device to supply the liquid resin that is increased or decreased by the calculated increase or decrease in the amount of the resin possessed by the bonded component in the standard state.

3. The apparatus for manufacturing a bonded component according to claim 2, wherein: The control device pre-stores the relationship between the change in thickness of the resin relative to the third reference thickness when the bonded component becomes the bonded component and the increase or decrease, and the increase or decrease is calculated by calculating the change in thickness of the resin of the bonded component used as the reference thickness relative to the third reference thickness, and by referring to the pre-stored relationship, the increase or decrease corresponding to the calculated change is performed.

4. The apparatus for producing a bonded component according to any one of claims 1 to 3, wherein: The bonded component manufacturing apparatus includes a moving device for moving the resin supply device relative to at least one of the first bonding surface and the second bonding surface. The control device adjusts the amount of the liquid resin supplied to at least one of the first joint surface and the second joint surface by adjusting at least one of the discharge flow rate of the liquid resin from the resin supply device and the moving speed of the moving device.

5. The apparatus for manufacturing a bonded component according to claim 4, wherein: The control device adjusts the amount of the liquid resin supplied to at least one of the first and second joint surfaces by adjusting the discharge flow rate of the liquid resin from the resin supply device while the moving speed of the moving device is set to a constant level.

6. A method for manufacturing a bonded component, comprising: determining a difference between the thickness of the first component and the first reference thickness; determining a difference between the thickness of the second component and the second reference thickness; a step of supplying the liquid resin to at least one of the first joint surface and the second joint surface by the resin supply device; and The first and second joint surfaces are brought into contact with each other, the distance between the first component held by the first holder and the second component held by the second holder is shortened by the distance adjusting device, and the first and second components are bonded together via the resin. In the resin supplying step, the control device controls the resin supply device to supply the liquid resin by an amount such that the amount of the resin in the bonded component in the standard state is increased or decreased by the increase or decrease amount calculated by the control device.

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