Flux shaping inductor structure for reducing high frequency loss

Abstract

A flux shaping inductor structure for reducing high frequency losses is presented. The inductor structure may include a top core, a bottom core, and one or more center posts disposed between the top core and the bottom core. The inductor structure may also include a winding with at least a portion of the winding disposed between the top core and the bottom core. The top core may include at least one top flux shaping plate that vertically overlaps at least a portion of the windings.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 483,434, filed on February 6, 2023, entitled “FLUX SHAPING INDUCTORSTRUCTURES FOR REDUCED HIGH-FREQUENCY LOSSES,” the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to flux shaping inductor structures for reducing high frequency losses. Background Art

[0004] Magnetic components, such as electronic transformers or inductors, typically consist of a conductor (such as a winding) wound around a core. They come in many shapes and sizes and can provide different functions (e.g., energy storage, enabling soft switching operation of converters).

[0005] Conventional high-power, high-frequency inductor designs typically consist of core structures with a single air gap. The flux density distribution in these inductors is highly non-uniform and the energy density is low, resulting in relatively high energy losses and large footprint designs. Recently, various multi-gap core structures and pot cores have been proposed. An example can be found in: "J. D. Bortis and J. W. Kolar, “Novel Highly Efficient / Compact Automotive PCB Winding Inductors Based on the Compensating Air Gap Fringing Field Concept,” in IEEE Transactions on Power Electronics, vol. 35, no. 9, pp. 9617-9631, Sept. 2020, doi: 10.1109 / TPEL.2020.2969295. However, the structures disclosed in the paper are difficult to manufacture and assemble because they consist of multiple rings of different radii. Summary of the Invention

[0006] The embodiments disclosed herein each have several aspects, no single one of which is solely responsible for the desirable attributes of the present disclosure. Without limiting the scope of the present disclosure, its more salient features will now be briefly discussed. After considering this discussion, and particularly after reading the section entitled "Detailed Description," one will understand how the features of the embodiments described herein provide advantages over existing inductor structures.

[0007] One aspect is an inductor structure comprising: a top core including at least a top center flux shaping plate; a bottom core; a center leg vertically disposed between the top center flux shaping plate and the bottom core; and a winding disposed between the top and bottom cores and surrounding the center leg, wherein the center flux shaping plate may partially overlap at least a portion of the winding.

[0008] In the above inductor structure, the inductor structure further includes a housing surrounding the top core, the bottom core and the winding.

[0009] In the above inductor structure, the top core further includes a first top flux shaping plate and a second top flux shaping plate disposed on opposite sides of the top center flux shaping plate.

[0010] In the above inductor structure, the first top air gap is disposed between the first top flux shaping plate and the top center flux shaping plate, and the second air gap is disposed between the top center flux shaping plate and the second top flux shaping plate.

[0011] In the above inductor structure, the top core further includes a first additional top flux shaping plate disposed between the top center flux shaping plate and the first top flux shaping plate, and a second additional top flux shaping plate disposed between the top center flux shaping plate and the second top flux shaping plate.

[0012] In the above inductor structure, the inductor structure further includes a heat sink disposed below the bottom core.

[0013] In the above-described inductor structure, the windings are integrated into the printed circuit board.

[0014] In the above inductor structure, the winding includes a plurality of winding layers.

[0015] In the above inductor structure, the winding is provided at the midpoint of the top core and the bottom core.

[0016] In the above inductor structure, the winding is arranged near the bottom core.

[0017] In the above-described inductor structure, a portion of the winding is provided outside the inductor structure.

[0018] Another aspect is an inductor structure comprising: a top core including a top central flux shaping plate, a first top flux shaping plate, and a second top flux shaping plate; a bottom core including a bottom central flux shaping plate, a first bottom flux shaping plate, and a second bottom flux shaping plate; a center leg vertically disposed between the top central flux shaping plate and the bottom central flux shaping plate; and a winding disposed between the top core and the bottom core and surrounding the center leg.

[0019] In the above inductor structure, the first top air gap is disposed between the first top flux shaping plate and the top center flux shaping plate.

[0020] In the above inductor structure, a second air gap is provided between the top center flux shaping plate and the second top flux shaping plate.

[0021] In the above inductor structure, the first bottom air gap is provided between the first bottom flux shaping plate and the bottom center flux shaping plate.

[0022] In the above inductor structure, the second air gap is provided between the bottom center flux shaping plate and the second bottom flux shaping plate.

[0023] In the above inductor structure, the top core further includes a first additional top flux shaping plate disposed between the top center flux shaping plate and the first top flux shaping plate, and a second additional top flux shaping plate disposed between the top center flux shaping plate and the second top flux shaping plate.

[0024] In the above inductor structure, the bottom core further includes a first additional bottom flux shaping plate disposed between the bottom central flux shaping plate and the first bottom flux shaping plate, and a second additional bottom flux shaping plate disposed between the bottom central flux shaping plate and the second bottom flux shaping plate.

[0025] In the above inductor structure, the winding includes a plurality of winding layers.

[0026] In the above inductor structure, the winding is provided at the midpoint of the top core and the bottom core.

[0027] Any feature of one aspect may be applied to all aspects identified herein. In addition, any feature of one aspect may be combined in any manner with other aspects described herein, independently, in part, or in whole. For example, one, two, or three or more aspects may be combined in whole or in part. In addition, any feature of one aspect may be optional for other aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The foregoing and other features of the present disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. It should be understood that these drawings depict only several embodiments of the present disclosure and are not to be considered limiting of its scope, and the present disclosure will be described with additional specificity and detail through the use of the accompanying drawings.

[0029] Figure 1 A simplified schematic diagram of an example high-frequency inductor and transformer design is shown.

[0030] Figure 2An example of an inductor structure with flux shaping according to some embodiments is shown.

[0031] Figure 3A An example of a cross-sectional view of a closed pot core structure with flux shaping is shown in accordance with some embodiments.

[0032] Figure 3B According to some embodiments Figure 3A An example perspective view of a closed pot core structure.

[0033] Figure 3C According to some embodiments Figure 3A Near-field distribution of a closed pot-shaped core structure.

[0034] Figure 3D A comparative stray magnetic field is shown.

[0035] Figure 3E A graph showing ohmic losses versus layer-by-layer for inductor devices having the same inductance and the same footprint is shown.

[0036] Figure 4A 、 Figure 4B and Figure 4C An example of an open EE inductor structure with flux shaping on the top and bottom cores is shown in accordance with some embodiments.

[0037] Figure 4D Shown in a two-dimensional simulation Figures 4A to 4C Magnetic flux lines for the open EE inductor structure shown.

[0038] Figure 4E 、 Figure 4F and Figure 4G An example of an open EE inductor structure with flux shaping plates on the top and bottom cores according to some embodiments is shown. Reference numerals have been added.

[0039] Figure 4H and Figure 4I Another example of an open EE inductor structure with flux shaping plates formed on the top and bottom cores is shown in accordance with some embodiments.

[0040] Figure 5A 、 Figure 5B and Figure 5C Another example of an open EE inductor structure with flux shaping only on the top core is shown, in accordance with some embodiments.

[0041] Figure 5D Shown in a two-dimensional simulation Figures 5A to 5C Magnetic flux lines for the open EE inductor structure shown.

[0042] Figure 5E 、 Figure 5F and Figure 5G Another example of an open EE inductor structure with flux shaping only on the top core is shown, in accordance with some embodiments.

[0043] Figure 5H Another example of an open EE inductor structure with flux shaping formed only on the top core is shown, in accordance with some embodiments.

[0044] Figure 6A 、 Figure 6B and Figure 6C Components of a multi-gap EE design are shown.

[0045] Figure 6D A pot core structure is shown.

[0046] Figure 7A The flux density distribution of a wirewound inductor structure with a single air gap is shown.

[0047] Figure 7B and Figure 7C An example of a wire-wound flux shaping inductor structure with a multi-gap design on both side magnetic legs is shown in accordance with some embodiments.

[0048] Figure 7D According to some embodiments Figure 7B and Figure 7C The magnetic flux density distribution of the wire-wound flux shaping inductor structure is shown.

[0049] Figure 7E 、 Figure 7F and Figure 7G Another example of a wirewound flux shaping inductor structure with a multi-gap design on all magnetic legs is shown in accordance with some embodiments.

[0050] Figure 7H According to some embodiments Figures 7E to 7G The magnetic flux density distribution of the wire-wound flux shaping inductor structure is shown.

[0051] Figure 8A A toroidal inductor with a single air-gapped toroidal core is shown.

[0052] Figure 8B A toroidal inductor having a multi-gap toroidal core is shown in accordance with some embodiments.

[0053] Figure 8C Shown are some embodiments having Figure 8B The current density distribution of the toroidal inductor with a multi-gap toroidal core is shown.

[0054] The embodiments of the present disclosure and their advantages may be best understood by referring to the detailed description below. It should be understood that like reference numerals are used to identify like elements shown in one or more of the accompanying drawings, wherein the purpose of showing in the accompanying drawings is to illustrate the embodiments of the present disclosure and not to limit the embodiments of the present disclosure. DETAILED DESCRIPTION

[0055] Various embodiments of electronic inductors having a closed pot core structure with a flux shaping plate on the core center post are provided herein. Inductor structures in an open EE core (e.g., a core having an EE shape) configuration may generate significant stray magnetic fields, which may cause electromagnetic compatibility (EMC) issues for nearby components. To address these drawbacks, various embodiments are provided to minimize the stray magnetic field. Specifically, the present disclosure provides various embodiments, such as a closed pot core structure with a flux shaping plate on the core center post. Such a structure can keep strong magnetic fields confined within the core structure while having minimal stray fields, which can provide the advantage of reducing high-frequency conduction losses in copper due to flux shaping.

[0056] According to various embodiments, the multi-gap EE structure described herein can include plates with the same dimensions, thereby allowing for simpler manufacturing and easy assembly. In addition, in some embodiments, the proposed structure includes a closed pot core structure with flux shaping plates, which can solve the problem of stray magnetic fields (from magnetic structures) and improve conventional inductor designs.

[0057] Some embodiments may include an open EE core structure with 0, 1, 2, ..., n plates on the top and bottom cores. Some embodiments may include an open EE core structure with 0, 1, 2, ..., n plates only on the top core. Some embodiments may include a wirewound flux shaping inductor structure with distributed air gaps. Some embodiments may include a toroidal inductor with a multi-gap toroidal core.

[0058] In some embodiments, open EE inductor structures have air gaps with or without ferrite plates at strategic locations, which allow for reshaping of the magnetic flux to minimize high-frequency AC resistance and, therefore, conduction losses in the copper. Open EE inductor structures can have gaps or plates on only the top core, or on both the top and bottom cores. The presence of air gaps / flux-shaping plates on both the top and bottom cores allows for flux shaping of the windings from both sides. However, since the presence of an air gap on the bottom core plate can cause significant stray losses on the heat sink surface due to its close proximity to the core base plate, this structure is useful for designs where a heat sink is not present.

[0059] In contrast, an open EE inductor structure with a gap / plate only on the top core can have flux shaping on the winding from only one side. However, since there is no air gap in the bottom core plate, there may be minimal losses in the heat sink due to stray fields.

[0060] Existing multi-gap pot core structures require multiple annular rings of varying radii that must be manufactured and assembled together. In contrast, the multi-gap EE structure embodiments described herein can include plates of uniform dimensions, allowing for simpler manufacturing and easier assembly. Furthermore, the open EE structure can also allow the windings to be placed very close to the heat sink, even in locations where the core is not present. However, this can result in some inductive losses in the heat sink.

[0061] Wirewound flux shaping inductor structures with distributed air gaps can use square / rectangular plates to increase energy density due to a more uniform flux density in the core due to the multiple air gaps. This results in a smaller footprint compared to existing structures with a single air gap. Multi-gap inductor designs can also be envisioned with toroidal cores, achieving similar benefits of reduced footprint and lower losses compared to designs with a single air gap.

[0062] Various embodiments may be used for one or more of the following: on-board chargers in electric vehicles, stationary storage (such as power walls, giant batteries, or super charging piles), autonomous drive hardware, or any power electronic converter that requires energy storage and has soft switching requirements. Various embodiments may also cover all different concepts / structures that can be used for any power converter designed for any of the above applications. In some embodiments, the core structure can be made of magnetic materials, such as ferrites and powder cores. Various embodiments are superior to inductors designed with low permeability materials, with a single air gap or no air gap, which are less efficient designs than designs that do not have flux shaping features or have flux shaping features but have significant near fields. According to various embodiments, multi-gap designs can result in a smaller footprint, which helps to significantly improve converter power density. In addition, planar high power high frequency inductors can significantly increase power capacity at a lower cost, which can more efficiently produce components for electric vehicles or for energy storage devices.

[0063] Figure 1 1 shows a schematic example of a high frequency inductor and transformer design 100. In some embodiments, the high frequency inductor design 100 may include an inductor structure 110 (e.g., for high power and high frequency applications) and a transformer structure 120. However, as Figure 1As shown, the inductor design 100 can be used in resonant converter applications. In some embodiments, each of the inverter structure 110 and the transformer structure 120 can be implemented as discrete components. In addition, for new multi-level soft-switching inverter designs that do not require isolation and / or turns ratio changes, discrete high-power and high-frequency inductors will be needed.

[0064] Figure 2 Examples of various inductor structures 200 with flux shaping according to some embodiments are shown. The inductor structure with flux shaping may include a flux shaping plate on a center post in a closed pot core 210 (Example 1; see e.g. Figure 3A and Figure 3B ). The inductor structure with flux shaping may also include two or more flux shaping plates (0, 1, 2, ..., n) on the top and bottom cores in the open EE structure 220 (Example 2; see e.g. Figures 4A to 4C and Figures 4E to 4I ). The inductor structure with flux shaping can also be on only the top core in the open EE structure 230 (Example 3; see e.g. Figures 5A-5C and Figure 5E - FIG5I ) includes two or more flux shaping plates (0, 1, 2, ..., n). Inductor structures with flux shaping can also include multiple gaps on some or all of the core magnetic legs using Litz wire 240 (Example 4; see, for example, Figure 7B and Figure 7C ,as well as Figure 7E-7G ). Inductor structures with flux shaping may also include a toroidal core with a multi-gap design using foil / Litz wire 250 (Example 5; see e.g. Figure 8B ). The above designs are only examples, and the inductor structure with flux shaping may include other designs.

[0065] Figure 3A An example cross-sectional view of a closed pot core structure 300 with a flux shaping plate 310 is shown, in accordance with some embodiments. Figure 3B Example perspective views of various shapes of closed pot core structures are shown, according to some embodiments. Figure 3C According to some embodiments Figure 3A Near-field distribution of a closed pot-shaped core structure. Figure 3D A comparative stray magnetic field is shown. Figure 3E A plot comparing ohmic losses layer by layer for the same inductance and the same footprint is shown.

[0066] refer to Figure 3AThe closed pot core structure 300 may include a flux shaping plate 310 disposed on top of a center post 312. In some embodiments, the flux shaping plate 310 may form a top core. In some embodiments, the flux shaping plate 310 may have a width sized to at least partially vertically overlap one or more of the first winding portion 330 or the second winding portion 340. In some examples, the width of the flux shaping plate 310 may be greater than the width of the center post 312. In some embodiments, the center post 312 may be vertically disposed on a bottom core 314. In some examples, the bottom core 314 may include sidewalls 314A and 314B (hereinafter, the bottom core is generally referred to as including sidewalls 314A and 314B). A winding (e.g., a winding including the first winding portion 330 and the second winding portion 340) may be disposed between the flux shaping plate 310 and the bottom core 314. In some cases, housing 316 may be used to enclose flux shaping plate 310 (eg, top core), center post 312 , bottom core 314 , and windings (eg, windings including first winding portion 330 and second winding portion 340 ). Figure 3B 3 shows examples of various shapes of the inductor structure 300. For example, the inductor structure can have a circular structure, such as Figure 3B-1 As shown. The inductor structure can also have a rectangular structure, such as Figure 3B-2 Even if such structures have different shapes, these structures can also include various shapes of housing 316, flux shaping plate 310, Figure 3B-1 Winding 350 (only in Figure 3B-1 is shown in, and Figure 3B-2 May include PCD windings, which Figure 3B-2 ), center column 312 and bottom core 314.

[0067] like Figure 3C As shown in the near field distribution of FIG, for example, by using a flux shaping plate 310 that can block at least some stray magnetic fields, the closed pot core structure 300 can provide a minimum stray magnetic field. Figure 3C As shown, most of the magnetic field is confined within the inductor structure, such as Figure 3A The closed pot core structure 300 is shown. Figure 3D As further shown, the current density is significantly more uniform (360) in the closed pot core structure 300 including the flux shaping plates compared to the conventional design (350) that does not include the flux shaping plates. In addition, the current density of the closed pot core structure 300 including the flux shaping plates having the non-optimized shape (370) can also have significantly more uniform current density compared to the conventional design (350). Therefore, Figure 3C and Figure 3D The simulation results shown show the minimum stray magnetic field by using the flux shaping plate. Figure 3E , the closed pot core structure 300 can also have reduced ohmic losses when using the flux shaping plate 310. For example, each layer turn ( Figure 3E Each value of the x-axis of ) corresponds to the ohmic loss at low frequency and high frequency (e.g., 272 KHz) with or without the flux shaping plate, such that each bar corresponds to a relative layer turn, the right bar (382) may represent the ohmic loss at high frequency without the flux shaping plate, the center bar (384) may represent the ohmic loss at high frequency with the flux shaping plate, and the left bar (386) may represent the ohmic loss at low frequency. Figure 3E As shown, the ohmic loss can be increased at high frequencies. Figure 3E As further described in

[0045] , the increase in ohmic losses at high frequencies can be minimized by implementing a flux shaping plate, as shown by a comparison between bar 382 (without the flux shaping plate) and bar 384 (with the flux shaping plate), which provide minimized ohmic losses. In some embodiments, a structure having a closed pot core structure, such as closed pot core structure 300, can be used in designs that can be integrated with external components, such as heat sinks / cold blocks, metal covers, etc., which may present near-field issues.

[0068] Figure 4A shows a 2D view of an open EE inductor structure 400, Figure 4B shows an exploded view of an open EE inductor structure 400, Figure 4C An assembled view of the open EE inductor structure 400 is shown. Figure 4A 、 Figure 4B and Figure 4C An example of an open EE inductor structure 400 with flux shaping formed on the top and bottom cores is shown in accordance with some embodiments. Figure 4D shows a two-dimensional simulation according to some embodiments. Figures 4A to 4C Magnetic flux lines for the open EE inductor structure shown. Figure 4E 、 Figure 4F and Figure 4G An example of an open EE inductor structure 450 with flux shaping plates on the top and bottom cores is shown in accordance with some embodiments. Figure 4H and Figure 4I Another example of an open EE inductor structure 480 with flux shaping plates on the top and bottom cores is shown in accordance with some embodiments.

[0069] refer to Figures 4A to 4C, the open EE inductor structure 400 may include a top core 410, a bottom core 430, and a PCB winding 420 interposed between the top core 410 and the bottom core 430. The top core 410 may include a top center flux shaping plate 414 disposed or coupled to a top portion of a center column 418. In some embodiments, the top core 410 may further include a first top flux shaping plate 412 and a second top flux shaping plate 416. In some examples, the first top flux shaping plate 412 and the second top flux shaping plate 416 are disposed on opposite sides of the center top flux shaping plate 414. The top core 410 of the open EE inductor structure 400 may further include two top air gaps 422A and 422B. For example, the first top flux shaping plate 422A may be formed between the first top flux shaping plate 412 and the top center flux shaping plate 414. Additionally, a second top air gap 422B may be formed between the second top flux shaping plate 416 and the top center flux shaping plate 414 .

[0070] like Figures 4A to 4C As further shown, the bottom core 440 may include a bottom central flux shaping plate 434 disposed on or coupled to a bottom portion of the center leg 418. The bottom core 430 may include a bottom central flux shaping plate 434 disposed on or coupled to a bottom portion of the center leg 418. In some embodiments, the bottom core 430 may also include a first bottom flux shaping plate 432 and a second bottom flux shaping plate 436. In some examples, the first bottom flux shaping plate 432 and the second bottom flux shaping plate 436 are disposed on opposite sides of the center bottom flux shaping plate 434. The bottom core 430 of the open EE inductor structure 400 may also include two bottom air gaps 424A and 424B. For example, the first bottom flux shaping plate 432 and the bottom central flux shaping plate 434 may be formed between the first bottom flux shaping plate 432 and the bottom central flux shaping plate 434. Furthermore, a second bottom air gap 424B may be formed between the second bottom flux shaping plate 436 and the bottom center flux shaping plate 434. In some embodiments, the open EE inductor structure 400 may include a total of three top flux shaping plates (e.g., the first top flux shaping plate 412, the center top flux shaping plate 414, and the second top flux shaping plate 416) and a total of three bottom flux shaping plates (e.g., the first bottom flux shaping plate 432, the middle bottom flux shaping plate 434, and the second bottom flux shaping plate 436), each of which at least partially vertically overlaps the winding 420 (e.g., the PCB winding). Figure 4CAn example of an assembled view of an EE inductor structure 400 is shown. For example, the assembled EE inductor structure 400 may include a top core 410 (having a first top flux shaping plate 412, a center top flux shaping plate 414, and a second top flux shaping plate 416), a bottom core 430 (having a first bottom flux shaping plate 432, a center bottom flux shaping plate 434, and a second bottom flux shaping plate 436), a center post 418, and a winding 420 (e.g., a PCB winding). Figure 4C As shown, winding 420 can surround center leg 418. In some examples, a portion 420A of winding 420 can be excluded from EE inductor structure 400.

[0071] Figure 4D shows a two-dimensional simulation according to some embodiments. Figures 4A to 4C Magnetic flux lines on one side of the open EE inductor structure 400 are shown. Figure 4D As shown, the magnetic flux lines on one side of the open EE inductor structure 400 can be substantially parallel to the winding layers (e.g., layer (422)). This design may be superior to inductor structures that do not include a flux shaping plate, whose flux lines are substantially perpendicular to the winding layers, so that stray magnetic fields or AC winding losses can be minimized at high frequencies. Figure 4D The eight winding layers shown are merely examples, and the present disclosure is not limited thereto. For example, more or less than eight winding layers may be used.

[0072] Figures 4E to 4G 2D, exploded, and assembled views of an example of an open EE inductor structure 450 with flux shaping plates on the top and bottom cores according to some embodiments of the open EE inductor structure 400 are shown, respectively. Figures 4E to 4G , the open EE inductor structure 450 may include two additional top flux shaping plates 452 on the top core 410 and two additional bottom flux shaping plates 462 on the bottom core 430. In some embodiments, the open EE inductor structure 450 may include a total of five top flux shaping plates (e.g., the first top flux shaping plate 412, the first additional top flux shaping plate 452A, the center top flux shaping plate 414, the second additional top flux shaping plate 452B, and the second top flux shaping plate 416) and a total of five bottom flux shaping plates (e.g., the first bottom flux shaping plate 432, the first additional bottom flux shaping plate 462A, the center bottom flux shaping plate 434, the second additional bottom flux shaping plate 462B, and the second bottom flux shaping plate 436), each of which at least partially vertically overlaps the winding 420.

[0073] In some embodiments, the top core 410 may include a first top flux shaping plate 412, a first additional top flux shaping plate 452A, a center top flux shaping plate 414, a second additional top flux shaping plate 452B, and a second top flux shaping plate 416. In some examples, two plates (the first top flux shaping plate 412 and the first additional top flux shaping plate 452A) and two additional plates (the second top flux shaping plate 416 and the second additional top flux shaping plate 452B) are disposed on opposite sides of the center top flux shaping plate 414. In some embodiments, the top core 410 may include air gaps 454A-454D. For example, a first top air gap 454A may be formed between the first top flux shaping plate 412 and the first additional top flux shaping plate 452A; a second top air gap 454B may be formed between the first additional top flux shaping plate 452A and the center top flux shaping plate 414; a third top air gap 454C may be formed between the center top flux shaping plate 414 and the second additional top flux shaping plate 452B; and a fourth top air gap 454D may be formed between the second additional top flux shaping plate 452B and the second top flux shaping plate 416.

[0074] Figure 4E shows a 2D view of an open EE inductor structure 450, Figure 4F An exploded view of an open EE inductor structure 450 is shown. Figures 4E to 4FAs further shown, in some embodiments, the bottom core 430 can include a first bottom flux shaping plate 432, a first additional bottom flux shaping plate 462A, a center bottom flux shaping plate 434, a second additional bottom flux shaping plate 462B, and a second bottom flux shaping plate 436. In some examples, two plates (the first bottom flux shaping plate 432 and the first additional bottom flux shaping plate 462A) and two additional plates (the second bottom flux shaping plate 436 and the second additional bottom flux shaping plate 462B) are disposed on opposite sides of the center bottom flux shaping plate 434. In some embodiments, the bottom core 430 can include air gaps 456A-456D. For example, a first bottom air gap 456A may be formed between the first bottom flux shaping plate 432 and the first additional bottom flux shaping plate 462A; a second bottom air gap 456B may be formed between the first additional bottom flux shaping plate 462A and the center bottom flux shaping plate 434; a third bottom air gap 456C may be formed between the center bottom flux shaping plate 434 and the second additional bottom flux shaping plate 462B; and a fourth bottom air gap 454D may be formed between the second additional bottom flux shaping plate 462B and the second bottom flux shaping plate 436. Thus, the open EE inductor structure 450 may include four top air gaps 454A-454D and four bottom air gaps 456A-456D. In this design, stray magnetic fields or AC winding losses may be minimized at high frequencies.

[0075] Figure 4G An example of an assembled view of an open EE inductor structure 450 is shown. For example, the assembled open EE inductor structure 450 may include a top core 410 (having a first top flux shaping plate 412, a first additional top flux shaping plate 452A, a center top flux shaping plate 414, a second additional top flux shaping plate 452B, and a second top flux shaping plate 416), a bottom core 430 (having a first bottom flux shaping plate 432, a first additional bottom flux shaping plate 462A, a center bottom flux shaping plate 434, a second additional bottom flux shaping plate 462B, and a second bottom flux shaping plate 436), a center post 418, and a winding 420 (e.g., a PCB winding). Figure 4G As shown, winding 420 may surround center leg 418. In some examples, a portion 420A of winding 420 may not be included in open EE inductor structure 450.

[0076] Figure 4H Another example of an open EE inductor structure 480 with flux shaping plates formed on the top core 410 and the bottom core 430 is shown in accordance with some embodiments. Figure 4H and Figure 4I, the open EE inductor structure 480 can include four additional top flux shaping plates (482A, 482B, 482C, and 482D) on the top core 410 and four additional bottom flux shaping plates (492A, 492B, 492C, and 492D) on the bottom core 430. According to this design, the open EE inductor structure 480 can include a total of seven top flux shaping plates and a total of seven bottom flux shaping plates, each of which at least partially vertically overlaps the PCB winding. For example, the top core 410 can include a first top flux shaping plate 412, a first additional top flux shaping plate 482A, a second additional top flux shaping plate 482B, a center top flux shaping plate 414, a third additional top flux shaping plate 482C, a fourth additional top flux shaping plate 482D, and a second top flux shaping plate 416. Likewise, the bottom core 430 may include a first bottom flux shaping plate 432, a first additional bottom flux shaping plate 492A, a second additional bottom flux shaping plate 492B, a center bottom flux shaping plate 434, a third additional bottom flux shaping plate 462C, a fourth additional bottom flux shaping plate 462D, and a second bottom flux shaping plate 436. As a result, the open EE inductor structure 480 may include six top air gaps. For example, six top air gaps may be provided (1) between the first top flux shaping plate 412 and the first additional top flux shaping plate 482A; (2) between the first additional top flux shaping plate 482A and the second additional top flux shaping plate 482B; (3) between the second additional top flux shaping plate 482B and the center top flux shaping plate 414; (4) between the center top flux shaping plate 414 and the third additional top flux shaping plate 482C; (5) between the third additional top flux shaping plate 482C and the fourth additional top flux shaping plate 482D; and (6) between the fourth additional top flux shaping plate 482D and the second top flux shaping plate 416. In addition, six bottom air gaps can be provided (1) between the first bottom flux shaping plate 432 and the first additional bottom flux shaping plate 492A; (2) between the first additional bottom flux shaping plate 492A and the second additional bottom flux shaping plate 492B; (3) between the second additional bottom flux shaping plate 492B and the center bottom flux shaping plate 434; (4) between the center bottom flux shaping plate 434 and the third additional bottom flux shaping plate 462C; (5) between the third additional bottom flux shaping plate 462C and the fourth additional bottom flux shaping plate 462D; and (6) between the fourth additional bottom flux shaping plate 462D and the second bottom flux shaping plate 436. In some embodiments, the winding 420 can be provided between the top core 410 and the bottom core 430. In these embodiments, the winding 420 can surround the center column 418.

[0077] In some embodiments, as Figure 4IAs shown, Figure 4H The example of the open EE inductor structure 480 shown may also include a plurality of plates 494 in each sidewall of the bottom core 430 and a plurality of coils 496 surrounding the center post 418 .

[0078] Figures 4A to 4I The inductor structures shown above are merely examples, and the present disclosure is not limited thereto. For example, more than seven top flux shaping plates and / or seven bottom flux shaping plates may be provided. Furthermore, more than six top air gaps and / or more than six bottom air gaps may be provided.

[0079] Figures 5A to 5C 2D, exploded, and assembled views of an example of an open EE inductor structure 500 with flux shaping only on the top core according to some embodiments are shown, respectively. Figures 5A to 5C The open EE inductor structure 500 may include a top core 510, a bottom core 530, and a PCB winding 520, which is generally interposed between the top core 510 and the bottom core 530. The top core 410 may include three flux shaping plates 512-516. The open EE inductor structure 500 may include two top air gaps 522 formed between a center flux shaping plate 514 and side flux shaping plates 512 and 516. The bottom core 530 may not include a flux shaping plate. The open EE inductor structure 500 may not include a bottom air gap. A heat sink / cold plate 540 may be positioned below the bottom core 530. According to this design, the open EE inductor structure 500 may include a total of three top flux shaping plates, each of which at least partially vertically overlaps the PCB winding 520. Figure 5C An example of an assembled view of an EE inductor structure 500 is shown. For example, the assembled EE inductor structure 500 may include a top core 510 (having a first top flux shaping plate 512, a center top flux shaping plate 514, and a second top flux shaping plate 516), a bottom core 530, a center post 518, and a winding 520 (e.g., a PCB winding). Figure 5C As shown, winding 520 can surround center leg 518. In some examples, portion 520A of winding 520 can be excluded from EE inductor structure 500.

[0080] Figure 5D Shown in a two-dimensional simulation Figures 5A to 5C The magnetic flux lines of the open EE inductor structure shown in FIG. Figure 5DAs shown, the magnetic flux lines 524 of the open EE inductor structure 500 can be substantially parallel to the windings 520 (e.g., winding layers). This design may be advantageous over conventional inductor structures that do not include a flux shaping plate, whose magnetic flux lines are substantially perpendicular to the winding layers, so that stray magnetic fields or AC winding losses can be minimized at high frequencies.

[0081] Figure 5E 、 Figure 5F and Figure 5G Another example of an open EE inductor structure 550 with flux shaping only on the top core is shown in accordance with some embodiments. Figures 5E to 5G , the open EE inductor structure 550 may include two additional top flux shaping plates 552 formed only on the top core. According to this design, the open EE inductor structure 550 may include a total of five top flux shaping plates 552, each of which at least partially vertically overlaps the PCB winding. As a result, the open EE inductor structure 550 may include a total of four top air gaps 554 ( Figure 5E (There is only one top air gap with designated leads and reference numerals in the diagram.) This design can be used to shape the electromagnetic field generated by the PCB windings. In some embodiments, a heat sink 540 can be disposed (e.g., assembled) at the bottom of the bottom core. The heat sink 540 can help cool the core / windings. The present disclosure does not limit the type and / or number of heat sinks. These types and / or numbers of heat sinks can be determined based on the specific application.

[0082] Figures 5E to 5G 2D, exploded, and assembled views of an example of an open EE inductor structure 550 with a flux shaping plate on the top core according to some embodiments of the open EE inductor structure 500 are shown, respectively. Figures 5E to 5G , the open EE inductor structure 550 can include two additional top flux shaping plates 552 on the top core 510. In some embodiments, the open EE inductor structure 550 can include a total of five top flux shaping plates (e.g., a first top flux shaping plate 512, a first additional top flux shaping plate 552A, a center top flux shaping plate 514, a second additional top flux shaping plate 552B, and a second top flux shaping plate 516), each of which at least partially vertically overlaps the winding 420. The open EE inductor structure 550 can be configured to minimize stray electromagnetic fields generated by PCB windings of the open EE inductor structure 550. In some embodiments, a heat sink 540 at the bottom of the open EE inductor structure 550 can be assembled to cool the core / windings.

[0083] In some embodiments, as Figure 5E and Figure 5FAs shown, the top core 510 may include a first top flux shaping plate 512, a first additional top flux shaping plate 552A, a center top flux shaping plate 514, a second additional top flux shaping plate 552B, and a second top flux shaping plate 516. In some examples, two plates (the first top flux shaping plate 512 and the first additional top flux shaping plate 552A) and two additional plates (the second top flux shaping plate 516 and the second additional top flux shaping plate 552B) are disposed on opposite sides of the center top flux shaping plate 514. In some embodiments, the top core 510 may include air gaps 554A to 554D. For example, a first top air gap 554A may be formed between the first top flux shaping plate 512 and the first additional top flux shaping plate 552A; a second top air gap 554B may be formed between the first additional top flux shaping plate 552A and the central top flux shaping plate 514; a third top air gap 554C may be formed between the central top flux shaping plate 514 and the second additional top flux shaping plate 552B; and a fourth top air gap 554D may be formed between the second additional top flux shaping plate 552B and the second top flux shaping plate 416.

[0084] Figure 5G An example of an assembled view of an open EE inductor structure 550 is shown. For example, the assembled open EE inductor structure 550 may include a top core 510 (having a first top flux shaping plate 512, a first additional top flux shaping plate 552A, a center top flux shaping plate 514, a second additional top flux shaping plate 552B, and a second top flux shaping plate 516), a center post 518, a bottom core 530, and windings 520 (e.g., PCB windings). Figure 5G As shown, winding 520 can surround center leg 518. In some examples, portion 520A of winding 520 can be excluded from open EE inductor structure 550.

[0085] Figure 5H Another example of an open EE inductor structure 580 with flux shaping plates formed on the top core 510 and the bottom core 530 is shown in accordance with some embodiments. Figure 5H, the open EE inductor structure 580 can include four additional top flux shaping plates (582A, 582B, 582C, and 582D) on the top core 510. According to this design, the open EE inductor structure 580 can include a total of seven top flux shaping plates, each of which at least partially vertically overlaps the PCB winding. For example, the top core 510 can include a first top flux shaping plate 512, a first additional top flux shaping plate 582A, a second additional top flux shaping plate 582B, a center top flux shaping plate 514, a third additional top flux shaping plate 582C, a fourth additional top flux shaping plate 582D, and a second top flux shaping plate 516. As a result, the open EE inductor structure 580 can include six top air gaps. For example, six top air gaps can be provided (1) between the first top flux shaping plate 512 and the first additional top flux shaping plate 582A; (2) between the first additional top flux shaping plate 582A and the second additional top flux shaping plate 582B; (3) between the second additional top flux shaping plate 582B and the center top flux shaping plate 514; (4) between the center top flux shaping plate 514 and the third additional top flux shaping plate 582C; (5) between the third additional top flux shaping plate 582C and the fourth additional top flux shaping plate 582D; and (6) between the fourth additional top flux shaping plate 582D and the second top flux shaping plate 516. In some embodiments, the winding 520 can be provided between the top core 510 and the bottom core 530. In these embodiments, the winding 520 can surround the center post 518.

[0086] Figures 5A to 5H The above-described inductor structure shown in FIG is merely an example, and the present disclosure is not limited thereto. For example, a total of more than seven top flux shaping plates may be provided. Furthermore, more than six top air gaps may be provided.

[0087] Figure 6A 、 Figure 6B and Figure 6C Shown with Figure 6D The ease of assembly of the multi-gap EE design 600 is compared to the pot core structure 650 shown. Figure 6A As shown, open EE inductor structures 600 with various multi-gap EE designs can be assembled with precise spacing of the plates 625. For example, Figure 6A 、 Figure 6B and Figure 6C The example of a multi-gap EE design 600 shown in FIG can be assembled with gap 610, gap 620, and gap 630, respectively. Given that these gaps 610, 620 can occur between straight parallel plates 625, equal spacing and consistent air gaps can be maintained across all plates 625.

[0088] refer to Figure 6D , conventional multi-gap pot core design 650 requires assembly of annular rings 640 of different radii. Figure 6D In designs with a ring, it may be difficult to ensure the same air gap length across the entire diameter of the ring.

[0089] Figure 7A Figure 2 shows the magnetic flux density distribution of a conventional wire-wound inductor structure with a single air gap. Figure 7A As shown, a wirewound inductor structure with a single air gap may reduce the magnetic field (eg, as shown at 702 ) and thus may store less energy overall (as shown at 704 ).

[0090] Figure 7B and Figure 7C An example wire wound flux shaping inductor structure 700 is shown having a multi-gap design on two vertical side magnetic legs 710 and 720 according to some embodiments. In this embodiment, only the two vertical magnetic legs 710, 720 may include multiple gaps 730. Although Figure 7B A certain number of gaps 730 are shown on the vertical magnetic pillars 710 and 720, but the present disclosure does not limit the number of gaps. In some embodiments, multiple gaps can be formed on the horizontal magnetic pillars, such as horizontal magnetic pillars 740 and 750. In some embodiments, as shown in FIG. Figure 7C As shown, the wire can be wrapped around Figure 7B The horizontal gap and vertical gap of the inductor structure shown. Figures 7E to 7G Compared with the embodiment of Figures 7E to 7G In an embodiment, multiple gaps are formed on all magnetic pillars.

[0091] Figure 7D According to some embodiments Figure 7B and Figure 7C The magnetic flux density distribution of the wire-wound flux shaping inductor structure shown in FIG. Figure 7D As shown, Figure 7A The magnetic flux density distribution of the wire wound flux shaping inductor structure 700 shows an improved magnetic field for more storage compared to the design of FIG.

[0092] Figure 7E 、 Figure 7F and Figure 7G Another example of a wire-wound flux shaping inductor structure 750 with a multi-gap design on all magnetic legs is shown in FIG. Figure 7E As shown, a plurality of air gaps 730 may be formed in the vertical magnetic columns 710, 720 and the horizontal magnetic columns 740, 750. Figure 7F As shown, a wire 760 may be wound around each of the vertical magnetic columns 710 , 720 and the horizontal magnetic columns 740 , 750 . Figure 7FIt can be called Litz wire winding, Figure 7G A prototype sample is shown. Figure 7G As shown, a plurality of air gaps 730 may be formed in the vertical magnetic pillars 710, 720 and the horizontal magnetic pillars 740, 750. In addition, a wire 760 may be wound around each of the vertical magnetic pillars 710, 720 and the horizontal magnetic pillars 740, 750.

[0093] Figure 7H According to some embodiments Figures 7E to 7G The magnetic flux density distribution of the wire wound flux shaping inductor structure 750 is shown. Figure 7H As shown, Figure 7B Compared to the embodiment of the present invention, the wire-wound flux shaping inductor structure 750 can provide a substantially more uniform magnetic flux density distribution and can store more energy due to the multiple air gaps on all magnetic legs.

[0094] Figure 8A A toroidal inductor 800 is shown having a single air gap 810 toroidal core. Figure 8B 8 shows a toroidal inductor 850 having a multi-gap toroidal core according to some embodiments. The toroidal inductor 800 may include a large single air gap 810. In some embodiments, as Figure 8B As shown, the toroidal inductor 850 may include multiple, smaller air gaps 820 .

[0095] Figure 8C Shown are some embodiments having Figure 8B The current density distribution of the toroidal inductor 850 with multiple air gap toroidal core is shown. Figure 8C As shown, compared to the toroidal inductor 800 including a large single air gap 810 , the toroidal inductor 850 including multiple smaller air gaps 860 can provide a more uniform current density distribution, thereby reducing high-frequency winding losses and increasing stored energy density.

[0096] Features, materials, characteristics or groups described in conjunction with a particular aspect, embodiment or example are to be understood to be applicable to any other aspect, embodiment or example described in this section or elsewhere in this specification unless incompatible therewith. All features disclosed in this specification (including any accompanying claims, abstract and drawings) and / or all steps of any method or process so disclosed may be combined in any combination, except combinations in which at least some of such features and / or steps are mutually exclusive. Protection is not limited to the details of any foregoing embodiments. Protection extends to any novel feature or any novel combination of features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel step or any novel combination of steps of any method or process so disclosed.

[0097] Furthermore, certain features described in this disclosure in the context of separate implementations may also be implemented in combination in a single implementation. Conversely, various features described in the context of a single implementation may also be implemented in multiple implementations individually or in any suitable subcombination. Furthermore, while features may be described above as functioning in certain combinations, in some cases one or more features from a claimed combination may be deleted from the combination, and the combination may be claimed as a subcombination or variation of a subcombination.

[0098] In addition, although operations may be depicted in the drawings or described in the specification in a particular order, such operations do not need to be performed in the particular order shown or in sequence, or all operations need not be performed to achieve the desired results. Other operations not depicted or described may be incorporated into the example methods and processes. For example, one or more additional operations may be performed before, after, simultaneously with, or between any of the operations described. In addition, in other implementations, the operations may be rearranged or reordered. Those skilled in the art will understand that in some embodiments, the actual steps taken in the processes shown and / or disclosed may be different from those shown in the figures. Depending on the embodiment, some of the steps described above may be removed and other steps may be added. In addition, the features and attributes of the specific embodiments disclosed above may be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Moreover, the separation of various system components in the above-described embodiments should not be understood as requiring such separation in all embodiments, and it should be understood that the described components and systems may generally be integrated together in a single product or packaged into multiple products. For example, any component of the energy storage system described herein may be provided separately or integrated together (e.g., packaged together or connected together) to form an energy storage system.

[0099] For purposes of this disclosure, certain aspects, advantages, and novel features are described herein. Not all of these advantages need be achieved according to any particular embodiment. Thus, for example, one skilled in the art will recognize that the present disclosure can be practiced or implemented in a manner that achieves one advantage or group of advantages taught herein without necessarily achieving other advantages taught or suggested herein.

[0100] Conditional language, such as "can," "could," "might," or "may," unless otherwise specifically stated or understood in the context of use, is generally intended to convey that certain embodiments include and other embodiments do not include certain features, elements, and / or steps. Thus, such conditional language is generally not intended to imply that one or more embodiments in any way require features, elements, and / or steps, or that one or more embodiments must include logic for determining, with or without user input or prompting, whether such features, elements, and / or steps are included or to be performed in any particular embodiment.

[0101] Unless expressly stated otherwise, conjunctive language such as the phrase "at least one of X, Y, and Z" should be understood in context as generally used to express an item, a term, etc., may be X, Y, or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z.

[0102] Language of degree as used herein, such as the terms “approximately,” “about,” “generally,” and “substantially” as used herein, means a value, amount, or characteristic that is close to a stated value, amount, or characteristic, which still performs a desired function or achieves a desired result.

[0103] The scope of the present disclosure is not intended to be limited by the specific disclosure of the embodiments in this section or elsewhere in this specification, and may be defined by the claims set forth in this section or elsewhere in this specification or set forth in the future. The language of the claims should be interpreted broadly based on the language employed in the claims and not limited to the examples described in this specification or during the prosecution, which examples should be construed as non-exclusive.

[0104] Although certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the present disclosure. In fact, the novel methods and systems described herein can be implemented in various other forms. In addition, various omissions, substitutions, and changes can be made to the systems and methods described herein without departing from the spirit of the present disclosure. The accompanying claims and their equivalents are intended to cover these forms or modifications that fall within the scope and spirit of the present disclosure. Therefore, the scope of the present invention is limited only by the accompanying claims.

Claims

1. An inductor structure comprising: a top core comprising at least a top center flux shaping plate; bottom core; a center post vertically disposed between the top center flux shaping plate and the bottom core; as well as A winding is disposed between the top core and the bottom core and around the central leg, with the central flux shaping plate partially overlapping at least a portion of the winding. 2 . The inductor structure of claim 1 , further comprising a housing surrounding the top core, the bottom core, and the winding.

3. The inductor structure of claim 1 , wherein the top core further comprises a first top flux shaping plate and a second top flux shaping plate disposed on opposite sides of the top center flux shaping plate, wherein a first top air gap is disposed between the first top flux shaping plate and the top center flux shaping plate, and wherein a second air gap is disposed between the top center flux shaping plate and the second top flux shaping plate.

4. The inductor structure of claim 3 , wherein the top core further comprises: a first additional top flux shaping plate disposed between the top central flux shaping plate and the first top flux shaping plate; as well as A second additional top flux shaping plate is disposed between the top central flux shaping plate and the second top flux shaping plate. 5 . The inductor structure according to claim 1 , further comprising a heat sink disposed below the bottom core.

6. The inductor structure according to any one of claims 1 to 5, wherein the winding is integrated into a printed circuit board.

7. The inductor structure according to any one of claims 1 to 6, wherein the winding comprises a plurality of winding layers.

8. The inductor structure according to any one of claims 1 to 7, wherein the winding is provided at a midpoint of the top core and the bottom core.

9. The inductor structure according to any one of claims 1 to 7, wherein the winding is provided adjacent to the bottom core.

10. The inductor structure according to any one of claims 1 to 9, wherein a portion of the winding is arranged outside the inductor structure.

11. An inductor structure comprising: a top core comprising a top center flux shaping plate, a first top flux shaping plate, and a second top flux shaping plate; a bottom core comprising a bottom center flux shaping plate, a first bottom flux shaping plate, and a second bottom flux shaping plate; a central column vertically disposed between the top central flux shaping plate and the bottom central flux shaping plate; as well as A winding is disposed between the top core and the bottom core and surrounds the center post.

12. The inductor structure of claim 11, wherein a first top air gap is disposed between the first top flux shaping plate and the top center flux shaping plate, and wherein a second air gap is disposed between the top center flux shaping plate and the second top flux shaping plate.

13. The inductor structure of claim 11 or 12, wherein a first bottom air gap is provided between the first bottom flux shaping plate and the bottom central flux shaping plate, and wherein a second air gap is provided between the bottom central flux shaping plate and the second bottom flux shaping plate.

14. The inductor structure according to any one of claims 11 to 13, wherein the top core further comprises: a first additional top flux shaping plate disposed between the top central flux shaping plate and the first top flux shaping plate; as well as a second additional top flux shaping plate disposed between the top central flux shaping plate and the second top flux shaping plate, and wherein the bottom core further comprises: a first additional bottom flux shaping plate disposed between the bottom central flux shaping plate and the first bottom flux shaping plate; as well as A second additional bottom flux shaping plate is disposed between the bottom central flux shaping plate and the second bottom flux shaping plate.

15. The inductor structure according to any one of claims 11 to 14, wherein the winding comprises a plurality of winding layers.

16. The inductor structure of any one of claims 11 to 15, wherein the winding is provided at a midpoint of the top core and the bottom core.

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