Display panel and preparation method thereof

Abstract

The invention provides a display panel and a preparation method thereof, and the display panel is provided with a display area and a non-display area, and comprises a substrate, and a packaging structure, a protection layer and a plurality of light-emitting devices which are located on the substrate. The light-emitting device is located in the display area. The packaging structure is located on the side, away from the substrate, of the light-emitting device and comprises a first packaging layer and a second packaging layer located on the side, away from the substrate, of the first packaging layer, the light-emitting device is covered with the first packaging layer and the second packaging layer, and the orthographic projection of the second packaging layer on the substrate is located in the display area and the non-display area. At least part of the protection layer is located in the non-display area and located on the side, close to the substrate, of the second packaging layer, in the non-display area, the protection layer makes direct contact with the second packaging layer, and the protection layer and the second packaging layer are the same in material type. The protection layer can protect the structure below in the preparation process of the first packaging layer, so that the substrate or the structure between the substrate and the protection layer is prevented from being damaged, and the quality of the display panel is ensured.

Description

Display panel and manufacturing method thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to Chinese Patent Application No. 202311550470.0 filed on November 16, 2023, Chinese Patent Application No. 202410141739.8 filed on January 31, 2024, Chinese Patent Application No. 202410181878.3 filed on February 18, 2024, and Chinese Patent Application No. 202410239791.7 filed on March 1, 2024. The contents of the above-mentioned Chinese patent application disclosures are hereby incorporated by reference in their entirety as a part of this application. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular, to a display panel and a method for manufacturing the same. Background Art

[0004] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0005] However, current electronic display products are limited by their own structural designs, making it difficult to further improve the yield of display panels.

[0006] Summary of the Invention

[0007] According to a first aspect of the present disclosure, there is provided a display panel having a display area and a non-display area, and comprising a substrate and an encapsulation structure, a protective layer and a plurality of light-emitting devices located on the substrate. The light-emitting device is located in the display area. The encapsulation structure is located on a side of the light-emitting device away from the substrate, and comprises a first encapsulation layer and a second encapsulation layer located on a side of the first encapsulation layer away from the substrate, the first encapsulation layer and the second encapsulation layer covering the light-emitting device, and the orthographic projection of the second encapsulation layer on the substrate is located in the display area and the non-display area. At least a portion of the protective layer is located in the non-display area, and is located on a side of the second encapsulation layer close to the substrate. In the non-display area, the protective layer is in direct contact with the second encapsulation layer, and the protective layer and the second encapsulation layer are made of the same material type.

[0008] In the above solution, the protective layer can protect the underlying structure during the preparation process of the first encapsulation layer to prevent the substrate or the structure between the substrate and the protective layer from being damaged, thereby ensuring the quality of the display panel.

[0009] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a pixel defining layer located on the substrate, the pixel defining layer is located in the display area and is provided with a plurality of pixel openings, the pixel openings are used to accommodate the light-emitting device, the protective layer includes a first sub-protective layer, the first sub-protective layer overlaps the pixel defining layer, and in the non-display area, the first sub-protective layer is in direct contact with the second encapsulation layer.

[0010] In the above solution, the first sub-protective layer and the pixel defining layer are overlapped to avoid a gap therebetween, thereby improving the protection effect on the underlying structure during the preparation process of the first encapsulation layer.

[0011] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer, the first encapsulation layer, the second encapsulation layer, and the protective layer are all inorganic film layers. The inorganic film layers have high density and stronger etching barrier effect, thereby improving the protective effect of the underlying structure.

[0012] Optionally, the material of the pixel defining layer, the first encapsulation layer, the second encapsulation layer and the protective layer includes one of silicon oxide, silicon nitride and silicon oxynitride.

[0013] In a specific embodiment of the first aspect of the present disclosure, the first subprotective layer is formed from the same material as the pixel defining layer, so that the first subprotective layer can be prepared simultaneously with the pixel defining layer, thereby simplifying the display panel manufacturing process.

[0014] Optionally, when the first subprotection layer and the pixel defining layer are in the same layer and made of the same material, the orthographic projection of the first subprotection layer on the substrate is located within the non-display area.

[0015] In a specific embodiment of the first aspect of the present disclosure, the first subprotective layer is located on a side of the pixel defining layer that faces the substrate. For example, an orthographic projection of the first subprotective layer on the substrate is located in a display area and a non-display area, and in the display area, the first subprotective layer at least partially overlaps with the pixel defining layer, and the first subprotective layer is located between the pixel defining layer and the substrate.

[0016] In the above solution, during the process of forming the pixel defining layer, the first sub-protection layer formed before the pixel defining layer can protect the underlying structure to ensure the quality of the display panel.

[0017] Optionally, when the first subprotective layer is located on the substrate-facing side of the pixel defining layer, the orthographic projection of the pixel defining layer on the substrate is located within the orthographic projection of the first subprotective layer on the substrate. In this way, the first subprotective layer covers the entire display area, thereby protecting the structures in the display area located below the pixel defining layer during the pixel defining layer formation process.

[0018] In a specific embodiment of the first aspect of the present disclosure, where the first subprotective layer is located on the substrate-facing side of the pixel-defining layer, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, with the first subprotective layer located between the first electrode and the substrate. In this manner, the provision of the first subprotective layer does not affect the arrangement and formation of the first electrode; furthermore, this approach can strengthen the bonding strength of the first electrode to the substrate (via the first subprotective layer), thereby reducing the risk of the first electrode falling off.

[0019] In a specific embodiment of the first aspect of the present disclosure, when the layer where the first subprotective layer is located is located on the side of the layer where the pixel defining layer is located facing the substrate, the display panel also includes a first flat layer located between the substrate and the first electrode, the first flat layer is located in the display area and the non-display area, and contacts the first subprotective layer in the non-display area, and in the display area, the first subprotective layer is located between the first electrode and the first flat layer.

[0020] In the above solution, the first sub-protective layer can protect the first flat layer during the preparation process of the first encapsulation layer to prevent the first flat layer from being damaged, thereby ensuring the quality of the display panel.

[0021] Optionally, in the case where the layer where the first subprotective layer is located is located on the side of the layer where the pixel defining layer is located facing the substrate, the display panel also includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on the side of the first subprotective layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first subprotective layer and the substrate, the first common electrode line is electrically connected to the second electrode, and in the non-display area, a first via hole is provided in the first subprotective layer, a second via hole connected to the first via hole is provided in the first flat layer, and the first common electrode line and the second common electrode line are connected through the first via hole and the second via hole.

[0022] In the above scheme, the first common electrode line and the second common electrode line constitute a common electrode line, and the first sub-protective layer and the first flat layer are provided with a first via hole and a second via hole for connecting the first common electrode line and the second common electrode line, so as to ensure that the common electrode line is connected to the second electrode while the main part of the non-display area (the second common electrode line) can be covered by the first sub-protective layer and the first flat layer, thereby reducing the risk of the common electrode line being damaged during the preparation process of the first encapsulation layer and the light-emitting device.

[0023] In one specific embodiment of the first aspect of the present disclosure, the first subprotective layer is located on a side of the pixel defining layer that faces away from the substrate. For example, an orthographic projection of the first subprotective layer on the substrate is located in the display area and the non-display area, and in the display area, the first subprotective layer at least partially overlaps with the pixel defining layer, and the pixel defining layer is located between the first subprotective layer and the substrate.

[0024] In the above solution, the first subprotection layer covers the edge portion of the pixel defining layer to enclose the pixel defining layer, thereby reducing the risk of cracks occurring at the edge of the pixel defining layer.

[0025] In a specific embodiment of the first aspect of the present disclosure, when the first subprotective layer is located on a side of the pixel defining layer facing away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate, and the orthographic projection of the first subprotective layer on the substrate is located outside the orthographic projection of the first electrode on the substrate in a direction away from the substrate. In this way, the provision of the first subprotective layer does not affect the provision and formation of the first electrode, thereby ensuring the quality of the light-emitting device.

[0026] In a specific embodiment of the first aspect of the present disclosure, when the layer where the first subprotective layer is located is located on the side of the layer where the pixel defining layer is located away from the substrate, the display panel also includes a first flat layer located between the substrate and the first electrode, and the first flat layer is located in the display area and the non-display area, and contacts the first subprotective layer in the non-display area.

[0027] Optionally, in the case where the layer where the first subprotective layer is located is located on the side of the layer where the pixel defining layer is located away from the substrate, the display panel also includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on the side of the first subprotective layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first subprotective layer and the substrate, the first common electrode line is electrically connected to the second electrode, and in the non-display area, a first via hole is provided in the first subprotective layer, a second via hole connected to the first via hole is provided in the first flat layer, and the first common electrode line and the second common electrode line are connected through the first via hole and the second via hole.

[0028] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes at least one dam located in the non-display area, wherein the dam surrounds at least a portion of the display area, the dam includes a top film layer away from the side of the substrate, the first sub-protective layer is in contact with the top film layer, and the first sub-protective layer and the top film layer are made of the same material.

[0029] In the above solution, the first sub-protection layer can protect the side surface of the dam during the preparation of the pixel definition layer to reduce the risk of the dam being damaged by etching.

[0030] Optionally, the top film layer is an inorganic film layer. In this case, when the first sub-protective layer is an inorganic film layer, the top film layer and the first sub-protective layer can have a high bonding strength, thereby reducing the risk of the top film layer and the first sub-protective layer falling off the substrate. Furthermore, as an inorganic film layer, the top film layer has a high density, thereby preventing water, oxygen, and other substances from invading the interior of the dam.

[0031] In a specific embodiment of the first aspect of the present disclosure, the first sub-protective layer is provided on the same layer as the top layer, and the first sub-protective layer covers the side surface of the dam. In this way, the top layer can be prepared simultaneously during the preparation of the first sub-protective layer, thereby simplifying the manufacturing process of the display panel.

[0032] In another specific embodiment of the first aspect of the present disclosure, the first sub-protective layer covers the top film layer. The first sub-protective layer is located on a side of the top film layer facing away from the substrate, and the orthographic projection of the top film layer on the substrate is located within the orthographic projection of the first sub-protective layer on the substrate. Thus, the first sub-protective layer covers the top film layer to protect the top film layer during the pixel definition layer preparation process, thereby reducing the risk of damage to the dam due to etching.

[0033] In a specific embodiment of the first aspect of the present disclosure, the top film layer includes multiple first openings, the orthographic projection of the first sub-protective layer on the substrate is located outside the orthographic projection of the first opening on the substrate, the orthographic projection of the first opening on the substrate is located within the orthographic projection of the second encapsulation layer on the substrate, the orthographic projection of the first opening on the substrate is located within the orthographic projection of the second encapsulation layer on the substrate, and the second encapsulation layer covers and fills the first openings.

[0034] In the above scheme, the first opening can be used to release the gas trapped inside the dam to ensure the packaging effect of the display panel; in addition, the second packaging layer covers and fills the first opening to seal the first opening, thereby preventing gas from invading the dam or the escape of residual gas in the dam during the subsequent preparation process; in addition, the setting of the first opening is equivalent to embedding the second packaging layer in the dam, thereby reducing the risk of the second packaging layer falling off the substrate.

[0035] In one embodiment of the first aspect of the present disclosure, the dam includes a support layer positioned between the top film layer and the substrate, and the first sub-protective layer covers a side surface of the support layer. Thus, the top film layer and the first sub-protective layer fully cover the support layer to protect the support layer.

[0036] Optionally, the support layer is an organic film layer. The organic film layer is thicker, which facilitates increasing the height of the dam. Accordingly, the organic film layer is also easily etched. When the top film layer and the first sub-protective layer are covered, the etching risk of the support layer is reduced.

[0037] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a first planarizing layer, the first planarizing layer being located in the display area and the non-display area, the first planarizing layer being located between the pixel defining layer and the substrate, and between the first sub-protective layer and the substrate, at least a portion of the support layer being formed from the same layer and material as the first planarizing layer, and the first planarizing layer being spaced apart from the dam. In this manner, the support layer can be prepared simultaneously with the preparation of the first planarizing layer, thereby simplifying the display panel manufacturing process.

[0038] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a third encapsulation layer, the third encapsulation layer being located between the first encapsulation layer and the second encapsulation layer. The third encapsulation layer is located on the side of the dam facing the display area, and the first subprotective layer is in direct contact with the third encapsulation layer between the dam and the display area. Optionally, the third encapsulation layer is an organic film layer. The dam defines a distribution area for the third encapsulation layer, and the first subprotective layer and the second encapsulation layer sandwich the third encapsulation layer to protect it.

[0039] In a specific embodiment of the first aspect of the present disclosure, the protective layer further includes a second subprotective layer, at least a portion of the second subprotective layer is located in the non-display area, and in the non-display area, the second subprotective layer is located between the first subprotective layer and the substrate.

[0040] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a first flat layer, the first flat layer being located in the display area and the non-display area, the first flat layer being located between the pixel defining layer and the substrate, and between the first sub-protective layer and the substrate, and in the non-display area, the orthographic projection of the first flat layer on the substrate is located within the orthographic projection of the first sub-protective layer on the substrate, and is located within the orthographic projection of the second sub-protective layer on the substrate, the second sub-protective layer extends to the display area, and the first sub-protective layer and the second sub-protective layer are separated by the first flat layer. In the above solution, the second sub-protective layer can protect the underlying structure. In addition, the protective layer is a structure composed of at least two film layers to further enhance its protective effect, thereby further improving the quality of the display panel.

[0041] Optionally, the orthographic projection of the pixel defining layer on the substrate is within the orthographic projection of the second sub-protective layer on the substrate. In this way, the second sub-protective layer covers the entire display area to protect the structures in the display area located below the pixel defining layer during the formation process of the pixel defining layer.

[0042] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a first signal line, wherein the first signal line is located on a side of the first planar layer facing the substrate. The presence of the first signal line requires the provision of other film layers to space it from adjacent conductive structures, thereby providing an interlayer location for the provision of the second sub-protective layer.

[0043] In a specific embodiment of the first aspect of the present disclosure, the second subprotective layer is located between the first signal line and the first planar layer. The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate in a direction away from the substrate, the first subprotective layer is located between the first electrode and the substrate, and the display panel further includes a first common electrode line and a second common electrode line, the first common electrode line being located in a display area and a non-display area, the second common electrode line being located in the non-display area, the first common electrode line being located on a side of the first subprotective layer and the pixel defining layer facing away from the substrate, the second common electrode line being located between the first subprotective layer and the substrate, the first common electrode line being electrically connected to the second electrode, and in the non-display area, the first subprotective layer and the second subprotective layer being located between the first common electrode line and the second common electrode line.

[0044] In the above scheme, the second sub-protective layer can protect the first signal line during the preparation process of the first flat layer (for example, the etching process required for opening the hole). In addition, the second sub-protective layer can prevent substances in the first flat layer, such as water and oxygen, from invading the first signal line, thereby reducing the risk of the first signal line being corroded and damaged.

[0045] Optionally, when the second subprotective layer is located between the first signal line and the first flat layer, in the non-display area, a first via is provided in the first subprotective layer, a second via connected to the first via is provided in the first flat layer, a third via connected to the second via is provided in the second subprotective layer, and the first common electrode line and the second common electrode line are connected through the first via, the second via and the third via.

[0046] Optionally, when the second subprotective layer is located between the first signal line and the first planar layer, the second common electrode line and the first signal line are in the same layer and made of the same material. In this way, the first signal line can be prepared simultaneously with the second common electrode line, thereby simplifying the display panel manufacturing process.

[0047] Optionally, in a case where the second subprotection layer is located between the first signal line and the first planar layer, the first signal line includes at least one of a power line and a data line.

[0048] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a second signal line, wherein the second signal line and the second sub-protective layer are located between the first signal line and the substrate. Having the first and second signal lines located on different layers increases wiring space within the display panel, thereby easing wiring complexity. This also increases the number of film layers provided, providing more options for the interlayer location of the second sub-protective layer.

[0049] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a second planar layer and a third planar layer, and in a direction away from the substrate, the third planar layer, the second signal line, the second planar layer, the first signal line, and the first planar layer are arranged in that order. The second subprotective layer is located between the second planar layer and the second signal line, or alternatively, the second subprotective layer is located between the second signal line and the third planar layer.

[0050] In a specific embodiment of the first aspect of the present disclosure, along a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate, the first sub-protective layer is located between the first electrode and the substrate, the display panel also includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on the side of the first sub-protective layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first sub-protective layer and the substrate, the first common electrode line is electrically connected to the second electrode, and the display panel also includes at least one dam located in the non-display area, the dam surrounds the display area, and the second common electrode line and the second sub-protective layer pass through the interior of the dam.

[0051] In the above solution, at the location of the dam, the height that the second common electrode line needs to cross over the dam can be reduced, thereby reducing the risk of the second common electrode line breaking; in addition, at this location, the second common electrode line is located inside the dam, so that the dam can protect the second common electrode line, thereby further reducing the risk of the second common electrode line being damaged by etching.

[0052] Optionally, the dam includes a top film layer and a support layer, the support layer is located between the top film layer and the substrate, and the second common electrode line and the portion of the second subprotective layer passing through the dam are located inside the support layer.

[0053] Optionally, the supporting layer includes a first sub-supporting layer and a second sub-supporting layer stacked on top of each other, the second sub-supporting layer being located between the first sub-supporting layer and the substrate, the first sub-supporting layer being the same layer and made of the same material as the first planar layer, the second sub-supporting layer being the same layer and made of the same material as at least one of the second planar layer and the third planar layer, and the second common electrode line and the portion of the second sub-protective layer that passes through the dam being located between the first sub-supporting layer and the second sub-supporting layer. In this manner, the provision of the supporting layer does not increase the manufacturing process flow of the display panel.

[0054] In one specific embodiment of the first aspect of the present disclosure, the second sub-protective layer is located between the second signal line and the second planar layer. Thus, the second sub-protective layer can protect the second signal line during the formation of the second planar layer (formation of the via). Furthermore, the second sub-protective layer can prevent substances in the second planar layer, such as water and oxygen, from invading the first signal line, thereby reducing the risk of corrosion damage to the first signal line.

[0055] Optionally, when the second subprotective layer is located between the second signal line and the second planar layer, the second common electrode line and the second signal line are formed in the same layer and made of the same material, and the second subprotective layer covers the second common electrode line. This allows the second common electrode line to be fabricated simultaneously with the second signal line, thereby simplifying the display panel fabrication process.

[0056] In a specific embodiment of the first aspect of the present disclosure, when the second sub-protective layer is located between the second signal line and the second flat layer, a plurality of second openings are provided in the first sub-support layer, the second openings are arranged at intervals along the dam, and the second openings expose the second sub-protective layer. The top film layer includes a first opening corresponding to the second opening, and the second encapsulation layer covers the second opening and the first opening, and is in direct contact with the second sub-protective layer through the second opening and the first opening.

[0057] In the above scheme, the second opening and the first opening can release the gas trapped in the first sub-support layer to ensure the packaging effect of the display panel; in addition, the second packaging layer covers and fills the second opening and the first opening to seal the second opening and the first opening, thereby preventing gas from invading the dam or the escape of residual gas in the dam in the subsequent preparation process; in addition, the setting of the second opening and the first opening not only allows the second sub-protective layer to be in direct contact with the second packaging layer, but also is equivalent to embedding the second packaging layer in the dam, thereby reducing the risk of the second packaging layer falling off the substrate.

[0058] In another specific embodiment of the first aspect of the present disclosure, a plurality of second openings are provided in the first sub-support layer, the second openings are arranged at intervals along the dam, the second openings expose the second sub-protective layer, and the first sub-protective layer covers the top film layer and the second openings so as to be in direct contact with the second sub-protective layer through the second openings.

[0059] In the above scheme, the second opening can release the gas trapped in the first sub-support layer to ensure the packaging effect of the display panel; in addition, the first sub-protective layer covers and fills the second opening to seal the second opening, thereby preventing gas from invading the dam or the escape of residual gas in the dam in the subsequent preparation process; in addition, the setting of the second opening not only allows the first sub-protective layer to be in direct contact with the second packaging layer, but also is equivalent to embedding the second packaging layer in the dam, thereby reducing the risk of the second packaging layer falling off the substrate.

[0060] In another specific embodiment of the first aspect of the present disclosure, the second common electrode line includes at least one vent hole that passes through the second common electrode line. The vent hole can be used to release gas trapped in the second sub-support layer to ensure the encapsulation effect of the display panel.

[0061] Optionally, a plurality of air holes are provided and arranged at intervals along the dam.

[0062] In another specific embodiment of the first aspect of the present disclosure, the substrate includes a driving circuit layer, the driving circuit layer is located in the display area, and the third planarization layer planarizes the driving circuit layer.

[0063] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a first isolation structure located on a side of the pixel defining layer away from the substrate, the first isolation structure is located in the display area and is provided with a plurality of first isolation openings, the first isolation openings are connected to the pixel openings, the first encapsulation layer includes a plurality of encapsulation units, the encapsulation units are located on a side of the light-emitting device away from the substrate to encapsulate the light-emitting device, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on the substrate, the light-emitting functional layer and the second electrode are located within the first isolation opening, the second electrode is connected to the first isolation structure, and the first isolation structure is located on the side of the pixel defining layer away from the substrate.

[0064] In the above scheme, light-emitting devices can be prepared in batches based on the isolation structure to accurately control the formation position of the light-emitting device and the thickness of each film layer it includes, thereby improving the luminous efficiency of the light-emitting device and the pixel density PPI of the display panel; in addition, in this process, the first encapsulation layer will undergo an etching process to form a packaging unit for independently packaging the light-emitting device. During the entire process, the area where the first encapsulation layer needs to be etched will cause the underlying structure to face the risk of etching, and the provision of the protective layer can protect the structure facing the risk of etching during this process.

[0065] Optionally, the display panel also includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on the side of the first subprotective layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first subprotective layer and the substrate, the first common electrode line is electrically connected to the second electrode, and is connected to the second electrode through a first isolation structure.

[0066] Optionally, the first common electrode line and the first isolation structure are in the same layer and made of the same material. In this way, the first common electrode line can be prepared simultaneously during the preparation of the first isolation structure, thereby simplifying the preparation process of the display panel.

[0067] Optionally, the layer where the first subprotective layer is located is located on the side facing the substrate of the layer where the pixel defining layer is located. In the non-display area, a first via hole is provided in the first subprotective layer, and a second via hole connected to the first via hole is provided in the first flat layer. The first common electrode line and the second common electrode line are connected through the first via hole and the second via hole.

[0068] In a specific embodiment of the first aspect of the present disclosure, the non-display area includes a dummy sub-pixel area, and the display panel further includes a second isolation structure, the second isolation structure being located in the dummy sub-pixel area and on a side of the first sub-protective layer away from the substrate. The second isolation structure can protect the underlying structure and, in addition, can serve as a signal shield to shield underlying circuits (e.g., a drive circuit or a signal line connected to the drive circuit) from interference with these circuits by external signals (e.g., signals caused by the touch structure described below).

[0069] Optionally, the display panel further includes at least one dam located in the non-display area, wherein the dam surrounds the display area, and the second isolation structure is located between the dam and the display area.

[0070] In a specific embodiment of the first aspect of the present disclosure, the substrate includes a gate driving circuit, the gate driving circuit is located in the dummy sub-pixel area, and the orthographic projection of the gate driving circuit on the substrate at least partially overlaps with the orthographic projection of the second isolation structure on the substrate.

[0071] Optionally, the orthographic projection of the gate driver circuit on the substrate is located within the orthographic projection of the second isolation structure on the substrate. In this way, the second isolation structure can shield the gate driver circuit from signals to prevent the gate driver circuit from being interfered by external signals.

[0072] In another specific embodiment of the first aspect of the present disclosure, the substrate includes a gate driver circuit, which is located on a side of the dummy sub-pixel region away from the display area. In this manner, the second isolation structure can shield signal lines connected to the gate driver circuit to prevent interference from external signals.

[0073] Optionally, the orthographic projection of the gate driving circuit on the substrate at least partially overlaps with the orthographic projection of the first common electrode line on the substrate. In this way, the first common electrode line can shield the gate driving circuit from signals to prevent the gate driving circuit from being interfered by external signals.

[0074] Optionally, the orthographic projection of the gate driving circuit on the substrate is located within the orthographic projection of the first common electrode line on the substrate.

[0075] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a touch structure, which is located on a side of the second encapsulation layer away from the substrate, and a positive projection of a portion of the touch structure on the substrate overlaps with the dummy sub-pixel area.

[0076] Optionally, the touch structure includes touch electrodes and touch traces connected to the touch electrodes, with the touch traces located in both the display area and the non-display area. In this manner, the second isolation structure and / or the first common electrode line can shield signals from the touch electrodes or touch traces to prevent these signals from interfering with the underlying gate driver circuit or signal lines connected to the gate driver circuit.

[0077] Optionally, the second isolation structure includes a plurality of second isolation openings, and the second isolation openings expose the first sub-protection layer.

[0078] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a third encapsulation layer, the third encapsulation layer being located between the first encapsulation layer and the second encapsulation layer. The third encapsulation layer fills the second isolation opening and is in direct contact with the first sub-protective layer in the second isolation opening. Thus, the first sub-protective layer is a continuous film layer at the second isolation opening, thereby protecting the underlying film layer during the formation of the second isolation opening.

[0079] Optionally, in a case where the second isolation opening is in direct contact with the first sub-protective layer, the display panel further includes a dummy electrode, and an orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the dummy electrode on the substrate. The dummy electrode is used to shield the signal at the second isolation opening to prevent signal interference between the touch structure and the circuit of the substrate.

[0080] Optionally, the dummy electrode is electrically connected to the second isolation structure while directly contacting the first sub-protective layer in the second isolation opening, so that the dummy electrode and the second isolation structure can be at the same potential, thereby eliminating the need to provide a separate wiring for the dummy electrode.

[0081] Alternatively, in the case where the second isolation opening is in direct contact with the first sub-protective layer, the dummy electrode is formed from the same layer and material as the first electrode, and a transfer hole is provided in the first sub-protective layer, through which the dummy electrode is connected to the second isolation structure. In this way, the dummy electrode can be prepared simultaneously with the preparation of the first electrode, thereby simplifying the display panel manufacturing process.

[0082] In another specific embodiment of the first aspect of the present disclosure, the display panel also includes a dummy light-emitting device, which includes a first dummy electrode, a first dummy light-emitting functional layer and a second dummy electrode stacked in sequence on the substrate, the first sub-protective layer includes a dummy pixel opening connected to the second isolation opening, the first dummy light-emitting functional layer and the second dummy electrode are located in the dummy pixel opening and the second isolation opening, and the second dummy electrode is connected to the second isolation structure.

[0083] In the above scheme, the dummy sub-pixel area and the display area undergo the same preparation process, thereby forming a dummy light-emitting device corresponding to the light-emitting device in the second isolation opening. In this way, the second dummy electrode of the dummy light-emitting device can be connected to the second isolation structure to shield the signal.

[0084] In another specific embodiment of the first aspect of the present disclosure, the display panel further includes a dummy light-emitting device, the dummy light-emitting device including a first dummy electrode, a first dummy light-emitting functional layer, and a second dummy electrode stacked sequentially on a substrate, a first sub-protective layer separating the first dummy electrode and the first dummy light-emitting functional layer, the first dummy light-emitting functional layer and the second dummy electrode being located in a second isolation opening, and the second dummy electrode being connected to a second isolation structure. In the above solution, the dummy sub-pixel region and the display region undergo the same preparation process, thereby forming a dummy light-emitting device corresponding to the light-emitting device in the second isolation opening. In this way, the second dummy electrode of the dummy light-emitting device can be connected to the second isolation structure to shield the signal. In addition, the first sub-protective layer is a continuous film layer at the second isolation opening, thereby protecting the film layer below during the formation of the second isolation opening.

[0085] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a first planar layer, the first planar layer being located in the display area and the non-display area, the first planar layer being located between the pixel defining layer and the substrate, and between the first sub-protective layer and the substrate. In the non-display area, the first sub-protective layer includes a third opening to expose the first planar layer, and an orthographic projection of the third opening on the substrate is located between an orthographic projection of the first isolation structure on the substrate and an orthographic projection of the second isolation structure on the substrate.

[0086] In the above solution, the third opening can be used to release the gas in the first flat layer to prevent the gas from causing adverse effects on subsequent packaging and the like.

[0087] In a specific embodiment of the first aspect of the present disclosure, the first isolation structure and the second isolation structure are in the same layer and made of the same material. In this way, the second isolation structure can be prepared simultaneously during the preparation of the first isolation structure, thereby simplifying the preparation process of the display panel.

[0088] In a specific embodiment of the first aspect of the present disclosure, the first isolation structure includes a first support portion and a first crown portion, the first support portion is located between the first crown portion and the substrate, and the orthographic projection of the first support portion on the substrate is located within the orthographic projection of the first crown portion on the substrate; the second isolation structure includes a second support portion and a second crown portion, the second support portion is located between the second crown portion and the substrate, and the orthographic projection of the second support portion on the substrate is located within the orthographic projection of the second crown portion on the substrate; the first support portion and the second support portion are in the same layer and made of the same material, and the first crown and the second crown are in the same layer and made of the same material.

[0089] According to a second aspect of the present disclosure, there is provided a display panel having a display area and a non-display area and including a substrate and a dam, an encapsulation structure, a protective layer, and a plurality of light-emitting devices located on the substrate. The light-emitting device is located in the display area, the dam is located in the non-display area, the dam includes a top film layer away from the substrate, the encapsulation structure is stacked on the side of the dam and the light-emitting device away from the substrate, at least a portion of the protective layer is located in the non-display area, the protective layer is located on the side of the encapsulation structure close to the substrate, and overlaps with the top film layer. The encapsulation structure includes a first encapsulation layer and a second encapsulation layer stacked together, the first encapsulation layer being located on the side of the second encapsulation layer close to the substrate, and the second encapsulation layer being located in the display area and the non-display area and in direct contact with the dam.

[0090] In the above scheme, the protective layer can protect the underlying structure during the preparation process of the first encapsulation layer to prevent damage to the substrate or the structure between the substrate and the protective layer; in addition, the protective layer can protect the side surface of the dam during the preparation process of the pixel defining layer to reduce the risk of the dam being damaged by etching.

[0091] In a specific embodiment of the first aspect of the present disclosure, the protective layer and the encapsulation structure are made of the same material, that is, inorganic materials.

[0092] A third aspect of the present disclosure provides a method for manufacturing a display panel, the method comprising: providing a substrate, and pre-dividing the display panel into a display area and a non-display area on the substrate; forming a protective layer on the substrate, at least a portion of the protective layer being formed in the non-display area; forming a light-emitting device on the substrate, the light-emitting device being formed in the display area; and sequentially forming a first encapsulation layer and a second encapsulation layer covering the light-emitting device on a side of the light-emitting device facing away from the substrate, wherein the second encapsulation layer is located in the display area and the non-display area, the protective layer being formed between the second encapsulation layer and the substrate, and in the non-display area, the second encapsulation layer being formed in direct contact with the protective layer. In this manufacturing method, the protective layer can protect the underlying structure during the manufacturing process of the first encapsulation layer to prevent damage to the substrate or the structure between the substrate and the protective layer, thereby ensuring the quality of the display panel.

[0093] In a specific embodiment of the third aspect of the present disclosure, the steps of forming a protective layer, a pixel defining layer, a light-emitting device and a first encapsulation layer include: forming a plurality of first electrodes on a substrate; forming a pixel defining material layer on the substrate on which the first electrodes are formed; forming a first isolation structure on a side of the pixel defining material layer away from the substrate, the first isolation structure having a plurality of first isolation openings; performing a patterning process on the pixel defining material layer to form pixel openings corresponding to the first isolation openings, a portion of the pixel defining material layer located in the display area is formed as a pixel defining layer, and a portion of the pixel defining material layer located in the non-display area is formed as a first sub-protective layer of the protective layer; forming a light-emitting functional layer and a second electrode on a side of the first isolation structure away from the substrate, the first electrode, the light-emitting functional layer and The second electrode constitutes a light-emitting device; after forming a first packaging film on the side of the first isolation structure and the light-emitting device facing away from the substrate, a photoresist is deposited on the first packaging film, and the photoresist is patterned to form a photoresist pattern, wherein the photoresist pattern covers part of the first isolation opening; the first packaging film, the light-emitting functional layer, and the second electrode are etched using the photoresist pattern as a mask to remove the parts of the first packaging film, the light-emitting functional layer, and the second electrode that are not covered by the photoresist pattern, wherein the remaining part of the first packaging film is a packaging unit; the remaining photoresist pattern is removed; the above steps of forming the light-emitting functional layer and the second electrode to removing the remaining photoresist pattern are repeated to form a light-emitting device and a packaging unit at the first isolation opening where the light-emitting device is not formed, wherein all the packaging units together constitute the first packaging layer.

[0094] In another specific embodiment of the third aspect of the present disclosure, the steps of forming a pixel defining layer, a light-emitting device and a first encapsulation layer include: forming a plurality of first electrodes on a substrate; forming a pixel defining material layer on the substrate on which the first electrodes are formed; forming a first isolation structure on a side of the pixel defining material layer away from the substrate, the first isolation structure having a plurality of first isolation openings; performing a patterning process on the pixel defining material layer to form pixel openings corresponding to part of the first isolation openings, a portion of the pixel defining material layer located in the display area is formed as a pixel defining layer, and a portion of the pixel defining material layer located in the non-display area is formed as a first sub-protective layer of the protective layer; forming a light-emitting functional layer and a second electrode on a side of the first isolation structure away from the substrate, and the first electrode, the light-emitting functional layer and the second electrode corresponding to the first isolation opening and the pixel opening constitute a light-emitting device. After forming a first encapsulation film on a side of the first isolation structure and the light-emitting device facing away from the substrate, a photoresist is deposited on the first encapsulation film, and the photoresist is patterned to form a photoresist pattern, wherein the photoresist pattern covers part of the first isolation opening; the first encapsulation film, the light-emitting functional layer and the second electrode are etched using the photoresist pattern as a mask to remove portions of the first encapsulation film, the light-emitting functional layer and the second electrode that are not covered by the photoresist pattern, wherein the remaining portion of the first encapsulation film is an encapsulation unit; the remaining photoresist pattern is removed; the above steps of forming a pixel opening to removing the remaining photoresist pattern are repeated to form a pixel opening corresponding to each first isolation opening in the pixel defining layer, and a light-emitting device and an encapsulation unit are formed at the first isolation opening where the light-emitting device is not formed, wherein all the encapsulation units together constitute a first encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] FIG1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure.

[0096] FIG. 2 is an enlarged view of a region S1 of the display panel shown in FIG. 1 .

[0097] FIG. 3A is a cross-sectional view of the display panel shown in FIG. 2 along line M1 - N1 .

[0098] FIG. 3B is a cross-sectional view of the display panel shown in FIG. 1 along M2 - N2 in one design.

[0099] FIG3C is a cross-sectional view of the display panel shown in FIG1 along line M2-N2 in another design.

[0100] FIG4 is a cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0101] FIG. 5A is a cross-sectional view of the display panel shown in FIG. 1 along line M1 - N1 in another design.

[0102] FIG5B is a cross-sectional view of the display panel along line M2 - N2 corresponding to FIG1 and FIG5A .

[0103] FIG. 6A is a cross-sectional view of the display panel shown in FIG. 1 along line M1 - N1 in another design.

[0104] FIG6B is a cross-sectional view of the display panel along line M2 - N2 corresponding to FIG1 and FIG6A .

[0105] FIG. 7A is a cross-sectional view of the display panel shown in FIG. 1 along line M1 - N1 in another design.

[0106] FIG7B is a cross-sectional view of the display panel along line M2 - N2 corresponding to FIG1 and FIG7A .

[0107] FIG8A is a cross-sectional view of the display panel shown in FIG1 along line M1-N1 in another design.

[0108] FIG8B is a cross-sectional view of the display panel along line M2 - N2 corresponding to FIG1 and FIG8A .

[0109] FIG. 9A is a cross-sectional view of the display panel shown in FIG. 1 along line M1 - N1 in another design.

[0110] FIG9B is a cross-sectional view of the display panel along M2 - N2 in one design corresponding to FIG1 and FIG9A .

[0111] FIG9C is a cross-sectional view of the display panel along line M2 - N2 in another design corresponding to FIG1 and FIG9A .

[0112] FIG. 10A is a cross-sectional view of the display panel shown in FIG. 1 along line M1 - N1 in another design.

[0113] FIG10B is a cross-sectional view of the display panel along line M2-N2 corresponding to FIG1 and FIG10A.

[0114] FIG11 is a cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0115] FIG12 is a schematic diagram of a planar structure of another display panel provided in an embodiment of the present disclosure.

[0116] FIG. 13A is a cross-sectional view of the display panel shown in FIG. 12 along M3 - N3 in one design.

[0117] FIG13B is a cross-sectional view of the display panel shown in FIG12 along M3-N3 in another design.

[0118] FIG14 is a cross-sectional view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0119] FIG15A is a cross-sectional view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0120] FIG15B is a cross-sectional view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0121] FIG16A is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0122] FIG16B is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0123] FIG16C is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0124] 17A to 17I are process diagrams of a method for forming a display panel as shown in FIG. 3A , provided in accordance with an embodiment of the present disclosure.

[0125] FIG18 is a schematic diagram showing the positional relationship between a portion of a film layer of a display panel and an evaporation source during evaporation according to an embodiment of the present disclosure.

[0126] Explanation of reference numerals: 10 - display panel; 11a - display area; 11b - binding area; 11c - non-display area; 11d - bending area; 11e - dummy sub-pixel area; 12 - frame area; 100 - substrate; 110 - common electrode line; 111 - first common electrode line; 111a - first conductive layer; 111b - second conductive layer; 112 - second common electrode line; 112a - vent hole; 121 - first flat layer; 122 - second flat layer; 123 - third flat layer; 130 - gate driver circuit; 131-first signal line; 132-second signal line; 200-light-emitting device; 200a-dummy light-emitting device; 210-first electrode; 210a-first dummy electrode; 220-light-emitting functional layer; 220a-first dummy light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 230a-second dummy electrode; 300-first isolation structure; 301-first isolation opening; 300a-second isolation structure; 3 01a-second isolation opening; 302-pixel opening; 310-first support portion; 310a-second support portion; 310b-first material layer; 320-first crown portion; 320a-second crown portion; 320b-second material layer; 330-pixel definition layer; 330a-pixel definition material layer; 400-encapsulation structure; 410-first encapsulation layer; 410a-first encapsulation film; 411-encapsulation unit; 420-second encapsulation layer; 430-third encapsulation layer; 401-first via hole; 4 02-second via; 403-third via; 401a-first opening; 402a-second opening; 403a-third opening; 500-protective layer; 510-first sub-protective layer; 520-second sub-protective layer; 600-dam; 610-top film layer; 620-support layer; first sub-support layer-621; second sub-support layer-622; 800-touch structure; 810-first touch electrode layer; 820-second touch electrode layer; 830-touch trace; 900-photoresist pattern. DETAILED DESCRIPTION

[0127] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0128] In a display panel, a pixel-defining layer is provided to define the position of a light-emitting device (such as the light-emitting device described below), and an encapsulation layer is provided to encapsulate the light-emitting device. The preparation of the light-emitting device and the encapsulation layer requires an etching process. In the peripheral non-display area of ​​the display panel, the etching process can cause etching of existing structures. If the etching is too severe, functional structures of the display panel, such as signal lines, can be damaged, thereby affecting the yield of the display panel.

[0129] The present disclosure provides a display panel and a method for manufacturing the same to at least address the aforementioned technical issues. The display panel comprises a display area and a non-display area, and includes a substrate, an encapsulation structure, a protective layer, and a plurality of light-emitting devices located on the substrate. The light-emitting devices are located in the display area. The encapsulation structure is located on a side of the light-emitting devices away from the substrate, and includes a first encapsulation layer and a second encapsulation layer located on a side of the first encapsulation layer facing away from the substrate. The first and second encapsulation layers cover the light-emitting devices, and the orthographic projection of the second encapsulation layer on the substrate is located in both the display area and the non-display area. At least a portion of the protective layer is located in the non-display area and on a side of the second encapsulation layer closer to the substrate. In the non-display area, the protective layer is in direct contact with the second encapsulation layer, and the protective layer and the second encapsulation layer are made of the same material. In this display panel, the protective layer can protect the underlying structure during the preparation process of the first encapsulation layer to prevent damage to the substrate or the structure between the substrate and the protective layer, thereby ensuring the quality of the display panel. In addition, the bonding strength between the protective layer and the second encapsulation layer, which are made of the same material, is strong, reducing the risk of the second encapsulation layer falling off. This improves the encapsulation effect of the display panel.

[0130] It should be noted that the formation method of the first encapsulation layer and the principle of the risk of over-etching of the pixel definition layer can be found in the detailed description of the embodiments related to Figures 17A to 17I below, and will not be repeated here.

[0131] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0132] [Corrected 22.10.2024 according to Rule 91] As shown in Figures 1, 2, 3A and 3B, the planar area of ​​the display panel 10 can be divided into a display area 11a and a border area 12 surrounding the display area 11a. Sub-pixels (which may be called sub-pixels, etc.) can be arranged in the display area 11a, such as R, G, and B sub-pixels. The physical structure of the sub-pixel can be the light-emitting device in the following embodiment. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, part of the wiring in the border area 12 can be arranged in the display area 11a, so that the border area 12 can be designed as a single-sided border.

[0133] The physical structure of the display panel 10 includes a substrate 100, an encapsulation structure, a protective layer 500, and a plurality of light-emitting devices 200 located on the substrate 100. The light-emitting devices 200 are located in the display area 11a. The encapsulation structure is located on the side of the light-emitting devices 200 away from the substrate 100 and includes a first encapsulation layer 410 and a second encapsulation layer 420 located on the side of the first encapsulation layer 410 facing away from the substrate 100. The first and second encapsulation layers 410 and 420 cover the light-emitting devices 200, and the orthographic projection of the second encapsulation layer 420 on the substrate 100 is located in the display area 11a and the non-display area 11c. At least a portion of the protective layer 500 is located in the non-display area 11c and on the side of the second encapsulation layer 420 closer to the substrate 100. In the non-display area 11c, the protective layer 500 is in direct contact with the second encapsulation layer 420. The protective layer 500 and the second encapsulation layer 420 are made of the same material, ensuring a high bonding strength between the protective layer 500 and the second encapsulation layer 420. In this way, the protective layer 500 can protect the underlying structure during the preparation process of the first encapsulation layer 410, thereby preventing damage to the substrate 100 or the structure between the substrate 100 and the protective layer 500, thereby ensuring the quality of the display panel. It should be noted that the same material type refers to materials of the same general category, such as organic materials or inorganic materials. Materials of the same general category can have a higher bonding strength.

[0134] In at least one embodiment of the present disclosure, as shown in FIG3A , in a direction away from the substrate 100, the light-emitting device 200 may include a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on the substrate 100. The light-emitting functional layer 220 may further include a light-emitting layer 222 and a second functional layer 223, wherein the first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that one or more light-emitting layers 222 may be provided in the light-emitting device 200. When multiple light-emitting layers 222 are provided, the light-emitting device 200 may have a higher light extraction efficiency.

[0135] For example, in at least one embodiment of the present disclosure, the first electrode 210 may be configured as an anode, and the second electrode 230 may be configured as a cathode.

[0136] In at least one embodiment of the present disclosure, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer including a plurality of pixel driving circuits located in the display area, and the display function layer being located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFTs, capacitors, etc., for example, in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device 200 to control the switching state and the light-emitting brightness of the light-emitting device 200.

[0137] In at least one embodiment of the present disclosure, as shown in FIG3A , the display panel further includes a pixel defining layer 330 located on the substrate 100. The pixel defining layer 330 is located in the display area 11a and has a plurality of pixel openings 302. The pixel openings 302 are used to accommodate the light-emitting devices 200. The protective layer 500 includes a first sub-protective layer 510. The first sub-protective layer 510 overlaps the pixel defining layer 330. In the non-display area 11c, the first sub-protective layer 510 is in direct contact with the second encapsulation layer 420. In this manner, the first sub-protective layer 510 overlaps the pixel defining layer 330 to avoid a gap between them, thereby improving the protection of the underlying structures during the preparation process of the first encapsulation layer 410.

[0138] As shown in FIG3A , the first electrode 210 is located between the pixel defining layer 330 and the substrate 100, with the pixel opening 302 exposing a portion of the first electrode 210. The light-emitting functional layer 220 and the second electrode 230 cover the pixel opening 302 and extend to the side of the pixel defining layer 330 facing away from the substrate 100. The pixel opening 302 defines the active area of ​​the first electrode 210, which corresponds to the active light-emitting area of ​​the light-emitting device 200. Thus, the pixel opening 302 effectively defines the light-emitting area (e.g., position, area, etc.) of the light-emitting device 200 (or sub-pixel).

[0139] In at least one embodiment of the present disclosure, the pixel defining layer 330, the first encapsulation layer 410, the second encapsulation layer 420, and the protective layer 500 are inorganic film layers. The contact of the same material helps to improve the interlayer adhesion, thereby achieving better structural stability and encapsulation effect.

[0140] In at least one embodiment of the present disclosure, the material of the pixel defining layer 330 , the first encapsulation layer 410 , the second encapsulation layer 420 , and the protection layer 500 includes one of silicon oxide, silicon nitride, and silicon oxynitride.

[0141] In some scenarios, some functional film layers in the light-emitting device are formed by evaporation, and each light-emitting device has multiple functional film layers, and some functional film layers (such as the light-emitting layer) in the light-emitting devices that emit different light have different material compositions. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0142] In the embodiments of the present disclosure, an isolation structure (hereinafter referred to as the first isolation structure) is provided at the gap between the light-emitting devices to isolate the functional film layers of adjacent light-emitting devices. In this way, during the evaporation process of the functional film layer, only the entire surface of the display panel needs to be evaporated, without the need to use a mask to prepare the functional film layer of each light-emitting device separately. This process does not need to consider the alignment accuracy during evaporation, so the gap between the light-emitting devices can be designed to be smaller to increase the PPI (the principle can be seen in the relevant description of the embodiments related to Figures 17A to 17I below). It should be noted that when preparing light-emitting devices based on the above-mentioned isolation structure, the light-emitting devices are prepared in batches, and the first encapsulation layer needs to be independently encapsulated for each light-emitting device during this process to protect the light-emitting device. Therefore, the first encapsulation layer is also formed through multiple etching processes, and the first encapsulation layer is also formed into multiple encapsulation units. In the above process, multiple etching processes are used. Therefore, if a protective layer is not provided in the non-display area, these etching processes will damage the structure of the non-display area.

[0143] In at least one embodiment of the present disclosure, as shown in Figures 2 and 3A, the display panel also includes a first isolation structure 300, which is located in the display area 11a and is provided with a plurality of first isolation openings 301, and the first isolation openings 301 are connected to the pixel openings 302. The first encapsulation layer 410 includes a plurality of encapsulation units 411, and the encapsulation units 411 are located on the side of the light-emitting device 200 away from the substrate 100 to encapsulate the light-emitting device 200. The light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220 and a second electrode 230 stacked in sequence on the substrate 100, the light-emitting functional layer 220 and the second electrode 230 are located within the first isolation opening 301, the second electrode 230 is connected to the first isolation structure 300, and the first isolation structure 300 is located on the side of the pixel defining layer 330 away from the substrate 100. Based on the isolation structure, the light-emitting device 200 can be prepared in batches to accurately control the formation position of the light-emitting device 200 and the thickness of each film layer it includes, thereby improving the luminous efficiency of the light-emitting device 200 and the pixel density PPI of the display panel; in addition, in this process, the first encapsulation layer 410 will undergo an etching process to form a packaging unit 411 for independently packaging the light-emitting device 200. During the entire process, the area where the first encapsulation layer 410 needs to be etched will cause the underlying structure to face the risk of etching, and the provision of the protective layer 500 can protect the structure facing the risk of etching during this process.

[0144] In at least one embodiment of the present disclosure, as shown in FIG3A , the first isolation structure 300 is located between the pixel defining layer 330 and the first encapsulation layer 410 and includes a first supporting portion 310 and a first crown portion 320 . The first supporting portion 310 is located between the first crown portion 320 and the substrate 100 , and the orthographic projection of the first supporting portion 310 on the substrate 100 is located within the orthographic projection of the first crown portion 320 on the substrate 100 . That is, the first isolation structure 300 as a whole will appear to be wide at the top and narrow at the bottom, so that when a portion of the film layer (e.g., the light-emitting functional layer 220) in the light-emitting device 200 is evaporated, it will be disconnected at the edge of the first isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices 200 .

[0145] In some embodiments of the present disclosure, the main structure of the first isolation structure 300 may be preferably made of a conductive material to reduce the voltage when driving the second electrode 230. For example, as shown in FIG3A , the first support portion 310 is a conductive structure, and the second electrode 230 is electrically connected to the side surface of the first support portion 310. In this way, the first support portion 310 can be used to assist in connecting the second electrode 230. Because the first support portion 310 is located in the gap between the light-emitting device 200, it can have a higher design thickness (greater than the thickness of the second electrode 230) and can be made of a high-conductivity material. Therefore, when connected to the second electrode 230, the voltage drop problem generated on the second electrode 230 when driving the light-emitting device 200 can be reduced.

[0146] For example, as shown in FIG3A , based on the first support portion 310 being a conductive structure, the first crown portion 320 may also be further designed as a conductive structure. This can further reduce the voltage drop problem on the second electrode 230 when driving the light-emitting device 200 .

[0147] For example, as shown in FIG3A , on the basis that the first support portion 310 is a conductive structure, the first crown portion 320 and the first support portion 310 can be made of titanium and aluminum in sequence, and the corrosion resistance of titanium and aluminum decreases in sequence, thereby forming the first isolation structure 300 as shown in FIG3A .

[0148] In at least one embodiment of the present disclosure, referring back to FIG. 3A , the pixel defining layer 330 is an inorganic insulating film layer. When the first isolation structure 300 is used to prepare a light-emitting device, the pixel defining layer 330 does not need to have a large thickness to accommodate and isolate part of the film layer in the light-emitting device 200, so that the pixel defining layer 330 can be directly prepared using inorganic materials. In this way, the pixel defining layer 330 can separate the first isolation structure 300 and the first electrode 210, so that a smaller gap is designed between the first electrode 210, which reduces the pixel gap and thus improves the pixel density PPI of the display panel. In addition, the inorganic layer has high density and strong resistance, which can reduce the design thickness of the display panel. In addition, the thickness of the inorganic film layer is relatively small, which allows the pixel opening 302 to have a smaller depth to ensure the film continuity of the film layer (such as the second electrode 230) formed at the pixel opening 302. In addition, as an inorganic film layer, the pixel defining layer 330 can have a greater bonding strength with the isolation structure 300, thereby reducing the risk of the isolation structure 300 falling off.

[0149] In at least one embodiment of the present disclosure, referring again to FIG. 3A , the first encapsulation layer 410 is composed of a plurality of encapsulation units 411. The encapsulation units 411 correspond to the first isolation openings 301, respectively, and cover the light-emitting devices 200 in the corresponding first isolation openings 301. During the process of batch-by-batch production of light-emitting devices 200 based on the isolation structure 300, the encapsulation units 411 are formed synchronously with the corresponding light-emitting devices 200. After each batch of light-emitting devices 200 is produced, the encapsulation units 411 can encapsulate and protect the already produced light-emitting devices 200 during the process of producing the next batch of light-emitting devices 200, thereby ensuring the luminous effect of the light-emitting devices 200.

[0150] When the light-emitting devices 200 are divided into multiple types that emit light of different colors, the light-emitting devices 200 that emit different light are manufactured independently, but the film layer (evaporated film layer such as the light-emitting functional layer) in each light-emitting device 200 is evaporated on the entire surface of the display panel during the evaporation. For example, the light-emitting device 200 is classified into light-emitting devices that emit red light (R), green light (G) and blue light (B), respectively. During the preparation process, the light-emitting devices R, G, and B are prepared in sequence. When preparing the light-emitting device R, a light-emitting device R is formed in each first isolation opening 301, and a first encapsulation layer 410 is prepared on the display panel to cover the light-emitting device G. Then, the first encapsulation layer 410 in part of the first isolation opening 301 (used to form the light-emitting devices G and B in the final product) and the second electrode and the light-emitting functional layer of the light-emitting device R are removed to obtain a packaging unit 411. During this process, the first encapsulation layer 410 is used to protect the light-emitting devices R in other first isolation openings 301. Based on this method, the light-emitting devices G and B are prepared in sequence to finally form the first encapsulation layer 410 as shown in Figure 3A. That is, the first encapsulation layer 410 on the entire display panel is prepared in multiple processes.

[0151] It should be noted that in the embodiments of the present disclosure, there is no restriction on the preparation order of the three types of light-emitting devices R, G, and B, and it can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the order of light-emitting devices B, G, and R.

[0152] [Corrected 22.10.2024 according to Rule 91] The reason why the first encapsulation layer 410 is composed of a plurality of encapsulation units 411 is related to the principle that the light-emitting device 200 is prepared based on the first isolation structure 300. For details, please refer to the following relevant descriptions of the embodiments shown in Figures 17A to 17I, which will not be repeated here.

[0153] In at least one embodiment of the present disclosure, as shown in Figures 3A and 3B, the display panel includes a common electrode line 110, and the common electrode line 110 includes a first common electrode line 111 and a second common electrode line 112. The first common electrode line 111 is connected to the second electrode 230 of the light-emitting device 200 and extends from the display area 11a to the non-display area 11c. The second common electrode line 112 is located in the non-display area 11c. The first common electrode line 111 is located on a side of the first subprotective layer 510 and the pixel defining layer 330 away from the substrate 100. The second common electrode line 112 is located between the first subprotective layer 510 and the substrate 100. The first common electrode line 111 is electrically connected to the second electrode 230, and in the non-display area 11c, the first common electrode line 111 and the second common electrode line 112 located in different layers are electrically connected. The main portion of the common electrode line 110 in the non-display area 11 c (the second common electrode line 112 ) may be covered by the first subprotecting layer 510 , thereby reducing the risk of the common electrode line being damaged during the preparation process of the first encapsulation layer 410 and the light emitting device 200 .

[0154] In at least one embodiment of the present disclosure, as shown in FIG. 3A and FIG. 4 , the first common electrode line 111 may be connected to the first isolation structure 300 to be indirectly connected to the second electrode 230 of the light emitting device 200 through the first isolation structure 300 .

[0155] In some embodiments of the present disclosure, as shown in FIG3B , the first common electrode line 111 may be separately provided to connect to the first isolation structure 300 . In this case, the first common electrode line 111 may be made of a material selected according to process requirements, and parameters such as the thickness of the first common electrode line 111 may be freely set.

[0156] In some embodiments of the present disclosure, as shown in Figures 3C and 4, the first common electrode line 111 can be formed in the same layer and material as the conductive portion of the first isolation structure 300. This allows the first common electrode line 111 to be formed simultaneously during the process of manufacturing the first isolation structure 300, thereby simplifying the display panel manufacturing process. For example, the first common electrode line 111 includes a first conductive layer 111a and a second conductive layer 111b stacked on each other. The first conductive layer 111a is formed in the same layer and material as the first supporting portion 310, and the second conductive layer 111b is formed in the same layer and material as the first crown portion 320.

[0157] Regarding the setting of the first isolation structure, further reference may be made to the records in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A, which will not be repeated here.

[0158] In the embodiments of the present disclosure, the protective layer can simply protect structures in the non-display area during the fabrication of the first isolation structure, the light-emitting device, and the first encapsulation layer. The structure of the protective layer is not limited and can be configured based on actual process requirements. The following describes several configurations of the protective layer using different embodiments.

[0159] In some embodiments of the present disclosure, the first subprotective layer is disposed on the same layer as the pixel definition layer. For example, as shown in Figures 3A and 3B , the first subprotective layer 510 is formed on the same layer and material as the pixel definition layer 330. This allows the first subprotective layer 510 to be fabricated simultaneously with the pixel definition layer 330, simplifying the display panel manufacturing process.

[0160] For example, as shown in Figures 3A and 3B, when the first subprotective layer 510 is in the same layer and made of the same material as the pixel defining layer 330, the first subprotective layer 510 is located outside the display area 11a, that is, the orthographic projection of the first subprotective layer 510 on the substrate 100 is located within the non-display area 11c.

[0161] In other embodiments of the present disclosure, the first subprotective layer is located below the pixel defining layer. For example, as shown in Figures 5A and 5B, the first subprotective layer 510 is located on the side of the pixel defining layer 330 facing the substrate 100. The orthographic projection of the first subprotective layer 510 on the substrate 100 is located in the display area 11a and the non-display area 11c. In the display area 11a, the first subprotective layer 510 overlaps at least partially with the pixel defining layer 330, and the first subprotective layer 510 is located between the pixel defining layer 330 and the substrate 100. In this way, during the formation process of the pixel defining layer 330, the first subprotective layer 510, which is formed before the pixel defining layer 330, can protect the underlying structure to ensure the quality of the display panel.

[0162] For example, as shown in Figures 5A and 5B, when the first subprotective layer 510 is located on the side of the pixel defining layer 330 layer facing the substrate 100, the orthographic projection of the pixel defining layer 330 on the substrate 100 is located within the orthographic projection of the first subprotective layer 510 on the substrate 100. In this way, the first subprotective layer 510 covers the entire display area 11a, thereby protecting the structures in the display area 11a located below the pixel defining layer 330 during the formation process of the pixel defining layer 330.

[0163] For example, as shown in Figures 5A and 5B , when the first subprotective layer 510 is located on the side of the pixel defining layer 330 facing the substrate 100, the first subprotective layer 510 is located between the first electrode 210 and the substrate 100. In this way, the provision of the first subprotective layer 510 does not affect the arrangement and formation of the first electrode 210. Furthermore, this approach can enhance the bonding strength of the first electrode 210 to the substrate 100 (via the first subprotective layer 510), thereby reducing the risk of the first electrode 210 falling off.

[0164] For example, as shown in Figures 5A and 5B, when the first subprotective layer 510 is located on the side of the pixel defining layer 330 facing the substrate 100, the display panel further includes a first planar layer 121 located between the substrate 100 and the first electrode 210. The first planar layer 121 extends from the display area 11a to the non-display area 11c and contacts the first subprotective layer 510 in the non-display area 11c. In the display area 11a, the first subprotective layer 510 is located between the first electrode 210 and the first planar layer 121. The first subprotective layer 510 can protect the first planar layer 121 during the preparation process of the first encapsulation layer 410 to prevent damage to the first planar layer 121, thereby ensuring the quality of the display panel.

[0165] The first planarization layer 121 is used to planarize the underlying circuit (such as the aforementioned driving circuit, etc.). On one hand, it can provide a planarized surface for disposing the first electrode 210 , and on the other hand, it can protect the underlying circuit.

[0166] For example, as shown in Figures 5A and 5B , when the first subprotective layer 510 is located on the side of the pixel defining layer 330 facing the substrate 100, in the non-display area 11c, a first via hole 401 is provided in the first subprotective layer 510, and a second via hole 402 communicating with the first via hole 401 is provided in the first planar layer 121. The first common electrode line 111 is connected to the second common electrode line 112 through the first via hole 401 and the second via hole 402. The first via hole 401 and the second via hole 402 are provided in the first subprotective layer 510 and the first planar layer 121 for connecting the first common electrode line 111 and the second common electrode line 112. This ensures that the common electrode line is connected to the second electrode 230 while the main portion (the second common electrode line 112) in the non-display area 11c can be covered by the first subprotective layer 510 and the first planar layer 121, thereby reducing the risk of damage to the common electrode line during the manufacturing process of the first encapsulation layer 410 and the light-emitting device 200.

[0167] In other embodiments of the present disclosure, the first subprotective layer is located above the pixel defining layer. For example, as shown in Figures 6A and 6B, the layer where the first subprotective layer 510 is located is located on the side of the layer where the pixel defining layer 330 is located away from the substrate 100. The orthographic projection of the first subprotective layer 510 on the substrate 100 is located in the display area 11a and the non-display area 11c, and in the display area 11a, the first subprotective layer 510 overlaps at least partially with the pixel defining layer 330, and the pixel defining layer 330 is located between the first subprotective layer 510 and the substrate 100. In this way, the first subprotective layer 510 covers the edge portion of the pixel defining layer 330 to edge the pixel defining layer 330, thereby reducing the risk of cracks at the edge of the pixel defining layer 330.

[0168] For example, as shown in Figures 6A and 6B, when the first subprotective layer 510 is located on the side of the pixel defining layer 330 away from the substrate 100, the light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on the substrate 100, and the orthographic projection of the first subprotective layer 510 on the substrate 100 is located outside the orthographic projection of the first electrode 210 on the substrate 100. In this way, the provision of the first subprotective layer 510 does not affect the provision and formation of the first electrode 210, thereby ensuring the quality of the light-emitting device 200.

[0169] For example, as shown in FIG6A and FIG6B , when the first subprotecting layer 510 is located on the side of the pixel defining layer 330 away from the substrate 100 , the first planarizing layer 121 may contact the first subprotecting layer 510 in the non-display area 11 c .

[0170] In at least one embodiment of the present disclosure, referring again to FIG. 1 , FIG. 5A , and FIG. 5B , the display panel further includes at least one dam 600 located in the non-display area 11 c. The dam 600 surrounds at least a portion of the display area 11 a. The dam 600 includes a top film layer 610 on a side away from the substrate 100. A first subprotective layer 510 overlaps the top film layer 610 and covers the side surfaces of the dam 600. The first subprotective layer 510 can protect the side surfaces of the dam 600 during the preparation of the pixel defining layer 330, thereby reducing the risk of damage to the dam 600 due to etching.

[0171] For example, as shown in FIG5B , the top film layer 610 is an inorganic film layer. Thus, when the first sub-protective layer 510 is an inorganic film layer, the top film layer 610 and the first sub-protective layer 510 can have a high bonding strength, thereby reducing the risk of the top film layer 610 and the first sub-protective layer 510 falling off the substrate 100. Furthermore, as an inorganic film layer, the top film layer 610 has a high density, thereby preventing water, oxygen, and the like from invading the interior of the dam 600.

[0172] In some embodiments of the present disclosure, as shown in FIG5B , the first sub-protective layer 510 and the top film layer 610 are formed from the same material. This allows the top film layer 610 to be prepared simultaneously with the first sub-protective layer 510 to simplify the display panel manufacturing process.

[0173] In other embodiments of the present disclosure, as shown in Figures 6A and 6B, the first sub-protective layer 510 covers the top film layer 610. The first sub-protective layer 510 is located on the side of the top film layer 610 facing away from the substrate 100, and the orthographic projection of the top film layer 610 on the substrate 100 is located within the orthographic projection of the first sub-protective layer 510 on the substrate 100. In this way, the first sub-protective layer 510 covers the top film layer 610 to protect the top film layer 610 during the preparation process of the pixel defining layer 330, thereby reducing the risk of etching damage to the dam 600.

[0174] In other embodiments of the present disclosure, as shown in Figures 7A and 7B, the top film layer 610 includes a plurality of first openings 401a, the orthographic projection of the first sub-protective layer 510 on the substrate 100 is located outside the orthographic projection of the first opening 401a on the substrate 100, the orthographic projection of the first opening 401a on the substrate 100 is located within the orthographic projection of the second encapsulation layer 420 on the substrate 100, the orthographic projection of the first opening 401a on the substrate 100 is located within the orthographic projection of the second encapsulation layer 420 on the substrate 100, and the second encapsulation layer 420 covers and fills the first opening 401a. The first opening 401a can be used to release the gas trapped inside the dam 600 to ensure the packaging effect of the display panel; in addition, the second packaging layer 420 covers and fills the first opening 401a to seal the first opening 401a, thereby preventing gas from invading the dam 600 or the escape of residual gas in the dam 600 in the subsequent preparation process; in addition, the setting of the first opening 401a is equivalent to embedding the second packaging layer 420 in the dam 600, thereby reducing the risk of the second packaging layer 420 falling off from the substrate 100.

[0175] It should be noted that if the gas inside the dam 600 is not released in advance, after the display panel is prepared, if the gas escapes, it will cause interface separation between the top film layer 610, the first sub-protective layer 510 and the second encapsulation layer 420, and even the gas will invade the encapsulation structure 400, thereby causing failure of the display panel encapsulation.

[0176] In at least one embodiment of the present disclosure, as shown in FIG7A , the dam 600 includes a support layer 620, which is located between the top film layer 610 and the substrate 100. The first sub-protective layer 510 covers the side surface of the support layer 620. In this way, the top film layer 610 and the first sub-protective layer 510 fully cover the support layer 620 to protect the support layer 620.

[0177] For example, as shown in FIG. 7A , the first opening 401 a of the top film layer 610 can release gas in the support layer 620 to ensure the packaging quality of the display panel.

[0178] Optionally, the support layer 620 is an organic film layer. The organic film layer is thicker, which facilitates increasing the height of the dam 600. Accordingly, the organic film layer is also easily etched. When the top film layer 610 and the first sub-protective layer 510 are covered, the etching risk of the support layer 620 is reduced.

[0179] In at least one embodiment of the present disclosure, as shown in FIG7A , at least a portion of the support layer 620 is formed from the same layer and material as the first planar layer 121, and the first planar layer 121 is spaced apart from the dam 600. This allows the support layer 620 to be fabricated simultaneously with the first planar layer 121, simplifying the display panel fabrication process.

[0180] For example, as shown in FIG7A , the support layer 620 includes a first sub-support layer 621 and a second sub-support layer 622 stacked on top of each other, the second sub-support layer 622 being located between the first sub-support layer 621 and the substrate 100, and the first sub-support layer 621 being formed from the same layer and the same material as the first planar layer 121. For example, the second sub-support layer 622 is formed from the same layer and the same material as the film structure (e.g., insulating film layer) between the first sub-support layer 621 and the substrate 100, or the film structure (e.g., insulating film layer) in the substrate 100.

[0181] For example, in at least one embodiment of the present disclosure, as shown in FIG7B , a plurality of second openings 402a corresponding to the first openings 401a are provided in the first sub-supporting layer 621, and the second openings 402a are arranged at intervals along the dam 600. The first openings 401a and the second openings 402a can release gas trapped in the first sub-supporting layer 621 and the second sub-supporting layer 622 (portions thereof not covered by the second common electrode lines 112) to ensure the encapsulation effect of the display panel.

[0182] In at least one embodiment of the present disclosure, as shown in Figure 7B, the display panel also includes a third encapsulation layer 430, which is located between the first encapsulation layer 410 and the second encapsulation layer 420, and the third encapsulation layer 430 is located on the side of the dam 600 facing the display area 11a, and the first subprotective layer 510 is in direct contact with the third encapsulation layer 430 between the dam 600 and the display area 11a.

[0183] For example, the third encapsulation layer 430 is an organic film layer. The third encapsulation layer 430 can be formed by inkjet printing, thus achieving a good leveling effect. The dam 600 can prevent the spread of ink, thereby defining the distribution area of ​​the third encapsulation layer 430. In the embodiment of the present disclosure, the first sub-protective layer 510 and the second encapsulation layer 420 sandwich the third encapsulation layer 430 to protect it. The first sub-protective layer 510 and the second encapsulation layer 420 are in contact, thereby preventing the intrusion of external moisture, oxygen, etc. into the third encapsulation layer 430.

[0184] In at least one embodiment of the present disclosure, the protective layer can be configured as a plurality of stacked film layers, thereby improving its protective effect on the film structure in the display panel. For example, as shown in Figures 8A and 8B, the protective layer 500 further includes a second sub-protective layer 520, at least a portion of which is located in the non-display area 11c. In the non-display area 11c, the second sub-protective layer 520 is located between the first sub-protective layer 510 and the substrate 100. In the non-display area 11c, the orthographic projection of the first flat layer 121 on the substrate 100 is located within the orthographic projection of the first sub-protective layer 510 on the substrate 100, and is also located within the orthographic projection of the second sub-protective layer 520 on the substrate 100. The second sub-protective layer 520 extends to the display area 11a. In the area where the first flat layer 121 is provided, the first sub-protective layer 510 and the second sub-protective layer 520 are separated by the first flat layer 121, that is, the first flat layer 121 is located between the first sub-protective layer 510 and the second sub-protective layer 520. In this way, the second sub-protective layer 520 can protect the structure of the lower layer. In addition, the protective layer 500 is a structure composed of at least two film layers, which further enhances its protective effect and thus further improves the quality of the display panel.

[0185] In at least one embodiment of the present disclosure, as shown in Figures 8A and 8B , the orthographic projection of the pixel defining layer 330 on the substrate 100 is located within the orthographic projection of the second sub-protective layer 520 on the substrate 100. Thus, the second sub-protective layer 520 covers the entire display area 11a, thereby protecting the structures in the display area 11a located below the pixel defining layer 330 during the formation process of the pixel defining layer 330.

[0186] In at least one embodiment of the present disclosure, as shown in Figures 8A and 8B, the display panel further includes a first signal line 131, which is located on the side of the first planar layer 121 facing the substrate 100. The presence of the first signal line 131 requires the provision of other film layers to space it from adjacent conductive structures, thereby providing an interlayer location for the provision of the second sub-protective layer 520.

[0187] In some embodiments of the present disclosure, the second subprotective layer 520 may be located above the first signal line 131 to cover the first signal line 131. For example, as shown in Figures 8A and 8B, the second subprotective layer 520 is located between the first signal line 131 and the first planar layer 121. In the non-display area 11c, the first subprotective layer 510 and the second subprotective layer 520 are located between the first common electrode line 111 and the second common electrode line 112. In this way, the second subprotective layer 520 can protect the first signal line 131 during the preparation process of the first planar layer 121 (for example, the etching process required for the opening). In addition, the second subprotective layer 520 can prevent substances in the first planar layer 121, such as water and oxygen, from invading the first signal line 131, thereby reducing the risk of the first signal line 131 being corroded and damaged.

[0188] For example, as shown in Figures 8A and 8B, when the second subprotective layer 520 is located between the first signal line 131 and the first flat layer 121, in the non-display area 11c, a first via hole 401 is provided in the first subprotective layer 510, a second via hole 402 connected to the first via hole 401 is provided in the first flat layer 121, and a third via hole 403 connected to the second via hole 402 is provided in the second subprotective layer 520, and the first common electrode line 111 and the second common electrode line 112 are connected through the first via hole 401, the second via hole 402 and the third via hole 403.

[0189] For example, as shown in Figures 8A and 8B , when the second subprotective layer 520 is located between the first signal line 131 and the first planar layer 121, the second common electrode line 112 is formed in the same layer and material as the first signal line 131. In this way, the first signal line 131 can be fabricated simultaneously with the second common electrode line 112, simplifying the display panel fabrication process.

[0190] For example, as shown in FIG. 8A and FIG. 8B , in the case where the second subprotecting layer 520 is located between the first signal line 131 and the first planar layer 121 , the first signal line 131 includes at least one of a power line and a data line.

[0191] In other embodiments of the present disclosure, the second subprotective layer 520 may be located below the first signal line 131. For example, as shown in Figures 9A and 9B, the display panel further includes a second signal line 132, and the second signal line 132 and the second subprotective layer 520 are located between the first signal line 131 and the substrate 100. Having the first signal line 131 and the second signal line 132 located on different layers can increase the wiring space of the display panel, thereby alleviating wiring difficulties. Accordingly, this also increases the number of film layers provided, providing more options for the interlayer position of the second subprotective layer 520.

[0192] For example, as shown in Figures 9A and 9B , the display panel further includes a second planar layer 122 and a third planar layer 123. In a direction away from the substrate 100, the third planar layer 123, the second signal line 132, the second planar layer 122, the first signal line 131, and the first planar layer 121 are arranged in that order. The second subprotective layer 520 is located between the second planar layer 122 and the second signal line 132, as specifically shown in Figure 9A . Alternatively, the second subprotective layer 520 is located between the second signal line 132 and the third planar layer 123.

[0193] In at least one embodiment of the present disclosure, as shown in FIG9A and FIG9B , at least a portion of the dam 600 (e.g., the supporting layer 620) can be formed by at least two of the first planar layer 121, the second planar layer 122, and the third planar layer 123. In this way, the second common electrode line 112 and the second subprotective layer 520 can pass through the interior of the dam 600. In this way, at the location where the dam 600 is located, the height that the second common electrode line 112 needs to pass over the dam 600 can be reduced, thereby reducing the risk of the second common electrode line 112 being broken. In addition, at this location, the second common electrode line 112 is located inside the dam 600, so that the dam 600 can protect the second common electrode line 112, further reducing the risk of the second common electrode line 112 being damaged by etching.

[0194] In at least one embodiment of the present disclosure, as shown in FIG. 9A and FIG. 9B , the dam 600 includes a top film layer 610 and a support layer 620 , and portions of the second common electrode line 112 and the second subprotecting layer 520 that pass through the dam 600 are located inside the support layer 620 .

[0195] For example, the supporting layer 620 includes a first sub-supporting layer 621 and a second sub-supporting layer 622. The first sub-supporting layer 621 is formed from the same layer and material as the first planar layer 121, and the second sub-supporting layer 622 is formed from the same layer and material as at least one of the second planar layer 122 and the third planar layer 123. In this way, the portion of the second common electrode line 112 and the second sub-protecting layer 520 that passes through the dam 600 is located between the first sub-supporting layer 621 and the second sub-supporting layer 622. As such, the provision of the supporting layer 620 does not increase the manufacturing process flow of the display panel.

[0196] In at least one embodiment of the present disclosure, as shown in Figures 9A and 9B , the second sub-protective layer 520 is located between the second signal line 132 and the second planar layer 122. Thus, the second sub-protective layer 520 can protect the second signal line 132 during the formation process of the second planar layer 122 (forming vias). Furthermore, the second sub-protective layer 520 can prevent substances in the second planar layer 122, such as water and oxygen, from invading the first signal line 131, thereby reducing the risk of corrosion damage to the first signal line 131.

[0197] For example, as shown in Figures 9A and 9B, when the second subprotective layer 520 is located between the second signal line 132 and the second planar layer 122, the second common electrode line 112 and the first signal line 131 are formed in the same layer and made of the same material. Thus, the second subprotective layer 520 is located between the second common electrode line 112 and the substrate 100. In this way, the second subprotective layer 520 can improve the surface properties of the substrate, facilitate the deposition of the second common electrode line 112, and reduce the risk of the second common electrode line 112 falling off.

[0198] For example, as shown in Figures 9A and 9C , when the second subprotective layer 520 is located between the second signal line 132 and the second planar layer 122, the second common electrode line 112 and the second signal line 132 are formed in the same layer and made of the same material, and the second subprotective layer 520 covers the second common electrode line 112. In this way, the second common electrode line 112 can be formed simultaneously with the second signal line 132, thereby simplifying the manufacturing process of the display panel.

[0199] In some embodiments of the present disclosure, as shown in Figure 10A, when the second sub-protective layer 520 is located between the second signal line 132 and the second flat layer 122, a plurality of second openings 402a are provided in the first sub-support layer 621, and the second openings 402a are arranged at intervals along the dam 600. The second openings 402a expose the second sub-protective layer 520, and the top film layer 610 includes a first opening 401a corresponding to the second opening 402a. The second encapsulation layer 420 covers the second opening 402a and the first opening 401a, and is in direct contact with the second sub-protective layer 520 through the second opening 402a and the first opening 401a. In this way, the second opening 402a and the first opening 401a can release the gas trapped in the first sub-support layer 621 to ensure the packaging effect of the display panel; in addition, the second packaging layer 420 covers and fills the second opening 402a and the first opening 401a to seal the second opening 402a and the first opening 401a, thereby preventing gas from invading the dam 600 or the escape of residual gas in the dam 600 in the subsequent preparation process; in addition, the setting of the second opening 402a and the first opening 401a not only allows the second sub-protective layer 520 to be in direct contact with the second packaging layer 420, but also is equivalent to embedding the second packaging layer 420 in the dam 600, thereby reducing the risk of the second packaging layer 420 falling off the substrate 100.

[0200] In other embodiments of the present disclosure, as shown in Figure 10B, a plurality of second openings 402a are provided in the first sub-support layer 621, and the second openings 402a are arranged at intervals along the dam 600. The second openings 402a expose the second sub-protective layer 520. The first sub-protective layer 510 covers the top film layer 610 and the second openings 402a so as to be in direct contact with the second sub-protective layer 520 through the second openings 402a. In this way, the second opening 402a can release the gas trapped in the first sub-support layer 621 to ensure the packaging effect of the display panel; in addition, the first sub-protective layer 510 covers and fills the second opening 402a to seal the second opening 402a, thereby preventing gas from invading the dam 600 or the escape of residual gas in the dam 600 in the subsequent preparation process; in addition, the setting of the second opening 402a not only allows the first sub-protective layer 510 to be in direct contact with the second packaging layer 420, but also is equivalent to embedding the second packaging layer 420 in the dam 600, thereby reducing the risk of the second packaging layer 420 falling off the substrate 100.

[0201] In at least one embodiment of the present disclosure, as shown in FIG11 , the second common electrode line 112 includes at least one vent hole 112a that passes through the second common electrode line 112. The vent hole 112a can be used to release gas trapped in the second sub-support layer 622 to ensure the encapsulation effect of the display panel.

[0202] For example, as shown in FIG11 , a plurality of air holes 112 a are provided and spaced apart along the dam 600. It should be noted that the provision of the air holes 112 a does not destroy the continuity of the second common electrode line 112. The structure shown in FIG11 only captures the locations where the air holes 112 a are located. For other locations, the structure of the second common electrode line 112 can refer to the structure shown in FIG10B .

[0203] It should be noted that, in the embodiment of the present disclosure, when the second flat layer 122 is provided and the third flat layer 123 is not provided, the second flat layer 122 is used to planarize the driving circuit of the substrate; correspondingly, when the third flat layer 123 is provided, the third flat layer 123 is used to planarize the driving circuit of the substrate.

[0204] In at least one embodiment of the present disclosure, referring again to FIG. 1 , the non-display area 11 c further includes a bending area 11 d , and the dam 600 is located between the bending area 11 d and the display area 11 a .

[0205] In at least one embodiment of the present disclosure, referring again to FIG. 1 , the non-display area 11c may further include a binding area 11b. Binding pins (which may be referred to as pads, or PADs, etc.) may be provided in the binding area 11b, and the signal lines in the display panel (such as the common electrode lines 110) may be aggregated and extended to the binding area 11b to be connected to the corresponding binding pins. For example, the common electrode lines 110 extend from the display area 11a to the binding area 11b, and the binding pins may be used to connect to external control circuits and / or chips, etc. For example, the binding area 11b is located on the side of the bending area 11d away from the display area 11a, so that after the portion of the display panel located in the bending area 11d is bent, the portion of the display panel located in the binding area 11b and the structure connected to the binding area 11b are bent to the back of the display panel, so as to facilitate narrowing the border width of the display panel.

[0206] In some scenarios, circuits are arranged in the non-display area of ​​a display panel near the display area. This can easily cause signal interference between these circuits when driven, leading to malfunctioning display panels. In embodiments of the present disclosure, a signal shielding structure can be provided in this area to address this technical issue. The structure and principle of this signal shielding structure are described below.

[0207] In at least one embodiment of the present disclosure, as shown in Figures 12 and 13A, the non-display area 11c includes a dummy sub-pixel area 11e, and the display panel further includes a second isolation structure 300a, which is located in the dummy sub-pixel area 11e and on the side of the first sub-protective layer 510 away from the substrate 100. For example, the second isolation structure 300a is located between the dam 600 and the display area 11a. The second isolation structure 300a can protect the structure of the lower layer. In addition, the second isolation structure 300a can play a role in signal shielding to shield the lower layer circuits (such as the drive circuit or the signal line connected to the drive circuit) to prevent these circuits from being interfered with by external signals (such as the signal caused by the touch structure 800 described below).

[0208] In some embodiments of the present disclosure, as shown in Figures 12 and 13A, the substrate 100 includes a gate driver circuit 130. The gate driver circuit 130 is located in the dummy sub-pixel region 11e, and the orthographic projection of the gate driver circuit 130 on the substrate 100 at least partially overlaps with the orthographic projection of the second isolation structure 300a on the substrate 100. For example, the orthographic projection of the gate driver circuit 130 on the substrate 100 is located within the orthographic projection of the second isolation structure 300a on the substrate 100. In this way, the second isolation structure 300a can shield the gate driver circuit 130 from signals, thereby preventing the gate driver circuit 130 from being interfered with by external signals.

[0209] In other embodiments of the present disclosure, as shown in Figures 12 and 13B , the substrate 100 includes a gate driver circuit 130 located on a side of the dummy sub-pixel region 11e away from the display region 11a. Thus, the second isolation structure 300a can shield signal lines connected to the gate driver circuit to prevent interference from external signals.

[0210] In other embodiments of the present disclosure, the orthographic projection of the gate driver circuit on the substrate 100 at least partially overlaps with the orthographic projection of the first common electrode line 111 on the substrate 100. In this way, the first common electrode line 111 can shield the gate driver circuit from external signal interference. For example, the orthographic projection of the gate driver circuit on the substrate 100 is located within the orthographic projection of the first common electrode line 111 on the substrate 100.

[0211] In at least one embodiment of the present disclosure, as shown in FIG14 , the display panel further includes a touch structure 800 , which is located on a side of the second encapsulation layer 420 away from the substrate 100 , and a positive projection of a portion of the touch structure 800 on the substrate 100 overlaps with the dummy sub-pixel area 11 e .

[0212] Optionally, the touch structure 800 includes touch electrodes and touch traces 830 connected to the touch electrodes, with the touch traces 830 extending from the display area 11a to the non-display area 11c. In this manner, the second isolation structure 300a and / or the first common electrode line 111 can shield signals from the touch electrodes or the touch traces 830 to prevent these signals from interfering with the underlying gate driver circuit 130 or signal lines connected to the gate driver circuit 130.

[0213] For example, the touch electrode includes a first touch electrode layer 810 and a second touch electrode layer 820, and the first touch electrode layer 810 and the second touch electrode layer 820 constitute a touch unit for implementing a touch function. For example, one of the first touch electrode layer 810 and the second touch electrode layer 820 includes a plurality of parallel first electrode strips and a plurality of parallel second electrode strips, and the first electrode strips and the second electrode strips intersect to form a touch unit at the intersection. The other of the first touch electrode layer 810 and the second touch electrode layer 820 includes a plurality of conductive bridges, and the first electrode strips are disconnected at the intersection with the second electrode strips, that is, the first electrode strips are disconnected into a plurality of electrode blocks, and adjacent electrode blocks are electrically connected via conductive bridges. It should be noted that the first touch electrode layer 810 can also be configured to include a plurality of first electrode strips, and the second touch electrode layer 820 can be configured to include a plurality of second electrode strips, so that the conductive bridges are not required.

[0214] In at least one embodiment of the present disclosure, the touch trace 830 can be designed as a single layer or a double layer. For example, in the case of a single layer design, the touch trace 830 can be in the same layer and made of the same material as one of the first touch electrode layer 810 and the second touch electrode layer 820. In the case of a double layer design, one layer of the touch trace 830 can be in the same layer and made of the same material as the first touch electrode layer 810, and the other layer can be in the same layer and made of the same material as the second touch electrode layer 820. In this way, the touch trace 830 can be formed by connecting two layers of conductive wires in parallel to reduce the voltage drop across the touch trace 830.

[0215] In at least one embodiment of the present disclosure, as shown in Figure 14, the second isolation structure 300a can be prepared simultaneously with the first isolation structure 300, for example, both are formed using the same type of mask plate. In this way, multiple second isolation openings 301a corresponding to the first isolation openings 301 will be formed in the second isolation structure 300a, and in the non-display area 11c, the second isolation openings 301a will expose the first sub-protective layer 510 below.

[0216] It should be noted that the dummy sub-pixel region 11e is not used for display. Therefore, during the fabrication of the light-emitting device 200, the second isolation opening 301a can be subjected to the same fabrication process as the first isolation opening 301 to fabricate a light-emitting device (dummy light-emitting device). Alternatively, the light-emitting device may not be fabricated in this region. These different options are described below.

[0217] In some embodiments of the present disclosure, no light-emitting device is formed in the second isolation opening 301a. For example, as shown in FIG14 , the display panel further includes a third encapsulation layer 430, which is located between the first encapsulation layer 410 and the second encapsulation layer 420. The third encapsulation layer 430 fills the second isolation opening 301a and directly contacts the first sub-protective layer 510 in the second isolation opening 301a. Thus, the first sub-protective layer 510 forms a continuous film layer at the second isolation opening 301a, thereby protecting the underlying film layer during the formation of the second isolation opening 301a.

[0218] For example, as shown in FIG14 , in a case where the second isolation opening 301 a is in direct contact with the first subprotective layer 510, the display panel further includes a dummy electrode 210 a, and the orthographic projection of the second isolation opening 301 a on the substrate 100 is located within the orthographic projection of the dummy electrode 210 a on the substrate 100. The dummy electrode 210 a is used to shield the signal at the second isolation opening 301 a to prevent signal interference between the touch-sensing structure 800 and the circuits of the substrate 100.

[0219] For example, as shown in Figure 14, the dummy electrode 210a is electrically connected to the second isolation structure 300a in direct contact with the first sub-protective layer 510 in the second isolation opening 301a. In this way, the dummy electrode 210a and the second isolation structure 300a can be at the same potential, eliminating the need to provide a separate wiring for the dummy electrode 210a.

[0220] For example, as shown in Figure 14, in the case where the second isolation opening 301a is in direct contact with the first subprotective layer 510, the dummy electrode 210a is in the same layer and made of the same material as the first electrode 210. A via hole is provided in the first subprotective layer 510, and the dummy electrode 210a is connected to the second isolation structure 300a through the via hole. In this way, the dummy electrode 210a can be prepared simultaneously with the preparation of the first electrode 210, thereby simplifying the preparation process of the display panel.

[0221] In other embodiments of the present disclosure, as shown in FIG15A , the display panel further includes a dummy light-emitting device 200a. The dummy light-emitting device 200a includes a first dummy electrode 210a, a first dummy light-emitting functional layer 220a, and a second dummy electrode 230a stacked sequentially on the substrate 100. The first subprotective layer 510 includes a dummy pixel opening 302 connected to the second isolation opening 301a. The first dummy light-emitting functional layer 220a and the second dummy electrode 230a are located in the dummy pixel opening 302 and the second isolation opening 301a, and the second dummy electrode 230a is connected to the second isolation structure 300a. Thus, the dummy sub-pixel region 11e and the display region 11a undergo the same preparation process, thereby forming a dummy light-emitting device 200a corresponding to the light-emitting device 200 in the second isolation opening 301a. Thus, the second dummy electrode 230a of the dummy light-emitting device 200a can be connected to the second isolation structure 300a to shield the signal.

[0222] In other embodiments of the present disclosure, as shown in Figures 15A and 15B, the display panel also includes a dummy light-emitting device 200a, which includes a first dummy electrode 210a, a first dummy light-emitting functional layer 220a, and a second dummy electrode 230a stacked in sequence on the substrate 100, a first sub-protective layer 510 separates the first dummy electrode 210a and the first dummy light-emitting functional layer 220a, the first dummy light-emitting functional layer 220a and the second dummy electrode 230a are located in the second isolation opening 301a, and the second dummy electrode 230a is connected to the second isolation structure 300a. In the above scheme, the dummy sub-pixel area 11e and the display area 11a are prepared by the same process, so that a dummy light-emitting device 200a corresponding to the light-emitting device 200 is formed in the second isolation opening 301a. In this way, the second dummy electrode 230a of the dummy light-emitting device 200a can be connected to the second isolation structure 300a to shield the signal; in addition, the first sub-protective layer 510 is a continuous film layer at the second isolation opening 301a, thereby protecting the underlying film layer during the formation of the second isolation opening 301a.

[0223] In at least one embodiment of the present disclosure, as shown in FIG15B , in the non-display area 11c, the first subprotective layer 510 includes a third opening 403a to expose the first planar layer 121. The orthographic projection of the third opening 403a on the substrate 100 is located between the orthographic projection of the first isolation structure 300 on the substrate 100 and the orthographic projection of the second isolation structure 300a on the substrate 100. As such, the third opening 403a can be used to release gas from the first planar layer 121 to prevent the gas from adversely affecting subsequent packaging and the like.

[0224] It should be noted that, taking FIG15B as an example, both the first isolation structure 300 and the second isolation structure 300a are grid-like structures and are connected to each other. FIG15B is cut through the region where the isolation opening (which may be the first isolation opening or the second isolation opening) between the first isolation structure 300 and the second isolation structure 300a is located. In this way, the first common electrode line is connected to the first isolation structure 300 through the second isolation structure 300a.

[0225] In at least one embodiment of the present disclosure, as shown in FIG15B , the first isolation structure 300 and the second isolation structure 300a are formed in the same layer and made of the same material. Thus, the second isolation structure 300a can be simultaneously formed during the preparation of the first isolation structure 300, thereby simplifying the display panel manufacturing process.

[0226] In at least one embodiment of the present disclosure, as shown in Figure 15B, the second isolation structure 300a includes a second support portion 310a and a second crown portion 320a. The second support portion 310a is located between the second crown portion 320a and the substrate 100. The orthographic projection of the second support portion 310a on the substrate 100 is located within the orthographic projection of the second crown portion 320a on the substrate 100. The first support portion 310 and the second support portion 310a are in the same layer and made of the same material. The first crown portion 320 and the second crown portion 320a are in the same layer and made of the same material.

[0227] In at least one embodiment of the present disclosure, the display panel further includes an optical adjustment structure (not shown) arranged on the side of the second packaging layer 420 away from the substrate 100, a polarization structure (not shown) arranged on the side of the touch structure 800 away from the substrate 100, a cover plate (not shown), etc.

[0228] At least one embodiment of the present disclosure provides a display panel. Referring again to FIG. 1 , FIG. 2 , FIG. 3A , and FIG. 3B , the display panel 10 has a display area 11a and a non-display area 11c and includes a substrate 100, a dam 600, an encapsulation structure 400, a protective layer 500, and a plurality of light-emitting devices 200. The light-emitting devices 200 are located in the display area 11a, the dam 600 is located in the non-display area 11c, the dam 600 includes a top film layer 610 that is away from the substrate 100, the encapsulation structure 400 is stacked on a side of the dam 600 and the light-emitting devices 200 that is away from the substrate 100, and at least a portion of the protective layer 500 is located in the non-display area 11c. The protective layer 500 is located on a side of the encapsulation structure that is closer to the substrate 100 and overlaps with the top film layer. The encapsulation structure 400 includes a stacked first encapsulation layer 410 and a second encapsulation layer 420. The first encapsulation layer 410 is located on the side of the second encapsulation layer 420 closest to the substrate 100. The second encapsulation layer 420 extends from the display area 11a to the non-display area 11c and directly contacts the dam 600. In this manner, the protective layer 500 can protect the underlying structures during the fabrication of the first encapsulation layer, preventing damage to the substrate 100 or the structures between the substrate 100 and the protective layer 500. Furthermore, the protective layer 500 can protect the side surfaces of the dam during the fabrication of the pixel definition layer, reducing the risk of damage from etching. The structure of the display panel, the technical problems it solves, the corresponding technical effects, and further improved design structures can be found in the relevant descriptions of the aforementioned embodiments and are not elaborated upon here.

[0229] At least one embodiment of the present disclosure provides a method for manufacturing a display panel. As shown in FIG. 16A , the method includes the following steps S100 to S300 .

[0230] S100 , providing a substrate, and pre-dividing a display area and a non-display area of ​​a display panel on the substrate.

[0231] S200 , forming a protective layer on the substrate, wherein at least a portion of the protective layer is formed in the non-display area.

[0232] S300 , forming a light emitting device on a substrate, wherein the light emitting device is formed in a display area.

[0233] S400, a first encapsulation layer and a second encapsulation layer covering the light-emitting device are sequentially formed on a side of the light-emitting device facing away from the substrate, wherein the second encapsulation layer is located in a display area and a non-display area, a protective layer is formed between the second encapsulation layer and the substrate, and in the non-display area, the second encapsulation layer is formed to be in direct contact with the protective layer.

[0234] In this preparation method, the protective layer can protect the underlying structure during the preparation process of the first encapsulation layer to prevent damage to the substrate or the structure between the substrate and the protective layer, thereby ensuring the quality of the display panel. Regarding the structure of the display panel obtained in steps S100 to S300, the technical problems solved, the corresponding technical effects, and possible further improvements, please refer to the relevant descriptions in the previous embodiments and will not be repeated here.

[0235] In the preparation method provided in the above embodiment of the present disclosure, as shown in FIG16B , a method for forming a protective layer, a pixel defining layer, a light-emitting device and a first encapsulation layer in the above steps S200 to S400 includes the following steps S21 to S29 .

[0236] S21, forming a plurality of first electrodes on a substrate.

[0237] S22 , forming a pixel defining material layer on the substrate having the first electrode formed thereon.

[0238] S23 , forming a first isolation structure on a side of the pixel defining material layer facing away from the substrate, the first isolation structure having a plurality of first isolation openings.

[0239] S24, performing a composition process on the pixel defining material layer to form a pixel opening corresponding to the first isolation opening, the portion of the pixel defining material layer located in the display area is formed as the pixel defining layer, and the portion of the pixel defining material layer located in the non-display area is formed as the first sub-protective layer of the protective layer.

[0240] S25, forming a light-emitting functional layer and a second electrode on a side of the first isolation structure away from the substrate, the first electrode, the light-emitting functional layer and the second electrode corresponding to each first isolation opening constitute a light-emitting device.

[0241] S26, after forming a first encapsulation film on the side of the first isolation structure and the light-emitting device facing away from the substrate, depositing photoresist on the first encapsulation film, and patterning the photoresist to form a photoresist pattern, wherein the photoresist pattern covers a portion of the first isolation opening.

[0242] S27, etching the first packaging film, the light-emitting functional layer and the second electrode using the photoresist pattern as a mask to remove portions of the first packaging film, the light-emitting functional layer and the second electrode that are not covered by the photoresist pattern, wherein the remaining portion of the first packaging film is a packaging unit.

[0243] S28, removing the remaining photoresist pattern.

[0244] S29, repeating the steps of forming the light-emitting functional layer and the second electrode until removing the remaining photoresist pattern, to form a light-emitting device and a packaging unit at the first isolation opening where no light-emitting device is formed, wherein all the packaging units together constitute a first packaging layer.

[0245] Regarding the structure of the display panel obtained in the above steps S21 to S29, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments and will not be repeated here.

[0246] In the preparation method provided in the above embodiment of the present disclosure, as shown in FIG16C , another method for forming the protective layer, the pixel defining layer, the light-emitting device and the first encapsulation layer in the above steps S200 to S400 includes the following steps S31 to S39 .

[0247] S31, forming a plurality of first electrodes on a substrate.

[0248] S32 , forming a pixel defining material layer on the substrate having the first electrode formed thereon.

[0249] S33 , forming a first isolation structure on a side of the pixel defining material layer facing away from the substrate, wherein the first isolation structure has a plurality of first isolation openings.

[0250] S34, performing a composition process on the pixel defining material layer to form a pixel opening corresponding to a portion of the first isolation opening, the portion of the pixel defining material layer located in the display area is formed as a pixel defining layer, and the portion of the pixel defining material layer located in the non-display area is formed as a first sub-protective layer of the protective layer.

[0251] S35 , forming a light-emitting functional layer and a second electrode on a side of the first isolation structure away from the substrate, and the first electrode, the light-emitting functional layer and the second electrode corresponding to the first isolation opening and the pixel opening constitute a light-emitting device.

[0252] S36, after forming a first packaging film on the side of the first isolation structure and the light-emitting device facing away from the substrate, depositing photoresist on the first packaging film, and patterning the photoresist to form a photoresist pattern, wherein the photoresist pattern covers a portion of the first isolation opening.

[0253] S37, etching the first packaging film, the light-emitting functional layer and the second electrode using the photoresist pattern as a mask to remove portions of the first packaging film, the light-emitting functional layer and the second electrode that are not covered by the photoresist pattern, wherein the remaining portion of the first packaging film is a packaging unit.

[0254] S38, removing the remaining photoresist pattern.

[0255] S39, repeat the above steps of forming pixel openings to removing the remaining photoresist pattern to form pixel openings corresponding to each first isolation opening in the pixel defining layer, and form light-emitting devices and packaging units at the first isolation openings where no light-emitting devices are formed, wherein all the packaging units together constitute the first packaging layer.

[0256] Next, the preparation process of the display panel shown in FIG. 3A is described in conjunction with FIG. 17A to FIG. 17I to intuitively demonstrate the principle that the first isolation structure can increase the pixel arrangement density PPI.

[0257] As shown in FIG. 17A , a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100 .

[0258] 17B , a pixel defining material layer 330a is deposited on the substrate 100 having the first electrode 210 formed thereon. In this process, the density of the pixel defining material layer 330a can be controlled by controlling the input power of the device during the deposition of the pixel defining material layer 330a.

[0259] 17C , a first material layer 310 b and a second material layer 320 b are formed on the pixel defining material layer 330 a . For example, the first material layer 310 b may be made of aluminum, and the second material layer 320 b may be made of titanium.

[0260] As shown in Figure 17D, the first material layer 310b and the second material layer 320b are patterned to form the first material layer 310b into a first support portion 310, and the second material layer 320b into a first crown portion 320. The first support portion 310 and the first crown portion 320 define a first isolation opening 301 and constitute a first isolation structure 300. The specific structure of the first isolation structure 300 can be found in the relevant description of the previous embodiment and is not further described here.

[0261] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern 900 described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0262] It should be noted that if the corrosion resistance of the second material layer 320b (e.g., titanium) is greater than the corrosion resistance of the first material layer 310b (e.g., aluminum), the etching rate of the first material layer 310b will be greater than the etching rate of the second material layer 320b, thereby making the width of the first crown portion 320 greater than the width of the first support portion 310, thereby forming a structure as shown in FIG17D.

[0263] As shown in Figure 17E, the pixel defining material layer 330a is subjected to a patterning process to form a pixel opening 302 at the location of a portion of the first isolation opening 301. The portion of the pixel defining material layer 330a located in the display area is formed into a pixel defining layer 330 (not the final form), and the portion located in the non-display area serves as a first sub-protective layer.

[0264] It should be noted that, in the step shown in FIG. 17E , the pixel opening 302 may be formed using a photolithography patterning process. In this process, the first isolation structure 300 may also be used to expose the photoresist, thereby precisely controlling the formation position of the pixel opening 302 .

[0265] During the above-mentioned process of preparing the first isolation structure, at least part of the first material layer 310b and the second material layer 320b located in the non-display area will be removed. If there is no protective layer (first sub-protective layer) in the non-display area, the etching material in the process will etch and damage the structure on the substrate.

[0266] As shown in FIG17F , a light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a light-emitting device 200 in each isolation opening 301 of the first isolation structure 300. No mask is used in this evaporation process, so the evaporated material is also deposited on the first crown 320. It should be noted that in actual processing, the evaporated material is deposited on the upper surface of the first crown 320 facing away from the substrate 100 and on the sidewalls (not shown in the figure). A first encapsulation film 410a is then deposited to cover the light-emitting device 200 and the first isolation structure 300. In this process, the density of the first encapsulation film 410a during its formation can be controlled by controlling the input power of the device during deposition.

[0267] It should be noted that, at a location where the first isolation opening 301 is formed but the pixel opening 302 is not formed, the light-emitting functional layer 220 and the first electrode 210 are spaced apart, so the light-emitting functional layer 220 and the first electrode 210 of the light-emitting device 200 at this location are separated from each other and thus do not have a light-emitting function.

[0268] As shown in Figure 17G, a photoresist is formed (e.g., coated) on the substrate 100 on which the first encapsulation film 410a is formed, and then a patterning process is performed to form a photoresist pattern 900. The photoresist pattern 900 only covers a portion of the first isolation opening 301 of the first isolation structure 300 (the first isolation opening 301 corresponding to the pixel opening 302).

[0269] As shown in FIG17H , the surface of the display panel is etched using the photoresist pattern 900 as a mask to remove the first encapsulation film 410a, second electrode 230, and light-emitting functional layer 220 not covered by the photoresist pattern 900. The remaining portion of the first encapsulation film 410a forms the encapsulation unit 411 of the first encapsulation layer 410. The remaining photoresist pattern 900 is then removed. If the non-display area does not have a protective layer (first sub-protective layer), this etching process may damage the structures on the substrate.

[0270] As shown in FIG. 17I , the pixel definition layer 330 is patterned to form a pixel opening 302 at another portion of the first isolation opening 301 where the pixel opening 302 is not formed.

[0271] Repeat the steps of FIG. 17E to FIG. 17H to form a light emitting device 200 emitting green light and a light emitting device 200 emitting blue light in other first isolation openings 301 , respectively, and form the display panel shown in FIG. 3A .

[0272] As shown in FIG18 , when evaporating a light-emitting functional layer (e.g., the first functional layer), if the evaporation source P is moved to face the first isolation structure 300, the boundaries of its evaporation angle correspond to lines L1 and L2 on the display panel. In this case, the area before lines L1 and L2 will not be evaporated. However, the area on the side of lines L1 and L2 facing away from the first isolation structure 300 will be evaporated regardless of the position of the evaporation source P. That is, starting from line L1 or line L2, the thickness of the light-emitting functional layer decreases as it approaches the first isolation structure 300. Similarly, the second electrode can also be formed by evaporation, and therefore, the thickness of the second electrode decreases as it approaches the first isolation structure 300.

[0273] At least one embodiment of the present disclosure provides a display device, comprising the display panel described in any of the above embodiments or a display panel obtained by the preparation method described in any of the above embodiments. For example, the display device can be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, or a navigation system.

[0274] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A display panel having a display area and a non-display area, wherein: The display panel further includes: substrate; A plurality of light emitting devices are located on one side of the substrate and in the display area; an encapsulation structure, located on a side of the light-emitting device away from the substrate, and comprising a first encapsulation layer and a second encapsulation layer located on a side of the first encapsulation layer away from the substrate, wherein the first encapsulation layer and the second encapsulation layer cover the light-emitting device, and an orthographic projection of the second encapsulation layer on the substrate is located in the display area and the non-display area; and The protective layer is at least partially located in the non-display area and is located on a side of the second encapsulation layer close to the substrate, wherein in the non-display area, the protective layer is in direct contact with the second encapsulation layer, and the material type of the protective layer and the second encapsulation layer are the same.

2. The display panel according to claim 1, further comprising a pixel defining layer located on the substrate, wherein: The pixel defining layer is located in the display area and is provided with a plurality of pixel openings, the pixel openings are used to accommodate the light emitting device, the protective layer comprises a first sub-protective layer, the first sub-protective layer overlaps the pixel defining layer, and in the non-display area, the first sub-protective layer is in direct contact with the second encapsulation layer; The pixel defining layer, the first encapsulation layer, the second encapsulation layer and the protective layer are inorganic film layers.

3. The display panel according to claim 2, wherein: The first sub-protection layer is in the same layer and made of the same material as the pixel defining layer.

4. The display panel according to claim 2, wherein: The orthographic projection of the first subprotecting layer on the substrate is located in the display area and the non-display area, and in the display area, the first subprotecting layer overlaps at least partially with the pixel defining layer, and the first subprotecting layer is located between the pixel defining layer and the substrate.

5. The display panel according to claim 4, wherein: Along the direction away from the substrate, the light emitting device includes a first electrode, a light emitting functional layer and a second electrode sequentially stacked on the substrate, and the first sub-protective layer is located between the first electrode and the substrate.

6. The display panel according to claim 5, further comprising a first planar layer between the substrate and the first electrode, wherein: The first planar layer is located in the display area and the non-display area and contacts the first subprotecting layer in the non-display area. In the display area, the first subprotecting layer is located between the first electrode and the first planar layer.

7. The display panel according to claim 2, wherein: The orthographic projection of the first subprotecting layer on the substrate is located in the display area and the non-display area, and in the display area, the first subprotecting layer overlaps at least partially with the pixel defining layer, and the pixel defining layer is located between the first subprotecting layer and the substrate.

8. The display panel according to claim 7, wherein: In a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked on the substrate, and The orthographic projection of the first sub-protection layer on the substrate is located outside the orthographic projection of the first electrode on the substrate.

9. The display panel according to claim 8, further comprising a first planar layer between the substrate and the first electrode, wherein: The first planarizing layer is located in the display area and the non-display area, and contacts the first subprotecting layer in the non-display area.

10. The display panel according to claim 2, further comprising at least one dam located in the non-display area, wherein: The dam surrounds at least a portion of the display area, the dam includes a top film layer away from the substrate, the first sub-protection layer is in contact with the top film layer, and the first sub-protection layer and the top film layer are made of the same material.

11. The display panel according to claim 10, wherein: The first sub-protective layer is disposed in the same layer as the top layer, and the first sub-protective layer covers the side surface of the dam; or The first sub-protective layer covers the top film layer, the first sub-protective layer is located on a side of the top film layer away from the substrate, and the orthographic projection of the top film layer on the substrate is within the orthographic projection of the first sub-protective layer on the substrate.

12. The display panel according to claim 11, wherein: The top film layer includes a plurality of first openings, the orthographic projection of the first sub-protection layer on the substrate is outside the orthographic projection of the first opening on the substrate, and the orthographic projection of the first opening on the substrate is within the orthographic projection of the second encapsulation layer on the substrate, and The orthographic projection of the first opening on the substrate is located within the orthographic projection of the second encapsulation layer on the substrate, and the second encapsulation layer covers and fills the first opening.

13. The display panel according to claim 10, wherein: The dam includes a support layer, the support layer is located between the top film layer and the substrate, and the first sub-protection layer covers a side surface of the support layer.

14. The display panel according to claim 13, further comprising a first flat layer, wherein the first flat layer and the dam are spaced apart, wherein: The first planar layer is located in the display area and the non-display area, the first planar layer is located between the pixel defining layer and the substrate, and between the first subprotective layer and the substrate, and at least a portion of the supporting layer is in the same layer and made of the same material as the first planar layer.

15. The display panel according to claim 10, further comprising a third encapsulation layer, wherein: The third encapsulation layer is located between the first encapsulation layer and the second encapsulation layer, and the third encapsulation layer is located on a side of the dam facing the display area, and The first subprotecting layer is in direct contact with the third encapsulation layer between the bank and the display area.

16. The display panel according to claim 2, wherein: The protective layer further includes a second sub-protecting layer, at least a portion of the second sub-protecting layer is located in the non-display area, and in the non-display area, the second sub-protecting layer is located between the first sub-protecting layer and the substrate.

17. The display panel according to claim 16, further comprising a first flat layer and a first signal line, the first flat layer being located in the display area and the non-display area, the first flat layer being located between the pixel defining layer and the substrate, and between the first sub-protective layer and the substrate, in the non-display area, the orthographic projection of the first flat layer on the substrate being located within the orthographic projection of the first sub-protective layer on the substrate, and being located within the orthographic projection of the second sub-protective layer on the substrate, and the first signal line being located on a side of the first flat layer facing the substrate.

18. The display panel according to claim 17, wherein: The second sub-protective layer is located between the first signal line and the first flat layer. In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate, and the first sub-protective layer is located between the first electrode and the substrate. The display panel further includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on a side of the first subprotecting layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first subprotecting layer and the substrate, the first common electrode line is electrically connected to the second electrode, and In the non-display area, the first subprotecting layer and the second subprotecting layer are located between the first common electrode line and the second common electrode line.

19. The display panel according to claim 17, further comprising a second signal line, wherein: The second signal line and the second sub-protection layer are located between the first signal line and the substrate.

20. The display panel according to claim 19, wherein: It also includes a second flat layer and a third flat layer, wherein along a direction away from the substrate, the third flat layer, the second signal line, the second flat layer, the first signal line, and the first flat layer are arranged in sequence, and The second sub-protecting layer is located between the second planar layer and the second signal line, or the second sub-protecting layer is located between the second signal line and the third planar layer.

21. The display panel according to claim 20, wherein: Along a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting functional layer, and a second electrode sequentially stacked on the substrate, the first sub-protective layer is located between the first electrode and the substrate, The display panel further includes a first common electrode line and a second common electrode line, the first common electrode line is located in the display area and the non-display area, the second common electrode line is located in the non-display area, the first common electrode line is located on a side of the first subprotecting layer and the pixel defining layer away from the substrate, the second common electrode line is located between the first subprotecting layer and the substrate, the first common electrode line is electrically connected to the second electrode, and The display panel further includes at least one dam located in the non-display area, the dam surrounds the display area, and the second common electrode line and the second subprotecting layer penetrate inside the dam.

22. The display panel according to claim 21, wherein: The dam comprises a top film layer and a support layer, wherein the support layer is located between the top film layer and the substrate, and The supporting layer includes a first sub-supporting layer and a second sub-supporting layer stacked on each other, the second sub-supporting layer is located between the first sub-supporting layer and the substrate, the first sub-supporting layer and the first flat layer are in the same layer and made of the same material, the second sub-supporting layer and at least one of the second flat layer and the third flat layer are in the same layer and made of the same material, and the second common electrode line and the second sub-protective layer, portions that pass through the dam, are located between the first sub-supporting layer and the second sub-supporting layer.

23. The display panel according to claim 2, further comprising a first isolation structure located on a side of the pixel defining layer away from the substrate, wherein: The first isolation structure is located in the display area and is provided with a plurality of first isolation openings, the first isolation openings are connected to the pixel openings, the first encapsulation layer includes a plurality of encapsulation units, the encapsulation units are located on a side of the light emitting device away from the substrate to encapsulate the light emitting device, and Along the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on the substrate, the light-emitting functional layer and the second electrode are located within the first isolation opening, and the second electrode is electrically connected to the first isolation structure.

24. The display panel according to claim 23, wherein: The non-display area includes a dummy sub-pixel area. The display panel further includes a second isolation structure, which is located in the dummy sub-pixel area and on a side of the first subprotection layer away from the substrate.

25. The display panel according to claim 24, wherein: The substrate comprises a gate driving circuit, the gate driving circuit is located in the dummy sub-pixel area, and an orthographic projection of the gate driving circuit on the substrate at least partially overlaps with an orthographic projection of the second isolation structure on the substrate; or The substrate comprises a gate driving circuit, and the gate driving circuit is located at a side of the dummy sub-pixel area away from the display area.

26. The display panel according to claim 25, further comprising a touch control structure, wherein: The touch control structure is located on a side of the second encapsulation layer away from the substrate, and the orthographic projection of the touch control structure on the substrate partially overlaps with the dummy sub-pixel area.

27. The display panel according to claim 24, further comprising a first planar layer, wherein: The first flat layer is located in the display area and the non-display area, the first flat layer is located between the pixel defining layer and the substrate, and between the first sub-protective layer and the substrate, in the non-display area, the first sub-protective layer includes a third opening to expose the first flat layer, and the orthographic projection of the third opening on the substrate is located between the orthographic projection of the first isolation structure on the substrate and the orthographic projection of the second isolation structure on the substrate.

28. The display panel according to claim 24, wherein: The first isolation structure and the second isolation structure are in the same layer and made of the same material. The first isolation structure includes a first supporting portion and a first crown portion, the first supporting portion is located between the first crown portion and the substrate, and the orthographic projection of the first supporting portion on the substrate is located within the orthographic projection of the first crown portion on the substrate, the second isolation structure includes a second supporting portion and a second crown portion, the second supporting portion is located between the second crown portion and the substrate, and the orthographic projection of the second supporting portion on the substrate is located within the orthographic projection of the second crown portion on the substrate, the first supporting portion and the second supporting portion are in the same layer and made of the same material, and the first crown portion and the second crown portion are in the same layer and made of the same material.

29. A display panel having a display area and a non-display area, wherein: The display panel comprises: substrate; A plurality of light emitting devices are located on the substrate and in the display area; a dam, located on the substrate and in the non-display area, the dam comprising a top film layer away from the substrate; and A packaging structure, stacked on the dam and the light emitting device at a side away from the substrate; a protective layer, at least partially located in the non-display area, wherein the protective layer is located on a side of the packaging structure close to the substrate and overlaps with the top film layer; The encapsulation structure includes a first encapsulation layer and a second encapsulation layer stacked together, the first encapsulation layer is located on a side of the second encapsulation layer close to the substrate, and the second encapsulation layer is located in the display area and the non-display area and directly contacts the dam.

30. A method for preparing a display panel, comprising: Providing a substrate, and pre-dividing a display area and a non-display area of ​​the display panel on the substrate; forming a protective layer on the substrate, wherein at least a portion of the protective layer is formed in the non-display area; forming a light emitting device on the substrate, wherein the light emitting device is formed in the display area; as well as A first encapsulation layer and a second encapsulation layer covering the light emitting device are sequentially formed on a side of the light emitting device away from the substrate, wherein the second encapsulation layer is located in the display area and the non-display area, the protective layer is formed between the second encapsulation layer and the substrate, and in the non-display area, the second encapsulation layer is formed to be in direct contact with the protective layer.

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