Circumferential welding device and welding method for automatic transposition of semiconductor heating disc

Abstract

The invention discloses a circumference welding device and method for automatic transposition of a semiconductor heating disc, and relates to the field of welding equipment. According to the invention, the swing driving assembly drives the plurality of swing frames to swing in a reciprocating and staggered manner, and when the swing frames rotate and swing, the clamping driving assemblies at the two ends can drive the clamping jaws to clamp and fix the semiconductor heating disc and the connection reinforcing member, so that the swing frames drive the semiconductor heating disc and the connection reinforcing member to rotate synchronously; the semiconductor heating disc and the connection reinforcing piece which are conveyed in a rotating mode are subjected to circumferential welding through a welding gun; through cooperation of the reciprocating swing mechanism and the clamping mechanism, automatic transposition welding of the semiconductor heating disc and the connection reinforcing piece can be achieved, circumferential welding of the semiconductor heating disc and the connection reinforcing piece can be completed at a time, the circumferential welding efficiency of the semiconductor heating disc is improved, the welding gun is located outside the moving track of the clamping mechanism, and the welding efficiency is improved. When the clamping mechanism rotates and swings along with the swing frame, mutual interference between the clamping mechanism and the welding gun is avoided, and normal operation of the welding process is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the field of welding equipment, and in particular relates to a circumferential welding device and a welding method for automatically changing the position of a semiconductor heating plate. Background Art

[0002] Semiconductor heating plates utilize the unique properties of semiconductor materials to generate heating. Their core components are semiconductor materials, such as silicon or silicon carbide. These materials possess high thermal and electrical conductivity, effectively converting electrical energy into heat. During the manufacturing process, reinforcements are welded around the perimeter of the semiconductor heating plate to securely connect its components and enhance its robustness.

[0003] In the prior art, when performing circumferential welding on the semiconductor heating disk and the connecting reinforcement, it is necessary to use a clamping mechanism to clamp and fix the semiconductor heating disk and the connecting reinforcement together along the outer circumference. When the welding gun is welding along the circumferential direction of the semiconductor heating disk and the connecting reinforcement, it is impossible to weld the clamping position. Therefore, during the welding process, it is necessary to adjust the clamping position of the clamping mechanism on the semiconductor heating disk after completing a round of welding, and then continue welding the unwelded position, which makes the welding process more cumbersome and reduces the welding efficiency of the semiconductor heating disk. Summary of the Invention

[0004] In response to the problems in the related art, the present invention proposes a circumferential welding device and a welding method with automatic position change of a semiconductor heating plate to overcome the above-mentioned technical problems existing in the existing related art.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a circumferential welding device with automatic position change of a semiconductor heating plate, comprising a welding cabinet and a welding workbench installed inside the welding cabinet. A reciprocating swing mechanism is installed on the top surface of the welding workbench. The reciprocating swing mechanism includes a swing drive assembly and a plurality of swing frames. The centers of the plurality of swing frames are all located on the same axis. The swing drive assembly can drive the plurality of swing frames to swing back and forth in an interlaced manner. A clamping mechanism is fixedly installed at both ends of each swing frame. The clamping mechanism includes a support plate, a clamping claw, and a clamping drive assembly. The support plate is fixedly mounted above the end of the swing frame. The clamping claw is mounted on the inner side of the support plate through the clamping drive assembly. The clamping drive assembly can drive the clamping claw to close and clamp when the swing frame rotates and swings, and can drive the clamping claw to open and release the clamp when the swing frame rotates and swings in the opposite direction to reset. A welding gun is also fixedly mounted on the top surface of the welding workbench, and the welding gun is located outside the moving track of the clamping mechanism.

[0006] Furthermore, the swing drive assembly includes a motor, which is fixedly mounted on the top surface of the welding workbench. A connecting rod is transmission-mounted on the output end of the motor, and a slider is rotatably mounted on the top surface of one end of the connecting rod.

[0007] Furthermore, the swing drive assembly also includes a bracket, which is fixedly mounted on the top surface of the welding workbench and located on one side of the motor, a slide rail on one side of the upper end of the bracket, a slide bar slidably mounted on the bottom end of the slide rail, a rack fixedly mounted on the bottom end of the slide bar, a guide frame fixedly mounted perpendicular to the rack at the bottom end of the rack, a guide groove provided on the inner ring of the guide frame, and the slider is slidably clamped in the guide groove.

[0008] Furthermore, a rotating shaft is rotatably mounted on the upper end of the bracket, a gear meshing and transmission-connected with the rack is fixedly mounted on the bottom end of the rotating shaft, and the swing frame is fixedly mounted on the top end of the rotating shaft.

[0009] Furthermore, a driving bevel gear is fixedly installed on the lower end of the rotating shaft, a rotating sleeve is provided on the movable sleeve at the upper end of the rotating shaft, the rotating sleeve is rotatably connected to the bracket, the swing frame is fixedly installed on the top end of the rotating sleeve, and a driven bevel gear is fixedly installed on the bottom end of the rotating sleeve. A transmission bevel gear is also rotatably installed on the bracket, and the transmission bevel gear is meshed and connected between the driving bevel gear and the driven bevel gear.

[0010] Furthermore, the clamping drive assembly includes a cylinder and a clamping positioning seat, the cylinder is fixedly mounted on the top surface of the support plate, the clamping positioning seat is embedded in the inner end of the support plate, the upper and lower ends of the clamping positioning seat are slidably mounted with connecting rods, the outer end of the connecting rod is fixedly mounted with the clamping claw, and the inner end of the connecting rod is fixedly mounted with a guide column; A slide is slidably installed inside the clamping and positioning seat, and the slide is provided with inclined guide grooves symmetrically arranged up and down. The guide columns are slidably engaged in the corresponding inclined guide grooves, and the telescopic end of the cylinder extends to the interior of the clamping and positioning seat and is fixedly connected to one end of the slide.

[0011] Furthermore, the top of the welding workbench is fixedly installed with support rods distributed in a circle, the top of the support rods is fixedly installed with a support ring seat, the top surface of the support ring seat is provided with a slide groove, and the bottom surface of the outer end of the support plate is fixedly installed with a support block that is slidably mounted in the slide groove.

[0012] Furthermore, a limiting groove is provided on the top surface of the inner end of the support plate, and an arc-shaped limiting surface that matches the outer circumferential surface of the semiconductor heating plate is provided on the side wall of the limiting groove.

[0013] Furthermore, a plurality of supporting rollers are rotatably mounted on the bottom of the limiting groove.

[0014] The present invention also discloses a welding method, the specific steps of which are as follows: First, align and fit the semiconductor heating plate and the connecting reinforcement piece, then place them horizontally so that the semiconductor heating plate and the connecting reinforcement piece are located between the clamping jaws. Then, close the clamping jaws at both ends of one of the swing frames, so that the semiconductor heating plate and the connecting reinforcement piece are clamped and positioned by the two sets of clamping jaws. Then, the two swing frames are driven to swing back and forth alternately by the swing drive assembly. When the swing frame holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame drives the semiconductor heating plate and the connecting reinforcement to rotate through the clamping claws at both ends. At this time, the circumferential surface of the rotating semiconductor heating plate and the connecting reinforcement is welded by the welding gun. When the swing frame reaches the end position of the swing and starts to swing back, the clamping drive assembly on it drives the clamping claws to open and release the clamping of the semiconductor heating plate and the connecting reinforcement, while the clamping claws at both ends of the other swing frame close to continue clamping and positioning the semiconductor heating plate and the connecting reinforcement; Afterwards, the swing frame that is disconnected from the semiconductor heating disk and the connecting reinforcement rotates in the opposite direction and swings to reset, while the swing frame that is clamped and connected to the semiconductor heating disk and the connecting reinforcement starts to rotate and swing, and drives the semiconductor heating disk and the connecting reinforcement to continue to rotate and change position, so that the welding gun can continue to perform circular welding on the semiconductor heating disk and the connecting reinforcement.

[0015] The present invention has the following beneficial effects: When the swing frame is rotated and reset, the clamping drive assemblies at both ends drive the clamping claws to release the clamping of the semiconductor heating disk and the connecting reinforcement, thereby not causing the semiconductor heating disk and the connecting reinforcement to rotate in the opposite direction; thereby, the automatic position-changing welding of the semiconductor heating disk and the connecting reinforcement can be realized through the cooperation of the reciprocating swing mechanism and the clamping mechanism, and the circumferential welding of the semiconductor heating disk and the connecting reinforcement can be completed at one time, thereby improving the circumferential welding efficiency of the semiconductor heating disk, and the welding gun is located outside the moving track of the clamping mechanism, so that when the clamping mechanism rotates and swings with the swing frame, it will not interfere with the welding gun, thereby ensuring the normal progress of the welding process.

[0016] 2. In the present invention, a plurality of swing frames and corresponding clamping mechanisms are provided. When one of the swing frames rotates in the opposite direction to reset and the clamping mechanism on it loosens its clamping of the semiconductor heating disk, the clamping mechanism on the other swing frame synchronously clamps and fixes the semiconductor heating disk and drives the semiconductor heating disk to rotate and position. Through the cooperation of the plurality of swing frames and the clamping mechanism, the semiconductor heating disk is always in a clamping and positioning state during the transposition and transportation process, thereby improving the stability of the clamping and transportation of the semiconductor heating disk, and at the same time, the semiconductor heating disk can be continuously transported and welded without pause, which is beneficial to improving the welding efficiency of the semiconductor heating disk.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, they can also obtain drawings based on these drawings without paying any creative work.

[0019] Figure 1 This is one of the three-dimensional structural diagrams of the welding device of the present invention; Figure 2 This is the second schematic diagram of the three-dimensional structure of the welding device of the present invention; Figure 3 For the present invention Figure 2 A local enlarged structural diagram of point A; Figure 4 This is one of the three-dimensional structural schematic diagrams of the welding workbench of the present invention; Figure 5 For the present invention Figure 4 A schematic diagram of the partially enlarged structure at point B; Figure 6 For the present invention Figure 4 A schematic diagram of the partially enlarged structure at point C; Figure 7 This is the second schematic diagram of the three-dimensional structure of the welding workbench of the present invention; Figure 8 For the present invention Figure 7 A schematic diagram of the local enlarged structure at D; Figure 9 This is the third schematic diagram of the three-dimensional structure of the welding workbench of the present invention.

[0020] In the figure: 1. welding cabinet; 2. welding workbench; 3. reciprocating swing mechanism; 31. motor; 32. swing frame; 33. guide frame; 34. connecting rod; 35. slider; 36. guide groove; 37. driving bevel gear; 38. rotating shaft; 39. driven bevel gear; 310. rotating sleeve; 311. transmission bevel gear; 312. bracket; 313. slide rail; 314. slide bar; 315. rack; 316. gear; 4. clamping mechanism; 41. support plate; 42. clamping claw; 43. support rod; 44. supporting ring seat; 45. slide groove; 46. supporting block; 47. cylinder; 48. clamping positioning seat; 49. slide plate; 410. inclined guide groove; 411. guide column; 412. connecting rod; 413. limit groove; 414. supporting roller; 5. welding gun. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0022] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inside" and the like indicating orientation or positional relationship are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the invention.

[0023] Example 1 See also Figure 1-Figure 3 As shown, the present invention is a circumferential welding device with automatic position change of a semiconductor heating plate, comprising a welding cabinet 1 and a welding workbench 2 installed inside the welding cabinet 1, a reciprocating swing mechanism 3 is installed on the top surface of the welding workbench 2, the reciprocating swing mechanism 3 comprises a swing drive assembly and a plurality of swing frames 32, the centers of the plurality of swing frames 32 are all located on the same axis, the swing drive assembly can drive the plurality of swing frames 32 to swing back and forth in an interlaced manner, and a clamping mechanism 4 is fixedly installed at both ends of each swing frame 32; the clamping mechanism 4 comprises a support plate 41, a clamping claw 42 and a clamping drive assembly, the support plate 41 is fixedly installed above the end of the swing frame 32, the clamping claw 42 is installed on the inner side end of the support plate 41 through the clamping drive assembly, the clamping drive assembly can drive the clamping claw 42 to close and clamp when the swing frame 32 rotates and swings, and can drive the clamping claw 42 to open and release the clamping when the swing frame 32 rotates and swings back and forth; a welding gun 5 is also fixedly installed on the top surface of the welding workbench 2, and the welding gun 5 is located outside the moving track of the clamping mechanism 4; Among them, there are two swing frames 32. During welding, first, the semiconductor heating disk and the connecting reinforcement are aligned and fitted, and then placed horizontally, and the semiconductor heating disk and the connecting reinforcement are located between the clamps 42. Then, the clamps 42 at both ends of one of the swing frames 32 are closed, so that the semiconductor heating disk and the connecting reinforcement are clamped and positioned by the two sets of closed clamps 42; then the two swing frames 32 are driven to swing back and forth by the swing drive assembly. When the swing frame 32 holding the semiconductor heating disk and the connecting reinforcement swings, the swing frame 32 drives the semiconductor heating disk and the connecting reinforcement to rotate through the clamps 42 at both ends. At this time, the rotating semiconductor heating disk and the connecting reinforcement are rotated by the welding gun 5. The circumferential surface of the parts is welded; and when the swing frame 32 reaches the swing end position and starts to swing back and forth, the clamping drive assembly thereon drives the clamping jaws 42 to open and loosen the clamping of the semiconductor heating disk and the connecting reinforcement, while the clamping jaws 42 at both ends of the other swing frame 32 close and continue to clamp and position the semiconductor heating disk and the connecting reinforcement; thereafter, the swing frame 32 disconnected from the semiconductor heating disk and the connecting reinforcement rotates and swings in the opposite direction to reset, while the swing frame 32 clamped and connected to the semiconductor heating disk and the connecting reinforcement starts to rotate and swing, and drives the semiconductor heating disk and the connecting reinforcement to continue to rotate and transpose, so that the welding gun 5 can continue to perform circumferential welding on the semiconductor heating disk and the connecting reinforcement; Through the cooperation of the reciprocating swing mechanism 3 and the clamping mechanism 4, the automatic position change welding of the semiconductor heating disk and the connecting reinforcement can be realized, and the circumferential welding of the semiconductor heating disk and the connecting reinforcement can be completed at one time, thereby improving the circumferential welding efficiency of the semiconductor heating disk, and the welding gun 5 is located outside the moving track of the clamping mechanism 4, so that when the clamping mechanism 4 rotates and swings with the swing frame 32, it will not interfere with the welding gun 5, thereby ensuring the normal progress of the welding process; through the cooperation of the two swing frames 32 and the clamping mechanism 4, the semiconductor heating disk is always in a clamping and positioning state during the position change conveying process, thereby improving the stability of the semiconductor heating disk clamping and conveying, and at the same time, the semiconductor heating disk can be continuously conveyed and welded without pause, further improving the welding efficiency of the semiconductor heating disk.

[0024] Example 2 See also Figure 1-Figure 4 、 Figure 6-Figure 9As shown, the difference between this embodiment and the above embodiment is that the swing drive assembly includes a motor 31, which is fixedly mounted on the top surface of the welding workbench 2, and the output end of the motor 31 is driven by a connecting rod 34, and the top surface of one end of the connecting rod 34 is rotatably mounted with a slider 35; the swing drive assembly also includes a bracket 312, which is fixedly mounted on the top surface of the welding workbench 2 and is located on one side of the motor 31, and a slide rail 313 is provided on one side of the upper end of the bracket 312, and the bottom end of the slide rail 313 is provided on the other side of the upper end of the bracket 312. A slide bar 314 is slidably mounted, a rack 315 is fixedly mounted on the bottom end of the slide bar 314, a guide frame 33 perpendicular to the rack 315 is fixedly mounted on the bottom end of the rack 315, a guide groove 36 is provided on the inner ring of the guide frame 33, and the slide bar 35 is slidably mounted in the guide groove 36; a rotating shaft 38 is also rotatably mounted on the upper end of the bracket 312, a gear 316 meshing and transmission-connected with the rack 315 is fixedly mounted on the bottom end of the rotating shaft 38, and a swing frame 32 is fixedly mounted on the top end of the rotating shaft 38; When the motor 31 is working, the slider 35 is driven to make a circular motion through the connecting rod 34, and the slider 35 cooperates with the guide groove 36 to drive the guide frame 33 to move back and forth left and right when making a circular motion. At the same time, the guide frame 33 drives the rack 315 to move back and forth left and right, and the rack 315 engages the driving gear 316 to rotate back and forth when it moves back and forth, so that the gear 316 drives the rotating shaft 38 to rotate back and forth, and the rotating shaft 38 drives the swinging frame 32 at the top to swing back and forth when it rotates back and forth, so that the swinging frame 32 can transport and replace the semiconductor heating plate through the cooperation of the clamping mechanism 4 during the reciprocating swing process.

[0025] Furthermore, a driving bevel gear 37 is fixedly mounted on the lower end of the rotating shaft 38, and a rotating sleeve 310 is movably mounted on the upper end of the rotating shaft 38. The rotating sleeve 310 is rotatably connected to the bracket 312. The top of the rotating sleeve 310 is fixedly mounted with a swing frame 32, and the bottom end of the rotating sleeve 310 is fixedly mounted with a driven bevel gear 39. A transmission bevel gear 311 is also rotatably mounted on the bracket 312. The transmission bevel gear 311 is meshed and transmission-connected between the driving bevel gear 37 and the driven bevel gear 39. Among them, the rotating shaft 38 moves through the driven bevel gear 39 and the rotating sleeve 310, so that there is no interference between the rotating shaft 38 and the rotating sleeve 310. When the rotating shaft 38 rotates and drives the swing frame 32 at its top to rotate and swing, the rotating shaft 38 drives the active bevel gear 37 to rotate synchronously. At this time, the active bevel gear 37 drives the driven bevel gear 39 to rotate in the opposite direction through the meshing transmission of the transmission bevel gear 311, thereby causing the rotating sleeve 310 to rotate in the opposite direction relative to the rotating shaft 38, and then causing the rotating sleeve 310 to drive the swing frame 32 at its top to rotate in the opposite direction with the swing frame 32 at the top of the rotating shaft 38. Therefore, the two swing frames 32 rotating in opposite directions cooperate with the clamping mechanism 4 to continuously drive the semiconductor heating disk to be transported and replaced.

[0026] Example 3 See also Figure 1-Figure 5As shown, the difference between this embodiment and the above embodiment is that the clamping drive assembly includes a cylinder 47 and a clamping positioning seat 48, the cylinder 47 is fixedly mounted on the top surface of the support plate 41, the clamping positioning seat 48 is embedded in the inner end of the support plate 41, and the upper and lower ends of the clamping positioning seat 48 are slidably clamped with a connecting rod 412, the outer end of the connecting rod 412 is fixedly mounted with a clamping claw 42, and the inner end of the connecting rod 412 is fixedly mounted with a guide column 411; a slide plate 49 is slidably mounted inside the clamping positioning seat 48, and the slide plate 49 is provided with inclined guide grooves 410 symmetrically arranged in the upper and lower directions, and the guide columns 411 are all slidably clamped inside the corresponding inclined guide grooves 410, and the telescopic end of the cylinder 47 extends to the interior of the clamping positioning seat 48 and is fixedly connected to one end of the slide plate 49; When it is necessary to clamp the semiconductor heating plate, the cylinder 47 extends and pushes the slide 49 inward. At this time, the slide 49 guides the two sets of guide columns 411 at the upper and lower ends to close through the inclined guide grooves 410 symmetrically distributed above and below. At the same time, the guide columns 411 drive the two clamping claws 42 at the upper and lower ends to move and close through the connecting rod 412. Correspondingly, when it is necessary to relax the clamping of the semiconductor heating plate, the cylinder 47 contracts and pulls the slide 49 outward. At this time, the slide 49 guides the two sets of guide columns 411 at the upper and lower ends to open through the inclined guide grooves 410 symmetrically distributed above and below. At the same time, the guide columns 411 drive the two clamping claws 42 at the upper and lower ends to move and open through the connecting rod 412.

[0027] Furthermore, the top of the welding workbench 2 is fixedly mounted with support rods 43 distributed in a circumference, the top of the support rods 43 is fixedly mounted with a support ring seat 44, the top surface of the support ring seat 44 is provided with a slide groove 45, and the bottom surface of the outer end of the support plate 41 is fixedly mounted with a support block 46 that is slidably mounted in the slide groove 45; The support plate 41 is auxiliary supported by the support rod 43, the support ring seat 44 and the support block 46, which can improve the stability of the support plate 41 when it rotates and moves with the swing frame 32, thereby improving the stability of the semiconductor heating disk's replacement and transportation, which is beneficial to improving the welding accuracy of the semiconductor heating disk.

[0028] Furthermore, a limiting groove 413 is provided on the top surface of the inner end of the support plate 41, and an arc-shaped limiting surface is provided on the side wall of the limiting groove 413, which matches the outer circumferential surface of the semiconductor heating disk. When the semiconductor heating disk is welded, the outer circumference of the semiconductor heating disk can be slid and clamped in the limiting groove 413, and at the same time, the outer circumferential surface of the semiconductor heating disk slides and fits tightly against the arc-shaped limiting surface, thereby not only providing auxiliary support to the semiconductor heating disk through the limiting groove 413, improving the stability of the semiconductor heating disk during transposition and transportation, but also limiting and centering the semiconductor heating disk, improving the positioning accuracy of the semiconductor heating disk, and thereby improving the welding accuracy of the semiconductor heating disk.

[0029] Furthermore, a plurality of support rollers 414 are rotatably mounted on the bottom of the limiting groove 413, and the support rollers 414 provide rolling support to the bottom surface of the semiconductor heating disk, thereby reducing the friction resistance during the replacement and transportation of the semiconductor heating disk, making the replacement and transportation of the semiconductor heating disk more labor-saving.

[0030] Example 4 This embodiment discloses a circumferential welding method for automatically changing the position of a semiconductor heating plate, and the specific steps are as follows: First, align and fit the semiconductor heating plate and the connecting reinforcement member, then place them horizontally so that the semiconductor heating plate and the connecting reinforcement member are located between the clamping jaws 42. Then, close the clamping jaws 42 at both ends of one of the swing frames 32, so that the semiconductor heating plate and the connecting reinforcement member are clamped and positioned by the two sets of clamping jaws 42. Then, the two swing frames 32 are driven to swing back and forth alternately by the swing drive assembly. When the swing frames 32 holding the semiconductor heating disk and the connecting reinforcement swing, the swing frames 32 drive the semiconductor heating disk and the connecting reinforcement to rotate through the clamping claws 42 at both ends. At this time, the welding gun 5 is used to weld the circumferential surface of the rotating semiconductor heating disk and the connecting reinforcement. When the swing frame 32 reaches the end position of the swing and starts to swing back, the clamping drive assembly drives the clamping claws 42 on it to open and release the clamping of the semiconductor heating plate and the connecting reinforcement. At the same time, the clamping claws 42 at both ends of the other swing frame 32 close and continue to clamp and position the semiconductor heating plate and the connecting reinforcement. Afterwards, the swing frame 32 that is disconnected from the semiconductor heating disk and the connecting reinforcement rotates in the opposite direction and swings back to reset, while the swing frame 32 that is clamped and connected to the semiconductor heating disk and the connecting reinforcement starts to rotate and swing, and drives the semiconductor heating disk and the connecting reinforcement to continue to rotate and change position, so that the welding gun 5 can continue to perform circumferential welding on the semiconductor heating disk and the connecting reinforcement.

[0031] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0032] The preferred embodiments of the invention disclosed above are intended only to help illustrate the invention. These preferred embodiments do not exhaust all details, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention.

Claims

1. A circumferential welding device with automatic transposition of a semiconductor heating plate, comprising a welding cabinet and a welding workbench installed inside the welding cabinet, characterized in that: The top surface of the welding workbench is equipped with a reciprocating swing mechanism, which includes a swing drive assembly and a plurality of swing frames. The centers of the plurality of swing frames are located on the same axis. The swing drive assembly can drive the plurality of swing frames to swing back and forth in an interlaced manner. A clamping mechanism is fixedly installed at both ends of each swing frame. The clamping mechanism includes a support plate, a clamping claw, and a clamping drive assembly. The support plate is fixedly mounted above the end of the swing frame. The clamping claw is mounted on the inner side of the support plate through the clamping drive assembly. The clamping drive assembly can drive the clamping claw to close and clamp when the swing frame rotates and swings, and can drive the clamping claw to open and release the clamp when the swing frame rotates and swings in the opposite direction to reset. A welding gun is also fixedly mounted on the top surface of the welding workbench, and the welding gun is located outside the moving track of the clamping mechanism.

2. A circumferential welding device with automatic position change of a semiconductor heating plate according to claim 1, characterized in that: The swing drive assembly includes a motor, which is fixedly installed on the top surface of the welding workbench. A connecting rod is installed on the output end of the motor, and a slider is rotatably installed on the top surface of one end of the connecting rod.

3. A circumferential welding device with automatic position change of a semiconductor heating plate according to claim 2, characterized in that: The swing drive assembly also includes a bracket, which is fixedly mounted on the top surface of the welding workbench and located on one side of the motor, a slide rail on one side of the upper end of the bracket, a slide bar slidably mounted on the bottom end of the slide rail, a rack fixedly mounted on the bottom end of the slide bar, a guide frame fixedly mounted perpendicular to the rack on the bottom end of the rack, a guide groove provided on the inner ring of the guide frame, and the slider slidably clamped in the guide groove.

4. A circumferential welding device with automatic position change of a semiconductor heating plate according to claim 3, characterized in that: A rotating shaft is rotatably mounted on the upper end of the bracket, a gear meshing with a rack is fixedly mounted on the bottom end of the rotating shaft, and the swing frame is fixedly mounted on the top end of the rotating shaft.

5. A circumferential welding device with automatic position change of a semiconductor heating plate according to claim 4, characterized in that: The lower end of the rotating shaft is fixedly mounted with a driving bevel gear, the upper end of the rotating shaft is movablely sleeved with a rotating sleeve, the rotating sleeve is rotatably connected to the bracket, the top of the rotating sleeve is fixedly mounted with the swing frame, the bottom end of the rotating sleeve is fixedly mounted with a driven bevel gear, and the bracket is also rotatably mounted with a transmission bevel gear, and the transmission bevel gear is meshed and transmission-connected between the driving bevel gear and the driven bevel gear.

6. The circumferential welding device with automatic position change of a semiconductor heating plate according to claim 1, characterized in that: The clamping drive assembly includes a cylinder and a clamping positioning seat, the cylinder is fixedly mounted on the top surface of the support plate, the clamping positioning seat is embedded in the inner end of the support plate, the upper and lower ends of the clamping positioning seat are slidably mounted with connecting rods, the outer end of the connecting rod is fixedly mounted with the clamping claw, and the inner end of the connecting rod is fixedly mounted with a guide column; A slide is slidably installed inside the clamping and positioning seat, and the slide is provided with inclined guide grooves symmetrically arranged up and down. The guide columns are slidably engaged in the corresponding inclined guide grooves, and the telescopic end of the cylinder extends to the interior of the clamping and positioning seat and is fixedly connected to one end of the slide.

7. The circumferential welding device with automatic position change of a semiconductor heating plate according to claim 1, characterized in that: The top of the welding workbench is fixedly installed with support rods distributed in a circle, the top of the support rods is fixedly installed with a support ring seat, the top surface of the support ring seat is provided with a slide groove, and the bottom surface of the outer end of the support plate is fixedly installed with a support block that is slidably mounted in the slide groove.

8. The circumferential welding device with automatic position change of a semiconductor heating plate according to claim 1, characterized in that: A limiting groove is provided on the top surface of the inner end of the support plate, and an arc-shaped limiting surface that matches the outer circumferential surface of the semiconductor heating disk is provided on the side wall of the limiting groove.

9. A circumferential welding device with automatic position change of a semiconductor heating plate according to claim 8, characterized in that: A plurality of supporting rollers are rotatably mounted on the bottom of the limiting groove.

10. A welding method using the circumferential welding device with automatic position change of the semiconductor heating plate according to any one of claims 1 to 9, characterized in that: The specific steps are as follows: First, align and fit the semiconductor heating plate and the connecting reinforcement piece, then place them horizontally so that the semiconductor heating plate and the connecting reinforcement piece are located between the clamping jaws. Then, close the clamping jaws at both ends of one of the swing frames, so that the semiconductor heating plate and the connecting reinforcement piece are clamped and positioned by the two sets of clamping jaws. Then, the two swing frames are driven to swing back and forth alternately by the swing drive assembly. When the swing frame holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame drives the semiconductor heating plate and the connecting reinforcement to rotate through the clamping claws at both ends. At this time, the circumferential surface of the rotating semiconductor heating plate and the connecting reinforcement is welded by the welding gun. When the swing frame reaches the end position of the swing and starts to swing back, the clamping drive assembly on it drives the clamping claws to open and release the clamping of the semiconductor heating plate and the connecting reinforcement, while the clamping claws at both ends of the other swing frame close to continue clamping and positioning the semiconductor heating plate and the connecting reinforcement; Afterwards, the swing frame that is disconnected from the semiconductor heating disk and the connecting reinforcement rotates in the opposite direction and swings to reset, while the swing frame that is clamped and connected to the semiconductor heating disk and the connecting reinforcement starts to rotate and swing, and drives the semiconductor heating disk and the connecting reinforcement to continue to rotate and change position, so that the welding gun can continue to perform circular welding on the semiconductor heating disk and the connecting reinforcement.

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