Guide wheel accurate grinding method of wire cutting machine and accurate grinding wheel mounting device

Abstract

The invention discloses a guide wheel accurate grinding method of a wire cutting machine and an accurate grinding wheel mounting device. The guide wheel accurate grinding method of the wire cutting machine comprises the steps that 1, a waste diamond wire is wound around a guide wheel to be subjected to accurate grinding on the wire cutting machine, and the waste diamond wire has preset tension; 2, a fine grinding wheel is rotationally installed on a workbench of the wire cutting machine, the axial direction of the fine grinding wheel is parallel to the axial direction of the guide wheel to be finely ground, and the length of the fine grinding wheel at least covers the waste diamond wire on the guide wheel to be finely ground; and 3, the workbench descends to drive the accurate grinding wheel to move downwards so as to press the waste diamond wire, the guide wheel to be accurately ground is rotated so as to drive the waste diamond wire to rotate on the guide wheel to be accurately ground, and accurate grinding of the guide wheel to be accurately ground is achieved. According to the method, the time consumed for grinding the wire groove of the guide wheel is greatly shortened, the friction effect of the wire groove of the guide wheel and the accurate grinding efficiency of the guide wheel are improved, and the wire cutting quality of the first several silicon rods is improved; and meanwhile, the cost loss of the diamond wire is reduced through reutilization of waste resources.

Description

Technical Field

[0001] The invention relates to a guide wheel fine grinding method of a wire cutting machine and a fine grinding wheel mounting device. Background Art

[0002] The wire cutting machine is a device that cuts silicon rods into silicon wafers through the high-speed reciprocating motion of the diamond wire wrapped around the guide wheel. After the wire cutting machine replaces the new guide wheel, the wire groove of the new guide wheel is not smooth and has burrs. As a result, during the wire cutting process of the first few silicon rods, the diamond wire becomes unstable and jumps in the wire groove. This not only causes the wire marks of the silicon wafer to exceed the standard, but also increases friction, resulting in chipping and cracking of the silicon wafer edge.

[0003] A common solution currently employed is to allow the diamond wire to idle for a period of time after replacing a new guide wheel on the wire saw to rub the guide wheel's grooves before proceeding with wire sawing of the silicon ingots. This method is not only time-consuming, but also ineffective in terms of friction between the guide wheel's grooves, which can still lead to excessive wafer line marks or chipping on the first few silicon ingots cut. Summary of the Invention

[0004] In view of this, an embodiment of the present invention provides a guide wheel fine grinding method and a fine grinding wheel installation device for a wire cutting machine, which solves the problem that after the wire cutting machine replaces the new guide wheel, it takes a long time to grind the guide wheel wire groove, and the problem of poor wire cutting effect caused by the instability of the diamond wire in the wire groove, improves the wire groove friction effect of the guide wheel and the guide wheel fine grinding efficiency, thereby improving the wire cutting quality of the first few silicon rods. At the same time, waste diamond wire is used to grind the guide wheel wire groove, and the cost loss of diamond wire is reduced by recycling waste resources.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention provides a method for fine grinding a guide wheel of a wire cutting machine, comprising: Step 1: Winding a waste diamond wire on a guide wheel to be finely ground on a wire cutting machine, wherein the waste diamond wire has a predetermined tension; Step 2: rotatably mounting a fine grinding wheel on a workbench of the wire cutting machine, wherein the axial direction of the fine grinding wheel is parallel to the axial direction of the guide wheel to be finely ground, and the length of the fine grinding wheel at least covers the waste diamond wire on the guide wheel to be finely ground; Step 3: lower the workbench to drive the fine grinding wheel to move downward to compress the waste diamond wire, rotate the guide wheel to be fine-ground to drive the waste diamond wire to rotate on the guide wheel to be fine-ground, and realize fine grinding of the guide wheel to be fine-ground.

[0007] Optionally, in step 3, lowering the workbench to drive the fine grinding wheel to move downward to compress the waste diamond wire, and rotating the guide wheel to be finely ground to drive the waste diamond wire to rotate on the guide wheel to be finely ground, comprising: Step 3.0: Continuously lowering the workbench from a predetermined position at a predetermined descending speed; Step 3.1: When the workbench descends from a predetermined position to a first distance, rotating the guide wheel to be fine-ground according to a first predetermined program; Step 3.2: rotating the guide wheel to be fine-ground according to a second predetermined program while the workbench is descending from the first distance to the second distance; … Step 3.n: During the process of the workbench descending from the n-1th distance to the nth distance, the guide wheel to be fine-ground is rotated according to the nth predetermined program.

[0008] Optionally, the nth distance is 18 mm-21 mm, and the difference between the ith distance and the (i-1)th distance is greater than or equal to 1 mm and less than or equal to 3 mm, wherein 2≤i≤n.

[0009] Optionally, rotating the guide wheel to be fine-ground according to a first predetermined program includes: first rotating the guide wheel to be fine-ground at a first speed in a first direction for a first wire supply amount and then rotating the guide wheel to be fine-ground at the first speed for a first return amount as a first cycle, and repeating the first number of the first cycle; rotating the guide wheel to be fine-ground according to a second predetermined program includes: first rotating the guide wheel to be fine-ground at a second speed in the first direction for a second wire supply amount and then rotating the guide wheel to be fine-ground at the second speed for a second return amount as a second cycle, and repeating the second number of the second cycle; ...; rotating the guide wheel to be fine-ground according to an nth predetermined program includes: first rotating the guide wheel to be fine-ground at an nth speed in the first direction for an nth wire supply amount and then rotating the guide wheel to be fine-ground at an nth speed for an nth return amount as an nth cycle, and repeating the nth number of the nth cycle, wherein the first direction is opposite to the second direction, and the time of the first cycle, the second cycle, ..., the nth cycle are equal.

[0010] Optionally, the first speed, the second speed, ..., the nth speed are greater than or equal to 250 m / min and less than or equal to 2500 m / min, and the jth speed ≥ j-1th speed, wherein 2≤j≤n.

[0011] Optionally, the first supply line quantity, the second supply line quantity, ..., the nth supply line quantity are greater than or equal to 250m and less than or equal to 1000m, and the jth supply line quantity ≥ the j-1th supply line quantity, wherein 2≤j≤n; the first loop line quantity, the second loop line quantity, ..., the nth loop line quantity are greater than or equal to 250m and less than or equal to 1000m, and the jth loop line quantity ≥ the j-1th loop line quantity, wherein 2≤j≤n; the kth supply line quantity > the kth loop line quantity, wherein 1≤k≤n.

[0012] Optionally, the predetermined tension of the waste diamond wire is 3N-3.4N, and the predetermined descending speed is 180 μm / cycle-220 μm / cycle.

[0013] In the second aspect, an embodiment of the present invention provides a fine grinding wheel mounting device for mounting a fine grinding wheel on a workbench of a wire cutting machine to implement the guide wheel fine grinding method provided in the first aspect of the embodiment of the present invention. The fine grinding wheel mounting device comprises: a base, a mounting portion and a loading table, wherein the loading table is arranged on one side of the base for connecting to the workbench of the wire cutting machine, and the mounting portion is arranged at both ends of the other side of the base, and both ends of the fine grinding wheel are rotatably connected to the mounting portion.

[0014] Optionally, the mounting portion is a bearing box located at both ends of the base.

[0015] Optionally, an airtight structure is provided on the bearing box, and is mounted on a side of the bearing box opposite to the fine grinding wheel via fixing bolts.

[0016] The technical solution of the first aspect of the above invention has the following advantages or beneficial effects: The fine grinding wheel is wound around the guide wheel to be fine-ground of the wire cutting machine, the fine grinding wheel is installed by rotating on the workbench, and then the workbench is lowered to drive the fine grinding wheel to move downward to compress the fine diamond wire, and the guide wheel to be fine-ground is rotated to drive the fine diamond wire to rotate on the guide wheel to be fine-ground to achieve fine grinding of the guide wheel to be fine-ground. The fine grinding wheel and the fine grinding wheel can be used to grind the wire groove of the guide wheel of the wire cutting machine. Compared with using the diamond wire to idle for a long time to grind the wire groove of the guide wheel, the time spent on grinding the wire groove of the guide wheel is greatly reduced, and the reactive cutting time of the wire cutting machine is effectively reduced, thereby solving the problem of taking a long time to grind the wire groove of the guide wheel after replacing a new guide wheel, improving the wire groove friction effect and the guide wheel fine grinding efficiency, thereby improving the wire cutting quality of the first few silicon rods; at the same time, using the waste diamond wire to grind the wire groove of the guide wheel reduces the cost loss of the diamond wire by recycling waste resources.

[0017] The further effects of the above-mentioned non-conventional optional manner will be described below in conjunction with specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flow chart of a method for fine grinding a guide wheel of a wire cutting machine according to an embodiment of the present invention; Figure 2 is a schematic diagram of installing a fine grinding wheel on a wire saw to perform fine grinding of a guide wheel according to an embodiment of the present invention; Figure 3 2 is a schematic structural diagram of a fine grinding wheel mounting device according to an embodiment of the present invention.

[0019] The reference numerals are as follows: 1-loading platform; 2-base; 3-installation part; 4-airtight structure; 5-fixing bolt; 6-fine grinding wheel; 7-guide wheel to be fine-ground; 8-diamond wire; 9-workbench; 10-fine grinding wheel installation device. DETAILED DESCRIPTION

[0020] The following description of exemplary embodiments of the present invention is made in conjunction with the accompanying drawings, in which various details of the embodiments of the present invention are included to facilitate understanding. These details should be considered as merely exemplary. Therefore, it should be appreciated by those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0021] In order to solve at least one technical problem existing in the prior art, the present invention provides a guide wheel fine grinding method for a wire cutting machine, which comprises winding waste diamond wire on the guide wheel to be fine-ground of the wire cutting machine, rotating and installing the fine grinding wheel on a workbench, then lowering the workbench to drive the fine grinding wheel to move downward to press the waste diamond wire, rotating the guide wheel to be fine-ground to drive the waste diamond wire to rotate on the guide wheel to be fine-ground to achieve fine grinding of the guide wheel to be fine-ground, and the fine grinding wheel and the waste diamond wire can be used to grind the wire groove of the guide wheel of the wire cutting machine. Compared with using the diamond wire to idle for a long time to grind the wire groove of the guide wheel, the time consumed for grinding the wire groove of the guide wheel is greatly reduced, and the reactive cutting time of the wire cutting machine is effectively reduced, thereby solving the problem of requiring a long time to grind the wire groove of the guide wheel after replacing a new guide wheel, improving the wire groove friction effect and the guide wheel fine grinding efficiency, and thereby improving the wire cutting quality of the first few silicon rods; at the same time, using the waste diamond wire to grind the wire groove of the guide wheel reduces the cost loss of the diamond wire by recycling waste resources.

[0022] Specifically, after the wire cutting machine of the present invention replaces a new guide wheel, it is necessary to fine-grind the wire grooves of the new guide wheel. Before wire cutting the silicon rod, a waste diamond wire is wound around the guide wheel to be fine-ground. A loading platform is plugged into the workbench of the wire cutting machine. A fine-grinding wheel that can rotate relative to the workbench is installed below the loading platform. The fine-grinding wheel is driven by the workbench to descend and press the diamond wire, so that the diamond wire is tensioned, increasing the friction between the diamond wire and the wire grooves of the guide wheel to be fine-ground. The diamond wire rotates as the guide wheel to be fine-ground rotates to grind the wire grooves on the guide wheel to be fine-ground on the wire cutting machine. The fine-grinding wheel can improve the grinding effect of the wire grooves of the guide wheel to be fine-ground, avoid the generation of jump lines during wire cutting of the first few silicon rods, and other cutting quality problems such as excessive silicon wafer line marks or broken edges, thereby improving the wire cutting quality of the silicon rods.

[0023] The specific implementation process of the present invention is described below with reference to the accompanying drawings.

[0024] Figure 1 FIG. 1 is a flow chart of a method for fine grinding a guide wheel of a wire cutting machine according to an embodiment of the present invention. Figure 1 As shown, a method for fine grinding the guide wheel of a wire cutting machine is shown when a new guide wheel is replaced and the groove of the guide wheel to be fine-ground needs to be ground. The fine grinding method for the guide wheel of a wire cutting machine according to an embodiment of the present invention mainly includes the following steps S101 to S103.

[0025] Step S101: Used diamond wire 8 is wound around the guide wheel 7 to be fine-ground on the wire saw. Used diamond wire 8 has a predetermined tension. During fine-grinding of the guide wheel, using new diamond wire to grind the grooves of the guide wheel would consume the diamonds on the new wire, shortening its service life. To address this issue, the present invention utilizes used diamond wire to grind the grooves of the guide wheel, thereby reusing waste resources and saving diamond wire costs.

[0026] Step S102: Rotate and install the fine grinding wheel 6 on the workbench 9 of the wire cutting machine, wherein the axial direction of the fine grinding wheel 6 is parallel to the axial direction of the guide wheel 7 to be fine-ground, and the length of the fine grinding wheel 6 at least covers the waste diamond wire 8 on the guide wheel 7 to be fine-ground. Figure 3 The fine grinding wheel mounting device 10 shown is used to rotatably mount the fine grinding wheel 6 on the workbench 9 of the wire cutting machine. In addition, the fine grinding wheel 6 is mounted on the wire cutting machine for fine grinding of the guide wheel as shown in FIG. Figure 2 As shown in .

[0027] Among them, the axial direction of the fine grinding wheel 6 is parallel to the axial direction of the guide wheel 7 to be fine-ground of the wire cutting machine, and the length of the fine grinding wheel 6 is at least equal to the length of the guide wheel 7 to be fine-ground, so that the fine grinding wheel 6 can completely cover the diamond wire 8 on the guide wheel 7 to be fine-ground in the axial direction. In this way, problems such as diamond wire jumping or tilting in the guide wheel to be fine-ground can be avoided, and the guide wheel groove grinding can be better performed.

[0028] Figure 2 Schematic diagram of installing a fine grinding wheel on a wire saw to perform fine grinding of a guide wheel according to an embodiment of the present invention. Figure 3 2 is a schematic structural diagram of a fine grinding wheel mounting device according to an embodiment of the present invention.

[0029] like Figure 2 As shown, the present invention rotatably mounts the fine grinding wheel 6 on the workbench 9 through the fine grinding wheel mounting device 10, and the axial direction of the fine grinding wheel 6 is parallel to the axial direction of the guide wheel to be finely ground 7 of the wire cutting machine.

[0030] like Figure 3 As shown, the fine grinding wheel mounting device 10 for mounting the fine grinding wheel 6 on the workbench 9 of the wire cutting machine according to the embodiment of the present invention mainly comprises a base 2, a mounting portion 3 and a loading platform 1; wherein the loading platform 1 is arranged on one side of the base 2 for connecting with the workbench 9 of the wire cutting machine, and the mounting portion 3 is arranged at both ends of the other side of the base 2, and both ends of the fine grinding wheel 6 are rotatably connected to the mounting portion 3. Figure 1 The main structure of the wire EDM is not shown. Only the loading platform 1 connected to the workbench 9 of the wire EDM is shown to illustrate how the fine grinding wheel mounting device 10 is used in the wire EDM for fine grinding of the guide wheel. Here, one side of the base 2 is, for example, the upper side of the base 2, and the other side of the base 2 is, for example, the lower side of the base 2.

[0031] According to one embodiment of the present invention, when the base 2 is installed under the loading platform 1, it can be achieved by, for example, gluing, screwing, riveting, etc. The present invention does not specifically limit the specific installation method.

[0032] According to one embodiment of the present invention, the mounting portion 3 is a bearing housing located at both ends of the base 2; and the two axial ends of the fine grinding wheel 6 are connected to the bearing housing. Specifically, the mounting portion 3 can be a bearing housing, through which the fine grinding wheel 6 is mounted so that the fine grinding wheel 6 can rotate.

[0033] According to one embodiment of the present invention, multiple sets of screw holes are provided on both sides of the lower end of the base 2 for securing the bearing housing. This allows the bearing housing to be fixed to both ends of the base 2 using bolts. Furthermore, by providing multiple sets of screw holes and selecting a set that matches the length of the fine grinding wheel 6 for securing the bearing housing, the bearing housing can be adapted to fine grinding wheels of varying lengths, providing a wider range of applications and improved integration.

[0034] According to another embodiment of the present invention, an airtight structure 4 is provided on the bearing housing and is mounted on the side of the bearing housing opposite the fine grinding wheel 6 via fixing bolts 5. Because water is used to cool the guide wheel 7 to be fine-ground during fine grinding to reduce the temperature generated by friction, and contaminants such as water entering the bearing housing can affect the performance and service life of the bearing, an airtight structure 4 is provided on the bearing housing. This airtight structure 4 is used for pneumatic sealing. By providing an annular groove structure on the bearing housing, compressed air enters the groove to form a uniform pressure field, and the air pressure difference is used to effectively block the gap between the rotating shaft and the housing, thereby preventing dust and contaminants from entering the bearing housing, thereby ensuring the performance and service life of the bearing.

[0035] According to the technical solution of the present invention, the fine grinding wheel is installed on the workbench of the wire cutting machine through the fine grinding wheel installation device, and the rotatable installation of the fine grinding wheel on the workbench is realized, so that the guide wheel groove can be ground by the fine grinding wheel. Compared with the long-term idling of the diamond wire to grind the wire wheel groove, the time spent on grinding the guide wheel groove is greatly reduced, and the reactive cutting time of the wire cutting machine is effectively reduced, thereby solving the problem of taking a long time to grind the guide wheel groove after replacing a new guide wheel, and improving the efficiency of the guide wheel groove grinding.

[0036] Step S103: lowering the workbench 9 to drive the fine grinding wheel 6 to move downward to compress the waste diamond wire 8, rotating the guide wheel 7 to be fine-ground to drive the waste diamond wire 8 to rotate on the guide wheel 7 to achieve fine grinding of the guide wheel 7 to be fine-ground.

[0037] After the fine grinding wheel 6 is mounted on the workbench 9 of the wire cutting machine using the fine grinding wheel mounting device 10, the workbench 9 is lowered to drive the fine grinding wheel 6 downward to compress the waste diamond wire 8. Then, the wire cutting machine is started, and the guide wheel 7 to be fine-ground is rotated to drive the waste diamond wire 8 to rotate. The fine grinding wheel 6 is driven by the workbench 9 to move downward and gradually compress the diamond wire 8, thereby gradually increasing the friction between the diamond wire 8 and the wire groove of the guide wheel 7 to be fine-ground, thereby grinding the wire groove of the guide wheel 7 to be fine-ground.

[0038] like Figure 2As shown, when using a fine grinding wheel 6 to fine-grind the guide wheel of a wire cutting machine, the fine grinding wheel 6 is placed on the diamond wire 8 between two guide wheels 7 to be fine-grinded via a workbench 9. The fine grinding wheel 6 is then driven down by the workbench 9 to compress the diamond wire 8, tightening the diamond wire 8 and increasing the friction between the diamond wire 8 and the wire grooves of the guide wheels 7 to be fine-grinded. Then, the wire cutting machine is operated, rotating the guide wheels 7 to be fine-grinded to drive the diamond wire 8 to rotate, so that the diamond wire 8 grinds the wire grooves of the guide wheels 7 to be fine-grinded on the wire cutting machine through rotation, thereby grinding the guide wheels of the wire cutting machine, improving the grinding effect and efficiency of the guide wheels of the wire cutting machine, solving the cutting quality problems such as excessive silicon wafer line marks or broken edges caused by wire jumps during wire cutting of the first few silicon ingots, and improving the wire cutting quality of the silicon ingots.

[0039] According to one embodiment of the present invention, in step S103, the lowering workbench 9 drives the fine grinding wheel 6 to move downward to compress the waste diamond wire 8, and the guide wheel 7 to be fine-ground is rotated to drive the waste diamond wire 8 to rotate on the guide wheel 7 to be fine-ground. Specifically, the following steps may be performed: Step S103.0: Continuously lowering the workbench 9 from a predetermined position at a predetermined descending speed; Step S103.1: When the workbench 9 descends from the predetermined position to the first distance, the guide wheel 7 to be fine-ground is rotated according to a first predetermined program; Step S103.2: During the process of the workbench 9 descending from the first distance to the second distance, the guide wheel 7 to be finely ground is rotated according to a second predetermined program; … Step S103.n: During the process of the workbench 9 descending from the n-1th distance to the nth distance, the guide wheel 7 to be fine-ground is rotated according to the nth predetermined program.

[0040] According to one embodiment of the present invention, rotating the guide wheel 7 to be fine-ground according to a first predetermined program includes: first rotating the guide wheel 7 to be fine-ground at a first speed in a first direction for a first wire supply amount and then rotating the guide wheel 7 to be fine-ground at the first speed for a first return amount as a first cycle, repeating the first number of first cycles; rotating the guide wheel 7 to be fine-ground according to a second predetermined program includes: first rotating the guide wheel 7 to be fine-ground at a second speed in the first direction for a second wire supply amount and then rotating the guide wheel 7 to be fine-ground at the second speed for a second return amount as a second cycle, repeating the second number of second cycles; ...; rotating the guide wheel 7 to be fine-ground according to an nth predetermined program includes: first rotating the guide wheel 7 to be fine-ground at an nth speed in the first direction for an nth wire supply amount and then rotating the guide wheel 7 to be fine-ground at an nth speed for an nth return amount as an nth cycle, repeating the nth number of nth cycles, wherein the first direction is opposite to the second direction, and the time of the first cycle, the second cycle, ..., the nth cycle is equal.

[0041] According to a specific embodiment of the present invention, the first speed, the second speed, ..., and the nth speed are greater than or equal to 250 m / min and less than or equal to 2500 m / min, and the jth speed is ≥ the j-1th speed, where 2≤j≤n. In this way, the guide wheel can be fine-ground at reasonable speeds, thereby improving the fine-ground effect.

[0042] According to another embodiment of the present invention, the first wire supply amount, the second wire supply amount, ..., the nth wire supply amount are greater than or equal to 250m and less than or equal to 1000m, and the jth wire supply amount ≥ the j-1th wire supply amount, wherein 2≤j≤n; the first return wire amount, the second return wire amount, ..., the nth return wire amount are greater than or equal to 250m and less than or equal to 1000m, and the jth return wire amount ≥ the j-1th return wire amount, wherein 2≤j≤n; the kth wire supply amount > the kth return wire amount, wherein 1≤k≤n. By making the wire supply amount in each step greater than the return wire amount, it is possible to avoid using the same section of diamond wire every time the guide wheel groove is ground, thereby ensuring that the wear of the diamond wire is even and avoiding affecting the wire cutting effect.

[0043] According to another embodiment of the present invention, the predetermined tension of the waste diamond wire 8 is, for example, 3N-3.4N, and the predetermined descent speed is, for example, 180μm / cycle-220μm / cycle. In this way, the guide wheel fine grinding can be performed with a reasonable wire tension and descent speed, thereby improving the fine grinding effect.

[0044] During specific execution, the guide wheel 7 to be finely ground of the wire cutting machine rotates, driving the diamond wire 8 to rotate, and the workbench 9 drives the fine grinding wheel 6 to move downward. The specific process parameters are as follows: maintaining a predetermined wire tension and a predetermined workbench descending speed, the predetermined distance is descended in the following n steps (n is a positive integer greater than 2): Step 1: When the workbench 9 descends from the predetermined position to the first distance, the workbench 9 is rotated forward by a first amount of wire supply at a first speed, and then reversed by a first amount of wire return. One forward rotation operation and one reverse rotation operation are regarded as a first cycle, and the first number of first cycles is continuously executed. Step 2: During the process of the workbench 9 continuing to descend from the first distance to the second distance, at the second speed, the second supply amount of wire is forwardly rotated, and then the second return amount of wire is reversed, and one forward rotation operation and one reverse rotation operation are regarded as a second cycle, and the second cycle is continuously executed for a second number; … Step n: As the workbench 9 continues to descend from the n-1th distance to the nth distance, at the nth speed, rotate the nth supply wire amount forward, and then reverse the nth return wire amount. Take one forward operation and one reverse operation as an nth cycle, and continue to execute the nth number of nth cycles.

[0045] The nth distance is equal to a predetermined distance, for example, 18 mm to 21 mm, and the difference between the ith distance and the (i-1)th distance is greater than or equal to 1 mm and less than or equal to 3 mm, wherein 2≤i≤n.

[0046] The nth distance is the total distance that the workbench drives the fine grinding wheel 6 to descend from the predetermined position. The larger the nth distance is, the tighter the fine grinding wheel 6 presses on the diamond wire 8, and the tighter the diamond wire 8 is, the easier it is to cause the wire to break; the smaller the nth distance is, the looser the fine grinding wheel 6 presses on the diamond wire 8, and the looser the diamond wire 8 is, the smaller the friction force on the fine grinding guide wheel 7 is, which affects the fine grinding effect. Therefore, in a specific embodiment of the present invention, the nth distance is 18mm-21mm.

[0047] In one embodiment of the present invention, after a new guide wheel is replaced on a wire cutting machine and the grooves of the new guide wheel need to be ground, a fine grinding wheel mounting device 10 is installed on the worktable 9 of the wire cutting machine to rotate and mount the fine grinding wheel 6 on the worktable 9 of the wire cutting machine. The height of the fine grinding wheel mounting device 10 is then adjusted to position 0 (i.e., the initial position) of the worktable 9 using a feed device. At this point, the fine grinding wheel 6 just contacts the diamond wire 8 and does not squeeze the diamond wire 8. Thereafter, according to predetermined parameters, the machine tool is started to execute the above n steps to grind the guide wheel grooves through the grinding process. The entire process takes a cumulative time of approximately 220 minutes. Among them, the number of steps executed is, for example, 20, the total distance that the fine grinding wheel 6 descends is 20 mm, and the process parameters when executing each step are, for example: the left tension and the right tension of the diamond wire 8 are both 3N-3.4N; the rotation speed of the diamond wire is 250m / min-2300m / min and the rotation speed of each step will gradually increase; the workbench descent speed is 180μm / cycle-200μm / cycle; the difference between the wire supply amount and the wire return amount in each cycle (ie: the wire amount) is 5m-10m, and the wire storage amount of the wire feed guide wheel and the wire take-up guide wheel is 3km, and the wire amount of the wire net is 7km; water will be used for cooling during this process, the cooling water flow rate is 210L / min-250L / min, and the cooling water temperature is 20℃-26℃.

[0048] Among them, the rotational speed is the moving speed of the diamond wire 8, the wire supply amount is the moving length of the diamond wire 8 driven by the forward rotation of the guide wheel 7 to be fine-ground, the wire return amount is the moving length of the diamond wire 8 driven by the reverse rotation of the guide wheel 7 to be fine-ground, and the number of cycles is the number of executions of a cycle consisting of one forward operation and one reverse operation in each step.

[0049] The following is a specific embodiment according to the present invention.

[0050] Step 1: Winding a waste diamond wire 8 on the guide wheel 7 to be finely ground on the wire cutting machine, the waste diamond wire 8 has a predetermined tension of 3.4N; Step 2: Rotate and install the fine grinding wheel 6 on the workbench 9 of the wire cutting machine, wherein the axial direction of the fine grinding wheel 6 is parallel to the axial direction of the guide wheel 7 to be fine-ground, and the length of the fine grinding wheel 6 covers the waste diamond wire 8 on the guide wheel 7 to be fine-ground; Step 3: Lower the workbench 9 to drive the fine grinding wheel 6 to move downward to compress the waste diamond wire 8, rotate the guide wheel 7 to be fine-ground to drive the waste diamond wire 8 to rotate on the guide wheel 7 to achieve fine grinding of the guide wheel 7, specifically including the following: Step 3.0: Starting from position 0, lower the workbench 9 at a descending speed of 200 μm / cycle; Step 3.1: While the workbench 9 is descending from position 0 to 1 mm (referring to a position 1 mm below position 0, and similarly hereinafter), the guide wheel 7 to be finely ground is rotated according to a first predetermined program. The first predetermined program includes: rotating the guide wheel 7 to be finely ground at a speed of 250 m / min in a first direction for 255 m, and then rotating the guide wheel 7 to be finely ground at a speed of 250 m / min in a second direction for 250 m, as a first cycle, and repeating this first cycle five times. Step 3.2: While the workbench 9 is being lowered from 1 mm to 2 mm, the guide wheel 7 to be finely ground is rotated according to a second predetermined program. The second predetermined program includes: rotating the guide wheel to be finely ground in the first direction at 500 m / min for 7505 m, and then rotating the guide wheel to be finely ground in the second direction at 500 m / min for 7500 m, as a second cycle, and repeating this second cycle five times. Step 3.3: While the workbench 9 is being lowered from 2 mm to 3 mm, the guide wheel 7 to be finely ground is rotated according to a third predetermined program. The third predetermined program includes: rotating the guide wheel to be finely ground in the first direction at 1000 m / min for 7995 m, and then rotating the guide wheel to be finely ground in the second direction at 1000 m / min for 7990 m, as a third cycle, and repeating this third cycle 10 times. Step 3.4: While the workbench 9 is being lowered from 3 mm to 5 mm, the guide wheel 7 to be finely ground is rotated according to a fourth predetermined program. The fourth predetermined program includes: rotating the guide wheel to be finely ground at 1200 m / min in the first direction for 7995 m, then rotating the guide wheel to be finely ground at 1200 m / min in the second direction for 7990 m, as a fourth cycle, and repeating this fourth cycle 20 times. Step 3.5: While the workbench 9 is being lowered from 5 mm to 9 mm, the guide wheel 7 to be finely ground is rotated according to a fifth predetermined program. The fifth predetermined program includes: rotating the guide wheel to be finely ground in the first direction at 1400 m / min for 7995 m, then rotating the guide wheel to be finely ground in the second direction at 1400 m / min for 7990 m, as a fifth cycle, and repeating this fifth cycle 20 times. Step 3.6: While the workbench 9 is lowered from 9 mm to 13 mm, the guide wheel 7 to be finely ground is rotated according to a sixth predetermined program. The sixth predetermined program includes: rotating the guide wheel to be finely ground at 1600 m / min in the first direction for 7995 m, then rotating the guide wheel to be finely ground at 1600 m / min in the second direction for 7990 m, as a sixth cycle, and repeating this sixth cycle 35 times. Step 3.7: During the process of the workbench 9 descending from 13 mm to 20 mm, the guide wheel 7 to be fine-ground is rotated according to the seventh predetermined program; the seventh predetermined program includes: first rotating the guide wheel to be fine-ground for 7995 m in the first direction at 2200 m / min and then rotating the guide wheel to be fine-ground for 7990 m in the second direction at 2200 m / min as a seventh cycle, and repeating the seventh cycle 5 times.

[0051] The present invention winds the waste diamond wire on the guide wheel to be fine-ground of the wire cutting machine, rotates the fine grinding wheel on the workbench, then lowers the workbench to drive the fine grinding wheel to move downward to compress the waste diamond wire, rotates the guide wheel to be fine-ground to drive the waste diamond wire to rotate on the guide wheel to be fine-ground to achieve fine grinding of the guide wheel to be fine-ground, and the fine grinding wheel and the waste diamond wire can be used to grind the wire groove of the guide wheel of the wire cutting machine. Compared with using the diamond wire to idle for a long time to grind the wire groove of the guide wheel, the time spent on grinding the wire groove of the guide wheel is greatly reduced, and the reactive cutting time of the wire cutting machine is effectively reduced, thereby solving the problem of needing a long time to grind the wire groove of the guide wheel after replacing a new guide wheel, improving the wire groove friction effect of the guide wheel and the guide wheel fine grinding efficiency, thereby improving the wire cutting quality of the first few silicon rods; at the same time, using the waste diamond wire to grind the wire groove of the guide wheel reduces the cost loss of the diamond wire by recycling waste resources.

[0052] The above embodiments are only intended to help understand the method, structure, and core concept of the present invention. Those skilled in the art will appreciate that various improvements and modifications may be made to the present invention without departing from the principles of the present invention, and such improvements and modifications are also within the scope of protection of the claims of the present invention.

Claims

1. A method for fine grinding a guide wheel of a wire cutting machine, characterized in that: include: Step 1: Winding a waste diamond wire (8) on a guide wheel (7) to be finely ground on a wire cutting machine, wherein the waste diamond wire (8) has a predetermined tension; Step 2: Rotatingly mounting a fine grinding wheel (6) on a workbench (9) of the wire cutting machine, wherein the axial direction of the fine grinding wheel (6) is parallel to the axial direction of the guide wheel to be fine-ground (7), and the length of the fine grinding wheel (6) at least covers the waste diamond wire (8) on the guide wheel to be fine-ground (7); Step 3: lowering the workbench (9) to drive the fine grinding wheel (6) to move downward to compact the waste diamond wire (8), rotating the guide wheel to be fine-ground (7) to drive the waste diamond wire (8) to rotate on the guide wheel to be fine-ground (7), thereby achieving fine grinding of the guide wheel to be fine-ground (7).

2. The guide wheel fine grinding method according to claim 1, characterized in that: In step 3, the workbench (9) is lowered to drive the fine grinding wheel (6) to move downward to compact the waste diamond wire (8), and the guide wheel to be finely ground (7) is rotated to drive the waste diamond wire (8) to rotate on the guide wheel to be finely ground (7), including: Step 3.0: Continuously lowering the workbench (9) from a predetermined position at a predetermined descending speed; Step 3.1: while the workbench (9) is descending from the predetermined position to a first distance, rotating the guide wheel (7) to be finely ground according to a first predetermined program; Step 3.2: while the workbench (9) is descending from the first distance to the second distance, rotating the guide wheel (7) to be finely ground according to a second predetermined program; …… Step 3.n: When the workbench (9) descends from the n-1th distance to the nth distance, the guide wheel (7) to be finely ground is rotated according to the nth predetermined program.

3. The guide wheel fine grinding method according to claim 2, characterized in that: The nth distance is 18 mm-21 mm, and the difference between the i-th distance and the (i-1)-th distance is greater than or equal to 1 mm and less than or equal to 3 mm, wherein 2≤i≤n.

4. The guide wheel fine grinding method according to claim 2, characterized in that: Rotating the guide wheel (7) to be finely ground according to a first predetermined program includes: The first cycle is defined as first rotating the guide wheel (7) to be finely ground in a first direction at a first speed for a first wire supply amount and then rotating the guide wheel (7) to be finely ground in a second direction at the first speed for a first wire return amount, and the first number of the first cycle is repeated; Rotating the guide wheel (7) to be finely ground according to a second predetermined program includes: The second cycle is defined as first rotating the guide wheel (7) to be finely ground in the first direction at a second speed for a second supply amount and then rotating the guide wheel (7) to be finely ground in the second direction at a second speed for a second return amount, and repeating the second number of the second cycle; …… Rotating the guide wheel (7) to be finely ground according to the nth predetermined program comprises: The nth cycle is defined as the nth number of times the guide wheel (7) to be finely ground is rotated in the first direction at the nth speed for the nth amount of wire supply and then rotated in the second direction at the nth speed for the nth amount of wire return. The first direction is opposite to the second direction, and the time of the first period, the second period, ..., and the nth period are equal.

5. The guide wheel fine grinding method according to claim 4, characterized in that: The first speed, the second speed, ..., the nth speed are greater than or equal to 250 m / min and less than or equal to 2500 m / min, and the jth speed is ≥ j-1th speed, wherein 2≤j≤n.

6. The guide wheel fine grinding method according to claim 5, characterized in that: The first supply line quantity, the second supply line quantity, ..., the nth supply line quantity are greater than or equal to 250 m and less than or equal to 1000 m, and the jth supply line quantity ≥ the j-1th supply line quantity, wherein 2≤j≤n; The first loop quantity, the second loop quantity, ..., the nth loop quantity are greater than or equal to 250 m and less than or equal to 1000 m, and the jth loop quantity ≥ the j-1th loop quantity, wherein 2≤j≤n; The kth supply line quantity>the kth return line quantity, where 1≤k≤n.

7. The guide wheel fine grinding method according to claim 6, characterized in that: The predetermined tension of the waste diamond wire (8) is 3N-3.4N, and the predetermined descending speed is 180μm / cycle-220μm / cycle.

8. A fine grinding wheel mounting device, characterized in that: Used to install a fine grinding wheel (6) on a workbench (9) of a wire cutting machine to implement the guide wheel fine grinding method according to any one of claims 1 to 7, the fine grinding wheel installation device comprises: a base (2), a mounting portion (3) and a loading table (1), wherein: The loading platform (1) is arranged on one side of the base (2) and is used to be connected to the workbench (9) of the wire cutting machine. The mounting portion (3) is arranged at both ends of the other side of the base (2), and both ends of the fine grinding wheel (6) are rotatably connected to the mounting portion (3).

9. The fine grinding wheel mounting device according to claim 8, characterized in that: The mounting portion (3) is a bearing box located at both ends of the base (2).

10. The fine grinding wheel mounting device according to claim 9, characterized in that: An airtight structure (4) is provided on the bearing box and is mounted on a side of the bearing box opposite to the fine grinding wheel (6) via fixing bolts (5).

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